Double-stator cylindrical linear motor based on semiconductor cooling fins

Abstract

The present invention discloses a double-stator cylindrical linear motor based on semiconductor cooling sheet heat dissipation, the motor comprises a motor housing, an inner stator and a semiconductor cooling sheet, the inner stator is fixedly arranged in the motor housing; the semiconductor cooling sheet comprises a semiconductor cooling sheet cold end and a semiconductor cooling sheet hot end, wherein: the semiconductor cooling sheet cold end contacts one end of the inner stator, and the semiconductor cooling sheet hot end is exposed to the motor housing. The present invention transfers the heat inside the motor to the outside of the motor housing through the semiconductor cooling sheet, thereby enhancing the heat dissipation of the motor. Since the semiconductor cooling sheet is noiseless, vibrationless, does not require refrigerant, is small in size and light in weight, the technical problems of the heat dissipation system of the motor in the prior art, which is complex in structure, expensive in cost, and increases the size and noise of the motor, are solved, and the beneficial effects of good heat dissipation of the motor, unaffected motor size, weight and noise, and economic and environmental protection are achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of permanent magnet linear motors, and in particular relates to a double-stator cylindrical linear motor based on semiconductor cooling fins for heat dissipation. Background Art

[0002] As a new type of motor with compact structure, improved space utilization and power density, the double-stator cylindrical linear motor is often used in scenarios where tidal and wave energy are important sources of renewable energy characterized by reciprocating motion.

[0003] Limited by the low thermal conductivity materials such as insulating paint and air inside the motor, the heat generated by the key heat-generating components inside the motor, especially the winding, often cannot be quickly transferred to the cooling motor housing, causing a large amount of heat to accumulate in the key components of the motor, forming a local high-temperature area. Using an efficient and reliable heat dissipation system to quickly transfer the heat generated during the operation of the motor to the outside, avoiding the accumulation of heat in the key components of the motor, and ensuring that the motor always works at a suitable temperature is of great significance to the life, efficiency and operation safety of the motor.

[0004] Heat dissipation can be enhanced by providing a heat dissipation system for the motor, such as an air cooling system, a liquid cooling system, or an evaporative cooling system.

[0005] Air cooling heat dissipation system can be divided into natural air cooling and forced air cooling according to whether additional devices to enhance air flow are used. Natural air cooling does not require additional power devices, and only exchanges heat through natural convection between the motor housing and the surrounding air, and the heat dissipation efficiency is low. Forced air cooling usually uses a fan system to enhance the heat exchange between the motor and the outside air. The additional fan system greatly improves the heat dissipation efficiency of the motor compared to natural air cooling, but it also increases the power consumption and noise of the motor system to a certain extent, and also increases the size of the motor.

[0006] Liquid cooling systems require additional circulating liquid circuits and sealing systems, which increases the cost and complexity of the motor system. Common liquid cooling systems are divided into water cooling systems and oil cooling systems. Water cooling systems are prone to scale and corrode the motor housing during long-term circulation, so in actual applications, anti-corrosion and anti-foaming additives are required. Oil cooling systems require a strict filtration system to filter the oil medium to prevent impurities in the oil from damaging the insulation layer inside the motor, and the cost of oil cooling systems is expensive.

[0007] The evaporative cooling heat dissipation system uses the phase change cycle of the low boiling point cooling medium to achieve efficient cooling of the motor. When the low boiling point, high insulation coefficient cooling medium comes into contact with the heat-generating components in the motor, the cooling medium absorbs a large amount of heat and vaporizes. The gaseous cooling medium is converted into liquid when it is cooled in the condenser. The gas-liquid phase change cycle of the cooling medium is used to achieve efficient heat dissipation of the motor, but the structure is complex and will increase the size and noise of the motor.

[0008] Therefore, the above-mentioned prior art has at least the following technical problems: the heat dissipation system of the motor in the prior art is complex in structure, expensive, and will increase the size and noise of the motor. Summary of the invention

[0009] The embodiment of the present application provides a double-stator cylindrical linear motor based on semiconductor refrigeration plate heat dissipation, which solves the technical problems in the prior art that the heat dissipation system of the motor has a complex structure, high cost, and increases the size and noise of the motor.

[0010] The embodiment of the present application provides a double-stator cylindrical linear motor based on heat dissipation of semiconductor refrigeration fins, the motor comprising:

[0011] Motor housing;

[0012] An inner stator, wherein the inner stator is fixedly disposed in the motor housing;

[0013] The semiconductor refrigeration plate comprises a semiconductor refrigeration plate cold end and a semiconductor refrigeration plate hot end, and the semiconductor refrigeration plate cold end and the semiconductor refrigeration plate hot end are connected through semiconductor refrigeration plate P and N junctions, wherein: the semiconductor refrigeration plate cold end contacts one end of the inner stator, and the semiconductor refrigeration plate hot end is exposed to the motor housing.

[0014] Furthermore, the inner stator is hollow inside to form a cavity, and the cavity is filled with a heat dissipation core.

[0015] Furthermore, the cold end of the semiconductor refrigeration plate contacts one end of the heat dissipation core.

[0016] Furthermore, the length of the heat dissipation core is the same as the length of the inner stator, that is, the heat dissipation core extends from one end of the inner stator to the other end of the inner stator.

[0017] Furthermore, the shape of the cavity is a cylinder coaxially opened on the inner stator, the heat dissipation core is cylindrical, and the outer surface of the heat dissipation core is in close contact with the inner surface of the cavity.

[0018] Furthermore, the heat dissipation core is a metal rod.

[0019] Furthermore, the heat dissipation core is an aluminum rod or a copper rod.

[0020] Furthermore, the cold end of the semiconductor refrigeration plate is fixed on one end of the heat dissipation core, and the area of ​​the cold end of the semiconductor refrigeration plate is the same as the end surface area of ​​the contact end of the heat dissipation core.

[0021] Furthermore, the area of ​​the hot end of the semiconductor refrigeration plate is larger than the area of ​​the cold end of the semiconductor refrigeration plate.

[0022] Furthermore, the hot end of the semiconductor refrigeration plate is fixed on the outer end surface of the motor housing, and the projection of the hot end of the semiconductor refrigeration plate on the outer end surface of the motor housing is located within the outer end surface of the motor housing.

[0023] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0024] (1) In the embodiment of the present application, a semiconductor refrigeration plate is arranged on the motor, the cold end of the semiconductor refrigeration plate is in contact with one end of the inner stator, and the hot end of the semiconductor refrigeration plate is exposed to the motor housing, thereby transferring the heat inside the motor to the outside of the motor housing, thereby enhancing the heat dissipation of the motor. Since the semiconductor refrigeration plate is noiseless, vibration-free, does not require refrigerant, is small in size and light in weight, the technical problems of the heat dissipation system of the motor in the prior art, such as complex structure, high cost, and increase in motor size and noise, are solved, thereby achieving good motor heat dissipation effect, without affecting the motor size, weight and noise, and achieving the beneficial effects of economy and environmental protection.

[0025] (2) In the embodiment of the present application, the middle of the inner stator is hollowed out and filled with a heat sink. Since the heat sink has good thermal conductivity, the heat conduction capacity inside the inner stator can be enhanced, and the heat from the outer layer of the inner stator can be transferred to the semiconductor refrigeration plate for heat dissipation, thereby enhancing the heat dissipation effect.

[0026] (3) In the embodiment of the present application, one end of the heat dissipation core is directly in contact with the cold end of the semiconductor refrigeration plate. Since the heat dissipation core has a good thermal conductivity, more heat can be transferred to the cold end of the semiconductor refrigeration plate, thereby further improving the heat dissipation effect.

[0027] (4) In the embodiment of the present application, the length of the heat dissipation core is set to be the same as the length of the inner stator, thereby enhancing the overall heat conduction of the inner stator along the length direction. The heat dissipation core can conduct more heat away from the cold end of the semiconductor refrigeration plate to the cold end of the semiconductor refrigeration plate, thereby further improving the heat dissipation effect.

[0028] (5) The embodiment of the present application enhances heat conduction by closely arranging the outer surface of the heat dissipation core and the inner surface of the cavity, thereby improving the heat dissipation effect.

[0029] (6) In the embodiment of the present application, the heat dissipation core is set as a metal rod. Since the metal rod has good heat conduction capability, the heat dissipation effect of the motor is enhanced.

[0030] (7) In the embodiment of the present application, the area of ​​the cold end of the semiconductor refrigeration plate is set to be the same as the end surface area of ​​the end in contact with the heat dissipation core, thereby increasing the heat conduction area between the cold end of the semiconductor refrigeration plate and the heat dissipation core and improving the heat dissipation effect.

[0031] (8) The embodiment of the present application increases the heat dissipation area by increasing the area of ​​the hot end of the semiconductor refrigeration plate, thereby improving the heat dissipation effect.

[0032] (9) The embodiment of the present application protects the hot end of the semiconductor cooling plate by arranging the hot end of the semiconductor cooling plate inside the outer end surface of the motor housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A schematic diagram of the structure of a double-stator cylindrical linear motor based on heat dissipation by semiconductor refrigeration fins provided in one embodiment of the present application;

[0034] Figure 2 This is a schematic diagram of the semiconductor refrigeration principle in the prior art. DETAILED DESCRIPTION

[0035] The embodiment of the present application provides a double-stator cylindrical linear motor based on semiconductor refrigeration plate heat dissipation, which solves the technical problems in the prior art that the heat dissipation system of the motor has a complex structure, high cost, and increases the size and noise of the motor.

[0036] The technical solution in the embodiment of the present application is to solve the above problems, and the overall idea is as follows:

[0037] By arranging a semiconductor cooling sheet on the motor, contacting the cold end of the semiconductor cooling sheet with one end of the inner stator, and exposing the hot end of the semiconductor cooling sheet to the motor housing, the heat inside the motor is transferred to the outside of the motor housing, thereby enhancing the heat dissipation of the motor. Since the semiconductor cooling sheet is noiseless, vibrationless, does not require refrigerant, is small in size and light in weight, the technical problems of the heat dissipation system of the motor in the prior art, which is complex in structure, expensive in cost, and increases the size and noise of the motor, are solved, and the motor heat dissipation effect is good, the size, weight and noise of the motor are not affected, and the beneficial effects of economy and environmental protection are achieved;

[0038] By hollowing out the middle of the inner stator and filling it with a heat dissipation core, the heat dissipation core has good thermal conductivity, thereby enhancing the heat conduction capacity in the inner stator, and conducting the heat of the outer layer of the inner stator to the semiconductor refrigeration sheet for heat dissipation, thereby enhancing the heat dissipation effect;

[0039] By directly contacting one end of the heat dissipation core with the cold end of the semiconductor refrigeration plate, the heat dissipation core has a good thermal conductivity, and can conduct more heat to the cold end of the semiconductor refrigeration plate, thereby further improving the heat dissipation effect;

[0040] By setting the length of the heat dissipation core to be the same as the length of the inner stator, that is, the heat dissipation core extends from one end of the inner stator to the other end of the inner stator, the overall heat conduction of the inner stator along the length direction is enhanced. The heat dissipation core can conduct more heat away from the cold end of the semiconductor refrigeration plate to the cold end of the semiconductor refrigeration plate, thereby further improving the heat dissipation effect.

[0041] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0042] Figure 1 A double-stator cylindrical linear motor based on semiconductor cooling fin heat dissipation is provided in one embodiment of the present application. Figure 1 As shown, the motor includes a motor housing 42, an inner stator 12 and semiconductor cooling fins.

[0043] like Figure 1 As shown, the motor housing 42 is provided with an inner stator 12 and an outer stator 11, the inner stator 12 is provided with an inner winding 22, the outer stator 11 is provided with an outer winding 21, a rotatable mover 50 is provided between the inner stator 12 and the outer stator 11, and an inner permanent magnet 32 ​​and an outer permanent magnet 31 are also provided between the inner stator 12 and the outer stator 11, wherein the inner stator 12 is fixedly arranged on the central axis of the motor housing 42, and the motor housing 42 is also provided with a mechanical support structure 41.

[0044] The semiconductor refrigeration plate includes a semiconductor refrigeration plate cold end 70 and a semiconductor refrigeration plate hot end 90, and the semiconductor refrigeration plate cold end 70 and the semiconductor refrigeration plate hot end 90 are connected through semiconductor refrigeration plate P and N junctions 80 and 90; wherein, the semiconductor refrigeration plate cold end 70 is in close contact with the end surface of one end of the inner stator 12 to improve the heat conduction effect, and the semiconductor refrigeration plate hot end 90 is exposed to the motor housing 42.

[0045] Furthermore, the semiconductor refrigeration plate cold end 70 is directly fixed on the end surface of one end of the inner stator 12 (for example, by bonding).

[0046] Semiconductor refrigeration is thermoelectric refrigeration, also known as temperature difference electric refrigeration. Since the materials currently used in thermoelectric refrigeration are basically semiconductor materials, thermoelectric refrigeration is called semiconductor refrigeration. Semiconductor refrigeration chips have the characteristics of no noise, no vibration, no need for refrigerant, small size, light weight, etc., and they are reliable, easy to operate, and easy to adjust the cooling capacity.

[0047] Semiconductor materials have the characteristics of thermoelectric energy conversion. When direct current is passed through, heat is transferred from one end of the material to the other end, producing a cooling effect. Semiconductor refrigeration is a new type of refrigeration technology based on five thermoelectric effects: Fourier effect, Joule effect, Seebeck effect, Thomson effect and Peltier effect.

[0048] Figure 2 It is a schematic diagram of semiconductor refrigeration in the prior art, such as Figure 2 As shown, two different semiconductor materials are connected in series to form a couple, forming a P and N junction b. When direct current passes through, due to the temperature difference effect, the two ends of the couple absorb and release heat, converting electrical energy into thermal energy. The direction of the current at the cold end is N→P, absorbing heat and cooling; the direction of the current at the hot end is P→N, releasing heat and heating. When direct current passes through the semiconductor P and N junction b, a thermoelectric effect will be generated on the contact surface of the junction. Semiconductor refrigeration is mainly an application of the Peltier effect. The heat generated by the Peltier effect is Q p for:

[0049] Q p =(α p -α n )TI

[0050] In the formula, α p , α n are the temperature difference electromotive force rates of the P-type junction and the N-type junction respectively; T is the absolute temperature on the joint; I is the current intensity generated by the direct current in the loop.

[0051] In addition to the Peltier effect, there are two other irreversible effects in the thermoelectric effect, namely the Fourier effect and the Joule effect. F :

[0052]

[0053] Where λ is the thermal conductivity of the conductor; s is the effective cross-sectional area of ​​the conductor; l is the effective length of the conductor; T h is the absolute temperature of the hot end a; T c is the absolute temperature of the cold end c; K is the total thermal conductivity of the conductor; ΔT is the temperature difference between the hot and cold ends.

[0054] Heat generated by Joule effect Q J :

[0055]

[0056] Where R is the total resistance of the conductor; ρ is the resistivity of the conductor.

[0057] In the cooling P, N junction couple, one end of the P, N junction b is the cold end a, and the other end is the hot end c. Therefore, there is a temperature difference between the two ends of the P, N junction b. Due to the temperature difference, and because the current passing through the couple arm will generate Joule heat, the local temperature will rise, and the heat will spread from the hot end c to the cold end a. If the balance is reached on the P, N junction b, the heat Q transferred from the hot end c to the cold junction 热 It can be expressed by the one-dimensional Fourier equation:

[0058]

[0059] The efficiency of semiconductor refrigeration is affected by the heat dissipation effect of the hot end c. When the semiconductor refrigeration device is actually used, the cold end a is attached to the object to be cooled to absorb heat. The heat is transferred to the hot end c and must be dissipated in time to maintain its normal operation. When the system is working, the heat dissipation density of the cold end a and the hot end c can reach 10 4 W / m 2 Therefore, the effective operation of the system strongly depends on the heat transfer performance at both the cold and hot ends.

[0060] The embodiment of the present application arranges a semiconductor refrigeration plate on the motor, contacts the cold end 70 of the semiconductor refrigeration plate with one end of the inner stator 12, and exposes the hot end 90 of the semiconductor refrigeration plate to the motor housing 42, thereby transferring the heat inside the motor to the outside of the motor housing, thereby enhancing the heat dissipation of the motor. Since the semiconductor refrigeration plate is noiseless, vibration-free, does not require refrigerant, is small in size and light in weight, the technical problems of the heat dissipation system of the motor in the prior art, such as complex structure, high cost, and increased motor size and noise, are solved, thereby achieving good motor heat dissipation effect, without affecting the motor size, weight and noise, and achieving the beneficial effects of economy and environmental protection.

[0061] In one embodiment of the present application, the inner stator 12 is hollow inside to form a cavity, and the cavity is filled with a heat sink 60. The heat sink 60 has good thermal conductivity, which can enhance the thermal conduction capacity within the inner stator 12 and conduct the heat from the outer layer of the inner stator 12 to the semiconductor refrigeration plate for heat dissipation.

[0062] In one embodiment of the present application, the first end of the heat dissipation core 60 is in contact with the cold end 70 of the semiconductor refrigeration plate. Since the heat dissipation core 60 has a good thermal conductivity, more heat can be transferred to the cold end 70 of the semiconductor refrigeration plate, thereby improving the heat dissipation effect.

[0063] In one embodiment of the present application, the length of the heat dissipation core 60 is the same as the length of the inner stator 12, that is, the heat dissipation core 60 extends from one end of the inner stator to the other end of the inner stator 12, thereby enhancing the overall heat conduction of the inner stator 12 along the length direction. The heat dissipation core 60 can conduct more heat away from the cold end 70 of the semiconductor refrigeration plate to the cold end 70 of the semiconductor refrigeration plate, thereby improving the heat dissipation effect.

[0064] In summary, the middle of the inner stator 12 is hollowed out and filled with a heat sink core 60. The length of the heat sink core 60 is the same as that of the inner stator 12, and one end of the heat sink core 60 is in contact with the cold end 70 of the semiconductor refrigeration plate. This is beneficial for conducting heat through the heat sink core 60 to the cold end 70 of the semiconductor refrigeration plate, and finally transferring heat to the outside of the motor housing 42 through the semiconductor heating end 90, thereby enhancing the heat dissipation effect inside the motor.

[0065] In one embodiment of the present application, the shape of the cavity is a cylinder coaxially opened on the inner stator 12, the heat dissipation core 60 is cylindrical and coaxially arranged in the cavity, the axial length of the heat dissipation core 60 is the same as the axial length of the inner stator 12, and the outer surface of the heat dissipation core 60 is in close contact with the inner surface of the cavity, thereby enhancing the heat conduction effect.

[0066] In one embodiment of the present application, the heat dissipation core 60 is a metal rod, which has good heat conduction capability, thereby enhancing the heat dissipation effect of the motor. Specifically, the heat dissipation core 60 is an aluminum rod or a copper rod with a high thermal conductivity coefficient.

[0067] In one embodiment of the present application, the area of ​​the cold end 70 of the semiconductor refrigeration plate is the same as the end surface area of ​​the contact end of the heat dissipation core 60, so as to maximize the heat conduction area between the cold end 70 of the semiconductor refrigeration plate and the heat dissipation core 60 and improve the heat dissipation effect.

[0068] In one embodiment of the present application, the area of ​​the hot end 90 of the semiconductor refrigeration plate is larger than the area of ​​the cold end 70 of the semiconductor refrigeration plate. Since the hot end 90 of the semiconductor refrigeration plate is located outside the motor housing 42 and is not restricted by the internal structure of the motor, it can be set as large as possible to increase the heat dissipation area, thereby improving the heat dissipation effect.

[0069] In one embodiment of the present application, the hot end 90 of the semiconductor refrigeration film is fixed on the outer end surface of the motor housing 42, and the projection of the hot end 90 of the semiconductor refrigeration film on the outer end surface of the motor housing 42 is located within the outer end surface of the motor housing 42, that is, the outer edge of the hot end 90 of the semiconductor refrigeration film does not exceed the outer edge of the outer end surface of the motor housing 42 to avoid damage to the hot end 90 of the semiconductor refrigeration film.

[0070] Experimental verification

[0071] A three-dimensional thermal analysis was performed on the motor, and the maximum temperatures of various parts inside the motor were compared between the motor before optimization without the semiconductor cooling plate according to the above embodiment (hereinafter referred to as before optimization) and the motor described in the embodiment of the present application with the semiconductor cooling plate (hereinafter referred to as after adding the semiconductor cooling plate). The maximum temperatures of the internal parts of the motor are shown in Table 1. Before optimization, the maximum temperature of the internal stator was 179.033°C. After adding the semiconductor cooling plate, the maximum temperature of the internal stator of the motor was 105.272°C. The temperature was reduced by 69.355°C compared with that before optimization, and the temperature reduction reached 41.20%. The cooling effect was very obvious, and the temperatures of other parts of the motor were also significantly reduced.

[0072] Table 1 Maximum temperature of each motor component

[0073]

[0074] It can be seen that the motor described in the embodiment of the present application has a good heat dissipation capability due to the provision of a semiconductor cooling plate.

[0075] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0076] (1) In the embodiment of the present application, a semiconductor refrigeration plate is arranged on the motor, the cold end 70 of the semiconductor refrigeration plate is in contact with one end of the inner stator, and the hot end 90 of the semiconductor refrigeration plate is exposed to the motor housing 42, so as to transfer the heat inside the motor to the outside of the motor housing, thereby enhancing the heat dissipation of the motor. Since the semiconductor refrigeration plate is noiseless, vibration-free, does not require refrigerant, is small in size and light in weight, the technical problems of the heat dissipation system of the motor in the prior art, that is, the complex structure, high cost, and increase in the size and noise of the motor, are solved, and the motor heat dissipation effect is good, the size, weight and noise of the motor are not affected, and the beneficial effects of economy and environmental protection are achieved.

[0077] (2) In the embodiment of the present application, the middle of the inner stator 12 is hollowed out and filled with a heat sink 60. Since the heat sink 60 has good thermal conductivity, the heat conduction capacity inside the inner stator 12 can be enhanced, and the heat from the outer layer of the inner stator 12 can be conducted to the semiconductor refrigeration plate for heat dissipation, thereby enhancing the heat dissipation effect.

[0078] (3) In the embodiment of the present application, one end of the heat dissipation core 60 is directly in contact with the cold end 70 of the semiconductor refrigeration plate. Since the heat dissipation core 60 has a good thermal conductivity, more heat can be transferred to the cold end 70 of the semiconductor refrigeration plate, thereby further improving the heat dissipation effect.

[0079] (4) In the embodiment of the present application, the length of the heat dissipation core 60 is set to be the same as the length of the inner stator 12, thereby enhancing the overall heat conduction of the inner stator 12 along the length direction. The heat dissipation core 60 can conduct more heat away from the cold end 70 of the semiconductor refrigeration plate to the cold end 70 of the semiconductor refrigeration plate, thereby further improving the heat dissipation effect.

[0080] (5) In the embodiment of the present application, the outer surface of the heat dissipation core 60 is closely arranged with the inner surface of the cavity, thereby enhancing heat conduction and improving the heat dissipation effect.

[0081] (6) In the embodiment of the present application, the heat dissipation core 60 is configured as a metal rod. Since the metal rod has good heat conduction capability, the heat dissipation effect of the motor is enhanced.

[0082] (7) In the embodiment of the present application, the area of ​​the cold end 70 of the semiconductor refrigeration plate is set to be the same as the end surface area of ​​the end in contact with the heat dissipation core 60, thereby increasing the heat conduction area between the cold end 70 of the semiconductor refrigeration plate and the heat dissipation core 60 and improving the heat dissipation effect.

[0083] (8) The embodiment of the present application increases the heat dissipation area by increasing the area of ​​the hot end 90 of the semiconductor refrigeration plate, thereby improving the heat dissipation effect.

[0084] (9) The embodiment of the present application protects the hot end 90 of the semiconductor refrigeration plate by disposing the hot end 90 of the semiconductor refrigeration plate within the outer end surface of the motor housing 42.

[0085] It should be understood that although the terms "first", "second", etc. may be used herein to describe various units, these units should not be limited by these terms. These terms are used only to distinguish one unit from another. For example, a first unit may be referred to as a second unit, and similarly, a second unit may be referred to as a first unit without departing from the scope of the exemplary embodiments.

[0086] The directional terms such as up, down, left, right, front, back, front, back, top, bottom, etc. mentioned or may be mentioned in this specification are defined relative to the structures shown in the drawings. They are relative concepts and may change accordingly according to different positions and different usage conditions. Therefore, these or other directional terms should not be interpreted as restrictive terms.

[0087] The above is only a preferred embodiment of the present application, and is not any formal or substantial limitation to the present application. It should be pointed out that ordinary technicians in this technical field can make several improvements and supplements without departing from the method of the present application, and these improvements and supplements should also be regarded as the protection scope of the present application. Any technician familiar with this profession can make some changes, modifications and evolutions of the technical content disclosed above without departing from the spirit and scope of the present application, which are equivalent embodiments of the present application; at the same time, any changes, modifications and evolutions of any equivalent changes made to the above embodiments based on the substantial technology of the present application are still within the scope of the technical solution of the present application.

Claims

1. A double-stator cylindrical linear motor based on semiconductor cooling fins for heat dissipation, characterized in that: The motor comprises: Motor housing; An inner stator, wherein the inner stator is fixedly disposed in the motor housing; A semiconductor refrigeration chip, comprising a semiconductor refrigeration chip cold end and a semiconductor refrigeration chip hot end, wherein the semiconductor refrigeration chip cold end and the semiconductor refrigeration chip hot end are connected through semiconductor refrigeration chip P and N junctions, wherein: the semiconductor refrigeration chip cold end contacts one end of the inner stator, and the semiconductor refrigeration chip hot end is exposed to the motor housing; The inner stator is hollow inside to form a cavity, the cavity is coaxial with the inner stator, and the cavity is filled with a heat dissipation core; the cold end of the semiconductor refrigeration plate is in contact with one end of the heat dissipation core; The cold end of the semiconductor refrigeration plate is fixed on one end of the heat dissipation core, and the area of ​​the cold end of the semiconductor refrigeration plate is the same as the end surface area of ​​the contact end of the heat dissipation core; the area of ​​the hot end of the semiconductor refrigeration plate is larger than the area of ​​the cold end of the semiconductor refrigeration plate.

2. The double-stator cylindrical linear motor based on semiconductor cooling fin heat dissipation according to claim 1, characterized in that: The length of the heat dissipation core is the same as that of the inner stator, that is, the heat dissipation core extends from one end of the inner stator to the other end of the inner stator.

3. The double-stator cylindrical linear motor based on semiconductor cooling fin heat dissipation according to claim 1, characterized in that: The shape of the cavity is a cylinder coaxially opened on the inner stator, the heat dissipation core is cylindrical, and the outer surface of the heat dissipation core is in close contact with the inner surface of the cavity.

4. The double-stator cylindrical linear motor based on semiconductor refrigeration sheet heat dissipation according to claim 1, characterized in that: The heat dissipation core is a metal rod.

5. The double-stator cylindrical linear motor based on semiconductor cooling fin heat dissipation according to claim 1, characterized in that: The heat dissipation core is an aluminum rod or a copper rod.

6. The double-stator cylindrical linear motor based on semiconductor cooling fin heat dissipation according to claim 1, characterized in that: The hot end of the semiconductor refrigeration plate is fixed on the outer end surface of the motor housing, and the projection of the hot end of the semiconductor refrigeration plate on the outer end surface of the motor housing is located within the outer end surface of the motor housing.

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