An electronic device cover and electronic device assembly

Abstract

The application provides an electronic device cover and an electronic device assembly, which improve the corrosion resistance of the electronic device without affecting the heat dissipation performance of the electronic device. The electronic device cover is used for accommodating the electronic device. The electronic device cover is provided with a first air inlet window and a first air outlet window. The first air inlet window is used for communicating with an air inlet of the electronic device to form an air inlet channel. The first air outlet window is used for communicating with an air outlet of the electronic device to form an air outlet channel. The electronic device cover has an air return channel. The air return channel is used for communicating the air outlet channel with the air inlet channel.

Description

[0001] This application claims priority to the Chinese patent application No. 202010076923.0 filed on January 23, 2020, and entitled "A Cover and Electronic Equipment", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the field of information technology, and in particular to an electronic equipment cover and an electronic equipment assembly. BACKGROUND

[0003] With the rapid development of information technology, electronic equipment is increasingly widely used in edge scenarios with high temperature and poor air quality. In order to adapt to the relatively harsh environment of edge scenarios, the dustproof, heat dissipation and corrosion resistance of electronic equipment have become key factors affecting its market competitiveness. In the prior art, electronic equipment generally sets a dust screen at the air inlet of its case to prevent dust. Although this scheme can achieve good dustproof effect, the setting of the dust screen will increase the heat dissipation resistance and affect the heat dissipation performance of the electronic equipment. In addition, the dust screen is also easy to be blocked by dust and needs to be cleaned and maintained regularly. If maintenance is not timely, dust will inevitably enter the case, and harmful impurities in the dust will adhere to the single board and cause corrosion under certain humidity conditions, affecting the performance of the electronic equipment. In addition, the electronic components such as single boards inside the electronic equipment are also prone to corrosion due to the influence of the environment temperature and humidity during operation, affecting the performance of the electronic equipment. SUMMARY

[0004] The present application provides an electronic equipment cover and an electronic equipment assembly to improve the corrosion resistance of the electronic equipment without affecting the heat dissipation performance of the electronic equipment.

[0005] In a first aspect, the present application provides an electronic equipment cover which can be used to accommodate an electronic equipment. The electronic equipment cover is provided with a first air inlet window and a first air outlet window. The first air inlet window can be used to communicate with the air inlet of the electronic equipment to form an air inlet channel, and the first air outlet window can be used to communicate with the air outlet of the electronic equipment to form an air outlet channel. In addition, the electronic equipment cover also has a return air channel which can be used to communicate the air outlet channel with the air inlet channel so that part of the hot return air of the air outlet channel can enter the air inlet channel.

[0006] In the above scheme, by setting the return air channel to return part of the hot air to the air inlet channel, the air inlet temperature of the case can be slightly increased without affecting the heat dissipation performance of the electronic equipment, so as to eliminate the cold air zone near the air inlet in the case, reduce the relative humidity of the air in the case, and thus reduce the risk of corrosion of the electronic components such as single boards.

[0007] In a specific implementation, the electronic device cover can include a top plate, a first side plate, and a bottom plate, wherein the first side plate is connected between the top plate and the bottom plate; an inner wall of the first side plate is provided with a baffle, the baffle is obliquely arranged with the bottom plate, the air inlet channel and the air outlet channel are respectively located on two sides of the baffle, and a gap between the baffle and the bottom plate can form part of the return air channel. In this way, in the return air channel, the hot return air on the side of the baffle close to the air outlet channel mainly enters the side close to the air inlet channel through the gap between the baffle and the bottom plate, so that the hot return air supplied to the lower area in the air inlet channel is relatively more sufficient, which is conducive to making the temperature of the mixed air formed in the air inlet channel more balanced.

[0008] The specific arrangement positions of the first air inlet window and the first air outlet window are not limited, and in one possible implementation, the first air inlet window and the first air outlet window can be arranged on the first side plate respectively, at this time, the return air channel is formed between the first side plate and the panel of the electronic device, so that the difficulty of arranging the return air channel can be reduced, and the structure of the electronic device cover can be simplified.

[0009] In one specific implementation, the baffle is located between the first air inlet window and the first air outlet window.

[0010] In a specific arrangement of the baffle, the baffle can include a first end, a second end, a third end, and a fourth end, wherein the first end and the second end are opposite to each other, the third end is an end of the baffle close to the top plate, and the fourth end is an end of the baffle close to the bottom plate; when the electronic device is arranged in the electronic device cover, the first end can abut against the panel of the case, the second end is connected with the first side plate, the third end can be arranged in connection with or in spacing with the top plate, and the fourth end is arranged in spacing with the bottom plate.

[0011] The specific structure of the baffle is not limited, and in one specific implementation, the baffle can be a straight plate structure, the baffle and the top plate can be arranged orthogonally, or the baffle can be obliquely arranged towards the side of the air inlet channel, that is, the included angle between the side of the baffle close to the air inlet channel and the top plate is an acute angle.

[0012] In a specific implementation, the third end of the baffle can be connected with the top plate, so that in the return air channel, the hot return air on the side of the baffle close to the air outlet channel can only enter the side close to the air inlet channel through the gap between the baffle and the bottom plate, thereby improving the balance degree of the temperature of the mixed air formed in the air inlet channel; in addition, the electronic device cover is also provided with a flow guide member, which can be arranged in the return air channel and used for guiding the hot return air through the gap between the baffle and the bottom plate to the air inlet channel, so that the hot return air can enter the air inlet channel more regularly and efficiently, thereby improving the efficiency of forming the mixed air.

[0013] The specific structure of the flow guide member is not limited, for example, in one specific embodiment, the flow guide member includes a plurality of flow guide plates which are spaced apart on the inner wall of the first side plate, so that the first flow guide groove is formed between two adjacent flow guide plates.

[0014] When the included angle between the side of the baffle close to the air inlet channel and the top plate is an acute angle, the number of the baffle can be multiple, the multiple baffles are spaced apart on the inner wall of the first side plate, and the third end of the multiple baffles is sequentially away from the top plate, so that the second flow guide groove of the return air channel is formed between two adjacent baffles, and the end of the second flow guide groove communicated with the air inlet channel is close to the bottom plate, so that the hot return air of the air outlet channel can be regularly guided to the lower area close to the bottom plate of the air inlet channel, which is beneficial to make the temperature of the mixed air formed in the air inlet channel more balanced.

[0015] In another specific embodiment, the baffle can also adopt a bent plate structure, and the number of the baffle is one or multiple. When the number of the baffle is one, the third end of the baffle is connected with the top plate, and the fourth end of the baffle is bent towards the side of the air inlet channel. At this time, the hot return air close to the air outlet channel side of the baffle can only enter the side close to the air inlet channel through the gap between the baffle and the bottom plate, so as to improve the balance degree of the temperature of the mixed air formed in the air inlet channel. In addition, the bent shape of the baffle can also play a flow guiding role to guide the hot return air to the lower area close to the bottom plate of the air inlet channel.

[0016] When the number of the baffle is multiple, the multiple baffles are spaced apart on the inner wall of the first side plate, and the third end of the multiple baffles is sequentially away from the top plate, so that the second flow guide groove of the return air channel is formed between two adjacent baffles, and the end of the second flow guide groove communicated with the air inlet channel is close to the bottom plate, so that the hot return air of the air outlet channel can be regularly guided to the lower area close to the bottom plate of the air inlet channel, which is beneficial to make the temperature of the mixed air formed in the air inlet channel more balanced.

[0017] When the baffle adopts a bent plate structure, the baffle can be specifically an arc-shaped plate, a combination plate formed by connecting multiple straight plates, or a combination plate formed by connecting a straight plate and an arc-shaped plate.

[0018] In one possible embodiment, the inner wall of the electronic device cover is provided with sound-absorbing cotton, so that the noise generated by the electronic device during operation can be isolated inside the electronic device cover.

[0019] When the sound-absorbing cotton is arranged on the inner wall of the electronic device cover, the sound-absorbing cotton and the inner wall of the electronic device cover can be fixedly connected by adhesive to ensure the connection reliability of the two.

[0020] The first air inlet window and the first air outlet window can be louver windows, and the blades of the louver windows can be bent blades. The blades include a first bent portion and a second bent portion. The first bent portion is arranged close to the inside of the electronic device cover relative to the second bent portion, and the included angle between the first bent portion and the second bent portion is less than 180 degrees. With this design, the air inlet hole formed between two adjacent blades is a bent hole. When the sound in the electronic device cover is transmitted outward through the air inlet hole, it will be reflected or refracted multiple times. During the multiple reflections or refractions, part of the sound energy will be absorbed by the air, which can reduce the sound transmitted to the outside of the electronic device cover, thereby achieving further noise reduction.

[0021] In one possible implementation, the electronic device includes a cabinet, and the air inlet and the air outlet are respectively arranged on the positionally opposite side panels of the cabinet. The electronic device cover further includes positionally opposite second and third side panels. The second and third side panels are respectively connected to the two sides of the first side panel, and the second side panel is arranged opposite to the side panel of the cabinet on which the air inlet is arranged.

[0022] With the above scheme, the air inlet channel can be composed of two parts, i.e., a first part formed between the area close to the second side panel of the first side panel and the panel of the cabinet, and a second part formed between the second side panel and the panel of the cabinet. The air outlet channel can also be composed of two parts, i.e., a third part formed between the area close to the third side panel of the first side panel and the panel of the cabinet, and a fourth part formed between the third side panel and the panel of the cabinet.

[0023] In one possible implementation, the side of the top panel close to the second side panel is provided with a second air inlet window, and the side of the top panel close to the third side panel is provided with a second air outlet window. The second air inlet window is in communication with the air inlet channel, and the second air outlet window is in communication with the air outlet channel. This can increase the air inlet and outlet paths, and is conducive to improving the heat dissipation efficiency of the electronic device.

[0024] In one possible implementation, the second side panel is provided with a third air inlet window, and the third air inlet window is in communication with the air inlet channel. The third air inlet window is a switchable window. By adjusting the opening or closing state of the third air inlet window, the electronic device assembly can be applied to different scenes.

[0025] In one possible implementation, the electronic device cover can be used in an outdoor environment. Since the relative humidity of the air in the electronic device is low, even if high-corrosive substances such as sodium chloride and potassium chloride enter the electronic device, deliquescence will not occur, and thus the electronic components will not be corroded.

[0026] In a second aspect, the present application provides an electronic device assembly, which comprises an electronic device and an electronic device cover according to any possible implementation of the electronic device cover, the electronic device being arranged in the electronic device cover, the electronic device cover being capable of reducing the relative humidity inside the electronic device by adjusting the inlet air temperature of the electronic device, so as to reduce the risk of corrosion of the electronic components inside the electronic device and improve the corrosion resistance of the electronic device.

[0027] In a possible implementation, the electronic device is a server.

[0028] In a possible implementation, the electronic device is a network device.

[0029] In a possible implementation, the electronic device is a storage device.

[0030] In a possible implementation, the electronic device is an electronic device that can be used in an outdoor environment. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 A partial structural schematic diagram of an electronic device assembly provided by an embodiment of the present application;

[0032] Figure 2 A partial structural schematic diagram of an electronic device cover provided by an embodiment of the present application;

[0033] Figure 3 A schematic diagram of the airflow direction inside an electronic device cover provided by an embodiment of the present application;

[0034] Figure 4 A partial structural schematic diagram of a first side plate provided by an embodiment of the present application;

[0035] Figure 5 A partial structural schematic diagram of a first side plate provided by another embodiment of the present application;

[0036] Figure 6 A partial structural schematic diagram of a first side plate provided by yet another embodiment of the present application;

[0037] Figure 7 A partial structural schematic diagram of a first side plate provided by yet another embodiment of the present application;

[0038] Figure 8 A partial structural schematic diagram of a first side plate provided by yet another embodiment of the present application;

[0039] Figure 9 A partial structural schematic diagram of a first side plate provided by yet another embodiment of the present application;

[0040] Figure 10A first side plate partial structure schematic view is provided for another embodiment of the present application.

[0041] Figure 11 A first air inlet window partial structure schematic view is provided for an embodiment of the present application.

[0042] Reference signs:

[0043] 10 - electronic device cover; 20 - electronic device; 21 - cabinet; 22 - air inlet; 23 - air outlet; 11 - first air inlet window;

[0044] 12 - first air outlet window; 101 - top plate; 102 - bottom plate; 103 - first side plate; 104 - second side plate; 105 - third side plate;

[0045] 30 - air inlet channel; 31 - first part; 32 - second part; 40 - air outlet channel; 41 - third part; 42 - fourth part;

[0046] 50 - return air channel; 13 - baffle; 14 - flow guide member; 141 - flow guide plate; 142 - first flow guide groove; 131 - second flow guide groove;

[0047] 15 - second air inlet window; 16 - second air outlet window; 17 - third air inlet window; 111 - third air inlet window; 112 - first bending part;

[0048] 113 - second bending part; 114 - air inlet hole. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings.

[0050] For the convenience of understanding the electronic device cover provided by the embodiments of the present application, the application scenario thereof is first described below. The camera module provided by the embodiments of the present application can be used for accommodating an electronic device, wherein the electronic device can be a server, a communication device, a network device, a storage device or a router, a switch and the like in the prior art. With the rapid development of Internet technology and 5G technology, the electronic device is increasingly widely used in edge scenarios with relatively poor environment. In order to adapt to the conditions such as high temperature, poor air quality and low noise requirement in the edge scenario, the heat dissipation, dust prevention, noise reduction and corrosion resistance and the like of the electronic device also need to be continuously improved. In the prior art, a dust screen is generally arranged at the air inlet of the case of the electronic device to prevent dust. The advantage of this scheme is that the dust prevention effect is good, but the disadvantage is that the arrangement of the dust screen increases the air resistance of heat dissipation, affects the heat dissipation performance of the electronic device, and the dust screen is also easy to be blocked by dust and needs to be regularly cleaned and maintained. If the maintenance is not timely, dust will enter the inside of the case, and when the corrosive harmful impurities in the dust adhere to the single board under certain humidity conditions, deliquescence will occur, which will corrode the single board, and in severe cases, even a short circuit phenomenon of the single board will occur. In addition, the electronic components such as the single board in the electronic device are also easy to be affected by the temperature and humidity of the environment and corrode themselves during the operation of the electronic device, which affects the performance of the electronic device.

[0051] Based on this, the present application provides an electronic device cover and an electronic device assembly applying the same, which can improve the corrosion resistance of the electronic device without affecting the heat dissipation performance of the electronic device.

[0052] Reference Figure 1 As shown in the figure, the electronic device cover 10 provided by the embodiments of the present application can be used for accommodating an electronic device 20, and the electronic device 20 can include a case 21 and components such as a single board and a fan arranged in the case 21. The case 21 is provided with an air inlet 22 and an air outlet 23. Specifically, the air inlet 22 and the air outlet 23 can be arranged on the opposite side panels of the case 21. The air inlet side of the fan can be arranged towards the air inlet 22, and the air outlet side of the fan can be arranged towards the air outlet 23. Thus, the cold air outside the case 21 can enter the case 21 through the air inlet 22 under the suction of the fan, the cold air entering the case 21 is heated after heat exchange with the electronic components, and then is discharged from the case 21 through the air outlet 23 under the exhaust of the fan, thereby achieving heat dissipation of the electronic device 20.

[0053] It should be noted that the relative humidity of the air in the case 21 is an important indicator affecting the corrosion of the related electronic components. Taking a single board as an example, the wiring on the single board is mostly made of copper material, and the critical value of the relative humidity of the copper in the air is 60%. When the relative humidity is above the critical value, the corrosion speed of the copper will continuously accelerate with the increase of the relative humidity value. In addition, the resistance value of the insulation resistance on the surface of the single board will also decrease with the increase of the relative humidity, and the relative humidity of 60%-65% is the inflection point of the decrease of the resistance value of the insulation resistance. In addition, when the relative humidity is below 60%, the high corrosive substances such as sodium chloride and potassium chloride in the air will not deliquesce, and will not have a corrosive effect on the electronic components.

[0054] Therefore, by controlling the relative humidity of the air in the case 21, the purpose of reducing the risk of corrosion of the single board can be achieved. It can be understood that when the absolute humidity is constant, the higher the temperature, the lower the relative humidity. Based on this principle, the relative humidity can be reduced by slightly increasing the air inlet temperature of the case 21 without affecting the normal heat dissipation of the electronic device 20. The embodiment of the present application is to increase the air inlet temperature of the case 21 by setting the electronic device cover 10.

[0055] In specific implementation, please refer to Figure 2 As shown in the figure, the electronic device cover 10 is provided with a first air inlet window 11 and a first air outlet window 12. The first air inlet window 11 can be used to communicate with the air inlet 22 of the case 21 and form an air inlet channel therebetween, and the first air outlet window 12 can be used to communicate with the air outlet 23 of the case 21 and form an air outlet channel therebetween. When the electronic device 20 is cooled, the fresh air outside the electronic device cover 10 can enter the inside of the electronic device cover 10 through the first air inlet window 11, flow through the air inlet channel and be sent into the case 21 through the air inlet 22. After heat exchange with the electronic components in the case 21, it is discharged from the air outlet 23, flows through the air outlet channel and can be discharged to the outside of the electronic device cover 10 through the first air outlet window 12, completing a heat exchange cycle.

[0056] The electronic equipment enclosure 10 further has a return air passage, which can communicate with the air outlet passage and the air inlet passage respectively. Part of the hot air in the air outlet passage can enter the air inlet passage through the return air passage, mix with the fresh air entering the air inlet passage through the first air inlet window 11, and form mixed air with a slightly higher temperature than the fresh air. Under the action of the fan, the mixed air enters the cabinet 21 through the air inlet 22, so as to increase the air inlet temperature of the air inlet 22, eliminate the cold air zone near the air inlet 22 in the cabinet 21, reduce the relative humidity of the air in the cabinet 21, and further reduce the risk of corrosion of single boards and other electronic components. Even in poor air quality application scenarios, such as outdoor environments, due to the low relative humidity of the air in the cabinet, the high corrosive substances such as sodium chloride and potassium chloride entering the cabinet will not deliquesce, and will not have a corrosive effect on the electronic components.

[0057] With reference to the foregoing Figure 2 As shown, the electronic equipment enclosure 10 can specifically be a hexahedral structure, including a top plate 101, a bottom plate 102, a first side plate 103, a second side plate 104, a third side plate 105, and a fourth side plate (not shown in the figure). The top plate 101 is opposite to the bottom plate 102, the first side plate 103 is opposite to the fourth side plate, and the second side plate 104 is opposite to the third side plate 105. When the electronic equipment is arranged in the electronic equipment enclosure 10, the second side plate 104 can be arranged opposite to a side panel of the cabinet on which an air inlet is arranged, and the third side plate 105 can be arranged opposite to a side panel of the cabinet on which an air outlet is arranged.

[0058] In the embodiments of the present application, the first air inlet window 11 and the first air outlet window 12 can be arranged on the first side plate 103 respectively, and specifically, the first air inlet window 11 is arranged on the first side plate 103 near the second side plate 104, and the first air outlet window 12 is arranged on the first side plate 103 near the third side plate 105. It can be understood that the first air inlet window 11 and the first air outlet window 12 can also be arranged on the fourth side plate respectively, and specifically, the first air inlet window 11 is arranged on the fourth side plate near the second side plate 104, and the first air outlet window 12 is arranged on the fourth side plate near the third side plate 105. Of course, in other embodiments of the present application, in order to improve the heat dissipation effect of the electronic equipment, the first air inlet window 11 and the first air outlet window 12 can be arranged on the third side plate 105 and the fourth side plate, so as to increase the air inlet and outlet paths and improve the heat dissipation efficiency.

[0059] Hereinafter, the structure of the first side plate 103 and the arrangement forms of the air inlet passage, the air outlet passage, and the return air passage will be specifically described by taking the first air inlet window 11 and the first air outlet window 12 arranged on the first side plate 103 as an example.

[0060] Please refer to the foregoing Figure 3As shown, in the embodiment of the present application, the air inlet channel 30 can be composed of two parts, respectively, the first part 31 formed between the area close to the second side plate 104 of the first side plate 103 and the panel of the cabinet 21, and the second part 32 formed between the second side plate 103 and the panel of the cabinet 21; the air outlet channel 40 can also be composed of two parts, respectively, the third part 41 formed between the area close to the third side plate 103 of the first side plate 103 and the panel of the cabinet 21, and the fourth part 42 formed between the third side plate 105 and the panel of the cabinet 21; the air return channel 50 is also formed between the first side plate 105 and the panel of the cabinet 21, which is located between the first part 31 and the third part 41 and communicates with the first part 31 and the third part 41 respectively. In this way, the difficulty of setting the air return channel 50 can be reduced, and the structure of the electronic equipment cover 10 can be simplified.

[0061] Since hot air rises, the temperature of the hot return air close to the top plate 101 in the air return channel 50 is generally higher than that close to the bottom plate 102. In order to avoid the temperature imbalance of the mixed air in the upper and lower parts of the air return channel 50 after the hot return air in the air return channel 50 mixes with the new air after entering the air inlet channel 30, affecting the adjustment effect of the relative humidity of the air in the cabinet, in the embodiment of the present application, reference is made to Figure 2 and Figure 3 As shown, the inner wall of the third side wall 105 can be provided with a baffle 13, which is inclinedly arranged with the bottom plate, and specifically can be located between the first air inlet window 11 and the first air outlet window 12. At this time, the air inlet channel and the air outlet channel are located on the two sides of the baffle, and the gap between the baffle and the bottom plate can form part of the air return channel. By arranging the baffle 13, in the air return channel 50, the hot return air on the side close to the air outlet channel 40 of the baffle mainly enters the side close to the air inlet channel 30 through the gap between the baffle 13 and the bottom plate 102. In this way, even if the hot return air on the side close to the air inlet channel 30 still has the phenomenon of hot air rising, the gap between the lower baffle 13 and the bottom plate 102 continuously supplies hot return air, so that the hot return air in the lower part is relatively more sufficient, and thus a mixed air with relatively balanced temperature can be obtained after mixing with the new air in the air inlet channel 30.

[0062] The inclined arrangement of the baffle and the bottom plate in the embodiment of the present application includes but is not limited to the perpendicular arrangement of the baffle and the bottom plate, specifically refers to the baffle and the bottom plate are not parallel, so that the hot return air on the side close to the air outlet channel 40 of the baffle mainly enters the side close to the air inlet channel 30 through the gap between the baffle 13 and the bottom plate 102, so that the hot return air in the lower part is relatively more sufficient, and thus a mixed air with relatively balanced temperature can be obtained after mixing with the new air in the air inlet channel 30.

[0063] When the baffle 13 is specifically arranged, the baffle 13 can include a first end, a second end, a third end and a fourth end, wherein the first end is opposite to the second end, the third end is an end of the baffle 13 close to the top plate 101, and the fourth end is an end of the baffle 13 close to the bottom plate 102. When the electronic device is arranged in the electronic device cover 10, the first end can abut against the panel of the case, the second end is connected with the first side plate, the third end can be connected with or spaced apart from the top plate 101, and the fourth end is spaced apart from the bottom plate 102.

[0064] The specific structure of the baffle 13 is not limited, and in one specific embodiment of the present application, the baffle 13 is specifically a straight plate structure, which can be arranged orthogonally between the top plate 101, or, as shown in Figure 4 , the baffle 13 can be arranged obliquely toward one side of the air inlet channel 30, that is, the included angle between the side of the baffle 13 close to the air inlet channel 30 and the top plate 101 is an acute angle. At this time, the third end of the baffle 13 can be connected with the top plate 101, so that the hot return air close to the air outlet channel 30 can only enter the side close to the air inlet channel 30 through the gap between the baffle 13 and the bottom plate 102, thereby improving the uniformity of the temperature of the mixed air formed in the air inlet channel 30. In another specific embodiment of the present application, the baffle 13 is specifically a straight plate structure, which can be arranged obliquely toward one side of the air inlet channel 30, that is, the included angle between the side of the baffle 13 close to the air inlet channel 30 and the top plate 101 is an acute angle. However, the third end of the baffle 13 is spaced apart from the top plate 101, and the fourth end is spaced apart from the bottom plate 102. Figure 4

[0065] As shown in Figure 2 and Figure 3 , the electronic device cover 10 can further be provided with a flow guide member 14, which can be specifically arranged in the return air channel 50. The flow guide member 14 can guide the hot return air passing through the gap between the baffle and the bottom plate to the air inlet channel 30, so that the hot return air can enter the air inlet channel 30 more regularly and efficiently, thereby improving the efficiency of forming mixed air.

[0066] The structure of the flow guide member 14 is not limited, for example, in one specific embodiment of the present application, the flow guide member 14 can include a plurality of flow guide plates 141 arranged in parallel, which can be fixedly arranged on the inner wall of the third side plate 105. In this way, a first flow guide groove 14 can be formed between two adjacent flow guide plates 141. Specifically, the number of the first flow guide grooves 142 can be arranged according to the specific application scene of the electronic device assembly, for example, when the ambient temperature of the application scene is relatively high, the number of the flow guide grooves 142 can be relatively small, and when the ambient temperature of the application scene is relatively low, the number of the flow guide grooves 142 can be relatively large.

[0067] Please refer to Figure 3 ​And Figure 5 As shown in FIG. 1, when the fourth end of the baffle 13 is arranged obliquely towards one side of the air inlet channel 30, the number of the baffle 13 can be multiple, and the multiple baffles 13 can be fixed at intervals on the inner wall of the first side plate 103. In a specific arrangement, for the baffle 13 closest to the top plate 101 among the multiple baffles 13, the third end of the baffle 13 can be arranged in connection with the top plate 101, and the third end of each of the remaining baffles 13 is sequentially away from the top plate 101. In this way, the second flow guide groove 131 of the air return channel 50 can be formed between two adjacent baffles 13. As can be seen, one end of the second flow guide groove 131 communicating with the air outlet channel 40 is arranged close to the top plate 101, and the other end of the second flow guide groove 131 communicating with the air inlet channel 30 is arranged close to the bottom plate 102. Thus, the hot return air of the air outlet channel 40 can be regularly guided to the lower region of the air inlet channel 30 close to the bottom plate 102, which is conducive to making the temperature of the mixed air formed in the air inlet channel 30 more balanced. In another implementation, the multiple baffles 13 are all arranged at intervals from the top plate 101, and the third end of each of the baffles 13 is sequentially away from the top plate 101. In this way, the second flow guide groove 131 of the air return channel 50 can be formed between two adjacent baffles 13.

[0068] In addition, in some other possible embodiments of the present application, the above-mentioned baffle can also adopt a bent plate structure. The specific structural form of the bent plate is not limited, for example, it can be a combination plate formed by connecting multiple straight plates, an arc-shaped plate, or a combination plate formed by connecting a straight plate and an arc-shaped plate, etc. When the bent plate is adopted, the number of the baffle can be one or multiple. In combination with the above description, when the number of the baffle is one, the third end of the baffle 13 can be arranged in connection with the top plate 101, and the fourth end of the baffle 13 can be bent towards one side of the air inlet channel 30. At this time, the hot return air close to the air outlet channel 40 side of the baffle 13 can only enter the side close to the air inlet channel 30 through the gap between the baffle 13 and the bottom plate 102, so as to improve the balance degree of the temperature of the mixed air formed in the air inlet channel 30. In addition, by virtue of the bent shape of the baffle 13, the baffle 13 can also play a flow guiding role to guide the hot return air to the lower region of the air inlet channel 30 close to the bottom plate 102. In another possible embodiment, the third end of the baffle 13 is arranged at intervals from the top plate 101, and the fourth end of the baffle 13 is arranged at intervals from the bottom plate 102. Figure 3 And Figure 6 As shown in FIG. 1, when the number of the baffle 13 is one, the third end of the baffle 13 can be arranged in connection with the top plate 101, and the fourth end of the baffle 13 can be bent towards one side of the air inlet channel 30. At this time, the hot return air close to the air outlet channel 40 side of the baffle 13 can only enter the side close to the air inlet channel 30 through the gap between the baffle 13 and the bottom plate 102, so as to improve the balance degree of the temperature of the mixed air formed in the air inlet channel 30. In addition, by virtue of the bent shape of the baffle 13, the baffle 13 can also play a flow guiding role to guide the hot return air to the lower region of the air inlet channel 30 close to the bottom plate 102. In another possible embodiment, the third end of the baffle 13 is arranged at intervals from the top plate 101, and the fourth end of the baffle 13 is arranged at intervals from the bottom plate 102.

[0069] When the number of the baffle 13 is multiple, reference can be made to the above description. Figure 7As shown, the plurality of baffles 13 can be fixed at intervals on the inner wall of the first side plate 103, and in a specific arrangement, for the baffle 13 closest to the top plate 101 among the plurality of baffles 13, the third end of the baffle 13 can be arranged in connection with the top plate 101, and the third end of the remaining baffles 13 is sequentially away from the top plate 101, so that the second flow guide groove 131 of the return air passage 50 can be formed between two adjacent baffles 13. Similarly, one end of the second flow guide groove 131 communicating with the air outlet passage 40 is arranged close to the top plate 101, and one end of the second flow guide groove 131 communicating with the air inlet passage 30 is arranged close to the bottom plate 102, so that the hot return air of the air outlet passage 40 can be regularly guided to the lower area of the air inlet passage 30 close to the bottom plate 102, which is beneficial to make the temperature of the mixed air formed in the air inlet passage 30 more balanced. In another possible embodiment, the third end of the plurality of baffles 13 is arranged at intervals between the top plate 101, and the third end of each baffle 13 is sequentially away from the top plate 101.

[0070] Figure 7 The embodiment shown is a baffle 13 formed by combining two straight plates into an obtuse angle structure. Among the two straight plates, the straight plate close to the bottom plate 102 is arranged obliquely toward the air inlet passage, and the straight plate close to the top plate 101 can be arranged orthogonally with the top plate 101, or can be arranged obliquely toward the air inlet passage as shown in Figure 8 . The present application does not limit this. In addition, the straight plate close to the top plate 101 can be connected with the top plate 101 or arranged at intervals with the top plate 101.

[0071] Of course, in other embodiments of the present application, the baffle 13 can also adopt the arc-shaped plate as shown in Figure 9 and Figure 10 . In a specific arrangement, the baffle 13 can protrude toward the air inlet passage as shown in Figure 9 , or can protrude toward the air outlet passage as shown in Figure 10 . The present application also does not limit this. The number of arc-shaped plates can be one, and one arc-shaped plate can be connected with the top plate 101 or arranged at intervals with the top plate 101.

[0072] It can be understood that when the first air inlet window 11 and the first air outlet window 12 are arranged on the fourth side plate, the fourth side plate can adopt a structure design symmetrical to the first side plate 103, which will not be described in detail here.

[0073] In the foregoing embodiments, through the design of the return air passage 50, combined with the uniform mixing and guiding effects of the baffles 13, the air inlet temperature of the air inlet of the cabinet can be increased by about 3°C, so that the cold air area close to the air inlet in the cabinet can be eliminated, the relative humidity of the air in the cabinet can be reduced to below 60%, and the risk of corrosion of single board and other electronic components can be reduced.

[0074] ReferenceFigure 2 As shown in the embodiments of the present application, the side of the top plate 101 close to the second side plate 104 can also be provided with a second air inlet window 15, which can be in communication with the air inlet channel, so that the external fresh air can enter the air inlet channel through the first air inlet window 11 and the second air inlet window 15, thereby increasing the air inlet path; similarly, the side of the top plate 101 close to the third side plate 105 can also be provided with a second air outlet window 16, which can be in communication with the air outlet channel, so that the hot air in the air outlet channel can be discharged to the outside through the first air outlet window 12 and the second air outlet window 16, thereby increasing the air outlet path.

[0075] In addition, with reference to the above Figure 2 As shown, the second side plate 104 can be provided with a third air inlet window 17, which is also in communication with the air inlet channel, and when provided, the third air inlet window 17 can be a switch window, by adjusting the opening or closing state of the third air inlet window 17, the electronic equipment assembly can be applied to different scenes. Specifically, when the third air inlet window 17 is in an open state, the electronic equipment assembly can be applied to a scene with good air quality and relatively sufficient cold air, the opening of the third air inlet window 17 can increase the air inlet path, at this time the temperature of the fresh air in the air inlet channel is relatively low, and the hot return air ratio is relatively small, the fan of the electronic equipment can meet the heat dissipation demand even at low speed, so the noise generated is relatively small, in addition, since the external air is relatively clean, the high corrosive substances entering the case are also relatively small, and the corrosion of the electronic components is relatively small; when the third air inlet window 17 is in a closed state, the electronic equipment assembly can be applied to a scene with poor air quality, such as an outdoor environment, at this time the hot return air ratio in the air inlet channel is relatively increased, so that the air inlet temperature of the air inlet into the case is increased slightly, thereby reducing the relative humidity of the air in the case, that is, in this scene, the risk of corrosion of the electronic components can also be reduced. Therefore, the electronic equipment cover and the electronic equipment provided by the embodiments of the present application can be used in outdoor environments.

[0076] In the above embodiments, the specific structure of the third air inlet window 17 is not limited, for example, it can be a rotating door pivoted to the first side plate by a hinge, or the third air inlet window 17 can also be a rotating louver, etc.

[0077] In order to reduce the noise influence of the electronic equipment on the surrounding environment, the inner wall of the electronic equipment cover 10 can be provided with sound-absorbing cotton, so that the noise generated by the electronic equipment when working can be isolated inside the electronic equipment cover 10. The specific type of sound-absorbing cotton is not limited, for example, it can be glass fiber sound-absorbing cotton or polyester fiber sound-absorbing cotton, etc. When the sound-absorbing cotton is provided on the inner wall of the electronic equipment cover 10, the sound-absorbing cotton and the inner wall of the electronic equipment cover 10 can be fixed by adhesive to ensure the connection reliability of the two.

[0078] It should be noted that when the sound-absorbing cotton is provided, the positions of the air inlet windows and the air outlet windows on the electronic device housing 10 need to be avoided to ensure smooth air inlet and outlet of the electronic device housing 10 .

[0079] In addition, in the embodiment of the present application, each of the aforementioned air inlet windows and air outlet windows can be a shutter. Taking the first air inlet window 11 as an example, refer to Figure 11 As shown, the blades 111 of the first air inlet window 11 can be specifically bent blades. The blades 111 include a first bent portion 112 and a second bent portion 113. The first bent portion 111 is positioned closer to the interior of the electronic device housing relative to the second bent portion 113, and the angle between the first bent portion 112 and the second bent portion 113 is less than 180 degrees. With this design, the air inlet 114 formed between two adjacent blades 111 is a bent hole. When sound inside the electronic device housing propagates outward through the air inlet 114, it will undergo multiple reflections or refractions. During these multiple reflections or refractions, some of the sound energy will be absorbed by the air, thereby reducing the sound that ultimately propagates outside the electronic device housing and achieving further noise reduction. Experiments have shown that the design of the blinds, combined with the sound-absorbing cotton attached to the inner wall of the electronic device housing, can achieve a noise reduction of approximately 3 decibels, allowing the electronic device to meet the 55-decibel noise standard for office environments.

[0080] In some other embodiments, each air inlet window and air outlet window may also adopt labyrinth-type shutters to achieve noise reduction. The structure of the labyrinth-type shutters may be similar to that in the prior art, and this application will not elaborate on this.

[0081] It is also worth mentioning that by providing an electronic equipment cover, the electronic equipment components can also be installed vertically in non-cabinet scenarios such as offices, thereby improving the high-quality industrial design of the appearance of the electronic equipment components.

[0082] In summary, the electronic device cover provided in the embodiment of the present application, by setting up a return air duct to return part of the hot air to the air inlet duct, can slightly increase the air inlet temperature of the chassis without affecting the heat dissipation performance of the electronic equipment, thereby eliminating the cold air zone near the air inlet area in the chassis, reducing the relative humidity of the air in the chassis, and thus reducing the risk of corrosion of electronic components such as single boards.

[0083] refer to Figure 1As shown, the embodiment of the present application further provides an electronic device assembly, which comprises the electronic device 20 and the electronic device cover 10 in any of the foregoing embodiments, wherein the electronic device 20 can be a server, a communication device, a network device, a storage device or a router, a switch and the like in the prior art, the electronic device can be arranged in the electronic device cover 10, and the electronic device cover 10 can reduce the relative humidity inside the electronic device 20 by adjusting the air inlet temperature of the electronic device, so that the risk of corrosion of the electronic components inside the electronic device 20 can be reduced, and the corrosion resistance of the electronic device can be improved.

[0084] The above merely illustrates the specific embodiments of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electronic device housing, characterized in that: The electronic device housing is used to accommodate electronic devices; The electronic device housing is provided with a first air inlet window and a first air outlet window, wherein the first air inlet window is used to communicate with the air inlet of the electronic device to form an air inlet channel, and the first air outlet window is used to communicate with the air outlet of the electronic device to form an air outlet channel; The electronic device housing is provided with a return air channel, and the return air channel is used to connect the air outlet channel with the air inlet channel; The electronic device housing further includes a top plate, a first side plate, and a bottom plate, wherein the first side plate connects the top plate and the bottom plate; a baffle is provided on an inner wall of the first side plate, and the baffle is arranged obliquely with respect to the bottom plate; the air inlet channel and the air outlet channel are respectively located on either side of the baffle, and a gap between the baffle and the bottom plate forms a portion of the return air channel; The first end of the baffle is used to abut against the electronic device, the second end of the baffle is connected to the first side panel, the third end of the baffle is connected to or spaced apart from the top panel, and the fourth end of the baffle is spaced apart from the bottom panel; wherein, the first end and the second end are positioned opposite to each other, the third end is the end of the baffle close to the top panel, and the fourth end is the end of the baffle close to the bottom panel.

2. The electronic device housing according to claim 1, wherein: The first air inlet window and the first air outlet window are arranged on the first side panel.

3. The electronic device housing according to claim 2, wherein: The baffle is located between the first air inlet window and the first air outlet window.

4. The electronic device housing according to claim 1, wherein: The baffle is a straight plate structure, and the baffle is arranged orthogonally to the top plate; or, the angle between the side of the baffle close to the air inlet channel and the top plate is an acute angle.

5. The electronic device housing according to claim 4, wherein: The third end is connected to the top plate; A flow guide member is provided in the electronic device housing. The flow guide member is provided in the return air channel and is used to guide part of the return air from the air outlet channel to the air inlet channel through the gap between the baffle and the bottom plate.

6. The electronic device housing according to claim 5, wherein: The flow guide component includes a plurality of flow guide plates, which are arranged at intervals on the inner wall of the first side plate, and two adjacent flow guide plates form a first flow guide groove.

7. The electronic device housing according to claim 4, wherein: When the angle between the side of the baffle close to the air inlet channel and the top plate is an acute angle, There are multiple baffles, and the multiple baffles are arranged at intervals on the inner wall of the first side plate, and the third ends of the multiple baffles are successively away from the top plate. Two adjacent baffles form the second guide groove of the return air channel, and the end of the second guide groove connected to the air inlet channel is arranged close to the bottom plate.

8. The electronic device housing according to claim 1, wherein: The baffle is a bent plate structure, and the number of the baffles is one or more.

9. The electronic device housing according to claim 8, wherein: There are multiple baffles; the multiple baffles are arranged at intervals on the inner wall of the first side plate, and the third ends of the multiple baffles are successively away from the top plate, and two adjacent baffles form a second guide groove of the return air channel, and the end of the second guide groove connected to the air inlet channel is arranged close to the bottom plate.

10. The electronic device housing according to claim 1, wherein: The inner wall of the electronic equipment housing is provided with sound-absorbing cotton.

11. The electronic device housing according to claim 1, wherein: The first air inlet window and the first air outlet window are respectively shutters, and the blades of the shutters include a first bending portion and a second bending portion. The first bending portion is arranged close to the interior of the electronic device cover, and the angle between the first bending portion and the second bending portion is less than 180 degrees.

12. The electronic device housing according to claim 2, wherein: The electronic device includes a chassis, and the air inlet and the air outlet are respectively provided on two opposite side panels of the chassis; The electronic device housing further includes a second side panel and a third side panel positioned opposite to each other. The second side panel and the third side panel are respectively connected to both sides of the first side panel, and the second side panel is arranged opposite to a side panel of the chassis on which the air inlet is provided.

13. The electronic device housing according to claim 12, wherein: A second air inlet window is provided on one side of the top plate close to the second side plate, and the second air inlet window is communicated with the air inlet channel; A second air outlet window is provided on one side of the top plate close to the third side plate, and the second air outlet window is communicated with the air outlet channel.

14. The electronic device housing according to claim 12, wherein: A third air inlet window is provided on the second side panel, the third air inlet window is communicated with the air inlet channel, and the third air inlet window is a switch window.

15. The electronic device housing according to any one of claims 1 to 14, wherein: The electronic device housing can be used in outdoor environments.

16. An electronic device assembly, characterized in that: The device comprises an electronic device and the electronic device housing according to any one of claims 1 to 15, wherein the electronic device is arranged in the electronic device housing.

17. The electronic device assembly according to claim 16, wherein: The electronic device is a server.

18. The electronic device assembly according to claim 16, wherein: The electronic device is a network device.

19. The electronic device assembly of claim 16, wherein: The electronic device is a storage device.

20. The electronic device assembly according to any one of claims 16 to 19, wherein: The electronic device is an electronic device that can be used in an outdoor environment.

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