Flexible circuit board with a shielded bend and method of manufacturing the same

Abstract

The present application relates to an antenna carrier provided with a flexible circuit board, comprising: a first dielectric formed to include a width direction and a length direction; a first signal line located on one side in the width direction of the upper surface or lower surface of the first dielectric; a second signal line located on the upper surface or lower surface of the first dielectric, separated from the first signal line to the other side in the width direction; a second dielectric located on one side in the width direction of the upper surface of the first dielectric, and the first signal line is provided below the second dielectric; a third dielectric located below the first dielectric, separated from the second dielectric to the other side in the width direction, and the second signal line is provided above the third dielectric; a first ground located above the second dielectric; and a second ground located below the third dielectric.

Description

Technical Field

[0001] This invention relates to a flexible circuit board with a bend that improves shielding and a method for manufacturing the same. Background Technology

[0002] Flexible circuit boards that transmit high-frequency signals are used inside wireless terminals (e.g., smartphones, tablets, etc.).

[0003] Flexible circuit boards can be individually bent based on the bending requirements of internal components or the hinges of wireless terminals.

[0004] like Figure 1 As shown, the thickness of the bent region A1 of such a flexible circuit board is formed to be thinner than the thickness of other regions.

[0005] Figure 2 It is a cross-sectional view of the bent area. Figure 3 It is a cross-sectional view of other regions adjacent to the bent region.

[0006] and Figure 3 Compared to the other areas shown, Figure 2 The bent area shown is thin because the structure of the first ground 310 and the second ground 320 has been removed, resulting in a problem of weak noise interference resistance.

[0007] In particular, in the case of flexible circuit boards consisting of two or more signal lines, there is a problem of interference between signal lines. Summary of the Invention

[0008] The purpose of this invention is to provide a flexible circuit board with a bend that has improved shielding properties and a method for manufacturing the same.

[0009] A flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes: a first dielectric material formed to include a width direction and a length direction; a first signal line located on one side in the width direction above or below the first dielectric material; a second signal line located above or below the first dielectric material, spaced apart from the first signal line in the width direction to the other side; a second dielectric material located on one side in the width direction above the first dielectric material, and the first signal line disposed below the second dielectric material; a third dielectric material located below the first dielectric material, spaced apart from the second dielectric material in the width direction to the other side, and the second signal line disposed above the third dielectric material; a first ground located above the second dielectric material; and a second ground located below the third dielectric material.

[0010] According to one embodiment, the flexible circuit board with the bend having improved shielding includes: a first cover located above the first dielectric and formed from all or part of the area below the second dielectric to the area above the third dielectric, thus being disposed to overlap at least a portion of the second dielectric in the vertical direction; and a second cover located below the first dielectric and formed from all or part of the area above the third dielectric to the area below the second dielectric, thus being disposed to overlap at least a portion of the third dielectric in the vertical direction.

[0011] According to one embodiment, the flexible circuit board with the bend having improved shielding includes: a third cover located above the first ground; and a fourth cover located below the second ground.

[0012] According to one embodiment, the flexible circuit board with the bend having improved shielding includes: a first center ground located between the first signal line and the second signal line and above the first dielectric; and a second center ground located between the first signal line and the second signal line and below the first dielectric, the second dielectric being configured to overlap at least a portion of the first center ground in the vertical direction, and a third dielectric being configured to overlap at least a portion of the second center ground in the vertical direction.

[0013] According to one embodiment, the flexible circuit board with the bend having improved shielding includes: a first side ground located on one side in the width direction above the first dielectric; a second side ground located on the other side in the width direction above the first dielectric; a third side ground located on one side in the width direction below the first dielectric; and a fourth side ground located on the other side in the width direction below the first dielectric. A first center ground is provided between the first side ground and the second side ground, and a second center ground is provided between the third side ground and the fourth side ground.

[0014] According to one embodiment, the flexible circuit board with an enhanced shielding bend includes: a first solder pad located between the first dielectric and the second dielectric, covering the portion of the first cover body between the first dielectric and the second dielectric; and a second solder pad located between the first dielectric and the third dielectric, covering the portion of the second cover body between the first dielectric and the third dielectric.

[0015] According to one embodiment, the first ground is formed with a width smaller than the width of the second dielectric so that it is not superimposed on the first cover in the vertical direction but is separated from the first cover in the horizontal direction, and the second ground is formed with a width smaller than the width of the third dielectric so that it is not superimposed on the second cover in the vertical direction but is separated from the second cover in the horizontal direction.

[0016] According to one embodiment, the flexible circuit board with the bend having improved shielding includes: a third signal line, spaced apart from the second signal line in the width direction and located above or below the first dielectric; a fourth dielectric, spaced apart from the third dielectric in the width direction and located above the first dielectric, with the third signal line disposed below the fourth dielectric; a fifth cover, located below the first dielectric, and formed from all or part of the area above the third dielectric to the area below the fourth dielectric, and configured to overlap at least a portion of the third dielectric in the vertical direction; and a third ground, located above the fourth dielectric.

[0017] According to one embodiment, the flexible circuit board with an enhanced shielding bend includes: a first cover, located above the first dielectric, and formed from all or part of the area below the second dielectric to all or part of the area below the fourth dielectric, configured to overlap at least a portion of the second dielectric and the fourth dielectric in a vertical direction; a second cover, located below the first dielectric, and formed from all or part of the area above the third dielectric to the area below the second dielectric, configured to overlap at least a portion of the third dielectric in a vertical direction; and a fifth cover, located below the first dielectric, and formed from all or part of the area above the third dielectric to the area below the fourth dielectric, configured to overlap at least a portion of the third dielectric in a vertical direction.

[0018] According to one embodiment, the flexible circuit board with the bend having improved shielding includes: a third cover located above the first ground; a fourth cover located below the second ground; and a sixth cover located above the third ground.

[0019] According to one embodiment, the flexible circuit board with the bend having improved shielding includes: a first center ground located between the first signal line and the second signal line and above the first dielectric; a second center ground located between the first signal line and the second signal line and below the first dielectric; a third center ground located between the second signal line and the third signal line above the first dielectric; and a fourth center ground located between the second signal line and the third signal line below the first dielectric, wherein the second dielectric is configured to overlap at least a portion of the first center ground in the vertical direction, the third dielectric is configured to overlap at least a portion of the second center ground and the fourth center ground in the vertical direction, and the fourth dielectric is configured to overlap at least a portion of the third center ground in the vertical direction.

[0020] According to one embodiment, the flexible circuit board with the bend having improved shielding includes: a first side ground located on one side in the width direction above the first dielectric; a second side ground located on the other side in the width direction above the first dielectric; a third side ground located on one side in the width direction below the first dielectric; and a fourth side ground located on the other side in the width direction below the first dielectric. A first center ground and a third center ground are provided between the first side ground and the second side ground, and a second center ground and a fourth center ground are provided between the third side ground and the fourth side ground.

[0021] According to one embodiment, the flexible circuit board with an enhanced shielding bend includes: a first solder pad located between the first dielectric and the second dielectric, covering the portion of the first cover body between the first dielectric and the second dielectric; a second solder pad located between the first dielectric and the third dielectric, covering the portion of the second cover body between the first dielectric and the third dielectric; and a third solder pad located between the first dielectric and the fourth dielectric, covering the portion of the first cover body between the first dielectric and the fourth dielectric.

[0022] According to one embodiment, the first ground is formed with a width smaller than the width of the second dielectric so that it does not overlap with the first cover in the vertical direction but is separated from the first cover in the horizontal direction; the second ground is formed with a width smaller than the width of the third dielectric so that it does not overlap with the second cover and the fifth cover in the vertical direction but is separated from the second cover and the fifth cover in the horizontal direction; and the third ground is formed with a width smaller than the width of the fourth dielectric so that it does not overlap with the first cover in the vertical direction but is separated from the first cover in the horizontal direction.

[0023] A flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes: a first dielectric material formed to include a width direction and a length direction; a first signal line located on one side in the width direction above or below the first dielectric material; a second signal line located above or below the first dielectric material, spaced apart from the first signal line in the width direction; a first cover located above the first dielectric material and formed to have a width dimension smaller than the width dimension of the first dielectric material; a second cover located below the first dielectric material and at least partially superimposed on the first cover in the vertical direction, and formed to have a width dimension smaller than the width dimension of the first dielectric material; and a second dielectric material located on one side in the width direction above the first dielectric material and below the second dielectric material. The system includes: a first signal line; a third dielectric, which is spaced apart from the second dielectric in the width direction and located below the first dielectric, with the second signal line positioned above the third dielectric; a first ground, located above the second dielectric; a second ground, located below the third dielectric; a third cover, located above the first ground; and a fourth cover, located below the second ground. At least a portion of one side of the first cover in the length direction is located between the first dielectric and the second dielectric, and no portion between the first dielectric and the second dielectric is exposed. At least a portion of one side of the second cover in the length direction is located between the first dielectric and the third dielectric, and no portion between the first dielectric and the third dielectric is exposed.

[0024] According to one embodiment, at least a portion of one side of the first cover in the width direction is located between the first dielectric and the second dielectric, and at least a portion of the other side of the second cover in the width direction is located between the first dielectric and the third dielectric.

[0025] A method for manufacturing a flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes: a first step of attaching a first cover over a first dielectric; a second step of attaching a second dielectric over the first dielectric to cover the first cover; and a third step of removing the second dielectric located over the first cover in such a way that at least a portion of the second dielectric located around the first cover remains.

[0026] A method for manufacturing a flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes: a first step of attaching a first cover over a first dielectric; and a second step of attaching a cut second dielectric over the first dielectric in a manner that covers at least a portion of the area around the first cover.

[0027] First, it has the following effects: the second dielectric and the first ground are formed only on a portion above the first dielectric and remain flexible, and shield the first signal line from noise interference; the third dielectric and the second ground are formed only on a portion below the first dielectric and remain flexible, and shield the second signal line from noise interference.

[0028] In addition, it has the following effect: the second dielectric, the first ground, the third dielectric, and the second ground are symmetrical with the first dielectric as the reference point, thus shielding the interference between the first signal line and the second signal line.

[0029] In addition, it has the following effect: the portion above the first dielectric where the second dielectric is disposed and the portion above the first dielectric where the second dielectric is not disposed are linked to each other, and the portion below the first dielectric where the third dielectric is disposed and the portion below the first dielectric where the third dielectric is not disposed are linked to each other, thereby enabling bending and preventing damage caused by bending at different angles.

[0030] In addition, it has the following effects: the first center ground, together with the second dielectric and the first ground, shields the first signal line from noise interference; the second center ground, together with the third dielectric and the second ground, shields the second signal line from noise interference.

[0031] In addition, it has the following effect: the first ground and the first cover do not overlap in the vertical direction, and the second ground and the second cover do not overlap in the vertical direction, thus preventing the thickness of the flexible circuit board from increasing.

[0032] In addition, it has the following effects: the third center ground, together with the fourth dielectric and the third ground, shields the third signal line from noise interference, and the fourth center ground, together with the third dielectric and the second ground, shields the second signal line from noise interference.

[0033] In addition, it has the following effects: the first side ground and the third side ground together with the first center ground and the second center ground shield the first signal line from noise interference, and the second side ground and the fourth side ground together with the first center ground and the second center ground shield the second signal line from noise interference.

[0034] In addition, it has the following effect: the third ground and the first cover do not overlap in the vertical direction, thus preventing the thickness of the flexible circuit board from increasing.

[0035] In addition, it has the following effect: the portion above the first dielectric where the second dielectric is disposed and the portion above the first dielectric where the second dielectric is not disposed are linked to each other, and the portion below the first dielectric where the third dielectric is disposed and the portion below the first dielectric where the third dielectric is not disposed are linked to each other, thereby enabling bending and preventing damage caused by bending at different angles. Attached Figure Description

[0036] Figure 1 This is a diagram showing the thickness of the bent area.

[0037] Figure 2 It is a cross-sectional view showing the bent area.

[0038] Figure 3 It is a cross-sectional view showing other areas adjacent to the bent area.

[0039] Figures 4 to 9 This is a cross-sectional view showing the bent region according to an embodiment of the present invention.

[0040] Figure 10 This is a diagram illustrating a first cover according to an embodiment of the present invention, which is configured to overlap at least a portion of a second dielectric.

[0041] Figure 11 This is a partial cross-sectional view showing a first cover configured to overlap at least a portion of a second dielectric according to an embodiment of the present invention.

[0042] Figures 12 to 14 This is a diagram illustrating each manufacturing step according to an embodiment of the present invention. Detailed Implementation

[0043] In the accompanying drawings used to illustrate the present invention, the positional relationship of the structure is explained with reference to the width direction, the vertical direction, and the length direction. To facilitate this explanation, in the reference numerals X, Y, and Z shown in the drawings, X represents the width direction, Y represents the vertical direction, and Z represents the length direction, respectively.

[0044] However, such directional descriptions are used to help explain positional relationships and should not be interpreted as limiting. It should be noted that the position changes depending on the direction of the viewpoint.

[0045] Flexible circuit boards that transmit high-frequency signals are used inside wireless terminals (e.g., smartphones, tablets, etc.).

[0046] Flexible circuit boards can be individually bent based on the bending requirements of internal components or the hinges of wireless terminals.

[0047] like Figure 1 As shown, the thickness of the bent region A1 of such a flexible circuit board is formed to be thinner than the thickness of other regions.

[0048] Figure 2 It is a cross-sectional view of the bent area. Figure 3 It is a cross-sectional view of other regions adjacent to the bent region.

[0049] and Figure 3 Compared to the other areas shown, Figure 2 The bent area shown is thin because the structure of the first ground 310 and the second ground 320 has been removed, resulting in a problem of weak noise interference resistance.

[0050] In particular, in the case of flexible circuit boards consisting of two or more signal lines, there is a problem of interference between signal lines.

[0051] To solve such problems, such as Figure 4 as well as Figure 5 As shown, a flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a first dielectric 110, a first signal line 510, a second signal line 520, a second dielectric 120, a third dielectric 130, a first cover 210, a second cover 220, a first ground 310, a second ground 320, a third cover 230, and a fourth cover 240.

[0052] The first dielectric 110 is formed to include a width direction and a length direction.

[0053] The first signal line 510 is located on one side in the width direction above or below the first dielectric 110.

[0054] The second signal line 520 is separated from the first signal line 510 in the width direction and is located above or below the first dielectric 110.

[0055] The second dielectric 120 is located on one side in the width direction above the first dielectric 110, and a first signal line 510 is disposed below it.

[0056] The third dielectric 130 is separated from the second dielectric 120 by the first dielectric 110 in the width direction and is located below the first dielectric 110, with the second signal line 520 disposed above it.

[0057] The first ground 310 is located above the second dielectric 120.

[0058] The second ground 320 is located below the third dielectric 130.

[0059] Thus, the following effects are achieved: the second dielectric 120 and the first ground 310 are formed only on a portion above the first dielectric 110 and remain flexible, thus shielding the first signal line 510 from noise interference; the third dielectric 130 and the second ground 320 are formed only on a portion below the first dielectric 110 and remain flexible, thus shielding the second signal line 520 from noise interference.

[0060] In addition, it has the following effect: the second dielectric 120, the first ground 310, the third dielectric 130, and the second ground 320 are symmetrical about the first dielectric 110 as a reference point to shield the interference between the first signal line 510 and the second signal line 520.

[0061] like Figure 4 as well as Figure 5 As shown, the flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a first cover 210, a second cover 220, a third cover 230, and a fourth cover 240.

[0062] The first cover 210 is located above the first dielectric 110 and extends from the lower region of the second dielectric 120 to the upper region of the third dielectric 130, thereby being configured to overlap at least a portion of the second dielectric 120 in the vertical direction.

[0063] The second cover 220 is located below the first dielectric 110 and is formed from all or part of the area above the third dielectric 130 to the area below the second dielectric 120, and is configured to overlap at least a portion of the third dielectric 130 in the vertical direction.

[0064] Figure 4 This is a diagram illustrating an example of a first cover 210 extending from the entire area below the second dielectric 120 to the area above the third dielectric 130, and a second cover 220 extending from the entire area above the third dielectric 130 to the area below the second dielectric 120. Figure 5 This is an example diagram showing a first cover 210 formed from a lower partial region of the second dielectric 120 to an upper region of the third dielectric 130, and a second cover 220 formed from an upper partial region of the third dielectric 130 to a lower region of the second dielectric 120.

[0065] It can be, such as Figure 4 As shown, the first cover 210 and the second dielectric 120 are completely superimposed in the vertical direction, or as... Figure 5 As shown, the first cover 210 and a portion of the second dielectric 120 are superimposed in the vertical direction.

[0066] At this time, when the flexible circuit board is bent, the portion of the first cover 210 and at least a portion of the second dielectric 120 that overlaps in the vertical direction allows the portion of the first dielectric 110 above which the second dielectric 120 is disposed and the portion of the first dielectric 110 above which the second dielectric 120 is not disposed to move together and bend, thereby preventing damage caused by bending at different angles to each other.

[0067] It can be, such as Figure 4 As shown, the second cover 220 and the third dielectric 130 are all superimposed in the vertical direction, or Figure 5 As shown, the second cover 220 and a portion of the third dielectric 130 are superimposed in the vertical direction.

[0068] At this time, when the flexible circuit board is bent, the portion of the second cover 220 and at least a portion of the third dielectric 130 that overlaps in the vertical direction allows the portion of the first dielectric 110 below which the third dielectric 130 is disposed and the portion of the first dielectric 110 below which the third dielectric 130 is not disposed to move together and bend, thereby preventing damage caused by bending at different angles to each other.

[0069] The third cover 230 is located above the first grounding 310.

[0070] The fourth cover 240 is located below the second ground 320.

[0071] Thus, the following effects are achieved: the portion above the first dielectric 110 where the second dielectric 120 is disposed and the portion above the first dielectric 110 where the second dielectric 120 is not disposed are connected to each other; the portion below the first dielectric 110 where the third dielectric 130 is disposed and the portion below the first dielectric 110 where the third dielectric 130 is not disposed are connected to each other, thereby enabling bending and preventing damage caused by bending at different angles.

[0072] like Figure 4 as well as Figure 5 As shown, the flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a first center ground 610, a second center ground 620, a first side ground 710, a second side ground 720, a third side ground 730, and a fourth side ground 740.

[0073] The first center ground 610 is located between the first signal line 510 and the second signal line 520, and is located on top of the first dielectric 110.

[0074] The second center ground 620 is located between the first signal line 510 and the second signal line 520, and is located below the first dielectric 110.

[0075] The second dielectric 120 is configured to overlap at least a portion of the first central ground 610 in the vertical direction.

[0076] The third dielectric 130 is configured to overlap at least a portion of the second center ground 620 in the vertical direction.

[0077] The first side ground 710 and the second side ground 720 are located on both sides of the first dielectric 110 in the width direction, so that the first center ground 610 is located between the first side ground 710 and the second side ground 720.

[0078] The third side ground 730 and the fourth side ground 740 are located on both sides in the width direction below the first dielectric 110 so that the second center ground 620 is located between the third side ground 730 and the fourth side ground 740.

[0079] When the first signal line 510 is located above the first dielectric 110, the third side ground 730 and the second center ground 620 can be separated from each other without any connection as shown in the figure. They can be partially connected to form a pattern or completely connected.

[0080] When the first signal line 510 is located below the first dielectric 110, the first side ground 710 and the first center ground 610 can be separated without any connection between them, as shown in the figure. They can be partially connected to form a pattern or completely connected.

[0081] When the second signal line 520 is located above the first dielectric 110, the fourth side ground 740 and the second center ground 620 can be separated from each other without any connection as shown in the figure. They can be partially connected to form a pattern or completely connected.

[0082] When the second signal line 520 is located below the first dielectric 110, the second side ground 720 and the first center ground 610 can be separated from each other without any connection as shown in the figure. They can be partially connected to form a pattern or completely connected.

[0083] At this point, the pattern formed by connecting parts may include a shape with periodically arranged graphics through unconnected parts, or a mesh formed by connecting parts.

[0084] Thus, the following effects are achieved: the first center ground 610, together with the second dielectric 120 and the first ground 310, shields the first signal line 510 from noise interference; the second center ground 620, together with the third dielectric 130 and the second ground 320, shields the second signal line 520 from noise interference.

[0085] In addition, it has the following effects: the first side ground 710 and the third side ground 730 together with the first center ground 610 and the second center ground 620 shield the first signal line 510 from noise interference, and the second side ground 720 and the fourth side ground 740 together with the first center ground 610 and the second center ground 620 shield the second signal line 520 from noise interference.

[0086] pass Figures 6 to 8 The positional relationship between the second dielectric 120 and the third dielectric 130 is described below (for reference, X1 is the range in which the second dielectric 120 and the first center ground 610 overlap in the vertical direction, and X2 is the range in which the third dielectric 130 and the second center ground 620 overlap in the vertical direction).

[0087] The positional relationship between the second dielectric 120 and the third dielectric 130 in the horizontal direction is described below, assuming that the second dielectric 120 is configured to overlap at least part of the first central ground 610 in the vertical direction and the third dielectric 130 is configured to overlap at least part of the second central ground 620 in the vertical direction.

[0088] like Figure 6 As shown, the second dielectric 120 and the third dielectric 130 are arranged separately in the horizontal direction.

[0089] like Figure 7 As shown, the second dielectric 120 and the third dielectric 130 can be arranged close to each other in a range that does not overlap in the vertical direction.

[0090] like Figure 8 As shown, the range in which the second dielectric 120 and the first center ground 610 overlap in the vertical direction can be different from the range in which the third dielectric 130 and the second center ground 620 overlap in the vertical direction.

[0091] like Figure 4 as well as Figure 5 As shown, the flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a first welding piece 410 and a second welding piece 420.

[0092] The first welding piece 410 is located between the first dielectric 110 and the second dielectric 120, and covers the portion of the first cover 210 between the first dielectric 110 and the second dielectric 120.

[0093] The second welding piece 420 is located between the first dielectric 110 and the third dielectric 130, and covers the portion of the second cover 220 between the first dielectric 110 and the third dielectric 130.

[0094] That is, the second dielectric 120 and the third dielectric 130 are bonded to the first dielectric 110 using the first welding piece 410 and the second welding piece 420 as the dielectric, respectively.

[0095] At this time, although not shown in the figure, the first welding piece 410 and the second welding piece 420 may not exist, and the second dielectric 120 and the third dielectric 130 may be directly bonded to the first dielectric 110 by high-temperature heat fusion.

[0096] If the first ground 310 overlaps with the first cover 210 in the vertical direction, and the second ground 320 overlaps with the second cover 220 in the vertical direction, then there is a problem of the flexible circuit board becoming thicker.

[0097] To address this problem, a flexible circuit board with a bend that improves shielding, according to an embodiment of the present invention, such as... Figure 5 As shown, it includes the following structure.

[0098] The first ground 310 is formed with a width smaller than that of the second dielectric 120 so that it does not overlap with the first cover 210 in the vertical direction but is separated from the first cover 210 in the horizontal direction (refer to Y1).

[0099] The second ground 320 is formed with a width smaller than that of the third dielectric 130 so that it does not overlap with the second cover 220 in the vertical direction but is separated from the second cover 220 in the horizontal direction (refer to Y2).

[0100] Thus, the first ground 310 and the first cover 210 do not overlap in the vertical direction, and the second ground 320 and the second cover 220 do not overlap in the vertical direction, thereby preventing the thickness of the flexible circuit board from increasing.

[0101] The previous passage Figure 4 as well as Figure 5 This describes a flexible circuit board with two signal lines, through... Figure 9 The following describes an example with three signal lines.

[0102] like Figure 9As shown, the flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a third signal line 530, a fourth dielectric 140, a fifth cover 250, a third ground 330, and a sixth cover 260.

[0103] The third signal line 530 is separated from the second signal line 520 in the width direction and is located above or below the first dielectric 110.

[0104] The fourth dielectric 140 is separated from the third dielectric 130 by the other side in the width direction and is located above the first dielectric 110, and a third signal line 530 is provided below it.

[0105] The fifth cover 250 is located below the first dielectric 110 and extends from the upper region of the third dielectric 130 to the lower region of the fourth dielectric 140, thereby being configured to overlap at least a portion of the third dielectric 130 in the vertical direction.

[0106] The third ground 330 is located above the fourth dielectric 140.

[0107] The sixth cover 260 is located above the third ground 330.

[0108] The first cover 210 is formed in all or part of the area below the fourth dielectric 140 and is configured to overlap at least a portion of the fourth dielectric 140 in the vertical direction.

[0109] like Figure 9 As shown, the flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a third center ground 630 and a fourth center ground 640.

[0110] The third center ground 630 is located between the second signal line 520 and the third signal line 530, and is located on the first dielectric 110.

[0111] The fourth center ground 640 is located between the second signal line 520 and the third signal line 530, and is located below the first dielectric 110.

[0112] The fourth dielectric 140 is configured to overlap at least partially with the third center ground 630 in the vertical direction.

[0113] Thus, the following effects are achieved: the third center ground 630, together with the fourth dielectric 140 and the third ground 330, shields the third signal line 530 from noise interference; the fourth center ground 640, together with the third dielectric 130 and the second ground 320, shields the second signal line 520 from noise interference.

[0114] like Figure 9As shown, the flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a third welding piece 430.

[0115] The third welding piece 430 is located between the first dielectric 110 and the fourth dielectric 140, and covers the portion of the first cover 210 between the first dielectric 110 and the fourth dielectric 140.

[0116] A flexible circuit board with an improved shielding bending portion according to an embodiment of the present invention, such as... Figure 9 As shown, it includes the following structure.

[0117] The third ground 330 is formed with a width smaller than that of the fourth dielectric 140 so that it does not overlap with the first cover 210 in the vertical direction but is separated from the first cover 210 in the horizontal direction.

[0118] That is, the first cover 210 is not provided below one end of the third ground 330, and the first cover 210 is provided below the fourth dielectric 140 at the end where the first ground 310 is not provided.

[0119] Thus, the third ground 330 and the first cover 210 do not overlap in the vertical direction, thereby preventing the thickness of the flexible circuit board from increasing.

[0120] The previous passage Figure 9 This describes a flexible circuit board with three signal lines, but it is not limited to this. When there are four or more signal lines, the additional dielectric and the dielectric adjacent to it are set symmetrically with the first dielectric 110 as a reference point. The additional signal lines, grounding and center grounding can be set based on the previous description.

[0121] The previous passage Figures 4 to 9 This describes that the first cover 210 is configured to overlap at least a portion of the second dielectric 120 in the width direction, through... Figure 10 as well as Figure 11 As described below, the first cover 210 is configured to overlap at least a portion of the second dielectric 120 in the length direction.

[0122] like Figure 10 As shown, a flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a first dielectric 110, a first signal line 510, a second signal line 520, a first cover 210, a second cover 220, a second dielectric 120, a third dielectric 130, a first ground 310, a second ground 320, a third cover 230, and a fourth cover 240.

[0123] The first dielectric 110 is formed to include a width direction and a length direction.

[0124] The first signal line 510 is located on one side of the width direction above or below the first dielectric 110.

[0125] The first cover 210 is located above the first dielectric 110 and is formed such that its width is smaller than the width of the first dielectric 110.

[0126] The second cover 220 is located below the first dielectric 110 and overlaps at least part of the first cover 210 in the vertical direction, and is formed such that its width is smaller than that of the first dielectric 110.

[0127] Figure 11 In order to show Figure 10 The diagram shows the structure above the first cover 210 with dotted lines, given that the first cover 210 is shaped between the first dielectric 110 and the second dielectric 120.

[0128] pass Figure 11 The following describes the configuration of the first cover 210 between the first dielectric 110 and the second dielectric 120.

[0129] The second dielectric 120 is located on one side of the width direction above the first dielectric 110, and a first signal line 510 is provided below it.

[0130] At this time, at least a portion of one side of the first cover 210 in the length direction is between the first dielectric 110 and the second dielectric 120, and no portion between the first dielectric 110 and the second dielectric 120 is exposed.

[0131] The third dielectric 130 is separated from the second dielectric 120 by the other side in the width direction and is located below the first dielectric 110, and a second signal line 520 is provided above it.

[0132] At this time, at least a portion of one side of the second cover 220 in the length direction is between the first dielectric 110 and the third dielectric 130, and no portion between the first dielectric 110 and the third dielectric 130 is exposed.

[0133] At this time, not only at least a portion of one side of the first cover 210 in the length direction, but also at least a portion of one side of the first cover 210 in the width direction can be located between the first dielectric 110 and the second dielectric 120.

[0134] In addition, not only at least a portion of one side of the second cover 220 in the length direction, but also at least a portion of the other side of the second cover 220 in the width direction can be located between the first dielectric 110 and the third dielectric 130.

[0135] That is, at least a portion of one side of the second dielectric 120 and the first cover 210 along the length direction may be superimposed in the vertical direction, and additionally, at least a portion of one side of the second dielectric 120 and the first cover 210 along the width direction may be superimposed in the vertical direction.

[0136] At this time, when the flexible circuit board is bent, the portion of the first cover 210 and at least a portion of the second dielectric 120 that overlaps in the vertical direction allows the portion of the first dielectric 110 above which the second dielectric 120 is disposed and the portion of the first dielectric 110 above which the second dielectric 120 is not disposed to move together and bend, thereby preventing damage caused by bending at different angles to each other.

[0137] Alternatively, at least a portion of one side of the third dielectric 130 and the second cover 220 in the length direction may be superimposed in the vertical direction, and additionally, at least a portion of one side of the third dielectric 130 and the second cover 220 in the width direction may be superimposed in the vertical direction.

[0138] At this time, when the flexible circuit board is bent, the portion of the second cover 220 and at least a portion of the third dielectric 130 that overlaps in the vertical direction allows the portion of the first dielectric 110 below which the third dielectric 130 is disposed and the portion of the first dielectric 110 below which the third dielectric 130 is not disposed to move together and bend, thereby preventing damage caused by bending at different angles to each other.

[0139] The first ground 310 is located above the second dielectric 120.

[0140] The second ground 320 is located below the third dielectric 130.

[0141] The third cover 230 is located above the first grounding 310.

[0142] The fourth cover 240 is located below the second ground 320.

[0143] Thus, the following effects are achieved: the portion above the first dielectric 110 where the second dielectric 120 is disposed and the portion above the first dielectric 110 where the second dielectric 120 is not disposed are connected to each other; the portion below the first dielectric 110 where the third dielectric 130 is disposed and the portion below the first dielectric 110 where the third dielectric 130 is not disposed are connected to each other, thereby enabling bending and preventing damage caused by bending at different angles.

[0144] like Figures 12 to 14 As shown, one embodiment of the manufacturing method of a flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a first step, a second step, and a third step.

[0145] The first step is to attach the first cover 210 to the top of the first dielectric 110.

[0146] The second step is to combine a second dielectric 120 over the first dielectric 110 to cover the first cover 210.

[0147] The third step is to remove the second dielectric 120 located above the first cover 210 in such a way that at least a portion of the second dielectric 120 remains around the first cover 210.

[0148] At this point, removal can be achieved using lasers or blades.

[0149] like Figure 12 as well as Figure 14 As shown, another embodiment of the manufacturing method of a flexible circuit board with a bend having improved shielding according to an embodiment of the present invention includes a first step and a second step.

[0150] The first step is to attach the first cover 210 to the top of the first dielectric 110.

[0151] The second step is to combine the cut second dielectric 120 over the first dielectric 110 in such a way that it covers at least a portion of the area around the first cover 210.

[0152] [Explanation of reference numerals in the attached figures]

[0153] 110: First dielectric; 120: Second dielectric

[0154] 130: Third dielectric; 140: Fourth dielectric

[0155] 210: First cover 220: Second cover

[0156] 230: Third cover 240: Fourth cover

[0157] 250: Fifth cover 260: Sixth cover

[0158] 310: First grounding; 320: Second grounding

[0159] 330: Third grounding; 410: First welding piece

[0160] 420: Second weld piece; 430: Third weld piece

[0161] 510: First signal line; 520: Second signal line

[0162] 530: Third signal line; 610: First center ground.

[0163] 620: Second center grounding; 630: Third center grounding

[0164] 640: Fourth center grounding; 710: First side grounding

[0165] 720: Second side grounded; 730: Third side grounded.

[0166] 740: Fourth side grounding

Claims

1. A flexible circuit board with a bend portion that improves shielding, comprising: The first dielectric is formed to include a width direction and a length direction; The first signal line is located on one side in the width direction above or below the first dielectric. The second signal line is separated from the first signal line in the width direction and is located above or below the first dielectric. The second dielectric is located on one side in the width direction above the first dielectric, and the first signal line is disposed below the second dielectric; The third dielectric is located below the first dielectric, spaced apart from the second dielectric in the width direction, and the second signal line is disposed above the third dielectric. The first ground is positioned above the second dielectric and overlaps with the first signal line and the second dielectric. The second ground is disposed below the third dielectric and overlaps with the second signal line and the third dielectric. The first center ground is located between the first signal line and the second signal line, and is located on top of the first dielectric. as well as The second center ground is located between the first signal line and the second signal line, and is located below the first dielectric. The second dielectric is configured to overlap at least a portion of the first central ground in the vertical direction. The third dielectric is configured to overlap at least a portion of the second center ground in the vertical direction.

2. The flexible circuit board with an improved shielding bend as described in claim 1, wherein, The flexible circuit board with an enhanced shielding bend includes: A first cover, located above the first dielectric, and formed from all or part of the area below the second dielectric to the area above the third dielectric, is configured to overlap at least a portion of the second dielectric in the vertical direction; and The second cover is located below the first dielectric and extends from all or part of the area above the third dielectric to the area below the second dielectric, and is configured to overlap at least a portion of the third dielectric in the vertical direction.

3. The flexible circuit board with an improved shielding bend as described in claim 1, wherein, The flexible circuit board with an enhanced shielding bend includes: The third cover is located above the first grounding; and The fourth cover is located below the second grounding.

4. The flexible circuit board with an improved shielding bend as described in claim 1, wherein, The flexible circuit board with an enhanced shielding bend includes: The first side is grounded and is located on one side in the width direction above the first dielectric. The second side is grounded and is located on the other side in the width direction above the first dielectric. The third side is grounded and located on one side in the width direction below the first dielectric; and The fourth side is grounded and is located on the other side in the width direction below the first dielectric. A first center ground is provided between the first side ground and the second side ground. A second center ground is provided between the third side ground and the fourth side ground.

5. The flexible circuit board with an improved shielding bend as described in claim 2, wherein, The flexible circuit board with an enhanced shielding bend includes: A first welding tab is located between the first dielectric and the second dielectric, and covers the portion of the first cover body between the first dielectric and the second dielectric; and The second welding piece is located between the first dielectric and the third dielectric, and covers the portion of the second cover body between the first dielectric and the third dielectric.

6. The flexible circuit board with an improved shielding bend according to claim 2, wherein, The first grounding element is configured such that its width is smaller than that of the second dielectric material so that it does not overlap with the first cover in the vertical direction but is spaced apart from the first cover in the horizontal direction. The second grounding is formed with a width smaller than that of the third dielectric so that it does not overlap with the second cover in the vertical direction but is separated from the second cover in the horizontal direction.

7. The flexible circuit board with an improved shielding bend as claimed in claim 1, wherein, The flexible circuit board with an enhanced shielding bend includes: The third signal line is separated from the second signal line in the width direction and is located above or below the first dielectric. A fourth dielectric material is located above the first dielectric material, spaced apart from the third dielectric material in the width direction, and the third signal line is disposed below the fourth dielectric material. A fifth cover, located below the first dielectric, and formed from all or part of the area above the third dielectric to the area below the fourth dielectric, is configured to overlap at least a portion of the third dielectric in the vertical direction; and The third ground is located above the fourth dielectric.

8. The flexible circuit board with an improved shielding bend according to claim 7, wherein, The flexible circuit board with an enhanced shielding bend includes: A first cover is located above the first dielectric and extends from all or part of the area below the second dielectric to all or part of the area below the fourth dielectric, and is configured to overlap at least a portion of the second dielectric and the fourth dielectric in the vertical direction. The second cover is located below the first dielectric and is formed from all or part of the area above the third dielectric to the area below the second dielectric, and is configured to overlap at least a portion of the third dielectric in the vertical direction. The fifth cover is located below the first dielectric and extends from the upper region of the third dielectric to the lower region of the fourth dielectric, thereby being configured to overlap at least a portion of the third dielectric in the vertical direction.

9. The flexible circuit board with an improved shielding bend according to claim 7, wherein, The flexible circuit board with an enhanced shielding bend includes: The third cover is located above the first grounding point; The fourth cover is located below the second grounding; and The sixth cover is located above the third grounding.

10. The flexible circuit board with an improved shielding bend according to claim 7, wherein, The flexible circuit board with an enhanced shielding bend includes: The first center ground is located between the first signal line and the second signal line, and is located on top of the first dielectric. The second center ground is located between the first signal line and the second signal line, and is located below the first dielectric. A third center ground is located between the second signal line and the third signal line on top of the first dielectric; and The fourth center ground is located between the second signal line and the third signal line below the first dielectric. The second dielectric is configured to overlap at least a portion of the first central ground in the vertical direction. The third dielectric is configured to overlap at least a portion of the second center ground and the fourth center ground in the vertical direction. The fourth dielectric is configured to overlap at least partially with the third central ground in the vertical direction.

11. The flexible circuit board with an improved shielding bend according to claim 10, wherein, The flexible circuit board with an enhanced shielding bend includes: The first side is grounded and is located on one side in the width direction above the first dielectric. The second side is grounded and is located on the other side in the width direction above the first dielectric. The third side is grounded and located on one side in the width direction below the first dielectric; and The fourth side is grounded and is located on the other side in the width direction below the first dielectric. A first center ground and a third center ground are provided between the first side ground and the second side ground. A second center ground and a fourth center ground are provided between the third side ground and the fourth side ground.

12. The flexible circuit board with an improved shielding bend according to claim 8, wherein, The flexible circuit board with an enhanced shielding bend includes: The first welding piece is located between the first dielectric and the second dielectric, and covers the portion of the first cover body between the first dielectric and the second dielectric. A second welding piece is located between the first dielectric and the third dielectric, and covers the portion of the second cover body between the first dielectric and the third dielectric below; and The third welding piece is located between the first dielectric and the fourth dielectric, and covers the portion of the first cover body between the first dielectric and the fourth dielectric.

13. The flexible circuit board with an improved shielding bend according to claim 8, wherein, The first grounding element is configured such that its width is smaller than that of the second dielectric material so that it does not overlap with the first cover in the vertical direction but is spaced apart from the first cover in the horizontal direction. The second grounding element is configured such that its width is smaller than that of the third dielectric material so that it does not overlap with the second cover and the fifth cover in the vertical direction, but is spaced apart from the second cover and the fifth cover in the horizontal direction. The third grounding is formed with a width smaller than that of the fourth dielectric so that it does not overlap with the first cover in the vertical direction but is separated from the first cover in the horizontal direction.

14. A flexible circuit board with a bend portion that improves shielding, comprising: The first dielectric is formed to include a width direction and a length direction; The first signal line is located on one side in the width direction above or below the first dielectric. The second signal line is separated from the first signal line in the width direction and is located above or below the first dielectric. A first cover is located above the first dielectric and is formed such that its width is smaller than the width of the first dielectric. The second cover is located below the first dielectric and overlaps at least a portion of the first cover in the vertical direction, and is formed such that its width is smaller than the width of the first dielectric. The second dielectric is located on one side in the width direction above the first dielectric, and the first signal line is disposed below the second dielectric; The third dielectric is located below the first dielectric, spaced apart from the second dielectric in the width direction, and the second signal line is disposed above the third dielectric. The first ground is positioned above the second dielectric and overlaps with the first signal line and the second dielectric. The second ground is disposed below the third dielectric and overlaps with the second signal line and the third dielectric. The third cover is located above the first grounding point; The fourth cover is located below the second grounding point. The first center ground is located between the first signal line and the second signal line, and is located on top of the first dielectric. as well as The second center ground is located between the first signal line and the second signal line, and is located below the first dielectric. At least a portion of one side of the first cover in the longitudinal direction lies between the first dielectric and the second dielectric, and no portion between the first dielectric and the second dielectric is exposed. At least a portion of one side of the second cover in the longitudinal direction lies between the first dielectric and the third dielectric, and no portion between the first dielectric and the third dielectric is exposed. The second dielectric is configured to overlap at least a portion of the first central ground in the vertical direction. The third dielectric is configured to overlap at least a portion of the second center ground in the vertical direction.

15. The flexible circuit board with an improved shielding bend according to claim 14, wherein, At least a portion of one side of the first cover body in the width direction is located between the first dielectric and the second dielectric. At least a portion of the other side of the second cover in the width direction is located between the first dielectric and the third dielectric.

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