Substrate processing apparatus and substrate processing method

Abstract

The present application provides a substrate processing apparatus and a substrate processing method capable of adjusting the formation range of a fluororesin film in the plane of a substrate. The substrate processing apparatus includes a hydrophobization processing section configured to perform hydrophobization processing in which a hydrophobic film is formed on the surface of a substrate by evaporation of a hydrophobization gas for hydrophobization processing; an ultraviolet irradiation section configured to remove the hydrophobic film formed in a removal region in the back surface of the substrate by irradiating the removal region with ultraviolet light; and a resin film formation section configured to form a fluororesin film in the removal region after the hydrophobic film has been removed.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] Patent Document 1 discloses a substrate processing apparatus that includes a film forming section for forming a friction-reducing film on the back side of a substrate to reduce friction between the back side of the substrate and a holding surface that holds the back side of the substrate during exposure processing. A fluoropolymer film is a specific example of the friction-reducing film formed by the film forming section.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-121683 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] This disclosure provides a substrate processing apparatus and a substrate processing method capable of adjusting the formation range of a fluoropolymer film within a substrate surface.

[0008] Solution for solving the problem

[0009] One aspect of this disclosure relates to a substrate processing apparatus comprising: a hydrophobic treatment unit configured to perform a hydrophobic treatment in which a hydrophobic film is formed on the surface of a substrate by vapor deposition of a hydrophobic gas for hydrophobic treatment; an ultraviolet irradiation unit configured to remove the hydrophobic film formed in the removal area during the hydrophobic treatment by irradiating a removal area in the back side of the substrate with ultraviolet light; and a resin film forming unit configured to form a friction-reducing film in the removal area after the hydrophobic film has been removed, which reduces friction between the removal area and the holding portion of the substrate.

[0010] The effects of the invention

[0011] According to this disclosure, a substrate processing apparatus and a substrate processing method are provided that can adjust the formation range of a fluoropolymer film within a substrate surface. Attached Figure Description

[0012] Figure 1 This is a schematic perspective view illustrating an example of a substrate processing system.

[0013] Figure 2 This is a schematic diagram illustrating an example of a coating and developing apparatus.

[0014] Figure 3This is a schematic diagram illustrating an example of a membrane forming unit.

[0015] Figure 4 (a) is a schematic diagram showing an example of the back side of a workpiece.

[0016] Figure 4 (b) is a top view schematically showing an example of a retaining arm.

[0017] Figure 5 This is a block diagram illustrating an example of the hardware structure of a control device.

[0018] Figure 6 This is a flowchart illustrating an example of a coating and developing process.

[0019] Figure 7 This is a flowchart illustrating an example of a membrane formation process.

[0020] Figure 8 (a) is a schematic diagram illustrating the hydrophobic treatment.

[0021] Figure 8 (b) is a schematic diagram showing an example of the surface of a workpiece after the formation of a hydrophobic film.

[0022] Figure 8 (c) is a schematic diagram showing an example of the back side of a workpiece after the formation of a hydrophobic film.

[0023] Figure 9 (a) is a schematic diagram showing the situation of ultraviolet irradiation.

[0024] Figure 9 (b) is a schematic diagram showing an example of the back side of a workpiece after ultraviolet irradiation.

[0025] Figure 9 (c) is a side view schematically showing an example of a workpiece after ultraviolet irradiation.

[0026] Figure 10 (a) is a schematic diagram showing the formation of a fluoropolymer film.

[0027] Figure 10 (b) is a schematic diagram showing an example of the back side of a workpiece after the formation of a fluoropolymer film.

[0028] Figure 10 (c) is a side view schematically showing an example of a workpiece after the formation of a fluoropolymer film.

[0029] Figure 11 (a) is a side view schematically showing another example of an ultraviolet irradiation section.

[0030] Figure 11(b) is a top view schematically showing another example of a retaining arm.

[0031] Figure 12 (a) is a side view schematically showing another example of an ultraviolet irradiation section.

[0032] Figure 12 (b) is a top view schematically showing an example of a cover component.

[0033] Figure 12 (c) is a top view schematically showing another example of a cover member.

[0034] Explanation of reference numerals in the attached figures

[0035] 1: Substrate processing system; 2: Coating and developing apparatus; 40: Hydrophobic treatment section; 50: Fluoropolymer film forming section; 60: Ultraviolet irradiation section; 62, 62A: Holding arms; 66: Ultraviolet lamp; 82B, 82C: Cover members; 92B: Holding section; U1: Liquid treatment unit; U3: Film forming unit; V: Processing space; W: Workpiece; Wa: Surface; Wb: Back side; Sr: Removal area; Sn: Non-removal area; Fh: Hydrophobic film; Ff: Fluoropolymer film. Detailed Implementation

[0036] The following describes various exemplary implementation methods.

[0037] An exemplary embodiment of the substrate processing apparatus includes: a hydrophobic treatment unit configured to perform a hydrophobic treatment in which a hydrophobic film is formed on the surface of the substrate by vapor deposition of a hydrophobic gas for hydrophobic treatment; an ultraviolet irradiation unit configured to remove the hydrophobic film formed in the removal area during the hydrophobic treatment by irradiating a removal area in the back side of the substrate with ultraviolet light; and a resin film forming unit configured to form a fluoropolymer film in the removal area after the hydrophobic film has been removed.

[0038] In this substrate processing apparatus, a fluoropolymer film is formed in areas where a hydrophobic film is not formed and in areas where the hydrophobic film has been removed. Conversely, no fluoropolymer film is formed in areas where a hydrophobic film is formed. In other words, the area where the hydrophobic film is removed by ultraviolet light corresponds to the area where the fluoropolymer film is formed. Therefore, the area where the hydrophobic film is removed can be adjusted by ultraviolet light irradiation, thereby adjusting the area where the fluoropolymer film is formed on the substrate surface.

[0039] The substrate processing apparatus may also include a coating film forming unit configured to form a coating film on the surface of a substrate after a fluoropolymer film has been formed by supplying a processing liquid to the surface of the substrate. In this case, a coating film can be formed on the surface of the substrate while the fluoropolymer film formed on the back side is still in place.

[0040] The substrate processing apparatus may also include a developing unit configured to develop the substrate after the coated film has been exposed. The removal area may also be set to a region other than the periphery of the back surface. In this case, a fluoropolymer film is formed in the region other than the periphery of the back surface, thus reducing friction between the substrate holding portion and the back surface during the exposure process.

[0041] The ultraviolet irradiation unit may also include: an ultraviolet illumination unit capable of irradiating ultraviolet light onto an area including the removal area; and a light-shielding member disposed between the ultraviolet illumination unit and the back surface to block ultraviolet light from irradiating areas other than the removal area in the back surface. In this case, the removal area of ​​the hydrophobic film can be adjusted by the shape of the light-shielding member, thus making it easy to adjust the formation range of the fluoropolymer film.

[0042] The light-shielding member may also include a holding arm that holds the substrate in a state that covers the area outside the removal area on the back side. In this case, the substrate can be transported and ultraviolet light can be blocked by the holding arm, thus simplifying the device.

[0043] The light-shielding member may also include a cover member disposed between the holding portion of the substrate and the ultraviolet illumination portion. In this case, the forming range of the fluoropolymer film can be adjusted simply by changing the shape of the cover member, thus simplifying the holding portion.

[0044] The hydrophobication treatment unit can also be configured to perform hydrophobic gas vapor deposition on the surface by supplying a hydrophobic gas into the treatment space for hydrophobication treatment. The resin film forming unit can also be configured to perform treatment gas vapor deposition on the back side by supplying a treatment gas for forming a fluororesin film into the aforementioned treatment space. In this case, the unit forming the treatment space can be used for both hydrophobication treatment and fluororesin film formation, thus simplifying the apparatus.

[0045] An exemplary embodiment of the substrate processing method includes the following steps: performing a hydrophobication treatment, in which a hydrophobic film is formed on the surface of the substrate by vapor deposition of a hydrophobic gas for hydrophobication treatment; removing the hydrophobic film formed in the removal area during the hydrophobication treatment by irradiating a removal area in the back side of the substrate with ultraviolet light; and forming a fluoropolymer film in the removal area after the hydrophobic film has been removed. In this substrate processing method, similar to the substrate processing apparatus described above, the formation range of the fluoropolymer film can be adjusted.

[0046] Hereinafter, an embodiment will be described with reference to the accompanying drawings. In the description, the same reference numerals are used to label the same elements or elements having the same function to omit repeated descriptions.

[0047] [Substrate Processing System]

[0048] Figure 1 The substrate processing system 1 shown is a system for forming a photosensitive coating on a workpiece W, exposing the photosensitive coating, and developing the photosensitive coating. The workpiece W to be processed is, for example, a substrate, or a substrate that has formed a film or circuit through a prescribed process. As an example of a substrate included in the workpiece W, it is a silicon-containing wafer. The workpiece W (substrate) may also be formed in a circular shape.

[0049] The workpiece W to be processed can be a glass substrate, a mask substrate, an FPD (Flat Panel Display), or an intermediate obtained by performing a prescribed process on these substrates. Furthermore, if the workpiece W has a beveled edge (chamfer), the term "surface" of the workpiece W in this specification also includes the beveled portion when viewed from the surface side of the workpiece W. Similarly, the "back side" of the workpiece W also includes the beveled portion when viewed from the back side of the workpiece W, and the "end face" of the workpiece W also includes the beveled portion when viewed from the end face side of the workpiece W. A photosensitive coating, for example, is a resist film.

[0050] The substrate processing system 1 includes a coating and developing apparatus 2 and an exposure apparatus 3. The exposure apparatus 3 is used to expose a resist film (photosensitive coating) formed on a workpiece W (substrate). Specifically, the exposure apparatus 3 irradiates the exposed portion of the resist film with energy rays using methods such as immersion exposure. The coating and developing apparatus 2 coats a resist (solution) onto the surface of the workpiece W to form a resist film before the exposure process performed by the exposure apparatus 3, and performs a developing process on the resist film after the exposure process.

[0051] (Substrate processing apparatus)

[0052] The structure of the coating and developing apparatus 2 will now be described as an example of a substrate processing apparatus. Figure 1 and Figure 2 As shown, the coating and developing apparatus 2 includes a carrier block 4, a processing block 5, an interface block 6, and a control device 100.

[0053] The carrier block 4 introduces workpiece W into and removes workpiece W from the coating and developing apparatus 2. For example, the carrier block 4 can support multiple carriers C for workpiece W and includes a conveying device A1 with a transfer arm. The carriers C, for example, hold multiple circular workpieces W. The conveying device A1 removes workpiece W from the carriers C and transfers it to the processing block 5, which receives the workpiece W and returns it to the carriers C. The processing block 5 has processing modules 11, 12, 13, and 14.

[0054] Processing module 11 includes a liquid treatment unit U1, a heat treatment unit U2, and a conveying device A3 for conveying workpiece W to these units. Processing module 11 forms a lower film on the surface of workpiece W using the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 applies a treatment liquid for forming the lower film onto the workpiece W. The heat treatment unit U2 performs various heat treatments accompanying the formation of the lower film. Processing module 11 also includes a film forming unit U3. The film forming unit U3 performs a hydrophobic treatment on the surface of the workpiece W on which the lower film is formed, and forms a film containing fluororesin on the back side of the workpiece W. Details of the film forming unit U3 will be described later.

[0055] Processing module 12 includes a liquid treatment unit U1, a heat treatment unit U2, and a conveying device A3 for transporting workpiece W to these units. Processing module 12 forms a resist film on the lower layer film using the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 (coating film forming section) supplies a treatment liquid (resist) for forming the resist film to the surface of the workpiece W after hydrophobic treatment, thereby forming a resist film (coating film) on the surface of the workpiece W. The heat treatment unit U2 performs various heat treatments accompanying the formation of the resist film.

[0056] Processing module 13 includes a liquid treatment unit U1, a heat treatment unit U2, and a conveying device A3 for transporting workpiece W to these units. Processing module 13 forms an upper film on the resist film using the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 coats the resist film with a liquid for forming the upper film. The heat treatment unit U2 performs various heat treatments accompanying the formation of the upper film.

[0057] Processing module 14 includes a liquid treatment unit U1, a heat treatment unit U2, and a conveying device A3 for transporting workpiece W to these units. Processing module 14 performs development treatment of the exposed resist film and accompanying heat treatment via the liquid treatment unit U1 and the heat treatment unit U2. The liquid treatment unit U1 (development unit) applies a developer to the surface of the exposed workpiece W, and then rinses off the developer with a rinsing solution to develop the resist film. The heat treatment unit U2 performs various heat treatments accompanying the development process. Specific examples of heat treatment include pre-development heat treatment (PEB: Post Exposure Bake) and post-development heat treatment (PB: Post Bake).

[0058] A frame unit U10 is provided on the side of the support block 4 within the processing block 5. The frame unit U10 is divided into multiple layers arranged in the vertical direction. A conveying device A7, including a lifting arm, is provided near the frame unit U10. The conveying device A7 causes the workpiece W to move up and down between the layers of the frame unit U10.

[0059] A frame unit U11 is provided on the side of the interface block 6 within the processing block 5. The frame unit U11 is divided into multiple layers arranged in the vertical direction.

[0060] The workpiece W is transferred between the interface block 6 and the exposure device 3. For example, the interface block 6 has a built-in conveying device A8 including a transfer arm, and the interface block 6 is connected to the exposure device 3. The conveying device A8 transfers the workpiece W, which is arranged in the rack unit U11, to the exposure device 3. The conveying device A8 receives the workpiece W from the exposure device 3 and returns the workpiece W to the rack unit U11.

[0061] (membrane forming unit)

[0062] Next, refer to Figure 3 , Figure 4 (a) and Figure 4 (b) will be used to describe in detail an example of the film forming unit U3. The film forming unit U3 sequentially performs hydrophobication treatment on the surface Wa of the workpiece W, irradiation of the back surface Wb of the workpiece W with ultraviolet light, and formation of a fluoropolymer-containing film (hereinafter referred to as "fluoropolymer film Ff") on the back surface Wb of the workpiece W. Figure 3 As shown, the film forming unit U3 has a vapor deposition processing section 20 and an ultraviolet irradiation section 60. A portion of the vapor deposition processing section 20 and the ultraviolet irradiation section 60 may also be housed in a housing (not shown).

[0063] exist Figure 3 In the illustrated film forming unit U3, after the surface Wa of the workpiece W is hydrophobically treated in the vapor deposition treatment unit 20, the ultraviolet irradiation unit 60 irradiates the workpiece W with ultraviolet light. Then, the vapor deposition treatment unit 20 forms a fluoropolymer film Ff on the back surface Wb of the ultraviolet-irradiated workpiece W. By performing the hydrophobic treatment, a hydrophobic film (hereinafter referred to as "hydrophobic film Fh") is formed on the surface Wa of the workpiece W. Hereinafter, the hydrophobic film Fh and the fluoropolymer film Ff are collectively referred to as "processed film", and the process including the hydrophobic treatment and the formation process of the fluoropolymer film is referred to as "formation process of processed film". Hereinafter, the elements of the vapor deposition treatment unit 20 and the ultraviolet irradiation unit 60 will be described in the order of processing the workpiece W. The vapor deposition treatment unit 20 includes, for example, a hot plate 22, a chamber 24, a lifting unit 28, a hydrophobic treatment unit 40, and a fluoropolymer film forming unit 50.

[0064] The hot plate 22 is configured to heat the workpiece W. The hot plate 22 is, for example, formed in a generally circular plate shape and horizontally disposed on a support platform (not shown). The hot plate 22 has a mounting surface 22a. The workpiece W to be processed is placed on the mounting surface 22a, and the hot plate 22 supports the workpiece W. The hot plate 22 heats the workpiece W placed on the mounting surface 22a. The hot plate 22 may include a heater composed of a resistance heating element. The heater is, for example, disposed inside the hot plate 22 or on the lower surface opposite to the mounting surface 22a.

[0065] The chamber 24 is configured to surround the mounting surface 22a of the hot plate 22. The chamber 24 has, for example, a top plate 24a and side walls 24b. The top plate 24a is formed as a circular plate with a diameter equal to that of the hot plate 22. The top plate 24a is arranged to face the mounting surface 22a in the vertical direction. The side walls 24b are formed to extend downward from the outer edge of the top plate 24a.

[0066] The chamber 24 is configured to move vertically. For example, the chamber 24 moves between a lowered position in the space for forming the processed film (hereinafter referred to as "processing space V") and an raised position that opens the processing space V. Alternatively, when the chamber 24 is in the lowered position, the lower end of the sidewall 24b contacts the hot plate 22. The vapor deposition processing unit 20 also has a chamber drive unit 26 for raising and lowering the chamber 24. The chamber drive unit 26 is, for example, a lifting actuator that raises and lowers the chamber 24 using a power source such as a cylinder or an electric motor.

[0067] The lifting unit 28 is configured to lift the workpiece W above the hot plate 22. The lifting unit 28, for example, has multiple support pins 32 and a pin drive unit 34. The support pins 32 are pins that support the workpiece W from below. The multiple support pins 32 are formed to extend in the vertical direction and are arranged to pass through the hot plate 22 in the vertical direction. The multiple support pins 32 can be arranged at equal intervals in the circumferential direction.

[0068] Multiple support pins 32 are configured to move vertically. For example, the multiple support pins 32 move between a placement position where the workpiece W is placed on the placement surface 22a of the hot plate 22 and a separation position where the workpiece W is separated from the placement surface 22a by moving upwards from it. A pin drive unit 34 moves the workpiece W vertically by raising and lowering the multiple support pins 32. The pin drive unit 34 is, for example, a lifting actuator that raises and lowers the multiple support pins 32 using a power source such as a cylinder or an electric motor.

[0069] The hydrophobication treatment unit 40 is configured to perform hydrophobication treatment, in which a hydrophobic film is formed on the surface Wa of the workpiece W by vapor deposition of a hydrophobication treatment gas (hereinafter referred to as "hydrophobication gas"). By performing hydrophobication treatment on the surface Wa of the workpiece W (by forming a hydrophobic film Fh), the adhesion between the resist film formed on the surface Wa after the hydrophobication treatment and the surface Wa is ensured. The hydrophobic gas is not limited as long as it contains a compound that can hydrophobize the surface Wa, for example, it can be a gas containing HMDS (hexamethyldisilazane: (CH3)3SiNHSi(CH3)3). The hydrophobication treatment unit 40 supplies the hydrophobic gas to the processing space V when the chamber 24 is lowered to form the processing space V.

[0070] The hydrophobication treatment unit 40 includes, for example, a gas supply source 42, a gas supply path 44, and an on / off valve 46. The gas supply source 42 is a supply source for the hydrophobicating gas. The gas supply source 42 can be a supply source of gas containing HMDS (hereinafter referred to as "HMDS gas"). The gas supply source 42 can also vaporize a raw material liquid containing HMDS to generate HMDS gas, and then supply the HMDS gas to the processing space V via nitrogen. The gas supply path 44 connects the gas supply source 42 to the processing space V formed within the chamber 24. For example, the end of the gas supply path 44 on the processing space V side extends vertically through the top plate 24a of the chamber 24, and a supply port 44a formed at this end opens into the processing space V.

[0071] An on / off valve 46 is provided in the gas supply path 44 to open and close the flow path of the gas supply path 44. When the on / off valve 46 is in the open state, hydrophobic gas is supplied from the gas supply source 42 to the processing space V; when the on / off valve 46 is in the closed state, hydrophobic gas is not supplied from the gas supply source 42 to the processing space V. Furthermore, the vapor deposition processing unit 20 may also include an exhaust unit for discharging gases (e.g., hydrophobic gases) from the processing space V. As an example, in an atmosphere containing HMDS gas in the processing space V, the workpiece W is heated by the hot plate 22, thereby causing silyl groups to bond with the surface Wa. Thus, a hydrophobic film Fh (silyl grouping film) is formed on the surface Wa of the workpiece W.

[0072] During hydrophobication treatment using hydrophobic gases such as HMDS, the workpiece W is placed on the mounting surface 22a. However, a slight gap may occur between the back surface Wb of the workpiece W and the mounting surface 22a. Therefore, the hydrophobic gas flows around the back surface Wb, forming a hydrophobic film Fh at the periphery of the back surface Wb and in a region further inward than the periphery. The film forming unit U3 removes a portion of the hydrophobic film Fh formed on the back surface Wb by the ultraviolet irradiation unit 60.

[0073] The ultraviolet irradiation unit 60 is configured to remove the hydrophobic film Fh formed in the removal region Sr on the back surface Wb during the hydrophobication treatment by irradiating a predetermined area (hereinafter referred to as the "removal region Sr") in the back surface Wb of the workpiece W with ultraviolet light. The ultraviolet irradiation unit 60 is also configured not to remove the hydrophobic film Fh in areas other than the removal region Sr formed in the back surface Wb (hereinafter referred to as the "non-removal region Sn"). For example, the ultraviolet irradiation unit 60 is configured not to irradiate the non-removal region Sn with ultraviolet light. Figure 4 As shown in (a), the non-removable region Sn can be set around the entire periphery of the back surface Wb, and the removal region Sr can be set inside the non-removable region Sn. The non-removable region Sn can also be set to cover all the inclined portions of the back surface Wb. For example, the width of the non-removable region Sn in the radial direction can be larger than the width of the inclined portion around the entire periphery of the workpiece W.

[0074] like Figure 3 As shown, the ultraviolet irradiation unit 60 and the vapor deposition treatment unit 20 (hot plate 22 and chamber 24) are arranged side by side in the horizontal direction. The ultraviolet irradiation unit 60 includes, for example, a holding arm 62, an arm drive unit 64, and an ultraviolet lamp 66 (ultraviolet illumination unit). The holding arm 62 is configured to hold the workpiece W. The holding arm 62 holds, for example, the back surface Wb of the workpiece W. The holding arm 62 is configured to be movable within a housing that houses the ultraviolet irradiation unit 60, the hot plate 22, the chamber 24, and the lifting unit 28. For example, the holding arm 62 is configured to be movable along a guide rail (not shown) extending in the horizontal direction.

[0075] The holding arm 62 moves between a junction position overlapping with the hot plate 22 and a standby position horizontally away from that junction position. With the processing space V open as the chamber 24 moves away from the hot plate 22, the workpiece W is transferred between the holding arm 62 and the support pin 32 at the junction position. The arm drive unit 64 moves the workpiece W between the standby position and the junction position by moving the holding arm 62 horizontally. The arm drive unit 64 is, for example, a horizontal actuator that reciprocates the holding arm 62 horizontally using a power source such as an electric motor. Furthermore, in Figure 3 The example shows the state in which the arm 62 is in the standby position.

[0076] The retaining arm 62 can hold the periphery of the workpiece W. For example... Figure 4 As shown in (b), the retaining arm 62 can be formed into a ring shape when viewed from the top and bottom. Figure 4 The retaining arm 62 illustrated in (b) includes a support portion 72 extending horizontally and a limiting portion 74 extending upward (see also...). Figure 3The support portion 72 is formed in a circular shape and supports the entire circumference of the peripheral portion of the back surface Wb. The limiting portion 74 is provided, for example, on the entire circumference or a portion of the outer edge (side surface) of the circular support portion 72, and limits the horizontal movement of the workpiece W.

[0077] With the workpiece W held by the arm 62, the support portion 72 covers the periphery of the back surface Wb of the workpiece W. Specifically, viewed from the back surface Wb towards the surface Wa, the support portion 72 covers the non-removed region Sn of the back surface Wb. That is, the width (radial length) of the support portion 72 is approximately the same as the width (radial length of the workpiece W) of the non-removed region Sn. In other words, the shape of the support portion 72, viewed from its thickness direction, corresponds to the non-removed region Sn, and the shape (outline) of the opening formed in the center of the support portion 72 corresponds to the removed region Sr.

[0078] Ultraviolet lamp 66 is a light source capable of emitting ultraviolet light to remove the hydrophobic coating Fh. Ultraviolet lamp 66 only needs to remove the hydrophobic coating Fh and can emit ultraviolet light of any wavelength. Figure 3 As shown, the ultraviolet lamp 66 can be positioned between the standby position of the holding arm 62 and the vapor deposition treatment section 20 (the junction above the hot plate 22). For example, the ultraviolet lamp 66 is located below the moving path of the holding arm 62 in the horizontal direction, and emits ultraviolet light upwards.

[0079] The ultraviolet lamp 66 is configured to irradiate ultraviolet light onto at least the removal area Sr in the back surface Wb of the workpiece W. The ultraviolet lamp 66 can also irradiate ultraviolet light into a linear irradiation area extending along a horizontal line intersecting the movement path of the holding arm 62. The width (length of the major axis) of the ultraviolet irradiation range of the ultraviolet lamp 66 can be equal to or larger than the diameter of the workpiece W. During the movement of the workpiece W by the arm drive 64, the ultraviolet lamp 66 emits ultraviolet light towards the back surface Wb of the workpiece W above it. When the linear irradiation range is greater than or equal to the diameter of the workpiece W, the ultraviolet lamp 66 can irradiate ultraviolet light onto the entire area of ​​the back surface Wb of the workpiece W.

[0080] As described above, the holding arm 62 holds the workpiece W with its support 72 covering the non-removed area Sn in the back surface Wb. Therefore, a portion of the ultraviolet light emitted into the entire area of ​​the back surface Wb is blocked by the holding arm 62 and does not reach the non-removed area Sn. Furthermore, the lower surface of the holding arm 62 (support 72) can be formed of a material that reflects or absorbs ultraviolet light from the ultraviolet lamp 66. As described above, Figure 3 and Figure 4The retaining arm 62, illustrated in (b), is positioned between the ultraviolet lamp 66 and the back surface Wb, functioning as a light-shielding member to block ultraviolet rays irradiating the non-removal area Sn in the back surface Wb. Furthermore, the size of the non-removal area Sn (removal area Sr) in the back surface Wb is defined by the support portion 72 of the retaining arm 62. That is, for the area in the back surface Wb covered by the support portion 72, ultraviolet rays do not reach and the hydrophobic film Fh is not removed; therefore, this area is called the non-removal area Sn.

[0081] Returning to the description of the vapor deposition processing unit 20, the fluoropolymer film forming unit 50 is configured to form a fluoropolymer film Ff in the removal area Sr after the hydrophobic film Fh has been removed. The fluoropolymer film forming unit 50 can be configured to perform vapor deposition of the back surface Wb by supplying a gas (hereinafter referred to as "processing gas") for forming the fluoropolymer film to the processing space V. The processing gas is not limited as long as it can form the fluoropolymer film Ff; for example, it can be a gas containing PTFE (polytetrafluoroethylene) as a compound.

[0082] The fluoropolymer film forming section 50 includes, for example, a gas supply source 52, a gas supply path 54, and an on / off valve 56. The gas supply source 52 is a supply source of processing gas for forming the fluoropolymer film. The gas supply path 54 can be a supply source of gas containing PTFE (hereinafter referred to as "PTFE gas"). The gas supply path 54 can also vaporize a PTFE-containing raw material liquid to generate PTFE gas, and then deliver the PTFE gas to the processing space V via nitrogen. The gas supply path 54 connects the gas supply source 52 to the processing space V formed within the chamber 24. For example, the end of the gas supply path 54 on the processing space V side extends vertically through a hot plate 22, and a supply port 54a formed at this end opens into the processing space V.

[0083] An on / off valve 56 is provided in the gas supply path 54 to open and close the flow path of the gas supply path 54. When the on / off valve 56 is in the open state, processing gas is supplied from the gas supply source 52 to the processing space V; when the on / off valve 56 is in the closed state, processing gas is not supplied from the gas supply source 52 to the processing space V. As an example, with the workpiece W positioned in a separated position by multiple support pins 32, separating the back surface Wb from the hot plate 22, PTFE gas is supplied to the processing space V, thereby vapor-depositing the back surface Wb with the PTFE gas (forming a fluoropolymer film Ff). At this time, the PTFE gas vapor-deposits the areas of the back surface Wb where the hydrophobic film Fh has not formed (removal area Sr), while the PTFE gas is not vapor-deposited in the areas where the hydrophobic film Fh has formed (non-removal area Sn). As a result, no fluoropolymer film Ff is formed in the non-removal area Sn, and a fluoropolymer film Ff is formed in the removal area Sr.

[0084] The fluoropolymer film Ff formed on the back surface Wb (removal area Sr) has the function of reducing friction between the component holding the back surface Wb and the back surface Wb or protecting the back surface Wb in the process after the film forming unit U3. For example, in the exposure apparatus 3 where the resist film is formed in the coating and developing apparatus 2 and then exposed, the workpiece W is placed from the lifting pin supporting the center of the workpiece W onto the mounting stage for exposure treatment of the resist film. Moreover, the workpiece W is held in a state of being adsorbed on the mounting stage, and is irradiated (irradiated with energy rays) while the position of the workpiece W is fixed in the mounting stage.

[0085] However, due to its own weight, the workpiece W supported by the lifting pin bends downwards at its outer periphery compared to its center. Therefore, the workpiece W contacts the stage surface in sequence from its outer periphery to its center. As a result, the outer periphery of the workpiece W adheres to the stage first, and thus the center of the workpiece W is sometimes adhered to under pressure (stress). Furthermore, if the workpiece W transported to the exposure apparatus 3 is not flat and has deformed, the workpiece W may also be held in a state where it is adhered to the stage under pressure. When the workpiece W is adhered to the stage under pressure in this way, the workpiece W deforms and sometimes irradiates areas that are offset from the desired region.

[0086] In contrast, by forming a fluoropolymer film Ff on the back surface Wb of the workpiece W, the friction between the back surface Wb and the stage of the exposure apparatus 3 is reduced. As a result, when the workpiece W is placed on the stage of the exposure apparatus 3, due to the reduced friction, the workpiece W is placed on the stage in a sliding manner, reducing the aforementioned pressure. Consequently, the offset between the target position on the stage of the exposure apparatus 3 and the placement position of the workpiece W can be suppressed.

[0087] (Control device)

[0088] Next, refer to Figure 5 The control device 100 will now be described. The control device 100 controls various elements of the coating and developing apparatus 2. The control device 100 is configured to perform the following treatment via the hydrophobic treatment unit 40: a hydrophobic gas used for hydrophobic treatment is vapor-deposited onto the surface Wa to form a hydrophobic film Fh on the surface Wa of the workpiece W. Furthermore, the control device 100 is configured to perform the following treatment: ultraviolet light is irradiated onto the removal area Sr via the ultraviolet irradiation unit 60 to remove the hydrophobic film Fh formed in the removal area Sr during the hydrophobic treatment; and a fluoropolymer film Ff is formed in the removal area Sr after the removal of the hydrophobic film Fh via the fluoropolymer film forming unit 50.

[0089] The control device 100 comprises one or more control computers. For example, the control device 100 has... Figure 5 The circuit 110 shown has one or more processors 112, a memory 114, a storage device 116, an input / output port 118, and a timer 122. The storage device 116 has a computer-readable storage medium, such as a hard disk. The storage medium stores a program for causing the control device 100 to perform the substrate processing method described later. The storage medium can be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The memory 114 temporarily stores the program loaded from the storage medium of the storage device 116 and the calculation results obtained by the processor 112.

[0090] The processor 112 and memory 114 cooperate to execute the above program. The input / output port 118, according to instructions from the processor 112, inputs and outputs electrical signals to the hot plate 22 (heater), chamber drive unit 26, pin drive unit 34, on / off valves 46 and 56, arm drive unit 64, and ultraviolet lamp 66, etc. The timer 122 measures elapsed time, for example, by counting reference pulses of a fixed period. Furthermore, the hardware structure of the control device 100 can also be constructed from dedicated logic circuits or an ASIC (Application Specific Integrated Circuit) obtained by integrating such logic circuits.

[0091] [Coating and developing process]

[0092] Next, refer to Figure 6 As an example of a substrate processing method, the coating and developing process performed in the coating and developing apparatus 2 will be described. The control device 100 controls the coating and developing apparatus 2, for example, to perform the coating and developing process according to the following procedure. First, the control device 100 controls the conveying device A1 to convey the workpiece W in the carrier C to the rack unit U10, and the control device 100 controls the conveying device A7 to place the workpiece W in the layer for the processing module 11.

[0093] Next, the control device 100 controls the conveying device A3 to move the workpiece W in the rack unit U10 to the liquid treatment unit U1 and the heat treatment unit U2 in the processing module 11. Additionally, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to form a lower film on the surface Wa of the workpiece W (step S01). Afterward, the control device 100 controls the conveying device A3 to move the workpiece W, after the lower film has been formed, to the film forming unit U3.

[0094] Next, the control device 100 performs a processing film forming process (step S02) including applying a hydrophobic treatment to the surface Wa of the workpiece W and forming a fluoropolymer film on the back surface Wb of the workpiece W. Details of step S02 will be described later. Thereafter, the control device 100 controls the conveying device A3 to return the workpiece W after the processing film forming process to the rack unit U10, and the control device 100 controls the conveying device A7 to arrange the workpiece W in the compartment for the processing module 12.

[0095] Next, the control device 100 controls the conveying device A3 to move the workpiece W from the rack unit U10 to the liquid treatment unit U1 and the heat treatment unit U2 in the processing module 12. Additionally, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to form a resist film Wa on the surface of the workpiece W (step S03). Afterward, the control device 100 controls the conveying device A3 to return the workpiece W to the rack unit U10, and the control device 100 controls the conveying device A7 to position the workpiece W in the compartment of the processing module 13.

[0096] Next, the control device 100 controls the conveying device A3 to move the workpiece W from the rack unit U10 to the respective units within the processing module 13. Additionally, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to form an upper film on the resist film of the workpiece W (step S04). Afterward, the control device 100 controls the conveying device A3 to move the workpiece W to the rack unit U11.

[0097] Next, the control device 100 controls the conveying device A8 to send the workpiece W from the rack unit U11 to the exposure device 3. Thereafter, the control device 100 controls the conveying device A8 to receive the workpiece W after exposure treatment from the exposure device 3 and place the workpiece W in the layer used by the processing module 14 in the rack unit U11.

[0098] Next, the control device 100 controls the conveying device A3 to move the workpiece W from the rack unit U11 to the respective units within the processing module 14. The control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to perform a developing process on the resist film of the workpiece W (step S05). Afterward, the control device 100 controls the conveying device A3 to return the workpiece W to the rack unit U10, and the control device 100 controls the conveying devices A7 and A1 to return the workpiece W to the carrier C. Thus, the coating and developing process is completed.

[0099] (Formation process of the treatment membrane)

[0100] Next, refer to Figures 7-10 (c) will be used to explain the membrane formation process in step S02. Figure 7This is a flowchart illustrating an example of a film formation process. In the film formation process, the control device 100 can control the hot plate 22 to maintain the temperature of the hot plate 22 at a specified value.

[0101] The control device 100 first controls the film forming unit U3 to form a hydrophobic film Fh on the surface Wa of the workpiece W while the processing space V is formed by the chamber 24 and the workpiece W to be processed is placed on the hot plate 22 (step S11). In step S11, for example, as Figure 8 As shown in (a), the control device 100 supplies hydrophobic gas from the gas supply source 42 to the processing space V by switching the on / off valve 46 of the hydrophobic treatment unit 40 from the closed state to the open state. Then, the control device 100 stands by until a predetermined time has elapsed. After the predetermined time has elapsed, the control device 100 switches the on / off valve 46 from the open state to the closed state. As a result, in the processing space V, the surface Wa of the workpiece W is exposed to the hydrophobic gas, and the workpiece W is heated by the hot plate 22. As a result, the workpiece W to be processed undergoes a hydrophobic treatment in which a hydrophobic film Fh is formed on the surface Wa by vapor deposition.

[0102] like Figure 8 As shown in (b), by performing step S11, a hydrophobic film Fh is formed over the entire area of ​​the surface Wa of the workpiece W. Furthermore, during the hydrophobic treatment, the hydrophobic gas also flows around to the back surface Wb, thus... Figure 8 As shown in (c), a hydrophobic film Fh is also formed on the peripheral portion of the back surface Wb (more specifically, the entire area of ​​the non-removed region Sn and the peripheral portion of the removed region Sr). Furthermore, in Figure 8 In (c), the boundary between the non-removed region Sn and the removed region Sr is shown by the boundary line BL (dashed line). Figure 8 In (c), the width of the hydrophobic film Fh in the radial direction of the workpiece W is fixed, but the hydrophobic film Fh can be formed in a way that the width of the hydrophobic film Fh varies depending on the circumferential position of the workpiece W.

[0103] Next, the control device 100 controls various drive units to move the workpiece W from the processing space V to a standby position located outside the processing space V (step S12). For example, the control device 100 opens the processing space V by raising the chamber 24 via the chamber drive unit 26. Then, the control device 100 controls various drive units to move the holding arm 62 to a junction position above the hot plate 22 via the arm drive unit 64, thereby transferring the workpiece W from the multiple support pins 32 to the holding arm 62. Afterward, the control device 100 moves the holding arm 62 horizontally to a standby position separated from the hot plate 22 via the arm drive unit 64. Thus, the workpiece W is removed from the processing space V. Furthermore, the control device 100 can also perform a temperature conditioning process (cooling process) on the workpiece W by continuing to hold the workpiece W in the standby position with the holding arm 62. The control device 100 can also exhaust the hydrophobic gas in the processing space V via the exhaust unit before opening the processing space V.

[0104] Next, the control device 100 controls the film forming unit U3 to move the workpiece W from the standby position into the processing space V, and irradiate the back surface Wb with ultraviolet light (step S13). For example, as Figure 9 As shown in (a), the control device 100 starts the ultraviolet lamp 66 to emit ultraviolet light, and moves the holding arm 62 from the standby position to the junction position above the hot plate 22 via the arm drive unit 64. Then, after the holding arm 62 moves to the junction position (after the workpiece W has passed through the irradiation range of the ultraviolet light above the ultraviolet lamp 66), the control device 100 stops the ultraviolet lamp 66 from emitting ultraviolet light. As described above, the holding arm 62 holds the workpiece W in a state that covers the non-removed area Sn of the back surface Wb, therefore, as Figure 9 (b) and Figure 9 As shown in (c), ultraviolet light is irradiated onto the removal region Sr to remove the hydrophobic film Fh formed in the removal region Sr.

[0105] After the holding arm 62 moves to the handover position, the control device 100 controls various drive units to hand over the workpiece W from the holding arm 62 to the multiple support pins 32. Then, the control device 100 lowers the chamber 24 via the chamber drive unit 26. As a result, the workpiece W, which has been irradiated with ultraviolet light, is moved back into the processing space V.

[0106] Next, the control device 100 controls the film forming unit U3 to form a fluoropolymer film Ff on the back side Wb of the workpiece W (step S14). For example, as Figure 10As shown in (a), the control device 100 continues to support the workpiece W in a position separated from the hot plate 22 by the multiple support pins 32 via the pin drive unit 34. Then, the control device 100 supplies processing gas for forming the fluoropolymer film from the gas supply source 52 to the processing space V by switching the on / off valve 56 of the fluoropolymer film forming unit 50 from the closed state to the open state.

[0107] Subsequently, the control device 100 remains in standby mode until a pre-set time has elapsed. After the pre-set time, the control device 100 switches the on / off valve 56 from the open state to the closed state. As a result, the back surface Wb of the workpiece W in the processing space V is exposed to the processing gas. Figure 10 (b) and Figure 10 As shown in (c), the result is that a fluoropolymer film Ff is formed in the removal area Sr by vapor deposition. Furthermore, the film forming unit U3 (vapor deposition processing unit 20) may also have other support portions to form the fluoropolymer film Ff at the locations where the workpiece W is supported by multiple support pins 32. This concludes the film formation process.

[0108] [Effects of the Implementation Method]

[0109] The coating and developing apparatus 2 illustrated above includes: a hydrophobic treatment unit 40 configured to perform a hydrophobic treatment in which a hydrophobic film Fh is formed on the surface Wa of a workpiece W by vapor deposition of a hydrophobic gas for hydrophobic treatment; an ultraviolet irradiation unit 60 configured to remove the hydrophobic film Fh formed in the removal area Sr during the hydrophobic treatment by irradiating the removal area Sr in the back side Wb of the workpiece W with ultraviolet light; and a fluoropolymer film forming unit 50 configured to form a fluoropolymer film Ff in the removal area Sr after the hydrophobic film Fh has been removed.

[0110] The coating and developing process illustrated above includes the following steps: performing a hydrophobic treatment in which a hydrophobic film Fh is formed on the surface Wa of the workpiece W by vapor deposition of a hydrophobic gas for hydrophobic treatment; removing the hydrophobic film Fh formed in the removal area Sr during the hydrophobic treatment by irradiating the removal area Sr in the back side Wb of the workpiece W with ultraviolet light; and forming a fluoropolymer film Ff in the removal area Sr after the hydrophobic film Fh has been removed.

[0111] In the aforementioned coating and developing apparatus 2 and coating and developing process, a fluoropolymer film Ff is formed in areas where the hydrophobic film Fh has not formed and in areas where the hydrophobic film Fh has been removed. On the other hand, no fluoropolymer film Ff is formed in areas where the hydrophobic film Fh has formed (areas where the hydrophobic film Fh remains after being removed). In other words, the area where the hydrophobic film Fh has been removed by ultraviolet irradiation (the area where the hydrophobic film Fh has been removed) corresponds to the formation range of the fluoropolymer film Ff. Therefore, by adjusting the area Sr where the hydrophobic film Fh has been removed by ultraviolet irradiation, the formation range of the fluoropolymer film Ff on the back surface Wb can be adjusted.

[0112] The coating and developing apparatus 2 illustrated above also includes a liquid treatment unit U1, which is configured to form a resist film on the surface Wa of a workpiece W after a fluoropolymer film Ff has been formed, by supplying a treatment liquid to the surface Wa of the workpiece W. In this case, a resist film can be formed on the surface Wa of the workpiece W while maintaining the fluoropolymer film Ff formed on the back side Wb.

[0113] The coating and developing apparatus 2 illustrated above also includes a liquid treatment unit U1, which is configured to perform a developing process on the workpiece W after the resist film has been exposed. The removal area Sr can be set in a region other than the periphery of the back surface Wb. In this case, a fluoropolymer film Ff is formed in the region other than the periphery of the back surface Wb (removal area Sr), thus reducing friction between the holding portion (e.g., stage) of the workpiece W and the back surface Wb during exposure processing. This suppresses the shift of the exposure position relative to the target position during exposure processing.

[0114] As described above, friction can be reduced during exposure processing using a fluoropolymer film Ff. However, when a fluoropolymer film is formed on the beveled portion of the back surface Wb, it can sometimes adversely affect the results of the exposure processing. Therefore, conventionally, at least five steps are performed sequentially before forming the resist film. First, the surface Wa of the workpiece W after the lower film is formed is hydrophobically treated with HMDS gas or the like, and ultraviolet light is irradiated onto the entire area of ​​the back surface Wb to remove the hydrophobic film Fh formed on the back surface Wb during the hydrophobic treatment (removal treatment). Then, a masking treatment is performed on the beveled portion to prevent the formation of a fluoropolymer film such as PTFE on the beveled portion (protective film formation treatment), and a fluoropolymer film formation treatment is performed. After this, a treatment is performed to remove the protective film formed on the beveled portion using a diluent or the like.

[0115] In contrast, in the coating and developing apparatus 2 described above, before forming the resist film, a fluoropolymer film Ff can be formed on the back surface Wb in a manner that prevents the formation of a fluoropolymer film on the inclined surface by sequentially performing hydrophobic treatment, ultraviolet irradiation (removal treatment), and fluoropolymer film formation treatment. That is, compared with conventional processes, the number of processes can be shortened.

[0116] In the above example, the ultraviolet irradiation unit 60 includes: an ultraviolet lamp 66 capable of irradiating ultraviolet light onto a region including the removal region Sr (e.g., the entire area of ​​the back surface Wb); and a light-shielding member disposed between the ultraviolet lamp 66 and the back surface Wb to block ultraviolet light irradiation onto the non-removal region Sn in the back surface Wb, excluding the removal region Sr. In this case, the removal region Sr of the hydrophobic film Fh can be adjusted by the shape of the light-shielding member, thus easily adjusting the formation range of the fluoropolymer film Ff.

[0117] In the above example, the light-shielding member of the ultraviolet irradiation unit 60 includes a holding arm 62, which holds the workpiece W in a state that covers the non-removal area Sn other than the removal area Sr on the back surface Wb. In this case, the workpiece W can be transported and ultraviolet light can be shielded by the holding arm 62, thus simplifying the coating and developing apparatus 2 (film forming unit U3).

[0118] In the above example, the hydrophobic treatment unit 40 is configured to perform hydrophobic gas evaporation on the surface Wa by supplying a hydrophobic gas into the treatment space V for hydrophobic treatment. The fluoropolymer film forming unit 50 is configured to perform evaporation of the treatment gas for forming a fluoropolymer film onto the back surface Wb by supplying a treatment gas for forming a fluoropolymer film into the aforementioned treatment space V. In this case, the unit forming the treatment space V can be used for both hydrophobic treatment and fluoropolymer film formation, thus simplifying the coating and developing apparatus 2 (film forming unit U3). Furthermore, as... Figure 3 As illustrated, by irradiating ultraviolet light from below through the ultraviolet irradiation unit 60 and supplying processing gas from below the processing space V through the fluoropolymer film forming unit 50, the processing film can be formed without flipping the workpiece W. In other words, in Figure 3 The structure of the illustrated film forming unit U3 allows for a further reduction in the number of steps compared to conventional processes.

[0119] [Variation Example]

[0120] The embodiments described above have been detailed, but various modifications can be made to the above embodiments within the scope of the spirit of this invention. For example... Figure 11As shown in (a), the film forming unit U3 may also have an ultraviolet irradiation section 60A instead of the ultraviolet irradiation section 60. The ultraviolet irradiation section 60A differs from the ultraviolet irradiation section 60 in that it has a holding arm 62A instead of the holding arm 62, an ultraviolet lamp 66A instead of the ultraviolet lamp 66, and a cover member 82A. The holding arm 62A differs from the holding arm 62 in that it holds the workpiece W by clamping the peripheral portion (e.g., the inclined portion). In the holding arm 62A, when the peripheral portion of the workpiece W is clamped, the portion located below the back surface Wb covers the non-removed area Sn. Furthermore, as... Figure 11 As shown in (b), the retaining arm 62A is not a full circumference corresponding to the periphery of the workpiece W, but is formed as a ring with a portion of the full circumference removed (e.g., 1 / 4 to 1 / 6).

[0121] The cover member 82A is formed to cover the portion of the entire circumference where the retaining arm 62A is not provided. The cover member 82A may be a plate member formed in a shape (arc-shaped) along a portion of the periphery of the workpiece W. The cover member 82A may be fixed in a predetermined position. In the ultraviolet irradiation unit 60A, when the retaining arm 62A is in the standby position, the non-removal area Sn is covered by the retaining arm 62A and the cover member 82A. That is, the retaining arm 62A and the cover member 82A constitute a light-shielding member that blocks ultraviolet rays toward the non-removal area Sn. The ultraviolet lamp 66A may be configured to irradiate ultraviolet rays onto the entire area of ​​the back surface Wb when the workpiece W is in the standby position. In this case, the control device 100 controls the film forming unit U3 to separately perform ultraviolet irradiation and the loading of the workpiece W into the processing space V.

[0122] like Figure 12 As shown in (a), the film forming unit U3 may also have an ultraviolet irradiation section 60B instead of the ultraviolet irradiation section 60. The ultraviolet irradiation section 60B differs from the ultraviolet irradiation section 60 in that it also has a holding section 92B (different from the holding arm 62) for supporting the workpiece W, a cover member 82B, and a lamp driving section 94B. The holding section 92B can be configured to be fixed in a predetermined position, where the workpiece W is supported. The cover member 82B can be disposed between the ultraviolet lamp 66 and the holding section 92B (the workpiece W supported by the holding section 92B). Figure 12 As shown in (b), the cover member 82B can also be formed as an annular plate member in a manner that covers the periphery of the workpiece W. That is, the shape of the cover member 82B as seen from the thickness direction can correspond to the non-removed region Sn. The cover member 82B constitutes a light-shielding member that blocks ultraviolet rays toward the non-removed region Sn.

[0123] The ultraviolet lamp 66 can be configured to move horizontally. The lamp drive unit 94B is, for example, a horizontal actuator that moves the ultraviolet lamp 66 horizontally via a power source such as an electric motor. In this case, the control device 100 can move the ultraviolet lamp 66 relative to the workpiece W via the lamp drive unit 94B, thereby irradiating the back surface Wb (removal area Sr) with ultraviolet light by the ultraviolet lamp 66. Alternatively, instead of the holding unit 92B, the ultraviolet lamp 66 can be moved and irradiated with ultraviolet light onto the back surface Wb while the holding arm 62 supports the workpiece W in the standby position. Alternatively, the ultraviolet lamp 66A can irradiate the entire area of ​​the back surface Wb with ultraviolet light. A cover member 82B can also be disposed between the holding arm (holding part) that holds the workpiece W in a state that does not cover at least a portion of the non-removal area Sn and the ultraviolet lamp 66. In the ultraviolet irradiation unit 60A, instead of the ultraviolet lamp 66A, the entire area of ​​the back surface Wb can be irradiated with ultraviolet light by moving the ultraviolet lamp 66.

[0124] exist Figure 12 In the coating and developing apparatus 2 shown in variation (a), the light-shielding member is composed of two different components: a holding portion 92B that holds the workpiece W and a cover member 82B disposed between the holding portion 92B and the ultraviolet lamp 66. In this case, the forming range of the fluoropolymer film Ff can be adjusted simply by changing the shape of the cover member 82B, thus simplifying the component holding the workpiece W (e.g., the holding portion 92B or the holding arm 62).

[0125] Alternatively, the non-removal area Sn, where no fluoropolymer film Ff is formed, can also be located outside the periphery of the back surface Wb of the workpiece W. For example, the cover member 82B can also be used instead. Figure 12 The cover member 82C shown in (c) is disposed between the workpiece W and the ultraviolet lamp 66. The cover member 82C is formed in an annular shape. The cover member 82C has a width of about 1 / 4 to 2 / 3 of the radius of the workpiece W from its outer edge in a direction corresponding to the radius of the workpiece W. The cover member 82C covers the outer periphery of the back surface Wb of the workpiece W (except for the central part), but does not cover the back surface Wb in a part of the outer periphery.

[0126] In addition to the central hole 96a formed in a circular shape, the cover member 82C also has a plurality of holes 96b extending through its outer periphery in the thickness direction. For example... Figure 12As shown in (c), the plurality of holes 96b can be formed in a linear shape along the circumferential direction. Alternatively, the plurality of holes 96b can also be formed in a linear shape along the radial direction, or they can be formed in a dotted shape on the outer periphery. In this case, a fluoropolymer film Ff is formed in the area corresponding to the holes 96a and the plurality of holes 96b on the back surface Wb of the workpiece W, and a hydrophobic film Fh remains in the area corresponding to the portion other than the plurality of holes 96b on the outer periphery of the cover member 82C. As a result, the friction between the workpiece W and other components can be reduced by the fluoropolymer film Ff in the central part of the back surface Wb and the fluoropolymer film Ff distributed on the outer periphery of the workpiece W. In addition, since a portion of the hydrophobic film Fh remains on the outer periphery of the workpiece W, slippage of the workpiece W during transport can be suppressed.

[0127] In the coating and developing apparatus 2 illustrated above, both the hydrophobication treatment and the formation of the fluoropolymer film Ff are performed within a single unit. Therefore, these processes can be performed continuously and efficiently. However, the coating and developing apparatus 2 may also have separate hydrophobication units (hydrophobication treatment sections) for hydrophobication treatment and resin film forming units (resin film forming sections) for the formation of the fluoropolymer film Ff. That is, the hydrophobication treatment and the formation of the fluoropolymer film Ff can be performed in different processing spaces. In this case, the ultraviolet irradiation unit 60 can be provided in either the hydrophobication unit or the resin film forming unit, and the coating and developing apparatus 2 may also include an ultraviolet irradiation unit having the ultraviolet irradiation unit 60.

[0128] In the coating and developing apparatus 2 illustrated above, a fluoropolymer film Ff is formed on the back side Wb of the workpiece W by vapor deposition of a processing gas for forming a fluoropolymer film. However, the coating and developing apparatus 2 can also form a fluoropolymer film Ff by supplying a processing liquid for forming a fluoropolymer film to the back side Wb.

[0129] The ultraviolet irradiation unit 60 of the coating and developing apparatus 2 illustrated above is configured to shield ultraviolet light from the ultraviolet lamp 66, preventing ultraviolet light from irradiating the non-removal area Sn. However, the ultraviolet irradiation unit 60 may also have an ultraviolet lamp with a reduced irradiation area. The ultraviolet irradiation unit 60 may also remove the hydrophobic film Fh of the removal area Sr by moving the ultraviolet lamp so that ultraviolet light irradiates only the removal area Sr.

Claims

1. A substrate processing apparatus comprising: The hydrophobication treatment unit is configured to perform hydrophobication treatment in which a hydrophobic film is formed on the surface of a substrate by vapor deposition of a hydrophobic gas used for hydrophobication treatment. The back side of the substrate includes a non-removable region and a removal region located inside the non-removable region, and a hydrophobic film is also formed in the entire area of ​​the non-removable region and the periphery of the removal region. The ultraviolet irradiation unit is configured to remove the hydrophobic film formed in the removal area during the hydrophobication treatment by irradiating the removal area with ultraviolet light. as well as The friction-reducing film forming section is configured to form a friction-reducing film that reduces friction with the holding section of the substrate in the removal area after the hydrophobic film has been removed. The friction-reducing film forming section does not form the friction-reducing film in the non-removal area. The ultraviolet irradiation unit does not irradiate the non-removal area with ultraviolet light, thereby not removing the hydrophobic film formed in the non-removal area. The ultraviolet irradiation unit has: An ultraviolet light irradiation unit that is capable of irradiating the area including the removal area with ultraviolet light; as well as A light-shielding member is disposed between the ultraviolet illuminator and the back surface to block the ultraviolet light from irradiating areas of the back surface other than the removal area.

2. The substrate processing apparatus according to claim 1, characterized in that, It also includes a coating film forming section, which is configured to form a coating film on the surface of the substrate after the friction reduction film has been formed by supplying a processing liquid to the surface of the substrate.

3. The substrate processing apparatus according to claim 2, characterized in that, It also includes a developing unit configured to develop the substrate after the coated film has been exposed. The removal area is defined as the area outside the periphery of the back side.

4. The substrate processing apparatus according to claim 1, characterized in that, The light-shielding member includes a retaining arm that holds the substrate in a state that covers the area on the back side other than the removal area.

5. The substrate processing apparatus according to claim 1, characterized in that, The light-shielding member includes a cover member disposed between the holding portion that holds the substrate and the ultraviolet illuminating portion.

6. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that, The hydrophobication treatment unit is configured to perform hydrophobication gas vapor deposition on the surface by supplying the hydrophobic gas into a processing space for performing the hydrophobication treatment. The friction-reducing film forming section is configured to perform vapor deposition of the processing gas on the back side by supplying the processing space with the processing gas for forming the friction-reducing film.

7. The substrate processing apparatus according to any one of claims 1 to 3, characterized in that, The friction-reducing film is a fluoropolymer film.

8. A substrate processing method comprising forming a friction-reducing film on the back side of a substrate to reduce friction between the film and a holding portion thereon, the substrate processing method comprising the following steps: The surface of the substrate is subjected to a hydrophobic treatment, in which a hydrophobic film is formed on the surface of the substrate by vapor deposition of a hydrophobic gas for hydrophobic treatment. The back side of the substrate includes a non-removal area and a removal area located inside the non-removal area. A hydrophobic film is also formed in the entire area of ​​the non-removal area and the periphery of the removal area. Remove the hydrophobic film formed in the removal region but do not remove the hydrophobic film formed in the non-removal region; and The friction-reducing film is formed in the removal region of the substrate where the hydrophobic film has been removed, and not in the non-removal region. The ultraviolet light is irradiated onto the area including the removal area by an ultraviolet light irradiation unit, and the ultraviolet light is blocked from irradiating the non-removed area by a light-shielding member disposed between the ultraviolet light irradiation unit and the back surface.

9. The substrate processing method according to claim 8, characterized in that, The friction-reducing film is a fluoropolymer film.

Images