Wafer film attaching device and film attaching method

Abstract

A wafer film bonding device includes: a placement table for placing a wafer, the wafer having an axis; a conveying unit for conveying a bonding film to the top of the wafer; and a film bonding unit, including a lifting mechanism and a spray valve arranged on the lifting mechanism, the spray valve is located above the bonding film, and the lifting mechanism can drive the spray valve to approach and move away from the wafer; the spray valve includes a first air outlet and a second air outlet, the air outlet direction of the first air outlet coincides with the axis, the second air outlet is arranged around the periphery of the first air outlet, and its air outlet direction has an angle α with the axis, and the angle α is an acute angle. In the present invention, the first air outlet can spray a linear airflow toward the center of the wafer, and the second air outlet can spray an annular airflow surrounding the center of the wafer. When the lifting mechanism gradually rises, the radius of the annular airflow gradually expands, so that the bonding film is bonded to the wafer in a way that it gradually diffuses from the center of the wafer to the circumference in a circular direction, so as to meet the requirements of film bonding of wafers with complex structures, and the tension is uniform after film bonding, which is beneficial to subsequent process steps.

Description

[Technical field]

[0001] The present invention relates to the technical field of wafer film pasting, and in particular to a wafer film pasting device and a film pasting method. [Background technology]

[0002] During the processing of the wafer, a film needs to be applied to the side of the wafer with the circuit structure to protect the circuit structure. In the prior art, a film laminating machine is usually used to laminat the wafer, which mainly uses roller pressure or spray valve pressure to achieve lamination between the laminating film and the wafer.

[0003] When the roller is used as a carrier for the film lamination operation, if there is a specific pattern or a multi-layer structure on the surface of the wafer to be laminarized, it is difficult for the roller to completely cover the concave surface due to the presence of a concave surface, which makes it easy for bubbles to form between the laminating film and the wafer, resulting in poor lamination tightness; and for the above-mentioned wafers, the pressure of the roller will also generate some stress, resulting in damage to the wafer. In addition, during the film lamination process, there are normal stress and tangential stress along the direction of the roller's movement. Uneven stress will cause the warpage of the wafer to increase, especially for thinned wafers, which will cause the wafer to break or break during subsequent lamination.

[0004] When the spray valve is used as the carrier of the film laminating action, the spray valve can blow out an airflow perpendicular to the surface of the film to fit the film to the wafer. Although the airflow pressure method can fit the concave surface of the wafer, in the actual working process, since the spray valve moves from one side of the wafer to the other side in a translational manner, the tension is uneven during the film laminating process, and there is still a high probability of bubbles.

[0005] Therefore, it is necessary to improve the prior art to overcome the above defects in the prior art. [Summary of the invention]

[0006] The object of the present invention is to provide a wafer laminating device, which uses air flow pressure to laminarize wafers, and during the laminating process, the tension is uniform.

[0007] The objective of the present invention is achieved through the following technical solutions: a wafer film bonding device, comprising: a placing table for placing a wafer, the wafer having an axis; a conveying unit for conveying a bonding film to above the wafer; and a film bonding unit, comprising a lifting mechanism and a spray valve arranged on the lifting mechanism, the spray valve is located above the bonding film, and the lifting mechanism can drive the spray valve to approach and move away from the wafer; wherein the spray valve comprises a first air outlet and a second air outlet for supplying air to spray toward the wafer, the air outlet direction of the first air outlet coincides with the axis, the second air outlet is arranged around the periphery of the first air outlet, the air outlet direction of the second air outlet has an angle α with the axis, and the angle α is an acute angle.

[0008] Furthermore, the spray valve includes a valve body and a piston cylinder arranged in the valve body, a first air channel is formed in the piston cylinder, a second air channel is formed between the valve body and the piston cylinder, the first air channel has the first air outlet, and the second air channel has the second air outlet.

[0009] Furthermore, the valve body is provided with a first air inlet connected to the first air channel and a second air inlet connected to the second air channel.

[0010] Furthermore, the piston cylinder can be extended and retracted relative to the valve body along the axis to adjust the opening size of the second air outlet.

[0011] Furthermore, a closed regulating chamber is formed between the valve body and the piston cylinder, and the piston cylinder can move along the axial direction to expand and shrink the regulating chamber. A third air inlet is opened on the valve body, which is respectively connected to the regulating chamber and the external air path. The air flow can enter and exit the regulating chamber from the third air inlet to control the expansion or contraction of the regulating chamber.

[0012] Furthermore, an elastic member is provided between the piston cylinder and the valve body to limit the movement of the piston cylinder in the axial direction.

[0013] Furthermore, the spray valve also includes: a first nozzle cap, which is detachably connected to the end of the piston cylinder, and the first air outlet is formed on the first nozzle cap; and a second nozzle cap, which is detachably connected to the end of the valve body and corresponds to the first nozzle cap, and the second air outlet is formed between the second nozzle cap and the first nozzle cap.

[0014] Furthermore, the conveying unit comprises a feeding reel and a receiving reel for conveying the bonding film, and the feeding reel and the receiving reel cooperate to tension the bonding film and make the bonding film parallel to the wafer.

[0015] In addition, the present invention also provides a film pasting method, comprising the following steps:

[0016] S1, transporting the wafer to a placement table, where the placement table fixes the wafer;

[0017] S2, the bonding film is transported by a transport unit to a parallel position above the wafer;

[0018] S3, the lifting mechanism drives the spray valve to descend to a position close to the top of the wafer, and the first gas outlet and the second gas outlet are respectively supplied with gas through the first gas path and the second gas path;

[0019] S4, opening the first air path, and blowing out a linear airflow perpendicular to the wafer from the first air outlet, so that the laminating film is aligned with the center of the wafer;

[0020] S5. Open the second air path, and the second air outlet blows out an annular airflow inclined toward the circumference of the wafer. The lifting mechanism drives the spray valve to gradually rise, and closes the first air path. The bonding surface of the bonding film and the wafer diffuses from the center of the circle in a circular shape toward the circumference of the wafer until the bonding film is bonded to the entire surface of the wafer to complete the film bonding.

[0021] Furthermore, the following steps are included: before film pasting, air is supplied to the third air inlet to adjust the relative position between the piston cylinder and the valve body, and then the opening size of the second air outlet is adjusted to adjust the pressure applied to the wafer to adapt to different types of wafers.

[0022] Compared with the prior art, the present invention has the following beneficial effects: the spray valve in the present invention comprises a first air outlet and a second air outlet arranged in a ring around the first air outlet, wherein the first air outlet can spray a linear airflow toward the center of the wafer, and the second air outlet can spray annular airflow surrounding the center of the wafer. When the lifting mechanism gradually rises, the radius of the annular airflow acting on the wafer gradually expands, thereby achieving the bonding of the bonding film to the wafer in a manner that the bonding film gradually diffuses from the center of the wafer to the circumferential direction in a circular manner. It can meet the needs of bonding wafers with complex structures without damaging the surface of the wafer. At the same time, the tension after bonding is uniform, which is beneficial to subsequent process steps.

Brief Description of the Drawings

[0023] Figure 1 It is a structural schematic diagram of the wafer film mounting equipment of the present invention.

[0024] Figure 2 It is a structural schematic diagram of the spray valve in the present invention.

[0025] Figure 3 It is a schematic diagram of the wafer bonding direction in the present invention. [Specific implementation method]

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] The terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0028] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0029] See also Figures 1 to 3 As shown, a wafer laminating device corresponding to a preferred embodiment of the present invention includes: a placing table 100, used for placing a wafer 1, and the wafer 1 has an axis 1a; a conveying unit 200, used for conveying a laminating film 2 to above the wafer 1; and a laminating unit 300, including a lifting mechanism 3 and a spray valve 4 arranged on the lifting mechanism 3, the spray valve 4 is located above the wafer 1, and blows the laminating film 2 to be laminated on the wafer 1, and the lifting mechanism 3 can drive the spray valve 4 to approach and move away from the wafer 1; wherein the spray valve 4 includes a first air outlet 451 and a second air outlet 461 for supplying air to spray toward the wafer 1, the air outlet direction of the first air outlet 451 coincides with the axis 1a, the second air outlet 461 is arranged around the periphery of the first air outlet 451, and the air outlet direction of the second air outlet 461 has an angle α with the axis 1a, and the angle α is an acute angle.

[0030] In the present invention, the spray valve 4 includes a first air outlet 451 and a second air outlet 461 arranged in a ring around the first air outlet 451, wherein the first air outlet 451 can spray a linear airflow toward the center of the wafer 1, and the second air outlet 461 can spray an annular airflow surrounding the center of the wafer 1. When the lifting mechanism 3 gradually rises, the radius of the annular airflow acting on the wafer 1 gradually expands, thereby realizing the bonding of the bonding film 2 with the wafer 1 in a manner of gradually diffusing from the center of the wafer 1 in a circular direction to the circumferential direction. It can meet the needs of bonding a wafer 1 with a complex structure without damaging the surface of the wafer 1. At the same time, the tension after bonding is uniform, which is beneficial to subsequent process steps.

[0031] Furthermore, the spray valve 4 includes a valve body 41 and a piston cylinder 42 disposed in the valve body 41. In this embodiment, the valve body 41 and the piston cylinder 42 are both cylindrical structures so that they can be matched with each other. A first air channel 43 is formed in the piston cylinder 42, and a second air channel 44 is formed between the valve body 41 and the piston cylinder 42; wherein the first air outlet 451 is located on the first air channel 43, and the second air outlet 461 is located on the second air channel 44, and the first air outlet 451 and the second air outlet 461 are concentrically arranged.

[0032] The valve body 41 is provided with a first air inlet 411 and a second air inlet 412. The first air inlet 411 is connected to the first air duct 43, and the second air inlet 412 is connected to the second air duct 44. The first air inlet 411 is used to connect to an external first air circuit (not shown), and the second air inlet 412 is used to connect to an external second air circuit (not shown) to supply air to the first air duct 43 and the second air duct 44 respectively.

[0033] The piston cylinder 42 includes a cylinder body 421 and a boss 422 connected to the end of the cylinder body 421 and protruding relative to the outer edge of the cylinder body 421. The outer edge of the boss 422 contacts the inner wall of the valve body 41 to support one end of the cylinder body 421. The first air channel 43 extends from one end to the other end along the axial direction of the cylinder body 421. The boss 422 and the cylinder body 421 can be integrally formed or detachably connected. Preferably, the inner wall of the valve body 41 is convexly provided with a support portion 413, the support portion 413 is located at a position away from the boss 422, and the support portion 413 contacts the outer edge of the cylinder body 421 to improve the support reliability of the piston cylinder 42 in the valve body 41. In this embodiment, a plurality of support portions 413 can be provided, and they are distributed at intervals along the circumference of the valve body 41 to limit the radial direction of the cylinder body 421; or a single annular support portion formed around the circumference of the valve body 41 can be provided.

[0034] Furthermore, the end of the piston cylinder 42 away from the boss 422 is detachably connected to a first nozzle cap 45 connected to the first air channel 43, and the first air outlet 451 is formed on the first nozzle cap 45. The first nozzle cap 45 has an outer wall inclined to the axis 1a. The end of the valve body 41 is detachably connected to a second nozzle cap 46, the second nozzle cap 46 has an inner wall corresponding to the outer wall of the first nozzle cap 45, the inner wall of the second nozzle cap 46 is parallel to the outer wall of the first nozzle cap 45, and the second air outlet 461 is formed between the second nozzle cap 46 and the first nozzle cap 45. By adopting the detachable first nozzle cap 45 and the second nozzle cap 46, different first nozzle caps 45 and the second nozzle caps 46 can be customized according to actual needs, so as to adjust the direction and size of the first air outlet 451 and the second air outlet 461 of the spray valve 4, which greatly improves the versatility of the spray valve 4. The first nozzle cap 45 and the second nozzle cap 46 can be detachable by means of snap connection, screw connection or direct sleeve connection. In this embodiment, the nozzle cap is fixed to the valve body 41 and the piston cylinder 42 by means of a sleeve ring 47. Of course, in other embodiments, the first air outlet 451 and the second air outlet 461 can also be formed by directly opening the inner wall of the piston cylinder 42 and the valve body 41.

[0035] Furthermore, the piston cylinder 42 can be fixedly coupled or slidably coupled to the valve body 41. In this embodiment, since the surface of the wafer 1 and the materials of the laminating film 2 are different, in order to achieve the best laminating effect, the pressure required for laminating also needs to be adaptively adjusted. Preferably, in this embodiment, the piston cylinder 42 can be extended and retracted relative to the valve body 41 along the axis 1a to adjust the opening size of the second air outlet 461, thereby adjusting the pressure applied to the wafer 1.

[0036] Specifically, the boss 422 of the piston cylinder 42 is slidably matched with the valve body 41, and the cylinder body 421 of the piston cylinder 42 is slidably matched with the abutment 413, and the abutment 413 divides the inside of the valve body 41 into a first chamber and a second chamber. Among them, the second air channel 44 is formed by the inner wall of the first chamber and the cylinder body 421, and the inner wall of the second chamber, the cylinder body 421 and the boss 422 cooperate to form an adjustment chamber 48. The valve body 41 is also provided with a third air inlet 414, and the third air inlet 414 is respectively connected to the adjustment chamber 48 and the external air path. An elastic member 49 is arranged between the boss 422 and the valve body 41, and the two ends of the elastic member 49 are respectively connected to the boss 422 and the valve body 41, which can provide a reaction force to support the boss 422 to limit the upward movement; at the same time, the elastic member 49 can also limit the downward movement of the boss 422 to ensure that the third air inlet 414 is always connected to the adjustment chamber 48. Airflow can enter and exit the regulating chamber 48 from the third air inlet 414 to control the expansion or contraction of the regulating chamber 48 .

[0037] By controlling the amount of air entering the regulating chamber 48 through the third air inlet 414, the air pressure in the regulating chamber 48 can be adjusted; when the air pressure is higher than the threshold of the regulating chamber 48, it can overcome the reaction force of the elastic member 49 and push the boss 422 to move upward, thereby reducing the distance between the inner wall of the second nozzle cap 46 and the outer wall of the first nozzle cap 45 to reduce the opening of the second air outlet 461. The reduction in the opening of the second air outlet 461 will be adjusted accordingly depending on the air pressure above the threshold of the regulating chamber 48; when the air pressure is lower than the threshold of the regulating chamber 48, the piston cylinder 42 will be reset to its initial position under the action of the reaction force of the elastic member 49.

[0038] Preferably, a sealing ring (not shown) can be provided between the valve body 41 and the piston cylinder 42 to achieve sealing, so as to ensure that the regulating chamber 48 and the second air channel 44 are separated from each other. In this embodiment, the air pressure range of the spray valve 4 is between 0 and 1000 Pa, the spray range diameter is between 0 and 500 mm, and the air flow temperature is between 0 and 150°C.

[0039] Furthermore, the placement table 100 can fix the wafer 1 by electrostatic adsorption, vacuum adsorption or mechanical fixation. It should be noted that the placement table 100 is a prior art in the art and the present invention will not be repeated here. The material of the wafer 1 can be glass, silicon, gallium nitride, gallium arsenide, silicon carbide, aluminum oxide, metal and organic material. The placement table 100 can be manually or robotically placed to take and place the wafer 1.

[0040] Furthermore, the conveying unit 200 includes a feeding reel 5 and a receiving reel 6 for conveying the laminating film 2. The feeding reel 5 and the receiving reel 6 cooperate to tension the laminating film 2 and make the laminating film 2 parallel to the wafer 1. Preferably, the conveying unit 200 is also provided with a tension controller (not shown) to make the tension of the laminating film 2 uniform and facilitate laminating.

[0041] Furthermore, the lifting mechanism 3 is specifically a lifting mechanical arm, which can realize lifting movement by electric or pneumatic means, such as a servo module or a cylinder. In this embodiment, the movement distance of the lifting mechanism 3 is 0 to 1000 mm, and the movement speed is 0 to 5 m / s. A screw hole 415 is provided on the valve body 41 to connect with the lifting mechanism 3.

[0042] The working process of the film laminating device of the present invention is as follows: before laminating, according to the actual structure of the wafer 1 and the laminating film 2, the third air inlet 414 is supplied with air to adjust the relative position between the piston cylinder 42 and the valve body 41, and then the opening size of the second air outlet 461 is adjusted to adjust the pressure applied to the wafer 1;

[0043] The wafer 1 to be film-coated is placed manually or by a robot on the placement table 100, and the placement table 100 fixes the wafer 1;

[0044] Then, the conveying unit 200 is started, and the laminating film 2 is fed to the wafer 1 by the feeding reel 5, and the laminating film 2 is tightened by the receiving reel 6, so that the laminating film 2 has a uniform tension and is placed parallel to the wafer 1, and is ready for laminating at a height of 1 to 10 mm from the upper surface of the wafer 1;

[0045] The lifting mechanism 3 is started, and the spray valve 4 is driven by the lifting mechanism 3 to descend to a position close to the wafer 1, the first gas path is opened, and the first gas outlet 451 sprays a linear gas flow, so that the laminating film 2 is aligned with the center of the wafer 1;

[0046] Then, the second gas path is opened, and the second gas outlet 461 sprays an annular airflow, so that the bonding film 2 is bonded to the periphery of the center of the wafer 1. At this time, the lifting mechanism 3 drives the spray valve 4 to move vertically upward, and closes the first gas path. The upwardly moving spray valve 4 causes the radius of the annular airflow acting on the bonding film 2 to continuously expand. At the same time, the bonding surface of the bonding film 2 and the wafer 1 also gradually expands in a circular manner until the bonding film 2 is bonded to the entire surface of the wafer 1.

[0047] Finally, the second gas path is closed, and a cutting mechanism (not shown) cuts the laminating film 2 along the edge of the wafer 1 , and the wafer 1 after laminating is taken out of the placement table 100 manually or by a robot.

[0048] It should be pointed out that the film pasting equipment of the present invention can also be applied to other occasions of special-shaped film pasting, and the method of using a spray valve to spray airflow can meet the various shape requirements of special-shaped film pasting.

[0049] In addition, the present invention also provides a film pasting method, comprising the following steps:

[0050] S1, transporting the wafer 1 to the placement table 100 manually or by a robot, and the placement table 100 fixes the wafer;

[0051] S2, the bonding film 2 is transported by the transport unit 200 to a parallel position above the wafer 1;

[0052] S3, the lifting mechanism 3 drives the spray valve 4 to descend to a position close to the top of the wafer 1, and the first gas outlet 451 and the second gas outlet 461 are respectively supplied with gas through the first gas path and the second gas path;

[0053] S4, opening the first air path, and blowing out a linear airflow perpendicular to the wafer 1 from the first air outlet 451, so that the laminating film 2 is aligned with the center of the wafer 1;

[0054] S5. Open the second air path, and the second air outlet 461 blows out an annular airflow inclined toward the circumference of the wafer 1. The lifting mechanism 3 drives the spray valve 4 to gradually rise, and closes the first air path, so that the bonding surface of the bonding film 2 and the wafer 1 diffuses from the center of the circle in a circular shape toward the circumference of the wafer 1 to complete the film bonding.

[0055] In addition, the film bonding method also includes the following steps: before bonding, according to the actual structure of the wafer 1 and the bonding film 2, the third air inlet 414 is supplied with air to adjust the relative position between the piston cylinder 42 and the valve body 41, and then the opening size of the second air outlet 461 is adjusted to adjust the pressure applied to the wafer 1, so as to achieve the best bonding effect.

[0056] In summary, the present invention adopts an airflow lamination method, which can be used for lamination of wafers with complex structures. It will not damage the surface structure of the wafer, and can cover the concave wafer structure. No bubbles will be generated after lamination. At the same time, it has good compatibility and can be compatible with the lamination of wafers of sizes such as 4 inches, 6 inches, 8 inches, and 12 inches. In addition, by setting a lifting mechanism and a spray valve, the wafer is lamination in a way of diffusion from the center to the circumference in a circular manner. After lamination, the tension is uniform, which is beneficial to the subsequent process steps.

[0057] The spray valve can automatically adjust the opening size of the second air outlet, and then adjust the pressure, so that different types of wafers and bonding films can achieve the best bonding effect, thereby improving the versatility of the film bonding equipment;

[0058] The spray valve uses a detachable nozzle cap to form a first air outlet and a second air outlet, which can be replaced according to actual needs to adjust the direction of the first air outlet and the second air outlet, and then adjust the direction of the airflow sprayed to the wafer, thereby further improving the adaptability of the film bonding equipment.

[0059] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer film attaching device, characterized in that: include: A placement table (100) for placing a wafer (1), wherein the wafer (1) has an axis (1a); A conveying unit (200) for conveying the laminating film (2) to above the wafer (1); as well as A film laminating unit (300) comprising a lifting mechanism (3) and a spray valve (4) arranged on the lifting mechanism (3), wherein the spray valve (4) is located above the laminating film (2), and the lifting mechanism (3) can drive the spray valve (4) to approach and move away from the wafer (1); The spray valve (4) comprises a first air outlet (451) and a second air outlet (461) for supplying air to spray toward the wafer (1), a first nozzle cap (45) and a second nozzle cap (46), the air outlet direction of the first air outlet (451) coincides with the axis (1a), the second air outlet (461) is arranged around the first air outlet (451) and the air outlet direction of the second air outlet (461) forms an angle α with the axis (1a), and the angle α is an acute angle. The spray valve (4) comprises a valve body (41) and a piston cylinder (42) arranged in the valve body (41), and the piston cylinder (42) can be extended and retracted relative to the valve body (41) along the axis (1a). , so as to adjust the opening size of the second air outlet (461), the first nozzle cap (45) is detachably connected to the end of the piston cylinder (42), the first air outlet (451) is formed on the first nozzle cap (45), the second nozzle cap (46) is detachably connected to the end of the valve body (41) and corresponds to the first nozzle cap (45), the second air outlet (461) is formed between the second nozzle cap (46) and the first nozzle cap (45), the second air outlet (461) blows out an annular airflow inclined toward the circumference of the wafer (1), so that the bonding surface of the bonding film (2) and the wafer (1) diffuses from the center of the circle in a circular manner toward the circumference of the wafer (1), so as to complete the film bonding.

2. The wafer film attaching equipment according to claim 1, characterized in that: The spray valve (4) comprises a valve body (41) and a piston cylinder (42) arranged in the valve body (41), a first air channel (43) is formed in the piston cylinder (42), a second air channel (44) is formed between the valve body (41) and the piston cylinder (42), the first air channel (43) has the first air outlet (451), and the second air channel (44) has the second air outlet (461).

3. The wafer film attaching equipment according to claim 2, characterized in that: The valve body (41) is provided with a first air inlet (411) connected to the first air channel (43) and a second air inlet (412) connected to the second air channel (44).

4. The wafer film attaching equipment according to claim 1, characterized in that: A sealed regulating chamber (48) is also formed between the valve body (41) and the piston cylinder (42); the piston cylinder (42) can move along the axis (1a) to expand or contract the regulating chamber (48); a third air inlet (414) is provided on the valve body (41) and is connected to the regulating chamber (48) and an external air path respectively; air can flow in and out of the regulating chamber (48) from the third air inlet (414) to control the expansion or contraction of the regulating chamber (48).

5. The wafer film attaching equipment according to claim 4, characterized in that: An elastic member (49) is provided between the piston cylinder (42) and the valve body (41) to limit the movement of the piston cylinder (42) in the direction of the axis (1a).

6. The wafer film attaching equipment according to claim 1, characterized in that: The conveying unit (200) comprises a feeding reel (5) and a receiving reel (6) for conveying the laminating film (2); the feeding reel (5) and the receiving reel (6) cooperate to tension the laminating film (2) and make the laminating film (2) parallel to the wafer (1).

7. A film attaching method based on the wafer film attaching equipment according to any one of claims 1 to 6, characterized in that: The steps include: S1, transporting a wafer (1) to a placement table (100), wherein the placement table (100) fixes the wafer (1); S2, the laminating film (2) is transported by the transport unit (200) to a parallel position above the wafer (1); S3, the lifting mechanism (3) drives the spray valve (4) to descend to a position close to the top of the wafer (1), and the first gas outlet (451) and the second gas outlet (461) respectively supply gas through the first gas path and the second gas path; S4, opening the first air path, and blowing out a linear airflow perpendicular to the wafer (1) from the first air outlet (451), so that the laminating film (2) is in contact with the center of the wafer (1); S5, opening the second air path, the second air outlet (461) blows out an annular airflow inclined toward the circumference of the wafer (1), the lifting mechanism (3) drives the spray valve (4) to gradually rise, and closes the first air path, the bonding surface of the bonding film (2) and the wafer (1) diffuses in a circular shape from the center of the circle toward the circumference of the wafer (1), until the bonding film (2) and the entire surface of the wafer (1) are bonded to complete the bonding.

8. The film attaching method according to claim 7, characterized in that: The following steps are also included: Before film lamination, the third air inlet (414) is supplied with air to adjust the relative position between the piston cylinder (42) and the valve body (41), thereby adjusting the opening size of the second air outlet (461) to adjust the pressure applied to the wafer (1) to adapt to different types of wafers (1).

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