Observation jig
By designing an observation fixture and utilizing a combination of a stage, frame, and base, stable observation of packaged device chips with the side facing upwards was achieved, solving the problem of difficult side observation of packaged device chips and improving the efficiency of microscope observation.
Patent Information
- Application Number
- CN202110097309.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-01-29
- Filing Date
- 2021-01-25
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2041-01-25
AI Technical Summary
Side observation of packaged device chips is difficult, especially due to their miniaturization and thinning, which makes it difficult to keep the side facing upwards, affecting the efficiency of microscope observation.
An observation fixture was designed, including a stage, a frame, and a base. The stage has an adhesive layer for holding the chip, the frame has a through opening and is rotatable, and the base has a protrusion to change the stage from a lying state to an upright state, so as to achieve stable observation with the chip side facing upward.
This fixture makes it easy to position the packaged device chip with its side facing upwards, simplifying the microscope observation process and improving observation efficiency.
Smart Images

Figure CN113189098B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an observation fixture used when observing the side of a chip. Background Technology
[0002] A wafer with multiple devices such as ICs and LSIs formed on its front side is divided into individual device chips by a cutting device with a cutting tool that can rotate.
[0003] In addition, a chip-sized package substrate called QFN (Quad Flat Non-leaded package), which is obtained by arranging multiple device chips on a wiring substrate and encapsulating them with molding resin, is also divided into individual packaged device chips by a dicing device (see, for example, Patent Document 1).
[0004] Furthermore, since the QFN forms electrodes across adjacent devices and is disposed across the pre-defined dividing line, when the dividing line is cut using a cutting tool, the electrodes may elongate due to the ductility of the metal, potentially causing a short circuit between them. Therefore, the packaged device chip is attached to the adhesive tape with its sides facing up, and the side is observed under a microscope to detect whether a short circuit has occurred.
[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-145558
[0006] However, since the packaged devices are as small as a few millimeters square and are also thin, considerable care is required to attach the side of the packaged device chip to the adhesive tape. There is also the problem that it is difficult to keep the side of the packaged device chip facing upwards, and it takes a lot of effort to observe the side of the packaged device chip under a microscope. Summary of the Invention
[0007] The present invention was made in view of the above facts, and its object is to provide an observation fixture for easily observing the side of a chip such as a packaged device chip.
[0008] To address the aforementioned problems, the present invention provides the following observation fixture. Specifically, the present invention provides an observation fixture for use when observing the side of a chip, wherein the observation fixture comprises: a stage having an adhesive layer on its front side for holding the chip; a frame having a through opening corresponding to the back side of the stage, and the frame supporting the stage so as to be rotatable from a lying state to an upright state; and a base having a protrusion inserted into the through opening and causing the stage to move from a lying state to an upright state.
[0009] Preferably, the frame supports a plurality of the platforms, and the base has a plurality of protrusions corresponding to the plurality of the platforms.
[0010] The observation fixture of the present invention comprises: a stage having an adhesive layer on its front side for holding a chip; a frame having a through opening corresponding to the back side of the stage, and the frame supporting the stage so as to be rotatable from a lying state to an upright state; and a base having a protrusion inserted into the through opening and causing the stage to be upright from a lying state. Therefore, it is easy to make the side of a chip such as a packaged device chip face up and observe it with a microscope, thus solving the problem of the time-consuming nature of microscope observation. Attached Figure Description
[0011] Figure 1 This is an exploded perspective view of the observation fixture constructed according to the present invention.
[0012] Figure 2 This shows how to keep the chip in place. Figure 1 A three-dimensional diagram showing the state of the platform.
[0013] Figure 3 (a) is a perspective view showing the state in which the frame and the stage holding the chip are placed together on the base. Figure 3 (b) is a three-dimensional diagram showing the state of the platform changing from a lying position to an upright position.
[0014] Label Explanation
[0015] 2: Observation fixture; 4: Stage; 6: Frame; 8: Base; 10: Adhesive layer; 20: Through opening; 30: Protrusion; 34: Chip; 34a: Front of chip; 34b: Side of chip. Detailed Implementation
[0016] Hereinafter, a preferred embodiment of the observation fixture constructed according to the present invention will be described with reference to the accompanying drawings.
[0017] exist Figure 1 The observation fixture, indicated by reference numeral 2, comprises: a stage 4 having an adhesive layer on its front side for holding the chip; a frame 6 having a through opening corresponding to the back side of the stage 4, and the frame 6 supporting the stage 4 so as to be rotatable from a lying position to an upright position; and a base 8 having a protrusion inserted into the through opening to move the stage 4 from a lying position to an upright position.
[0018] Platform 4 is formed into a rectangular plate shape, and a rectangular adhesive layer 10 for holding the chip is provided on the front side of platform 4. The size of the adhesive layer 10 can be the same as the size of the front side of platform 4, preferably a size that can hold chips of various sizes, for example, about 1cm × 1cm. See reference. Figure 1 As understood, the front of platform 4 is formed flat, while a stepped difference is formed on the back of platform 4. Platform 4 has a first part 12 with a relatively large thickness and a second part 14 with a smaller thickness than the first part 12. In the illustrated embodiment, each platform 4 is provided with a pair of cylindrical shafts 18 protruding from the side 16 of the first part 12, and the pair of shafts 18 are arranged in opposite positions to each other.
[0019] The frame 6 is rectangular in shape, and a pair of rectangular through openings 20, spaced apart along its length, are formed to accommodate the platform 4. Multiple circular support holes 24 are formed on the inner circumferential surface 22 of the frame 6 for inserting the shafts 18 of the platform 4. These support holes 24 are positioned opposite each other. Furthermore, in the frame 6, when the shafts 18 of the platform 4 are inserted into the support holes 24, the platform 4 is supported in a way that allows it to rotate from a lying position to an upright position.
[0020] like Figure 1 As shown, in each through opening 20, a pair of protruding pieces 26 protruding from the lower part of the inner peripheral surface 22 are arranged at a distance L1 along the length of the frame 6. Moreover, when the platform 4 is supported by the frame 6, the second part 14 of the platform 4 is supported by each protruding piece 26. In this way, the shape of each through opening 20 is formed corresponding to the shape of the back surface of the platform 4.
[0021] The base 8 has: a main portion 28, which is generally rectangular; and a pair of protrusions 30 that protrude upward from the upper surface of the main portion 28 at intervals along its length. Each protrusion 30 is disposed on one side of the main portion 28 in the short side direction and is positioned between a pair of protruding pieces 26 formed in each through opening 20 when the frame 6 is placed on the upper surface of the main portion 28. The size L2 of the protrusion 30 in the long side direction of the main portion 28 is slightly smaller than the interval L1 between the pair of protruding pieces 26 formed in each through opening 20. In addition, on the other side of the main portion 28 in the short side direction, a pair of rectangular receiving openings 32 are formed at intervals along the length direction of the main portion 28.
[0022] Furthermore, when the frame 6 supporting the platform 4 is placed on the upper surface of the main part 28 of the base 8 and the protrusions 30 of the base 8 are inserted into the through openings 20 of the frame 6, and the protrusions 30 pass between the pair of protruding pieces 26 formed in the through openings 20, the protrusions 30 push the back side of the second part 14 of each platform 4 upward, causing each platform 4 to rotate and change from a lying state to an upright state. In addition, when each platform 4 changes to the upright state, the first part 12 of each platform 4 is stored in the storage openings 32 of the base 8.
[0023] Next, the method for observing the side of the chip using the observation fixture 2 as described above will be explained. In the illustrated embodiment, as... Figure 2 As shown, firstly, the chip 34 is held on the adhesive layer 10 of the platform 4, which is supported by the frame 6 and is rotatable.
[0024] In the illustrated embodiment, chip 34 is a rectangular plate-shaped chip obtained by dividing a chip-size packaging substrate, known as QFN, into individual packaged device chips. Electrodes 36 are exposed on the front side 34a and side side 34b of chip 34.
[0025] Next, as Figure 3 As shown, the frame 6 is placed on the upper surface of the main part 28 of the base 8, and each protrusion 30 of the base 8 is inserted into each through opening 20 of the frame 6, with each protrusion 30 passing between a pair of protruding pieces 26 formed in each through opening 20. Then, the back side of the second part 14 of each platform 4 is pushed upward by each protrusion 30, and each platform 4 rotates from a lying state to an upright state, and the first part 12 of each platform 4 is housed in each receiving opening 32 of the base 8. Thus, as... Figure 3 As shown in (b), the side 34b of the chip 34 held by each stage 4 can be made to face upwards, so that the side 34b of the chip 34 can be observed through a microscope. Even when each stage 4 is rotated or after each stage 4 is rotated and changed to an upright state, the chip 34 is held by the adhesive layer 10 of the stage 4, so the state in which the side 34b of the chip 34 faces upwards is stably maintained.
[0026] As described above, the observation fixture 2 of the illustrated embodiment includes: a stage 4 having an adhesive layer 10 on its front side for holding the chip 34; a frame 6 having a through opening 20 formed corresponding to the back side of the stage 4, and the frame 6 supporting the stage 4 so as to be able to rotate from a lying state to an upright state; and a base 8 having a protrusion 30 inserted into the through opening 20 to raise the stage 4 from a lying state to an upright state. Therefore, it is easy to make the side 34b of the chip 34 face upward and observe it with a microscope, solving the problem of the time-consuming nature of microscope observation.
[0027] Furthermore, in the illustrated embodiment, the frame 6 supports a pair of platforms 4, but the frame 6 may also support one platform 4, or even three or more platforms 4. In the illustrated embodiment, the base 8 has a pair of protrusions 30, but the base 8 may also have one or more protrusions 30 corresponding to the number of platforms 4. Additionally, multiple observation fixtures 2 from the illustrated embodiments may be connected together.
Claims
1. An observation fixture used when observing the side of a chip, wherein, The observation fixture has the following features: The platform has an adhesive layer on its front side to hold the chip in place. A frame having a through opening corresponding to the back of the platform, and the frame supporting the platform so as to allow it to rotate from a lying position to an upright position; and A base having a protrusion that is inserted into the through opening and causes the base to move from a lying position to an upright position.
2. The observation fixture according to claim 1, wherein, The frame supports multiple platforms, and the base has multiple protrusions corresponding to the multiple platforms.
Citation Information
Patent Citations
Package substrate division method
JP2019145558A
Apparatus and method for mounting chip
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