Processing method and processing device

Abstract

The present application provides a processing method and a processing device, which can inhibit the detection state of a processed object from deteriorating. A processing method for processing a processed object includes the following steps: a worktable photographing step of photographing a foreign object held by a transparent portion of a holding worktable to form a foreign object photographing image, the holding worktable having the transparent portion composed of a transparent component at least in a part of a holding surface; a holding step of holding the processed object by the holding worktable after the worktable photographing step is implemented; a processed object photographing step of photographing the processed object held by the holding worktable through the transparent portion to form a processed object photographing image; and a processing step of implementing cutting on the processed object held by the holding worktable by a cutting unit.

Description

Technical Field

[0001] The invention relates to a processing method and a processing device. Background Art

[0002] Processing devices such as cutting devices that process workpieces sometimes need to determine the machining position of a cutting tool or other machining unit on the workpiece or confirm the cut groove resulting from the machining. To enable imaging of the workpiece from below, processing devices sometimes use a device in which the holding table that holds the workpiece has a transparent portion formed of a transparent member (e.g., see Patent Documents 1 and 2).

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2010-87141

[0004] Patent Document 2: Japanese Patent Application Laid-Open No. 2010-82644

[0005] In the above-mentioned processing apparatus, when an object being processed is photographed while the holding surface of the worktable is damaged or contaminated, the damage or contamination is reflected in the captured image. If the processing position is determined or the processing results are verified based on the captured image that reflects the contamination or damage, accurate determination of the processing position or verification of the processing results may be impossible, and improvements are urgently needed. Consequently, in the above-mentioned processing apparatus, the detection results of the object being processed, when photographed through the transparent portion, may be degraded. Summary of the Invention

[0006] Therefore, an object of the present invention is to provide a processing method and a processing apparatus capable of suppressing deterioration in the detection result of a workpiece imaged through a transparent portion.

[0007] According to one aspect of the present invention, there is provided a processing method for processing a workpiece, wherein the processing method comprises the following steps: a worktable photographing step of photographing a foreign object on a transparent portion of a holding worktable to form a foreign object photographing image, wherein the holding worktable has the transparent portion formed of a transparent component on at least a portion of a holding surface; a holding step of holding the workpiece by the holding worktable after the worktable photographing step is performed; a workpiece photographing step of photographing the workpiece held by the holding worktable through the transparent portion to form a workpiece photographing image; and a processing step of processing the workpiece held by the holding worktable by using a processing unit, wherein in the workpiece photographing step, the foreign object in the transparent portion photographed by the worktable photographing step is removed and photographed.

[0008] Preferably, the position of the foreign object is determined based on the foreign object photographed image, and in the workpiece photographing step, the position of the foreign object is avoided and photographed.

[0009] Preferably, the processing method further comprises an image processing step of removing the foreign matter from the processed object captured image based on the captured image of the foreign matter.

[0010] Preferably, the processing method further comprises a processing position determining step of determining the processing position of the workpiece based on the image of the workpiece after the workpiece imaging step and before the processing step.

[0011] Preferably, the processing method further comprises a confirmation step of confirming a processing state of the workpiece based on the captured image of the workpiece after the workpiece imaging step and during or after the processing step.

[0012] According to another aspect of the present invention, a processing device is provided, which is a processing device used in the processing method, wherein the processing device comprises: a holding workbench having a transparent portion composed of a transparent component on at least a portion of the holding surface; a processing unit that processes a workpiece held by the holding workbench; and a detection camera that detects foreign matter in the transparent portion of the holding workbench.

[0013] Preferably, the processing device further includes a workpiece photographing camera, which photographs the held surface of the workpiece held by the holding worktable through the transparent portion, and the detection camera is arranged on the side opposite to the workpiece photographing camera across the holding worktable.

[0014] The present invention has an effect of being able to suppress deterioration of the detection result of the workpiece imaged through the transparent portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a perspective view showing a configuration example of the processing apparatus according to the first embodiment.

[0016] Figure 2 It shows Figure 1 A perspective view of a holding unit of a machining device and a camera photographing a workpiece is shown.

[0017] Figure 3 This is a flowchart showing the flow of the processing method according to the first embodiment.

[0018] Figure 4 It is shown in partial section Figure 3 A side view of the workbench photographing step of the machining method is shown.

[0019] Figure 5 It is shown in Figure 3 FIG. 1 is a diagram showing an example of a foreign matter captured image obtained in the stage imaging step of the processing method shown.

[0020] Figure 6 It is shown in partial section Figure 3 A side view of the holding step of the processing method is shown.

[0021] Figure 7 It will Figure 6 A side view of section VII in FIG. 1 is enlarged and shown in partial section.

[0022] Figure 8 It is shown in partial section Figure 3 A side view of the workpiece imaging step of the machining method shown.

[0023] Figure 9 It is shown in Figure 3 FIG. 1 is a diagram of a workpiece captured image obtained in the workpiece capturing step of the machining method shown.

[0024] Figure 10 It is shown in partial section Figure 3 A side view of a processing step of the processing method is shown.

[0025] Figure 11 It is shown in Figure 3 FIG. 1 is a diagram of a workpiece captured image obtained in the second workpiece capturing step of the machining method shown.

[0026] Figure 12 This is a flowchart showing the flow of the processing method according to the second embodiment.

[0027] Figure 13 This is a flowchart showing the flow of the processing method according to the third embodiment.

[0028] Figure 14 It is shown in Figure 13 FIG. 1 is a diagram of a workpiece captured image obtained in the second workpiece capturing step of the machining method shown.

[0029] Figure 15 It is shown from Figure 14 The image of the workpiece after foreign matter is removed from the image of the workpiece shown.

[0030] Description of labels

[0031] 1: Processing device; 12: Holding worktable; 20: Cutting unit (processing unit); 50: Workpiece photographing camera; 60: Detection camera; 123: Transparent portion; 124: Holding surface; 200: Workpiece; 202: Front surface (held surface); 300: Foreign matter photographing image; 301, 302: Foreign matter; 500, 501, 502, 503: Workpiece photographing image; ST1: Worktable photographing step; ST2: Holding step; ST4: Workpiece photographing step; ST5: Processing position determining step; ST6: Processing step; ST7: Second workpiece photographing step (workpiece photographing step); ST8: Confirmation step; ST10: Image processing step. DETAILED DESCRIPTION

[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the structural elements described below include substantially the same structural elements that can be easily imagined by those skilled in the art. In addition, the structures described below can be appropriately combined. In addition, various omissions, replacements, or changes in the structure can be made within the scope of the present invention.

[0033] [First embodiment]

[0034] A processing apparatus according to a first embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 It is a perspective view showing a configuration example of the processing apparatus according to the first embodiment. Figure 2 It shows Figure 1 A perspective view of a holding unit of a machining device and a camera photographing a workpiece is shown.

[0035] The processing apparatus 1 of the first embodiment is a processing apparatus used for the processing method of the first embodiment, and is a processing apparatus that cuts (corresponds to processing) a workpiece 200 . Figure 1 The workpiece 200 to be processed by the processing apparatus 1 shown is a disc-shaped semiconductor wafer or optical device wafer, having a substrate 201 made of silicon, sapphire, gallium arsenide, SiC (silicon carbide), or the like. The workpiece 200 has devices 204 formed on a front surface 202 of the substrate 201 in an area partitioned in a grid pattern by a plurality of streets 203.

[0036] Device 204 is, for example, an integrated circuit (IC) or LSI (Large Scale Integration), or an image sensor (CCD) or CMOS (Complementary Metal Oxide Semiconductor). In the first embodiment, the workpiece 200 has a metal film 206 formed on the back surface 205 of the substrate 201, which is the back side of the front surface 202. Because the workpiece 200 has the metal film 206 formed on the back surface 205, even when photographed from the back surface 205 by an infrared camera, the streets 203 cannot be detected.

[0037] In the first embodiment, the front surface 202 of the workpiece 200 is attached to a belt 211 having an annular frame 210 attached to its outer periphery, and the workpiece 200 is supported by the annular frame 210 with the metal film 206 on the back surface 205 facing upward. Furthermore, in the first embodiment, the workpiece 200 has the metal film 206 formed on the back surface 205 of the substrate 201. However, in the present invention, the metal film 206 need not be formed, and the back surface 205 may be attached to the belt 211 with the front surface 202 facing upward.

[0038] Figure 1 The processing device 1 shown is a processing device that uses the holding table 12 of the holding unit 10 to hold the workpiece 200 and uses the cutting tool 21 to cut along the partition 203 to separate it into individual devices 204. Figure 1 As shown, the processing device 1 includes a holding unit 10 , a cutting unit 20 , a moving unit 30 , an upper camera 40 , a detection camera 60 , and a control unit 100 .

[0039] like Figure 2 As shown, the holding unit 10 includes: a shell 11, which is moved along the X-axis direction parallel to the horizontal direction through the X-axis moving unit 31 of the moving unit 30; a holding workbench 12, which is arranged on the shell 11 in a manner capable of rotating around an axis parallel to the Z-axis direction along the vertical direction; and a frame fixing part 13, which is arranged in plurality around the holding surface 124 of the holding workbench 12.

[0040] In the first embodiment, the shell 11 has: a lower plate 111, which is moved along the X-axis direction by the X-axis moving unit 31 and is parallel to the horizontal direction; a side plate 112, which is upright from the outer edge of the lower plate 111; and an upper plate 113, the outer edge of which is connected to the upper end of the side plate 112 and is parallel to the lower plate 111.

[0041] The holding table 12 holds the workpiece 200 on the holding surface 124 and is rotatably supported on the upper plate 113 about its axis. The holding table 12 includes an annular support member 121 rotatably supported on the upper plate 113 about its axis parallel to the Z-axis; an annular frame 122 mounted on the support member 121; and a disc-shaped transparent portion 123 embedded within the frame 122. The holding table 12 is positioned so that the support member 121, frame 122, and transparent portion 123 are coaxial with each other.

[0042] The transparent portion 123 is formed from a transparent member such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, or magnesium fluoride. Its upper surface serves as a holding surface 124 for holding the workpiece 200. The holding surface 124 is formed with a plurality of suction grooves 125. In the first embodiment, the plurality of suction grooves 125 are formed in circular shapes of varying diameters arranged concentrically along the outer edge of the holding surface 124. The holding table 12 places the front face 202 of the workpiece 200 on the holding surface 124 via a belt 211. In the first embodiment, the holding table 12 includes the transparent portion 123 formed from a transparent member over the entire holding surface 124. However, in the present invention, the transparent portion 123 may also be formed from a transparent member over at least a portion of the holding surface 124.

[0043] The frame fixing portion 13 includes a frame support portion 131 disposed at the outer edge of the support member 121 and having the annular frame 210 placed on its upper surface, and a vacuum pad 132 for sucking and holding the annular frame 210 placed on the upper surface of the frame support portion 131 .

[0044] The suction groove 125 and vacuum pad 132 of the holding table 12 are connected to a vacuum suction source (not shown). The vacuum suction source suctions the workpiece 200 placed on the holding surface 124 by suction and holds it on the holding surface 124, and also suctions and holds the annular frame 210 placed on the upper surface of the frame support portion 131 on the frame fixing portion 13. In the first embodiment, the holding table 12 suctions and holds the front surface 202 of the workpiece 200 on the holding surface 124 via the belt 211, and also suctions and holds the annular frame 210 on the frame fixing portion 13 via the belt 211. Furthermore, in the first embodiment, the holding unit 10 is provided with a circular through-hole 114 in the upper plate 113 of the housing 11. The through-hole 114 is located coaxially with the support member 121, the frame 122, and the transparent portion 123 of the holding table 12.

[0045] The moving unit 30 has an X-axis moving unit 31, which is Figure 2 The processing feed unit shown; Y axis moving unit 32, which is Figure 1The indexing feed unit shown; Z-axis moving unit 33, which is Figure 1 and a rotary moving unit 34, which makes Figure 2 The holding table 12 shown rotates around an axis parallel to the Z-axis direction.

[0046] The X-axis moving unit 31 moves the holding table 12 and the cutting unit 20 relative to each other in the X-axis direction by moving the lower plate 111 of the housing 11 of the holding unit 10 in the X-axis direction. The X-axis moving unit 31 moves the holding table 12 in the X-axis direction within the range of the loading and unloading area 4 where the workpiece 200 is loaded and unloaded onto the holding table 12 and the processing area 5 where the workpiece 200 held by the workpiece 200 is cut. The Y-axis moving unit 32 moves the cutting unit 20 in the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction, thereby moving the holding table 12 and the cutting unit 20 relative to each other in the Y-axis direction. The Z-axis moving unit 33 moves the cutting unit 20 in the Z-axis direction, thereby moving the holding table 12 and the cutting unit 20 relative to each other in the Z-axis direction.

[0047] The X-axis moving unit 31, the Y-axis moving unit 32 and the Z-axis moving unit 33 have: a well-known ball screw, which is arranged to rotate freely around the axis; a well-known motor, which rotates the ball screw around the axis; and a well-known guide rail, which supports the workbench 12 or the cutting unit 20 to be able to move freely along the X-axis direction, the Y-axis direction or the Z-axis direction.

[0048] The rotational moving unit 34 rotates the holding table 12 around an axis parallel to the Z-axis. The rotational moving unit 34 rotates the holding table 12 around the axis within a range greater than 180 degrees and less than 360 degrees. The rotational moving unit 34 includes: a motor 341 fixed to the side plate 112 of the housing 11; a pulley 342 connected to the output shaft of the motor 341; and a belt 343 wound around the outer periphery of the support member 121 of the holding table 12 and rotated around the axis via the pulley 342. When the motor 341 is rotated, the rotational moving unit 34 rotates the holding table 12 around the axis via the pulley 342 and the belt 343. In addition, in the first embodiment, the rotational moving unit 34 can rotate the holding table 12 220 degrees in both one direction around the axis and another direction opposite to the one direction.

[0049] The cutting unit 20 is a machining unit that uses a cutting tool 21 to cut a workpiece 200 held by the holding table 12. The cutting unit 20 is provided so as to be movable relative to the workpiece 200 held by the holding table 12 in the Y-axis direction via a Y-axis moving unit 32 and in the Z-axis direction via a Z-axis moving unit 33. The cutting unit 20 is mounted on a support frame 3 that is erected from the apparatus main body 2 via the Y-axis moving unit 32 and the Z-axis moving unit 33.

[0050] The cutting unit 20 can position the cutting tool 21 at any position on the holding surface 124 of the holding table 12 via the Y-axis moving unit 32 and the Z-axis moving unit 33. The cutting unit 20 includes: the cutting tool 21; a spindle housing 22 that is movable in the Y-axis and Z-axis directions via the Y-axis moving unit 32 and the Z-axis moving unit 33; a spindle 23 that is rotatably mounted on the spindle housing 22 about its axis and rotated by a motor, with the cutting tool 21 mounted at the front end of the spindle 23; and a cutting water nozzle 24.

[0051] The cutting tool 21 is an extremely thin cutting tool having a roughly annular shape that cuts the workpiece 200 held by the holding table 12. In the first embodiment, the cutting tool 21 is a so-called hub-shaped tool having: a circular base in the shape of an annular ring; and an annular cutting edge, which is arranged on the outer periphery of the circular base and cuts the workpiece 200. The cutting edge is formed by abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material (bonding material) such as metal or resin, and is formed to a predetermined thickness. In addition, in the present invention, the cutting tool 21 can also be a so-called washer tool consisting only of a cutting edge.

[0052] The spindle 23 is rotated about its axis by a motor, thereby rotating the cutting tool 21 about its axis. The axes of the cutting tool 21 and the spindle 23 of the cutting unit 20 are parallel to the Y-axis. A cutting water nozzle 24 is located at the front end of the spindle housing 22 and supplies cutting water to the workpiece 200 and the cutting tool 21 while the cutting tool 21 is cutting the workpiece 200.

[0053] The upper camera 40 is fixed to the cutting unit 20 so as to move integrally therewith. The upper camera 40 includes multiple imaging elements for capturing images of the workpiece 200 held by the holding table 12 from above. These imaging elements are, for example, CCD (Charge-Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) imaging elements. The upper camera 40 captures images of the workpiece 200 held by the holding table 12 and outputs the resulting images to the control unit 100.

[0054] In the first embodiment, the detection camera 60 is positioned above the holding table 12, which is located in the loading / unloading area 4. The detection camera 60 includes an imaging element that images the transparent portion 123 of the holding table 12 from above. The imaging element is, for example, a CCD (Charge-Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) imaging element. The detection camera 60 images the transparent portion 123 of the holding table 12 and outputs the resulting image to the control unit 100.

[0055] Furthermore, in the first embodiment, the inspection camera 60 has a field of view capable of capturing a single image of the holding surface 124 of the holding table 12 positioned in the loading / unloading area 4. However, the present invention is not limited to this. The field of view of the inspection camera 60 may be narrower than the holding surface 124 of the holding table 12, so that the inspection camera 60 captures the holding surface 124 multiple times. Furthermore, in the present invention, the inspection camera 60 is not limited to being positioned above the holding table 12 positioned in the loading / unloading area 4; it may be positioned within a range capable of capturing an image of the transparent portion 123 of the holding table 12 positioned at any position within the movable range of the X-axis moving unit 31.

[0056] In addition, the image captured by the detection camera 60 specifies the intensity of light received by each pixel of the imaging element through a plurality of grayscale levels (e.g., 256 levels). That is, the image captured by the detection camera 60 becomes an image with light and dark levels, in which the intensity of light is expressed in levels corresponding to the intensity of light received by each pixel. The detection camera 60 captures the transparent portion 123 of the holding table 12 and detects foreign matter 301, 302 ( Figure 5 As shown in FIG. 1 , the foreign matter 301 or 302 referred to in the present invention refers to a portion of the transparent portion 123 for which the difference in light intensity between the transparent portion 123 and other portions of the transparent portion 123 in the image obtained when the transparent portion 123 is imaged by the detection camera 60 is greater than or equal to a predetermined value, and may be, for example, dirt on the transparent portion 123 or a scratch formed on the transparent portion 123.

[0057] In addition, if Figure 2 As shown, the processing apparatus 1 further includes a workpiece imaging camera 50 that images the front surface 202, which is the holding surface of the workpiece 200 held by the holding table 12, through the transparent portion 123. The workpiece imaging camera 50 images the front surface 202 of the workpiece 200 held by the holding table 12 from below the workpiece 200 through the transparent portion 123. Since the workpiece imaging camera 50 images the workpiece 200 from below through the transparent portion 123, the inspection camera 60 is disposed on the opposite side of the holding table from the workpiece imaging camera 50.

[0058] In the first embodiment, the workpiece imaging camera 50 is disposed adjacent to the holding unit 10 in the Y-axis direction. Furthermore, the workpiece imaging camera 50 is configured to be movable in the Y-axis direction by the second Y-axis moving unit 35 provided in the apparatus main body 2, and to be movable in the Z-axis direction by the second Z-axis moving unit 38 provided on a vertical column 37, which is erected from a movable plate 36 that is movable in the Y-axis direction by the second Y-axis moving unit 35. In the first embodiment, the workpiece imaging camera 50 is attached to the other end of a horizontally extending member 39, one end of which is attached to a lifting member that is movable in the Z-axis direction by the second Z-axis moving unit 38.

[0059] The second Y-axis moving unit 35 and the second Z-axis moving unit 38 have: a well-known ball screw, which is arranged to rotate freely around the axis; a well-known motor, which rotates the ball screw around the axis; and a well-known guide rail, which supports the moving plate or the workpiece photographing camera 50 so that it can move freely along the Y-axis direction or the Z-axis direction.

[0060] The workpiece imaging camera 50 includes an imaging element that captures the workpiece 200 held by the holding table 12 from below through the transparent portion 123. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary Metal Oxide Semiconductor) imaging element. The workpiece imaging camera 50 captures the workpiece 200 held by the holding table 12 and outputs the resulting image to the control unit 100.

[0061] In addition, the processing device 1 includes an X-axis direction position detection unit 51 ( Figure 2, which is shown in the figure), which is used to detect the position of the workbench 12 in the X-axis direction; the Y-axis direction position detection unit (not shown) is used to detect the position of the cutting unit 20 in the Y-axis direction; and the Z-axis direction position detection unit is used to detect the position of the cutting unit 20 in the Z-axis direction. The X-axis direction position detection unit 51 and the Y-axis direction position detection unit can be composed of a linear scale and a reading head parallel to the X-axis direction or the Y-axis direction. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction using the pulse of the motor. The X-axis direction position detection unit 51, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the position of the workbench 12 in the X-axis direction and the Y-axis direction or the Z-axis direction of the cutting unit 20 to the control unit 100.

[0062] In addition, the processing device 1 includes a second Y-axis direction position detection unit 55 ( Figure 2 (as shown). The second Y-axis position detection unit 55 can be composed of a linear scale parallel to the Y-axis direction and a reading head. The second Y-axis position detection unit 55 outputs the position of the workpiece imaging camera 50 in the X-axis direction and the position of the cutting unit 20 in the Y-axis or Z-axis direction to the control unit 100. Furthermore, the positions of the holding table 12, the cutting unit 20, and the workpiece imaging camera in each axial direction detected by each position detection unit 51, 55 are determined based on a predetermined reference position of the processing apparatus 1. That is, the processing apparatus 1 of the first embodiment determines each position based on a predetermined reference position.

[0063] In addition, the processing device 1 has: a box elevator 91, which carries a box 90 containing multiple workpieces 200 before and after cutting, and moves the box 90 along the Z-axis direction; a cleaning unit 92, which cleans the workpiece 200 after cutting; and a conveying unit (not shown) which takes out and puts the workpiece 200 relative to the box 90 and conveys the workpiece 200.

[0064] The control unit 100 controls each of the aforementioned components of the processing apparatus 1, causing the processing apparatus 1 to perform processing operations on the workpiece 200. Furthermore, the control unit 100 is a computer comprising: an arithmetic processing unit including a microprocessor such as a CPU (central processing unit); a storage device including memory such as ROM (read-only memory) or RAM (random access memory); and an input / output interface device. The arithmetic processing unit of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device and outputs control signals for controlling the processing apparatus 1 to the aforementioned components of the processing apparatus 1 via the input / output interface device.

[0065] The processing device 1 is also connected to a display unit (not shown) and an input unit. The display unit is connected to the control unit 100 and is composed of a liquid crystal display device or the like that displays the status and images of the processing operation. The input unit is connected to the control unit 100 and is used when the operator registers processing content information, etc. In the first embodiment, the input unit is composed of at least one of an external input device such as a touch panel provided on the display unit and a keyboard.

[0066] Next, the processing method according to the first embodiment will be described with reference to the drawings. Figure 3 This is a flowchart illustrating the flow of the processing method according to the first embodiment. The processing method according to the first embodiment is a method for cutting a workpiece 200 using the processing apparatus 1 described above, and is also a processing operation of the processing apparatus 1. First, the operator registers processing details in the control unit 100 and places the cassette 90 containing a plurality of workpieces 200 before cutting on the cassette elevator 91.

[0067] In addition, the processing content information includes: the position of the workpiece 200 photographed by the workpiece photographing camera 50 when performing the alignment of the workpiece 200 and the cutting tool 21, that is, determining the processing position of the workpiece 200; and the position of the workpiece 200 photographed by the workpiece photographing camera 50 when performing the incision inspection, which confirms the cutting groove 400 ( Figure 10 The processing state of the workpiece 200 is determined by determining whether the deviation from the desired position and the size of the chipping generated on both edges of the cutting groove 400 are within a specified range.

[0068] Then, when the control unit 100 receives a start instruction of a processing operation from the operator, the processing device 1 starts the processing method of the first embodiment. Figure 3As shown, the processing method of the first embodiment includes a workbench photographing step ST1, a holding step ST2, a photographing position determining step ST3, a workpiece photographing step ST4, a processing position determining step ST5, a processing step ST6, a second workpiece photographing step ST7, a confirmation step ST8, and a cleaning and conveying step ST9.

[0069] (Workbench shooting steps)

[0070] Figure 4 It is shown in partial section Figure 3 A side view of the workbench photographing step of the machining method is shown. Figure 5 It is shown in Figure 3 FIG. 1 is a diagram showing an example of a foreign matter captured image obtained in the stage imaging step of the processing method shown.

[0071] The stage photographing step ST1 is to photograph the foreign matter 301 and 302 on the transparent portion 123 of the holding stage 12 and form a Figure 5 In the workbench photographing step ST1, as shown in FIG. Figure 4 As shown, the control unit 100 of the processing device 1 controls the X-axis moving unit 31 to position the holding table 12 at the loading and unloading area 4. In the table photographing step ST1, the control unit 100 of the processing device 1 photographs the transparent portion 123 of the holding table 12 using the detection camera 60 to obtain Figure 5 A captured image 300 of a foreign object is shown.

[0072] In the worktable imaging step ST1, the control unit 100 of the processing device 1 extracts pixels whose light intensity difference from the pixels of other parts of the transparent portion 123 of the foreign matter imaging image 300 obtained by the detection camera 60 is greater than a predetermined value, thereby detecting foreign matter 301, 302 on the transparent portion 123. Figure 5 In the example shown, dirt on the transparent portion 123 is detected as foreign matter 301, and damage on the transparent portion 123 is detected as foreign matter 302. In the worktable imaging step ST1, the control unit 100 of the processing device 1 stores the foreign matter imaging image 300, determines the positions of the detected foreign matter 301 and 302 in the X-axis direction and the Y-axis direction, and stores the determined positions. In addition, in the first embodiment, the control unit 100 calculates the positions of the pixels detected as foreign matter 301 and 302 in the foreign matter imaging image 300 as the positions of the foreign matter 301 and 302. In the first embodiment, in the worktable imaging step ST1, the control unit 100 of the processing device 1 stores the foreign matter imaging image 300, determines and stores the positions of the foreign matter 301 and 302, and then enters the holding step ST2.

[0073] (Keep Steps)

[0074] Figure 6 It is shown in partial section Figure 3 A side view of the holding step of the processing method is shown. Figure 7 It will Figure 6 A side view of section VII in FIG. 1 is enlarged and shown in partial section.

[0075] The holding step ST2 is a step of holding the workpiece 200 using the holding table 12 after the workpiece photographing step ST1 is performed. In the holding step ST2, the control unit 100 of the processing device 1 controls the transport unit to take out a workpiece 200 from the cassette 90 and place it on the holding surface 124 of the holding table 12 positioned in the loading and unloading area 4. In the holding step ST2, the control unit 100 of the processing device 1 controls the vacuum suction source, such as Figure 6 and Figure 7 As shown, the workpiece 200 is sucked and held on the holding surface 124 via the belt 211 , and the annular frame 210 is sucked and held on the frame support portion 131 via the belt 211 , and the process proceeds to the imaging position determination step ST3 .

[0076] (Steps for determining the shooting location)

[0077] The shooting position determination step ST3 is a step for determining the position of the workpiece 200, i.e., the shooting position, when performing alignment (i.e., shooting using the workpiece shooting camera 50 in the workpiece shooting step ST4), and the position of the workpiece 200, i.e., the shooting position, when performing incision inspection (i.e., shooting using the workpiece shooting camera 50 in the second workpiece shooting step ST7).

[0078] In the photographing position determination step ST3, the control unit 100 determines whether the photographing position of the workpiece 200 held by the holding table 12, as photographed by the workpiece photographing camera 50 during the execution of the alignment stored as the processing content information, is consistent with the positions of the foreign objects 301 and 302 determined in the table photographing step ST1. In the photographing position determination step ST3, if the control unit 100 determines that the photographing position during the execution of the alignment stored as the processing content information is inconsistent with the positions of the foreign objects 301 and 302 determined in the table photographing step ST1, the photographing position stored as the processing content information is determined as the photographing position for the workpiece photographing step ST4.

[0079] In the imaging position determination step ST3, if the control unit 100 determines that the imaging position at the time of alignment stored as processing content information is inconsistent with the positions of the foreign objects 301 and 302 determined in the worktable imaging step ST1, the control unit 100 determines whether the imaging position stored as processing content information is moved in a predetermined direction by a predetermined distance coincides with the positions of the foreign objects 301 and 302. In the imaging position determination step ST3, a predetermined movement is performed in a predetermined direction until the control unit 100 determines that the position after moving in the predetermined direction by a predetermined distance coincides with the positions of the foreign objects 301 and 302. The position determined to be inconsistent is then determined as the imaging position for the workpiece imaging step ST4.

[0080] Furthermore, in the photographing position determination step ST3, the control unit 100 determines whether the photographing position of the workpiece 200 held by the holding table 12, as photographed by the workpiece photographing camera 50 during the execution of the incision inspection stored as the processing content information, is consistent with the positions of the foreign objects 301 and 302 determined in the table photographing step ST1. In the photographing position determination step ST3, if the control unit 100 determines that the photographing position during the execution of the incision inspection stored as the processing content information is inconsistent with the positions of the foreign objects 301 and 302 determined in the table photographing step ST1, the photographing position stored as the processing content information is determined as the photographing position for the second workpiece photographing step ST7.

[0081] Furthermore, in the imaging position determination step ST3, if the control unit 100 determines that the imaging position during the incision inspection stored as processing content information matches the positions of the foreign objects 301 and 302 determined in the worktable imaging step ST1, the control unit 100 determines whether the imaging position stored as processing content information is moved in a predetermined direction by a predetermined distance matches the positions of the foreign objects 301 and 302. In the imaging position determination step ST3, the imaging position is moved in a predetermined direction until the control unit 100 determines that the position after moving in the predetermined direction by the predetermined distance does not match the positions of the foreign objects 301 and 302. The position determined to be inconsistent is then determined as the imaging position for the second workpiece imaging step ST7. In the imaging position determination step ST3, if the control unit 100 determines the imaging positions for the workpiece imaging steps ST4 and ST7, the process proceeds to the workpiece imaging step ST4.

[0082] (Processing object photography steps)

[0083] Figure 8 It is shown in partial section Figure 3 A side view of the workpiece imaging step of the machining method shown. Figure 9 It is shown in Figure 3FIG. 1 is a diagram of a workpiece captured image obtained in the workpiece capturing step of the machining method shown.

[0084] The workpiece photographing step ST4 is to photograph the workpiece 200 held by the holding table 12 through the transparent portion 123 using the workpiece photographing camera 50. Figure 9 In the first embodiment, in the workpiece photographing step ST4, the control unit 100 of the processing device 1 controls the X-axis moving unit 31 and the second Y-axis moving unit 35, as shown in FIG. Figure 8 As shown, the workpiece imaging camera 50 is positioned below the imaging position determined in the imaging position determining step ST3 of the workpiece 200 held by the holding table 12 .

[0085] In the workpiece photographing step ST4, the control unit 100 of the processing device 1 uses the workpiece photographing camera 50 to photograph the photographing position of the workpiece 200 from below through the transparent portion 123, and obtains the alignment for performing the alignment between the workpiece 200 and the cutting tool 21. Figure 9 The processing position determination step ST5 is entered. Figure 9 In the workpiece captured image 500 shown, the position with the strongest light intensity is indicated by a white background, and the weaker the light intensity, the denser the parallel dotted lines. The spacing streets 203 are indicated by a white background, and the devices 204 are indicated by thick parallel oblique lines.

[0086] Thus, in the first embodiment, in the workpiece imaging step ST4, the workpiece 200 is imaged by capturing the image at the imaging position determined in the imaging position determination step ST3, avoiding the positions of the foreign objects 301 and 302 on the transparent portion 123. Furthermore, in the workpiece imaging step ST4, the transparent portion 123 is imaged by capturing the image at the imaging position determined in the imaging position determination step ST3, excluding the foreign objects 301 and 302 on the transparent portion 123 captured in the worktable imaging step ST1.

[0087] (Processing position determination step)

[0088] The processing position determination step ST5 is a step of determining the processing position 207 of the workpiece 200 based on the workpiece image 500 after the workpiece image capture step ST4 and before the processing step ST6. In the processing position determination step ST5, the control unit 100 of the processing device 1 detects the spacing road 203 based on the workpiece image 500 and determines the processing position 207 (in the case of cutting) when performing cutting. Figure 9(indicated by a dotted line in the figure) and alignment is performed. In the processing position determination step ST5, when the processing position 207 is determined, the process proceeds to the processing step ST6. In the first embodiment, the processing position 207 indicates the position where the center of the cutting edge of the cutting tool 21 in the thickness direction passes during cutting, and is the center of the width direction of the spacer 203.

[0089] (Processing step, second imaging step, and confirmation step)

[0090] Figure 10 It is shown in partial section Figure 3 A side view of a processing step of the processing method is shown. Figure 11 It is shown in Figure 3 FIG. 1 is a diagram of a workpiece captured image obtained in the second workpiece capturing step of the machining method shown.

[0091] Processing step ST6 involves cutting the workpiece 200 held by the holding table 12 using the cutting tool 21 of the cutting unit 20. In processing step ST6, the processing apparatus 1 begins cutting (step ST61). When cutting begins, the control unit 100 of the processing apparatus 1 controls the X-axis moving unit 31 to move the holding table 12 to the processing area 5. The control unit 100 then controls the moving unit 30 and the cutting unit 20 to move the holding table 12 and the cutting tool 21 of the cutting unit 20 relative to each other along the spacing path 203 while supplying cutting water from the cutting water nozzle 24. The cutting tool 21 then cuts into the spacing path 203 until it reaches the band 211, thereby forming a cut groove 400 in the workpiece 200.

[0092] In processing step ST6, the control unit 100 of the processing device 1 determines whether the predetermined number of streets 203 have been cut since the previous second workpiece imaging step ST7 (step ST62). If the control unit 100 determines that the predetermined number of streets 203 have not been cut (step ST62: No), step ST62 is repeated. In processing step ST6, if the control unit 100 of the processing device 1 determines that the predetermined number of streets 203 have been cut (step ST62: Yes), the process proceeds to the second workpiece imaging step ST7.

[0093] The second workpiece imaging step ST7 is to use the workpiece imaging camera 50 to image the workpiece 200 held by the holding table 12 through the transparent portion 123. Figure 111 . In the first embodiment, in the second workpiece imaging step ST7, the control unit 100 of the processing device 1 controls the X-axis moving unit 31 and the second Y-axis moving unit 35 to position the workpiece imaging camera 50 below the workpiece 200 held by the worktable 12 at the imaging position determined in the imaging position determining step ST3.

[0094] In the second workpiece photographing step ST7, the control unit 100 of the processing device 1 uses the workpiece photographing camera 50 to photograph the photographing position of the workpiece 200 from below through the transparent portion 123, and obtains the image data for performing the incision inspection. Figure 11 The workpiece image 501 shown in FIG. 1 is captured, and the process proceeds to the confirmation step ST8. Figure 11 In the image 501 of the workpiece shown, a white background is used to represent the position with the strongest light intensity. The weaker the light intensity, the denser the parallel dotted lines are used to represent it. The spacing road 203 is represented by a white background, the device 204 is represented by thick parallel oblique lines, and the cutting groove 400 is represented by dense parallel oblique lines.

[0095] Thus, in the first embodiment, in the second workpiece imaging step ST7, the workpiece 200 is imaged by imaging at the imaging position determined in the imaging position determination step ST3, avoiding the positions of the foreign objects 301 and 302 on the transparent portion 123. Furthermore, in the second workpiece imaging step ST7, the transparent portion 123 is imaged by imaging at the imaging position determined in the imaging position determination step ST3, excluding the foreign objects 301 and 302 on the transparent portion 123 imaged in the worktable imaging step ST1.

[0096] After the second workpiece imaging step ST7 is performed, confirmation step ST8 determines the machining status of the workpiece 200 based on the captured workpiece image 501, i.e., performs a notch inspection. In confirmation step ST8, the control unit 100 of the machining apparatus 1 checks whether the deviation of the cut groove 400 formed in the workpiece 200 from the desired position and the size of the chipping 401 generated on both edges of the cut groove 400 are within specified ranges. In confirmation step ST8, the control unit 100 of the machining apparatus 1 stores the results of the verification.

[0097] Then, in processing step ST6, the control unit 100 of the processing apparatus 1 determines whether the cutting unit 20 has cut all the grooves 203 of the workpiece 200 held by the holding table 12 to form the cut grooves 400, that is, whether the cutting of the workpiece 200 held by the holding table 12 has been completed (step ST63). If the control unit 100 of the processing apparatus 1 determines that the cutting of the workpiece 200 held by the holding table 12 has not been completed (step ST63: No), the process returns to step ST62. If the control unit 100 of the processing apparatus 1 determines that the cutting of the workpiece 200 held by the holding table 12 has been completed (step ST63: Yes), the process proceeds to cleaning and transporting step ST9.

[0098] Furthermore, during the period from step ST61 to step ST63 when it is determined that cutting of the workpiece 200 has been completed, the processing apparatus 1 is cutting the workpiece 200 held by the holding table 12. Therefore, steps ST61, ST62, and ST63 constitute processing step ST6. Therefore, in the first embodiment, during processing step ST6, the second workpiece imaging step ST7 is performed, and the confirmation step ST8 for confirming the processing status of the workpiece 200 is performed.

[0099] (Cleaning and transport steps)

[0100] The cleaning and transporting step ST9 is a step of using the cleaning unit 92 to clean the workpiece 200 after cutting and store it in the box 90. In the cleaning and transporting step ST9, the control unit 100 of the processing device 1 controls the X-axis moving unit 31 to move the holding table 12 to the loading and unloading area 4, and controls the vacuum suction source to stop the suction and holding of the workpiece 200 and the annular frame 210. In the cleaning and transporting step ST9, the control unit 100 of the processing device 1 controls the conveying unit to transport the workpiece 200 to the cleaning unit 92, and after cleaning it by the cleaning unit 92, store it in the box 90, thereby ending the processing method of the first embodiment. The processing device 1 repeats Figure 3 The processing method shown is performed until all the workpieces 200 in the box 90 are cut.

[0101] In the processing method of the first embodiment described above, in the worktable imaging step ST1, foreign objects 301 and 302 such as damage and dirt are identified based on the foreign object image 300 obtained by imaging the transparent portion 123 using the detection camera 60. Furthermore, in the processing method, since the transparent portion 123 is imaged while excluding foreign objects 301 and 302 in the workpiece imaging steps ST4 and ST7, the reflection of foreign objects 301 and 302 in the workpiece image 500 and 501 can be suppressed. As a result, in the processing method, since foreign objects 301 and 302 are not included in the workpiece image 500 and 501, deterioration in the detection results of the workpiece 200 imaged through the transparent portion 123 can be suppressed.

[0102] Furthermore, in the processing method, since the transparent portion 123 is imaged while avoiding the positions of the foreign objects 301 and 302 in the workpiece imaging steps ST4 and ST7 , it is possible to prevent the foreign objects 301 and 302 from being included in the workpiece captured images 500 and 501 .

[0103] Furthermore, since the processing apparatus 1 of the first embodiment implements the processing method of the first embodiment, there is an effect of being able to suppress deterioration of the detection result of the workpiece 200 imaged through the transparent portion 123 .

[0104] [Second embodiment]

[0105] A processing method according to a second embodiment of the present invention will be described with reference to the drawings. Figure 12 : is a flowchart showing the process of the processing method of the second embodiment. Figure 12 In the present invention, the same parts as those in the first embodiment are denoted by the same reference numerals and their description is omitted.

[0106] like Figure 12 As shown, in the processing method of the second embodiment, the process is the same as the first embodiment except that after the workpiece photographing step ST4 and after the processing step ST6 are implemented, the second workpiece photographing step ST7 is implemented and the confirmation step ST8 of confirming the processing status of the workpiece 200 based on the workpiece photographed image 501 is implemented.

[0107] The processing method and processing device 1 of the second embodiment detect foreign objects 301 and 302 such as damage and foreign matter based on the foreign object shooting image 300, exclude the foreign objects 301 and 302 in the workpiece shooting steps ST4 and ST7 and shoot the transparent part 123, thereby suppressing the foreign objects 301 and 302 from being reflected in the workpiece shooting images 500 and 501. As with the first embodiment, it has the effect of worsening the detection result of the workpiece 200 shot through the transparent part 123.

[0108] [Third embodiment]

[0109] A processing method according to a third embodiment of the present invention will be described with reference to the accompanying drawings. Figure 13 This is a flowchart showing the flow of the processing method according to the third embodiment. Figure 14 It is shown in Figure 13 FIG. 1 is a diagram of a workpiece captured image obtained in the second workpiece capturing step of the machining method shown. Figure 15 It is shown from Figure 14 The image of the workpiece shown is an image of the workpiece after foreign matter has been removed. Figure 13 、 Figure 14 as well as Figure 15 In the present invention, the same parts as those in the first embodiment are denoted by the same reference numerals and their description is omitted.

[0110] like Figure 13 As shown, the processing method of the third embodiment is the same as the first embodiment except that the imaging position determining step ST3 is not included and the image processing step ST10 is performed after the workpiece imaging steps ST4 and ST7 are performed.

[0111] The image processing step ST10 is to process the foreign body image 300 from the image. Figure 14 The image 502 of the workpiece is shown as an example in which foreign matter 301 and 302 are removed. Figure 15 , an example of a process for capturing an image 503 of a workpiece from which foreign matter 301 and 302 have been removed is shown. Figure 14 The workpiece image 502 shown is an image captured in the second workpiece image capturing step ST7. However, since it is the same as the image captured in the workpiece image capturing step ST4, the image captured in the second workpiece image capturing step ST7 will be used as a representative example for the following description. Furthermore, while the workpiece image 502 includes foreign matter 302, the same applies to the case where foreign matter 301 is also included. Therefore, the example of foreign matter 302 will be used as a representative example for the following description.

[0112] In the image processing step ST10, the control unit 100 of the processing device 1 determines the position of the foreign matter 301, 302 determined in the worktable imaging step ST1 based on the imaging position stored as the processing content information and the positions of the foreign matter 301, 302. Figure 14 FIG. 5 shows an example of whether the workpiece captured image 502 contains foreign matter 302. In the image processing step ST10, as shown in FIG. Figure 14 As shown, when the control unit 100 of the processing device 1 determines that the workpiece image 502 contains the foreign matter 302, the foreign matter 302 in the workpiece image 502 is identified. In the image processing step ST10, the control unit 100 of the processing device 1 removes the foreign matter 302 from the workpiece image 502 to form a Figure 15 The workpiece captured image 503 is shown with the foreign matter 302 removed. The workpiece captured image 503 is used in the confirmation step ST8.

[0113] The processing method and processing device 1 of the third embodiment detect foreign objects 301 and 302 such as damage and dirt based on the foreign object shooting image 300, exclude the foreign objects 301 and 302 in the workpiece shooting steps ST4 and ST7, and shoot the transparent part 123, thereby preventing the foreign objects 301 and 302 from being reflected in the workpiece shooting image 503. As with the first embodiment, it has the effect of preventing the deterioration of the detection result of the workpiece 200 shot through the transparent part 123.

[0114] Furthermore, the processing method and processing apparatus 1 of the third embodiment removes the foreign object 302 from the workpiece image 502 based on the foreign object image 300, thereby preventing the foreign object 302 from being included in the workpiece image 503 used in the processing position determination step ST5 and the confirmation step ST8. Furthermore, similar to the second embodiment, the processing method and processing apparatus 1 of the third embodiment may perform the second workpiece image capturing step ST7 and the image processing step ST10 after performing the processing step ST6, and perform the confirmation step ST8 of confirming the processing status of the workpiece 200 based on the workpiece image 503.

[0115] In addition, the present invention is not limited to the above-mentioned embodiment. That is, it can be implemented in various ways without departing from the scope of the main purpose of the present invention. In addition, in the above-mentioned embodiment, the processing unit of the processing device 1 is a cutting unit 20 having a spindle 23 with which the cutting tool 21 can be freely loaded and unloaded, but in the present invention, it is not limited to the cutting unit 20, and it can also be a laser oscillator, a laser beam irradiation unit having a focusing lens, etc. That is, in the present invention, the processing device can also be a laser processing device. In addition, in the present invention, it is also possible to use the upper camera 40 or the workpiece shooting camera 50 to shoot the transparent part 123 of the holding workbench 12 that does not hold the workpiece 200 instead of providing the detection camera 60, and form a foreign matter shooting image 300. In this case, it is preferred to use the upper camera 40 or the workpiece shooting camera 50 to shoot the transparent part 123 of the holding workbench 12 multiple times.

Claims

1. A processing method for processing a workpiece, wherein: The processing method has the following steps: a workbench photographing step of photographing a foreign object on a transparent portion of a holding workbench to form a foreign object photographed image, wherein the holding workbench has the transparent portion formed of a transparent member on at least a portion of a holding surface; A holding step, after the workbench photographing step is performed, using the holding workbench to hold the workpiece; a workpiece photographing step of photographing the workpiece held by the holding table from below the holding table through the transparent portion to form a photographed image of the workpiece; and The processing step is to process the workpiece held by the holding table using a processing unit. In the workpiece imaging step, the foreign matter is excluded from the transparent portion imaged in the table imaging step to suppress reflection of the foreign matter in the workpiece imaging image captured from below the holding table through the transparent portion.

2. The processing method according to claim 1, wherein: The position of the foreign object is determined based on the foreign object captured image, and in the workpiece capturing step, the position of the foreign object is avoided while capturing the image.

3. The processing method according to claim 1, wherein: The processing method further includes an image processing step of removing the foreign matter from the processed object captured image based on the captured image of the foreign matter.

4. The processing method according to any one of claims 1 to 3, wherein: The processing method further includes a processing position determining step of determining a processing position of the workpiece based on the captured image of the workpiece after the workpiece imaging step and before the processing step.

5. The processing method according to claim 1 or 2, wherein: The processing method further includes a confirmation step of confirming a processing state of the workpiece based on the captured image of the workpiece after the workpiece imaging step and during or after the processing step.

6. A processing device, wherein: The processing device has: a holding table having a transparent portion formed of a transparent member on at least a portion of a holding surface; a processing unit that processes a workpiece held by the holding table; and a detection camera for detecting foreign matter on the transparent portion of the holding table, The processing device further includes a workpiece photographing camera, which photographs the held surface of the workpiece held by the holding table from below the holding table through the transparent portion. The processing device can remove foreign matter from the transparent portion detected by the detection camera to suppress the foreign matter from being reflected in an image captured by the workpiece imaging camera through the transparent portion from below the holding table.

7. The processing device according to claim 6, wherein: The inspection camera is arranged on the opposite side of the workpiece imaging camera across the holding table.

Images