Device, system and method for handling die carrier

Abstract

The present invention discloses an apparatus and method for automatically handling a die carrier. In one example, the disclosed apparatus includes: at least one loading port, each configured to load a die carrier, the die carrier being operable to accommodate a plurality of dies; and an interface tool coupled to the at least one loading port and a semiconductor processing unit. The interface tool includes: a first robot arm configured to transport the die carrier from the at least one loading port to the interface tool; and a second robot arm configured to transport the die carrier from the interface tool to the semiconductor processing unit to process at least one die in the die carrier.

Description

Technical Field

[0001] Embodiments of the present invention relate to an apparatus, system and method for transporting a die carrier. Background Art

[0002] During the manufacture of semiconductor devices, the devices are typically processed at many workstations or processing machines. For example, integrated circuits are mass-produced on a single wafer, which can be cut into many pieces, each of which contains a copy of the circuit and is called a die. Multiple dies can be accommodated on a frame, which is called a frame cassette.

[0003] The transportation or delivery of die carriers (e.g., frame cassettes) is an important aspect of the overall manufacturing process. Although an automated materials handling system (AMHS) can be used to automatically transport frame cassettes between various processing machines ("tools"), manual operation is generally required to load and unload frame cassettes into and from processing tools. Thus, a huge human effort is required to transfer frame cassettes in manufacturing equipment, which often results in injuries to human operators. In addition, production throughput is limited when manual operation causes process interruptions during frame cassette transportation.

[0004] As such, existing apparatus and methods for handling die carriers are not entirely satisfactory. Summary of the invention

[0005] Embodiments of the present invention are directed to an apparatus, system and method for transporting a die carrier.

[0006] According to an embodiment of the present invention, a device for handling a die carrier includes at least one loading port and an interface tool. Each loading port is configured to load a die carrier, and the die carrier is operable to accommodate a plurality of dies. The interface tool is coupled to the at least one loading port and a semiconductor processing unit, wherein the interface tool includes a first robot arm and a second robot arm. The first robot arm is configured to transport the die carrier from the at least one loading port to the interface tool. The second robot arm is configured to transport the die carrier from the interface tool to the semiconductor processing unit to process at least one die in the die carrier.

[0007] According to an embodiment of the present invention, a system for handling die carriers includes a semiconductor processing unit, at least one loading port, and an interface tool. The loading port is configured to load at least one die carrier, each of which is operable to accommodate a plurality of dies. The interface tool is coupled to the semiconductor processing unit and to the at least one loading port, wherein the interface tool includes a first robot and a second robot. The first robot is configured to transport the at least one die carrier from the at least one loading port to the interface tool. The second robot is configured to transport the at least one die carrier from the interface tool to the semiconductor processing unit.

[0008] According to an embodiment of the present invention, a method for handling a die carrier includes the following steps: receiving a die carrier at a load port, the die carrier being operable to accommodate a plurality of dies; transporting the die carrier from the load port to an interface tool by a first robot; and transporting the die carrier from the interface tool to a semiconductor processing unit by a second robot to process at least one die in the die carrier. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Various aspects of the present disclosure are best understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that the various features are not necessarily drawn to scale. In fact, the size and geometry of the various features may be arbitrarily increased or decreased for clarity of discussion. Throughout the specification and drawings, similar reference numbers indicate similar features.

[0010] Figure 1A A top view block diagram illustrating an exemplary system for handling a die carrier according to some embodiments of the present disclosure.

[0011] Figure 1B Description of some embodiments of the present disclosure Figure 1A A front view block diagram of an exemplary system for handling a die carrier is shown in FIG.

[0012] Figure 1C Description of some embodiments of the present disclosure Figure 1A A side view block diagram of an exemplary system for handling a die carrier is shown in FIG.

[0013] Figure 2A A top view block diagram illustrates another exemplary system for handling a die carrier according to some embodiments of the present disclosure.

[0014] Figure 2B Description of some embodiments of the present disclosure Figure 2A A front view block diagram of an exemplary system for handling a die carrier is shown in FIG.

[0015] Figure 2C Description of some embodiments of the present disclosure Figure 2A A side view block diagram of an exemplary system for handling a die carrier is shown in FIG.

[0016] Figure 3 Schematic diagram illustrating a semiconductor fabrication apparatus equipped with a semiconductor processing unit for processing substrates and / or dies according to some embodiments of the present disclosure.

[0017] Figure 4 A portion of a semiconductor manufacturing apparatus including a carrier transport tool and a carrier loading device according to some embodiments of the present disclosure is described.

[0018] Figure 5 is a flow chart illustrating an exemplary method for automatically handling a die carrier according to some embodiments of the present disclosure.

[0019] [Explanation of Symbols]

[0020] 100, 200: Exemplary systems

[0021] 101, 102, 103, 104, 201, 281, 420: Die carrier

[0022] 109, 208, 209: Monitor

[0023] 110, 210: Semiconductor processing unit

[0024] 122, 124, 220, 320, 410: loading port

[0025] 130, 230, 430: Interface tools

[0026] 131, 231: First interface / interface

[0027] 132: Second interface / interface

[0028] 133: Interface

[0029] 138, 238: Elevator

[0030] 141, 241: First robotic arm

[0031] 142, 242: Second robotic arm

[0032] 190, 290, 330, 470: Vehicle loading device

[0033] 232: Interface / Upper Entrance

[0034] 233: Interface / lower entrance

[0035] 251: First End

[0036] 252: Second End

[0037] 300, 400: Semiconductor manufacturing equipment

[0038] 310, 380: Aerial Hoist and Transport (OHT) vehicles

[0039] 340: Semiconductor processing tools

[0040] 351, 352, 353, 354: Chamber

[0041] 360: Calibrator

[0042] 370: Assembler

[0043] 422: Door

[0044] 432: Shake the robotic arm

[0045] 440: Carrier Transport Tool / Wafer Transport Tool / Overhead Hoist Transport (OHT) System

[0046] 442: Stationary track or rail

[0047] 450: Wheeled OHT vehicle / OHT vehicle

[0048] 452: Electric motor-driven or pneumatic lifting mechanisms / lifting mechanisms

[0049] 480: Top plate

[0050] 500: Exemplary Methods

[0051] 502, 504, 506, 508, 510, 512, 514, 516, 518, 520, 522: Operation

[0052] X, Y: direction

[0053] Z: Direction / Axis DETAILED DESCRIPTION

[0054] The following disclosure sets forth various exemplary embodiments to implement different features of the subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, a first feature formed on or formed on a second feature may include an embodiment in which the first feature and the second feature are formed in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may reuse reference numbers and / or letters in various examples. Such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or configurations discussed.

[0055] In addition, for ease of description, spatially relative terms such as "beneath", "below", "lower", "above", "upper", etc. may be used herein to describe the relationship between one element or feature and another (other) element or feature illustrated in the figures. In addition to the orientations shown in the figures, the spatially relative terms are also intended to encompass different orientations of the device in use or operation. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly. Terms such as "fit", "attach", "connect", and "interconnect" refer to relationships in which structures are fastened or fit to each other directly or indirectly through intervening structures, and both fits or relationships that are removable or fixed, unless otherwise expressly stated.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It should be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present disclosure, and should not be interpreted in an idealized sense or an overly formal sense unless explicitly defined as such herein.

[0057] Reference will now be made in detail to the present embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used throughout the drawings and the description to refer to the same or like parts.

[0058] Integrated circuit (IC) manufacturing may go through multiple production steps during which carriers are used to support and carry the wafers and dies being manufactured. Carriers for carrying device dies may include boats, trays, glass carriers, magazines, frames, etc. In one embodiment, multiple dies may be carried on frames and multiple frames may be carried in frame cassettes before and after the dies are processed at a processing tool. To save manpower, a loading port may be used to load and unload die carriers during IC manufacturing.

[0059] In order to further improve the working efficiency and production quality of semiconductor manufacturing equipment, the present invention discloses an apparatus and method for automatically loading a die carrier (e.g., a frame box) into a processing tool and unloading the die carrier from the processing tool to process the dies in the frame box, wherein a robot arm cooperates with a lift to move the die carrier.

[0060] In some embodiments, the disclosed apparatus includes: a load port configured to load a die carrier, the die carrier operable to accommodate a plurality of dies; and an interface tool coupled to the load port and a semiconductor processing unit. The interface tool includes: a first robot configured to transport the die carrier from the load port to an elevator stage of the interface tool; and a second robot configured to transport the die carrier from the elevator stage of the interface tool to the semiconductor processing unit to process at least one die in the die carrier. The elevator stage can automatically transport the die carrier vertically within the interface tool, which is an elevator area of ​​the apparatus. Each of the first robot arm and the second robot arm is one of: a shutter arm having a shutter end effector configured to grasp and hold a handle located on top of the die carrier to move the die carrier horizontally and vertically; a clamp arm having a clamp end effector configured to wrap around the entire die carrier to move the die carrier horizontally and vertically; or a swing arm having a first end and a second end, wherein the first end is configured to clamp on the die carrier so that the die carrier swings around the second end.

[0061] The disclosed device may also include a semiconductor wafer information detector for detecting the wafer information of the loaded frame cassette and communicating the semiconductor wafer information with other loading ports of the manufacturing equipment or a central controller. This can help to report loading problems in a timely manner to avoid processing errors.

[0062] The present disclosure is applicable to all types of devices that load or unload die carriers, such as when bumping or packaging a product. The disclosed system can improve work efficiency, save human operating resources, and improve production quality by reducing human errors at the manufacturing level, thereby avoiding human injuries during the manual loading / unloading process of the frame cassette. The disclosed device provides an elevator structure with a robotic arm for automatically handling die carriers to generate maximum production capacity. In one embodiment, the disclosed device is used as a frame cassette loading port to provide an interface between an overhead hoist transport (OHT) system or another cassette movement system and a semiconductor processing tool.

[0063] Figure 1A A top view block diagram of an exemplary system 100 for handling die carriers according to some embodiments of the present disclosure is illustrated. Figure 1B Description of some embodiments of the present disclosure Figure 1A A front view block diagram of an exemplary system 100 for handling die carriers is shown in FIG. Figure 1C Description of some embodiments of the present disclosure Figure 1A A side view block diagram of an exemplary system 100 for handling die carriers is shown in FIG.

[0064] like Figure 1A As shown in , the exemplary system 100 includes a semiconductor processing unit 110 and a carrier loading device 190 interfaced with the semiconductor processing unit 110. The semiconductor processing unit 110 can be any device or system for processing semiconductor substrates and / or dies. The carrier loading device 190 can provide the dies in the die carrier 104 to the semiconductor processing unit 110 for processing. In one embodiment, the die carrier is a frame box including a plurality of frames, each of which is operable to accommodate a plurality of dies.

[0065] like Figure 1A As shown in , the carrier loading device 190 in this example includes an interface tool 130 and two loading ports 122, 124. The two loading ports 122, 124 are respectively coupled to opposite sides of the interface tool 130. Each of the two loading ports 122, 124 is configured to load a die carrier that can be operated to accommodate a plurality of dies. For example, the loading port 122 can receive the die carrier 101 from an automated materials handling system (AMHS) carrier; and the loading port 124 can receive the die carrier 102 from the AMHS carrier.

[0066] In the illustrated embodiment, the load port 122 and the interface tool 130 are connected via a first interface 131 so that die carriers can be transferred between the load port 122 and the interface tool 130 via the first interface 131. Similarly, the load port 124 and the interface tool 130 are connected via a second interface 132 so that die carriers can be transferred between the load port 124 and the interface tool 130 via the second interface 132.

[0067] After receiving the die carrier 103 from the load port 122 or the load port 124, the interface tool 130 may transport the die carrier 103 to the semiconductor processing unit 110 via an interface 133 connecting the interface tool 130 and the semiconductor processing unit 110. In the illustrated embodiment, the die carrier is automatically transported between the load ports 122, 124 and the interface tool 130 by a first robot. Similarly, the die carrier is transported between the interface tool 130 and the semiconductor processing unit 110 by a second robot. According to various embodiments, each of the first robot and the second robot may be one of a shutter arm, a clamp arm, or a shaking arm. The shutter arm has a shutter end effector configured to grab and hold a handle located on top of the die carrier to move the die carrier horizontally and vertically. The gripper arm has a gripper end effector configured to wrap around the entire die carrier to move the die carrier horizontally and vertically. The swing arm has a first end and a second end, wherein the first end is configured to clamp on the die carrier to swing the die carrier around the second end.

[0068] like Figure 1B As shown in , the interface tool 130 includes a first robot 141 configured to transport a die carrier from a load port 122, 124 to the interface tool 130. The first robot 141 can hold the die carrier 101 or 102 and move the die carrier 101 or 102 horizontally along the X direction. That is, the first robot 141 can move the die carrier from the load port 122 or 124 to the interface tool 130 via (through) the first interface 131 or the second interface 132 before die processing, and / or move the die carrier from the interface tool 130 via the first interface 131 or the second interface 132 to the load port 122 or 124 along the X direction after die processing. In one embodiment, the first robot 141 can hold a handle located on the top of the die carrier to horizontally move the die carrier. In another embodiment, the first robot 141 has a support stage located under the die carrier to accommodate the die carrier, thereby horizontally moving the die carrier.

[0069] like Figure 1A and Figure 1C As shown in FIG. 1 , the interface tool 130 also includes an elevator 138 configured to move the die carrier 103 vertically in the interface tool 130 along the Z direction. Figure 1B The interfaces 131, 132 are shown to be located at the upper region of the interface tool 130, but Figure 1C133 is shown to be located at the lower area of ​​the interface tool 130. Thus, after the first robot 141 transfers the die carrier 103 from the load port 122 or 124 to the upper area of ​​the interface tool 130, the elevator 138 will vertically move the die carrier 103 along the Z direction to a lower position aligned with the interface 133, which is the entrance of the semiconductor processing unit 110.

[0070] In one embodiment, the first robot 141 may be coupled to the elevator 138 to hold the die carrier to move the die carrier vertically. In one embodiment, the first robot 141 may hold a handle located on top of the die carrier to move the die carrier vertically. In another embodiment, the first robot 141 has a support platform located below the die carrier to accommodate the die carrier, thereby moving the die carrier vertically. In this case, the support platform of the first robot 141 is also the elevator platform of the elevator 138.

[0071] like Figure 1C As shown in , the interface tool 130 also includes a second robot 142 configured to transport the die carrier 103 from the interface tool 130 to the semiconductor processing unit 110. Specifically, the second robot 142 can hold the die carrier 103 and move the die carrier 103 to the semiconductor processing unit 110 through the interface 133 in the Y direction to process the die. In one embodiment, the second robot 142 can hold a handle located on the top of the die carrier to move the die carrier horizontally and vertically. In another embodiment, the second robot 142 has a gripping end effector configured to wrap around the entire die carrier to move the die carrier horizontally and vertically.

[0072] Reference again Figure 1B In one embodiment, the load ports 122, 124 may be considered as an OHT area of ​​the carrier loader 190 for loading and unloading die carriers in cooperation with the OHT system and for performing door storage functions, while the interface tool 130 may be considered as an elevator area of ​​the carrier loader 190 for performing carrier transfer and carrier feeding functions. Each of the load ports 122, 124 may be a multi-cassette load port (MCLP).

[0073] In one embodiment, each of the load ports 122, 124 includes an opening mechanism configured to open a first door of a loaded die carrier, and a door storage portion configured to store the first door before the die carrier is transported to the interface tool 130. The second robot 142 is also configured to transport the die carrier from the semiconductor processing unit 110 back to the interface tool 130 after the semiconductor processing unit 110 processes the die in the die carrier. The first robot 141 is also configured to transport the die carrier from the interface tool 130 to the load port 122 or 124, which also includes a closing mechanism. The closing mechanism can be configured to retrieve a second door of the same model as the first door from the door storage portion and close the second door onto the die carrier, which can later be transported to another processing tool.

[0074] In another embodiment, one of the load ports 122 or 124 is configured to load a die carrier, while the other is configured to unload a die carrier. In yet another embodiment, after the semiconductor processing unit 110 processes the die in the die carrier, another carrier loading device transports the die carrier to another semiconductor processing unit for further processing.

[0075] In this way, the process of handling a die carrier in a fabrication tool can be performed in an automated manner without human intervention, except for error reports or system alarms. For example, the monitor 109 can display the operation flow within the load ports 122, 124 and the interface tool 130. The monitor 109 can also display key parameters related to the die carrier operation flow and report errors when abnormal conditions occur (e.g., when the wafer information detected on the die carrier does not match the code associated with the semiconductor processing unit 110).

[0076] Although Figure 1A to Figure 1C The interface tool 130 in the embodiment has a double-layer elevator structure to store multiple frame boxes through Z-axis movement, but the system in other embodiments may include an interface tool with a single-layer elevator structure or an N-layer elevator structure, where N>2. Figure 1A to Figure 1C The interface tool 130 in the embodiment has a single interface 133 connecting the interface tool 130 to the semiconductor processing unit 110, but the system in other embodiments may include an interface tool with multiple interfaces or entrances to the semiconductor processing tool. In this way, multiple frame cassettes can be transported from the elevator area to the chambers of the semiconductor processing tool according to different channels of the chambers.

[0077] Figure 2A A top view block diagram is illustrated of another exemplary system 200 for handling die carriers according to some embodiments of the present disclosure. Figure 2B Description of some embodiments of the present disclosure Figure 2A A front view block diagram of an exemplary system 200 for handling a die carrier is shown in FIG. Figure 2C Description of some embodiments of the present disclosure Figure 2A A side view block diagram of an exemplary system 200 for handling a die carrier is shown in FIG.

[0078] like Figure 2A As shown in , the exemplary system 200 includes a semiconductor processing unit 210 and a carrier loading device 290 interfaced with the semiconductor processing unit 210. The semiconductor processing unit 210 can be any device or system for processing semiconductor substrates and / or dies. The carrier loading device 290 can provide the dies in the die carrier 201 to the semiconductor processing unit 210 for processing. In one embodiment, the die carrier is a frame box including a plurality of frames, each of which is operable to accommodate a plurality of dies. Figure 2A As shown in , the carrier loading device 290 in this example includes an interface tool 230 and a loading port 220. The loading port 220 is coupled to the right side of the interface tool 230, that is, the X direction. The loading port 220 is configured to load a die carrier that can operate to accommodate multiple dies. For example, the loading port 220 can receive a die carrier 201 from an AMHS carrier.

[0079] In the illustrated embodiment, the load port 220 and the interface tool 230 are connected via a first interface 231 so that a die carrier can be transferred between the load port 220 and the interface tool 230 via the first interface 231. After receiving the die carrier 201 from the load port 220, the interface tool 230 can transfer the die carrier 201 to the semiconductor processing unit 210 via an interface 232 connecting the interface tool 230 and the semiconductor processing unit 210. In the illustrated embodiment, the die carrier is automatically transferred between the load port 220 and the interface tool 230 by a first robot; and the die carrier is transferred between the interface tool 230 and the semiconductor processing unit 210 by a second robot. According to various embodiments, each of the first robot and the second robot may be one of a shutter arm, a gripper arm, or a swing arm.

[0080] like Figure 2BAs shown in FIG. 1 , the interface tool 230 includes a first robot 241 configured to transport a die carrier 281 between the load port 220 and the interface tool 230. The first robot 241 has a first end 251 and a second end 252. The second end 252 is fixed to a position close to the first interface 231, and the first end 251 is configured to clamp on the die carrier 281 so that the die carrier 281 swings around the second end 252. The first end 251 can clamp on the entire die carrier 281 so that the die carrier 281 moves around the second end 252. In one embodiment, the first end 251 can have a three-prong pin for firmly grasping the die carrier 281. In the illustrated embodiment, before the die is processed, the die carrier 281 is transported horizontally from the load port 220 through the first interface 231 to the interface tool 230 along the X direction by the first robot 241. The die carrier 281 may also be transported horizontally along the X direction from the interface tool 230 through the first interface 231 to the load port 220 by the first robot 241 after die processing.

[0081] like Figure 2C As shown in , the interface tool 230 also includes an elevator 238, which is configured to move the die carrier 281 vertically in the Z direction in the interface tool 230. In one embodiment, the interface tool 230 includes the following two: an interface 232 that connects the upper area of ​​the interface tool 230 to the semiconductor processing unit 210; and another interface 233 that connects the lower area of ​​the interface tool 230 to the semiconductor processing unit 210. Although Figure 2B , Figure 2C The interfaces 231, 232 are shown to be located at the upper region of the interface tool 230, but Figure 2C 233 is shown to be located at the lower area of ​​the interface tool 230. In this way, after the first robot 241 transfers the die carrier 281 from the load port 220 to the upper area of ​​the interface tool 230, the die carrier 281 can be fed into the semiconductor processing unit 210 through the upper entrance 232 or the lower entrance 233 of the semiconductor processing unit 210. The elevator 238 can vertically move the die carrier 281 along the Z direction to a position aligned with the upper entrance 232 or the lower entrance 233 of the semiconductor processing unit 210. In one embodiment, a plurality of frame cassettes can be transferred from the interface tool 230 to the chamber of the semiconductor processing tool 210 through the upper entrance 232 and the lower entrance 233 according to different channels of the chamber.

[0082] like Figure 2CAs shown in , the interface tool 230 also includes a second robot 242 configured to transport the die carrier 281 from the interface tool 230 to the semiconductor processing unit 210. Specifically, the second robot 242 can hold the die carrier 281 and move the die carrier 281 through the interface 232 (or the interface 233) along the Y direction to the semiconductor processing unit 210 to process the die. In one embodiment, the second robot 242 can hold the handle located on the top of the die carrier 281 to move the die carrier 281 horizontally and vertically. In another embodiment, the second robot 242 has a support stage located under the die carrier 281 to accommodate the die carrier 281, thereby moving the die carrier 281 horizontally and vertically. In this case, the second robot 242 can be coupled to the elevator 238 to hold the die carrier so as to move the die carrier vertically; and the support stage of the second robot 242 is also the elevator stage of the elevator 238. A shutter arm like the second robot arm 242 can save space and can be used in semiconductor processing tools with limited space.

[0083] Reference again Figure 2B In one embodiment, the load port 220 may be considered as an OHT area of ​​the carrier loader 290 for loading and unloading die carriers in cooperation with the OHT system and for performing door storage functions, while the interface tool 230 may be considered as an elevator area of ​​the carrier loader 290 for performing carrier transport and carrier feeding functions. The load port 220 may be a multi-cassette load port (MCLP). In one embodiment, the load port 220 includes: an opening mechanism configured to open a first door of a loaded die carrier; and a door storage portion configured to store the first door before the die carrier is transported to the interface tool 230. After the semiconductor processing unit 210 processes the die in the die carrier, the second robot 242 is also configured to transport the die carrier from the semiconductor processing unit 210 back to the interface tool 230. The first robot 241 is also configured to transport the die carrier from the interface tool 230 to the load port 220, and the load port 220 also includes a closing mechanism. The closing mechanism may be configured to retrieve a second door of the same model as the first door from the door storage and close the second door onto the die carrier, which may then be transported to another processing tool. In another embodiment, after the semiconductor processing unit 210 processes the die in the die carrier, the die carrier is transported to another semiconductor processing unit for further processing by another carrier loading device.

[0084] In this way, the process of handling a die carrier in a fabrication tool can be performed in an automated manner without human intervention, except for error reporting or system alarms. For example, the two monitors 209, 208 can display the operation flow in the load port 220 and the interface tool 230, display key parameters related to the die carrier operation flow, and report errors when abnormal conditions occur.

[0085] Although Figure 2A to Figure 2C The interface tool 230 in the embodiment has a double-layer elevator structure to store multiple frame boxes through Z-axis movement, but the system in other embodiments may include an interface tool with a single-layer elevator structure or an N-layer elevator structure, where N>2. Figure 2A to Figure 2C The interface tool 230 in FIG. 2 has two interfaces 232 , 233 connecting the interface tool 230 to the semiconductor processing unit 210 , but systems in other embodiments may include an interface tool having another number of interfaces or accesses to the semiconductor processing tools.

[0086] Figure 3 A schematic diagram illustrating a semiconductor fabrication apparatus 300 equipped with a semiconductor processing unit for processing substrates and / or dies according to some embodiments of the present disclosure. Figure 3 The frame cassette is fed into a semiconductor processing tool 340 using a carrier loading device 330. The carrier loading device 330 is used as a frame cassette load port (FCLP), which may have a Figure 1A to Figure 1C The structure of the carrier loading device 190 or Figures 2A to 2C The structure of the carrier loading device 290 is the same as the structure of the carrier loading device 290.

[0087] exist Figure 3At the far left of the semiconductor processing tool 340, a loading port 320 in this example is used as an entry point for feeding trays and boats into the semiconductor processing tool 340, and a carrier loading device 330 is used as an entry point for feeding frame cassettes into the semiconductor processing tool 340. For example, the loading port 320 can receive boats / trays containing substrates from an AMHS or OHT vehicle 310, which can also deliver frame cassettes including dies to the carrier loading device 330. In one embodiment, after the semiconductor processing tool 340 receives both the die and the substrate, the semiconductor processing tool 340 can process the die and the substrate, for example by placing the die on the substrate and adding a substance such as a brazing material to bond the die and the substrate together to form a die-substrate package. The die-substrate package can be moved through some chambers 351, 352, 353, 354, where the die-substrate package is baked or brazed to bond the die and the substrate to each other. The processed parts may be moved to a calibrator 360 to calibrate the boat die objects, for example by placing the boat die objects back in place if they are straying from the conveyor. An assembler 370 may perform final assembly of the processed parts on the boat / tray, and Figure 3 Another AMHS or OHT vehicle 380 at the far right may transport the boat / tray to the next processing station.

[0088] Figure 4 A portion of a semiconductor fabrication apparatus 400 including a carrier transport tool 440 and a carrier loading device 470 is illustrated according to some embodiments of the present disclosure. Figure 4 The portion of the semiconductor manufacturing equipment 400 shown in FIG. 4 may be a schematic perspective view of an automatic material handling system (AMHS). Figure 4 As shown in FIG. 1 , the AMHS includes: a wafer transport tool 440, such as an OHT system; and a carrier loading device 470, which can be the above-mentioned Figures 1A to 3 The carrier loading device 470 in this example includes a loading port 410 coupled to an interface tool 430, and the interface tool 430 includes a rocker robot 432 for grabbing a die carrier and moving the die carrier between the loading port 410 and the interface tool 430. The rocker robot 432 can be connected to Figure 2B The first robot arm 241 shown in FIG. 2 operates in a similar manner.

[0089] In one example, the OHT system 440 includes a network of stationary tracks or rails 442 operable to guide the movement of one or more wheeled OHT vehicles 450 supported and suspended by the rails 442. In some embodiments, the rails 442 are single rails mounted and suspended from a ceiling 480 and / or wall of a semiconductor fabrication facility. It will be appreciated by those skilled in the art that the rails 442 may have any suitable cross-sectional configuration, so long as the rails 442 can properly support the OHT vehicle 450 for rolling motion.

[0090] The OHT carrier 450 is operable to transport a die carrier 420 having a door 422 through the semiconductor fabrication facility 400 for intra-bay or inter-bay movement. The OHT carrier 450 is configured and structured to accommodate a die carrier 420 holding a plurality of dies and to transport the die carrier 420 from one location to another within the semiconductor fabrication facility 400 in a generally horizontal or lateral direction.

[0091] The OHT vehicle 450 is configured and operable to pick up, raise / lower, accommodate, articulate and release the die carrier 420. In one embodiment, the OHT vehicle 450 includes a motor-driven or pneumatic lifting mechanism 452, which is generally comprised of a clamp assembly including one or more retractable and extendable clamp arms having a clamp at one end thereof that is configured to lock onto a mating hook or flange on the die carrier 420. The lifting mechanism 452 is operable to vertically raise and lower the clamp and attached die carrier 420.

[0092] like Figure 4 As shown in FIG. 4 , the OHT carrier 450 can receive the die carrier 420, transport the die carrier 420 along the rail 442, and release the die carrier 420 onto the platform of the load port 410. The load port 410 can automatically open and store the door 422 of the die carrier 420. The interface tool 430 can automatically move the die carrier 420 from the load port 410 into the interface tool 430 and then feed the die carrier 420 into the processing tool to process at least one die in the die carrier 420, which is similar to the method already described in FIG. Figures 1A to 3In some embodiments, there are multiple processing tools in the semiconductor fabrication equipment 400, and each processing tool for the die frame can be coupled to a corresponding FCLP, which is described above according to Figures 1A to 3 In this case, after at least one die in the die carrier 420 is processed and the load port 410 unloads the die carrier 420, the OHT carrier 450 can pick up the die carrier 420 from the load port 410 and transport the die carrier 420 to the next load port for additional die processing at a processing tool coupled to the next load port.

[0093] Figure 5 is a flow chart illustrating an exemplary method 500 for automatically handling a die carrier according to some embodiments of the present disclosure. Figure 5 As shown in , at operation 502, a die carrier is received at a load port. The die carrier is operable to accommodate a plurality of dies. At operation 504, a first door of the die carrier is opened. At operation 506, the first door is stored in a door storage portion of the load port. At operation 508, the die carrier is moved from the load port to an elevator of an interface tool by a first robot arm. At operation 510, the die carrier is vertically transported by the elevator to a position aligned with an entrance of a semiconductor processing unit.

[0094] At operation 512, the die carrier is moved through the entrance by the second robot. At operation 514, the die carrier is placed into the semiconductor processing unit. At operation 516, the second robot is retracted back to the interface tool. At operation 518, at least one die in the die carrier is processed. At operation 520, a second door of the same model as the first door is retrieved. At operation 522, the second door is closed onto the die carrier. The above-mentioned steps may be changed according to different embodiments of the present disclosure. Figure 5 The order of operations shown in .

[0095] In an embodiment, an apparatus for handling a die carrier is disclosed. The apparatus includes: at least one load port, each configured to load a die carrier, the die carrier being operable to accommodate a plurality of dies; and an interface tool coupled to the at least one load port and a semiconductor processing unit. The interface tool includes: a first robot configured to transport the die carrier from the at least one load port to the interface tool; and a second robot configured to transport the die carrier from the interface tool to the semiconductor processing unit to process at least one die in the die carrier.

[0096] According to some embodiments, the at least one load port includes two load ports respectively coupled to opposite sides of the interface tool.

[0097] According to some embodiments, each of the first and second robotic arms is one of: a shutter arm having a shutter end effector configured to grasp and hold a handle located on top of the die carrier to move the die carrier horizontally and vertically; a clamp arm having a clamp end effector configured to wrap around the entire die carrier to move the die carrier horizontally and vertically; or a swing arm having a first end and a second end, wherein the first end is configured to clamp on the die carrier so that the die carrier swings around the second end.

[0098] According to some embodiments, wherein: the first robotic arm is the shutter arm; and the second robotic arm is the clamping arm.

[0099] According to some embodiments, wherein: the first robotic arm is the swing arm; and the second robotic arm is the shutter arm.

[0100] According to some embodiments, the interface tool further comprises: an elevator configured to vertically move the die carrier.

[0101] According to some embodiments, wherein the die carrier is a frame cassette comprising a plurality of frames, each of the plurality of frames being operable to accommodate a plurality of dies.

[0102] According to some embodiments, the at least one load port comprises: an opening mechanism configured to open a first door of the die carrier; and a door storage portion configured to store the first door before the die carrier is transported to the interface tool.

[0103] According to some embodiments, wherein: the second robot is further configured to transport the die carrier from the semiconductor processing unit to the interface tool after the at least one die is processed; the first robot is further configured to transport the die carrier from the interface tool to the at least one load port; and the at least one load port further comprises a closing mechanism, the closing mechanism being configured to retrieve a second door having the same model as the first door from the door storage portion and close the second door on the die carrier that has been transported from the interface tool to the at least one load port.

[0104] In another embodiment, a system is disclosed. The system includes: a semiconductor processing unit; at least one load port configured to load at least one die carrier, each of the at least one die carrier being operable to accommodate a plurality of dies; and an interface tool coupled to the semiconductor processing unit and coupled to the at least one load port. The interface tool includes: a first robot configured to transport the at least one die carrier from the at least one load port to the interface tool; and a second robot configured to transport the at least one die carrier from the interface tool to the semiconductor processing unit.

[0105] According to some embodiments, the interface tool further includes: a first interface connecting the at least one loading port and the interface tool; and a second interface connecting the interface tool and the semiconductor processing unit.

[0106] According to some embodiments, wherein: the first robot arm is a gate arm having a gate end effector, the gate end effector being configured to grab and hold a handle located on top of the die carrier to move the die carrier through the first interface along a first horizontal direction; and the second robot arm is a clamp arm having a clamp end effector, the clamp end effector being configured to wrap around the entire die carrier to move the die carrier through the second interface along a second horizontal direction, the second horizontal direction being perpendicular to the first horizontal direction.

[0107] According to some embodiments, wherein: the first interface is located above the second interface; and the interface tool further comprises an elevator configured to move the die carrier between the first interface and the second interface in a vertical direction, the vertical direction being perpendicular to both the first horizontal direction and the second horizontal direction.

[0108] According to some embodiments, the interface tool further includes: a third interface connecting the interface tool with the semiconductor processing unit.

[0109] According to some embodiments, wherein: the first robot arm is a swing arm having a first end and a second end; the first end is configured to be clamped on the tube core carrier so that the tube core carrier is swung around the second end along a first horizontal direction through the first interface; and the second robot arm is a gate arm having a gate end effector, the gate end effector is configured to grasp and hold a handle located on the top of the tube core carrier so that the tube core carrier is moved along a second horizontal direction through the second interface or the third interface, and the second horizontal direction is perpendicular to the first horizontal direction.

[0110] According to some embodiments, wherein: the third interface is located above the second interface; and the interface tool further comprises an elevator configured to move the die carrier between the third interface and the second interface in a vertical direction, the vertical direction being perpendicular to both the first horizontal direction and the second horizontal direction.

[0111] According to some embodiments, wherein: the at least one load port comprises a platform configured to receive the die carrier from a transport tool; and the die carrier is transported vertically onto the platform by the transport tool.

[0112] In yet another embodiment, a method is disclosed. The method includes receiving a die carrier at a load port, the die carrier operable to accommodate a plurality of dies, transporting the die carrier from the load port to an interface tool by a first robot, and transporting the die carrier from the interface tool to a semiconductor processing unit by a second robot to process at least one die in the die carrier.

[0113] According to some embodiments, the method for transporting a die carrier further includes: opening a first door of the die carrier before transporting the die carrier from the load port to the interface tool; storing the first door in a door storage portion of the load port; retrieving a second door of the same model as the first door; and closing the second door on the die carrier after processing the at least one die.

[0114] According to some embodiments, wherein: transporting the die carrier from the load port to the interface tool comprises: moving the die carrier onto an elevator by the first robot; the die carrier is vertically transported by the elevator to a position aligned with an entrance of the semiconductor processing unit; and transporting the die carrier from the interface tool to the semiconductor processing unit comprises: moving the die carrier through the entrance by the second robot; placing the die carrier into the semiconductor processing unit; and retracting the second robot.

[0115] The foregoing summarizes the features of several embodiments so that those skilled in the art may better understand various aspects of the present disclosure. Those skilled in the art will appreciate that they may easily use the present disclosure as a basis for designing or modifying other processes and structures to perform the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art will also appreciate that these equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and modifications may be made herein without departing from the spirit and scope of the present disclosure.

Claims

1. A device for transporting a die carrier, comprising: at least one load port, each configured to load a die carrier operable to accommodate a plurality of dies; as well as An interface tool connected to the at least one load port via a first interface along a first direction and connected to the semiconductor processing unit via a second interface along a second direction, wherein the second direction is perpendicular to the first direction, wherein the interface tool comprises: a first robot arm configured to clamp onto the die carrier and swing the die carrier around one end of the first robot arm to be transported from the at least one load port to the interface tool; as well as A second robot arm is configured to grab and hold a handle located on top of the die carrier to transport the die carrier from the interface tool to the semiconductor processing unit to process at least one die in the die carrier. 2 . The apparatus for handling a die carrier according to claim 1 , wherein the at least one load port comprises two load ports respectively coupled to opposite sides of the interface tool.

3. The apparatus for handling a die carrier according to claim 1, wherein the first robot is one of: a shutter arm having a shutter end effector configured to grasp and hold a gripper located atop the die carrier to move the die carrier horizontally and vertically; a gripper arm having a gripper end effector configured to wrap around the entire die carrier to move the die carrier horizontally and vertically; or The swing arm has a first end and a second end, wherein the first end is configured to be clamped on the die carrier so that the die carrier swings around the second end.

4. The apparatus for handling a die carrier according to claim 3, wherein the second robot is one of: a shutter arm having a shutter end effector configured to grasp and hold a gripper located atop the die carrier to move the die carrier horizontally and vertically; a gripper arm having a gripper end effector configured to wrap around the entire die carrier to move the die carrier horizontally and vertically; or The swing arm has a first end and a second end, wherein the first end is configured to be clamped on the die carrier so that the die carrier swings around the second end.

5. The device for handling a die carrier according to claim 4, wherein: The first mechanical arm is the shutter arm; and The second robotic arm is the gripping arm.

6. The apparatus for handling a die carrier according to claim 1, wherein the interface tool further comprises: An elevator is configured to vertically move the die carrier. 7 . The apparatus for handling a die carrier according to claim 1 , wherein the die carrier is a frame cassette comprising a plurality of frames, each of the plurality of frames being operable to accommodate a plurality of dies.

8. The apparatus for handling a die carrier according to claim 1, wherein the at least one load port comprises: an opening mechanism configured to open a first door of the die carrier; as well as A door storage portion is configured to store the first door before the die carrier is transported to the interface tool.

9. The device for handling a die carrier according to claim 8, wherein: The second robot is further configured to transport the die carrier from the semiconductor processing unit to the interface tool after the at least one die is processed; The first robot is further configured to transport the die carrier from the interface tool to the at least one load port; and The at least one load port further includes a closing mechanism configured to retrieve a second door of the same model as the first door from the door storage portion and close the second door on the die carrier that has been transported from the interface tool to the at least one load port.

10. A system for handling a die carrier, comprising: Semiconductor processing units; at least one load port configured to load at least one die carrier, the at least one die carrier each being operable to accommodate a plurality of dies; as well as an interface tool coupled to the semiconductor processing unit and to the at least one load port, wherein the interface tool comprises: a first interface connecting the at least one loading port and the interface tool along a first direction; a second interface connecting the interface tool and the semiconductor processing unit along a second direction different from the first direction; a first robot arm configured to grasp and hold a handle located on top of the die carrier, to transport the at least one die carrier from the at least one load port to the interface tool; and A second robot arm is configured to wrap around the entire die carrier to transport the at least one die carrier from the interface tool to the semiconductor processing unit.

11. The system for handling die carriers of claim 10, wherein the first interface is located above the second interface.

12. The system for handling a die carrier according to claim 11, wherein: The first robot arm is a paddle arm having a paddle end effector configured to move the die carrier through the first interface in a first horizontal direction; and The second robot arm is a gripper arm having a gripper end effector configured to move the die carrier through the second interface along a second horizontal direction, the second horizontal direction being perpendicular to the first horizontal direction.

13. The system for handling a die carrier according to claim 12, wherein: The interface tool also includes an elevator configured to move the die carrier between the first interface and the second interface in a vertical direction, the vertical direction being perpendicular to both the first and second horizontal directions.

14. The system for handling a die carrier according to claim 10, wherein the interface tool further comprises: A third interface connects the interface tool and the semiconductor processing unit.

15. The system for handling a die carrier according to claim 14, wherein: The first mechanical arm is a rocking arm having a first end and a second end; The first end is configured to be clamped on the die carrier so that the die carrier swings around the second end in a first horizontal direction through the first interface; and The second robot arm is a gate arm having a gate end effector, which is configured to grasp and hold a handle located on top of the tube core carrier to move the tube core carrier through the second interface or the third interface along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction.

16. The system for handling a die carrier according to claim 15, wherein: The third interface is located above the second interface; as well as The interface tool also includes an elevator configured to move the die carrier between the third interface and the second interface in a vertical direction that is perpendicular to both the first and second horizontal directions.

17. The system for handling a die carrier according to claim 10, wherein: The at least one load port includes a platform configured to receive the die carrier from a transport tool; and The die carrier is transported vertically onto the platform by the transport tool.

18. A method for handling a die carrier, comprising: receiving a die carrier at the load port, the die carrier being operable to accommodate a plurality of dies; Grasping and holding a handle located on top of the die carrier by a first robot arm to transport the die carrier from the load port to an interface tool; as well as A second robot arm is wrapped around the entire die carrier to transport the die carrier from the interface tool to a semiconductor processing unit to process at least one die in the die carrier.

19. The method of handling a die carrier according to claim 18, further comprising: opening a first door of the die carrier before transferring the die carrier from the load port to the interface tool; storing the first door in a door storage portion of the load port; Retrieving a second door of the same model as the first door; as well as After processing the at least one die, the second door on the die carrier is closed.

20. The method of handling a die carrier according to claim 18, wherein: Transporting the die carrier from the load port to the interface tool includes: moving the die carrier onto an elevator by the first robot; The die carrier is vertically transported by the elevator to a position aligned with an entrance of the semiconductor processing unit; and Transporting the die carrier from the interface tool to the semiconductor processing unit comprises: moving the die carrier through the inlet by the second robot; placing the die carrier into the semiconductor processing unit; and Retract the second robotic arm.

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