Equipment and method for removing excess glue after semiconductor plastic packaging

Abstract

The present invention relates to a device and method for removing glue overflow after semiconductor plastic packaging, the device comprises: a frame; a support wheel rotatably mounted on the frame; a conveying mechanism mounted on the frame and arranged on both sides of the support wheel, for conveying products to be removed; a mounting frame mounted on the frame and adjustable in height; a grinding wheel rotatably mounted on the mounting frame, correspondingly arranged above the support wheel; a driving member mounted on the mounting frame and connected to the grinding wheel driving, which can drive the grinding wheel to rotate, and then the surface of the product to be removed located on the support wheel can be polished to remove the glue overflow through the rotation of the grinding wheel; a controller mounted on the frame and controlling the mounting frame to be adjusted in height, and the controller is also connected to the driving member for control. The present invention can automatically and effectively remove the glue overflow that is thick and covers the entire mounting surface on the mounting products, saves the steps of manual polishing, and can accurately control the thickness of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a device and method for removing overflow glue after semiconductor plastic packaging. Background Art

[0002] In the current semiconductor packaging and testing industry, most of the substrate materials used are copper substrates, because copper materials have excellent electrical and thermal conductivity, and are the main choice for electronic device product frames. In addition, some frames use other metals or alloys as the substrate, and a layer of copper or other metals (such as nickel, etc.) is plated on the surface. Most of the plastic encapsulation materials are epoxy resins, and different de-overflow processes are required depending on the filler.

[0003] The early de-burst process was very simple, for example, using 50% sulfuric acid solution or even hydrochloric acid solution, soaking at high temperature to separate the overflow from the substrate, and finally using a copper brush to brush off the overflow. However, this process has defects. The first is the safety issue. Sulfuric acid is a highly corrosive acid, which is more corrosive at high temperatures, so it is a huge safety hazard for operators. Secondly, the reaction rate of high-concentration sulfuric acid with the copper substrate at high temperatures is difficult to control, which will cause local over-corrosion and damage the substrate. Thirdly, there is no organic solvent in the solution, and the softening effect on the overflow is very poor, which often results in unclean overflow removal. After improving the process flow and adding some alkaline organic solvents to the solution, the currently popular de-burst process has gradually been formed.

[0004] The existing method of degumming is chemical solution immersion + high-pressure water washing. The process is to use alkaline chemicals to immerse the product frame in the chemical solution under heating to fully soften the overflow glue attached to the lead frame, and then use high-pressure water to separate and remove the softened overflow from the product frame.

[0005] Alkaline deburring solution is currently the most widely used, relatively mature and complete process. Its main components include alkaline organic solvents and other additives (including corrosion inhibitors, surfactants, penetrants, etc.). The specific working mechanism is as follows:

[0006] The main function of strong alkali in the solution. First, to separate the overflow from the matrix. In an alkaline solution, copper will undergo an oxidation reaction under the action of oxygen in the air to generate basic salts, and can enter the solution under the action of the complexing agent in the additive. This reaction is very slow at low temperatures, but the reaction speed will be significantly accelerated at high temperatures, so the alkaline overflow removal solution needs to be heated to more than 70 degrees. Second, control the pH value of the solution. The organic solvent selected in the alkaline solution is more active under alkaline conditions, which can ensure the softening efficiency of the organic solvent and thus ensure the softening effect.

[0007] However, with the advancement of science and technology, more and more electronic products tend to be larger and thinner, and the market demand for SMT integrated circuits is growing. For SMT products, such as QFN (quad flat non-leaded package) products, the glue overflow is black, very thick and appears on the entire mounting surface. The existing glue removal method cannot meet the requirements of SMT chips for the overflow on the frame of this type of product. In the prior art, for the glue overflow treatment of SMT chips, it is necessary to manually use sandpaper to polish after chemical immersion to remove the glue overflow, which wastes both chemical solutions and manpower and material resources. In addition, the thickness of the product cannot be accurately controlled by manual polishing, which increases the manufacturing cost of the enterprise. Summary of the invention

[0008] The purpose of the present invention is to overcome the defects of the prior art and provide a device and method for removing excess glue after semiconductor plastic packaging, so as to solve the problem that the existing excess glue removal of mounting products needs to be removed by manual grinding, which not only wastes chemical solutions but also wastes manpower and material resources, and there is also the problem that the thickness of the product cannot be accurately controlled and the cost of the enterprise is increased.

[0009] The technical solution to achieve the above purpose is:

[0010] The present invention provides a device for removing excess glue after semiconductor plastic packaging, comprising:

[0011] frame;

[0012] A support wheel rotatably mounted on the frame;

[0013] A conveying mechanism installed on the frame, the conveying mechanism being arranged on both sides of the supporting wheel, and conveying the product to be debonded through the conveying mechanism;

[0014] A mounting frame mounted on the frame and capable of being raised and lowered;

[0015] A grinding wheel rotatably mounted on the mounting frame, wherein the grinding wheel is correspondingly arranged above the supporting wheel;

[0016] A driving member mounted on the mounting frame and drivingly connected to the grinding wheel, wherein the grinding wheel is driven by the driving member to rotate, and the surface of the product to be debonded located on the supporting wheel can be polished to remove excess glue through the rotation of the grinding wheel; and

[0017] A controller is installed on the frame and controls the mounting frame to perform lifting and lowering adjustment. The controller is also control-connected to the driving member.

[0018] The overflow glue removal device of the present invention automatically conveys the product to be de-glueed through a conveying mechanism, and the product is conveyed to the support wheel by the conveying mechanism, and then the overflow glue on the product is removed by the rotation of the provided grinding wheel, which can automatically and effectively remove the thick overflow glue that appears on the mounting product and covers the entire mounting surface, saving the steps of manual grinding, saving manpower and material resources. Moreover, by removing the overflow glue through the device, the thickness of the product can be accurately controlled.

[0019] A further improvement of the semiconductor post-plastic encapsulation glue removal device of the present invention is that it also includes a swingably adjustable clamping wheel mounted on the frame, wherein the clamping wheel is arranged on both sides of the grinding wheel and is located above the corresponding conveying mechanism;

[0020] The pressing wheel is swung to adjust the pressing wheel so that the pressing wheel is pressed tightly on the product to be debonded.

[0021] A further improvement of the semiconductor post-plastic encapsulation glue removal device of the present invention is that it also includes a sensor installed on the frame and arranged corresponding to the clamping wheel, and the sensor is connected to the controller;

[0022] The sensor detects the swing of the pressing wheel to generate a detection signal which is sent to the controller;

[0023] The controller is also connected to the conveying mechanism, and controls and adjusts the conveying speed of the conveying mechanism after receiving the detection signal.

[0024] A further improvement of the semiconductor post-plastic encapsulation glue removal device of the present invention is that it also includes a support frame supported on the frame;

[0025] A swing shaft is rotatably mounted on the support frame, the swing shaft is connected to the clamping wheel via an inclined rod, and a push rod is also connected to the swing shaft;

[0026] A push spring is provided on the support frame at a position corresponding to the push rod. The push spring is connected to the push rod and applies elastic force to the push rod so that the push rod drives the swing shaft to rotate, thereby causing the pressure wheel to swing and press tightly on the product to be debonded.

[0027] A further improvement of the semiconductor post-plastic encapsulation glue removal device of the present invention is that it also includes a track frame supported on the frame and a telescopic adjustment member installed on the track frame;

[0028] The mounting frame is connected to the telescopic adjustment member;

[0029] The telescopic adjustment of the telescopic adjustment member can be used to lift and lower the mounting frame relative to the track frame, thereby adjusting the distance between the mounting frame and the supporting wheel.

[0030] The present invention also provides a method for removing glue by using the above-mentioned semiconductor post-plastic encapsulation glue removal device, comprising the following steps:

[0031] Providing a product to be debonded, and placing the product to be debonded on the conveying mechanism;

[0032] Starting the conveying mechanism and the driving member, using the conveying mechanism to convey the product to be debonded between the supporting wheel and the grinding wheel, using the driving member to drive the grinding wheel to rotate, and then the rotating grinding wheel grinds the surface of the product to be debonded to remove the excess glue; and

[0033] During the process of removing the overflowed glue, the controller collects the driving current of the driving component in real time, and performs lifting and lowering control on the mounting frame according to the magnitude of the driving current collected in real time, so as to control the driving current of the driving component to remain stable.

[0034] A further improvement of the method of the present invention is that the removal device is further provided with a swingably adjustable clamping wheel, and the clamping wheel is arranged on both sides of the grinding wheel;

[0035] During the process of removing the overflowed glue, the pressing wheel is adjusted so that the pressing wheel is pressed tightly against the product to be de-glueed.

[0036] A further improvement of the method of the present invention is that, during the process of removing the overflowed glue, the controller also collects the swing condition of the pinch wheel in real time, and controls and adjusts the conveying speed of the conveying mechanism based on the collected swing condition of the pinch wheel.

[0037] A further improvement of the method of the present invention is that when the driving current collected by the controller changes, the controller controls the mounting frame to perform lifting and movement adjustment, and at the same time the controller controls and adjusts the conveying speed of the conveying mechanism.

[0038] A further improvement of the method of the present invention is that when controlling and adjusting the conveying speed of the conveying mechanism, the conveying speed of the conveying mechanism is adjusted to be smaller than the moving speed of the mounting frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a structural schematic diagram of a first embodiment of a device for removing overflow glue after semiconductor plastic packaging according to the present invention.

[0040] Figure 2 It is a structural schematic diagram of a second embodiment of the semiconductor post-plastic packaging overflow adhesive removal device of the present invention.

[0041] Figure 3This is a working principle diagram of the second embodiment of the semiconductor post-plastic packaging overflow glue removal device of the present invention. DETAILED DESCRIPTION

[0042] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0043] See also Figure 1 The present invention provides a device and method for removing excess glue after semiconductor plastic packaging, which is used to solve the problem that the existing chemical immersion method has poor effect in removing excess glue on the surface of mounted chips. The removal device of the present invention can automatically polish and remove the excess glue on the product, saving the step of manual polishing, and the polishing amount of the removal device is accurately controllable. After polishing, the surface quality of the product is uniform, the roughness and color are consistent, and the quality of the product can be improved. The device and method for removing excess glue after semiconductor plastic packaging of the present invention are described below in conjunction with the accompanying drawings.

[0044] See also Figure 1 , shows a schematic diagram of the structure of the first embodiment of the semiconductor plastic packaging post-overflow adhesive removal device of the present invention. Figure 1 , the structure of the device for removing overflow glue after semiconductor plastic packaging of the present invention is described.

[0045] like Figure 1As shown, the semiconductor post-plastic encapsulation overflow removal device of the present invention includes a frame 21, a support wheel 22, a conveying mechanism 23, a mounting frame 24, a grinding wheel 25, a driving member and a controller; the support wheel 22 is rotatably mounted on the frame 21, and the support wheel 22 can rotate freely on the frame 21; the conveying mechanism 23 is mounted on the frame 21, and the conveying mechanism 23 is arranged on both sides of the support wheel 22, and the product 10 to be de-glueed is transported by the conveying mechanism 23, and the conveying directions of the conveying mechanisms 23 on both sides of the support wheel 22 are consistent, and the product 10 to be de-glueed is transported to the support wheel 22 by the conveying mechanism 23 located on one side of the support wheel 22, and after the product 10 to be de-glueed passes through the support wheel 22, its front side is placed on the conveying mechanism 23 on the other side, and the arrangement of the conveying mechanisms 23 on both sides can transport the product 10 to be de-glueed from one side of the frame 21 to the other side. The mounting frame 24 is installed on the frame 21 in a lifting and adjusting manner. The mounting frame 24 is moved downward to approach the support wheel 22 or moved upward to move away from the support wheel 22 through the lifting and adjusting manner. The grinding wheel 25 is rotatably installed on the mounting frame 24. The grinding wheel 25 is correspondingly arranged above the support wheel 22. There is a certain gap between the grinding wheel 25 and the support wheel 22. The gap allows the product 10 to pass through. The support wheel 22 supports the bottom of the product 10 to be removed. The bottom of the grinding wheel 25 contacts the surface of the product 10 to be removed, and then the surface of the product 10 to be removed is polished by the rotation of the grinding wheel 25 to remove the excess glue. The driving member is installed on the mounting frame 24. The driving member is connected to the grinding wheel 25. The grinding wheel 25 can be driven to rotate by the driving member. Then, the surface of the product 10 to be removed located on the support wheel 22 can be polished to remove the excess glue. The controller is mounted on the frame 21, and controls the mounting frame 24 to perform lifting and lowering adjustment. The controller is also connected to the driving member control. The controller can control the operation of the driving member to realize the control of the rotation of the grinding wheel 25, thereby achieving the effect of accurately controlling the grinding amount and realizing accurate grinding of the product.

[0046] In a specific embodiment of the present invention, Figure 1 and Figure 3As shown, the grinding wheel 25 is a cylindrical structure, and the support wheel 22 is also a cylindrical structure. The central axis of the grinding wheel 25 and the support wheel 22 are aligned vertically, and the portion of the grinding wheel 25 in contact with the surface of the product 10 to be debonded is a straight line, and the portion of the support wheel 22 in contact with the bottom surface of the product 10 to be debonded is also a straight line. The two straight lines are aligned vertically, thereby ensuring that when the product 10 to be debonded is polished, the upper and lower surfaces of the product 10 to be debonded are evenly stressed, avoiding deformation, warping, and other problems of the product. The portion of the grinding wheel 25 in contact with the surface of the product 10 to be debonded is a straight line, and the polished straight line is expanded into a surface by moving the product 10 to be debonded forward, thereby achieving complete polishing of the upper surface of the product 10 to be debonded.

[0047] Preferably, the grinding wheel 25 is a soft grinding wheel, which can evenly fit the surface of the product 10 to be debonded, thereby improving the grinding effect. The soft grinding wheel is made of non-woven fabric, abrasive and binder, wherein the non-woven fabric forms a sponge-like structure with large pores, and the abrasive is evenly distributed in the pores of the non-woven fabric. The binder is preferably a resin material, such as epoxy resin, and the abrasive can be diamond or silicon carbide. The support wheel 22 is a soft rubber wheel with certain elasticity and deformation ability. The soft rubber wheel is used to support the product 10 to be debonded, and the deformation of the soft rubber wheel can be used to absorb and buffer the short-side warping of the product to a certain extent, thereby improving the structural stability of the product.

[0048] In a specific embodiment of the present invention, a controller is connected to a driving member control, and the controller monitors the driving current of the driving member. When the driving current changes, the controller lifts and lowers the mounting frame 24 so that the mounting frame 24 can lift and lower the grinding wheel 25 to restore the driving current to the state before the change. That is, the controller achieves the effect of maintaining the driving current stable. While maintaining the driving current stable, in order to ensure the grinding effect, the controller controls the lifting and lowering speed of the mounting frame 24 and the conveying speed of the conveying mechanism 23, so that the conveying speed of the conveying mechanism 23 is less than the lifting and lowering speed of the mounting frame 24, that is, the product 10 to be debonded is slowly conveyed forward, while the grinding wheel 25 quickly moves downward and rotates, which can ensure that the excess glue on the surface of the product is polished clean under the premise of stable driving current. The working principle of this part is explained below: the thickness of the overflow glue on the surface of the product is uneven. When the grinding wheel 25 contacts the thicker overflow glue, the resistance encountered by the grinding wheel 25 becomes larger, so that the driving current of the driving part will become larger. For this reason, the controller monitors the driving current of the driving part in real time. When the driving current becomes larger, the height of the grinding wheel 25 is adjusted upward to reduce the tightness of the contact between the grinding wheel 25 and the product surface, so that the driving current can be reduced. By monitoring the size of the driving current at the next moment, repeatedly adjusting the height of the grinding wheel 25 can make the driving current return to the state before the change, thereby maintaining the stability of the driving current. After the height of the grinding wheel 25 is raised, the grinding amount of the thicker overflow glue is constant. If the conveying speed of the product remains unchanged at this time, the thicker overflow glue cannot be polished clean. In order to improve the grinding effect, the controller synchronously controls the conveying speed of the transmission mechanism 23 when monitoring the change of the driving current, and adjusts the conveying speed to a smaller value. Specifically, the conveying speed and the lifting speed of the grinding wheel can be controlled according to the proportion of the change of the driving current, so that the ratio of the lifting speed to the conveying speed is consistent with the proportion of the change of the driving current. At this time, the product moves forward slowly, and the grinding wheel 25 grinds the surface of the product, causing the driving current to continue to change. The controller continues to lift and lower the grinding wheel. At this time, the working process of the grinding wheel 25 is equivalent to gradually moving downward until the overflow glue is completely polished clean.

[0049] The driving current of the grinding wheel 25 is stable, which can make the rotation working state of the grinding wheel 25 stable, the grinding effect on the product is stable, and the force applied to the product is also kept stable, avoiding the risk of deformation, warping, etc. caused by sudden changes in the force, thereby ensuring the quality and yield of the product.

[0050] In a specific embodiment of the present invention, Figure 2 and Figure 3As shown, the removal device of the present invention further includes a swingable pressure wheel 26 mounted on the frame 21. The pressure wheel 26 is arranged on both sides of the grinding wheel 25 and is located above the corresponding conveying mechanism 23. The pressure wheel 26 is swung to adjust so that the pressure wheel 26 is pressed against the product 10 to be debonded. The pressure wheel 26 can swing upward or downward by swinging adjustment. The downward swing adjustment of the pressure wheel 26 can make the pressure wheel 26 press against the upper surface of the product 10 to be debonded. There are two pressure wheels 26, which are arranged on both sides of the grinding wheel 25. By pressing the two sides of the grinding part of the product with two pressure wheels 26, the product can be leveled to avoid deformation and warping of the product during the grinding process.

[0051] Preferably, the pressing wheel 26 is a soft rubber wheel having certain elasticity and deformation ability. By pressing the product 10 to be debonded, the soft rubber wheel can avoid damaging the product 10 to be debonded, thereby effectively protecting the product 10 to be debonded.

[0052] Furthermore, a support frame 27 is supported on the frame 21, and a swing shaft 271 is rotatably mounted on the support frame 27. The swing shaft 271 is connected to the pressure wheel 26 through an inclined rod 272, and the pressure wheel 26 can be swung and adjusted by the rotation adjustment of the swing shaft 271; a push rod 273 is also connected to the swing shaft 271; a push spring 274 is provided at the position corresponding to the push rod 273 on the support frame 27, and the push spring 274 is connected to the push rod 273 and applies elastic force to the push rod 273 so that the push rod 273 drives the swing shaft 271 to rotate, thereby causing the pressure wheel 26 to swing and press against the product 10 to be debonded. That is, the push spring 274 always applies a push elastic force to the push rod 273, so that the swing shaft 271 rotates toward the direction of the grinding wheel 25 and then moves downward with the pressure wheel 26 through the inclined rod 272, so that the pressure wheel 26 presses against the product. Preferably, both ends of the pinch wheel 26 are rotatably connected to the inclined rod 272 via bearings, and the pinch wheel 26 can rotate automatically, and the friction resistance of the pinch wheel 26 to the forward conveying movement of the product can be reduced by the rotation.

[0053] In order to improve the stability of the push spring 274, a limit column is provided on the support frame 27 corresponding to the push spring 274. The limit column is inserted into the push spring 274, and there is an adjustable distance between the limit column and the push rod 273. The limit column plays a role of limiting the push spring 274.

[0054] Preferably, the support frame 27 includes a pair of support plates, which are erected opposite to each other on the frame 21, and a cross beam 275 is supported and connected between the pair of support plates. A swing shaft 271 is supported between the pair of support plates, and the swing shaft 271 is rotatably connected to the support plate through a bearing. The push rod 273 arranged on the swing shaft 271 is vertically arranged, and a push spring 274 is supported and connected between the push rod 273 and the cross beam 275.

[0055] In a specific embodiment of the present invention, the removal device of the present invention also includes a sensor installed on the frame 21 and arranged corresponding to the pressure wheel 26. The sensor is connected to the controller. The sensor is used to detect the swing of the pressure wheel 26. When the sensor detects the swing of the pressure wheel 26, it generates a detection signal and sends the detection signal to the controller. The controller is also controlled and connected to the conveying mechanism 23. After receiving the detection signal, the controller controls and adjusts the conveying speed of the conveying mechanism 23.

[0056] When the overflow glue on the surface of the product 10 to be de-glueed is thick, the overflow glue will apply an upward thrust to the pressure wheel 26 when passing through the pressure wheel 26, causing the pressure wheel 26 to swing upward. The present invention detects the swing of the pressure wheel 26 by setting a sensor so that the thick overflow glue can be known in advance before it reaches the grinding wheel 25, and then the conveying speed of the conveying mechanism 23 is reduced in advance by the controller to prevent the conveying mechanism 23 from being too fast and making it impossible for the grinding wheel 25 to grind the thick overflow glue clean. Preferably, in the actual production process, the thickness of the overflow glue on the product is statistically analyzed to obtain the average thickness of the overflow glue, and the overflow glue exceeding the average thickness is defined as thicker. The swing angle of the pressure wheel 26 can be calculated by the average thickness of the overflow glue. The sensor detects the actual swing of the pressure wheel 26. When the actual swing is greater than the swing angle corresponding to the average thickness of the overflow glue, the sensor generates a detection signal, which then notifies the controller, and the controller controls the conveying mechanism 23 to reduce the conveying speed. Preferably, a set speed may be pre-set in the controller, and the set speed is lower than the normal conveying speed of the conveying mechanism 23. When the controller receives the detection signal from the sensor, the conveying speed of the conveying mechanism 23 is controlled to be adjusted to the set speed.

[0057] In a preferred embodiment, the sensor is a laser sensor, which is supported on the frame 21. The laser sensor is located corresponding to the pressure wheel 26. When the pressure wheel 26 is in a normal state, the laser sensor will not be triggered. When the pressure wheel 26 swings upward and blocks the laser sensor, the laser sensor is triggered to form a detection signal.

[0058] In another preferred embodiment, the sensor is a distance sensor, which is mounted on the support frame 27. The distance sensor is used to measure the distance between itself and the inclined rod 272. When the clamping wheel 26 swings upward, the inclined rod 272 also moves upward, so that the distance sensor detects the change in distance and forms a detection signal.

[0059] In a specific embodiment of the present invention, Figure 1 and Figure 2 As shown, the removal device of the present invention also includes a track frame 29 supported on the frame 21 and a telescopic adjustment member 31 installed on the track frame 29; the mounting frame 24 is connected to the telescopic adjustment member 31, and the mounting frame 24 can be raised and lowered relative to the track frame 29 through the telescopic adjustment of the telescopic adjustment member 31, thereby adjusting the distance between the mounting frame 24 and the support wheel 22.

[0060] Preferably, the track frame 29 and the mounting frame 24 are both door-type frames, and a telescopic adjustment member 31 is provided on the top of the track frame 29, and the telescopic adjustment member 31 can be telescopically adjusted; the mounting frame 24 is placed on the inner side of the track frame 29, and the telescopic adjustment member 31 can be telescopically adjusted so that the mounting frame 24 can be moved up and down relative to the track frame 29.

[0061] In order to improve the stability of the up and down movement adjustment of the mounting frame 24, a vertical guide rail 291 is provided on the track frame 29; a slider is provided on the mounting frame 24 corresponding to the vertical guide rail 291, and the slider is slidably arranged on the vertical guide rail 291. Through the sliding cooperation between the vertical guide rail 291 and the slider, the up and down movement of the mounting frame 24 can be limited and guided. In a preferred embodiment, the vertical guide rail 291 is a square rail, which is fixedly connected to the inner side of the track frame 29, and a slider is arranged on the outer side of the mounting frame 24. The slider is provided with a square groove, and the slider is clamped on the square rail through the square groove, so that the slider can slide and adjust along the square rail. In another preferred embodiment, the vertical guide rail 291 is a rail groove arranged on the inner side of the track frame 29, and the slider on the mounting frame 24 is inserted in the rail groove, and the slider can slide and adjust in the rail groove.

[0062] In a preferred embodiment of the present invention, the telescopic adjustment member is a cylinder, the piston rod of the cylinder is fixedly connected to the mounting frame, and the mounting frame can be driven to move up and down by the telescopic movement of the piston rod. The controller is control-connected to the cylinder to control the operation of the cylinder.

[0063] In another preferred embodiment of the present invention, the telescopic adjustment member is a push rod motor, a push rod on the push rod motor is fixedly connected to the mounting frame, the mounting frame can be driven to move up and down for adjustment through the telescopic movement of the push rod, and the controller is control-connected to the push rod motor.

[0064] In a specific embodiment of the present invention, the driving member is a motor, and the motor shaft of the motor is driven and connected to the grinding wheel 25 through a belt drive. Specifically, a pulley is fixedly connected to the shaft of the grinding wheel 25, and a pulley is also fixedly connected to the motor shaft of the motor. The belt is put on the two pulleys, so that the rotation of the motor shaft can be transmitted to the shaft of the grinding wheel 25 through the two pulleys and the belt, thereby driving the grinding wheel 25 to rotate.

[0065] Preferably, the controller is connected to the motor control, and the controller can detect the driving current of the motor. Specifically, a current sensor can be installed at the power supply of the motor, and the driving current of the motor is detected by the current sensor, and then the current sensor is connected to the controller to send the detected driving current to the controller.

[0066] In a specific embodiment of the present invention, Figure 3 As shown, the removal device of the present invention further includes a plurality of auxiliary wheels 28 rotatably mounted on the frame 21, and the auxiliary wheels 28 are arranged above the conveying mechanism 23. When the product 10 to be debonded is conveyed on the conveying mechanism 23, if the product 10 to be debonded passes through the auxiliary wheels 28, the auxiliary wheels 28 press the product, thereby achieving the effect of fixing and flattening the product.

[0067] In a specific embodiment of the present invention, Figure 1 As shown, the transmission mechanism 23 is a conveyor belt, which includes a belt body 231, a driving shaft 232 and a driven shaft 233. The driving shaft 232 and the driven shaft 233 are both rotatably mounted on the frame 21 through bearings. A driving motor is provided at the driving shaft 232 to drive the driving shaft 232 to rotate. The belt body 231 is sleeved on the driving shaft 232 and the driven shaft 233. The belt body 231 is driven to rotate by the rotation of the driving shaft 232, thereby conveying the product. In order to improve the stability of the product, a positioning hole is provided on the frame of the product, and a positioning column matched with the positioning hole is provided on the conveyor belt. When the product is placed on the conveyor belt, the positioning column on the conveyor belt is inserted into the positioning hole of the product, thereby ensuring the stability of the product during the conveying process.

[0068] In a specific embodiment of the present invention, Figure 1 and Figure 2 As shown, a platform surface 211 is formed on the top of the frame 21 of the present invention, and a pair of vertical plates 212 are provided on the platform surface 211. The pair of vertical plates 212 are used to install the support wheels 22, the conveying mechanism 23, the support frame 27 and the track frame 29.

[0069] The present invention also provides a method for removing glue using the above-mentioned removal device, and the method is described below.

[0070] The method for removing glue by using the above-mentioned semiconductor post-plastic encapsulation glue removal device comprises the following steps:

[0071] like Figure 1 As shown, a product 10 to be debonded is provided, and the product 10 to be debonded is placed on a conveying mechanism 23;

[0072] The conveying mechanism 23 and the driving member are started, and the product 10 to be debonded is fed between the supporting wheel 22 and the grinding wheel 25 by the conveying mechanism 23, and the grinding wheel 25 is driven to rotate by the driving member, so that the rotating grinding wheel 25 grinds the surface of the product 10 to be debonded to remove the excess glue;

[0073] During the process of removing the overflowed glue, the controller collects the driving current of the driving component in real time, and controls and adjusts the mounting frame 24 according to the magnitude of the driving current collected in real time, so as to control the driving current of the driving component to remain stable.

[0074] Furthermore, the controller collects the driving current of the driving component in real time, and compares the driving current collected in real time with a set current value. When the driving current is inconsistent with the set current value, the controller adjusts the mounting frame 24 up and down, collects the driving current at the next moment after adjustment and compares it with the set current value, and if it is inconsistent, continues to raise and lower the mounting frame 24 until the driving current is consistent with the set current value. Specifically, the change in driving current is caused by the thicker overflow glue on the product, and the driving current will become larger at this time. The controller moves the mounting frame 24 upward to adjust it so that the driving current remains stable.

[0075] In an improvement, in order to improve the grinding effect, when the controller detects that the driving current has changed, it controls the mounting frame to adjust the lifting and lowering while also controlling and adjusting the conveying speed of the conveying mechanism, and adjusts the conveying speed of the conveying mechanism to be less than the lifting and lowering speed of the mounting frame, so as to clean the overflow glue on the surface of the product. Preferably, when the controller detects that the driving current has changed, it calculates the change ratio of the driving current, and controls and adjusts the conveying speed and the lifting and lowering speed of the grinding wheel according to the change ratio of the driving current, so that the ratio of the lifting and lowering speed to the conveying speed is consistent with the change ratio of the driving current.

[0076] In a specific embodiment of the present invention, Figure 2 and Figure 3 As shown, the removal device of the present invention is also provided with a swingably adjustable clamping wheel 26, and the clamping wheel 26 is arranged on both sides of the grinding wheel 25;

[0077] In the process of removing the overflow glue, the pressing wheel 26 is adjusted to press the pressing wheel 26 on the product to be removed. By pressing the two sides of the product grinding part with two pressing wheels 26, the product can be leveled to avoid deformation and warping of the product during the grinding process.

[0078] Furthermore, in the process of removing the overflowed glue, the controller also collects the swing condition of the pressing wheel in real time, and controls and adjusts the conveying speed of the conveying mechanism according to the collected swing condition of the pressing wheel.

[0079] Specifically, a sensor is provided at the pinch wheel to detect the swing of the pinch wheel. When the overflowed glue on the product passing through the pinch wheel is thicker, the thick overflowed glue exerts an upward thrust on the pinch wheel, causing the pinch wheel 26 to swing upward. The present invention detects the swing of the pinch wheel 26 by providing a sensor so that the thick overflowed glue can be known in advance before it reaches the grinding wheel 25, and then the conveying speed of the conveying mechanism 23 is reduced in advance through the controller to prevent the conveying mechanism 23 from being too fast and making it impossible for the grinding wheel 25 to grind the thick overflowed glue clean.

[0080] Preferably, after receiving the detection signal sent by the sensor, the controller controls the conveying mechanism to reduce the conveying speed so that the product moves slowly toward the grinding wheel, thereby improving the effect of grinding thicker overflow glue.

[0081] The beneficial effects of the semiconductor post-plastic encapsulation glue removal device and method of the present invention include: real-time monitoring of the driving current during the grinding process and adjusting the height of the grinding wheel according to the change of the driving current, which can maintain a stable driving current, ensure the accuracy of grinding, and overcome the problem of slight deformation and warping of the product. The transmission mechanism and the support wheel form a three-point support, which can effectively adapt to the unevenness of the long side direction of the product, and combined with the set clamping wheel, it can achieve the effect of fixing and flattening the product.

[0082] The present invention is described in detail above in conjunction with the embodiments of the drawings, and those skilled in the art can make various variations of the present invention according to the above description. Therefore, certain details in the embodiments should not constitute limitations of the present invention, and the scope of protection of the present invention shall be defined by the scope of the attached claims.

Claims

1. A device for removing excess glue after semiconductor plastic packaging, characterized in that: include: frame; A support wheel rotatably mounted on the frame; A conveying mechanism installed on the frame, the conveying mechanism being arranged on both sides of the supporting wheel, and conveying the product to be debonded through the conveying mechanism; A mounting frame mounted on the frame and capable of being raised and lowered; A grinding wheel rotatably mounted on the mounting frame, wherein the grinding wheel is correspondingly arranged above the supporting wheel; A driving member mounted on the mounting frame and drivingly connected to the grinding wheel, wherein the grinding wheel is driven by the driving member to rotate, and the surface of the product to be debonded located on the supporting wheel can be polished to remove the excess glue through the rotation of the grinding wheel; as well as A controller installed on the frame and controlling the mounting frame to perform lifting and lowering adjustment, the controller being also controllably connected to the driving member; The central axes of the grinding wheel and the supporting wheel are aligned vertically, the contact portion between the grinding wheel and the surface of the product to be debonded is a straight line, and the contact portion between the supporting wheel and the bottom surface of the product to be debonded is also a straight line, and the two straight lines are aligned vertically; The controller monitors the driving current of the driving member. When the driving current changes, the controller raises and lowers the mounting frame so that the mounting frame and the grinding wheel are raised and lowered to restore the driving current to the state before the change. The controller controls the lifting speed of the mounting frame and the conveying speed of the conveying mechanism, so that the conveying speed of the conveying mechanism is lower than the lifting speed of the mounting frame, so that the product to be debonded is slowly conveyed forward, while the grinding wheel moves downward and rotates quickly, which can ensure that the excess glue on the product surface is polished clean under the premise of stable driving current; It also includes a clamping wheel mounted on the frame and capable of swinging and adjusting, wherein the clamping wheel is arranged on both sides of the grinding wheel and is located above the corresponding transmission mechanism; The pressing wheel is adjusted by swinging so that the pressing wheel is pressed tightly on the product to be debonded; It also includes a sensor installed on the frame and arranged corresponding to the pinch wheel, and the sensor is connected to the controller; The sensor detects the swing of the pressing wheel to generate a detection signal which is sent to the controller; The controller is also connected to the conveying mechanism, and controls and adjusts the conveying speed of the conveying mechanism after receiving the detection signal; When the overflow glue on the surface of the product to be de-glueed is thicker, the overflow glue will apply an upward thrust to the pressure wheel when passing through the pressure wheel, causing the pressure wheel to swing upward. The sensor detects the swing of the pressure wheel, and then the controller reduces the conveying speed of the conveying mechanism in advance. The thickness of the overflow glue on the product is statistically analyzed to obtain the average thickness of the overflow glue. The overflow glue exceeding the average thickness is defined as thicker. The swing angle of the pressure wheel can be calculated based on the average thickness of the overflow glue. The sensor detects the actual swing of the pressure wheel. When the actual swing is greater than the swing angle corresponding to the average thickness of the overflow glue, the sensor generates a detection signal, which then notifies the controller, and the controller controls the conveying mechanism to reduce the conveying speed.

2. The semiconductor post-plastic encapsulation glue removal device according to claim 1, characterized in that: Also includes a support frame supported on the frame; A swing shaft is rotatably mounted on the support frame, the swing shaft is connected to the clamping wheel via an inclined rod, and a push rod is also connected to the swing shaft; A push spring is provided on the support frame at a position corresponding to the push rod. The push spring is connected to the push rod and applies elastic force to the push rod so that the push rod drives the swing shaft to rotate, thereby causing the pressure wheel to swing and press tightly on the product to be debonded.

3. The semiconductor post-plastic encapsulation glue removal device according to claim 1, characterized in that: It also includes a track frame supported on the frame and a telescopic adjustment member installed on the track frame; The mounting frame is connected to the telescopic adjustment member; The telescopic adjustment of the telescopic adjustment member can be used to lift and lower the mounting frame relative to the track frame, thereby adjusting the distance between the mounting frame and the supporting wheel.

4. A method for removing glue using the semiconductor post-plastic encapsulation glue removal device according to claim 1, characterized in that: The steps include: Providing a product to be debonded, and placing the product to be debonded on the conveying mechanism; The conveying mechanism and the driving member are started, the product to be debonded is fed between the supporting wheel and the grinding wheel by the conveying mechanism, the grinding wheel is driven to rotate by the driving member, and the rotating grinding wheel grinds the surface of the product to be debonded to remove the excess glue; as well as In the process of removing the overflowed glue, the controller collects the driving current of the driving member in real time, and performs lifting and lowering control on the mounting frame according to the magnitude of the driving current collected in real time, so as to control the driving current of the driving member to remain stable; The removal device is also provided with a swingably adjustable clamping wheel, which is arranged on both sides of the grinding wheel; During the process of removing the overflowed glue, the pressing wheel is adjusted so that the pressing wheel is pressed tightly against the product to be removed; In the process of removing the overflowed glue, the controller also collects the swing condition of the pinch wheel in real time, and controls and adjusts the conveying speed of the conveying mechanism according to the collected swing condition of the pinch wheel; When the driving current collected by the controller changes, the controller controls the mounting frame to perform lifting and movement adjustment, and at the same time, the controller controls and adjusts the conveying speed of the conveying mechanism; When controlling and adjusting the conveying speed of the conveying mechanism, the conveying speed of the conveying mechanism is adjusted to be lower than the moving speed of the mounting frame.

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