Display device

Abstract

A display device is disclosed, which includes: a display module, including a display panel for displaying an image and a circuit board connected to the display panel; a supporting plate, arranged on the surface of the display module; and a conductive adhesive film, arranged between the circuit board and the supporting plate, the conductive adhesive film including a double-sided adhesive film and a single-sided adhesive film, the double-sided adhesive film being fixed to the surface of the supporting plate and the surface of the circuit board, and the single-sided adhesive film being fixed to one of the above-mentioned surfaces of the supporting plate and the above-mentioned surfaces of the circuit board.

Description

Technical Field

[0001] The present inventive concept relates to a display device, and more particularly, to a foldable display device. Background Art

[0002] A display device is an output device for presenting information in a visual form. The display device may include various types of display panels to display information. The display panel may include a liquid crystal display, a light emitting diode display, a quantum dot display, etc. In recent years, a rollable or foldable display device has been developed, which includes a bendable or foldable flexible display module. The flexible display module includes a flexible display panel and various functional components. For example, the flexible display panel includes a base component, various functional layers arranged on the base component, and pixels arranged on the base component. Summary of the invention

[0003] An exemplary embodiment of the present invention provides a display device, which includes: a display module, including a display panel for displaying an image and a circuit board connected to the display panel; a supporting plate, arranged on a surface of the display module; and a conductive adhesive film, arranged between the circuit board and the supporting plate, the conductive adhesive film including a double-sided adhesive film and a single-sided adhesive film, the double-sided adhesive film being fixed to a surface of the supporting plate and a surface of the circuit board, and the single-sided adhesive film being fixed to one of the above-mentioned surfaces of the supporting plate and the above-mentioned surfaces of the circuit board.

[0004] The double-sided adhesive film may include: a first conductive film; a first conductive adhesive disposed between the first conductive film and the surface of the support plate; and a second conductive adhesive disposed between the first conductive film and the surface of the circuit board.

[0005] The single-sided adhesive film may include: a second conductive film; and a third conductive adhesive disposed between the second conductive film and the surface of the circuit board.

[0006] The second conductive film may be thicker than the first conductive film.

[0007] The second conductive film may be spaced apart from the first conductive film.

[0008] The circuit board may include: a ground line; a cover layer disposed on the ground line and having an opening exposing a portion of the ground line; and a step difference compensation film disposed in the opening and connected to the portion of the ground line.

[0009] The step difference compensation film may include: a third conductive film; and a fourth conductive adhesive, arranged between the third conductive film and the above-mentioned portion of the grounding line, wherein the third conductive film is attached to the second conductive adhesive and the third conductive adhesive, and the grounding line is connected to the supporting plate through the step difference compensation film, the double-sided adhesive film and the single-sided adhesive film.

[0010] The conductive adhesive film may further include a connection portion connecting the first conductive film to the second conductive film.

[0011] The connection portion may include a fourth conductive film formed integrally with the first conductive film and the second conductive film.

[0012] The fourth conductive film may have the same thickness as one of the first conductive film and the second conductive film.

[0013] The display module may further include: a first circuit element disposed on the circuit board and overlapping the single-sided adhesive film; and a second circuit element disposed on the circuit board and overlapping the double-sided adhesive film, wherein the first circuit element is larger than the second circuit element.

[0014] The display module may include a folding area and a plurality of non-folding areas.

[0015] The conductive adhesive film may be disposed in one of the plurality of folding areas.

[0016] The support plate may be a metal plate.

[0017] The display device may further include a buffer film disposed between the display panel and the support plate.

[0018] The display module may further include a window disposed on the display panel and including a flexible material.

[0019] An exemplary embodiment of the present invention provides a display device, which includes: a display module, including a display panel for displaying an image and a circuit board electrically connected to the display panel, the display module also including a folding area and a plurality of non-folding areas arranged adjacent to opposite ends of the folding area; a supporting plate, arranged on the surface of the display module to support the display module; and a conductive adhesive film, arranged between the circuit board and the supporting plate in at least one of the plurality of non-folding areas to form an electrostatic path, the conductive adhesive film including a double-sided adhesive film and a single-sided adhesive film, the double-sided adhesive film being fixed to the surface of the supporting plate and the surface of the circuit board, and the single-sided adhesive film being fixed to the above-mentioned surface of the supporting plate and one of the above-mentioned surfaces of the circuit board, wherein the display module also includes a circuit element arranged on the circuit board to overlap with the single-sided adhesive film.

[0020] The double-sided adhesive film may include: a first conductive film; a first conductive adhesive disposed between the first conductive film and the surface of the support plate; and a second conductive adhesive disposed between the first conductive film and the surface of the circuit board.

[0021] The single-sided adhesive film may include: a second conductive film; and a third conductive adhesive disposed between the second conductive film and the surface of the circuit board.

[0022] The circuit board may include: a ground line; a cover layer disposed on the ground line to cover the ground line, wherein the cover layer includes an opening to expose a portion of the ground line; and a step difference compensation film disposed in the opening and electrically connected to the above-mentioned portion of the ground line.

[0023] The step difference compensation film may include: a third conductive film; and a fourth conductive adhesive disposed between the third conductive film and the above-mentioned portion of the ground line, wherein the third conductive film is electrically connected to the first conductive film and the second conductive film through the second conductive adhesive and the third conductive adhesive, respectively.

[0024] The second conductive film may be thicker than the first conductive film.

[0025] The conductive adhesive film may further include a connection portion connecting the first conductive film to the second conductive film.

[0026] The connection portion may include a fourth conductive film which is integrally formed with the first conductive film and the second conductive film and has the same thickness as one of the first conductive film and the second conductive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other features of the present inventive concept will become more apparent by describing in detail exemplary embodiments of the present inventive concept with reference to the accompanying drawings, in which:

[0028] Figure 1 is a perspective view showing a display device according to an exemplary embodiment of the present inventive concept;

[0029] Figure 2A It is shown Figure 1 A perspective view of a state in which the display device shown in FIG. 1 is folded inwardly (folded inwardly) around a first folding axis;

[0030] Figure 2B It is shown Figure 1 A perspective view of a state in which the display device shown in FIG. 1 is folded outwardly (folded outwardly) around a first folding axis;

[0031] Figure 3A It is shown Figure 1 A perspective view of a state in which the display device shown in FIG. 1 is folded inwardly (folded inwardly) around a second folding axis;

[0032] Figure 3B It is shown Figure 1 A perspective view of a state in which the display device shown in FIG. 1 is folded outwardly (folded outwardly) around a second folding axis;

[0033] Figure 4 is an exploded perspective view showing a display device according to an exemplary embodiment of the present inventive concept;

[0034] Figure 5Ais a rear view illustrating a display device according to an exemplary embodiment of the present inventive concept;

[0035] Figure 5B It is shown Figure 5A A rear view of the second support plate and the circuit board shown in ;

[0036] Fig. 6A is along Figure 5A A cross-sectional view taken along line II' shown in FIG.

[0037] Figure 6B It is shown Fig. 6A An enlarged view of the portion BB shown in;

[0038] Fig. 7A is a rear view illustrating a display device according to an exemplary embodiment of the present inventive concept;

[0039] Figure 7B It is shown Fig. 7A A rear view of the second support plate and the circuit board shown in ;

[0040] Fig. 8A is along Fig. 7A A cross-sectional view taken along line II-II' shown in FIG.

[0041] Figure 8B It is shown Fig. 8A An enlarged view of the portion BB shown in;

[0042] Figure 8C FIG. 2 is a diagram showing another exemplary embodiment of the present invention. Fig. 8A An enlarged view of the portion BB shown in;

[0043] Fig.9A is a rear view illustrating a display device according to an exemplary embodiment of the present inventive concept;

[0044] Fig. 9B It is shown Fig.9A A rear view of the second support plate and the circuit board shown in ;

[0045] Fig. 10A is a rear view illustrating a display device according to an exemplary embodiment of the present inventive concept;

[0046] Fig. 10B It is shown Fig. 10A A rear view of the second support plate and the circuit board shown in ;

[0047] Fig.11A is a rear view illustrating a display device according to an exemplary embodiment of the present inventive concept;

[0048] Fig. 11B It is shown Fig.11A A rear view of the second support plate and the circuit board shown in ;

[0049] Fig. 12A is a rear view illustrating a display device according to an exemplary embodiment of the present inventive concept; and

[0050] Fig. 12B It is shown Fig. 12A A rear view of the second support plate and the circuit board shown in FIG. DETAILED DESCRIPTION

[0051] In the present disclosure, it will be understood that when an element or layer is referred to as being "on," "connected to" or "coupled to" another element or layer, it can be directly on, connected to or coupled to the other element or layer, or intervening elements or layers may be present.

[0052] The same reference numerals may refer to the same elements throughout. In the drawings, the thickness, ratio, and size of components may be exaggerated.

[0053] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0054] Hereinafter, exemplary embodiments of the present inventive concept will be explained in detail with reference to the accompanying drawings.

[0055] Figure 1 is a perspective view illustrating a display device DD according to an exemplary embodiment of the inventive concept.

[0056] refer to Figure 1 , the display device DD has a rectangular shape having short sides in a first direction DR1 and long sides in a second direction DR2 crossing the first direction DR1. However, the shape of the display device DD should not be limited to the rectangular shape, and the display device DD may have various shapes.

[0057] The display device DD may be a foldable electronic device. For example, the display device DD according to an exemplary embodiment of the inventive concept may be folded around folding axes FX1 and FX2 extending in a predetermined direction. Hereinafter, a state in which the display device DD is folded around the folding axes FX1 and FX2 is referred to as a "folded state", and a state in which the display device DD is not folded is referred to as a "non-folded state". The folding axes FX1 and FX2 may be rotation axes generated when the display device DD is folded, and the folding axes FX1 and FX2 may be formed by components and structures of the display device DD.

[0058] The folding axes FX1 and FX2 may extend in the first direction DR1 or the second direction DR2. In an exemplary embodiment of the present inventive concept, the folding axis extending in the second direction DR2 may be referred to as a "first folding axis" FX1, and the folding axis extending in the first direction DR1 may be referred to as a "second folding axis" FX2. The display device DD may include one of the first folding axis FX1 and the second folding axis FX2. The display device DD may be folded around one of the first folding axis FX1 and the second folding axis FX2. For example, the display device DD may be folded around the first folding axis FX1, returned to its unfolded state, and then folded around the second folding axis FX2.

[0059] The display device DD according to the present embodiment can be applied to large electronic items such as televisions and monitors, and small and medium-sized electronic items such as mobile phones, tablet computers, car navigation units, and game units. These items are merely exemplary, and therefore, the display device DD can be applied to various other electronic items.

[0060] like Figure 1 As shown in , the display device DD may display an image IM on a display surface IS substantially parallel to each of the first direction DR1 and the second direction DR2. The display surface IS on which the image IM is displayed may correspond to the front surface of the display device DD. However, when the display device DD is in the folded state, a portion of the display surface IS may be located on the rear surface of the display device DD.

[0061] The display surface IS of the display device DD may be divided into a plurality of regions. The display surface IS of the display device DD may include a display area DA and a non-display area NDA.

[0062] The display area DA may be an area on which the image IM is displayed, and a user may observe the image IM through the display area DA. The display area DA may have a quadrilateral shape. The non-display area NDA may surround the display area DA. Therefore, the display area DA may have a shape delimited by the non-display area NDA. However, this is merely exemplary, and the non-display area NDA may be provided adjacent to only one side of the display area DA, or may be omitted.

[0063] The non-display area NDA is an area adjacent to the display area DA, and the image IM is not displayed through the non-display area NDA. The display device DD includes a bezel area corresponding to the non-display area NDA.

[0064] The display device DD according to the exemplary embodiment of the present invention may be a touch-type display, and may sense a user input TC applied thereto from the outside. The user input TC includes various forms of external input, such as a part of the user's body, light, heat, or pressure. In the present exemplary embodiment, the user input TC is shown as a user's hand applied to the front surface of the display device DD. However, this is merely exemplary, and the user input TC may be provided in various forms as described above, and depending on the structure of the display device DD, the display device DD may sense the user input TC applied to the side surface or rear surface of the display device DD.

[0065] The display device DD may activate the display surface IS to display the image IM while sensing the user input TC. In the present exemplary embodiment, the area sensing the user input TC may be located in the display area DA on which the image IM is displayed. However, this is merely exemplary, and the area sensing the user input TC may be located in the non-display area NDA or over the entire display surface IS.

[0066] Figure 2A It is shown Figure 1 A perspective view of a state in which the display device DD is folded inwardly (inwardly folded) around a first folding axis FX1, and Figure 2B It is shown Figure 1 0 is a perspective view of a state in which the display device DD is folded outward (outwardly folded) around a first folding axis FX1.

[0067] refer to Figure 1 and Figure 2A The display device DD may be a foldable display device. The display device DD may be foldable around a folding axis (eg, a first folding axis FX1 and a second folding axis FX2) extending in a predetermined direction.

[0068] According to the operation mode of the display device DD, the display device DD may include a plurality of regions. These regions may include a folding region FA1 and at least one non-folding region NFA1 and NFA2. The folding region FA1 may be located between two non-folding regions NFA1 and NFA2.

[0069] The folding area FA1 is folded around the first folding axis FX1 to form a curvature. The first folding axis FX1 may extend in a second direction DR2, for example, in a long axis direction of the display device DD. The folding area FA1 may be folded around the first folding axis FX1 and may extend in the second direction DR2.

[0070] As an example, the non-folding areas NFA1 and NFA2 may include a first non-folding area NFA1 and a second non-folding area NFA2. The first non-folding area NFA1 is disposed adjacent to one side of the folding area FA1 in the first direction DR1, and the second non-folding area NFA2 is disposed adjacent to the other side of the folding area FA1 in the first direction DR1. For example, the first non-folding area NFA1 may be disposed adjacent to a first side of the folding area FA1 along the first direction DR1, and the second non-folding area NFA2 may be disposed adjacent to a second side of the folding area FA1 along the first direction DR1. The first side and the second side of the folding area FA1 may be opposite to each other and extend along the second direction DR2.

[0071] The display device DD may be folded inward (inward folding) or folded outward (outward folding). In the present exemplary embodiment, inward folding may refer to when the display device DD is folded so that the display surface IS of the first non-folding area NFA1 and the display surface IS of the second non-folding area NFA2 face each other, and outward folding may refer to when the display device DD is folded so that the display surfaces IS of the different non-folding areas NFA1 and NFA2 face away from each other. For example, when the display device DD is folded inwardly, the display surface IS of the first non-folding area NFA1 and the display surface IS of the second non-folding area NFA2 are protected by the back side of the display device DD, and when the display device DD is folded outwardly, the display surface IS of the first non-folding area NFA1 and the display surface IS of the second non-folding area NFA2 are exposed to the outside.

[0072] In other words, when the display device DD is folded inward, the first part of the display surface IS faces the second part of the display surface IS, and when the display device DD is folded outward, the first part of the rear surface of the display device DD is folded to face the second part of the rear surface of the display device DD.

[0073] Figure 2A The display device DD shown in FIG. 1 can be folded inward (inwardly folded) to allow the display surface IS of the first non-folding area NFA1 to face the display surface IS of the second non-folding area NFA2. When the first non-folding area NFA1 is rotated in a clockwise direction around the first folding axis FX1, the display device DD can be folded inward. The first folding axis FX1 can be located at the center of the display device DD in the first direction DR1 to fold the display device DD inward so that the first non-folding area NFA1 and the second non-folding area NFA2 are aligned with each other.

[0074] refer to Figure 2B, the display device DD can be folded outward around the first folding axis FX1 (outward folding). The display device DD can display an image IM when the display surface IS of the first non-folding area NFA1 and the display surface IS of the second non-folding area NFA2 are exposed to the outside. In addition, the image IM can also be displayed on the display surface IS of the folding area FA1 exposed to the outside. Figure 1 As shown in , the display device DD may display an image IM when in the unfolded state. The first non-folding area NFA1, the second non-folding area NFA2, and the folding area FA1 may respectively display images providing independent information, or may respectively display parts of one image.

[0075] The display device DD may be manufactured to have both the inner folding state and the outer folding state, or may be manufactured to have one of the inner folding state and the outer folding state.

[0076] Figure 3A It is shown Figure 1 A perspective view of a state in which the display device DD is folded inwardly (inwardly folded) around the second folding axis FX2, and Figure 3B It is shown Figure 1 0 is a perspective view of a state in which the display device DD is folded outward (outwardly folded) around a second folding axis FX2.

[0077] refer to Figure 3A and Figure 3B , the display device DD may be folded inward or outward about the second folding axis FX2. The second folding axis FX2 may extend in the first direction DR1, for example, in the short axis direction.

[0078] According to the operation mode of the display device DD, the display device DD may include a plurality of regions. These regions may include a folding region FA2 and at least one non-folding region NFA3 and NFA4. The folding region FA2 may be located between two non-folding regions NFA3 and NFA4.

[0079] The folding area FA2 is folded around the second folding axis FX2 to form a curvature. The folding area FA2 may be folded around the second folding axis FX2 and may extend in the first direction DR1.

[0080] As an example, the non-folding areas NFA3 and NFA4 may include a third non-folding area NFA3 and a fourth non-folding area NFA4. The third non-folding area NFA3 is disposed adjacent to one side of the folding area FA2 in the second direction DR2, and the fourth non-folding area NFA4 is disposed adjacent to the other side of the folding area FA2 in the second direction DR2. For example, the third non-folding area NFA3 may be disposed adjacent to a first side of the folding area FA2 along the second direction DR2, and the fourth non-folding area NFA4 may be disposed adjacent to a second side of the folding area FA2 along the second direction DR2. The first side and the second side of the folding area FA2 may be opposite to each other and extend along the first direction DR1.

[0081] In the present exemplary embodiment, one folding area FA1 or FA2 is provided in the display device DD, however, the present inventive concept should not be limited thereto or thereby. According to another exemplary embodiment of the present inventive concept, a plurality of folding areas may be provided in the display device DD.

[0082] Figure 4 is an exploded perspective view illustrating a display device DD according to an exemplary embodiment of the inventive concept.

[0083] refer to Figure 4 , the display device DD according to the exemplary embodiment of the inventive concept may include a display module DM for displaying an image and a window WM provided on the display module DM. The display module DM may be the display device DD (refer to Figure 1 ) and the image can be generated by the display module DM.

[0084] The display module DM may include a display panel DP and an input sensing unit ISP. The display panel DP according to an exemplary embodiment of the inventive concept may be a light-emitting display panel, however, it is not limited thereto. For example, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots and quantum rods. Hereinafter, an organic light-emitting display panel is described as a representative example of the display panel DP.

[0085] The display panel DP may be a flexible display panel. Therefore, the display panel DP may be completely rolled, or may be folded or unfolded around the second folding axis FX2.

[0086] The input sensing unit ISP may be directly disposed on the display panel DP. According to an exemplary embodiment of the present inventive concept, the input sensing unit ISP may be formed on the display panel DP through a continuous process. In other words, when the input sensing unit ISP is directly disposed on the display panel DP, an adhesive film may not be disposed between the input sensing unit ISP and the display panel DP, however, the present inventive concept should not be limited thereto. An adhesive film may be disposed between the input sensing unit ISP and the display panel DP. In this case, the input sensing unit ISP is not manufactured together with the display panel DP through a continuous process. In other words, after being manufactured through a separate process, the input sensing unit ISP may be fixed to the upper surface of the display panel DP by an adhesive film.

[0087] The display panel DP may generate an image, and the input sensing unit ISP may obtain coordinate information about a user input TC (eg, a touch event).

[0088] The upper surface of the window WM forms the display surface IS of the display device DD. The window WM may be optically transparent. Therefore, the user may easily perceive the image generated by the display module DM through the window WM.

[0089] The window WM may include an optically transparent insulating material. For example, the window WM may include a glass substrate or a synthetic resin film. When the window WM includes a glass substrate, the window WM may have a thickness equal to or less than about 80 microns (e.g., about 30 microns), however, the thickness of the window WM is not limited thereto.

[0090] When the window WM includes a synthetic resin film, the window WM may include a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0091] The window WM may have a single-layer or multi-layer structure. For example, the window WM may include a plurality of synthetic resin films coupled to each other by an adhesive, or include a glass substrate and a synthetic resin film coupled to the glass substrate by an adhesive.

[0092] The window WM may include a flexible material. Therefore, the window WM may be folded or unfolded around the second folding axis FX2. In other words, when the shape of the display module DM changes, the shape of the window WM may change.

[0093] The window WM transmits an image from the display module DM and buffers external impact to prevent the display module DM from being damaged or malfunctioning due to the external impact. The external impact may be an external force represented by pressure or stress, which may cause defects in the display module DM.

[0094] A window protective layer may also be provided on the window WM. The window protective layer may increase the impact resistance of the window WM and may prevent the window WM from breaking when impacted. The window protective layer may include at least one of a urethane-based resin, an epoxy-based resin, a polyester-based resin, a polyether-based resin, an acrylate-based resin, an acrylonitrile-butadiene-styrene (ABS) resin, and a rubber. As an example, the window protective layer may include at least one of phenylene, polyethylene terephthalate (PET), polyimide (PI), polyamide (PA), polyethylene naphthalate (PEN), and polycarbonate (PC).

[0095] A window function layer may be further provided between the window WM and the window protection layer. For example, the window function layer may include at least one of an anti-fingerprint layer, an anti-glare layer, and a hard coating layer.

[0096] One or more functional layers may be provided between the display module DM and the window WM. As an example, one of the functional layers may be an anti-reflection layer RPL that blocks reflection of external light. The anti-reflection layer RPL may prevent the components included in the display module DM from being perceived from the outside due to external light incident through the front surface of the display device DD. The anti-reflection layer RPL may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 retarder and / or a λ / 4 retarder. The polarizer may be a film type or a liquid crystal coating type. The film type polarizer may include a stretched synthetic resin film, and the liquid crystal coating type polarizer may include liquid crystals arranged in a predetermined orientation. The retarder and the polarizer may be implemented as one polarizing film. The functional layer may also include a protective film disposed on or below the anti-reflection layer RPL.

[0097] The anti-reflection layer RPL may be disposed on the input sensing unit ISP. In other words, the anti-reflection layer RPL may be disposed between the input sensing unit ISP and the window WM. The anti-reflection layer RPL and the window WM may be coupled to each other by an adhesive film ADL. The adhesive film ADL may cover the entire surface of the anti-reflection layer RPL facing the window WM. An adhesive film may also be disposed between the input sensing unit ISP and the anti-reflection layer RPL to fix the anti-reflection layer RPL to the input sensing unit ISP.

[0098] As an example, the adhesive film ADL may be an optically clear adhesive (OCA) film. However, the adhesive film ADL is not limited thereto and may include various adhesives. For example, the adhesive film ADL may include an optically clear resin (OCR) or a pressure-sensitive adhesive film (PSA).

[0099] The display module DM may display an image in response to an electrical signal, and may transmit / receive information about an external input. The display module DM may include an active area AA and a peripheral area NAA. The active area AA may be an area through which an image provided from the display module DM is transmitted through the window WM to the outside.

[0100] The peripheral area NAA may be adjacent to the active area AA. For example, the peripheral area NAA may surround the active area AA. However, this is merely exemplary, and the peripheral area NAA may have various shapes and should not be particularly limited. For example, the peripheral area NAA may be disposed adjacent to less than all sides of the active area AA. According to an exemplary embodiment of the present inventive concept, the active area AA of the display module DM may correspond to at least a portion of the display area DA.

[0101] The display module DM may further include a circuit board FPCB and a flexible circuit film FCF.

[0102] The circuit board FPCB may be connected to the flexible circuit film FCF to be electrically connected to the display panel DP. The circuit board FPCB may include a control chip, a plurality of passive components, and a plurality of active components mounted thereon. The circuit board FPCB may include the same flexible film material as the flexible circuit film FCF.

[0103] The flexible circuit film FCF may be connected to the display panel DP to electrically connect the display panel DP to the circuit board FPCB. The flexible circuit film FCF may be coupled to the peripheral area NAA of the display panel DP through a bonding process. A driving chip may be mounted on the flexible circuit film FCF. Since the flexible circuit film FCF is bent to surround the side surface of the display module DM, the circuit board FPCB coupled to the flexible circuit film FCF may be disposed on the rear surface of the display module DM.

[0104] The driving chip may include a driving element for driving the pixels of the display panel DP, such as a data driving circuit. In the exemplary embodiment of the inventive concept, one flexible circuit film FCF is shown, however, the number of flexible circuit films should not be limited to one. The flexible circuit film FCF may be provided in plurality and may be connected to the display panel DP. The driving chip may be directly mounted on the display panel DP. In this case, the portion of the display panel DP on which the driving chip is mounted may be bent to be disposed on the rear surface of the display module DM.

[0105] The input sensing unit ISP may be electrically connected to the circuit board FPCB through the flexible circuit film FCF. However, the inventive concept is not limited thereto. In other words, the display module DM may further include a separate flexible circuit film to electrically connect the input sensing unit ISP to the circuit board FPCB.

[0106] like Figure 4As shown in , the display device DD may further include a support plate SP disposed on the rear surface of the display module DM and supporting the display module DM. The support plate SP, the display module DM, and the window WM may be arranged in the third direction DR3. The support plate SP may be a metal plate. The support plate SP may be a stainless steel plate. The support plate SP may be stronger than the display module DM.

[0107] The support plate SP may include a plurality of support plates SP1 and SP2. The number of support plates SP1 and SP2 may correspond to the number of non-folding areas NFA3 and NFA4. As an example, the support plate SP may include a first support plate SP1 and a second support plate SP2 spaced apart from the first support plate SP1. For example, the first support plate SP1 and the second support plate SP2 may be separated by the folding area FA2. For example, a gap corresponding to the side of the folding area FA2 may be positioned between the first support plate SP1 and the second support plate SP2 along the first direction DR1. The first support plate SP1 and the second support plate SP2 may be arranged to correspond to the non-folding areas NFA3 and NFA4, respectively. In other words, the first support plate SP1 may be arranged to correspond to the third non-folding area NFA3 of the display module DM, and the second support plate SP2 may be arranged to correspond to the fourth non-folding area NFA4 of the display module DM. When the display module DM is folded about the second folding axis FX2, the first support plate SP1 and the second support plate SP2 may be spaced apart from each other in the second direction DR2.

[0108] The first support plate SP1 and the second support plate SP2 may be spaced apart from each other in the folding area FA2. The first support plate SP1 and the second support plate SP2 may overlap a portion of the folding area FA2. In other words, the distance between the first support plate SP1 and the second support plate SP2 in the second direction DR2 may be smaller than the width of the folding area FA2 in the second direction DR2. In other words, the gap between the first support plate SP1 and the second support plate SP2 in the second direction DR2 may be smaller than the width of the folding area FA2 in the second direction DR2.

[0109] The support plate SP may further include a connection module for connecting the first support plate SP1 and the second support plate SP2. The connection module may include an articulated module or a multi-joint module.

[0110] In an exemplary embodiment of the present inventive concept, the support plate SP includes two support plates SP1 and SP2, however, the number of support plates is not limited to two. In other words, when the number of second folding axes FX2 increases, the support plate SP may include a plurality of support plates separated from each other relative to the second folding axes FX2. For example, when two folding axes are arranged along the second direction DR2, three support plates may be provided.

[0111] Figure 4The structure in which the support plate SP is divided into the first support plate SP1 and the second support plate SP2 is shown, however, the present inventive concept is not limited thereto. In other words, the support plate SP may be formed in a single plate shape to be arranged to correspond to the third non-folding area NFA3 and the fourth non-folding area NFA4 and the folding area FA2. In this case, the support plate SP may be provided with a plurality of holes passing through the support plate SP in the folding area FA2.

[0112] A buffer film CHL (see Fig. 6A ). The buffer film CHL may include a polymer material. The buffer film CHL may absorb an impact applied thereto from the outside. The buffer film CHL may be coupled to each of the display module DM and the support plate SP through an adhesive film.

[0113] Figure 5A is a rear view showing a display device DD according to an exemplary embodiment of the present inventive concept, and Figure 5B It is shown Figure 5A 2 is a rear view of the second support plate SP2 and the circuit board FPCB shown in FIG. Fig. 6A is along Figure 5A A cross-sectional view taken along line II' shown in FIG. Figure 6B It is shown Fig. 6A An enlarged view of section BB is shown in FIG.

[0114] refer to Figure 4 , Figure 5A and Fig. 6A , the support plate SP may be disposed on the rear surface of the display module DM. In the case where the display device DD is folded about the second folding axis FX2 extending in the first direction DR1, the support plate SP may include two support plates SP1 and SP2 spaced apart from each other in the second direction DR2. The first support plate SP1 and the second support plate SP2 may be disposed to correspond to the third non-folding area NFA3 and the fourth non-folding area NFA4, respectively.

[0115] The flexible circuit film FCF coupled to the display panel DP may be bent to surround side surfaces of the display panel DP and the second support plate SP2, and the circuit board FPCB coupled to the flexible circuit film FCF may be placed on the rear surface of the second support plate SP2.

[0116] Figure 5AThe structure in which the circuit board FPCB is disposed on the rear surface of the second support plate SP2 is shown, however, the inventive concept is not limited thereto. In other words, when the circuit board FPCB and the flexible circuit film FCF are connected to the display panel DP at the first support plate SP1, the circuit board FPCB may be placed on the rear surface of the first support plate SP1. In addition, when the support plate SP is formed in a single plate shape, the circuit board FPCB may be placed on the rear surface of one side of the support plate SP.

[0117] The display device DD may further include a conductive adhesive film CAF1 to attach the circuit board FPCB to the second support plate SP2. Thus, the circuit board FPCB may be fixed to the rear surface of the second support plate SP2. In addition, the wires (e.g., the ground wires GRL (reference wires) of the circuit board FPCB may be fixed to the rear surface of the second support plate SP2. Fig. 6A )) may be electrically connected to the second support plate SP2 through the conductive adhesive film CAF1.

[0118] The conductive adhesive film CAF1 may include a double-sided adhesive film DAP and a single-sided adhesive film SAP. When viewed in a plane, the double-sided adhesive film DAP and the single-sided adhesive film SAP may be spaced apart from each other. Therefore, a space SA may be provided between the double-sided adhesive film DAP and the single-sided adhesive film SAP.

[0119] The double-sided adhesive film DAP may be attached to each of the rear surface of the second support plate SP2 and the rear surface RS of the circuit board FPCB. The single-sided adhesive film SAP may be attached to one of the rear surface of the second support plate SP2 and the rear surface RS of the circuit board FPCB. As an example, the single-sided adhesive film SAP may be attached to the rear surface RS of the circuit board FPCB and not to the rear surface of the second support plate SP2.

[0120] The double-sided adhesive film DAP may include a first conductive film CF1, a first conductive adhesive CA1, and a second conductive adhesive CA2. The first conductive film CF1 may be a base film of the double-sided adhesive film DAP, and may include conductive fibers or metal films. The first conductive adhesive CA1 may be disposed between the first conductive film CF1 and the rear surface of the second support plate SP2, and the second conductive adhesive CA2 may be disposed between the first conductive film CF1 and the rear surface RS of the circuit board FPCB. The first conductive adhesive CA1, the first conductive film CF1, and the second conductive adhesive CA2 may be stacked sequentially. Each of the first conductive adhesive CA1 and the second conductive adhesive CA2 may include a conductive adhesive material. As an example, each of the first conductive adhesive CA1 and the second conductive adhesive CA2 may be a film formed by distributing metal particles or carbon of gold, silver, platinum, nickel, copper in a synthetic resin. The synthetic resin may include epoxy resin, silicon, polyimide, polyurethane, etc.

[0121] The double-sided adhesive film DAP may be attached to each of the rear surface RS of the circuit board FPCB and the rear surface of the second support plate SP2 through the first conductive adhesive CA1 and the second conductive adhesive CA2.

[0122] The single-sided adhesive film SAP may include a second conductive film CF2 and a third conductive adhesive CA3. The second conductive film CF2 may be a base film of the single-sided adhesive film SAP and may have conductivity. As an example, the second conductive film CF2 may include the same material as the first conductive film CF1. The third conductive adhesive CA3 may be disposed between the second conductive film CF2 and the rear surface RS of the circuit board FPCB. The third conductive adhesive CA3 may include a conductive adhesive material. As an example, the third conductive adhesive CA3 may include the same material as the first conductive adhesive CA1 and the second conductive adhesive CA2. However, the third conductive adhesive CA3 may include a material different from the first conductive adhesive CA1 and the second conductive adhesive CA2.

[0123] The single-sided adhesive film SAP may be attached to the circuit board FPCB by the third conductive adhesive CA3. However, no adhesive may be provided between the second conductive film CF2 and the rear surface of the second support plate SP2. Therefore, the single-sided adhesive film SAP may not be fixed to the rear surface of the second support plate SP2. However, the second conductive film CF2 may be electrically connected to the second support plate SP2. For example, the second conductive film CF2 may be adjacent to the rear surface of the second support plate SP2.

[0124] A control chip, passive components, and active components may be mounted on the upper surface US of the circuit board FPCB. The rear surface RS of the circuit board FPCB may face the second support plate SP2, and the upper surface US of the circuit board FPCB may be opposite to the rear surface RS. The circuit board FPCB may include a first circuit element CM1 and a second circuit element CM2 mounted on the upper surface US of the circuit board FPCB. The first circuit element CM1 may have a size larger than that of the second circuit element CM2.

[0125] The first circuit element CM1 may be mounted on the upper surface US of the circuit board FPCB to correspond to the single-sided adhesive film SAP, and the second circuit element CM2 may be mounted on the upper surface US of the circuit board FPCB to correspond to the double-sided adhesive film DAP. In other words, the first circuit element CM1 may be formed in an area overlapping with the single-sided adhesive film SAP, and the second circuit element CM2 may be formed in an area overlapping with the double-sided adhesive film DAP. Hereinafter, the area corresponding to the single-sided adhesive film SAP will be referred to as the single-sided adhesive area SCA, and the area corresponding to the double-sided adhesive film DAP will be referred to as the double-sided adhesive area DCA.

[0126] When pressing occurs due to an external force, the second support plate SP2 may be deformed. The deformation of the second support plate SP2 may be transmitted to the circuit board FPCB and may cause deformation of the circuit board FPCB. However, since the first circuit element CM1 is formed in the single-sided adhesive area SCA having a relatively large strength and a relatively large size, the circuit board FPCB may not be deformed even if pressing occurs due to an external force. When the deformed second support plate SP2 and the undeformed circuit board FPCB are connected to each other, the adhesive may be repeatedly attached to and separated from the second support plate SP2, and noise may occur during such action.

[0127] like Figure 5A , Fig. 6A and Figure 6B As shown in , in the single-sided adhesive area SCA on which the first circuit element CM1 is mounted, the conductive adhesive may be omitted between the second conductive film CF2 and the second support plate SP2. Therefore, the conductive adhesive film CAF1 may not be fixed to the second support plate SP2 in the single-sided adhesive area SCA. In other words, the conductive adhesive film CAF1 may remain unattached to the second support plate SP2 in the area on which the first circuit element CM1 is mounted. For example, the conductive adhesive film CAF1 may not be attached to the second support plate SP2 in the single-sided adhesive area SCA but may be directly adjacent to the second support plate SP2. Therefore, although deformation occurs in the second support plate SP2, the conductive adhesive film CAF1 may not be repeatedly attached to and detached from the second support plate SP2, and therefore, noise caused by the attachment and detachment actions may be removed.

[0128] refer to Figure 5B , Fig. 6A and Figure 6B , the circuit board FPCB may include a ground line GRL, cover layers CVL1 and CVL2, and step difference compensation films SCF1 and SCF2. The cover layers CVL1 and CVL2 may include a first cover layer CVL1 and a second cover layer CVL2. The first cover layer CVL1 and the second cover layer CVL2 may include an insulating material. The first circuit element CM1 and the second circuit element CM2 may be mounted on a first surface of the first cover layer CVL1. The upper surface US of the circuit board FPCB may be a first surface of the first cover layer CVL1. The ground line GRL may be disposed on a second surface of the first cover layer CVL1. The ground line GRL may be a copper wire and may receive a ground voltage.

[0129] The ground line GRL may be covered by the second cover layer CVL2. The second cover layer CVL2 may be provided with openings OP1 and OP2 through which portions of the ground line GRL are exposed. The openings OP1 and OP2 may include a first opening OP1 in the double-sided adhesive area DCA to expose the ground line GRL and a second opening OP2 in the single-sided adhesive area SCA to expose the ground line GRL. The first opening OP1 and the second opening OP2 may be gaps.

[0130] In addition to the ground line GRL, other lines may be further disposed on the second surface of the first cover layer CVL1.

[0131] The step difference compensation films SCF1 and SCF2 may include a first step difference compensation film SCF1 and a second step difference compensation film SCF2. The first step difference compensation film SCF1 may be in the double-sided adhesive area DCA to correspond to the first opening OP1, and the second step difference compensation film SCF2 may be in the single-sided adhesive area SCA to correspond to the second opening OP2. For example, the first step difference compensation film SCF1 may be disposed in the first opening OP1, and the second step difference compensation film SCF2 may be disposed in the second opening OP2. The first step difference compensation film SCF1 and the second step difference compensation film SCF2 may be electrically connected to the ground line GRL, and may compensate for the step difference between the second cover layer CVL2 and the ground line GRL caused by the first opening OP1 and the second opening OP2.

[0132] The first and second step difference compensation films SCF1 and SCF2 may be disposed at different positions from each other but may have the same structure as each other. Therefore, the first step difference compensation film SCF1 will be described as a representative example, and a detailed description of the second step difference compensation film SCF2 will be omitted.

[0133] The first step difference compensation film SCF1 may include a third conductive film CF3 and a fourth conductive adhesive CA4. The third conductive film CF3 may be a base film of the first step difference compensation film SCF1, and may have a thickness suitable for compensating the step difference between the second cover layer CVL2 and the fourth conductive adhesive CA4. The third conductive film CF3 may include a material having conductivity. As an example, the third conductive film CF3 may include the same material as the first conductive film CF1 and the second conductive film CF2. The fourth conductive adhesive CA4 may be disposed between the third conductive film CF3 and the ground line GRL. The fourth conductive adhesive CA4 may include a conductive adhesive material. As an example, the fourth conductive adhesive CA4 may include the same material as the first conductive adhesive CA1, the second conductive adhesive CA2, and the third conductive adhesive CA3.

[0134] As an example, the circuit board FPCB may further include a protective metal layer PL covering at least an area of ​​a portion of the ground line GRL exposed through the first opening OP1 and the second opening OP2. The protective metal layer PL may be provided to prevent the ground line GRL from being oxidized or corroded. As an example, the protective metal layer PL may include an oxidation-resistant and corrosion-resistant metal material such as gold (Au).

[0135] When the protective metal layer PL is provided, the first and second step difference compensation films SCF1 and SCF2 may be attached to the protective metal layer PL by the fourth conductive adhesive CA4. When the protective metal layer PL is omitted, the first and second step difference compensation films SCF1 and SCF2 may be directly attached to the ground line GRL.

[0136] The third conductive film CF3 of the first step difference compensation film SCF1 may be attached to the second conductive adhesive CA2 of the double-sided adhesive film DAP, and the third conductive film CF3 of the second step difference compensation film SCF2 may be attached to the third conductive adhesive CA3 of the single-sided adhesive film SAP. Therefore, the double-sided adhesive film DAP may be electrically connected to the ground line GRL through the first step difference compensation film SCF1, and the single-sided adhesive film SAP may be electrically connected to the ground line GRL through the second step difference compensation film SCF2. Therefore, the first electrostatic path formed when the second support plate SP2 and the ground line GRL are electrically connected to each other through the first step difference compensation film SCF1 and the double-sided adhesive film DAP may be provided in the double-sided adhesive area DCA. In addition, the second electrostatic path formed when the second support plate SP2 and the ground line GRL are electrically connected to each other through the second step difference compensation film SCF2 and the single-sided adhesive film SAP may be provided in the single-sided adhesive area SCA.

[0137] Therefore, when static electricity occurs in the circuit board FPCB, the static electricity may be discharged through the first and second static electricity paths, and thus, circuit elements or signal lines mounted on the circuit board FPCB may be prevented from being damaged due to the static electricity.

[0138] refer to Figure 6B , the second conductive film CF2 may have a thickness t2 greater than the thickness t1 of the first conductive film CF1. For example, the thickness t2 of the second conductive film CF2 may be equal to the sum of the thickness t1 of the first conductive film CF1 and the thickness of the first conductive adhesive CA1, however, it is not limited thereto. In other words, the thickness t2 of the second conductive film CF2 may be less than the sum of the thickness t1 of the first conductive film CF1 and the thickness of the first conductive adhesive CA1.

[0139] Fig. 7A is a rear view showing a display device DD according to an exemplary embodiment of the present inventive concept, and Figure 7B It is shown Fig. 7A2 is a rear view of the second support plate SP2 and the circuit board FPCB shown in FIG. Fig. 8A is along Fig. 7A A cross-sectional view taken along line II-II' shown in FIG. Figure 8B It is shown Fig. 8A an enlarged view of section BB shown in FIG. 1 , and Figure 8C FIG. 2 is a diagram showing another exemplary embodiment of the present invention. Fig. 8A An enlarged view of section BB is shown in FIG. Fig. 7A , Figure 7B , Fig. 8A , Figure 8B and Figure 8C In the same reference numerals, Figure 5A , Figure 5B , Fig. 6A and Figure 6B , and thus, detailed descriptions of the same elements may be omitted to avoid redundancy.

[0140] refer to Figure 4 , 7A to 8C , the conductive adhesive film CAF2 may include a double-sided adhesive film DAP, a single-sided adhesive film SAP, and a connecting portion CP connecting the double-sided adhesive film DAP and the single-sided adhesive film SAP. When observed in a plane, the double-sided adhesive film DAP and the single-sided adhesive film SAP may be spaced apart from each other. Therefore, a space may be provided between the double-sided adhesive film DAP and the single-sided adhesive film SAP. The connecting portion CP may be arranged in the space, and the double-sided adhesive film DAP and the single-sided adhesive film SAP may be connected. The area in which the space of the connecting portion CP is arranged may be referred to as a connecting area CCA. The connecting portion CP may be located between the first circuit element CM1 and the second circuit element CM2.

[0141] In this exemplary embodiment, the double-sided adhesive film DAP and the single-sided adhesive film SAP are described similarly to those of reference FIG. 5A to FIG. 6B The double-sided adhesive film DAP and the single-sided adhesive film SAP are described, and therefore, the details thereof may be omitted.

[0142] The connection portion CP may include a fourth conductive film CF4. The connection portion CP may include a fourth conductive film CF4 integrally formed with the first conductive film CF1 of the double-sided adhesive film DAP and the second conductive film CF2 of the single-sided adhesive film SAP. The fourth conductive film CF4 may have the same thickness as one of the first conductive film CF1 and the second conductive film CF2.

[0143] like Figure 8B As shown in FIG. 1 , the fourth conductive film CF4 may have a thickness t3 equal to the thickness t1 of the first conductive film CF1, however, it is not limited thereto. Figure 8CAs shown in , the fourth conductive film CF4 may have a thickness t3 equal to the thickness t2 of the second conductive film CF2. Figure 8B It is also shown that the fourth conductive film CF4 overlaps with a pair of openings OP3 and OP4, one opening OP3 being located between the second conductive adhesive CA2 and the third conductive adhesive CA3, and the other opening OP4 being located between the first conductive adhesive CA1 and the second conductive film CF2. Figure 8C Only one opening OP3 between the second conductive adhesive CA2 and the third conductive adhesive CA3 is shown.

[0144] The double-sided adhesive film DAP and the single-sided adhesive film SAP may be electrically connected to each other through the fourth conductive film CF4 of the connecting portion CP. When the second support plate SP2 is deformed due to an external force, the second conductive film CF2 may not contact the rear surface of the second support plate SP2. In this case, the second electrostatic path formed when the second support plate SP2 is electrically connected to the ground line GRL through the single-sided adhesive film SAP may not be provided. When the second electrostatic path is not formed, the double-sided adhesive film DAP and the single-sided adhesive film SAP may be electrically connected to each other through the connecting portion CP to enhance the electrostatic discharge function. As described above, when the double-sided adhesive film DAP and the single-sided adhesive film SAP are electrically connected to each other through the connecting portion CP, an electrostatic path may be provided between the second support plate SP2 and the ground line GRL electrically connected to each other through the single-sided adhesive film SAP, the connecting portion CP and the double-sided adhesive film DAP.

[0145] When the connection portion CP is disposed on the conductive adhesive film CAF2, the ability of the display device DD to perform an electrostatic discharge function increases.

[0146] 7A to 8C The structure in which the connection portion CP includes only the fourth conductive film CF4 is shown, however, the inventive concept is not limited thereto. In other words, the connection portion CP may also include at least one of a conductive adhesive disposed between the fourth conductive film CF4 and the circuit board FPCB and a conductive adhesive disposed between the fourth conductive film CF4 and the second support plate SP2.

[0147] FIG. 5A to FIG. 7B The structure in which the single-sided adhesive film SAP is disposed adjacent to one short side of the circuit board FPCB is shown, however, the inventive concept is not limited thereto. In other words, the position of the single-sided adhesive film SAP may be changed according to the position of the first circuit element CM1. For example, when the first circuit element CM1 is moved, the single-sided adhesive film SAP may be moved to overlap with the first circuit element CM1.

[0148] Fig.9A is a rear view showing a display device DD according to an exemplary embodiment of the present inventive concept, and Fig. 9B It is shown Fig.9AA rear view of the second support plate SP2 and the circuit board FPCB shown in FIG. Fig.9A and Fig. 9B In the same reference numerals, Figure 5A and Figure 5B , and therefore, detailed description of the same elements may be omitted.

[0149] refer to Figure 4 , Fig.9A and Fig. 9B , the conductive adhesive film CAF3 may include a first double-sided adhesive film DAP1, a second double-sided adhesive film DAP2, a third double-sided adhesive film DAP3 and a single-sided adhesive film SAP. The first double-sided adhesive film DAP1 and the second double-sided adhesive film DAP2 may be disposed adjacent to the opposite short sides of the circuit board FPCB, and the third double-sided adhesive film DAP3 may be disposed adjacent to one long side of the circuit board FPCB. The first double-sided adhesive film DAP1, the second double-sided adhesive film DAP2 and the third double-sided adhesive film DAP3 may be formed integrally with each other and may have a single film shape. In other words, the first double-sided adhesive film DAP1, the second double-sided adhesive film DAP2 and the third double-sided adhesive film DAP3 may be a single film.

[0150] The single-sided adhesive film SAP may be disposed adjacent to the other long side of the circuit board FPCB. For example, the other long side of the circuit board FPCB is closer to the folding area FA2. The single-sided adhesive film SAP may be disposed between the first double-sided adhesive film DAP1 and the second double-sided adhesive film DAP2. The single-sided adhesive film SAP may be spaced apart from the first double-sided adhesive film DAP1 to the third double-sided adhesive film DAP3.

[0151] The circuit board FPCB may include a first circuit element CM3 installed in an area corresponding to the single-sided adhesive film SAP and a second circuit element CM2 installed in an area corresponding to at least one of the first to third double-sided adhesive films DAP1 to DAP3. The first circuit element CM3 may have a size larger than that of the second circuit element CM2.

[0152] In the present exemplary embodiment, the configuration of each of the first to third double-sided adhesive films DAP1 to DAP3 is similar to that of the reference Figure 5A , Figure 5B , Fig. 6A , Figure 6B , Fig. 7A , Figure 7B as well as FIG. 8A to FIG. 8C The configuration of the double-sided adhesive film DAP described in the reference, and therefore, its details may be omitted. Similarly, the configuration of the single-sided adhesive film SAP is similar to that of the reference Figure 5A , Figure 5B , Fig. 6A , Figure 6B , Fig. 7A , Figure 7B as well as FIG. 8A to FIG. 8C The configuration of the single-sided adhesive film SAP is described, and therefore, the details thereof may be omitted.

[0153] The circuit board FPCB may include a first step difference compensation film SCF1 and a second step difference compensation film SCF3. The first step difference compensation film SCF1 is used to connect the ground line GRL (reference Fig. 6A ) is electrically connected to the first to third double-sided adhesive films DAP1 to DAP3, and the second step difference compensation film SCF3 is used to electrically connect the single-sided adhesive film SAP to the ground line GRL. The first step difference compensation film SCF1 may overlap with at least one of the first to third double-sided adhesive films DAP1 to DAP3, and may be in direct contact with one of the first to third double-sided adhesive films DAP1 to DAP3. The second step difference compensation film SCF3 may overlap with the single-sided adhesive film SAP, and may be in direct contact with the single-sided adhesive film SAP.

[0154] Fig.9A and Fig. 9B FIG. 4 shows a structure in which the mounting position of the first circuit element CM3 is changed. In other words, when Figure 5A and Figure 5B When compared, the first circuit element CM3 ( Figure 5A and Figure 5B The shape and position of CM1) in is changed, and therefore, Fig.9A and Fig. 9B The conductive adhesive film CAF3 shown in FIG. Figure 5A and Figure 5B The shape of the conductive adhesive film CAF1 shown in FIG. 1 is different from that of the conductive adhesive film CAF3. However, the structure and function of the conductive adhesive film CAF3 may be substantially the same as those of the conductive adhesive film CAF1.

[0155] Fig. 10A is a rear view showing a display device DD according to an exemplary embodiment of the present inventive concept, and Fig. 10B It is shown Fig. 10A 2 is a rear view of the second support plate SP2 and the circuit board FPCB shown in FIG.

[0156] refer to Figure 4 , Fig. 10A and Fig. 10B, the conductive adhesive film CAF4 may include a first double-sided adhesive film DAP1, a second double-sided adhesive film DAP2, and a third double-sided adhesive film DAP3, a single-sided adhesive film SAP, and a first connection portion CP1 and a second connection portion CP2. When viewed in a plane, the first double-sided adhesive film DAP1 to the third double-sided adhesive film DAP3 and the single-sided adhesive film SAP may be spaced apart from each other. Therefore, a space may be provided between the first double-sided adhesive film DAP1 to the third double-sided adhesive film DAP3 and the single-sided adhesive film SAP. The first connection portion CP1 may be provided in the space to connect the first double-sided adhesive film DAP1 to the single-sided adhesive film SAP, and the second connection portion CP2 may be provided in the space to connect the third double-sided adhesive film DAP3 to the single-sided adhesive film SAP.

[0157] Fig. 10A and Fig. 10B The conductive adhesive film CAF4 is shown to include a structure of two connection portions CP1 and CP2 , however, the present inventive concept is not limited thereto. In other words, the conductive adhesive film CAF4 may include one or three or more connection portions.

[0158] Each of the first connection portion CP1 and the second connection portion CP2 may have 7A to 8C The configuration of the connection portion CP shown in FIG. 1 is the same configuration as that of the first connection portion CP1 and the second connection portion CP2. Therefore, a detailed description of the first connection portion CP1 and the second connection portion CP2 may be omitted.

[0159] As described above, even when the single-sided adhesive film SAP is not in contact with the second support plate SP2, since the first double-sided adhesive film DAP1 and the third double-sided adhesive film DAP3 are electrically connected to the single-sided adhesive film SAP through the first connection portion CP1 and the second connection portion CP2, an electrostatic path can be provided between the second support plate SP2 and the ground line GRL via the second step difference compensation film SCF3. Therefore, when the conductive adhesive film CAF4 includes the first connection portion CP1 and the second connection portion CP2, the display device DD can have enhanced electrostatic discharge characteristics.

[0160] Fig.11A is a rear view showing a display device DD according to an exemplary embodiment of the present inventive concept, and Fig. 11B It is shown Fig.11A 2 is a rear view of the second support plate SP2 and the circuit board FPCB shown in FIG.

[0161] refer to Figure 4 , Fig.11A and Fig. 11B , the conductive adhesive film CAF5 may include a double-sided adhesive film DAP, a first single-sided adhesive film SAP1, and a second single-sided adhesive film SAP2.

[0162] The circuit board FPCB may include a first circuit element CM11 installed in a region corresponding to the first single-sided adhesive film SAP1, a second circuit element CM2 installed to overlap the double-sided adhesive film DAP, and a third circuit element CM12 installed in a region corresponding to the second single-sided adhesive film SAP2. The first circuit element CM11 and the third circuit element CM12 may have a size larger than that of the second circuit element CM2.

[0163] In the present exemplary embodiment, since the configuration of the double-sided adhesive film DAP is similar to that of the reference FIG. 5A to FIG. 8C The configuration of the double-sided adhesive film DAP described above is not described, and therefore the details thereof may be omitted. Similarly, since the configuration of each of the first single-sided adhesive film SAP1 and the second single-sided adhesive film SAP2 is similar to that of the reference FIG. 5A to FIG. 8C The configuration of the single-sided adhesive film SAP is described, and thus the details thereof may be omitted.

[0164] The circuit board FPCB may include a ground line GRL (reference Fig. 6A ) A first step difference compensation film SCF1 electrically connected to the double-sided adhesive film DAP, a second step difference compensation film SCF21 electrically connecting the first single-sided adhesive film SAP1 to the ground line GRL, and a third step difference compensation film SCF22 electrically connecting the second single-sided adhesive film SAP2 to the ground line GRL. The first step difference compensation film SCF1 may overlap with the double-sided adhesive film DAP and may be in direct contact with the double-sided adhesive film DAP. The second step difference compensation film SCF21 may overlap with the first single-sided adhesive film SAP1 and may be in direct contact with the first single-sided adhesive film SAP1. The third step difference compensation film SCF22 may overlap with the second single-sided adhesive film SAP2 and may be in direct contact with the second single-sided adhesive film SAP2.

[0165] Fig.11A and Fig. 11B 2 shows an example of using two single-sided adhesive films SAP1 and SAP2 when two large circuit components CM11 and CM12 are spaced apart from each other on the circuit board FPCB. Figure 5A and Figure 5B Compared to the single-sided adhesive film, the number is changed, however, Fig.11A and Fig. 11B The conductive adhesive film CAF5 shown in FIG. Figure 5A and Figure 5B The functions of the conductive adhesive film CAF1 shown in FIG. 5 are basically similar to those of the conductive adhesive film CAF1.

[0166] Fig. 12A is a rear view showing a display device DD according to an exemplary embodiment of the present inventive concept, and Fig. 12B It is shown Fig. 12A 2 is a rear view of the second support plate SP2 and the circuit board FPCB shown in FIG.

[0167] refer to Figure 4 , Fig. 12A and Fig. 12B , the conductive adhesive film CAF6 may include a double-sided adhesive film DAP, a first single-sided adhesive film SAP1 and a second single-sided adhesive film SAP2, and a first connection portion CP11, a second connection portion CP21 and a third connection portion CP22. When observed in a plane, the first single-sided adhesive film SAP1 and the second single-sided adhesive film SAP2 may be spaced apart from the double-sided adhesive film DAP. Therefore, a space may be provided between the first single-sided adhesive film SAP1 and the second single-sided adhesive film SAP2 and the double-sided adhesive film DAP. The first connection portion CP11 may be disposed in the space and the double-sided adhesive film DAP may be connected to the first single-sided adhesive film SAP1, and the second connection portion CP21 and the third connection portion CP22 may be disposed in the space and the second single-sided adhesive film SAP2 may be connected to the double-sided adhesive film DAP.

[0168] Fig. 12A and Fig. 12B The conductive adhesive film CAF6 is shown to include a structure of three connection parts CP11, CP21, and CP22, however, the present inventive concept is not limited thereto. In other words, the conductive adhesive film CAF6 may include two or four or more connection parts.

[0169] Each of the first connection portion CP11, the second connection portion CP21, and the third connection portion CP22 may include 7A to 8C The configuration of the connection portion CP shown in is the same configuration. Therefore, a detailed description of the first connection portion CP11, the second connection portion CP21, and the third connection portion CP22 may be omitted.

[0170] As described above, since the double-sided adhesive film DAP can be electrically connected to the first single-sided adhesive film SAP1 and the second single-sided adhesive film SAP2 through the first connecting portion CP11, the second connecting portion CP21 and the third connecting portion CP22, even if at least one of the first single-sided adhesive film SAP1 and the second single-sided adhesive film SAP2 is not in contact with the second supporting plate SP2, an electrostatic path can be provided between the second supporting plate SP2 and the ground line GRL via the second step difference compensation film SCF21 and the third step difference compensation film SCF22, and therefore, the display device DD can have enhanced electrostatic discharge characteristics.

[0171] The exemplary embodiments of the present invention provide a display device capable of reducing noise generation caused by pressing. For example, in the above exemplary embodiments, although the support plate is deformed in a structure in which the conductive adhesive film is disposed between the support plate and the circuit board to prevent static electricity, the conductive adhesive film may be non-repeatedly attached to and detached from the support plate, and therefore, noise caused by the attachment and detachment actions may be removed. Although the present invention has been described with reference to the exemplary embodiments of the present invention, it should be understood by those skilled in the art that various changes and modifications may be made to the exemplary embodiments of the present invention without departing from the spirit and scope of the present invention as set forth in the appended claims.

Claims

1. A display device, comprising: A display module, comprising a display panel for displaying an image and a circuit board connected to the display panel; A support plate, arranged on the rear surface of the display module; as well as A conductive adhesive film is disposed between the circuit board and the support plate, and the conductive adhesive film comprises: a double-sided adhesive film fixed to the rear surface of the support plate and the rear surface of the circuit board; and a single-sided adhesive film fixed to one of the rear surface of the support plate and the rear surface of the circuit board, Wherein, the display module further includes: a first circuit element disposed on the circuit board and overlapping the single-sided adhesive film; a second circuit element disposed on the circuit board and overlapping the double-sided adhesive film, and Wherein, the first circuit element is larger than the second circuit element.

2. The display device according to claim 1, wherein: The double-sided adhesive film comprises: a first conductive film; a first conductive adhesive disposed between the first conductive film and the rear surface of the support plate; and A second conductive adhesive is disposed between the first conductive film and the rear surface of the circuit board.

3. The display device according to claim 2, wherein: The single-sided adhesive film comprises: a second conductive film; and A third conductive adhesive is disposed between the second conductive film and the rear surface of the circuit board.

4. The display device according to claim 3, wherein: The second conductive film is thicker than the first conductive film.

5. The display device according to claim 4, wherein: The second conductive film is spaced apart from the first conductive film.

6. The display device according to claim 3, wherein: The circuit board comprises: Ground wire; a cover layer disposed on the ground line and having an opening exposing a portion of the ground line; and A step difference compensation film is disposed in the opening and connected to the portion of the ground line.

7. The display device according to claim 6, wherein: The step difference compensation film comprises: a third conductive film; and a fourth conductive adhesive disposed between the third conductive film and the portion of the ground line, The third conductive film is attached to the second conductive adhesive and the third conductive adhesive, and the ground line is connected to the support plate through the step difference compensation film, the double-sided adhesive film, and the single-sided adhesive film.

8. The display device according to claim 3, wherein: The conductive adhesive film further includes a connection portion connecting the first conductive film to the second conductive film.

9. The display device according to claim 8, wherein: The connection portion includes a fourth conductive film formed integrally with the first conductive film and the second conductive film.

10. The display device according to claim 9, wherein: The fourth conductive film has the same thickness as one of the first conductive film and the second conductive film.

11. The display device according to claim 1, wherein: The display module includes a folding area and a plurality of non-folding areas.

12. The display device according to claim 11, wherein: The conductive adhesive film is disposed in one of the plurality of folding areas.

13. The display device according to claim 1, wherein: The support plate is a metal plate. 14 . The display device according to claim 1 , further comprising a buffer film disposed between the display panel and the support plate.

15. The display device according to claim 1, wherein: The display module further includes a window disposed on the display panel and including a flexible material.

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