Protective film peeling apparatus and protective film peeling method using the same

Abstract

A protective film peeling apparatus and a protective film peeling method using the same are disclosed. The protective film peeling method according to an embodiment of the present application includes the steps of providing a mother glass, a plurality of display portions, and a protective portion covering the plurality of display portions on a stage, wherein the plurality of display portions are arranged on the mother glass and each include an inspection pad; half-cutting the protective portion along a first cutting line; full-cutting the protective portion along a second cutting line different from the first cutting line; and peeling a portion of the protective portion.

Description

TECHNICAL FIELD

[0001] The present application relates to a protective film peeling apparatus with improved reliability, a protective film peeling method, and a display module manufacturing method. BACKGROUND

[0002] Various display devices for multimedia devices such as televisions, portable phones, tablet PCs, navigators, game consoles, etc. are being developed. The display devices include various functional components such as display modules, input sensors, windows, optical films, etc.

[0003] The functional components are combined with each other through manufacturing processes or processing processes. The display devices of a stacked structure are manufactured through a plurality of combination processes. SUMMARY

[0004] An object of the present application is to provide a protective film peeling apparatus with improved reliability.

[0005] An object of the present application is to provide a protective film peeling method and a display module manufacturing method using the protective film peeling apparatus.

[0006] A protective film peeling method according to an embodiment of the present application can include the steps of providing a mother glass, a plurality of display parts, and a protective part covering the plurality of display parts on a stage, wherein the plurality of display parts are arranged on the mother glass and each include an inspection pad part, half-cutting the protective part along a first cutting line, full-cutting the protective part along a second cutting line different from the first cutting line, and peeling a part of the protective part.

[0007] A pad area in which the inspection pad is arranged and a protective area adjacent to the pad area are defined in each of the plurality of display parts, and the first cutting line can correspond to a first edge which is a part of a plurality of edges surrounding each of the plurality of display parts and an area between the protective area and the pad area.

[0008] The second cutting line can correspond to a second edge which is a remaining part of the plurality of edges.

[0009] The second edge can be one of edges of the pad area.

[0010] Each of the plurality of display parts can further include a signal pad arranged in the pad area and electrically connected to the inspection pad, and the second cutting line can correspond to an area between the signal pad and the inspection pad.

[0011] The half-cutting step can include the step of irradiating a first laser beam, and the full-cutting step can include the step of irradiating a second laser beam having higher energy than the first laser beam.

[0012] The half-cutting step and the full-cutting step can be simultaneously performed.

[0013] A protective film peeling apparatus according to an embodiment of the present application can include a stage, a light source part disposed on the stage, irradiating a first laser beam along a first cutting line and a second laser beam having higher energy than the first laser beam along a second cutting line different from the first cutting line, and a peeling part disposed on the stage.

[0014] The apparatus can further include a first optical part transforming a Gaussian beam profile of at least one of the first laser beam and the second laser beam into a flat-top beam profile, and a second optical part transforming at least one of the first laser beam and the second laser beam into a beam profile extending in a first direction.

[0015] The apparatus can further include a scanning part combined with the light source part and moving in a first direction and a second direction crossing the first direction, wherein the stage can move in the first direction or the second direction as the scanning part moves.

[0016] According to the present application, a protective part can be processed using a laser beam. A region of a mother glass and a region of the protective part each can not have physical contact with a region in which a plurality of display parts are disposed. Since the protective part is processed by the laser beam without physical contact, the mother glass can not be cracked and damaged by physical contact. Accordingly, a protective film peeling apparatus having improved reliability, a protective film peeling method using the same, and a display module manufacturing method can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 FIG. 1 is a perspective view illustrating a protective film peeling apparatus according to an embodiment of the present application.

[0018] Figure 2 FIG. 2 is a flowchart illustrating a protective film peeling method according to an embodiment of the present application.

[0019] Figure 3 FIG. 3 is a plan view of a mother glass and a protective part according to an embodiment of the present application.

[0020] Figure 4 FIG. 4 is a cross-sectional view taken along line I-I' of FIG. 3 according to an embodiment of the present application. Figure 1

[0021] Figure 5 ​is a cross-sectional view of a protective film peeling apparatus according to an embodiment of the present application.

[0022] Figure 6 is a plan view of a protective film peeling apparatus according to an embodiment of the present application.

[0023] Figure 7 is a plan view of a protective film peeling apparatus according to an embodiment of the present application.

[0024] Figure 8 is a cross-sectional view of a protective film peeling apparatus according to an embodiment of the present application.

[0025] Figure 9 is a cross-sectional view showing an etching process of a mother glass according to an embodiment of the present application.

[0026] Figure 10 is a plan view showing a step of a display module manufacturing method according to an embodiment of the present application.

[0027] Figure 11 is a cross-sectional view showing a first preliminary display module according to an embodiment of the present application.

[0028] Figure 12 is a cross-sectional view showing a second preliminary display module according to an embodiment of the present application.

[0029] Figure 13 is a plan view showing a display module according to an embodiment of the present application.

[0030] Figure 14 is a plan view showing a mother glass and a protective portion according to an embodiment of the present application.

[0031] Symbol Explanation

[0032] FPA: protective film peeling apparatus ST: stage

[0033] LZ: light source portion SC: scanning portion

[0034] PR: peeling portion WS: mother glass

[0035] PP: protective portion DETAILED DESCRIPTION

[0036] In the present specification, when referred to as that a certain constitutional element (or a region, a layer, a portion, etc.) is located "on", "connected to", or "combined with" another constitutional element, it means that it can be directly disposed on, connected to / bonded to, or a third constitutional element can be disposed therebetween.

[0037] The same reference numerals denote the same constituent elements. Also, in the drawings, the thickness, ratio, and size of the constituent elements are exaggerated for effective explanation of the technical content.

[0038] "and / or" includes all of the combinations of the relevant constituents which can be defined.

[0039] The first, second, and the like terms can be used to explain various constituent elements, but the constituent elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one constituent element from another in the context of the description. For example, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element without departing from the scope of the present application. The singular expression includes the plural expression as long as it is clear from the context that the singular expression does not mean a different meaning.

[0040] Also, the terms "below", "lower", "above", "upper", and the like are used to explain the relative relationship between the constituents shown in the drawings. The terms are explained as relative concepts based on the direction shown in the drawings.

[0041] All of the terms used in the present specification (including technical and scientific terms) have the same meanings as those generally understood by those skilled in the art to which the present application pertains, unless otherwise defined. Also, the terms such as those defined in a generally used dictionary are to be interpreted as having meanings consistent with the meanings in the context of the relevant technology, and are not to be interpreted as being ideally or excessively formal meanings unless otherwise defined. Technical and scientific terms used in the present specification have the same or similar meanings as those generally understood by those skilled in the art to which the present application pertains.

[0042] The terms "include" and / or "have" and the like used in the present specification are intended to describe and / or include a possibility that there are one or more other constituent elements in addition to the described constituent elements, and are not intended to exclude the other constituent elements.

[0043] Hereinafter, an embodiment of the present application will be described with reference to the accompanying drawings.

[0044] Figure 1 is a perspective view showing a protective film peeling apparatus according to an embodiment of the present application.

[0045] Referring to Figure 1 , the protective film peeling apparatus FPA can include a stand ST, a light source part LZ, a scanning part SC, a control part CT, and a peeling part PR.

[0046] The stand ST can support a mother glass WS covered by a protected part PP. For example, the stand ST can support the mother glass WS by vacuum suction. Although Figure 1The case where the area of the protective portion PP is smaller than the area of the mother glass WS is shown, but the area of the protective portion PP according to an embodiment of the present application is not limited thereto. For example, the area of the protective portion PP can be the same as the area of the mother glass WS.

[0047] The mother glass WS can be parallel to a plane defined by the first direction DR1 and a second direction DR2 intersecting the first direction DR1. A normal of the mother glass WS can point to a third direction DR3. The third direction DR3 can point to a thickness direction of the mother glass WS. The third direction DR3 can be a direction intersecting the first direction DR1 and the second direction DR2. The first direction DR1, the second direction DR2, and the third direction DR3 can be perpendicular to each other.

[0048] Further, the directions indicated by the first direction DR1 to the third direction DR3 are relative concepts and can be converted to different directions. Also, in the present specification, a plane defined by the first direction DR1 and the second direction DR2 is defined as a plane, and "observed on the plane" can be defined as a case where it is observed from the third direction DR3.

[0049] The mother glass WS can include a glass substrate.

[0050] The mother glass WS can be arranged with a plurality of display portions DA. Although Figure 1 The display portions DA are shown to be arranged in a 3x3 matrix, but this is merely exemplary, and the number of the plurality of display portions DA according to an embodiment of the present application is not limited thereto. For example, the plurality of display portions DA can be arranged in various numbers according to the size of the mother glass WS and the size of each of the plurality of display portions DA.

[0051] Each of the plurality of display portions DA can be separated to form a display module. The plurality of display portions DA can each include a display panel. The display panel according to an embodiment of the present application can be a light emitting type display panel, and is not particularly limited. For example, the display panel can include an organic light emitting display panel or a quantum dot light emitting display panel. The light emitting layer of the organic light emitting display panel can include an organic light emitting substance, and the light emitting layer of the quantum dot light emitting display panel can include quantum dots or quantum rods, etc. For example, the display panel according to an embodiment of the present application can be the organic light emitting display panel.

[0052] The protective portion PP can be arranged on the plurality of display portions DA, thereby covering the plurality of display portions DA.

[0053] The light source section LZ can be disposed on the stage ST. The light source section LZ can be a device that oscillates the laser beam LS. For example, the light source section LZ can include an oscillator. The light source section LZ can irradiate the laser beam LS to the protection section PP. The laser beam LS can include a CO2 laser. However, it is merely exemplary, and the laser beam LS according to an embodiment of the present application is not limited thereto. For example, the laser beam LS can include an excimer laser, a YAG (Yttrium Aluminum Garnet) laser, a glass laser, a YVO4 (Yttrium Orthovanadate) laser, or an Ar laser.

[0054] The scanning section SC can be combined with the light source section LZ. The scanning section SC can move in the first direction DR1 and the second direction DR2. The laser beam LS can be irradiated onto the protection section PP by the movement of the scanning section SC.

[0055] The scanning section SC can repeatedly move in the first direction DR1 or the second direction DR2. The light source section LZ can repeatedly irradiate the laser beam LS to the protection section PP in the first direction DR1 or the second direction DR2. The stage ST can move in the first direction DR1 or the second direction DR2 according to the movement of the scanning section SC. According to the present application, the laser beam LS can be repeatedly irradiated in the first direction DR1 or the second direction DR2. The instantaneous peak intensity applied to the protection section PP can be reduced. By the reduced instantaneous peak intensity, thermal deformation and damage of the mother glass WS can be prevented. Accordingly, a protection film peeling apparatus FPA having improved reliability can be provided.

[0056] The control section CT can control the light source section LZ. The control section CT can select a kind of the laser beam LS irradiated from the light source section LZ. The control section CT can be connected with the scanning section SC. The control section CT can control the movement of the scanning section SC.

[0057] The peeling section PR can be disposed on the stage ST. The peeling section PR can be disposed adjacent to one end of the protection section PP.

[0058] The protection film peeling apparatus FPA can further include an optical section OP. The optical section OP can transform the shape of the laser beam LS in combination with the light source section LZ. The optical section OP can include a first optical section or a second optical section.

[0059] The first optical section can transform a Gaussian Beam profile of the laser beam LS into a Flat Top Beam profile. The Gaussian Beam profile has a difference in energy intensity between a center portion and a surrounding portion on a cross section of the beam, in contrast, the Flat Top Beam profile can have a uniform energy intensity as a whole on a cross section of the beam. The first optical section can transform a peak intensity of the laser beam LS to be above a minimum processing intensity value and below a deformation intensity value. The minimum processing intensity value can be an intensity of the laser beam LS having an energy that enables the laser beam LS to form a groove in the protection portion PP. The deformation intensity value can be an intensity of the laser beam LS that deforms the mother glass WS by heat energy applied from the laser beam LS. According to the present application, the first optical section can adjust the peak intensity of the laser beam LS. Thermal deformation and damage of the mother glass WS can be prevented. Thus, a protection film peeling apparatus FPA having improved reliability can be provided.

[0060] The second optical section can transform the laser beam LS into a beam shape extending in the first direction DR1 or the second direction DR2. The second optical section can include at least one cylindrical lens. When viewed in a plane, an intensity of the laser beam LS not transformed by the second optical section can have a peak intensity at a center, and can have an intensity smaller than the peak intensity the farther away from the center in the first direction DR1 or the second direction DR2. When viewed in a plane, an intensity of the laser beam LS transformed by the second optical section can have a peak intensity extending in the first direction DR1 or the second direction DR2. According to the present application, the second optical section can disperse an energy intensity of the laser beam LS concentrated in a point when viewed in a plane to a line extending in the first direction DR1 or the second direction DR2. Thermal deformation and damage of the mother glass WS can be prevented. Thus, a protection film peeling apparatus FPA having improved reliability can be provided.

[0061] Figure 2 is a flowchart illustrating a protection film peeling method according to an embodiment of the present application, Figure 3 is a plan view of a mother glass and a protection portion according to an embodiment of the present application, Figure 4 is a cross-sectional view taken along Figure 1 I-I' of FIG. 1.

[0062] Referring to Figures 2 to 4 , a mother glass WS, a plurality of display portions DA, and a protection portion PP can be provided on a stage ST (S100). The mother glass WS disposed on the stage ST can have a first thickness WS-H1. The first thickness WS-H1 can have a value of 400 μm or more and 600 μm or less.

[0063] The plurality of display portions DA can each include a display panel DP. Figure 3 One of the plurality of display portions DA is shown.

[0064] The display panel DP can be arranged on a mother glass WS. The display panel DP can include a drive circuit GDC, a plurality of signal lines SGL (hereinafter, referred to as signal lines), a plurality of signal pads DP-PD (hereinafter, referred to as signal pads), and a plurality of pixels PX (hereinafter, referred to as pixels).

[0065] A display area DP-DA can be defined as an area in which the pixels PX are arranged. A non-display area DP-NDA can be an area adjacent to the display area DP-DA. The non-display area DP-NDA can surround the display area DP-DA. However, the shape of the non-display area DP-NDA according to an embodiment of the present application is not limited thereto. The shape of the display area DP-DA and the shape of the non-display area DP-NDA can be designed relative to each other.

[0066] The drive circuit GDC can include a scan drive circuit. The scan drive circuit can generate a plurality of scan signals (hereinafter, referred to as scan signals) and sequentially output the scan signals to a plurality of scan lines SL (hereinafter, referred to as scan lines) described later.

[0067] The scan drive circuit can include a plurality of thin film transistors formed through the same process as a drive circuit of the pixel PX (for example, a Low Temperature Polycrystalline Silicon (LTPS) process or a Low Temperature Polycrystalline Oxide (LTPO) process).

[0068] The signal lines SGL can include the scan lines SL, data lines DL, power lines PL, emission control lines (ECLs), and control signal lines CSL.

[0069] Each of the scan lines SL can be connected to a corresponding one of the pixels PX. Each of the data lines DL can be connected to a corresponding one of the pixels PX. The power lines PL can be connected to the pixels PX. Each of the emission control lines (ECLs) can be connected to a corresponding one of the pixels PX. The control signal lines CSL can provide a control signal to the scan drive circuit.

[0070] The signal line SGL can overlap the display area DP-DA and the non-display area DP-NDA. The signal line SGL can include a pad portion and a line portion. The line portion can overlap the display area DP-DA and the non-display area DP-NDA. The pad portion can be disposed at the end of the line portion. The pad portion can be disposed in the non-display area DP-NDA and overlap a corresponding signal pad in the signal pad DP-PD.

[0071] The display panel DP can include a circuit element layer DP-CL, a display element layer DP-OLED, and a sealing layer TFE.

[0072] The circuit element layer DP-CL can be disposed on the mother glass WS. The circuit element layer DP-CL can include at least one insulating layer and a circuit element. The insulating layer can include at least one inorganic layer and at least one organic layer. The circuit element can include a signal line SGL and a driving circuit GDC.

[0073] The display element layer DP-OLED can include an organic light emitting diode. The display element layer DP-OLED can further include an organic layer such as a pixel defining film.

[0074] The sealing layer TFE can be disposed on the display element layer DP-OLED to cover the display element layer DP-OLED. The sealing layer TFE can include a first inorganic layer, an organic layer, and a second inorganic layer which are sequentially stacked in a third direction DR3. However, it is merely exemplary, and the sealing layer TFE according to an embodiment of the present application is not limited thereto. For example, the sealing layer TFE according to an embodiment of the present application can further include a plurality of inorganic layers and a plurality of organic layers.

[0075] The first inorganic layer can prevent external moisture or oxygen from permeating to the display element layer DP-OLED. For example, the first inorganic layer can include silicon nitride, silicon oxide, or a combination thereof.

[0076] The organic layer can be disposed on the first inorganic layer to provide a flat surface. A curvature formed on the first inorganic layer or a particle present on the first inorganic layer, etc. can be covered by the organic layer. For example, the organic layer can include an organic substance.

[0077] The second inorganic layer can be disposed on the organic layer to cover the organic layer. The second inorganic layer can seal moisture or the like discharged from the organic layer to prevent it from flowing to the outside. The second inorganic layer can include silicon nitride, silicon oxide, or a combination thereof.

[0078] The display portion DA can further include a plurality of inspection pads DP-TP (hereinafter, referred to as inspection pads). The inspection pads DP-TP can be arranged in a region adjacent to the signal pads DP-PD. For example, the inspection pads DP-TP can be arranged apart from the signal pads DP-PD in the second direction DR2. Each of the inspection pads DP-TP can be electrically connected to a corresponding signal pad among the signal pads DP-PD. The inspection pads DP-TP can receive an inspection signal from the outside for inspecting an electrical operating state and an optical operating state of the display panel DP. For example, the inspection signal can be a signal for inspecting an image quality of the display panel DP.

[0079] The display portion DA can define a protection region PTA and a pad region PDA. The protection region PTA can be a region in which a portion of the circuit element layer DP-CL and the display element layer DP-OLED are arranged. The pad region PDA can be a region in which another portion of the circuit element layer DP-CL, the signal pads DP-PD, and the inspection pads DP-TP are arranged.

[0080] The protection portion PP can be arranged on the display portion DA. The protection portion PP can cover the display portion DA. The protection portion PP can define a non-peeling region PA and a surrounding region BA. The non-peeling region PA can overlap the display portion DA when viewed in plan. The surrounding region BA can be a region adjacent to the non-peeling region PA. The non-peeling region PA can be provided in a plurality, and the plurality of non-peeling regions PA can be regions arranged on a plurality of display portions DA. The surrounding region BA can be a boundary region between the plurality of non-peeling regions PA.

[0081] The protection portion PP can include a protection film PF and an adhesive portion ADH.

[0082] The protection film PF can include a plastic film. For example, the protection film PF can include polyethylene terephthalate (PET).

[0083] The adhesive portion ADH can be arranged under the protection film PF. The adhesive portion ADH can include an adhesive substance. The adhesive portion ADH can include a substance having low adhesive force and high viscoelasticity. Accordingly, when the protection portion PP is removed from the display portion DA, the amount of residual adhesive substance remaining on the display portion DA can be minimized. For example, the adhesive portion ADH can include a silicon-based adhesive substance. However, this is merely exemplary, and the adhesive substance of the adhesive portion ADH according to an embodiment of the present application is not limited thereto. For example, the adhesive portion ADH can include a urethane-based adhesive substance.

[0084] Figure 5 is a cross-sectional view illustrating a protection film peeling apparatus according to an embodiment of the present application, Figure 6is a plan view showing a protective film peeling apparatus according to an embodiment of the present application. In the description of Figure 5 the same reference numerals are used to designate components that have been explained through Figure 4 the description of the drawings, and the explanation thereof is omitted.

[0085] Referring to Figure 1 , Figure 2 , Figure 5 and Figure 6 , the light source section LZ can provide a laser beam LS. The laser beam LS can include a first laser beam LS-1 and a second laser beam LS-2. The second laser beam LS-2 can have an energy higher than that of the first laser beam LS-1. The control section CT can control the laser beam LS irradiated from the light source section LZ by selecting the first laser beam LS-1 or the second laser beam LS-2.

[0086] The light source section LZ can semi-cut (S200) the protective section PP along the first cutting lines HCL1, HCL2, HCL3, HCL4. The light source section LZ can irradiate the first laser beam LS-1 along the first cutting lines HCL1, HCL2, HCL3, HCL4.

[0087] The first laser beam LS-1 can have an energy of 24 W (watt) or more and 33 W or less. In a case where the first laser beam LS-1 has an energy lower than 24 W, a portion of the thickness of the adhesive section ADH can not be cut, resulting in a portion (e.g., the adhesive section ADH) of the protective section PP not being peeled. In a case where the first laser beam LS-1 has an energy higher than 33 W, the thickness of the adhesive section ADH can be entirely cut, resulting in at least a portion of the non-peeling area PA being peeled.

[0088] The first laser beam LS-1 can cut a portion of the thickness of the protective section PP. For example, the first laser beam LS-1 can cut the entire thickness of the protective film PF and a portion of the thickness of the adhesive section ADH in the third direction DR3.

[0089] The light source section LZ can form a first groove HM1 in a region corresponding to the first cutting lines HCL1, HCL2, HCL3, HCL4. The depth HM-H1 of the first groove HM1 can be greater than the thickness of the protective film PF and less than the thickness of the protective section PP.

[0090] The first cutting lines HCL1, HCL2, HCL3, HCL4 can correspond to the first edges HCL1, HCL2, HCL4 that are a portion of the plurality of edges surrounding each of the plurality of display sections DA and the region HCL3 between the protective area PTA and the pad area PDA.

[0091] The light source portion LZ can cut the protective portion PP entirely along a second cutting line FCL different from the first cutting lines HCL1, HCL2, HCL3, HCL4 (S300). The light source portion LZ can irradiate the second laser beam LS-2 along the second cutting line FCL.

[0092] The second laser beam LS-2 can have an energy higher than that of the first laser beam LS-1. The second laser beam LS-2 can have an energy of 34 W or more and 51 W or less. In a case where the second laser beam LS-2 has an energy lower than 34 W, a portion of the thickness of the adhesive portion ADH can not be cut, and thus the thickness of the protective portion PP can not be cut entirely. In this case, when the protective portion PP is peeled, a force applied to the second cutting line FCL can be transmitted to the non-peeling area PA, and at least a portion of the non-peeling area PA can be peeled. In a case where the second laser beam LS-2 has an energy greater than 51 W, the energy of the second laser beam LS-2 can be transmitted to the mother glass WS, and thus a crack can occur in the mother glass WS. However, according to the present application, the second laser beam LS-2 can prevent thermal deformation and damage from occurring in the mother glass WS. Thus, a protective film peeling apparatus FPA (refer to Figure 1 ) having improved reliability can be provided.

[0093] The second laser beam LS-2 can cut the entire thickness of the protective portion PP. For example, the second laser beam LS-2 can cut the entire thickness of the protective film PF and the thickness of the adhesive portion ADH in the third direction DR3.

[0094] The light source portion LZ can form a second groove HM2 in a region corresponding to the second cutting line FCL. The depth HM-H2 of the second groove HM2 can be the same as the thickness of the protective portion PP.

[0095] The second cutting line FCL can correspond to a second edge FCL that is a portion of the plurality of edges surrounding each of the plurality of display portions DA other than the first edges HCL1, HCL2, HCL4. The second edge FCL can be one of the edges of the pad area PDA. The second edge FCL can be spaced apart from the protective area PTA with the pad area PDA interposed therebetween. The first edges HCL1, HCL2, HCL4 and the second edge FCL can form a closed loop when viewed in plan.

[0096] The second cutting line FCL can not overlap the circuit element layer DP-CL when viewed in plan. It is possible to prevent the energy of the second laser beam LS-2 from being transmitted to the signal pad DP-PD. Thus, it is possible to prevent damage to the signal pad DP-PD of the display panel DP (refer to Figure 2 ).

[0097] The step of partially cutting the protection portion PP along the first cutting line HCL1, HCL2, HCL3, HCL4 (S200) and the step of fully cutting the protection portion PP along the second cutting line FCL (S300) can be performed simultaneously.

[0098] According to the present application, the light source portion LZ can process the protection portion PP with the laser beam LS. The respective regions of the mother glass WS and the protection portion PP which overlap the region in which the plurality of display portions DA are arranged can not have physical contact. Since the protection portion PP is processed by the laser beam LS without physical contact, cracks and damage due to physical contact can not occur in the mother glass WS. Also, there is no need to secure a region for physical contact, and thus the protection film peeling apparatus FPA can not be restricted in terms of space. Therefore, a protection film peeling apparatus FPA with improved reliability can be provided.

[0099] Figure 7 is a plan view of a protection film peeling apparatus according to an embodiment of the present application, Figure 8 is a cross-sectional view of a protection film peeling apparatus according to an embodiment of the present application. In the description of Figure 7 , the same reference numerals are used to designate the constituent elements described with reference to Figure 6 , and the description thereof will be omitted.

[0100] Referring to Figure 2 , Figure 7 and Figure 8 , the peeling portion PR can peel a portion of the protection portion PP (S400). For example, the peeling portion PR can peel a peripheral region BA of the protection portion PP. The one end portion of the protection portion PP can be adjacent to the second cutting line FCL. The peeling portion PR can include a plurality of peeling tapes PTP (hereinafter referred to as peeling tapes), a plurality of peeling adhesives PAD (hereinafter referred to as peeling adhesives), a moving portion MV, an ascending portion UP, and a head portion HD.

[0101] Each of the peeling tapes PTP can be fixed to the head portion HD. Each of the peeling tapes PTP can extend in the first direction DR1. The peeling tapes PTP can be arranged apart from each other in the second direction DR2. Although Figure 7 four peeling tapes PTP are exemplarily shown, the number of the peeling tapes PTP according to an embodiment of the present application is not limited thereto. One side of each of the peeling tapes PTP is provided at the head portion HD, and the other side of each of the peeling tapes PTP can be attached to the protection portion PP.

[0102] Each peeling adhesive PAD is arranged on the other side of each peeling tape PTP. For example, each peeling adhesive PAD can be attached to a lower portion of the other side of each peeling tape PTP. The peeling adhesive PAD and the protection portion PP can overlap. The peeling adhesive PAD can have a stronger adhesive force than the adhesive portion ADH (refer to Figure 5 ). Thus, the protection portion PP can be easily peeled by the peeling adhesive PAD.

[0103] The moving portion MV can move the rising portion UP, the head portion HD, the peeling tape PTP, and the peeling adhesive PAD in the first direction DR1. For example, the moving portion MV can peel the protection portion PP in the first direction DR1 toward the second cutting line FCL from the one end portion of the protection portion PP.

[0104] The rising portion UP can move the head portion HD, the peeling tape PTP, and the peeling adhesive PAD in the third direction DR3.

[0105] The head portion HD can fix the peeling tape PTP and the peeling adhesive PAD. For example, the head portion HD can fix the peeling tape PTP and the peeling adhesive PAD during the step (S400) of peeling a portion of the protection portion PP. After peeling the portion of the protection portion PP, the head portion HD can separate the peeling tape PTP, the peeling adhesive PAD, and the portion of the protection portion PP. The protection film peeling apparatus FPA (refer to Figure 1 ) can further include a dummy box. The separated peeling tape PTP, peeling adhesive PAD, and portion of the protection portion PP can be discarded in the dummy box.

[0106] While the moving portion MV moves in the first direction DR1 and the rising portion UP moves in the third direction DR3, the protection portion PP can be stressed in the first direction DR1 and the third direction DR3. The second cutting line FCL can be provided with a second groove HM2 (refer to Figure 5 ) extending in the second direction DR2 and additionally extending in a direction crossing the second direction DR2 at each end portion extending in the second direction DR2. For example, the crossing direction can be a direction defined between the first direction DR1 and the second direction DR2.

[0107] The force can be applied along the second cutting line FCL in the first direction DR1 and the third direction DR3. A portion of the second cutting line FCL extending in the second direction DR2 can be peeled by the force applied in the third direction DR3. A portion of the second cutting line FCL additionally extending in a direction crossing the second direction DR2 can be peeled by the force applied in the first direction DR1 and the third direction DR3. The force can be easily transmitted to the first cutting line HCL1, HCL2 extending in the first direction DR1 through the additionally extending portion.

[0108] Since the protection portion PP has been fully cut by the second cutting line FCL, the surrounding area BA and the non-peeling area PA can be separated across the second cutting line FCL. The surrounding area BA of the protection portion PP can be peeled by the force.

[0109] The first cutting line HCL1, HCL2 can be provided with a first groove HM1 (refer to Figure 5 ) extending in the first direction DR1. The force can be applied in the first direction DR1 through the first groove HM1 (refer to Figure 5 ) extending in the first direction DR1. Since the protection portion PP has been half-cut by the first cutting line HCL1, HCL2, the adhesive portion ADH (refer to Figure 5 ) can be easily peeled by the force.

[0110] The first cutting line HCL3 can be provided with a first groove HM1 (refer to Figure 5 ) extending in the second direction DR2. Since the force is applied in the first direction DR1 along the first cutting line HCL1, HCL2, the force can not be applied to the first cutting line HCL3 extending in the second direction DR2. Therefore, the non-peeling area PA overlapping the pad area PDA is not peeled.

[0111] The first cutting line HCL4 can be provided with a first groove HM1 (refer to Figure 5 ) extending in the second direction DR2. The force can be transmitted from the respective ends of the first cutting line HCL1, HCL2 to the first cutting line HCL4. Since the protection portion PP has been half-cut by the first cutting line HCL4, the adhesive portion ADH (refer to Figure 5 ) can be easily separated by the force. Therefore, the non-peeling area PA of the protection portion PP is not peeled, and the surrounding area BA of the protection portion PP can be peeled.

[0112] According to the present application, in the protective film peeling method, the mother glass WS and the protective portion PP each of which overlaps with the region in which the plurality of display portions DA are arranged can not be physically contacted. The mother glass WS can not be cracked and damaged due to the physical contact. Thus, a protective film peeling apparatus FPA (refer to Figure 1 ) having improved reliability can be provided.

[0113] Figure 9 is a cross-sectional view illustrating an etching process of a mother glass according to an embodiment of the present application.

[0114] Referring to Figure 9 , the spraying portion EJ can spray the etching solution CM to the lower surface of the mother glass WS (refer to Figure 8 ). The mother glass WS (refer to Figure 8 ) is etched by the etching solution CM, and thus a first mother glass WS-1 can be formed. The etching solution CM can reduce the thickness of the mother glass WS (refer to Figure 8 ). The etching solution CM can include Hydrofluoric acid.

[0115] The first mother glass WS-1 can have a second thickness WS-H2. The second thickness WS-H2 can be thinner than a first thickness WS-H1 (refer to Figure 4 ). The second thickness WS-H2 can have a value of 100 μm or more and 300 μm or less. The first mother glass WS-1 can be composed of a thin glass.

[0116] The first mother glass WS-1 can be lighter than the mother glass WS. The strength and flatness of the first mother glass WS-1 according to an embodiment of the present application can be higher than a base layer composed of a film.

[0117] According to the present application, in the protective film peeling method, the non-peeling region PA can not be physically contacted. The mother glass WS (refer to Figure 8 ) can not be cracked and damaged due to the physical contact. The first mother glass WS-1 can be easily formed from the mother glass WS (refer to Figure 8 ) without the cracks and the damages. Thus, a display module manufacturing method having improved reliability can be provided.

[0118] Figure 10 is a plan view illustrating a step of a display module manufacturing method according to an embodiment of the present application, Figure 11 is a cross-sectional view illustrating a first preliminary display module according to an embodiment of the present application.

[0119] Referring to Figure 10 and Figure 11In the first mother glass WS-1, a substrate cutting line CL can be defined. The substrate cutting line CL can not overlap the plurality of display portions DA. The cutting wheel CHE can cut the first mother glass WS-1 along the substrate cutting line CL. Accordingly, the plurality of first preliminary display modules DM-1 to which the protection portions PP-1 are bonded can be formed. However, this is merely exemplary, and the configuration of cutting the first mother glass WS-1 according to an embodiment of the present application is not limited thereto. For example, the first mother glass WS-1 can be cut along the substrate cutting line CL by a laser. The protection portions PP-1 can protect the display panel DP (refer to Figure 3 ) during a display module manufacturing process.

[0120] According to the display module manufacturing method according to an embodiment of the present application, the peripheral area BA (refer to Figure 6 ) of the protection portion PP (refer to Figure 6 ) is peeled off, so that the cutting wheel CHE can easily cut the first mother glass WS-1.

[0121] According to the present application, in the protection film peeling method, the non-peeling area PA can not be physically contacted. The mother glass WS (refer to Figure 8 ) can not be cracked and damaged due to the physical contact. When the first mother glass WS-1 is cut by the cutting wheel CHE, the cracking and the damage can be prevented from causing the first mother glass WS-1 to be broken. Accordingly, the display module manufacturing method having improved reliability can be provided.

[0122] Figure 12 is a cross-sectional view illustrating a second preliminary display module according to an embodiment of the present application, Figure 13 is a plan view illustrating a display module according to an embodiment of the present application.

[0123] Referring to Figures 10 to 13 , in the protection portion PP-1, a portion of the protection portion PP-1 overlapping the pad area PDA (refer to Figure 10 ) is peeled off. The portion of the protection portion PP-1 can be easily peeled off by the first groove HM1. The inspection pad DP-TP can be exposed to the outside. Before a scribing process is performed, the second preliminary display module DM-2 can be subjected to a quality inspection.

[0124] The inspection pad DP-TP can be disposed outside a scribe line SCL of the second preliminary display module DM-2. Before the scribe process is performed, the quality inspection for the second preliminary display module DM-2 can be performed by supplying an inspection signal through the inspection pad DP-TP.

[0125] The protection portion PP-1 according to an embodiment of the present application can protect the mother glass WS (refer to Figure 8) and a substrate cutting process using a cutting wheel CHE. Thus, reliability can be ensured when checking the quality of the image using the inspection pad DP-TP after peeling a portion of the protection portion PP-1 overlapping the pad area PDA (refer to Figure 10 ). Thus, reliability can be ensured when checking the quality of the image using the inspection pad DP-TP after peeling a portion of the protection portion PP-1 overlapping the pad area PDA (refer to

[0126] The scribing process can include a process of separating the display module DM from the second preliminary display module DM-2. The display module DM can be separated from the second preliminary display module DM-2 along the scribe SCL. The inspection pad DP-TP can be separated from the display module DM by the scribing process.

[0127] Figure 14 is a plan view showing a mother glass and a protection portion according to an embodiment of the present application. In describing Figure 14 , the same reference numerals are used to designate constituent elements already described through Figures 1 to 8 , and a description thereof will be omitted.

[0128] Referring to Figures 1 to 14 , the light source portion LZ can half-cut the protection portion PP1 along the first cutting lines HCL1-1, HCL2-1, HCL3-1, HCL4-1. The light source portion LZ can full-cut along the second cutting line FCL-1. The second cutting line FCL-1 can correspond to an area between the signal pad DP-PD1 and the inspection pad DP-TP1. The peeling portion PR can peel a surrounding area BA-1 of the protection portion PP1. The peeling portion PR can easily expose the inspection pad DP-TP1. The quality of the image can be checked using the exposed inspection pad DP-TP1.

[0129] According to the present application, the second cutting line FCL-1 can not overlap the signal pad DP-PD1. Thus, it is possible to prevent the energy of the laser beam LS from being transmitted to the signal pad DP-PD1. It is possible to prevent damage from occurring in the signal pad DP-PD1. Thus, it is possible to provide a protection film peeling method with improved reliability.

[0130] The above, although described with reference to preferred embodiments of the present application, it is understood by those skilled in the art or those having ordinary knowledge in the art that various modifications and changes can be made thereto without departing from the spirit and technical scope of the present application as recited in the claims. Therefore, the technical scope of the present application should not be limited to the contents described in the detailed description of the specification, but should be determined by the scope of the claims.

Claims

1. A protective film peeling method comprising the steps of: A mother glass, a plurality of display portions, and a protective portion covering the plurality of display portions are provided on a stage, wherein a plurality of display portions arranged on a mother glass and each including an inspection pad; partially cutting a portion in a thickness direction of the protective portion along a first cutting line; fully cutting the protective portion along a second cutting line different from the first cutting line; and peeling a portion of the protective portion through the partially cut portion in the thickness direction, wherein each of the plurality of display portions defines a pad area in which the inspection pad is arranged and a protective area adjacent to the pad area, the first cutting line corresponds to a first edge that is a portion of a plurality of edges surrounding each of the plurality of display portions and an area between the protective area and the pad area.

2. The protective film peeling method according to claim 1, wherein the second cutting line corresponds to a second edge that is a remaining portion of the plurality of edges.

3. The protective film peeling method according to claim 2, wherein the second edge is one of edges of the pad area.

4. The protective film peeling method according to claim 1, wherein each of the plurality of display portions further includes a signal pad arranged in the pad area and electrically connected to the inspection pad, the second cutting line corresponds to an area between the signal pad and the inspection pad.

5. The protective film peeling method according to claim 1, wherein the partially cutting step includes the step of irradiating a first laser beam, the fully cutting step includes the step of irradiating a second laser beam having higher energy than the first laser beam, wherein the protective portion includes a protective film and a bonding portion, when the partially cutting is performed, an entirety of a thickness of the protective film and a portion of a thickness of the bonding portion are cut.

6. The protective film peeling method according to claim 1, wherein the partially cutting step and the fully cutting step are performed simultaneously.

7. A protective film peeling apparatus comprising: a stage that provides a mother glass, a plurality of display portions, and a protective portion that covers the plurality of display portions, wherein the plurality of display portions are arranged on the mother glass and each include an inspection pad; a light source portion arranged on the stage that irradiates a first laser beam along a first cutting line and a second laser beam having higher energy than the first laser beam along a second cutting line different from the first cutting line to enable full cutting of the protective portion; and a peeling portion arranged on the stage, the light source portion partially cuts a portion in a thickness direction of the protective portion along the first cutting line to enable peeling of a portion of the protective portion through the portion in the thickness direction of the protective portion. further comprising:

8. The protective film peeling apparatus according to claim 7, wherein a first optical portion that transforms a Gaussian beam profile of at least one of the first laser beam and the second laser beam into a flat-top beam profile; and a second optical portion that transforms at least one of the first laser beam and the second laser beam into a beam profile extending in a first direction. further comprising:

9. The protective film peeling apparatus according to claim 7, wherein a scanning portion that is combined with the light source portion and moves in a first direction and a second direction intersecting the first direction, ​ The gantry moves along the first direction or the second direction with the movement of the scanning part. The gantry moves along the first direction or the second direction with the movement of the scanning part.

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