electronic devices

Abstract

The present application relates to an electronic device. The electronic device includes: a display panel having an active area and a peripheral area adjacent to the active area; an electronic module disposed below the display panel; a first light-blocking element disposed on the display panel and overlapping the peripheral area; and a second light-blocking element disposed on the electronic module, wherein the display panel is interposed between the second light-blocking element and the electronic module. A hole at least partially surrounded by the active area is defined in a portion of the display panel. When viewed in plan, the second light-blocking element is disposed in a region adjacent to the hole. The first light-blocking element has a first thickness, and the second light-blocking element has a second thickness that is less than the first thickness.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0020250, filed on February 19, 2020, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary implementations of the present invention generally relate to an electronic device, and more particularly, to a foldable electronic device. Background Art

[0004] Electronic devices include an active area that is activated by electrical signals. This active area is used to sense external inputs and display various images to provide information to the user. In recent years, with the development of electronic devices in various shapes, there has been a need to diversify the shape of the active area.

[0005] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the Invention

[0006] An electronic device constructed according to the principles and exemplary implementations of the present invention has an increased active area. For example, one or more electronic modules of the electronic device may overlap with and / or be surrounded by the active area rather than overlapping with and / or being surrounded by a peripheral area, thereby reducing the size of the peripheral area. As a result, the active area can have a relatively large area.

[0007] The electronic device constructed according to the principles and exemplary embodiments of the present invention has improved reliability. For example, the electronic device may include a first pattern and a second pattern for blocking light, wherein the first pattern covers the peripheral area, and the second pattern surrounds the electronic module housed in the effective area of the electronic device. The electronic module can sense various types of signals (such as visible light passing through the layer) to generate images and / or electrical signals. The first pattern can be thicker than the second pattern to allow the layer covering and / or arranged on the second pattern and the electronic module to be flattened, thereby reducing the curvature and / or uneven parts in the covering layer. Therefore, it is possible to reduce or prevent the quality degradation of the image and / or electrical signal generated by the electronic module. In addition, the second pattern of the electronic device can be formed and / or printed on a layer with an uneven and / or rough surface. Therefore, the possibility of the second pattern being separated from the layer can be reduced, thereby improving the reliability of the electronic device.

[0008] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0009] According to one aspect of the present invention, an electronic device includes: a display panel having an active area and a peripheral area adjacent to the active area; an electronic module disposed below the display panel; a first light-blocking element disposed on the display panel and overlapping the peripheral area; and a second light-blocking element disposed on the electronic module, wherein the display panel is interposed between the second light-blocking element and the electronic module. A hole is defined in a portion of the display panel that can be at least partially surrounded by the active area. When viewed in plan, the second light-blocking element is disposed in an area adjacent to the hole. The first light-blocking element has a first thickness, and the second light-blocking element has a second thickness that is less than the first thickness.

[0010] The first light blocking element may include a first light blocking pattern having a first thickness, the second light blocking element may include a second light blocking pattern having a second thickness, and the first thickness may be greater than or equal to three times the second thickness.

[0011] The second thickness may be in the range of about 0.5 μm to about 1.5 μm.

[0012] The electronic device may further include: a window disposed on the display panel; and an adhesive layer spaced apart from the display panel, wherein the window is interposed between the adhesive layer and the display panel. The second light blocking element may be disposed between the window and the adhesive layer.

[0013] The electronic device may further include a hard coating layer disposed below the window. The second light blocking element and the hard coating layer may be spaced apart from each other, with the window interposed between the second light blocking element and the hard coating layer.

[0014] The electronic device may further include a shock absorbing layer disposed on the display panel.

[0015] The electronic device may further include a hard coating layer disposed between the impact absorbing layer and the display panel and in contact with the impact absorbing layer. The second light blocking element may be spaced apart from the impact absorbing layer, wherein the hard coating layer is interposed between the second light blocking element and the impact absorbing layer.

[0016] The second light blocking element may be printed directly on the surface of the impact absorbing layer.

[0017] The electronic device may further include a hard coating layer disposed between the impact absorbing layer and the display panel and in contact with the impact absorbing layer. The second light blocking element may be spaced apart from the hard coating layer, wherein the impact absorbing layer is interposed between the second light blocking element and the hard coating layer.

[0018] A hole may be defined in a portion of the display panel, and a portion of the hard coating layer may be exposed by the hole.

[0019] A first portion of the second light blocking element may overlap the aperture, and a second portion of the second light blocking element may not overlap the aperture.

[0020] The electronic device may further include a window, the window being disposed on the impact absorbing layer. The second light blocking element may be disposed between the window and the impact absorbing layer or on the window.

[0021] The electronic device may further include an anti-reflection member disposed on the display panel. A second light blocking element may be disposed on the anti-reflection member and the second light blocking element may be spaced apart from the display panel, wherein the anti-reflection member is interposed between the second light blocking element and the display panel.

[0022] The first light blocking element may include a plurality of first stacked layers, the second light blocking element may include one or more second stacked layers, and the number of the plurality of first stacked layers may be greater than the number of the one or more second stacked layers.

[0023] When viewed in a plan view, the second light blocking element may be at least partially surrounded by the active area.

[0024] A width of the first light blocking element may be greater than a width of the second light blocking element.

[0025] The display panel may include a foldable region extending along a folding axis.

[0026] According to another aspect of the present invention, an electronic device includes: a window; an impact absorbing layer disposed below the window; a hard coating layer disposed below the impact absorbing layer; a display panel disposed below the hard coating layer, the display panel including a hole defined therein; and a light blocking pattern disposed on the impact absorbing layer near the hole.

[0027] The impact absorbing layer and the hard coating layer may be in direct contact with each other, the impact absorbing layer and the light blocking pattern may be in direct contact with each other, and the impact absorbing layer may be disposed between the hard coating layer and the light blocking pattern.

[0028] The electronic device may further include a peripheral light blocking pattern disposed on the same layer as the light blocking pattern. The thickness of the peripheral light blocking pattern may be greater than the thickness of the light blocking pattern, and the width of the peripheral light blocking pattern may be greater than the width of the light blocking pattern.

[0029] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings illustrate exemplary embodiments of the present invention and, together with the description, serve to explain the inventive concept. The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this specification.

[0031] Figure 1A is a perspective view of an illustrative embodiment of an electronic device configured in accordance with the principles of the present invention.

[0032] Figure 1B yes Figure 1A A three-dimensional image of an electronic device being folded along a folding axis.

[0033] Figure 2 is an exemplary embodiment of an electronic device according to an embodiment of the present invention, along Figure 1A A cross-sectional view taken along line II'.

[0034] Figure 3A yes Figure 2 sectional view of an exemplary embodiment of a display panel.

[0035] Figure 3B yes Figure 2 sectional view of another exemplary embodiment of a display panel.

[0036] Figure 4A It shows Figure 1A An exploded perspective view of an exemplary embodiment of some elements of an electronic device.

[0037] Figure 4B is used to illustrate an exemplary embodiment of an electronic device, along Figure 4A A sectional view taken along line IV-IV'.

[0038] Figure 4C is used to illustrate another exemplary embodiment of an electronic device, along Figure 4A A sectional view taken along line IV-IV'.

[0039] Figure 5 yes Figure 1A A rear view of an exemplary embodiment of some elements of an electronic device.

[0040] Figure 6 is used to illustrate an exemplary embodiment of an electronic device, along Figure 1A A sectional view taken along line II-II'.

[0041] Figure 7 yes Figure 6 is a plan view of an exemplary embodiment of first to third sidewalls and a second light-blocking pattern.

[0042] Figure 8 is used to illustrate an exemplary embodiment of an electronic device, along Figure 1A A cross-sectional view taken along line III-III'.

[0043] Figure 9 is used to illustrate another exemplary embodiment of an electronic device, along Figure 1A A sectional view taken along line II-II'.

[0044] Figure 10 is a diagram for illustrating another exemplary embodiment of an electronic device. Figure 1A A sectional view taken along line II-II'.

[0045] Figure 11 is a diagram for illustrating another exemplary embodiment of an electronic device. Figure 1A A sectional view taken along line II-II'.

[0046] Figure 12 is a diagram for illustrating another exemplary embodiment of an electronic device. Figure 1A A sectional view taken along line II-II'.

[0047] Figure 13 is used to illustrate another exemplary embodiment of an electronic device, along Figure 1A A cross-sectional view taken along line II-II'. DETAILED DESCRIPTION

[0048] In the following description, for the purpose of illustration, many specific details are set forth in order to provide a thorough understanding of various exemplary embodiments or implementations of the present invention. As used herein, "embodiment" and "implementation" are interchangeable terms that are non-limiting examples of one or more devices or methods employing the inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other cases, in order to avoid unnecessarily obscuring the various exemplary embodiments, known structures and devices are shown in block diagram form. In addition, various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, configuration and characteristics of an exemplary embodiment may be used or implemented in another exemplary embodiment.

[0049] Unless otherwise indicated, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise indicated, the features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments (hereinafter individually or collectively referred to as "elements") may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0050] The hatching and / or shading used in the accompanying drawings are generally provided to clarify the boundaries between adjacent elements. Therefore, whether or not hatching or shading is present does not convey or indicate any preference or requirement for a particular material, material properties, size, ratio, commonality between the elements shown and / or any other characteristics, attributes, properties, etc. of the elements, unless otherwise stated. In addition, in the accompanying drawings, the sizes and relative sizes of the elements may be exaggerated for the purpose of clarity and / or description. When the exemplary embodiments can be implemented differently, a specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously, or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0051] When an element such as a layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, it may be directly on, directly connected to or directly coupled to another element or layer, or there may be an intervening element or layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly coupled to" another element or layer, there is no intervening element or layer. For this reason, the term "connected" may refer to a physical connection, electrical connection and / or fluid connection with or without an intervening element. In addition, the D1 axis, the D2 axis and the D3 axis are not limited to the three axes of a rectangular coordinate system (such as, x-axis, y-axis and z-axis) and may be interpreted in a broader sense. For example, the D1 axis, the D2 axis and the D3 axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ for example. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0052] Although the terms "first," "second," etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, the first element discussed below may be referred to as the second element without departing from the teachings of the present disclosure.

[0053] Spatially relative terms such as "below," "beneath," "under," "above," "up," "above," "higher," "side" (e.g., as in "sidewall"), etc. may be used herein for descriptive purposes and, thereby, to describe the relationship of one element to another element(s) as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, elements described as being "below" or "beneath" other elements or features would then be oriented as being "above" the other elements or features. Thus, the exemplary term "below" can encompass both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and therefore the spatially relative descriptors used herein should be interpreted accordingly.

[0054] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, as used herein, the singular forms "one", "an" and "the" are intended to also include the plural forms. In addition, when used in this specification, the terms "comprise", "comprises", "includes" and / or "comprising" represent the existence of stated features, integral bodies, steps, operations, elements, parts and / or their groups, but do not exclude the existence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or their groups. It should also be noted that, as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as terms of degree, and are therefore used to explain the inherent deviations in measured values, calculated values and / or provided values that will be recognized by those of ordinary skill in the art.

[0055] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views, which are schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Thus, deviations from the illustrated shapes, for example due to manufacturing techniques and / or tolerances, should be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be understood as being limited to the specific illustrated shapes of the regions, but will include deviations in shape caused by, for example, manufacturing. In this way, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device and are therefore not necessarily intended to be limiting.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. Terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0057] Figure 1A is a perspective view of an illustrative embodiment of an electronic device configured in accordance with the principles of the present invention. Figure 1B yes Figure 1A A three-dimensional image of an electronic device being folded along a folding axis. Figure 1A The electronic device 1000 is shown in an expanded position, and Figure 1B The electronic device 1000 is shown in a folded position.

[0058] Reference Figure 1A and Figure 1B The electronic device 1000 may be selectively activated by an electrical signal applied thereto. For example, the electronic device 1000 may be a computer device such as a cellular phone, a tablet computer, a car navigation system, a game console, or a wearable device, but exemplary embodiments are not limited to these examples. Figure 1A An example is shown in which the electronic device 1000 is a cellular phone.

[0059] Electronic device 1000 may include an active area 1000A for displaying an image. When electronic device 1000 is in the unfolded position, active area 1000A may include a plane defined by a first direction DR1 and a second direction DR2. The thickness direction of electronic device 1000 may be parallel to a third direction DR3 that intersects with first direction DR1 and second direction DR2. Therefore, the front surface or top surface and the rear surface or bottom surface of each component constituting electronic device 1000 may be defined based on third direction DR3.

[0060] The active area 1000A may include a first area 1000A1, a second area 1000A2, and a third area 1000A3. The second area 1000A2 may be bent or folded along a folding axis FX extending in a second direction DR2. Therefore, the first area 1000A1 and the third area 1000A3 may be referred to as non-foldable areas, and the second area 1000A2 may be referred to as a foldable area.

[0061] When the electronic device 1000 is folded, the first area 1000A1 and the third area 1000A3 may face each other. Therefore, in the fully folded position, the active area 1000A may not be exposed to the outside, and this position may be referred to as an inner folded position. However, exemplary embodiments are not limited to this folding operation of the electronic device 1000.

[0062] As an example, when the electronic device 1000 is folded, the first area 1000A1 and the third area 1000A3 may be opposite to each other. For example, in the folded position, the active area 1000A may be exposed to the outside, and this position may be referred to as an outer folded position.

[0063] In an exemplary embodiment, the electronic device 1000 may allow only one of the inward folding and outward folding operations. In another exemplary embodiment, the electronic device 1000 may allow both inward folding and outward folding operations. In this case, a specific area of the electronic device 1000 (e.g., the second area 1000A2) can be folded in both inward folding and outward folding modes. In another exemplary embodiment, one area of the electronic device 1000 can be folded inward folding, and another area of the electronic device 1000 can be folded in outward folding.

[0064] Figure 1A and Figure 1B An example is shown in which one foldable area and two non-foldable areas are provided, but the number of foldable areas and non-foldable areas is not limited to this example. For example, the electronic device 1000 may include two or more non-foldable areas and at least one foldable area provided between adjacent non-foldable areas in the non-foldable area.

[0065] Figure 1A and Figure 1B An example is shown in which the folding axis FX is substantially parallel to the short axis of the electronic device 1000, but exemplary embodiments are not limited to this example. For example, the folding axis FX may be substantially parallel to the long axis (e.g., the first direction DR1) of the electronic device 1000. In this case, the first area 1000A1, the second area 1000A2, and the third area 1000A3 may be sequentially arranged in the second direction DR2.

[0066] A plurality of sensing areas 100SA1, 100SA2, and 100SA3 may be defined in the electronic device 1000. In the sensing areas 100SA1, 100SA2, and 100SA3, the electronic device 1000 may include an electronic module to provide and / or receive various types of signals such as visible light and infrared light to and from the outside. Figure 1AAn example is shown in which three sensing areas 100SA1 , 100SA2 , and 100SA3 are provided, but the number of sensing areas is not limited to this example.

[0067] The sensing areas 100SA1, 100SA2, and 100SA3 may include a first sensing area 100SA1, a second sensing area 100SA2, and a third sensing area 100SA3. For example, the first sensing area 100SA1 may overlap with the camera module, and the second sensing area 100SA2 and the third sensing area 100SA3 may overlap with the ambient light sensor, but exemplary embodiments are not limited to this example.

[0068] Each of the electronic modules may receive an external input provided through the first, second, or third sensing areas 100SA1, 100SA2, or 100SA3, or may provide an output to the outside through the first, second, or third sensing areas 100SA1, 100SA2, or 100SA3.

[0069] The first sensing area 100SA1 may be surrounded and / or completely surrounded by the active area 1000A, and the second sensing area 100SA2 and the third sensing area 100SA3 may be included in the active area 1000A. For example, the second sensing area 100SA2 and the third sensing area 100SA3 may display an image. The light transmittance (hereinafter referred to as "transmittance") of each of the first sensing area 100SA1, the second sensing area 100SA2, and the third sensing area 100SA3 may be higher than the light transmittance of the active area 1000A. In addition, the transmittance of the first sensing area 100SA1 may be higher than the transmittance of each of the second sensing area 100SA2 and the third sensing area 100SA3.

[0070] According to an exemplary embodiment, at least one of the electronic modules can overlap with active area 1000A, and other electronic modules can be enclosed and / or completely surrounded by active area 1000A. Therefore, it is not necessary to define the area in which the electronic modules are to be disposed within peripheral area 1000NA surrounding active area 1000A. As a result, the ratio of the area of active area 1000A to the total area of electronic device 1000 can be increased.

[0071] Figure 2 is used to illustrate an exemplary embodiment of an electronic device, along Figure 1A A cross-sectional view taken along line II'. Figure 3A yes Figure 2 sectional view of an exemplary embodiment of a display panel.

[0072] Reference Figure 2, the electronic device 1000 may include a display panel 100 , an upper functional layer and a lower functional layer.

[0073] Reference Figure 3A The display panel 100 may be an element configured to generate an image and sense an input applied from the outside. For example, the display panel 100 may include a display layer 110 and a sensor layer 120. The thickness of the display panel 100 may be in the range of 25 μm to 35 μm (specifically, about 30 μm), but the thickness of the display panel 100 is not limited thereto.

[0074] The display layer 110 may be an element configured to substantially generate an image. The display layer 110 may be a light-emitting display layer (eg, an organic light-emitting display layer, a quantum dot display layer, or a micro-LED display layer).

[0075] The display layer 110 may include a base layer 111 , a circuit layer 112 , a light emitting device layer 113 , and an encapsulation layer 114 .

[0076] The base layer 111 may include a synthetic resin film. The synthetic resin layer may include a thermosetting resin. The base layer 111 may have a multilayer structure. For example, the base layer 111 may have a three-layer structure including a synthetic resin layer, an adhesive layer, and a synthetic resin layer. The synthetic resin layer may be a polyimide-based resin layer, but exemplary embodiments are not limited to a specific material. The synthetic resin layer may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a polyurethane resin, a cellulose resin, a silicone resin, a polyamide resin, and a perylene resin. In addition, the base layer 111 may include a glass substrate or a substrate made of an organic / inorganic composite material.

[0077] The circuit layer 112 may be provided on the base layer 111. The circuit layer 112 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 111 using a coating or deposition process and then selectively patterned using multiple photolithography processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 112 may be formed.

[0078] The light emitting device layer 113 may be provided on the circuit layer 112. The light emitting device layer 113 may include a light emitting device. For example, the light emitting device layer 113 may include an organic light emitting material, quantum dots, quantum rods, or micro LEDs.

[0079] The encapsulation layer 114 may be provided on the light emitting device layer 113. The encapsulation layer 114 may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence, but the layers constituting the encapsulation layer 114 are not limited to this example.

[0080] The inorganic layer can protect the light emitting device layer 113 from moisture and oxygen, and the organic layer can protect the light emitting device layer 113 from pollutants such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic organic layer, but exemplary embodiments are not limited thereto.

[0081] The sensor layer 120 may be provided on the display layer 110. The sensor layer 120 may sense external input provided from the outside. For example, the external input may be a user input generated by a user. For example, the user input may include various types of external inputs such as a part of the user's body, light, heat, pressure, or a pen.

[0082] The sensor layer 120 may be formed on the display layer 110 through a continuous process. In this case, the sensor layer 120 is directly disposed on the display layer 110. This means that no other element is disposed between the sensor layer 120 and the display layer 110. For example, no additional adhesive member may be disposed between the sensor layer 120 and the display layer 110.

[0083] In an exemplary embodiment, the sensor layer 120 may be coupled to the display layer 110 by a bonding member. The bonding member may be a typical adhesive or glue.

[0084] Return to reference Figure 2 , an upper functional layer may be provided on the display panel 100. For example, the upper functional layer may include an anti-reflection member 200 and an upper member 300.

[0085] The anti-reflection member 200 may be referred to as an anti-reflection layer. The anti-reflection member 200 may reduce the reflectivity of external light incident from the outside. The anti-reflection member 200 may include a stretched synthetic resin film. For example, the anti-reflection member 200 may be provided by printing an iodine compound on a polyvinyl alcohol (PVA) film. However, the material used for the anti-reflection member 200 is not limited to this example. The thickness of the anti-reflection member 200 may be in the range of 25 μm to 35 μm (specifically, approximately 31 μm), but the thickness of the anti-reflection member 200 is not limited thereto.

[0086] The anti-reflection member 200 may be coupled to the display panel 100 via a first adhesive layer 1010. The first adhesive layer 1010 may be a transparent adhesive layer such as a pressure-sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, or an optically clear resin (OCR). The adhesive layer or adhesive described below may be formed of or include a typical adhesive or adhesive. The thickness of the first adhesive layer 1010 may be in the range of 20 μm to 30 μm (specifically, 25 μm), but the thickness of the first adhesive layer 1010 is not limited thereto.

[0087] In an exemplary embodiment, the first adhesive layer 1010 may be omitted, and in this case, the anti-reflection member 200 may be directly disposed on the display panel 100. In this case, an additional adhesive layer may not be disposed between the anti-reflection member 200 and the display panel 100.

[0088] The upper member 300 may be disposed on the anti-reflection member 200. The upper member 300 may include a first hard coating layer 310, a protective layer 320, a first upper adhesive layer 330, a window 340, a second upper adhesive layer 350, a light blocking layer 360, an impact absorbing layer 370, and a second hard coating layer 380. The elements included in the upper member 300 are not limited to the above elements. In an exemplary embodiment, at least one of the above elements may be omitted, or in another exemplary embodiment, other elements may be added.

[0089] The first hard coating layer 310 may be the outermost layer of the electronic device 1000. The first hard coating layer 310 may be a functional layer coated on the protective layer 320 and used to improve the performance of the electronic device 1000. For example, the first hard coating layer 310 may improve the anti-fingerprint performance, anti-fouling performance, and anti-scratch performance of the electronic device 1000.

[0090] The protective layer 320 may be provided below the first hard coating layer 310. The protective layer 320 may protect the elements provided below the protective layer 320. The first hard coating layer 310, an anti-fingerprint layer, etc. may be additionally provided on the protective layer 320 to improve chemical resistance and wear resistance. The protective layer 320 may include a film having an elastic modulus of less than 15 GPa at room temperature. The thickness of the protective layer 320 may be in the range of 50 μm to 60 μm (specifically, 55 μm), but the thickness of the protective layer 320 is not limited thereto. In an exemplary embodiment, the protective layer 320 may be omitted.

[0091] The first upper adhesive layer 330 may be disposed under the protective layer 320. The protective layer 320 and the window 340 may be coupled to each other through the first upper adhesive layer 330. The thickness of the first upper adhesive layer 330 may be in the range of 20 μm to 30 μm (specifically, about 25 μm), but the thickness of the first upper adhesive layer 330 is not limited thereto.

[0092] The window 340 may be disposed below the first upper adhesive layer 330. The window 340 may be formed of or include an optically transparent insulating material. For example, the window 340 may include a glass substrate or a synthetic resin film. When the window 340 is a glass substrate, the thickness of the window 340 may be less than or equal to 80 μm, or may be, for example, approximately 30 μm, but the thickness of the window 340 is not limited thereto.

[0093] In the case where the window 340 is a synthetic resin film, the window 340 may include a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0094] The window 340 may have a multi-layer or single-layer structure. For example, the window 340 may include a plurality of synthetic resin films coupled to each other by an adhesive, or may include a glass substrate and a synthetic resin film coupled to each other by an adhesive.

[0095] The second upper adhesive layer 350 may be disposed under the window 340. The window 340 and the impact absorbing layer 370 may be coupled to each other through the second upper adhesive layer 350. The thickness of the second upper adhesive layer 350 may be in the range of 30 μm to 40 μm (specifically, about 35 μm), but the thickness of the second upper adhesive layer 350 is not limited thereto.

[0096] In an exemplary embodiment, when viewed in a plan view, the sidewall 340S of the window 340 and the sidewall 350S of the second upper adhesive layer 350 may be disposed inside the sidewalls of other layers (e.g., the sidewall 1000S of the display panel 100 and the sidewall 320S of the protective layer 320). This means that the sidewalls 340S and 350S are closer to the active area 1000A than other comparative elements.

[0097] The positional relationship between the layers can be changed by the folding operation of the electronic device 1000. According to the exemplary embodiment, since the sidewall 340S of the window 340 is disposed inside the sidewall 1000S of the display panel 100 and the sidewall 320S of the protective layer 320, even when the positional relationship between the layers is changed due to the folding operation, the sidewall 340S of the window 340 can be prevented or suppressed from protruding beyond the sidewall 320S of the protective layer 320. Therefore, this can reduce the possibility that the sidewall 340S of the window 340 will serve as a path for external impact. As a result, this can reduce the possibility of cracks forming in the window 340.

[0098] A first distance 340W between the sidewall 340S of the window 340 and the sidewall 320S of the protective layer 320 may be greater than a specific distance. Here, the first distance 340W may be a distance measured in the first direction DR1. In addition, when viewed in a plan view, the first distance 340W may correspond to the distance between the sidewall 340S and the sidewall 320S.

[0099] The first distance 340W may be in the range of 180 μm to 205 μm (specifically, 196 μm), but the exemplary embodiment is not limited to this example. In an exemplary embodiment, the first distance 340W may be greater than or equal to 50 μm and may be, for example, about 300 μm. As the first distance 340W increases, the protruding length of the protective layer 320 relative to the window 340 may increase, and a portion of the protective layer 320 may be bent and may be attached to other elements (e.g., a housing). In addition, when the area of the protective layer 320 increases, it may be possible to reduce the possibility of contaminants provided from the area on the protective layer 320 entering the area below the protective layer 320.

[0100] Furthermore, the window 340 and the second upper adhesive layer 350 may be adhered to the impact absorbing layer 370 through a lamination process. Taking into account process tolerances in the lamination process, the area of the window 340 and the second upper adhesive layer 350 may be smaller than that of the impact absorbing layer 370. Furthermore, the area of the second upper adhesive layer 350 may be smaller than that of the window 340. In an exemplary embodiment, during the process of attaching the window 340, pressure may be applied to the second upper adhesive layer 350. The pressure may stretch the second upper adhesive layer 350 in the first direction DR1 and the second direction DR2. Here, to prevent the second upper adhesive layer 350 from protruding beyond the window 340, the area of the second upper adhesive layer 350 may be smaller than that of the window 340.

[0101] During the folding operation of the electronic device 1000, when the first upper adhesive layer 330 and the second upper adhesive layer 350 are attached to each other, the window 340 may be difficult to slide, and in this case, a warping phenomenon may occur in the window 340. However, according to an exemplary embodiment, the area of the second upper adhesive layer 350 may be smaller than that of the window 340. Therefore, the first upper adhesive layer 330 may not be attached to the second upper adhesive layer 350, and it may be possible to prevent or suppress contaminants from being attached to the second upper adhesive layer 350.

[0102] The second distance 350W between the sidewall 350S of the second upper adhesive layer 350 and the sidewall 320S of the protective layer 320 may be greater than a specific distance. Here, the second distance 350W may be a distance measured in the first direction DR1. In addition, when viewed in a plan view, the second distance 350W may correspond to the distance between the sidewall 350S and the sidewall 320S.

[0103] In an exemplary embodiment, the second distance 350W may be about 392 μm, but the exemplary embodiment is not limited thereto. For example, the second distance 350W may be within a range of 292 μm to 492 μm.

[0104] The impact absorbing layer 370 may be a functional layer for protecting the display panel 100 from external impacts. The impact absorbing layer 370 may be selected from one of films having an elastic modulus greater than or equal to 1 GPa at room temperature. The impact absorbing layer 370 may be a stretched film having an optical function. For example, the impact absorbing layer 370 may be an optical axis control film. The impact absorbing layer 370 may be, for example, a biaxially oriented PET film. The thickness of the impact absorbing layer 370 may be in the range of 35 μm to 45 μm (specifically, approximately 41 μm), but the thickness of the impact absorbing layer 370 is not limited thereto. In an exemplary embodiment, the impact absorbing layer 370 may be omitted.

[0105] The second hard coating layer 380 may be formed on the surface of the impact absorbing layer 370. The second hard coating layer 380 may include an organic coating agent, an inorganic coating agent, or a coating agent made of an organic / inorganic composite material, and any material that reduces the haze problem may be used for the second hard coating layer 380. The term 'haze' may be defined as the degree of diffusion of light incident on the test material, and if the haze is high, the light may be scattered to cause an opaque haze problem.

[0106] Each of the top and bottom surfaces of the impact absorbing layer 370 may include an uneven portion and / or surface. The top surface of the impact absorbing layer 370 may be in contact with the second upper adhesive layer 350. Therefore, the uneven portion of the top surface of the impact absorbing layer 370 may be filled with the second upper adhesive layer 350. Therefore, it may be possible to prevent optical problems (e.g., increased haze) from occurring on the top surface of the impact absorbing layer 370. The bottom surface of the impact absorbing layer 370 may be flattened by the second hard coating layer 380. In the first hole 101H (e.g., see Figure 4A ) is set to cut the second adhesive layer 1020, by the first hole 101H (for example, see Figure 4A ) The exposed bottom surface may have a substantially smooth surface. Since the second hard coating layer 380 covers the uneven and / or rough surface of the impact absorbing layer 370, it may be possible to suppress haze problems that may occur in the uneven and / or rough surface.

[0107] The light blocking layer 360 may be disposed between the impact absorbing layer 370 and the second upper adhesive layer 350. The light blocking layer 360 may be disposed on the top surface of the impact absorbing layer 370 by a printing method. The light blocking layer 360 may overlap the peripheral area 1000NA. The light blocking layer 360 may be a colored layer formed by a coating method. The light blocking layer 360 may include a polymer resin and a pigment contained in the polymer resin. In an exemplary embodiment, the polymer resin may be an acrylic resin or a polyester, and the pigment may be a carbon-based pigment. However, the material used for the light blocking layer 360 is not limited to this example.

[0108] After forming the second hard coating layer 380 on the impact absorbing layer 370, the light blocking layer 360 can be formed by a printing method. Since the impact absorbing layer 370 has an uneven and / or rough surface, the adhesive strength when the light blocking layer 360 is printed on the impact absorbing layer 370 can be stronger than when the light blocking layer 360 is printed on the second hard coating layer 380. Since the light blocking layer 360 is directly printed on the uneven and / or rough surface of the impact absorbing layer 370, the possibility of the light blocking layer 360 separating from the impact absorbing layer 370 can be reduced. In other words, since the possibility of the light blocking layer 360 separating from the printing target surface (e.g., the impact absorbing layer 370) is reduced, the product reliability of the electronic device 1000 can be improved.

[0109] The upper member 300 may be coupled to the anti-reflective member 200 via a second adhesive layer 1020. The second adhesive layer 1020 may be formed of or include a typical adhesive or glue. The thickness of the second adhesive layer 1020 may be in the range of 20 μm to 30 μm (specifically, about 25 μm), but the thickness of the second adhesive layer 1020 is not limited thereto.

[0110] The lower functional layer may be provided on the display panel 100. For example, the lower functional layer may include a lower protective film 400, a pad member 500, a first lower member 600, a second lower member 700, and a height difference compensation member 800. The elements included in the lower functional layer are not limited to the above elements. In an exemplary embodiment, at least one of the above elements may be omitted, or in another exemplary embodiment, other elements may be added.

[0111] The lower protective film 400 may be coupled to the rear surface of the display panel 100 via the third adhesive layer 1030. The lower protective film 400 may prevent scratches from forming on the rear surface of the display panel 100 during the manufacturing process of the display panel 100. The lower protective film 400 may be a colored polyimide film. For example, the lower protective film 400 may be an opaque yellow film, but exemplary embodiments are not limited to this example.

[0112] The thickness of the lower protective film 400 may be in the range of 30 μm to 50 μm (specifically, about 40 μm). The thickness of the third adhesive layer 1030 may be in the range of 13 μm to 25 μm (specifically, about 18 μm). However, the thickness of the lower protective film 400 and the thickness of the third adhesive layer 1030 are not limited thereto.

[0113] The pad member 500 may be provided under the lower protective film 400. The pad member 500 may protect the display panel 100 from impact provided by the underlying elements. The pad member 500 may improve the impact resistance of the electronic device 1000.

[0114] The pad member 500 may include a first pad adhesive layer 510, a barrier film 520, a pad layer 530, and a second pad adhesive layer 540. The elements included in the pad member 500 are not limited to the above elements. In an exemplary embodiment, at least one of the above elements may be omitted, or in another exemplary embodiment, other elements may be added.

[0115] The first pad adhesive layer 510 and the second pad adhesive layer 540 can be formed of or include a typical adhesive or adhesive. The first pad adhesive layer 510 can be attached to the lower protective film 400, and the second pad adhesive layer 540 can be attached to the first lower member 600. The thickness of the first pad adhesive layer 510 can be in the range of 20μm to 30μm (specifically, about 25μm). The thickness of the second pad adhesive layer 540 can be in the range of 4μm to 15μm (specifically, about 8μm). However, the thickness of the first pad adhesive layer 510 and the second pad adhesive layer 540 is not limited thereto.

[0116] The barrier film 520 can improve impact resistance. The barrier film 520 can prevent the display panel 100 from deforming. The barrier film 520 can be a synthetic resin film (e.g., a polyimide film), but the exemplary embodiment is not limited to this example. The thickness of the barrier film 520 can be in the range of 30 μm to 40 μm (specifically, about 35 μm), but the thickness of the barrier film 520 is not limited thereto.

[0117] The cushion layer 530 may include, for example, foam or sponge. The foam may include polyurethane foam or thermoplastic polyurethane foam. In the case where the cushion layer 530 includes foam, the cushion layer 530 may be formed by using the barrier film 520 as a base layer. For example, the cushion layer 530 may be formed by foaming a foaming agent on the barrier film 520.

[0118] The thickness of the pad layer 530 may be in the range of 80 μm to 120 μm (specifically, about 100 μm), but the thickness of the pad layer 530 is not limited thereto.

[0119] At least one of the barrier film 520 and the cushion layer 530 may have a color that absorbs light. For example, at least one of the barrier film 520 and the cushion layer 530 may be black. In this case, it may be possible to prevent a user from recognizing an element disposed under the cushion member 500.

[0120] The first lower member 600 may be disposed below the pad member 500. The first lower member 600 may include a plate 610, a lower adhesive layer 620, and a cover layer 630. The elements included in the first lower member 600 are not limited to the above elements. In an exemplary embodiment, at least one of the above elements may be omitted, or in another exemplary embodiment, other elements may be added.

[0121] Plate 610 may be formed of or include a material having an elastic modulus of greater than or equal to 60 GPa at room temperature. For example, plate 610 may be SUS304, but exemplary embodiments are not limited to this example. Plate 610 may support components disposed thereon. Furthermore, plate 610 may improve the heat dissipation performance of electronic device 1000.

[0122] An opening 611 may be defined in a portion of the plate 610. The opening 611 may be defined in a region overlapping the second region 1000A2. When viewed in a plan view or in the third direction DR3, the opening 611 may overlap the second region 1000A2. The shape of the portion of the plate 610 may be more easily deformed by the opening 611.

[0123] The cover layer 630 may be attached to the board 610 via the lower adhesive layer 620. The lower adhesive layer 620 may be formed of or include a typical adhesive or glue. The cover layer 630 may cover the opening 611 of the board 610. Thus, contaminants may be further prevented from entering the opening 611.

[0124] The cover layer 630 may be formed of or include a material having an elastic modulus lower than that of the plate 610. For example, the cover layer 630 may be formed of or include thermoplastic polyurethane, but exemplary embodiments are not limited to this example.

[0125] The thickness of the plate 610 may be in the range of 120 μm to 180 μm (specifically, about 150 μm). The thickness of the lower adhesive layer 620 may be in the range of 4 μm to 15 μm (specifically, about 8 μm). The thickness of the cover layer 630 may be in the range of 4 μm to 15 μm (specifically, about 8 μm). However, the thickness of the plate 610, the thickness of the lower adhesive layer 620, and the thickness of the cover layer 630 are not limited to the above values.

[0126] The second lower members 700 may be disposed below the first lower member 600. The second lower members 700 may be spaced apart from each other. For example, one of the second lower members 700 may be disposed in the first region 1000A1, and another one of the second lower members 700 may be disposed in the third region 1000A3.

[0127] Each of the second lower members 700 may be attached to the first lower member 600 by a fourth adhesive layer 1040. For example, one of the fourth adhesive layers 1040 may be attached to the bottom surface of the first lower member 600 overlapping with the first region 1000A1, and another of the fourth adhesive layers 1040 may be attached to the bottom surface of the first lower member 600 overlapping with the third region 1000A3. In other words, the fourth adhesive layer 1040 may not overlap with the second region 1000A2. The thickness of each of the fourth adhesive layers 1040 may be in the range of 8 μm to 15 μm (specifically, about 8 μm), but the thickness of each of the fourth adhesive layers 1040 is not limited thereto.

[0128] In an exemplary embodiment, a height difference compensation film may be further provided between each of the second lower members 700 and the first lower member 600. For example, the height difference compensation film may be provided in an area overlapping with the second area 1000A2. A surface of the height difference compensation film (hereinafter referred to as the first surface) may have a lower adhesive strength than the other surface. For example, the first surface may have no adhesive strength. The first surface may be a surface facing the first lower member 600.

[0129] Each of the second lower members 700 may include a lower plate 710, a heat sink 720, and an insulating film 730. The elements included in each of the second lower members 700 are not limited to the above elements. In an exemplary embodiment, at least one of the above elements may be omitted, or in another exemplary embodiment, other elements may be added.

[0130] In an exemplary embodiment, a plurality of lower plates 710 may be provided. One of the lower plates 710 may overlap a portion of the second area 1000A2 and the first area 1000A1, and another of the lower plates 710 may overlap another portion of the second area 1000A2 and the third area 1000A3.

[0131] The lower plates 710 may be spaced apart from each other in the second area 1000A2. The lower plates 710 may be arranged as close to each other as possible and may support the area in which the opening 611 of the plate 610 is formed. For example, the lower plates 710 may prevent the shape of the area in which the opening 611 of the plate 610 is defined from being changed by pressure applied by an element thereon.

[0132] In addition, the lower plate 710 may prevent elements disposed on the second lower member 700 from being deformed due to elements disposed below the second lower member 700 .

[0133] Each of the lower plates 710 may include a metal alloy (e.g., a copper alloy). However, the material used for the lower plates 710 is not limited to this example. The thickness of each of the lower plates 710 may be in the range of 60 μm to 100 μm (specifically, about 80 μm), but exemplary embodiments are not limited to this thickness of the lower plates 710.

[0134] The heat sink 720 may be attached to the bottom surface of the lower plate 710. The heat sink 720 may be a heat conductive sheet having high thermal conductivity. For example, the heat sink 720 may include a heat dissipation layer 721, a first heat dissipation adhesive layer 722, a second heat dissipation adhesive layer 723, and a gap tape 724.

[0135] The gap tape 724 may be attached to the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723, which are spaced apart from each other and interposed with the heat dissipation layer 721. The gap tape 724 may be composed of a plurality of layers. For example, the gap tape 724 may include a substrate layer, an upper adhesive layer disposed on the top surface of the substrate layer, and a lower adhesive layer disposed on the bottom surface of the substrate layer.

[0136] The heat dissipation layer 721 can be attached to the lower plate 710 by the first heat dissipation adhesive layer 722. The heat dissipation layer 721 can be hermetically sealed by the first heat dissipation adhesive layer 722, the second heat dissipation adhesive layer 723 and the gap tape 724. The heat dissipation layer 721 can be a graphitized polymer film. The polymer film can be, for example, a polyimide film. The thickness of each of the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 can be in the range of 3 μm to 8 μm (specifically, about 5 μm). The thickness of each of the heat dissipation layer 721 and the gap tape 724 can be in the range of 10 μm to 25 μm (specifically, about 17 μm). However, the thickness of each of the first heat dissipation adhesive layer 722, the second heat dissipation adhesive layer 723, the heat dissipation layer 721 and the gap tape 724 may not be limited to the above ranges or values.

[0137] The insulating film 730 may be attached to the bottom surface of the heat sink 720. For example, the insulating film 730 may be attached to the second heat dissipation adhesive layer 723. The insulating film 730 may prevent rattling noise from occurring in the electronic device 1000. The thickness of the insulating film 730 may be about 15 μm, but exemplary embodiments are not limited to this example.

[0138] The height difference compensating member 800 may be attached to the bottom surface of the board 610. For example, the lower adhesive layer 620 may be attached to the bottom surface of one portion of the board 610, and the height difference compensating member 800 may be attached to the bottom surface of another portion of the board 610.

[0139] The height difference compensation member 800 may include a first compensation adhesive layer 810, a height difference compensation film 820, and a second compensation adhesive layer 830. The first compensation adhesive layer 810 may be attached to the bottom surface of the board 610. The height difference compensation film 820 may be a synthetic resin film. The second compensation adhesive layer 830 may be attached to the bottom surface of the height difference compensation film 820 and the component (not shown). The thickness of each of the first compensation adhesive layer 810 and the second compensation adhesive layer 830 may be in the range of 13 μm to 25 μm (specifically, about 17 μm). The thickness of each of the first compensation adhesive layer 810 and the second compensation adhesive layer 830 is not limited to this example, and the thickness of the height difference compensation film 820 may be determined according to the thickness of the first compensation adhesive layer 810 and the second compensation adhesive layer 830.

[0140] Figure 3B yes Figure 2 sectional view of another exemplary embodiment of a display panel.

[0141] Reference Figure 3B , when compared with the reference Figure 3A When comparing the display panel 100 described above, the display panel 100aa may further include an anti-reflection layer 130. In this case, the electronic device 1000 (eg, see FIG. 1 ) including the display panel 100aa may be provided. Figure 2 ) in which the anti-reflection member 200 is omitted (see, for example, Figure 2 ) and the first adhesive layer 1010 (see, for example, Figure 2 ).

[0142] The display panel 100 aa may include a display layer 110 , a sensor layer 120 , and an anti-reflection layer 130 .

[0143] In an exemplary embodiment, the anti-reflection layer 130 may include color filters. The color filters may be arranged in a specific arrangement. The arrangement of the color filters may be determined in consideration of the color of light emitted from the pixels in the display layer 110. In addition, the anti-reflection layer 130 may further include a black matrix disposed adjacent to the color filters.

[0144] In an exemplary embodiment, the anti-reflection layer 130 may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer provided on different layers. The first reflective layer and the second reflective layer may cause the first reflected light and the second reflected light respectively reflected by the first reflective layer and the second reflective layer to destructively interfere with each other, thereby reducing the reflectivity of external light.

[0145] Figure 4A It shows Figure 1A An exploded perspective view of an exemplary embodiment of some elements of an electronic device.

[0146] Figure 4AIt is shown as an example Figure 2 The electronic device 1000 includes a light blocking layer 360, a display panel 100, and an electronic module 2000. The electronic module 2000 may include a camera module 2100 and an ambient light sensor 2200.

[0147] The ambient light sensor 2200 may include a light emitting module 2210 and a light receiving module 2220. The light emitting module 2210 and the light receiving module 2220 may be mounted on a single substrate. The light emitting module 2210 may be configured to generate and output light. For example, the light emitting module 2210 may emit infrared light, and the light emitting module 2210 may include a light emitting diode. The light receiving module 2220 may sense infrared light. When the level of infrared light is higher than a certain level, the light receiving module 2220 may be activated. The light receiving module 2220 may include a CMOS sensor. The infrared light emitted from the light emitting module 2210 may be reflected by an external object (e.g., a user's finger or face) and may be incident on the light receiving module 2220.

[0148] An active area 100A and a peripheral area 100NA may be defined in the display panel 100. The active area 100A may correspond to Figure 1A The active area 1000A shown in FIG, and the peripheral area 100NA may correspond to Figure 1A The peripheral area 1000NA is shown in FIG.

[0149] The first sensing area 100SA1 overlapping with the camera module 2100 may be at least partially enclosed and / or completely surrounded by the active area 100A, and the second sensing area 100SA2 and the third sensing area 100SA3 overlapping with the light emitting module 2210 and the light receiving module 2220, respectively, may be part of the active area 100A.

[0150] The first hole 101H may be defined in a portion of the display panel 100. The first hole 101H may be at least partially surrounded by the active area 100A. The first hole 101H may correspond to the first sensing area 100SA1. In this way, the camera module 2100 may receive external light input provided through the first hole 101H.

[0151] The electronic device 1000 may include a light-blocking element disposed on the display panel 100 to block light. The light-blocking element for blocking light may be associated with the peripheral area 100NA and the first hole 101H. In an exemplary embodiment, the light-blocking layer 360 may include a first light-blocking element in the form of a first light-blocking pattern 361 and a second light-blocking element in the form of a second light-blocking pattern 362. The first light-blocking pattern 361 may be a pattern that covers and / or overlaps the peripheral area 100NA. The second light-blocking pattern 362 may be disposed near and / or adjacent to the first hole 101H. At least a portion of the second light-blocking pattern 362 may overlap the first hole 101H. When viewed in plan, the second light-blocking pattern 362 may enclose and / or completely surround the camera module 2100. Furthermore, the second light-blocking pattern 362 may be enclosed and / or completely surrounded by the active area 100A.

[0152] The first light-blocking pattern 361 and the second light-blocking pattern 362 may be provided on the same layer. For example, the first light-blocking pattern 361 and the second light-blocking pattern 362 may be formed simultaneously by the same process. The first light-blocking pattern 361 may be referred to as a peripheral light-blocking pattern, and the second light-blocking pattern 362 may be referred to as a light-blocking pattern.

[0153] Figure 4B is used to illustrate an exemplary embodiment of an electronic device, along Figure 4A A sectional view taken along line IV-IV'.

[0154] Reference Figure 4A and Figure 4B , the first light-blocking pattern 361 and the second light-blocking pattern 362 may have different thicknesses from each other. For example, the first thickness TK1 of the first light-blocking pattern 361 may be greater than the second thickness TK2 of the second light-blocking pattern 362. The first thickness TK1 may be greater than the second thickness TK2 and may be less than or equal to 10 times the second thickness TK2. In an exemplary embodiment, the first thickness TK1 may be greater than or equal to 3 times the second thickness TK2 and may be less than or equal to 10 times the second thickness TK2. However, the range of the second thickness TK2 is not limited thereto. For example, the second thickness TK2 may be in the range of 0.5 μm to 1.5 μm, and the first thickness TK1 may be in the range of 1.5 μm to 5 μm, but exemplary embodiments are not limited to this example. For example, the first light-blocking pattern 361 may be approximately 4 μm, and the second light-blocking pattern 362 may be approximately 1 μm.

[0155] When the second thickness TK2 is less than 0.5 μm, the second light-blocking pattern 362 may not sufficiently block external light. Furthermore, when the second thickness TK2 is greater than 1.5 μm, uneven portions may be formed in a layer covering the second light-blocking pattern 362 due to the second light-blocking pattern 362. When uneven portions are formed in the layer, the clarity of an image obtained by the camera module 2100 may be degraded.

[0156] According to an exemplary embodiment, the first light-blocking pattern 361 and the second light-blocking pattern 362 can be designed to have different thicknesses. The first thickness TK1 can be designed to be thicker than the second thickness TK2. Therefore, the first light-blocking pattern 361 can cover the peripheral area 100NA, thereby sufficiently blocking light. In addition, the second thickness TK2 can be designed to be thinner than the first thickness TK1. As the second thickness TK2 of the second light-blocking pattern 362 becomes thinner, the curvature and / or unevenness generated in the layer covering the second light-blocking pattern 362 can be reduced, and thus the layer can be flattened. Therefore, it is possible to prevent or reduce the formation of unevenness in the area overlapping with the camera module 2100. As a result, it is possible to prevent the quality of the image obtained by the camera module 2100 from deteriorating.

[0157] The width 361TW of the first light-blocking pattern 361 may be greater than the width 362TW of the second light-blocking pattern 362. For example, the width 361TW of the first light-blocking pattern 361 may be equal to or greater than 0.67 mm, and the width 362TW of the second light-blocking pattern 362 may be approximately 0.52 mm. However, the width 361TW of the first light-blocking pattern 361 and the width 362TW of the second light-blocking pattern 362 are not limited to these values.

[0158] The first light-blocking pattern 361 may be provided in the electronic device 1000 (eg, see Figure 2 ) of the peripheral area 1000NA (see, for example, Figure 2 ), and the second light-blocking pattern 362 may be provided in the electronic device 1000 (eg, see Figure 2 ) effective area 1000A (see, for example, Figure 1A ). Therefore, during the process of assembling the electronic device 1000, the first light-blocking pattern 361 may be covered with another element (e.g., a housing), or the first light-blocking pattern 361 may be partially cut through an additional cutting process. Therefore, the first light-blocking pattern 361 may be designed to have a larger width than the second light-blocking pattern 362.

[0159] Figure 4C is used to illustrate another exemplary embodiment of an electronic device, along Figure 4A A sectional view taken along line IV-IV'.

[0160] Reference Figure 4A and Figure 4C , the first light-blocking pattern 361 may include one or more stacked layers in the form of printed layers 361L1, 361L2, and 361L3 stacked on the impact-absorbing layer 370, and the second light-blocking pattern 362 may include one or more stacked layers in the form of a printed layer 362L disposed on the impact-absorbing layer 370. The number of printed layers 361L1, 361L2, and 361L3 in the first light-blocking pattern 361 may be different from the number of printed layers 362L in the second light-blocking pattern 362. Figure 4C , one printed layer may refer to a layer formed by a single printing process.

[0161] The first light-blocking pattern 361 may be provided by three-color printing, and the second light-blocking pattern 362 may be provided by single-color printing. That is, the number of repetitions of the printing process for forming the first light-blocking pattern 361 may be greater than the number of repetitions of the printing process for forming the second light-blocking pattern 362.

[0162] As long as the number of printed layers constituting the first light-blocking pattern 361 is greater than the number of printed layers constituting the second light-blocking pattern 362, the number of layers included in each of the first light-blocking pattern 361 and the second light-blocking pattern 362 may not be limited to Figure 4C .

[0163] Figure 5 yes Figure 1A A rear view of an exemplary embodiment of some elements of an electronic device.

[0164] exist Figure 5 exemplarily shows a display panel 100, a height difference compensating member 800, a heat dissipation layer 721 and a gap strip 724.

[0165] Reference Figure 4A and Figure 5 , the first hole 101H, the second hole 102H, and the third hole 103H may correspond to the first sensing area 100SA1, the second sensing area 100SA2, and the third sensing area 100SA3, respectively.

[0166] This can be accomplished by removing the electronic device 1000 (e.g., see Figure 1A ) are used to form the first hole 101H, the second hole 102H and the third hole 103H, and this will be described in more detail below.

[0167] The first hole 101H may overlap with the height difference compensating member 800, and each of the second hole 102H and the third hole 103H may overlap with the gap band 724. Therefore, when viewed in a plan view, the first hole 101H may be surrounded and / or completely surrounded by the height difference compensating member 800, and each of the second hole 102H and the third hole 103H may be surrounded and / or completely surrounded by the gap band 724.

[0168] Figure 6 is used to illustrate an exemplary embodiment of an electronic device, along Figure 1A A cross-sectional view taken along line II-II'.

[0169] Figure 6 A first hole 101H is shown in which the camera module 2100 is inserted. The first hole 101H may include a first hole portion 101H1, a second hole portion 101H2, and a third hole portion 101H3.

[0170] The first hole portion 101H1 may be defined by the first sidewall SW1 , the second hole portion 101H2 may be defined by the second sidewall SW2 , and the third hole portion 101H3 may be defined by the third sidewall SW3 .

[0171] The first hole portion 101H1, the second hole portion 101H2, and the third hole portion 101H3 may have different sizes from each other. For example, the first hole portion 101H1 may have the smallest size, the second hole portion 101H2 may have the largest size, and the third hole portion 101H3 may have a size between the sizes of the first hole portion 101H1 and the second hole portion 101H2.

[0172] The first hole portion 101H1 may be formed by a laser cutting process. For example, a laser may be used to cut the layer from the lower protective film 400 to the second adhesive layer 1020. The second hole portion 101H2 may be provided in the pad member 500, and in an exemplary embodiment, the second hole portion 101H2 may be formed by a shearing process on the pad member 500. The pad member 500 having the second hole portion 101H2 may be attached to the lower protective film 400. The third hole portion 101H3 may be formed by a shearing process on the plate 610 and the height difference compensation member 800.

[0173] According to an exemplary embodiment, the pad member 500 having the second hole portion 101H2 may be attached to the plate 610 having the third hole portion 101H3, and then, the pad member 500 may be attached to the lower protective film 400. Therefore, the first hole portion 101H1, the second hole portion 101H2, and the third hole portion 101H3 may be formed to have sizes different from each other in consideration of component tolerance, device tolerance, and folding tolerance.

[0174] The folding tolerance may be a tolerance caused by the folding operation of the electronic device 1000. For example, the folding tolerance may be determined in consideration of the movement distance (or sliding) of each element when the electronic device 1000 is fully folded and the unrecovered movement distance of each element when the electronic device 1000 is unfolded after the folding operation.

[0175] According to an exemplary embodiment, since the sizes of the first hole portion 101H1, the second hole portion 101H2, and the third hole portion 101H3 are determined in consideration of the folding tolerance, no interference problem may occur between the inner side wall of the first hole 101H and the electronic module (e.g., the camera module 2100) inserted into the first hole 101H. In addition, the second light-blocking pattern 362 corresponding to the position of the first hole 101H may also be set in consideration of the folding tolerance. Therefore, even when the electronic device 1000 is folded and unfolded, it is possible to reduce the second light-blocking pattern 362 from blocking the active area 100A of the display panel 100 (e.g., see FIG. 2 ). Figure 4A ) or the possibility of covering the viewing angle area 2100AV of the camera module 2100.

[0176] According to an exemplary embodiment, the second light-blocking pattern 362 may be directly disposed on the impact-absorbing layer 370, and the second hard coating layer 380 may be directly disposed under the impact-absorbing layer 370. Therefore, the second light-blocking pattern 362 may be in contact with the impact-absorbing layer 370, and the second hard coating layer 380 may be in contact with the impact-absorbing layer 370. The impact-absorbing layer 370 may be disposed between the second light-blocking pattern 362 and the second hard coating layer 380.

[0177] After forming the second hard coating layer 380 on the shock absorbing layer 370, the second light-blocking pattern 362 may be formed by a printing method. Since the shock absorbing layer 370 has an uneven and / or rough surface, the adhesive strength when the second light-blocking pattern 362 is printed on the shock absorbing layer 370 may be stronger than when the second light-blocking pattern 362 is printed on the second hard coating layer 380. Since the second light-blocking pattern 362 is directly printed on the uneven and / or rough surface of the shock absorbing layer 370, the possibility of the second light-blocking pattern 362 being separated from the shock absorbing layer 370 may be reduced.

[0178] Camera module 2100 can be inserted into first hole 101H. Second upper adhesive layer 350, light blocking layer 360, impact absorbing layer 370, and second hard coating layer 380 can be provided between camera module 2100 and window 340. Since at least one layer is provided between camera module 2100 and window 340, the possibility of window 340 being damaged by camera module 2100 can be reduced. Therefore, the product reliability of the electronic device can be improved.

[0179] The top surface 2100U of the camera module 2100 can be located in the second hole portion 101H2 provided in the pad member 500. The second hole portion 101H2 can have the largest diameter among the first hole portion 101H1, the second hole portion 101H2, and the third hole portion 101H3. Therefore, even when the positional relationship between the layers is changed by folding the electronic device 1000, the possibility of the camera module 2100 colliding with the second side wall SW2 can be reduced. Therefore, the product reliability of the electronic device can be improved.

[0180] The position of the top surface 2100U of the camera module 2100 is not limited to Figure 6 For example, the top surface 2100U of the camera module 2100 may be disposed in the first hole portion 101H1. In this case, the width 362W of the area enclosed and / or completely surrounded by the second light-blocking pattern 362 may be designed to have a reduced value compared to a case where the top surface 2100U of the camera module 2100 is disposed in the second hole portion 101H2.

[0181] For example, the second light-blocking pattern 362 may be designed so that the second light-blocking pattern 362 does not overlap with the viewing angle area 2100AV of the camera module 2100. When viewed in a plan view, the second light-blocking pattern 362 may be spaced apart from the viewing angle area 2100AV of the camera module 2100 by a certain distance in consideration of process tolerances. As the distance between the camera module 2100 and the second light-blocking pattern 362 decreases, the second light-blocking pattern 362 may not block or obscure the viewing angle area 2100AV of the camera module 2100 even when the width 362W of the area enclosed and / or completely surrounded by the second light-blocking pattern 362 decreases.

[0182] According to an exemplary embodiment, the distance DT between the camera module 2100 and the window 340 can be maintained at a value greater than a predetermined distance. Maintaining the distance DT between the camera module 2100 and the window 340 greater than the predetermined distance can reduce the likelihood of damage to the window 340 by the camera module 2100. Consequently, the product reliability of the electronic device can be improved. When the window 340 is a glass substrate, the damage can be a crack, and when the window 340 is a synthetic resin film, the damage can be a dent.

[0183] For example, the distance DT may be in the range of 60% to 200% of the sum of the thicknesses of the elements in which the first hole 101H is defined and whose modulus is less than the reference modulus. Figure 6, the element having the first hole 101H may correspond to an element disposed under the second hard coating layer 380. The reference modulus may be less than 100 MPa, and in an exemplary embodiment, the reference modulus may be in the range of 0 MPa to 50 MPa.

[0184] Elements meeting this condition may be the first adhesive layer 1010 , the second adhesive layer 1020 , the third adhesive layer 1030 , the first pad adhesive layer 510 , the pad layer 530 , the second pad adhesive layer 540 , the first compensation adhesive layer 810 , and the second compensation adhesive layer 830 .

[0185] In an exemplary embodiment, the thickness of the first adhesive layer 1010 may be about 25 μm, the thickness of the second adhesive layer 1020 may be about 25 μm, the thickness of the third adhesive layer 1030 may be about 18 μm, the thickness of the first pad adhesive layer 510 may be about 25 μm, the thickness of the pad layer 530 may be about 100 μm, the thickness of the second pad adhesive layer 540 may be about 8 μm, the thickness of the first compensation adhesive layer 810 may be about 17 μm, and the thickness of the second compensation adhesive layer 830 may be about 17 μm. Each of the thicknesses may have a process error. Therefore, the sum of the thicknesses may be within the range of 183 μm to 300 μm (specifically, about 235 μm). However, the sum of the thicknesses is not limited thereto.

[0186] Considering the highest compressibility of layers having a modulus less than the reference modulus, the distance DT between the camera module 2100 and the window 340 may be determined. For example, the distance DT may be greater than the value obtained by multiplying the sum of the thicknesses by the highest compressibility. The distance DT may be greater than 110 μm (e.g., greater than 141 μm).

[0187] According to the exemplary embodiment, even when the components are compressed to the maximum extent due to the applied pressure during use of the electronic device 1000, the window 340 and the camera module 2100 can be spaced apart from each other by a certain distance. Therefore, the possibility of the window 340 being damaged by the camera module 2100 can be significantly reduced. Therefore, the product reliability of the electronic device can be improved.

[0188] Figure 7 yes Figure 6 is a plan view of an exemplary embodiment of first to third sidewalls and a second light-blocking pattern.

[0189] Figure 7 The second light-blocking pattern 362 , the first sidewall SW1 , the second sidewall SW2 , and the third sidewall SW3 are exemplarily shown in FIG.

[0190] When viewed in a plan view, the first sidewall SW1 may overlap the second light-blocking pattern 362, and the second sidewall SW2 and the third sidewall SW3 may not overlap the second light-blocking pattern 362. When viewed in a plan view, the third sidewall SW3 may enclose and / or completely surround the second light-blocking pattern 362, and the second sidewall SW2 may enclose and / or completely surround the third sidewall SW3.

[0191] Reference Figure 6 and Figure 7 The first width WT1 of the first hole portion 101H1, the second width WT2 of the second hole portion 101H2, and the third width WT3 of the third hole portion 101H3 may be different from each other. For example, the second width WT2 may be greater than the first width WT1 and the third width WT3, and the third width WT3 may be greater than the first width WT1.

[0192] The inner diameter 362ID of the second light-blocking pattern 362 may be in the range of 2 mm to 3 mm (specifically, about 2.68 mm), and the outer diameter 362OD of the second light-blocking pattern 362 may be in the range of 3.2 mm to 4.2 mm (specifically, about 3.72 mm). Figure 4B ) can be about 0.52 mm.

[0193] The first hole portion 101H1 may correspond to a hole defined in the display panel 100. When viewed in a plan view, a portion 362P1 of the second light-blocking pattern 362 may be disposed in the first hole portion 101H1. In other words, the portion 362P1 of the second light-blocking pattern 362 may overlap with the first hole portion 101H1. In addition, another portion 362P2 of the second light-blocking pattern 362 may not overlap with the first hole portion 101H1.

[0194] Figure 8 is used to illustrate an exemplary embodiment of an electronic device, along Figure 1A A cross-sectional view taken along line III-III'.

[0195] Figure 8 The third hole 103H is shown in which the light receiving module 2220 is inserted. Figure 4A ) of the second hole 102H (see, for example, Figure 5 ) may have substantially the same cross-sectional structure as the third hole 103H, and therefore, one may understand the cross-sectional structure of the second hole 102H (eg, see Figure 5 ) related technical features.

[0196] The third hole 103H may include a first hole portion 103H1 and a second hole portion 103H2. The first hole portion 103H1 may be defined by the first sidewall SW13, and the second hole portion 103H2 may be defined by the second sidewall SW23.

[0197] The first hole portion 103H1 and the second hole portion 103H2 may have different sizes from each other. For example, the size of the first hole portion 103H1 may be larger than the size of the second hole portion 103H2.

[0198] The first hole portion 103H1 may be provided in the pad member 500 and, in an exemplary embodiment, may be formed by a shearing process of the pad member 500. The second hole portion 103H2 may be formed by a shearing process of the first and second lower members 600 and 700.

[0199] The third hole 103H may not be provided in the display panel 100. For example, the third hole 103H may be provided in at least one of the elements provided below the display panel 100. Therefore, a portion of the display panel 100 overlapping with the third hole 103H may display an image and may sense an input applied from the outside.

[0200] The first hole 101H (see, for example, Figure 6 ) may penetrate the display panel 100, but the third hole 103H may not penetrate the display panel 100. For example, the depth DT1 of the first hole 101H (eg, see Figure 6 ) may be greater than the depth DT2 of the third hole 103H.

[0201] Figure 9 is used to illustrate another exemplary embodiment of an electronic device, along Figure 1A A cross-sectional view taken along line II-II'. Figure 9 In the following description, reference is made to Figure 6 Described elements may be identified by the same reference numerals without repeating their descriptions to avoid redundancy.

[0202] Reference Figure 9 , the second light-blocking pattern 362a of the electronic device 1000aa may be disposed between the window 340 and the first upper adhesive layer 330. The first light-blocking pattern 361 of the electronic device 1000aa (eg, see Figure 4A ) may also be disposed between the window 340 and the first upper adhesive layer 330 .

[0203] The second light-blocking pattern 362a may be printed on the top surface of the window 340 and may be covered by the first upper adhesive layer 330. The thickness of the second light-blocking pattern 362a may be in the range of 0.5 μm to 1.5 μm (specifically, 1 μm). However, the thickness of the second light-blocking pattern 362a is not limited thereto.

[0204] According to an exemplary embodiment, the second light-blocking pattern 362a is disposed on the top surface of the window 340, and since the second light-blocking pattern 362a has a relatively thin thickness, the possibility of forming an uneven portion in a layer covering the second light-blocking pattern 362a can be reduced. For example, the second light-blocking pattern 362a may have a thickness greater than that of another light-blocking pattern (such as a Figure 1A The thickness of the first light-blocking pattern 361 (which overlaps the peripheral area 1000NA) is smaller than the thickness of the first light-blocking pattern 361. Therefore, it is possible to prevent the quality of the image obtained by the camera module 2100 from being deteriorated.

[0205] Figure 10 is a diagram for illustrating another exemplary embodiment of an electronic device. Figure 1A A cross-sectional view taken along line II-II'. Figure 10 In the following description, reference is made to Figure 6 Described elements may be identified by the same reference numerals without repeating their descriptions to avoid redundancy.

[0206] Reference Figure 10 , the second light-blocking pattern 362b of the electronic device 1000bb may be disposed between the second adhesive layer 1020 and the anti-reflection member 200. The first light-blocking pattern 361 of the electronic device 1000bb (eg, see Figure 4A ) may be disposed between the second adhesive layer 1020 and the anti-reflection member 200. The second light-blocking pattern 362b may constitute a portion of the first sidewall SW1 defining the first hole portion 101H1.

[0207] The second light-blocking pattern 362b may be printed on the anti-reflection member 200 and may be covered by the second adhesive layer 1020. The thickness of the second light-blocking pattern 362b may be in the range of 0.5 μm to 1.5 μm (specifically, about 1 μm). However, the thickness of the second light-blocking pattern 362b is not limited thereto.

[0208] According to an exemplary embodiment, the second light-blocking pattern 362b is disposed on the top surface of the anti-reflection member 200, and since the second light-blocking pattern 362b has a relatively thin thickness, the possibility of forming an uneven portion in a layer covering the second light-blocking pattern 362b can be reduced. For example, the thickness of the second light-blocking pattern 362b can be smaller than that of another light-blocking pattern (such as a thin film having a thickness greater than 0.05mm). Figure 1AThe thickness of the first light-blocking pattern 361 overlapped with the peripheral area 1000NA is less than 100%. Therefore, it is possible to prevent the quality of the image obtained by the camera module 2100 from being deteriorated.

[0209] Figure 11 is a diagram for illustrating another exemplary embodiment of an electronic device. Figure 1A A cross-sectional view taken along line II-II'. Figure 11 In the following description, reference is made to Figure 6 Described elements may be identified by the same reference numerals without repeating their descriptions to avoid redundancy.

[0210] When with reference Figure 6 When comparing the electronic device 1000 described, Figure 11 1000cc of electronic equipment may not include Figure 6 The impact absorbing layer 370, the second hard coating layer 380 and the second adhesive layer 1020 are formed. In this case, the upper member 300 can be attached to the anti-reflection member 200 via the second upper adhesive layer 350. Figure 6 Compared with the electronic device 1000 , the electronic device 1000 cc may further include a second hard coating layer 341 disposed under the window 340 .

[0211] The first hole 101Ha may include a first hole portion 101H1a, a second hole portion 101H2, and a third hole portion 101H3. The first hole portion 101H1a may be defined by a first sidewall SW1a. The first hole portion 101H1a may be formed by a laser cutting process. The first sidewall SW1a may include the sidewalls of the lower protective film 400, the sidewalls of the third adhesive layer 1030, the sidewalls of the display panel 100, the sidewalls of the first adhesive layer 1010, the sidewalls of the anti-reflection member 200, and the sidewalls of the second upper adhesive layer 350. After forming the first hole 101Ha, the second upper adhesive layer 350 may be attached to the second hard coating layer 341.

[0212] The second hard coating layer 341 may be exposed through the first hole portion 101H1a. The bottom surface of the window 340 may be flattened by the second hard coating layer 341. Since the second hard coating layer 341 covers the bottom surface of the window 340 to protect the window 340 from other components of the electronic device 1000cc (such as the camera module 2100), it is possible to prevent the window 340 from being damaged by other components such as the camera module 2100.

[0213] The second light-blocking pattern 362c may be disposed between the window 340 and the first upper adhesive layer 330. The first light-blocking pattern 361 of the electronic device 1000cc (eg, see Figure 4A ) may be disposed between the window 340 and the first upper adhesive layer 330 .

[0214] The second light-blocking pattern 362c may be printed on the top surface of the window 340 and may be covered by the first upper adhesive layer 330. The thickness of the second light-blocking pattern 362c may be in the range of 0.5 μm to 1.5 μm (specifically, about 1 μm). However, the thickness of the second light-blocking pattern 362c is not limited thereto.

[0215] According to an exemplary embodiment, the second light-blocking pattern 362c is disposed on the top surface of the window 340, and since the second light-blocking pattern 362c has a relatively small thickness, the possibility of forming an uneven portion in a layer covering the second light-blocking pattern 362c can be reduced. For example, the thickness of the second light-blocking pattern 362c can be smaller than that of another light-blocking pattern (such as a layer with a thickness of 100 nm). Figure 1A The thickness of the first light blocking pattern 361 overlapped with the peripheral area 1000NA is less than 100%. Therefore, it is possible to prevent the quality of the image obtained by the camera module 2100 from being deteriorated.

[0216] Figure 12 is used to illustrate another exemplary embodiment of an electronic device. Figure 1A A cross-sectional view taken along line II-II'. Figure 12 In the following description, reference is made to Figure 6 Described elements may be identified by the same reference numerals without repeating their descriptions to avoid redundancy.

[0217] Reference Figure 12 , when compared with the reference Figure 6 When compared to the electronic device 1000 described above, the electronic device 1000 dd may not include the second hard coating layer 380 .

[0218] The second light-blocking pattern 362 d may be disposed on a top surface or a bottom surface of the impact absorbing layer 370 . Figure 12 An example is shown in which the second light-blocking pattern 362d is disposed on the bottom surface of the impact absorbing layer 370. The second light-blocking pattern 362d may be disposed between the impact absorbing layer 370 and the second adhesive layer 1020.

[0219] and Figure 6 Compared to the example of FIG. 3 , the distance between the camera module 2100 and the second light-blocking pattern 362 d can be reduced. Therefore, even when the width 362W of the area enclosed and / or completely surrounded by the second light-blocking pattern 362 d is reduced, the second light-blocking pattern 362 d may not block the viewing angle area 2100AV of the camera module 2100.

[0220] The thickness of the second light-blocking pattern 362d may be in the range of 0.5 μm to 1.5 μm (specifically, approximately 1 μm). However, the thickness of the second light-blocking pattern 362d is not limited thereto. According to exemplary embodiments, since the second light-blocking pattern 362d has a relatively thin thickness, the possibility of uneven portions being formed in the layer covering the second light-blocking pattern 362d may be reduced. Therefore, degradation of the quality of images obtained by the camera module 2100 may be prevented.

[0221] Figure 13 is used to illustrate another exemplary embodiment of an electronic device, along Figure 1A A cross-sectional view taken along line II-II'. Figure 13 In the following description, reference is made to Figure 6 Described elements may be identified by the same reference numerals without repeating their descriptions to avoid redundancy.

[0222] Reference Figure 13 , the electronic device 1000ee can be aligned with the reference 1000e in terms of the position of the second light-blocking pattern 362e. Figure 6 The electronic device 1000 depicted is different.

[0223] The second light blocking pattern 362e may be disposed below the second hard coating layer 380. The second light blocking pattern 362e may be disposed between the second adhesive layer 1020 and the second hard coating layer 380. The first light blocking pattern 361 (eg, see Figure 4A ) may be disposed between the second adhesive layer 1020 and the second hard coating layer 380 .

[0224] and Figure 6 Compared to the example of FIG. 3 , the distance between the camera module 2100 and the second light-blocking pattern 362e can be reduced. Therefore, even when the width 362W of the area enclosed and / or completely surrounded by the second light-blocking pattern 362e is reduced, the second light-blocking pattern 362e may not block the viewing angle area 2100AV of the camera module 2100.

[0225] In addition, the thickness of the second light-blocking pattern 362e may be in the range of 0.5 μm to 1.5 μm (specifically, 1 μm). However, the thickness of the second light-blocking pattern 362e is not limited thereto. According to an exemplary embodiment, since the second light-blocking pattern 362e has a relatively small thickness, the possibility of forming an uneven portion in the layer covering the second light-blocking pattern 362e may be reduced. For example, the thickness of the second light-blocking pattern 362e may be smaller than that of another light-blocking pattern (such as a thin film having a thickness greater than 0.5 μm). Figure 1AThe thickness of the first light blocking pattern 361) overlapped with the peripheral area 1000NA is less than 0.1%. Therefore, it is possible to prevent the degradation of the image quality of the image obtained by the camera module 2100.

[0226] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements as will be apparent to those skilled in the art.

Claims

1. An electronic device comprising: A display panel having an active area and a peripheral area adjacent to the active area; an electronic module, disposed below the display panel; a first light blocking element disposed on the display panel and overlapping the peripheral area; as well as a second light blocking element disposed on the electronic module, wherein the display panel is interposed between the second light blocking element and the electronic module; wherein a hole is defined in a portion of the display panel and is at least partially surrounded by the active area, When viewed in plan, the second light blocking element is provided in a region adjacent to the hole, and The first light blocking element has a first thickness, and the second light blocking element has a second thickness that is less than the first thickness.

2. The electronic device according to claim 1, wherein The first light blocking element includes a first light blocking pattern having the first thickness, the second light blocking element includes a second light blocking pattern having the second thickness, and wherein the first thickness is greater than or equal to three times the second thickness.

3. The electronic device according to claim 1, wherein The second thickness is in a range of 0.5 μm to 1.5 μm.

4. The electronic device according to claim 1, further comprising: a window, disposed on the display panel; as well as an adhesive layer spaced apart from the display panel, wherein the window is interposed between the adhesive layer and the display panel, Wherein, the second light blocking element is disposed between the window and the adhesive layer.

5. The electronic device according to claim 4, further comprising a hard coating layer, wherein the hard coating layer is disposed below the window. in, The second light blocking element and the hard coating layer are spaced apart from each other, wherein the window is interposed between the second light blocking element and the hard coating layer. 6 . The electronic device according to claim 1 , further comprising a shock absorbing layer provided on the display panel.

7. The electronic device according to claim 6, further comprising a hard coating layer provided between the impact absorbing layer and the display panel and in contact with the impact absorbing layer, in, The second light blocking element is spaced apart from the impact absorbing layer, wherein the hard coating layer is interposed between the second light blocking element and the impact absorbing layer.

8. The electronic device according to claim 6, wherein The second light blocking element is directly printed on the surface of the impact absorbing layer.

9. The electronic device according to claim 6, further comprising a hard coating layer provided between the impact absorbing layer and the display panel and in contact with the impact absorbing layer, in, The second light blocking element is spaced apart from the hard coating layer, wherein the impact absorbing layer is interposed between the second light blocking element and the hard coating layer.

10. The electronic device according to claim 9, wherein A portion of the hard coating layer is exposed by the hole.

11. The electronic device according to claim 10, wherein: A first portion of the second light blocking element overlaps the aperture, and a second portion of the second light blocking element does not overlap the aperture.

12. The electronic device according to claim 6, further comprising a window provided on the impact absorbing layer, in, The second light blocking element is disposed between the window and the impact absorbing layer or on the window.

13. The electronic device according to claim 1, further comprising an anti-reflection member provided on the display panel. in, the second light blocking element is disposed on the anti-reflection member, and The second light blocking element is spaced apart from the display panel, wherein the anti-reflection member is interposed between the second light blocking element and the display panel.

14. The electronic device according to claim 1, wherein The first light blocking element includes a plurality of first stacked layers, the second light blocking element includes one or more second stacked layers, and the number of the plurality of first stacked layers is greater than the number of the one or more second stacked layers.

15. The electronic device according to claim 1, wherein When viewed in the plan view, the second light blocking element is at least partially surrounded by the active area.

16. The electronic device according to claim 1, wherein A width of the first light blocking element is greater than a width of the second light blocking element.

17. The electronic device according to claim 1, wherein The display panel includes a foldable area extending along a folding axis.

18. An electronic device comprising: window; an impact absorbing layer disposed below the window; a hard coating layer disposed below the impact absorbing layer; a display panel disposed below the hard coating layer, the display panel including an aperture defined therein; a light blocking pattern disposed on the impact absorbing layer near the hole; as well as a peripheral light-blocking pattern provided on the same layer as the light-blocking pattern, Wherein, the thickness of the peripheral light-blocking pattern is greater than the thickness of the light-blocking pattern.

19. The electronic device according to claim 18, wherein The impact absorbing layer and the hard coating layer are in direct contact with each other, the impact absorbing layer and the light blocking pattern are in direct contact with each other, and The impact absorbing layer is disposed between the hard coating layer and the light blocking pattern.

20. The electronic device according to claim 18, in, A width of the peripheral light-blocking pattern is greater than a width of the light-blocking pattern.

Images