Semiconductor package testing method and semiconductor package
By sensing and analyzing the electrical signals output from a combination of multiple semiconductor chips, the problem of large measurement errors in electrical signals during multi-chip package testing is solved, resulting in more accurate test results and earlier defect detection.
CN113295980BActive Publication Date: 2026-07-17SAMSUNG ELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2021-02-23
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing technologies for testing multi-chip semiconductor packages suffer from large electrical signal measurement errors, making it difficult to accurately determine whether the package has defects.
Method used
By sensing the electrical signals output by a combination of multiple semiconductor chips, the amplitude of the electrical signals is obtained and compared with a reference table. The analysis is performed using a receiver, arithmetic circuits, and deterministic circuits to reduce electrical signal sensing errors and improve test reliability.
Benefits of technology
It effectively reduces electrical signal measurement errors, improves the accuracy and reliability of semiconductor package testing, and enables earlier detection of package defects.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN113295980B_ABST
Abstract
A method of testing a semiconductor package including a plurality of semiconductor chips and a semiconductor package are provided. The method includes sensing a plurality of electrical signals respectively output from a plurality of semiconductor chip groups each representing a combination of at least two semiconductor chips among the plurality of semiconductor chips, obtaining amplitudes of a plurality of electrical signals respectively output from the plurality of semiconductor chips based on the sensed plurality of electrical signals, and outputting a test result for the semiconductor package by using the obtained amplitudes of the electrical signals.
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