Cooling Architecture

Abstract

The present invention discloses a heat dissipation structure, which includes: a base, a substrate, an electronic component, a heat conductor, a colloid structure and a heat pipe; the base includes an opening; the substrate is arranged on the base, and the substrate includes a plurality of positioning holes; the electronic component is arranged on the substrate and is exposed relative to the opening; the heat conductor is arranged on the base, and the heat conductor abuts against the electronic component through the opening; the heat conductor includes a body and a plurality of fixing holes arranged on the body, and the body includes a first surface and a second surface; the first surface abuts against the electronic component, and the plurality of fixing holes respectively correspond to the corresponding positioning holes; the colloid structure is arranged between the base and the heat conductor; the heat pipe includes a first part and a second part connected to the first part; the first part of the heat pipe is welded on the second surface of the heat conductor. The heat dissipation structure of the present invention can achieve waterproof and dustproof effects, as well as increase the heat dissipation efficiency.

Description

[Technical field]

[0001] The invention relates to a heat dissipation structure, and in particular to a heat dissipation structure with waterproof effect. [Background technology]

[0002] First, in the prior art, the heat pipe, the heat conductive block and the electronic components are stacked in sequence, so that the heat pipe can dissipate heat from the electronic components through the heat conductive block. In addition, in the prior art, a thermal pad is further arranged between the heat pipe and the heat conductive block, so that the heat of the heat conductive block can be transferred to the heat pipe through the thermal pad.

[0003] However, since it is generally hoped that the heat pipe and the heat conductive block are tightly pressed together, if a thermal pad is further provided between the heat pipe and the heat conductive block as a medium conductor, the heat pipe may be easily squeezed and deformed, thereby affecting the heat dissipation efficiency.

[0004] In addition, since the heat pipe and the heat conductive block also have assembly tolerances during assembly, it will not only affect the heat dissipation efficiency, but also cause poor airtightness and affect the waterproof effect.

[0005] Therefore, how to utilize the improvement of the heat dissipation structure to overcome the above-mentioned defects has become one of the important issues that this technology wants to solve. [Summary of the invention]

[0006] The technical problem to be solved by the present invention is to provide a heat dissipation architecture to address the deficiencies of the prior art.

[0007] In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a heat dissipation structure, which includes: a base, a substrate, an electronic component, a heat conductor, a colloid structure and a heat pipe. The base includes an opening. The substrate is arranged on the base, and the substrate includes a plurality of positioning holes. The electronic component is arranged on the substrate and is exposed relative to the opening. The heat conductor is arranged on the base, and the heat conductor abuts against the electronic component through the opening. The heat conductor includes a body and a plurality of fixing holes arranged on the body, and the body includes a first surface and a second surface corresponding to the first surface, wherein the first surface abuts against the electronic component, and the plurality of fixing holes respectively correspond to the corresponding positioning holes. The colloid structure is arranged between the base and the heat conductor. The heat pipe includes a first part and a second part connected to the first part, wherein the first part of the heat pipe is welded on the second surface of the heat conductor.

[0008] The beneficial effects of the present invention are that the heat dissipation structure provided by the present invention can achieve the effects of waterproofing and dustproofing through the technical solution of "the colloid structure is arranged between the base and the heat conductor", and can achieve the effect of increasing the heat dissipation efficiency through the technical solution of "the first part of the heat pipe is welded on the second surface of the heat conductor".

[0009] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention.

Brief Description of the Drawings

[0010] Figure 1 It is a three-dimensional assembly schematic diagram of a heat dissipation structure according to an embodiment of the present invention applied to an electronic device.

[0011] Figure 2 It is a three-dimensional exploded schematic diagram of a heat dissipation structure according to an embodiment of the present invention being applied to an electronic device.

[0012] Figure 3 FIG. 1 is a perspective exploded schematic diagram of a heat dissipation structure according to an embodiment of the present invention.

[0013] Figure 4 FIG. 4 is another exploded perspective view of the heat dissipation structure according to an embodiment of the present invention.

[0014] Figure 5 FIG. 4 is another exploded perspective view of the heat dissipation structure according to the embodiment of the present invention.

[0015] Figure 6 It is a three-dimensional exploded schematic diagram of a heat conductor and a heat pipe of a heat dissipation structure according to an embodiment of the present invention.

[0016] Figure 7 It is another three-dimensional exploded schematic diagram of the heat conductor and the heat pipe of the heat dissipation structure according to the embodiment of the present invention.

[0017] Figure 8 for Figure 2 Schematic cross-sectional view of section VIII-VIII.

[0018] Fig. 9 for Figure 8 Schematic diagram of the enlarged portion IX. [Specific implementation method]

[0019] The following is an explanation of the implementation of the "heat dissipation architecture" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0020] It should be understood that, although the terms "first", "second", "third", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another element. In addition, the term "or" used herein may include any one or more combinations of the associated listed items depending on the actual situation.

[0021] First, see Figure 1 and Figure 2 As shown, Figure 1 is a three-dimensional schematic diagram of a heat dissipation structure according to an embodiment of the present invention applied to an electronic device. Figure 2 The figure is a three-dimensional exploded schematic diagram of a heat dissipation structure of an embodiment of the present invention applied to an electronic device. The embodiment of the present invention provides a heat dissipation structure D2, which can be applied to an electronic device D. In one embodiment, the electronic device D can be a notebook computer, and the heat dissipation structure D2 can be set on the notebook computer, but the present invention is not limited to this. The overall structure of the electronic device D will be described first, and the heat dissipation structure D2 will be described in the subsequent content.

[0022] As mentioned above, the electronic device D includes: a main structure D1 and a heat dissipation structure D2, and the heat dissipation structure D2 is disposed on the main structure D1. In addition, the electronic device D further includes: a display D3 and a keyboard D4, and the display D3 and the keyboard D4 are disposed on the main structure D1 to form a notebook computer, but the present invention is not limited thereto.

[0023] Next, see Figures 3 to 5 As shown, Figures 3 to 5They are three-dimensional exploded schematic diagrams of the heat dissipation structure of the embodiments of the present invention. The heat dissipation structure D2 includes: a base 1, a substrate 2, an electronic component 3, a heat conductor 4, a colloid structure 5 and a heat pipe 6 (Heat pipe). For example, the base 1 can be a notebook computer shell die-casted from an aluminum-magnesium alloy, and the base 1 can be the base of the notebook computer, such as the C part (inside of the base) of the notebook computer, but the present invention is not limited to this. In addition, for example, the substrate 2 can be a circuit board of the electronic device D, and the electronic component 3 can be a chip set arranged on the substrate 2 in the electronic device D, but the present invention is not limited to this. In addition, for example, the heat conductor 4 can be a metal plate.

[0024] As described above, the electronic component 3 is disposed on the substrate 2, the substrate 2 is disposed on the base 1, the base 1 is disposed on the main structure D1, and the base 1 includes an opening 10, and the electronic component 3 can be exposed relative to the opening 10 of the base 1. In addition, the heat conductor 4 is disposed on the base 1, and the heat conductor 4 can abut against the electronic component 3 through the opening 10. In other words, the heat conductor 4 is disposed on a first side of the base 1, the substrate 2 and the electronic component 3 are disposed on a second side of the base 1, and the first side and the second side are respectively located on two opposite sides of the base 1. In addition, the heat conductor 4 and the electronic component 3 can abut against each other through the opening 10, so that the heat of the electronic component 3 is dissipated through the heat conductor 4.

[0025] Next, see Figures 3 to 5 Please also refer to Figure 6 and Figure 7 As shown, Figure 6 and Figure 7 The three-dimensional exploded schematic diagrams are respectively one of the heat conductor and the heat pipe of the heat dissipation structure of the embodiment of the present invention. The heat conductor 4 includes a main body 41, and the main body 41 of the heat conductor 4 includes a first surface 4101 and a second surface 4102 corresponding to the first surface 4101, and the second surface 4102 abuts against the electronic component 3. In addition, the main body 41 of the heat conductor 4 further includes a peripheral portion 411 and a supporting portion 412 connected to the peripheral portion 411 and protruding relative to the peripheral portion 411, and the peripheral portion 411 surrounds the supporting portion. Thereby, in terms of the present invention, the heat conductor 4 can be in the shape of a disk. Further, the second surface 4102 located on the supporting portion 412 can abut against the electronic component 3, and the second surface 4102 located on the peripheral portion 411 can also abut against the base 1 at the same time.

[0026] As described above, the substrate 2 includes a plurality of positioning holes 20, and the heat conductor 4 further includes a plurality of fixing holes 42 disposed on the body 41. The plurality of fixing holes 42 may be located on the peripheral portion 411 of the body 41 of the heat conductor 4, and the plurality of fixing holes 42 respectively correspond to the corresponding positioning holes 20. Further, a plurality of positioning members 7 may be provided, so that the heat conductor 4 and the substrate 2 are combined with each other by using the plurality of positioning members 7 corresponding to the corresponding positioning holes 20 and fixing holes 42, so that the heat conductor 4 is pressed against the electronic component 3.

[0027] As described above, the heat pipe 6 includes a first portion 61 and a second portion 62 connected to the first portion 61. The first portion 61 of the heat pipe 6 is welded to the first surface 4101 of the heat conductor 4 by welding, so that the heat pipe 6 and the heat conductor 4 are combined with each other. In this way, the heat generated by the electronic component 3 can be dissipated through the heat conductor 4 and the heat pipe 6. For example, the first portion 61 of the heat pipe 6 can be welded to the abutting portion 412 of the heat conductor 4, but the present invention is not limited thereto.

[0028] Based on the above, preferably, the heat dissipation structure D2 may further include: a heat dissipation element 8, the heat dissipation element 8 is arranged on the base 1 and adjacent to the heat pipe 6, and the second part 62 of the heat pipe 6 is against the heat dissipation element 8. For example, the heat dissipation element 8 may be a heat dissipation fin made of a metal material, so that the heat energy generated by the electronic component 3 is dissipated sequentially through the heat conductor 4, the heat pipe 6 and the heat dissipation element 8. In addition, for example, the second part 62 of the heat pipe 6 may be welded on the heat dissipation element 8. In addition, preferably, the heat dissipation structure D2 may further include: a fan 9, the fan 9 is arranged on the base 1 and adjacent to the heat dissipation element 8, so as to increase the heat dissipation efficiency of the heat dissipation element 8 by using the fan, however, in other embodiments, the fan 9 may not be arranged, and only the heat dissipation element 8 may be used to discharge the heat. It should be noted that the present invention is not limited to the above examples.

[0029] Next, see Figures 3 to 7 As shown, the colloid structure 5 can be disposed between the base 1 and the heat conductor 4 to bond the base 1 and the heat conductor 4 to each other. In the present invention, the colloid structure 5 can be disposed on the second surface 4102 located at the outer portion 411 of the heat conductor 4, and the outer portion 411 of the heat conductor 4 is abutted against the base 1 through the colloid structure 5, that is, the colloid structure 5 is disposed between the base 1 and the outer portion 411 of the heat conductor 4.

[0030] As described above, the colloid structure 5 includes a substrate 51 and an adhesive layer 52 disposed on two opposite surfaces of the substrate 51, and the substrate 51 is compressible. For example, the colloid structure 5 can be double-sided adhesive tape, double-sided foam adhesive tape, or other colloids with adhesive effects. Preferably, the colloid structure 5 can be double-sided foam adhesive tape, however, the present invention is not limited to the type of the colloid structure 5.

[0031] As described above, further, the colloid structure 5 can surround the opening 10 of the base 1 to form a frame-shaped body surrounding the opening 10. In other words, the projection area formed by the vertical projection of the colloid structure 5 on the base 1 can surround the opening 10 of the base 1. In addition, the vertical projection of the colloid structure 5 on the base 1 can form a first projection area, and the vertical projections of the plurality of positioning holes 20 and the plurality of fixing holes 42 on the base 1 can form a second projection area, and the first projection area can surround the second projection area. In other words, the colloid structure 5 can surround the plurality of positioning holes 20 and the plurality of fixing holes 42. Thereby, the opening 10 can be closed by the heat conductor 4 and the colloid structure 5 to prevent moisture from affecting the electronic element 3 and / or other electronic components on the substrate 2.

[0032] Next, see Figure 4 and Figure 5 As shown, in the present invention, the base 1 includes a waterproof area A1 and a non-waterproof area A2, the substrate 2 and the electronic component 3 are arranged in the waterproof area A1, and the heat dissipation element 8 is arranged in the non-waterproof area A2. For example, the base 1 may further include a partition wall 100, and the waterproof area A1 and the non-waterproof area A2 may be separated by the partition wall 100. The heat pipe 6 may be arranged on the base 1, and the first part 61 of the heat pipe 6 may be pressed against the electronic component 3 located in the waterproof area A1 through the heat conductor 4, and the second part 62 of the heat pipe may be pressed against the heat dissipation element 8 located in the non-waterproof area A2. In this way, since the heat pipe 6 does not penetrate the partition wall 100, it can prevent external dust or moisture from entering the waterproof area A1 without any gap in the partition wall 100.

[0033] Next, see Figure 8 and Fig. 9 As shown, Figure 8 for Figure 2 A schematic cross-sectional view of section VIII-VIII of FIG. Fig. 9 for Figure 8 An enlarged schematic diagram of part IX of . Preferably, in the present invention, each positioning member 7 includes an abutting portion 71 and a screw-connecting portion 72, the abutting portion 71 abuts against the substrate 2, and the screw-connecting portion 72 is screwed into the corresponding fixing hole 42. In other words, the locking direction of the positioning member 7 of the present invention is to lock the substrate 2 in the direction toward the heat conductor 4 to enhance the convenience of assembly. Furthermore, the present invention can also utilize the colloid structure 5 to provide a margin between the heat conductor 4 and the base 1 in the case of a tight fit. In other words, the present invention can utilize the compressibility of the colloid structure 5, and in the case of an assembly tolerance between the heat conductor 4 and the base 1, provide a predetermined displacement for the heat conductor 4 and the base 1 to offset.

[0034] The beneficial effects of the present invention are that the heat dissipation structure D2 provided by the present invention can achieve the effects of waterproof and dustproof through the technical solution of "the colloid structure 5 is set between the base 1 and the heat conductor 4", and can achieve the effect of increasing the heat dissipation efficiency through the technical solution of "the first part 61 of the heat pipe 6 is welded on the first surface 4101 of the heat conductor 4".

[0035] Furthermore, the present invention can also provide a margin between the heat conductor 4 and the base 1 in a tight fit by setting the colloid structure 5 between the base 1 and the heat conductor 4. That is to say, the present invention can utilize the compressibility of the colloid structure 5, and provide a predetermined displacement for the heat conductor 4 and the base 1 to deviate when there is an assembly tolerance between the heat conductor 4 and the base 1. Thus, in one embodiment, the floating effect of the heat conductor 4 can be achieved by adjusting the thickness and / or hardness of the colloid structure 5, which can not only correct the parallelism problem between the electronic component 3 and the heat conductor 4, but also avoid the stress concentration problem caused by the flatness tolerance of the base 1 when the positioning member 7 is locked.

[0036] Furthermore, the present invention can also use a technical solution in which the first portion 61 of the heat pipe 6 is welded to the first surface 4101 of the heat conductor 4 , without providing a thermal pad between the heat pipe 6 and the heat conductor 4 .

[0037] Furthermore, the present invention can achieve the effect of improving the convenience of assembly by having the abutting portion 71 of the positioning member 7 abut against the substrate 2 and the screwing portion 72 of the positioning member 7 screwed into the corresponding fixing hole 42, so that the locking direction of the positioning member 7 is from the substrate 2 to the direction of the heat conductor 4.

[0038] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention's specification and drawings are included in the scope of the present invention.

Claims

1. A heat dissipation architecture, characterized in that: include: a base, the base comprising an opening; a substrate, the substrate being disposed on the base, the substrate comprising a plurality of positioning holes; an electronic component, the electronic component being disposed on the substrate and exposed relative to the opening; a heat conductor, the heat conductor being disposed on the base, the heat conductor being against the electronic component through the opening, the heat conductor comprising a body and a plurality of fixing holes disposed on the body, and the body comprising a first surface and a second surface corresponding to the first surface, wherein the first surface is against the electronic component, and the plurality of fixing holes respectively correspond to the corresponding positioning holes; a colloid structure, the colloid structure being disposed between the base and the heat conductor, and the colloid structure being compressible so as to provide an assembly margin between the base and the heat conductor; and a heat pipe, the heat pipe comprising a first portion and a second portion connected to the first portion, wherein the first portion of the heat pipe is welded to the second surface of the heat conductor; A plurality of positioning members, each of the positioning members corresponds to the corresponding positioning holes and the fixing holes, and each of the positioning members includes an abutting portion and a screw-connecting portion, the abutting portion abuts against the substrate, and the screw-connecting portion is screwed to the corresponding fixing hole; the positioning holes and the fixing holes are arranged around the electronic component.

2. The heat dissipation structure according to claim 1, characterized in that: The colloid structure includes a substrate and an adhesive layer arranged on two opposite surfaces of the substrate, and the substrate is compressible.

3. The heat dissipation structure according to claim 1, characterized in that: The colloid structure is a double-sided foam adhesive.

4. The heat dissipation structure according to claim 1, characterized in that: The colloid structure surrounds the plurality of positioning holes and the plurality of fixing holes.

5. The heat dissipation structure according to claim 1, characterized in that: The opening is closed by the heat conductor and the colloid structure.

6. The heat dissipation structure according to claim 1, characterized in that: The main body of the heat conductor includes an outer portion and a supporting portion connected to the outer portion and protruding relative to the outer portion, and a plurality of fixing holes are located on the outer portion.

7. The heat dissipation structure according to claim 6, characterized in that: The first surface on the abutting portion abuts against the electronic component, the first surface on the peripheral portion abuts against the base, and the colloid structure is arranged between the base and the peripheral portion of the heat conductor.

8. The heat dissipation structure according to claim 1, characterized in that: The invention further comprises: a heat dissipation element, which is arranged on the base and adjacent to the heat pipe, wherein the second portion of the heat pipe abuts against the heat dissipation element.

9. The heat dissipation structure according to claim 8, characterized in that: The base includes a waterproof area and a non-waterproof area. The substrate and the electronic element are arranged in the waterproof area, and the heat dissipation element is arranged in the non-waterproof area.

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