Heat exchange assembly, heat dissipation structure and motor controller

Abstract

The application discloses a heat exchange assembly, a heat dissipation structure and a motor controller. The heat exchange assembly comprises at least two layers of stacked heat dissipation fins, the heat dissipation fins are provided with a plurality of spaced-apart through holes, one side surface of one layer of heat dissipation fins is provided with a liquid inlet of cooling liquid, and the other side surface of the other layer of heat dissipation fins adjacent to the one layer of heat dissipation fins is provided with a liquid outlet of cooling liquid; and the normal projection of two through holes located at the opposite positions of the two layers of heat dissipation fins on the plane of the heat dissipation fins is cross-shaped, so as to form a flow channel for the circulation of the cooling liquid from the liquid inlet to the liquid outlet. When the cooling liquid is introduced into the heat exchange assembly, the cooling liquid can flow horizontally and vertically on the two layers of heat dissipation fins at the same time, the flow direction and flow range of the cooling liquid are increased, the turbulent flow effect of the cooling liquid is enhanced, and the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor heat dissipation, in particular to a heat exchange assembly, a heat dissipation structure and a motor controller. BACKGROUND

[0002] At present, the cold plate of the chip module of the electric vehicle controller, such as the IGBT (Insulated Gate Bipolar Transisto) module, has various structural forms, such as a flat plate, a hobbing, a forged Pinfin, etc. However, the above-mentioned several cold plate structures have a large gap between the fins, the fins are relatively independent between the fins, the heat cannot be transferred between different fins, the heat dissipation amount of different positions is greatly different, and when the cooling liquid is passed in, the flow of the cooling liquid is in the same plane, the convection heat transfer effect is general, and the heat dissipation effect is poor. SUMMARY

[0003] The main purpose of the present application is to provide a heat exchange assembly, which aims to enhance the convection heat transfer effect of the cooling liquid in the heat exchange assembly, so as to improve the heat exchange efficiency.

[0004] To achieve the above-mentioned purpose, the heat exchange assembly provided by the present application comprises at least two layers of stacked heat dissipation fins, a plurality of spaced-apart through holes are arranged on the heat dissipation fins, one side of a layer of heat dissipation fins is formed with a liquid inlet of cooling liquid, and the other side of the adjacent other layer of heat dissipation fins is formed with a liquid outlet of cooling liquid.

[0005] Among them, the orthographic projection of the two through holes located at the opposite positions of the adjacent two layers of heat dissipation fins on the plane where the heat dissipation fins are located is cross-shaped, so as to form a flow channel for the cooling liquid to flow from the liquid inlet to the liquid outlet.

[0006] In an embodiment of the present application, the projections of the two through holes at the opposite positions of the adjacent two layers of heat dissipation fins on the substrate are connected head to tail.

[0007] In an embodiment of the present application, the two layers of heat dissipation fins are arranged in close contact.

[0008] In an embodiment of the present application, the through holes are strip-shaped holes; the direction from the side where the liquid inlet is arranged to the side where the liquid outlet is arranged of the heat exchange assembly is defined as the first direction, and the extension direction of the through holes is inclined relative to the first direction.

[0009] In an embodiment of the present application, the through holes are strip-shaped holes; the direction from the side where the liquid inlet is arranged to the side where the liquid outlet is arranged of the heat exchange assembly is defined as the first direction, wherein the extension direction of the through holes on one heat dissipation fin is parallel to the first direction, and the extension direction of the through holes on the adjacent other heat dissipation fin is perpendicular to the first direction.

[0010] In one embodiment of the present application, the adjacent two layers of the heat dissipation fins are identical in shape and are arranged in a staggered manner; the staggered angle of the adjacent two layers of the heat dissipation fins is 180°.

[0011] In one embodiment of the present application, the heat exchange assembly comprises a plurality of layers of the heat dissipation fins arranged in a stacked manner, wherein the adjacent two layers of the heat dissipation fins are defined as a first heat dissipation fin and a second heat dissipation fin, respectively, and the through holes on the first heat dissipation fin are arranged in a crossing manner with the through holes at the opposite positions on the second heat dissipation fin in the orthogonal projection of the plane on which the second heat dissipation fin is located.

[0012] The heat dissipation fin adjacent to the side of the first heat dissipation fin away from the second heat dissipation fin is defined as a third heat dissipation fin, and the heat dissipation fin adjacent to the side of the second heat dissipation fin away from the first heat dissipation fin is defined as a fourth heat dissipation fin.

[0013] The through holes on the third heat dissipation fin coincide with the through holes at the opposite positions on the first heat dissipation fin in the orthogonal projection of the plane on which the first heat dissipation fin is located, and / or the through holes on the fourth heat dissipation fin coincide with the through holes at the opposite positions on the second heat dissipation fin in the orthogonal projection of the plane on which the second heat dissipation fin is located.

[0014] To achieve the above-mentioned purpose, the present application further provides a heat dissipation structure comprising a substrate and the above-mentioned heat exchange assembly, wherein the heat exchange assembly is arranged on the substrate.

[0015] In one embodiment of the present application, the substrate comprises a plurality of layers of substrate layers arranged in a stacked manner, and a plurality of heat dissipation holes are formed on at least part of the substrate layers; at least one of the heat dissipation holes is in communication with at least one of the through holes.

[0016] In one embodiment of the present application, the heat dissipation holes of the adjacent two layers of the substrate layers are arranged in a staggered manner and at least partially coincide to form a flow channel.

[0017] In one embodiment of the present application, the surface of the substrate is provided with a recess, and the heat exchange assembly is mounted in the recess.

[0018] To achieve the above-mentioned purpose, the present application further provides an electric motor controller comprising a power module and the above-mentioned heat dissipation structure; the heat dissipation structure comprises a substrate and the above-mentioned heat exchange assembly, wherein the heat exchange assembly is arranged on the substrate, and the side of the substrate away from the heat exchange assembly is fixedly connected with the power module.

[0019] In the technical scheme, the heat exchange assembly comprises at least two layers of stacked heat dissipation fins, the heat exchange area is increased by forming a plurality of spaced through holes on the heat dissipation fins, and the orthographic projection of two through holes located at opposite positions of two adjacent layers of heat dissipation fins on the heat dissipation fins is arranged in a cross structure, so that the two through holes on the two adjacent layers of heat dissipation fins can be communicated, and a flow channel for the cooling liquid from the liquid inlet to the liquid outlet is formed, thereby enabling the cooling liquid to flow horizontally and vertically on the two adjacent layers of heat dissipation fins when the cooling liquid is injected into the heat exchange assembly, increasing the flow direction and flow range of the cooling liquid, and improving the heat exchange efficiency and heat dissipation efficiency of the heat exchange assembly. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor based on the drawings shown.

[0021] Figure 1 It is an embodiment of the structure of the motor controller of the present application.

[0022] Figure 2 It is an exploded structure diagram of an embodiment of the motor controller of the present application.

[0023] Figure 3 It is a structure diagram of the cooling liquid flow channel in an embodiment of the heat dissipation structure of the present application.

[0024] Figure 4 It is another structure diagram of the cooling liquid flow channel in an embodiment of the heat dissipation structure of the present application.

[0025] Figure 5 It is a structure diagram of an embodiment of the heat dissipation structure of the present application.

[0026] Figure 6 It is an exploded structure diagram of an embodiment of the heat dissipation structure of the present application.

[0027] Figure 7 It is a structure diagram of another embodiment of the motor controller of the present application.

[0028] Figure 8 It is a diagram of the heat exchanger of the heat dissipation structure and the substrate with grooves.

[0029] Explanation of reference numerals:

[0030] Reference Name Reference Name 100 Substrate 210 Heat sink 110 Substrate layer 201 Through hole 111 Heat dissipation hole 210a Liquid inlet 101 Groove 210b Liquid outlet 200 Heat exchange assembly 300 Power module

[0031] The objectives, functional features and advantages of the present application will be further described with reference to the embodiments in combination with the accompanying drawings. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the protection scope of the present application.

[0033] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture (as shown in the drawings). If the certain posture changes, the directional indications also change accordingly.

[0034] In addition, if the embodiments of the present application involve descriptions of “first”, “second”, etc., the descriptions of “first”, “second”, etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by “first”, “second” can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person of ordinary skill in the art can realize the combination. When the combination of technical solutions contradicts each other or cannot be realized, it should be considered that the combination of technical solutions does not exist and is not within the protection scope of the present application.

[0035] The present application provides a heat exchange assembly, aiming at improving the structure of the heat exchange assembly using cooling liquid for heat exchange, enhancing the turbulent flow effect of the cooling liquid when flowing in the heat exchange assembly, and further improving the overall heat exchange effect and heat dissipation effect of the heat exchange assembly. It can be understood that the heat exchange assembly provided by the present application can be applied to any occasion where cooling liquid flow is needed for heat exchange and heat dissipation, and is not limited to a specific heat dissipation occasion or a specific shape structure of the heat exchange assembly.

[0036] In the embodiments of the present application, as shown in Figures 1 to 4 The heat exchange assembly 200 includes at least two layers of stacked heat dissipation fins 210, a plurality of spaced-apart through holes 201 are formed on the heat dissipation fins 210, one side surface of one layer of heat dissipation fins 210 is formed with a cooling liquid inlet 210a, and the other side surface of the adjacent other layer of heat dissipation fins 210 is formed with a cooling liquid outlet 210b;

[0037] The projections of the two through holes 201 located at opposite positions of the adjacent two layers of the fins 210 on the fins 210 are cross arranged to form a flow channel for the cooling liquid to flow from the liquid inlet 210a to the liquid outlet 210b.

[0038] In application, the heat exchange assembly 200 can be directly installed on a mounting platform, such as a heat generating device (e.g. a power module), or indirectly installed on the heat generating device through the substrate 100 to contact the heat generating device for heat exchange, thereby achieving the heat exchange and heat dissipation functions of the heat generating device. The heat exchange assembly 200 comprises at least two layers of stacked fins 210, each of which is formed with a plurality of spaced through holes 201, which increase the heat exchange area and the vertical heat conduction path, thereby accelerating the heat dissipation efficiency of the heat generating device. On this basis, the projections of the two through holes 201 located at opposite positions of the adjacent two layers of the fins 210 on the fins 210 are cross arranged, so that the two through holes 201 at opposite positions of the adjacent two layers of the fins 210 are in communication with each other, allowing the heat to be transferred from the through hole 201 of one fin 210 to the through hole 201 of another fin 210 in the stacking direction of the two layers of the fins 210, thereby further increasing the heat transfer path. It can be understood that the through holes 201 of the adjacent two layers of the fins 210 are cross arranged, and when the cooling liquid is injected into the heat exchange assembly 200, the communicating through holes 201 form a flow channel for the cooling liquid to flow from the liquid inlet 210a to the liquid outlet 210b, allowing the cooling liquid to flow vertically from one fin 210 to another fin 210 and also to flow horizontally on the same fin 210, thereby increasing the flow direction of the cooling liquid and improving the heat exchange efficiency.

[0039] It can be understood that although the heat dissipation column in the prior art can conduct the temperature of the heat generating device to the heat exchange assembly, the temperature is not uniform along the length direction of the heat dissipation column during heat conduction, there are gaps between different heat dissipation columns, and the temperature of the body and the outer periphery of the heat dissipation column is also not uniform, resulting in uneven heat exchange when the cooling liquid flows through the heat dissipation column. By improving the heat dissipation column to a fin and using surface contact for heat conduction, the heat dissipation performance of the heat exchange assembly is greatly improved, and the heat can be quickly spread on the fin. On the other hand, since the fins are arranged in a stacked manner, the distances of different fins from the heat source are different, and by cross arranging the through holes on the adjacent two layers of the fins, the cooling liquid can be exchanged between different fins and also flow horizontally on the same fin. This three-dimensional flow path of the cooling liquid makes the heat exchange assembly have better temperature uniformity.

[0040] In addition, a plurality of through holes 201 are formed on the fins 210, and the arrangement and shape of the plurality of through holes 201 can be determined according to actual conditions. For example, the plurality of through holes 201 can be regularly arranged in an array, or irregularly arranged in a scattered manner. The cross-sectional shape of the through holes 201 can be circular, triangular, square, or other irregular shapes.

[0041] Two through holes 201 at opposite positions on adjacent two layers of fins 210 are cross arranged. It can be understood that one through hole 201 on one fin 210 is cross communicated with one through hole 201 on another fin 210, that is, the through holes 201 on the adjacent two layers of fins 210 are one-to-one corresponding. In this way, the flow guiding effect on the cooling liquid is stronger, the flow resistance of the cooling liquid is reduced, and the energy loss is reduced. It can also be understood that one through hole 201 on one fin 210 is cross communicated with two or more through holes 201 on another fin 210. At this time, the through holes 201 on the adjacent two layers of fins 210 are in a one-to-many corresponding manner. In this way, the flow path of the cooling liquid is increased, the flow of the cooling liquid is disturbed, the contact time between the cooling liquid and the fins 210 is prolonged, and the heat exchange efficiency is improved.

[0042] In actual application, the way of feeding the cooling liquid into the heat exchange assembly 200 can be determined according to actual conditions. For example, the cooling liquid can be fed into the heat exchange assembly 200 from one side and discharged from the other side, or fed into and discharged from the same side of the heat exchange assembly 200, or the heat exchange assembly 200 can be directly placed in a liquid tank with flowing cooling liquid. When the cooling liquid flows from one side to the other side of the heat exchange assembly 200, the fins 210 are provided with through holes 201 penetrating the side surface of the fins 210 towards the liquid inlet and outlet sides, so that the cooling liquid enters from the through holes 201 (equivalent to the liquid inlet 210a) on one side and flows out from the through holes 201 (equivalent to the liquid outlet 210b) on the other side. At this time, the through holes 201 inside the heat exchange assembly 200 form a flow channel for the cooling liquid, so that the cooling liquid can flow horizontally and vertically inside the heat exchange assembly 200, ensuring the flow area and improving the heat dissipation effect. When the cooling liquid enters from one side of the heat exchange assembly 200 and flows out from the same side, at least two through holes 201 penetrating the side surface of the fins 210 are arranged towards the liquid inlet side, to respectively allow the cooling liquid to enter and flow out. The through holes 201 inside the heat exchange assembly 200 form a flow channel for the cooling liquid. When the heat exchange assembly 200 is directly placed in a cooling liquid tank, the fins 210 are immersed in the cooling liquid, and the through holes 201 can be arranged on the side surface or top surface of the fins 210, as long as the through holes 201 inside the heat exchange assembly 200 can form a flow channel for the cooling liquid.

[0043] It should be noted that the stacking mode between the two adjacent layers of the heat dissipation fins 210 can be adhered and stacked, or can be spaced and stacked. When adhered and stacked, the through hole 201 on one heat dissipation fin 210 and the plate surface of the other heat dissipation fin 210 form a cooling liquid flow channel extending along the plate surface of the heat dissipation fin 210, that is, in this mode, the cooling liquid flows in the through hole 201, and the through hole 201 can play a flow guiding role; when spaced and stacked, the intermediate flow channel for the cooling liquid to flow is formed between the two adjacent layers of the heat dissipation fins 210, and at this time, the through holes 201 on the two layers of heat dissipation fins 210 can be in communication with the intermediate flow channel, and the through holes 201 are used to guide the cooling liquid from one intermediate flow channel to another intermediate flow channel, and at the same time, the original flow direction of the cooling liquid can be changed, thereby playing a flow disturbance role on the cooling liquid.

[0044] In actual application, in order to ensure the heat dissipation effect, the heat dissipation fin 210 can be made of a metal material with high thermal conductivity, such as copper or aluminum. The through hole 201 on the heat dissipation fin 210 can be formed by stamping process.

[0045] In the technical scheme of the present application, the heat exchange assembly 200 includes at least two layers of heat dissipation fins 210 stacked, a plurality of spaced through holes 201 are formed on the heat dissipation fins 210 to increase the heat exchange area, and the orthographic projection of the two through holes 201 at the opposite positions of the two adjacent layers of heat dissipation fins 210 on the heat dissipation fin 210 is set as a cross structure, so that the two through holes 201 on the two adjacent layers of heat dissipation fins 210 are cross-connected, and a flow channel for the cooling liquid to flow from the liquid inlet 210a to the liquid outlet 210b is formed, so that when the cooling liquid is introduced into the heat exchange assembly 200, the cooling liquid can flow horizontally and vertically on the two adjacent layers of heat dissipation fins 210 at the same time, the flow direction and flow range of the cooling liquid are increased, the turbulent flow effect of the cooling liquid is enhanced, and the heat exchange efficiency and the heat dissipation efficiency are improved.

[0046] In order to further enhance the heat exchange effect of the cooling liquid, with reference to Figures 1 to 4 In an embodiment of the present application, the orthographic projection of the two through holes 201 at the opposite positions of the two adjacent layers of heat dissipation fins 210 on the plane of one heat dissipation fin 210 is connected end to end.

[0047] In this embodiment, by connecting the two through holes 201 at the opposite positions of the two adjacent layers of heat dissipation fins 210 end to end, the cooling liquid flows horizontally in the through hole 201 on one heat dissipation fin 210 for a certain path, and then flows vertically into the through hole 201 of the other heat dissipation fin 210, thereby prolonging the flow path of the cooling liquid, and further prolonging the residence time of the cooling liquid in the heat exchange assembly 200, so as to achieve the purpose of sufficient heat exchange.

[0048] Based on the fact that each layer of the heat dissipation sheet 210 is provided with a plurality of through holes 201 arranged at intervals, the plurality of through holes 201 on the adjacent two layers of the heat dissipation sheet 210 are connected in sequence, that is, the tail end of the through hole 201 on the upper layer of the heat dissipation sheet 210 is in communication with the head end of the corresponding through hole 201 on the lower layer of the heat dissipation sheet 210, and the tail end of the through hole 201 on the lower layer of the heat dissipation sheet 210 is in communication with the head end of another through hole 201 on the upper layer of the heat dissipation sheet 210, or the tail end of the through hole 201 on the lower layer of the heat dissipation sheet 210 is in communication with the head end of the through hole 201 on the next lower layer of the heat dissipation sheet 210, and so on, so that the cooling liquid can flow in the heat exchange assembly 200 in the horizontal and vertical directions, and the convective heat exchange effect of the cooling liquid is improved.

[0049] Alternatively, when the plurality of through holes 201 on the adjacent two layers of the heat dissipation sheet 210 are orthogonally projected on the plane of the heat dissipation sheet 210, the plurality of through holes 201 can form the flow channel of the cooling liquid connected in sequence, such as zigzag, time sequence chart, wave shape or straight line. When the plurality of through holes 201 on the adjacent two layers of the heat dissipation sheet 210 are projected towards the plane perpendicular to the heat dissipation sheet 210, the plurality of through holes 201 can also form the flow channel of the cooling liquid connected in sequence.

[0050] In an embodiment of the present application, referring to Figures 1 to 4 , the adjacent two layers of the heat dissipation sheet 210 are arranged in abutment.

[0051] In the embodiment, the adjacent two layers of the heat dissipation sheet 210 are arranged in abutment, so that the through hole 201 on one heat dissipation sheet 210 and the plate surface of another heat dissipation sheet 210 form the flow channel for the cooling liquid, and the cooling liquid in the flow channel can absorb the heat on the heat dissipation sheet 210 through the plate surface and the hole wall of the through hole 201. At least one through hole 201 is arranged on the side surface of one heat dissipation sheet 210 to form the liquid inlet 210a, and at least one other through hole 201 is arranged on the side surface of another heat dissipation sheet 210 to form the liquid outlet 210b, and the liquid inlet 210a and the liquid outlet 210b are arranged on the opposite sides of the heat exchange assembly 200, respectively. It can be understood that the cooling liquid enters the inside of the heat exchange assembly 200 from one side of one heat dissipation sheet 210 and flows out of the heat exchange assembly 200 from the other side of another heat dissipation sheet 210, so that the cooling liquid flows in the plurality of heat dissipation sheets 210 and then flows out from the other side, thereby ensuring the length and time of the flow of the cooling liquid in the heat exchange assembly 200.

[0052] On the basis of the foregoing embodiment, the plurality of through holes 201 in the adjacent two layers of the fins 210 are connected end to end, so that when the cooling liquid is introduced from the liquid inlet 210a of a fin 210, the cooling liquid first flows transversely in the through holes 201 on the side of the fin 210, then longitudinally enters the through holes 201 of the adjacent fin 210, and then flows transversely to the tail end of the through holes 201, and then longitudinally flows into the through holes 201 on the fin 210 of the previous layer or the fin 210 of the next layer, and so on, until the through holes 201 in the plurality of layers of the fins 210 are filled, and the cooling liquid flows out from the liquid outlet 210b of another fin 210, thereby ensuring that the cooling liquid fully contacts the plurality of layers of the fins 210 and improving the heat exchange effect.

[0053] In actual application, the heat exchange assembly 200 includes a plurality of layers of the fins 210 stacked, in order to ensure the residence time and the heat exchange area of the cooling liquid in the heat exchange assembly 200, the liquid inlet 210a can be arranged on one side of the uppermost layer of the fins 210, and the liquid outlet 210b can be arranged on the other side of the lowermost layer of the fins 210, so as to achieve the purpose of prolonging the path of the cooling liquid. Of course, in other embodiments, the liquid inlet 210a and the liquid outlet 210b can be arranged on the adjacent two layers of the fins 210 respectively, that is, the liquid inlet 210a and the liquid outlet 210b are arranged alternately, and in this embodiment, the heat exchange assembly 200 has a plurality of liquid inlets 210a simultaneously introducing the cooling liquid and a plurality of liquid outlets 210b simultaneously flowing out, thereby increasing the flow of the cooling liquid and reducing the flow resistance of the cooling liquid.

[0054] In an embodiment of the present application, referring to Figures 1 to 3 , the through hole 201 is a strip-shaped hole; a direction from the side where the liquid inlet 210a is arranged to the side where the liquid outlet 210b is arranged of the heat exchange assembly 200 is defined as a first direction (see Figure 3 ); and an extension direction (see Figure 3 ) of the through hole 201 is arranged obliquely relative to the first direction, wherein the extension direction of the through hole 201 refers to a length direction of the through hole 201 in the plane of the fin 210 (see Figure 3 ). Specifically, the extension direction of the obliquely arranged through hole 201 forms an angle with the first direction, which is defined as an oblique angle A, and the oblique angle A affects the change of the flow direction of the cooling liquid in the adjacent two through holes 201. The oblique angle A cannot be too large or too small. If the oblique angle A is too large, the reversing range of the cooling liquid is large, which is easy to cause large resistance; if the oblique angle A is too small, the reversing range of the cooling liquid is small, and the turbulence effect is small. Optionally, the oblique angle of the through hole 201 relative to the first direction can be selected from 15° to 75°, such as 15°, 30°, 45°, 60°, 75°, and the like.

[0055] It can be understood that the liquid inlet 210a and the liquid outlet 210b are located on two sides of the heat exchange assembly 200 respectively, a direction from the liquid inlet 210a to the liquid outlet 210b is defined as a first direction, and the extension direction of the through hole 201 is arranged obliquely to the first direction, so that the flow direction of the cooling liquid in the through hole 201 is arranged obliquely to the first direction, thereby increasing the flow length of the cooling liquid.

[0056] Based on the fact that the plurality of through holes 201 on the adjacent two layers of heat dissipation fins 210 are connected in sequence and the corresponding two through holes 201 are arranged in a cross manner, the flow directions of the cooling liquid in the two through holes 201 connected to each other are different, the flow path of the cooling liquid is in a zigzag shape in the direction from the liquid inlet 210a to the liquid outlet 210b, and the flow direction of the cooling liquid is changed multiple times to achieve flow disturbance and enhance the effect of turbulent flow of the cooling liquid.

[0057] In order to make the heat exchange effect of the cooling liquid in the heat exchange assembly 200 more uniform, with reference to Figures 1 to 3 In an embodiment of the present application, the plurality of through holes 201 on the same heat dissipation fin 210 are arranged in an array.

[0058] In the embodiment, the plurality of through holes 201 arranged on the heat dissipation fin 210 in an array ensures the uniformity of the flow distribution of the cooling liquid in the heat exchange assembly 200, thereby preventing uneven heat exchange inside the heat exchange assembly 200.

[0059] Alternatively, the arrayed distribution of the plurality of through holes 201 can be a circular array or a rectangular array.

[0060] In an embodiment of the present application, with reference to Figures 1 to 3 , the adjacent two layers of heat dissipation fins 210 are the same in shape and are arranged in a staggered manner; the staggered angle of the adjacent two layers of heat dissipation fins 210 is 180°.

[0061] It can be understood that the plurality of layers of heat dissipation fins 210 in the heat exchange assembly 200 are the same in shape, a plurality of through holes 201 arranged at intervals are formed on the heat dissipation fin 210, and the adjacent two layers of heat dissipation fins 210 are arranged in a staggered manner to ensure that the two through holes 201 at the corresponding positions are arranged in a cross manner to partially overlap and form a cooling liquid flow channel connected to each other.

[0062] In the embodiment, the plurality of layers of heat dissipation fins 210 adopt the same structure, which reduces the manufacturing difficulty and cost, and only one set of mold needs to be designed for universal use, and it is also convenient to replace.

[0063] In actual application, the fixing manner of the plurality of layers of heat dissipation fins 210 can be a fixed connection manner such as welding or fusion.

[0064] In other embodiments of the present application, with reference to Figure 4The through holes 201 are strip-shaped holes; a first direction is defined as a direction from a side where the liquid inlet 210a is arranged to a side where the liquid outlet 210b is arranged, wherein the extension direction of the through holes 201 on one fin 210 is parallel to the first direction, and the extension direction of the through holes 201 on the adjacent other fin 210 is perpendicular to the first direction.

[0065] In the embodiment, the structures of the two adjacent fins 210 are different, and the arrangement modes of the plurality of through holes 201 on the two fins 210 are also different. The plurality of through holes 201 on one fin 210 are arranged in parallel and spaced apart along the first direction, and the plurality of through holes 201 on the other fin 210 are arranged along a direction perpendicular to the first direction, and the plurality of through holes 201 on the two fins 210 are connected end to end, the extension directions of the two through holes 201 connected end to end are perpendicular, and the projection shape of the cooling liquid flow channel on the substrate 100 is a time sequence pattern shape, so that the effect of increasing the convective heat transfer of the cooling liquid is achieved.

[0066] In other embodiments of the present application, the heat exchange assembly 200 includes a plurality of fins 210 arranged in a stacked manner, and two adjacent fins 210 are defined as a first fin and a second fin, respectively, and the through holes 201 on the first fin are arranged in a cross manner with the through holes 201 at the corresponding positions on the second fin in the orthogonal projection on the plane of the second fin.

[0067] A third fin adjacent to a side of the first fin away from the second fin is defined, and a fourth fin adjacent to a side of the second fin away from the first fin is defined.

[0068] The orthogonal projection of the through holes 201 on the third fin on the plane of the first fin coincides with the through holes 201 at the corresponding positions on the first fin, and / or the orthogonal projection of the through holes 201 on the fourth fin on the plane of the second fin coincides with the through holes 201 at the corresponding positions on the second fin.

[0069] In the embodiment, the heat exchange assembly 200 includes a plurality of fins 210 arranged in a stacked manner, wherein the through holes 201 at the corresponding positions on at least two adjacent fins 210 (the first fin and the second fin) are arranged in a cross manner, and the two through holes 201 at the corresponding positions of the first fin and the second fin are connected to each other, so that heat can be transmitted from the through holes 201 on the first fin to the through holes 201 on the second fin, further increasing the heat transmission path.

[0070] It can be understood that, on this basis, the structure of the third heat dissipation fin adjacent to the other side of the first heat dissipation fin can be the same as that of the first heat dissipation fin, that is, the through hole 201 on the third heat dissipation fin coincides with the orthographic projection of the through hole 201 on the first heat dissipation fin, at this time, the longitudinal flow efficiency of the cooling liquid is increased; of course, the structure of the third heat dissipation fin can also be the same as that of the second heat dissipation fin, at this time, the through hole 201 of the third heat dissipation fin is arranged in cross with the through hole 201 of the first heat dissipation fin, ensuring the longitudinal and transverse flow of the cooling liquid.

[0071] Similarly, the structure of the fourth heat dissipation fin adjacent to the other side of the second heat dissipation fin can be the same as that of the second heat dissipation fin, that is, the through hole 201 on the fourth heat dissipation fin coincides with the orthographic projection of the through hole 201 on the second heat dissipation fin, at this time, the longitudinal flow efficiency of the cooling liquid is increased; of course, the structure of the fourth heat dissipation fin can also be the same as that of the first heat dissipation fin, at this time, the through hole 201 of the fourth heat dissipation fin is arranged in cross with the through hole 201 of the second heat dissipation fin, ensuring the longitudinal and transverse flow of the cooling liquid.

[0072] The application also provides a heat dissipation structure, referring to Figure 1 , Figure 2 and Figure 8 , the heat dissipation structure comprises a substrate 100 and a heat exchange assembly 200, the specific structure of the heat exchange assembly 200 refers to the above-mentioned embodiments, since the heat dissipation structure adopts all the technical solutions of the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here. Among them, the heat exchange assembly 200 is arranged on the substrate 100.

[0073] The substrate 100 plays a role in providing a mounting platform for the heat exchange assembly 200, so as to mount the heat exchange assembly 200 on a heat generating device (such as a power module), and transfer the temperature of the heat generating device to the substrate 100 and the heat exchange assembly 200, and contact heat exchange with the heat generating device, so as to realize the function of heat dissipation of the heat generating device. The heat exchange assembly 200 comprises at least two layers of heat dissipation fins 210 arranged in stack, a plurality of through holes 201 arranged at intervals are formed on the heat dissipation fins 210, so as to increase the heat exchange area; meanwhile, the orthographic projection of the two through holes 201 located at the opposite positions of the two adjacent layers of heat dissipation fins 210 on the substrate 100 is arranged in cross structure, so that the two through holes 201 on the two adjacent layers of heat dissipation fins 210 are cross connected, forming a flow channel for the cooling liquid to flow from the liquid inlet 210a to the liquid outlet 210b, so that when the cooling liquid is introduced into the heat exchange assembly 200, the cooling liquid can realize transverse and longitudinal flow on the two adjacent layers of heat dissipation fins 210 at the same time, the flow direction and flow range of the cooling liquid are increased, the turbulent flow effect of the cooling liquid is enhanced, and the heat exchange efficiency of the heat exchange assembly 200 is improved, so as to improve the heat dissipation efficiency of the heat dissipation structure.

[0074] In actual application, the substrate 100 can be made of copper or aluminum with high thermal conductivity to accelerate the heat conduction from the heat generating device to the heat exchange assembly 200.

[0075] In an embodiment, the surface of the substrate 100 is provided with a groove 101, and the heat exchange assembly 200 is installed in the groove 101. In this embodiment, the groove 101 plays a role of limiting and fixing the heat exchange assembly 200, simplifies the installation difficulty of the heat exchange assembly 200 and the substrate 100, and improves the assembly precision of the two.

[0076] In order to further improve the heat dissipation effect of the heat dissipation structure, referring to Figures 5 to 8 In an embodiment of the present application, the substrate 100 includes a plurality of substrate layers 110 stacked together, and a plurality of heat dissipation holes 111 are formed in at least some of the substrate layers 110.

[0077] It can be understood that when the substrate layer 110 in contact with the heat generating device is provided with the heat dissipation hole 111, the remaining substrate layers 110 also have the heat dissipation hole 111 to ensure that the cooling liquid flows through the heat dissipation hole 111; when the substrate layer 110 in contact with the heat generating device does not have the heat dissipation hole 111, at least some of the remaining substrate layers 110 have the heat dissipation hole 111, and the heat dissipation hole 111 provided in the remaining substrate layers 110 has the cooling liquid flowing through it.

[0078] The stacking direction of the plurality of substrate layers 110 is consistent with the stacking direction of the plurality of heat dissipation fins 210.

[0079] In this embodiment, the substrate 100 is stacked by a plurality of substrate layers 110, and a plurality of heat dissipation holes 111 are formed in the substrate layers 110 to increase the heat exchange area and improve the heat exchange efficiency. It can be understood that the adjacent two substrate layers 110 can be arranged in close contact or spaced apart and fixedly connected by welding.

[0080] The stacking direction of the plurality of substrate layers 110 is consistent with the stacking direction of the plurality of heat dissipation fins 210, so that the substrate 100 has sufficient mounting area to mount the heat dissipation fins 210, and the stability of the overall structure is ensured.

[0081] On the basis of the foregoing embodiments, when the cooling liquid is introduced, the cooling liquid will also flow into the heat dissipation hole 111 of the substrate layer 110 when flowing through the through hole 201 in the heat dissipation fin 210, so as to simultaneously absorb the heat of the substrate layer 110 and the heat dissipation fin 210, and further accelerate the heat dissipation efficiency.

[0082] In order to further improve the heat dissipation efficiency, referring to Figures 5 to 8In an embodiment of the present application, the heat dissipation holes 111 of the substrate layers 110 of two adjacent layers are staggered and at least partially overlapped to form flow channels; the flow channels are in communication with the flow channels of the cooling liquid in the heat exchange assembly 200, so that the cooling liquid can flow into the heat dissipation holes 111 of the substrate layers 110 to be cooled, improving the heat exchange effect.

[0083] The at least one heat dissipation hole 111 is in communication with the at least one through hole 201.

[0084] It can be understood that the two heat dissipation holes 111 of the relative positions of the substrate layers 110 of two adjacent layers are staggered and at least partially overlapped, so that when the cooling liquid is passed in, the cooling liquid can not only flow horizontally along the plane of the substrate layer 110, but also flow vertically along the thickness direction of the substrate layer 110, increasing the flow direction of the cooling liquid, enhancing the turbulent flow effect of the cooling liquid, and improving the heat exchange efficiency of the cooling liquid in the substrate 100.

[0085] As can be seen from the foregoing embodiments, the heat exchange assembly 200 has multiple heat dissipation fins 210 that form cooling liquid flow channels that can flow horizontally and vertically at the same time, and the substrate 100 has multiple substrate layers 110 that form cooling liquid flow channels that can flow horizontally and vertically at the same time, so that the heat exchange effect of the cooling liquid is enhanced by both the heat exchange assembly 200 and the substrate 100, further improving the heat exchange efficiency of the heat dissipation structure.

[0086] In an embodiment, the at least one heat dissipation hole 111 on the substrate 100 is in communication with the at least one through hole 201 of the heat exchange assembly 200, so that the cooling liquid flow channel inside the substrate 100 is in communication with the cooling liquid flow channel inside the heat exchange assembly 200, enhancing the cooling liquid convection effect between the substrate 100 and the heat exchange assembly 200, making the heat exchange in the substrate 100 and the heat exchange assembly 200 more uniform, and improving the reliability of the overall heat dissipation structure.

[0087] The present application also proposes a motor controller, referring to Figure 1 , Figure 2 and Figure 7 , the motor controller includes a power module 300 and a heat dissipation structure, the specific structure of the heat dissipation structure is referred to the above embodiments, since the present power module adopts all the technical solutions of the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here. Among them, the side of the substrate 100 away from the heat exchange assembly 200 is fixedly connected with the power module 300.

[0088] The heat dissipation structure is fixedly connected with the power module 300 to form a motor controller with heat dissipation function, and improve the performance of the motor controller.

[0089] In an embodiment, when the substrate 100 is a plate structure, the heat exchange assembly 200 includes at least two layers of stacked heat dissipation fins 210, a plurality of spaced-apart through holes 201 are formed on the heat dissipation fins 210, and the orthographic projection of the two through holes 201 located at the opposite positions of the adjacent two layers of heat dissipation fins 210 on the substrate 100 is cross-shaped to form a flow channel for the cooling liquid to flow through. When the cooling liquid is introduced into the heat exchange assembly 200, the cooling liquid can flow horizontally and vertically on the adjacent two layers of heat dissipation fins 210 at the same time, so as to realize the horizontal and vertical flow in the heat exchange assembly 200, enhance the turbulent flow effect of the cooling liquid, and improve the heat dissipation efficiency of the power module 300.

[0090] In an embodiment, the substrate 100 is provided as a plurality of stacked substrate layers 110, and a plurality of heat dissipation holes 111 are arranged on the substrate layers 110. The heat dissipation holes 111 of the adjacent two layers of substrate layers 110 are arranged alternately to form a cooling liquid flow channel in the substrate 100. In combination with the cooling liquid flow channel in the heat exchange assembly 200, the double effect of enhancing the convection heat exchange of the cooling liquid is realized, and the heat dissipation efficiency of the power module 300 is further improved.

[0091] It can be understood that, in actual application, the motor controller with heat dissipation function formed by the power module 300 and the heat dissipation structure can be combined or split according to the type of the motor controller and the module. For example, when the power module 300 is an IGBT (Insulated Gate Bipolar Transisto, Insulated Gate Bipolar Transisto) module, the overall power module with heat dissipation structure can be applied in the motor controller to enhance the performance of the motor controller.

[0092] The above is only the preferred embodiment of the present application, and does not limit the patent range of the present application. Any equivalent structural transformation, direct / indirect application in other related technical fields based on the inventive concept of the present application and the content of the specification and drawings are included in the patent protection range of the present application.

Claims

1. A heat dissipation structure, characterized in that, include: A substrate for contacting a heating element; the surface of the substrate is provided with grooves. as well as A heat exchange assembly is installed in the groove. The heat exchange assembly includes at least two stacked heat sinks. Each heat sink has a plurality of spaced through holes. One side of one heat sink has a coolant inlet, and the other side of the adjacent heat sink has a coolant outlet. The through holes located at opposite positions of two adjacent heat sinks are arranged in a cross configuration on the plane of the heat sink to form a coolant flow channel that allows coolant to flow both laterally and longitudinally from the inlet to the outlet. The substrate is composed of multiple stacked substrate layers, and at least some of the substrate layers have multiple heat dissipation holes; the stacking direction of the multiple substrate layers is consistent with the stacking direction of the heat sink; the heat dissipation holes of adjacent substrate layers are staggered and at least partially overlap to form coolant channels that can flow in both the lateral and longitudinal directions simultaneously; At least one of the heat dissipation holes is connected to at least one of the through holes, so that the coolant flow channel inside the substrate is connected to the coolant flow channel inside the heat exchange component, thereby enhancing the coolant convection effect between the substrate and the heat exchange component. The substrate layer facing away from the heat exchange assembly is used to mount the heating device.

2. The heat dissipation structure as described in claim 1, characterized in that, The two through holes at opposite positions on the heat sinks of two adjacent layers are connected end to end by their orthogonal projections onto the plane of the heat sink.

3. The heat dissipation structure as described in claim 2, characterized in that, The two adjacent heat sinks are attached together.

4. The heat dissipation structure as described in claim 3, characterized in that, The through hole is a strip-shaped hole; the direction of the heat exchange component from the side where the liquid inlet is located toward the side where the liquid outlet is located is defined as the first direction, and the extension direction of the through hole is inclined relative to the first direction.

5. The heat dissipation structure as described in claim 3, characterized in that, The through hole is a strip-shaped hole; the direction of the heat exchange component from the side where the liquid inlet is located to the side where the liquid outlet is located is defined as the first direction, wherein the extension direction of the through hole on one of the heat sinks is parallel to the first direction, and the extension direction of the through hole on the adjacent heat sink is perpendicular to the first direction.

6. The heat dissipation structure as described in any one of claims 1 to 4, characterized in that, The heat sinks of two adjacent layers are identical in shape and are staggered; the stagger angle between two adjacent heat sink layers is 180°.

7. The heat dissipation structure as described in any one of claims 1 to 5, characterized in that, The heat exchange assembly includes multiple stacked heat sinks, wherein two adjacent heat sinks are defined as a first heat sink and a second heat sink, and the orthographic projection of the through hole on the first heat sink onto the plane of the second heat sink is intersected with the through hole at the opposite position on the second heat sink. The heat sink adjacent to the side of the first heat sink that is away from the second heat sink is defined as the third heat sink, and the heat sink adjacent to the side of the second heat sink that is away from the first heat sink is defined as the fourth heat sink. Wherein, the orthographic projection of the through hole on the third heat sink onto the plane of the first heat sink coincides with the through hole at a relative position on the first heat sink, and / or, the orthographic projection of the through hole on the fourth heat sink onto the plane of the second heat sink coincides with the through hole at a relative position on the second heat sink.

8. A motor controller, characterized in that, It includes a power module and a heat dissipation structure as described in any one of claims 1 to 7; the side of the substrate facing away from the heat exchange assembly is fixedly connected to the power module.

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