Electronic device with display panel speaker

Abstract

An electronic device includes: a housing including a first plate facing a first direction, a second plate facing opposite to the first direction, and a side surface member surrounding a portion of a space between the first plate and the second plate; a display panel disposed in the second direction of the first plate and visibly disposed through at least a portion of the first plate; a speaker disposed on a surface of the display panel facing the second direction; a bracket including a first surface facing the first direction and a second surface facing the second direction, and disposed to support the display panel on the first surface; and a bonding layer configured to attach the display panel and the bracket. The bonding layer includes a gap formed by removing a portion of the bonding layer to receive the speaker and formed between the display panel and the bracket.

Description

Technical Field

[0001] Various embodiments of the present disclosure are directed to a coupling structure between a display panel having a speaker attached thereto and a bracket. Background Art

[0002] The electronic device may have one or more speakers disposed in its body, for example, speakers disposed at the upper and lower ends of the body respectively and reproducing sound in stereo may be excellent in performance. Such an electronic device may remove the speaker disposed at the upper end of the body in order to realize a full screen display panel.

[0003] To achieve this, a display panel speaker that directly emits sound by vibrating the display panel may be used. The display panel speaker may replace the speaker provided at the upper end of the main body.

[0004] Since the display panel speaker directly radiates sound to the outside by vibrating the display panel, the display panel speaker does not need a speaker hole structure or a sound tunnel structure to provide a separate sound path for radiating sound like a coil type speaker. Therefore, the display panel speaker is increasingly used in electronic devices on which a display panel is mounted.

[0005] A display panel of this structure has a speaker directly attached to its rear surface, and thus can be applied to an organic light emitting diode (OLED), but is not suitable for a liquid crystal display device that requires a separate light source.

[0006] The above information is provided as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the invention

[0007] Solutions to the problem

[0008] However, the electronic device including the display panel speaker may have a problem in that the performance of the speaker in a specific acoustic frequency band is deteriorated due to a bonding structure between the display panel speaker and a bracket.

[0009] Various embodiments of the present disclosure provide an electronic device capable of enhancing the acoustic performance of a speaker in a low frequency band by implementing an assembly structure of a display panel that reduces the vibration rigidity of the display panel.

[0010] An electronic device according to various embodiments of the present disclosure includes: a housing including a first plate facing a first direction, a second plate facing a direction opposite to the first direction, and a side surface member surrounding at least a portion of a space between the first plate and the second plate; a display panel arranged in the second direction of the first plate and visibly arranged through at least a portion of the first plate; a speaker arranged on a surface of the display panel facing the second direction; a bracket including a first surface facing the first direction and a second surface facing the second direction, and arranged between the first and second plates to support the display panel arranged on the first surface; and a bonding layer having a first thickness and configured to attach the display panel and the bracket, and the bonding layer may include a gap formed by removing a portion of the bonding layer to receive the speaker and formed between the display panel and the bracket.

[0011] An electronic device according to various embodiments includes: a housing including a first plate facing a first direction, a second plate facing a direction opposite to the first direction, and a side surface member surrounding at least a portion of a space between the first plate and the second plate; a display panel disposed in the second direction of the first plate and visibly disposed through at least a portion of the first plate; a speaker disposed on a surface of the display panel facing the second direction; a bracket including a first surface facing the first direction and a second surface facing the second direction, and disposed between the first plate and the second plate to support the display panel disposed on the first surface; and a bonding layer having a first thickness and configured to attach the display panel and the bracket, and the bracket may include a gap formed by removing a portion of the bracket to receive the speaker and formed between the bonding layer and the bracket.

[0012] An electronic device according to various embodiments of the present disclosure includes: a housing, including a first plate facing a first direction, a second plate facing a direction opposite to the first direction, and a side surface member surrounding at least a portion of a space between the first plate and the second plate; a display panel, arranged in the second direction of the first plate and visibly arranged through at least a portion of the first plate; a speaker, arranged on a surface of the display panel facing the second direction; a bracket, including a first surface facing the first direction and a second surface facing the second direction, and arranged between the first plate and the second plate to support the display panel arranged on the first surface; a bonding layer having a first thickness and configured to attach the display panel and the bracket; a first gap, formed by removing a portion of the bonding layer and formed between the display panel and the bracket; and a second gap, formed by removing the first surface of the bracket and formed between the bonding layer and the bracket.

[0013] Before proceeding to the following detailed description, it may be helpful to set forth definitions of certain words and phrases used throughout this patent document: the terms "include" and "comprising" and their derivatives mean inclusion without limitation; the term "or" is inclusive, meaning and / or; the phrases "associated with" and "associated with" and their derivatives may mean including, included, interconnected with, containing, contained within, connected to or connected with, coupled to or coupled with, communicable with, cooperating with, interleaved, juxtaposed, proximate, coupled to or coupled with, having, having the property of, and the like; the term "controller" means any device, system, or portion thereof that controls at least one operation, such device may be implemented as hardware, firmware, or software, or some combination of at least two thereof. It should be noted that the functionality associated with any particular controller may be centralized or distributed, whether locally or remotely.

[0014] In addition, the various functions described below can be implemented or supported by one or more computer programs, each of which is formed by a computer-readable program code and is included in a computer-readable medium. The terms "application" and "program" refer to one or more computer programs, software components, instruction sets, processes, functions, objects, classes, instances, related data or parts thereof suitable for implementation in a suitable computer-readable program code. The phrase "computer-readable program code" includes any type of computer code, including source code, object code and executable code. The phrase "computer-readable medium" includes any type of medium that can be accessed by a computer, such as a read-only memory (ROM), a random access memory (RAM), a hard drive, a compact disc (CD), a digital video disc (DVD) or any other type of memory. "Non-transitory" computer-readable medium does not include wired, wireless, optical or other communication links that transmit temporary electrical signals or other signals. Non-transitory computer-readable media include media in which data can be permanently stored and media in which data can be stored and then rewritten, such as rewritable optical discs or erasable storage devices.

[0015] Definitions for certain words and phrases are provided in this patent document, those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior, as well as future uses of such defined words and phrases. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description in conjunction with the accompanying drawings, in which:

[0017] Figure 1is a perspective view showing a front surface of a mobile electronic device according to an embodiment;

[0018] Figure 2 It is shown Figure 1 A perspective view of a rear surface of an electronic device;

[0019] Figure 3 It is shown Figure 1 An exploded perspective view of the internal configuration of an electronic device;

[0020] Figure 4A is a top view showing a state in which a speaker is provided on a display panel according to various embodiments of the present disclosure;

[0021] Figure 4B is a side view showing a state in which a speaker is provided on a display panel and operates according to various embodiments of the present disclosure;

[0022] Figure 5 is a graph showing the results of measuring the vibration displacement of a display panel according to various embodiments of the present disclosure;

[0023] Fig. 6A is a top view showing an electronic device having a bonding layer attached thereto according to various embodiments of the present disclosure;

[0024] Figure 6B is a cross-sectional view showing a coupling structure between a display panel and a bracket according to various embodiments of the present disclosure;

[0025] Fig. 7A is a top view showing an electronic device having a bonding layer attached thereto according to various other embodiments of the present disclosure;

[0026] Figure 7B is a cross-sectional view showing a coupling structure between a display panel and a bracket according to various other embodiments of the present disclosure;

[0027] Figure 8 is a graph showing a comparison of acoustic performance of a speaker when a portion of a bonding layer is removed and acoustic performance when a portion of a bracket is removed according to various embodiments of the present disclosure;

[0028] Fig. 9 is a cross-sectional view showing a coupling structure between a display panel and a bracket according to various other embodiments of the present disclosure;

[0029] Fig.10 is a top view showing an electronic device with another bonding layer attached thereto according to various embodiments of the present disclosure;

[0030] Fig.11is a cross-sectional view showing a coupling structure between a display panel and a bracket according to various other embodiments of the present disclosure; and

[0031] Fig.12 is a cross-sectional view illustrating a coupling structure between a display panel and a bracket according to various other embodiments of the present disclosure. DETAILED DESCRIPTION

[0032] Discussed below Figures 1 to 12 The various embodiments used to describe the principles of the present disclosure in this patent document are only by way of illustration and should not be interpreted in any way as limiting the scope of the present disclosure. Those skilled in the art will understand that the principles of the present disclosure can be implemented in any appropriately arranged system or device.

[0033] Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the various embodiments are not intended to limit the present disclosure to specific embodiments, but include various modifications, equivalents and / or substitutions of the embodiments of the present disclosure. Regarding the description of the accompanying drawings, the same reference numerals may be used to refer to the same elements.

[0034] The electronic device according to various embodiments of the present disclosure may include, for example, a smart phone, a tablet personal computer (PC), a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), a Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) player, a mobile medical device, a camera or at least one of a wearable device (e.g., smart glasses, a head-mounted device (HMD), electronic clothing, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, a smart mirror, a smart watch, etc.).

[0035] Figure 1 is a perspective view showing a front surface of a mobile electronic device according to an embodiment. Figure 2 It is shown Figure 1 A perspective view of a rear surface of an electronic device.

[0036] Reference Figure 1 and Figure 2According to an embodiment, an electronic device 100 may include a housing 110 including a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 100C surrounding a space between the first surface 110A and the second surface 110B. In another embodiment, the housing may refer to a structure forming a portion of the first surface 110A, the second surface 110B, and the side surface 110C. According to an embodiment, the first surface 110A may be formed by a front surface plate 102 having at least a portion that is substantially transparent (e.g., a glass plate or a polymer plate including various coatings). The second surface 110B may be formed by a substantially opaque rear surface plate 111. The rear surface plate 111 may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of the above materials. The side surface 110C may be formed by a side surface frame structure (or side surface member) 118, which is coupled to the front surface plate 102 and the rear surface plate 111 and includes metal and / or polymer. In a specific embodiment, the rear surface plate 111 and the side surface frame structure 118 may be integrally formed with each other and may include the same material (e.g., a metal material such as aluminum).

[0037] In the illustrated embodiment, the front surface plate 102 may include two first regions 110D that are bent from the first surface 110A toward the rear surface plate 111 and extend seamlessly at both ends of the long edge of the front surface plate 102. Figure 2 ), the rear surface plate 111 may include two second areas 110E that are bent from the second surface 110B toward the front surface plate 102 and extend seamlessly at both ends of the long edges. In a specific embodiment, the front surface plate 102 (or the rear surface plate 111) may include only one of the first areas 110D (or the second areas 110E). In another embodiment, a portion of the first area 110D or the second area 110E may not be included. In an embodiment, when viewed from the side of the electronic device 100, the side surface frame structure 118 may have a first thickness (width) on a side surface that does not include the first area 110D or the second area 110E, and may have a second thickness that is thinner than the first thickness on a side surface that includes the first area 110D or the second area 110E.

[0038] According to one embodiment, the electronic device 100 may include at least one of the display 101, the audio modules 103, 107, 114, the sensor modules 104, 116, 119, the camera modules 105, 112, 113, the key input device 117, the light emitting element 106, and the connector holes 108, 109. In a specific embodiment, the electronic device 100 may omit at least one of the elements (e.g., the key input device 117 or the light emitting element 106), or may further include other elements.

[0039] For example, the display 101 may be exposed through a corresponding portion of the front surface plate 102. In a specific embodiment, at least a portion of the display 101 may be exposed through the front surface plate 102 forming the first surface 110A and the first region 110D of the side surface 110C. In a specific embodiment, a corner of the display 101 may be formed to be substantially the same shape as an adjacent outer portion of the front surface plate 102. In another embodiment, the distance between the outer portion of the display 101 and the outer portion of the front surface plate 102 may be formed to be substantially the same so as to expand the exposed area of ​​the display 101.

[0040] In another embodiment, a recess or opening may be formed on a portion of the screen display area of ​​the display 101, and the electronic device 100 may include at least one of the audio module 114, the sensor module 104, the camera module 105, and the light emitting element 106 aligned with the recess or opening. In another embodiment, the electronic device 100 may include at least one of the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor 116, and the light emitting element 106 on the rear surface of the screen display area of ​​the display 101. In another embodiment, the display 101 may be connected to or disposed adjacent to a touch sensing circuit, a pressure sensor for measuring touch intensity (pressure), and / or a digitizer for detecting a stylus by a magnetic field method. In a specific embodiment, at least a portion of the sensor modules 104, 119 and / or at least a portion of the key input device 117 may be disposed on the first area 110D and / or the second area 110E.

[0041] The audio modules 103, 107, 114 may include a microphone hole 103 and speaker holes 107, 114. The microphone hole 103 may have a microphone disposed therein to obtain external sound, and in a specific embodiment, a plurality of microphones may be disposed to detect the direction of the sound. The speaker holes 107, 114 may include an external speaker hole 107 and a call receiver hole 114. In a specific embodiment, the speaker holes 107, 114 and the microphone hole 103 may be implemented as one hole, or the electronic device 100 may include a speaker without the speaker holes 107, 114.

[0042] The sensor modules 104, 116, 119 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 100. The sensor modules 104, 116, 119 may include, for example, a first sensor module 104 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 110A of the housing 110, and / or a third sensor module 119 (e.g., an HRM sensor) and / or a fourth sensor module 116 (e.g., a fingerprint sensor) disposed on the second surface 110B of the housing 110. The fingerprint sensor may be displayed not only on the first surface 110A (e.g., the display 101) of the housing 110, but also on the second surface 110B. The electronic device 100 may further include a sensor module not shown, such as at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 104.

[0043] The camera modules 105, 112, 113 may include a first camera device 105 disposed on a first surface 110A of the electronic device 100 and a second camera device 112 and / or a flash 113 disposed on a second surface 110B. The camera devices 105, 112 may include one or more lenses, image sensors, and / or image signal processors. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In a specific embodiment, two or more lenses (IR camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one surface of the electronic device 100.

[0044] The key input device 117 may be provided on the side surface 100C of the housing 110. In another embodiment, the electronic device 100 may not include a part or all of the key input device 117, and the key input device 117 not included may be implemented in other forms such as soft keys on the display 101. In a specific embodiment, the key input device may include a sensor module 116 provided on the second surface 110B.

[0045] The light emitting element 106 may be disposed, for example, on the first surface 110A of the housing 110. The light emitting element 106 may provide, for example, state information of the electronic device 100 in the form of light. In another embodiment, the light emitting element 106 may provide a light source associated with the operation of the camera module 105. The light emitting element 106 may include, for example, a light emitting diode (LED), an IR LED, and a xenon lamp.

[0046] The connector holes 108, 109 may include a first connector hole 108 and / or a second connector hole (e.g., a headphone jack) 109, the first connector hole 108 being used to receive a connector (e.g., a USB connector) for sending power and / or data to an external electronic device and receiving power and / or data from an external electronic device, and the second connector hole 109 being used to receive a connector for sending audio signals to an external electronic device and receiving audio signals from an external electronic device.

[0047] Figure 3 It is shown Figure 1 An exploded perspective view of the internal configuration of an electronic device.

[0048] Reference Figure 3 , the electronic device 300 may include a side surface frame structure 310, a first support member 311 (e.g., a bracket), a front surface plate 320, a display 330, a printed circuit board 340, a battery 350, a second support member 360 (e.g., a rear shell), an antenna 370, and a rear surface plate 380. In a specific embodiment, the electronic device 300 may omit at least one of the elements (e.g., the first support member 311 or the second support member 360), or may further include other elements. At least one of the elements of the electronic device 300 may be identical to the first support member 311 or the second support member 360. Figure 1 or Figure 2 At least one of the elements of the electronic device 100 is the same or similar, and redundant description is omitted.

[0049] The first support member 311 may be disposed inside the electronic device 300 and may be connected to the side surface frame structure 310, or may be formed integrally with the side surface frame structure 310. The first support member 311 may be formed of, for example, a metal material and / or a non-metal material (e.g., a polymer). The first support member 311 may have a surface to which the display 330 is coupled and another surface to which the printed circuit board 340 is coupled. The printed circuit board 340 may have a processor, a memory, and / or an interface mounted therein. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0050] The memory may include, for example, volatile memory or non-volatile memory.

[0051] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0052] The battery 350 may be a device that supplies power to at least one element of the electronic device 300, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be substantially disposed on the same plane as the printed circuit board 340. The battery 350 may be integrally disposed inside the electronic device 300, or may be disposed to be attachable to and detachable from the electronic device 300.

[0053] The antenna 370 may be disposed between the rear surface plate 380 and the battery 350. The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 370 may perform short-range communication with an external device, or may wirelessly send and receive power for charging. In another embodiment, the antenna structure may be formed by a portion or combination of the side surface frame structure 310 and / or the first support member 311.

[0054] Figure 4A is a top view illustrating a state in which a speaker is provided on a display panel according to various embodiments of the present disclosure. Figure 4B is a side view illustrating a state in which a speaker is provided on a display panel and operates according to various embodiments of the present disclosure.

[0055] Reference Figure 4A and Figure 4B , the electronic device 400 according to various embodiments may include a housing 410. According to one embodiment, the housing may include a display panel 420 and a speaker 430. According to one embodiment, the display panel 420 may include a first surface 420a facing a first direction (①) and a second surface 420b facing a second direction (②) opposite to the first direction (①).

[0056] According to an embodiment, the display panel 420 is a thin film type panel such as a film and may be formed of a rigid material or a flexible material. According to an embodiment, the display panel 420 may be formed in a flat or curved shape or a combination thereof. For example, the display panel 420 may include an OLED.

[0057] According to one embodiment, the display panel 420 may include an upper area 421 and a lower area 422. According to one embodiment, the speaker 430 may be disposed in the upper area 421, but is not limited thereto and may be disposed in a lower area, a middle area, or an edge area of ​​the electronic device. When the speaker 430 is mounted on the display panel 420, the speaker may be referred to as a display panel speaker.

[0058] According to one embodiment, the display panel 420 may have a speaker 430 disposed on the second surface 420b. The speaker 430 may be attached to the second surface 420b by an adhesive material B such as a tape. When the speaker 430 is working, the generated vibration may be transmitted to the display panel 420, and the transmitted vibration may be directed to the first direction (①) by the display panel 420. For example, the speaker 430 may include one or more film speakers 430 formed with a piezoelectric material as the piezoelectric material. According to one embodiment, when the speaker 430 is working, the speaker 430 may generate a vibration having directionality in the first direction (①).

[0059] Figure 5 is a graph showing results of measuring absolute displacement of a speaker attached to a display panel according to various embodiments of the present disclosure.

[0060] Reference Figure 5 , when the device according to one embodiment is attached to a display panel (e.g. Figure 4A The display panel 420 shown) has a speaker (eg Figure 4A When the loudspeaker 430 shown is in operation, the displacement between the maximum wavelength and the minimum wavelength of the loudspeaker 430 may be approximately 80 μm.

[0061] In order to reproduce the music of the electronic device according to an embodiment, the displacement is measured with reference to the time when the maximum displacement occurs by reproducing the signal of the frequency band (20Hz to 20kHz) of the speaker 430. The displacement of the peripheral part of the display panel to which the speaker is attached is measured, and it can be seen that the displacement is about 80μm relative to the point with the maximum displacement.

[0062] Fig. 6A is a top view showing an electronic device to which a bonding layer is attached according to various embodiments of the present disclosure. Figure 6B is a cross-sectional view illustrating a coupling structure between a display panel and a bracket according to various embodiments of the present disclosure.

[0063] Reference Fig. 6A and Figure 6B According to various embodiments, the electronic device 400 may include a display panel (eg Figure 4A The electronic device 400 may include a display panel 420, a bonding layer 450, and a bracket 440 stacked on each other. The bonding layer 450 may be disposed in a second direction (e.g., Figure 4BIn the second direction (②) shown in FIG. 4 , the bracket 440 may be disposed in the second direction (②) of the bonding layer 450. According to one embodiment, the electronic device 400 may have a display panel 420 and a bracket 440 bonded to each other by the bonding layer 450. For example, the bonding layer 450 may include a double-sided tape. One surface of the bonding layer 450 may be attached to the display panel 420, and the other surface may be attached to the bracket 440.

[0064] According to one embodiment, the display panel 420 is configured as a thin film type OLED. Therefore, at least some areas of the display panel 420 (i.e., some areas to which the speaker 430 is attached) can be used as a vibration plate, and when the speaker 430 vibrates, the vibration is transmitted to the vibration plate. According to one embodiment, the bonding layer 450 may include a portion that is removed and a portion that is not removed. According to one embodiment, the bonding layer 450 that is not removed may be related to the function of attaching the display panel 420 and the bracket 440 to each other, and may be related to the performance of the antenna as a spacer for maintaining the gap between the display panel 420 and the bracket 440, i.e., the propagation performance. According to one embodiment, the bonding layer 450 may perform a buffering function to prevent damage to the display panel 420 caused by an impact that occurs when the electronic device 400 falls.

[0065] According to one embodiment, the bonding layer 450 may have a first thickness and may be disposed between the display panel 420 and the bracket 440, and some areas may be removed. According to one embodiment, the bonding structure between the display panel 420 and the bracket 440 (i.e., a portion of the bonding layer 450) may be removed to reduce the vibration stiffness of the display panel 420.

[0066] According to an embodiment, a gap g1 may be formed due to the removed portion of the bonding layer 450. The gap g1 according to an embodiment may be located between the second surface 420b of the display panel 420 and the first surface 440a of the bracket 440 as an opening in a layer form.

[0067] According to one embodiment, the gap g1 as the removed portion of the bonding layer 450 may receive a speaker (eg, Fig. 6A The speaker 430 shown in the figure). The vibration stiffness of the display panel 420 can be reduced by removing a portion of the bonding layer 450. Therefore, the display panel 420 can achieve better acoustic performance in the low frequency band with less force than before removing a portion of the bonding layer 450. According to one embodiment, the gap g1 can enhance the acoustic performance of the low frequency band of the speaker 430. For example, the low frequency band can be between 200 Hz and 1 kHz.

[0068] According to one embodiment, when the first plate (e.g. Figure 1When viewed from above the front surface plate 102 shown in FIG. 1 , the gap g1 may cover the speaker 430 and the surrounding area of ​​the speaker 430 and may be substantially rectangular. However, the shape of the gap g1 is not limited to a rectangle and may be formed in various shapes. According to one embodiment, the gap g1 may have the same thickness as the thickness of the bonding layer 450. The thickness of the gap g1 may be about 100 μm.

[0069] According to an embodiment, the bracket 440 may be a supporting member for supporting the display panel 420 and may be connected to a side surface member (eg, Figure 1 The bracket 440 may be provided between the display panel 420 and the second plate (eg, Figure 2 According to one embodiment, the bracket 440 may include a first surface 440a facing a first direction (①) and a second surface 440b facing a second direction (②) opposite to the first direction (①). The first surface 440a may support the display panel 420 disposed thereon. Reference symbol BP may indicate an area in which the battery pack is disposed.

[0070] Fig. 7A is a top view showing an electronic device to which a bonding layer according to various other embodiments of the present disclosure is attached. Figure 7B is a cross-sectional view illustrating a coupling structure between a display panel and a bracket according to various other embodiments of the present disclosure.

[0071] Reference Fig. 7A and Figure 7B , the electronic device 500 according to various embodiments will not be described. Fig. 6A and Figure 6B The elements of the electronic device 400 shown are identical, and only the different elements will be described.

[0072] and Fig. 6A and Figure 6B Compared with the electronic device 400 shown in FIG. 1 , the electronic device 500 according to various embodiments may be different in the formation position of the gap g2. According to an embodiment, the electronic device 500 may include a display panel 420, a bonding layer 450, a bracket 440, and a gap g2.

[0073] According to an embodiment, the bonding layer 450 may have a first thickness and may be disposed between the display panel 420 and the bracket 440. According to an embodiment, a contact structure between the display panel 420 and the bracket 440 (ie, a portion of the bracket 440) may be removed to reduce vibration stiffness of the display panel 420.

[0074] According to an embodiment, the gap g2 may be formed by removing a portion of the first surface 440a of the bracket 440. The gap g2 according to an embodiment may be a layered depression and may be located between the display panel 420 and the first surface 440a of the bracket 440.

[0075] According to one embodiment, the vibration stiffness of the display panel 420 can be further reduced by the gap g2, which is the removed portion of the bracket 440. Figure 4A Operation of the speaker 430) shown can achieve better acoustic performance in the low frequency band of the speaker.

[0076] According to one embodiment, when the first plate (e.g. Figure 1 When viewed from above the front surface plate 102 shown in FIG. 1 , the gap g2 may cover the speaker 430 and the surrounding area of ​​the speaker 430 and may be substantially rectangular. However, the shape of the gap g2 is not limited to a rectangle and may be formed in various shapes. According to one embodiment, the thickness of the gap g2 may be about 100 μm.

[0077] Figure 8 is a graph showing a comparison of acoustic performance of a speaker when a portion of a bonding layer is removed and acoustic performance when a portion of a bracket is removed according to various embodiments of the present disclosure.

[0078] Reference Figure 8 , in which the bonding layer (e.g. Figure 6B The acoustic performance of the low frequency band in the embodiment in which the gap g1 is formed by a portion of the bonding layer 450 as shown and in which the bracket (eg, Figure 7B The low-frequency acoustic performances in the embodiments in which the gap g2 is formed by a portion of the first surface 440a of the bracket 440 as shown can be similar to each other.

[0079] Fig. 9 is a cross-sectional view illustrating a coupling structure between a display panel and a bracket according to various other embodiments of the present disclosure.

[0080] Reference Fig. 9 According to various embodiments, the electronic device 600 may be formed as Fig. 6A and Figure 6B The gap g1 and the gap g2 formed in the electronic device 400 are shown in FIG. Fig. 7A and Figure 7B The structure of the electronic device 600 according to the embodiment will not be described. Fig. 6A and Figure 6B The electronic device 400 and Fig. 7A and Figure 7BThe elements of the electronic device 500 are shown to be identical, and only the different elements will be described.

[0081] The electronic device 600 according to an embodiment may include a display panel 420 , a bonding layer 450 , a bracket 440 , a first gap g3 , and a second gap g4 .

[0082] According to an embodiment, the first gap g3 may be formed by removing a portion of the bonding layer 450 and may be formed between the display panel 420 and the bracket 440. According to an embodiment, the second gap g4 may be formed by removing the first surface 440a of the bracket 440 and may be formed between the bonding layer 450 and the bracket 440. The first gap g3 may include a layered opening, and the second gap g4 may include a groove recessed in the form of a layer on the first surface 440a of the bracket 440. According to an embodiment, the first gap g3 and the second gap g4 may be vertically stacked and may be spatially connected to each other. The sum of the thicknesses of the first gap g3 and the second gap g4 may be about 100 μm. For example, the first gap g3 may be about 50 μm, and the second gap g4 may be about 50 μm.

[0083] Fig.10 is a top view showing an electronic device with another bonding layer attached according to various embodiments of the present disclosure.

[0084] Reference Fig.10 The electronic device 700 according to various embodiments may be different from the removed portion of the bonding layer 450 in terms of shape. Fig. 6A An electronic device 400 is shown.

[0085] According to an embodiment, the removed area of ​​the bonding layer 450 may extend to a lower area of ​​the bracket 440. According to an embodiment, the removed area of ​​the bonding layer 450 may have a specific area shape, and as more areas are removed, the vibration stiffness of the panel may be further reduced.

[0086] According to an embodiment, the removed area of ​​the bonding layer 450 should avoid symmetrical shapes in the horizontal and vertical directions. This is because due to the characteristics of the display panel speaker that generates sound through vibration of the display panel, the performance of the speaker suddenly deteriorates in a specific frequency band.

[0087] This is because, when the sizes of regions having opposite phases in a specific vibration mode of the display panel are similar to each other, they may be offset and the energy of generating sound suddenly decreases. The same applies to the case where the bracket is removed (e.g. Figure 7B The second gap g2 shown in FIG. 1 ) and the case where the gap is formed by using both the bonding layer and the bracket (eg Fig. 9The first gap g3 and the second gap g4 are shown).

[0088] Fig.11 is a cross-sectional view illustrating a coupling structure between a display panel and a bracket according to various other embodiments of the present disclosure.

[0089] Reference Fig.11 , the electronic device 800 according to various embodiments will not be described. Fig. 6A and Figure 6B The elements of the electronic device 400 shown are identical, and only the different elements will be described.

[0090] The electronic device 800 according to an embodiment may include a curved display panel 820, a curved bracket 840, a bonding layer 850, and a gap g5. The bonding layer 850 may attach the curved display panel 820 and the curved bracket 840 to each other.

[0091] The bonding layer 850 according to an embodiment may have a gap g5 formed by removing some areas thereof. The removed areas of the bonding layer 850 may be formed as an opening in a layer form. According to an embodiment, the gap g5 may be formed in a curved shape. According to an embodiment, a curved gap structure having a curved gap g5 may be formed on the display panel 820 of the electronic device 800, and the curved gap structure is used to be bonded to an area formed on an edge area of ​​the curved display panel 820.

[0092] According to an embodiment, the curved display panel 820 , the curved bracket 840 , the bonding layer 850 , and the gap g5 may have respective curvature radii.

[0093] Fig.12 is a cross-sectional view illustrating a coupling structure between a display panel and a bracket according to various other embodiments of the present disclosure.

[0094] Reference Fig.12 , the electronic device 900 according to various embodiments will not be described. Fig. 7A and Figure 7B The elements of the electronic device 500 shown are identical, and only the different elements will be described.

[0095] The electronic device 900 according to an embodiment may include a curved display panel 920, a curved bracket 940, a bonding layer 950, and a gap g6. The bonding layer 950 may attach the curved display panel 920 and the curved bracket 940 to each other.

[0096] The bracket 940 according to an embodiment may have a gap g6 formed by removing some areas thereof. The removed area of ​​the bracket 940 may be formed as an opening in a layer form. According to an embodiment, the gap g6 may be formed in a curved shape. According to an embodiment, the curved gap structure having the curved gap g6 formed on the bracket 940 may be formed on an area of ​​the curved display panel 920 formed on an edge area of ​​the electronic device 900.

[0097] According to an embodiment, the curved display panel 920 , the curved bracket 940 , the bonding layer 950 , and the gap g6 may have respective curvature radii.

[0098] According to one embodiment, an electronic device (eg Fig. 6A The electronic device 400 shown may include: a housing (eg Figure 1 The housing 110 shown in FIG. 1 includes a housing 110 facing a first direction (eg Figure 4B The first plate (eg, Figure 1 The first plate 102 shown in FIG. 102 ) faces a second direction opposite to the first direction (eg, Figure 4B The second plate (eg, Figure 2 The second plate 111 shown in FIG. 1 and the side surface member (eg, Figure 1 side surface member 118 shown in FIG); a display panel (eg Figure 6B The display panel 420 shown in the figure is disposed on a first plate (eg Figure 1 In the second direction of the first plate 102 shown, and through the first plate (eg Figure 1 At least a portion of the first plate 102 shown is visibly arranged; a speaker (eg Fig. 6A The speaker 430 shown in the figure is arranged on a surface of the display panel facing the second direction; the bracket (eg Figure 6B The bracket 440 shown in the figure includes a first surface facing the first direction and a second surface facing the second direction, and is disposed between the first plate and the second plate to support the display panel disposed on the first surface; and a bonding layer (eg Figure 6B The bonding layer 450 shown has a first thickness and is configured to attach the display panel and the bracket, and the bonding layer may include a gap (e.g. Figure 6B A gap g1) is shown in FIG. 1 , which is formed by removing a portion of the bonding layer to receive the speaker and is formed between the display panel and the bracket.

[0099] According to one embodiment, the gap (e.g. Figure 6B The gap g1) shown may comprise a layer-shaped opening.

[0100] According to one embodiment, when the first plate (e.g. Figure 1 When viewed from above the first plate 102 shown, the gap (eg Figure 6B The gap g1 shown may cover the loudspeaker (eg Fig. 6A The area surrounding the speaker 430) shown.

[0101] According to one embodiment, when the first plate (e.g. Figure 1 When viewed from above the first plate 102 shown, the gap (eg Figure 6B The gap g1) shown may be substantially rectangular.

[0102] According to one embodiment, the gap (e.g. Figure 6B The gap g1) shown may enhance the performance of the speaker in the low frequency band by reducing the stiffness of the display panel.

[0103] According to an embodiment, the low frequency band may be between 200 Hz and 1 kHz.

[0104] According to one embodiment, the gap (e.g. Figure 6B The gap g1) shown may be approximately 100 μm.

[0105] According to one embodiment, the bonding layer (e.g. Figure 6B The bonding layer 450 shown can be used to hold the display panel (eg Figure 6B The display panel 420 shown) and the bracket (eg Figure 6B Gaps are created between the supports 440 as shown to maintain propagation performance.

[0106] According to one embodiment, a speaker (e.g. Figure 6B The speaker 430) shown may include a piezoelectric speaker.

[0107] According to one embodiment, a display panel (eg Figure 6B The display panel 420 shown may include an OLED panel.

[0108] According to one embodiment, an electronic device (eg Fig. 7A The electronic device 500 shown may include: a housing (eg Fig. 6A The housing 410 shown in FIG. 4 includes a housing 410 facing a first direction (eg Figure 4B The first plate (eg, Figure 1 The first plate 102 shown in FIG. 102 ) faces a second direction opposite to the first direction (eg, Figure 4B The second plate (eg, Figure 2 The second plate 111 shown in FIG. 1 and the side surface member (eg, Figure 1side surface member 118 shown); display panel (eg Figure 6B The display panel 420 shown in the figure is disposed on a first plate (eg Figure 1 In the second direction of the first plate 102 shown, and through the first plate (eg Figure 1 At least a portion of the first plate 102 shown is visibly arranged; a speaker (eg Fig. 6A The speaker 430 shown in the figure is arranged on a surface of the display panel facing the second direction; the bracket (eg Figure 7B The bracket 440 shown in the figure includes a first surface facing the first direction and a second surface facing the second direction, and is disposed between the first plate and the second plate to support the display panel disposed on the first surface; and a bonding layer (eg Figure 6B The bonding layer 450 shown has a first thickness and is configured to attach the display panel and the bracket, and the bracket may include a gap (e.g. Figure 7B A gap g2) is shown, which is formed by removing a portion of the bracket to receive the speaker and is formed between the bonding layer and the bracket.

[0109] According to one embodiment, the gap (e.g. Figure 7B The gap g2 shown may include a layer-shaped recess in the support (eg Figure 7B A groove on a first surface of the bracket 440 shown.

[0110] According to one embodiment, when the first plate (e.g. Figure 1 When viewed from above the first plate 102 shown, the gap (eg Figure 7B The gap g2 shown can cover the speaker (e.g. Fig. 6A The area surrounding the speaker 430) shown.

[0111] According to one embodiment, the gap (e.g. Figure 7B The gap g2 shown in FIG. 1 may be located in an electronic device (eg Fig. 6A The electronic device 400 shown in FIG. 4 is placed on the upper portion of the electronic device 400 and can be placed on the first board (eg Figure 1 The first plate 102 is shown as being generally rectangular when viewed from above.

[0112] According to one embodiment, the gap (e.g. Figure 7B The gap g2) shown may provide space to enhance the acoustic performance of the speaker in the low frequency band by reducing the stiffness of the display panel.

[0113] According to one embodiment, the stent (e.g. Figure 7B The bracket 440 shown may be formed from an aluminum material.

[0114] According to one embodiment, the bonding layer (e.g. Figure 7BThe bonding layer 450 shown can be used to hold the display panel (eg Figure 7B The display panel 420 shown) and the bracket (eg Figure 7B Gaps are created between the supports 440 as shown to maintain propagation performance.

[0115] According to one embodiment, an electronic device (eg Fig. 9 The electronic device 600 shown in the figure may include: a housing including a first plate (eg, Figure 1 The first plate 102 shown in FIG. 1 ), the second plate (eg, Figure 2 The second plate 111 shown), and a side surface member surrounding at least a portion of the space between the first plate and the second plate; a display panel (eg Figure 6B The display panel 420 shown in the figure is disposed on a first plate (eg Figure 1 In the second direction of the first plate 102 shown, and through the first plate (eg Figure 1 At least a portion of the first plate 102 shown is visibly arranged; a speaker (eg Fig. 6A The speaker 430 shown in the figure is arranged on a surface of the display panel facing the second direction; the bracket (eg Fig. 9 The bracket 440 shown in the figure includes a first surface facing the first direction and a second surface facing the second direction, and is arranged between the first plate and the second plate to support the display panel arranged on the first surface; the bonding layer (e.g. Fig. 9 The bonding layer 450 shown in the figure has a first thickness and is configured to attach the display panel and the bracket; a first gap (such as the gap g3 shown in the figure) is formed by removing a portion of the bonding layer and is formed between the display panel and the bracket; and a second gap (such as Fig. 9 The gap g4) shown is formed by removing the first surface of the support and is formed between the bonding layer and the support.

[0116] According to one embodiment, the first gap (eg Fig. 9 The gap g3 shown may include a layer-shaped opening, and the second gap (eg Fig. 9 The gap g4) shown may include a groove recessed in a layer shape on the first surface of the bracket (eg, the bracket 440 shown in the figure).

[0117] According to one embodiment, the first gap and the second gap (eg Fig. 9 The gaps g3 , g4 ) shown can be stacked vertically and can be spatially connected to one another.

[0118] In the bonding structure between the display panel and the bracket, an assembly structure of the display panel capable of reducing the vibration stiffness of the display panel is realized by removing a portion of the bonding layer or a portion of the bracket, thereby enhancing the acoustic performance of the speaker in the low frequency band.

[0119] Although the present disclosure has been shown and described with reference to certain preferred embodiments of the present disclosure, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims. Therefore, the scope of the present invention is defined not by the detailed description of the present invention, but by the appended claims, and all differences within the scope will be construed as being included in the present invention.

[0120] Although the present disclosure has been described in various embodiments, various changes and modifications may occur to those skilled in the art. The present disclosure is intended to encompass such changes and modifications as fall within the scope of the appended claims.

Claims

1. An electronic device, comprising: The housing comprises: a first plate facing a first direction, a second plate facing in a direction opposite to the first direction, and a side surface member surrounding at least a portion of a space between the first plate and the second plate; A display panel is disposed in a second direction of the first plate, the display panel being visibly disposed through at least a portion of the first plate; a speaker attached to one surface of the display panel so that when the speaker is in operation, the generated vibration is transmitted to the display panel, the speaker facing the second direction; a bracket, comprising a first surface facing the first direction and a second surface facing the second direction, the bracket being disposed between the first plate and the second plate to support the display panel disposed on the first surface; and a bonding layer having a first thickness, the bonding layer being configured to attach the display panel and the bracket, wherein the bonding layer includes a gap in which the speaker is received, the gap being formed by removing a portion of the bonding layer, the gap being formed between the display panel and the bracket and being configured to enhance acoustic performance of the speaker in a low frequency band by reducing vibration stiffness of the display panel, wherein the one surface of the display panel includes an upper area and a lower area, wherein the gap is formed at a position corresponding to a partial area of ​​the upper area of ​​the display panel, and wherein, when viewed from above the display panel, the partial area of ​​the upper region does not overlap with a battery of the electronic device disposed in the housing, and the speaker is attached to the partial area of ​​the upper region of the display panel. The electronic device according to claim 1 , wherein the gap comprises a layer-shaped opening. 3 . The electronic device of claim 1 , wherein the gap includes a surrounding area of ​​the speaker when viewed from above the first plate.

4. The electronic device of claim 3, wherein the gap is substantially rectangular when viewed from above the first plate. The electronic device according to claim 1 , wherein the low frequency band is between 200 Hz and 1 kHz. The electronic device of claim 1 , wherein the gap is approximately 100 μm. 7 . The electronic device according to claim 1 , wherein the bonding layer is configured to maintain propagation performance by maintaining a gap between the display panel and the bracket. The electronic device of claim 1 , wherein the speaker comprises a piezoelectric speaker.

9. The electronic device according to claim 1, wherein the display panel comprises an OLED panel.

10. An electronic device comprising: The housing comprises: a first plate facing a first direction, a second plate facing in a direction opposite to the first direction, and a side surface member surrounding at least a portion of a space between the first plate and the second plate; A display panel is disposed in a second direction of the first plate, the display panel being visibly disposed through at least a portion of the first plate; a speaker attached to one surface of the display panel so that when the speaker is in operation, the generated vibration is transmitted to the display panel, the speaker facing the second direction; a bracket, comprising a first surface facing the first direction and a second surface facing the second direction, the bracket being disposed between the first plate and the second plate to support the display panel disposed on the first surface; and a bonding layer having a first thickness, the bonding layer being configured to attach the display panel and the bracket, wherein the bracket includes a gap in which the speaker is received, the gap being formed by removing a portion of the bracket, the gap being formed between the bonding layer and the bracket, and being configured to enhance acoustic performance of the speaker in a low frequency band by reducing vibration stiffness of a display panel, wherein the one surface of the display panel includes an upper area and a lower area, wherein the gap is formed at a position corresponding to a partial area of ​​the upper area of ​​the display panel, and wherein, when viewed from above the display panel, the partial area of ​​the upper region does not overlap with a battery of the electronic device disposed in the housing, and the speaker is attached to the partial area of ​​the upper region of the display panel. 11 . The electronic device according to claim 10 , wherein the gap comprises a groove recessed in a layer shape on the first surface of the bracket. The electronic device according to claim 10 , wherein the bracket is formed of an aluminum material.

13. An electronic device comprising: Housing, including a first plate facing a first direction, a second plate facing in a direction opposite to the first direction, and a side surface member surrounding at least a portion of a space between the first plate and the second plate; A display panel is disposed in a second direction of the first plate, the display panel being visibly disposed through at least a portion of the first plate; a speaker attached to one surface of the display panel so that when the speaker is in operation, the generated vibration is transmitted to the display panel, the speaker facing the second direction; a bracket, comprising a first surface facing the first direction and a second surface facing the second direction, the bracket being disposed between the first plate and the second plate to support the display panel disposed on the first surface; a bonding layer having a first thickness, the bonding layer being configured to attach the display panel and the bracket; a first gap in which the speaker is arranged, the first gap being formed by removing a portion of the bonding layer, the first gap being formed between the display panel and the bracket; as well as a second gap formed by removing the first surface of the bracket, the second gap being formed between the bonding layer and the bracket, wherein the first gap and the second gap are configured to enhance the acoustic performance of the speaker in a low frequency band by reducing the vibration stiffness of the display panel, wherein the one surface of the display panel includes an upper area and a lower area, wherein the first gap and the second gap are formed at positions corresponding to a partial area of ​​the upper area of ​​the display panel, and wherein, when viewed from above the display panel, the partial area of ​​the upper region does not overlap with a battery of the electronic device disposed in the housing, and the speaker is attached to the partial area of ​​the upper region of the display panel.

14. The electronic device according to claim 13, wherein the first gap and the second gap are vertically stacked, The first gap and the second gap are spatially connected to each other.

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