Base and housing for electronic components with integrated cooler

Abstract

A base and an electronic component having the base achieve improved cooling and high-frequency conduction. The base comprises a base body including a plurality of electrical feedthroughs, the feedthroughs having openings sealed with insulating material, at least one feedthrough conductor extending through the openings while being electrically insulated from the base body. A thermoelectric cooling element is secured to the base body so that the thermoelectric cooling element dissipates waste heat generated during operation to the base body. A support for the electronic component is secured to the thermoelectric cooling element so that the support is cooled thereby. The base body comprises a first conductor rail assembly having a first signal conductor and at least one ground conductor connected to the feedthrough conductors. A second conductor rail assembly for connecting the electronic component is disposed on the support body and has a second signal conductor and at least one ground conductor. The two conductor rail assemblies are separated by a gap, and the gap is bridged by a wire bond connecting the two signal conductors and the ground conductor. At least one of the opposing ends of the conductor rail assembly across the gap comprises a capacitive structural element that increases its capacitance.

Description

Technical Field

[0001] The present invention generally relates to a housing for electronic components and, in particular, to a base for such a housing having an integrated cooler and improved transmission properties.

[0002] The invention is also intended to be suitable, in particular, for components for high-frequency data transmission, particularly data transmission rates in the range of 50 GBit / s or higher. Background Art

[0003] A common housing type for these applications is the so-called TO housing (TO=“Transistor Outline”). This type of housing is designed for high-frequency transmission and is described in DE 10 2017 120 216 A1.

[0004] Other housings for high transmission rates are disclosed in WO 2019 / 161755 A1, US 2018 / 284374 A1 and US10 177529 B2.

[0005] For some optoelectronic applications, such as the aforementioned high-frequency data transmission, it is desirable to precisely control the wavelength of the laser chip used for transmission. Since the laser wavelength is also temperature-dependent, the temperature of the laser should be stabilized within a very narrow range. For this purpose, a thermoelectric cooler (TEC) can be used. Such cooling elements can be integrated into the housing of the electronic component, for example a TO housing, for particularly effective cooling. The use of thermoelectric cooling elements often presents the problem of achieving good temperature insulation on the cold side of the electronic component while simultaneously achieving low signal reflection at the contact points. In TO-type housings, the problem of a suitable design is exacerbated by the limited available space. Summary of the Invention

[0006] Therefore, the object of the present invention is to provide a base and an electronic component having such a base, which achieve better cooling and high-frequency conduction. This object is achieved by the subject matter of the independent claims. Advantageous developments are given in the dependent claims.

[0007] Until now, simple wirebond connections have been used to contact electronic components in the housing, as described, for example, in DE 10 2017 120 216 B4. The next generation of optical data connections aims to double the data transmission rate to 56 Gbit / s. However, these simple wirebond connections result in significant line losses. The present disclosure overcomes this problem by using a CLC network for compensation. At the same time, this achieves good thermal decoupling of the hot and cold sides of the TEC in the housing.

[0008] For this purpose, a base for an electronic component is provided, which base has a base body with a plurality of electrical feedthroughs, wherein the feedthroughs each have an opening sealed with an insulating material, through which at least one feedthrough conductor extends in order to be electrically insulated from the base body, and wherein

[0009] The thermoelectric cooling element is fixed to the base body so that the thermoelectric cooling element can dissipate waste heat generated during operation to the base body, and wherein

[0010] A support for an electronic component is attached to a thermoelectric cooling element so that the support can be cooled by the thermoelectric cooling element. A first conductor track assembly is provided, comprising a first signal conductor and at least one ground conductor, the first signal conductor being connected to a feed-through conductor. A second conductor track assembly is provided on the support for connecting the electronic component, comprising a second signal conductor and at least one ground conductor. The two conductor track assemblies are separated by a gap, and a wire bond bridges the gap, connecting the two signal conductors and the ground conductor. At least one of the opposing ends of the conductor track assembly at the gap comprises a capacitive structural element that increases the capacitance of the conductor track assembly. Preferably, both ends of the conductor track assembly comprise such a capacitance-increasing structural element. Particularly preferably, the capacitances of the structural elements are also equal to achieve a symmetrical circuit.

[0011] The gap serves to interrupt the flow of heat from the thermoelectric cooling element, i.e., from the substrate, to the cold side. Wirebonds have a high inductance. This high inductance causes reflections and correspondingly high losses in the signal line. However, the capacitance-enhancing structural elements at the ends of the conductor rail assembly provide a CLC network, i.e., a structure with two capacitive elements in addition to the inductance of the wirebonds. The CLC network enables impedance matching, which ideally completely compensates for the high impedance of the wirebonds.

[0012] In a preferred embodiment, at least one conductor track assembly is configured as a coplanar waveguide. Preferably, both conductor track assemblies are coplanar waveguides. In a coplanar waveguide arrangement, at least one conductor track of the ground conductor runs in the same plane alongside the conductor tracks of the signal conductor.

[0013] The gap and the bridging wire connections reduce the heat flow from one side of the first conductor track assembly to the electronic components. Thermal decoupling is also significantly improved if the base has a platform on which the first conductor track assembly is arranged, wherein the platform is separated from the support for the electronic components by the gap. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be described in detail below with reference to the accompanying drawings.

[0015] Figure 1shows a perspective view of the base, and

[0016] Figure 2 The base is shown in a top view.

[0017] Figure 3 The base is shown in a perspective view from the side.

[0018] Figure 4 A circuit board with a first conductor rail assembly is shown in a cross-sectional view.

[0019] Figure 5 and Figure 6 is an equivalent circuit diagram for wire bond connections.

[0020] Figure 7 An enlarged detail of the mount and the circuit board with the conductor rail assembly is shown.

[0021] Figure 8 A graph showing the forward transmission coefficient as a function of frequency is shown.

[0022] Figure 9 Graphs are shown of the input reflection coefficient as a function of frequency, respectively.

[0023] Figure 10 TDR graphs of impedance as a function of time are shown for three different models.

[0024] Figure 11 A cross-sectional view of an electronic component is shown.

[0025] Figure 12 and Figure 13 An embodiment of a capacitive structural element 111 , 121 is shown. DETAILED DESCRIPTION

[0026] Figure 1 and Figure 2 An example of a base 1 according to the present disclosure is shown. The base 1, which forms part of a housing for an electronic component, has a base body 3 with a plurality of electrical feedthroughs 4. In a preferred embodiment, and not limited to the example shown, the base body 3 has a disk-like or flange-like shape.

[0027] Each feedthrough 4 has an opening 7 sealed with an insulating material 6, through which at least one feedthrough conductor 8 extends, electrically insulated from the base body 3. The insulating material 6 can be glass, in particular. The glass insert can be easily produced by melting the glass. However, ceramic insulators, glass ceramic materials, or plastics can also be used.

[0028] Temperature stabilization or cooling is often desired for electronic components used to transmit data at high data rates. To this end, the base 1 includes a thermoelectric cooling element 16, which is fixed to the base body 3. The thermoelectric cooling element 16 is connected so that its hot side is connected to the base body 3 and can output the waste heat generated during operation to the base body 3. A support 18 for the electronic component 2 is fixed to the thermoelectric cooling element 16 on its cold side, so that the support 18 can be cooled by the thermoelectric cooling element 16. The problem with this arrangement is that the waste heat can flow back to the electronic component 2 via the base body 3. In this case, the heat flow also takes place in particular along the path of the power supply line. However, thermal decoupling measures, such as long, coiled wire paths, can significantly increase wire losses.

[0029] The base 1 is designed to minimize heat flow while maintaining low signal conductor losses. To this end, a first conductor track assembly 11 is provided, comprising a first signal conductor 13 and at least one ground conductor 14, which is connected to the feedthrough conductor 8. A second conductor track assembly 12, for connecting electronic components, is provided on the support 18, comprising a second signal conductor 15 and at least one ground conductor 14. The two conductor track assemblies 11, 12 are separated by a gap 20, bridged by a wire bond 22. Thus, the two signal conductors 13, 15 are electrically connected to at least one wire bond 22, and the ground conductor 14 is electrically connected to at least one other wire bond 22. The gap 20 provides good thermal isolation. However, wire bonds have a higher inductance, which can cause reflections at the wire bond contact points. To avoid these problems, the ends 110, 120, facing each other at the gap, are provided with capacitive structural elements 111, 121, respectively. The capacitive structural elements are designed or formed such that they increase the capacitance of the conductor track assemblies 11, 12, in particular the capacitance per unit length of the line. The two capacitive structural elements interact with the wire bond 22 connecting the two signal conductors 13, 15 to form a CLC network. Its impedance can be adjusted so that reflections at the gap 20 are reduced, or ideally, even completely avoided.

[0030] In the preferred embodiment implemented in the example shown, the electronic component 2 is not fixed directly to the support 18, but rather to a mounting base 25. The mounting base 25 is a component support, on which the second conductor rail assembly 12 is preferably also arranged. In this way, the electronic component 2 can be pre-mounted on the mounting base 25 and connected to the conductor rail assembly 12. The mounting base 25 with the electronic component 2 can then be aligned on the support 18 and fixed thereto. The connection of the electronic component 2 can be made via a wire bond 23, just as the gap 20 is bridged.

[0031] The mounting base 25 can be made of, for example, aluminum nitride ceramic or generally of a ceramic containing aluminum nitride. Other ceramic materials with good thermal conductivity can also be used.

[0032] The signal line of the base 1 for transmitting high-frequency signals (hereinafter also referred to as radio frequency signals, ie RF signals) starts at the feed-through conductor 8 outside the housing and ends at the electronic component 2. Figure 1 and Figure 2 As can be seen, the longer section of the signal line runs alongside the thermoelectric cooling element 16 and the support 18. To guide the signal to the electronic component 2, in another preferred embodiment, the base 1 includes a platform 9 on which the first conductor track assembly 11 is arranged. The platform 9 is separated from the support 18 for the electronic component 2 by a gap 20. The platform 9 facilitates simple installation because, due to its mechanical stability, it forms a mounting base for the first conductor track assembly 11, thereby simplifying the production of the wire bonding connection 22. Furthermore, the platform 9 can serve as a secure grounding contact for the first conductor track assembly. However, the platform 9 has the disadvantage that it establishes good thermal contact with the base body 3. The gap 20, however, interrupts the heat flow to the electronic structure 2. The platform 9 can be an integral component of the base body 3 or can be fixed to the base body 3 as a separate component, for example, by soldering.

[0033] In a further embodiment, the first conductor track assembly 11 is arranged on a circuit board 26. The circuit board can then be fixed to the platform 9, for example by soldering. Preferably, the circuit board is made of a ceramic material, for example, a ceramic containing aluminum nitride or aluminum oxide. The signal conductor 13 is soldered to make contact with the feedthrough conductor 8 of the feedthrough 4. Contact with the ground conductor 14 can be made in a simple manner via the platform 9.

[0034] The power of the thermoelectric cooling element 16 is closed-loop controlled based on the temperature measurement in order to achieve a constant temperature on the electronic component 2. For this purpose, as in Figure 3 As can be seen in the figure, a temperature sensor 27 can be arranged on the support 18. The measured value of the temperature sensor 27 can be read via one of the feedthroughs 4 and processed in an external closed-loop control circuit to control the temperature on the electronic component 2. A suitable temperature sensor is, for example, a thermistor.

[0035] For high data transmission rates, optoelectronic converters in the form of laser diodes are particularly suitable. Such laser diodes can be directly modulated laser diodes or externally modulated laser diodes (EMLs). Externally modulated laser diodes are preferred. To maintain wavelength stability, it is advantageous to cool the laser diode. Therefore, the mount described here is particularly suitable for laser diodes, in particular for externally modulated laser diodes as electronic components. Furthermore, for high transmission rates, a one-side grounded or asymmetrical signal path with an impedance Z0 of 50 Ohm is advantageous to avoid signal attenuation due to reflections. Thus, in the mount described here, the signal path comprises the first and second waveguide components 11, 12 and the bridging of the gap 20 by means of a wire bond connection 22.

[0036] Figure 4 An embodiment of a circuit board 26 is shown in cross-section. Figure 1 and Figure 2 The ground conductor 14 and the signal conductor 13 can also be seen in the figure. The opposite side of the circuit board 26 is provided with a metal layer, which serves as a back electrode 141. The base 1 or generally the housing formed by the base 1 is grounded and is therefore part of the return line for the high-frequency signal. The metal platform 9 connected to the base 3 is therefore also grounded. The circuit board 26 is connected to the platform 9 with its back contact 141. For example, the circuit board 26 can be soldered to the platform 9. The ground conductor 14 is connected to the back electrode 141 via a conductive through-contact (Durchkontaktierung) or a via (Via) 142. If the circuit board 26 is placed on the platform 9 with the back electrode 141, the back electrode 141 is grounded via the platform 9 connected to the base 3. By connecting the ground conductor 14 via the via 142, the ground conductor 14 is also kept at ground potential. Not limited to Figure 4 In a special embodiment of the present invention, a backside electrode 141 in the form of a conductive layer is arranged on the side of the circuit board 26 opposite the first conductor track assembly 11, wherein at least one ground conductor 14 of the conductor track assembly 11 is connected to the backside electrode 141 via at least one, preferably a plurality of, conductive connections, i.e., vias 142. According to another embodiment, the at least one ground conductor 14 is electrically connected to the platform 9 as described above.

[0037] according to Figure 1 、 Figure 2 and Figure 4 It can also be seen that the conductor track assemblies 11, 12 are also designed as coplanar waveguides. The coplanar waveguides include signal conductors 13, 15 and two ground conductors 14 running in the same plane next to the respective signal conductors 13, 15. Figure 4In the embodiment shown, the conductor track assembly is in particular designed as a CBCPW (“conductor-backed coplanar waveguide”). The mounting 25 with the second conductor track assembly 12 can also be correspondingly configured as in Figure 4 , the conductor rail assembly 12 is configured as shown in FIG. 1 so that it forms a CBCPW.

[0038] The feed-through conductor 8 of the feed-through 4 for introducing high-frequency signals passes through Figure 1 The solder connection 30 visible in FIG. 1 is connected to the signal conductor 13 of the conductor rail assembly 11 .

[0039] If further based on Figure 1 and Figure 2 As can be seen, the direction of the signal conductor 13 of the conductor rail assembly changes from the direction along (or in line with) the feed-through conductor 8 connected to the signal conductor 13 to the direction of the electronic component 2. Preferably, the direction of the signal conductor 13 changes by at least 45°, in particular by 90° as shown. The signal conductor 13 ends near the side edge of the circuit board 26 at the gap 20. Therefore, the circuit board 26 has two opposite end edges and two adjacent opposite side edges, one of which points to the base body 3, and the gap is formed on one of the side edges. Figure 4 The side edges 261 , 262 are drawn in.

[0040] Despite the relatively high inductance per unit length, a bond wire connection 22 bridging the gap 20 and connecting the two conductor rail assemblies 11 and 12 is used because it is a connection with low thermal conductivity and thus provides good thermal separation of the hot and cold sides of the thermoelectric cooling element 16 .

[0041] The width of the gap 20 is preferably at least 0.1 mm. This also provides sufficient space for manufacturing and installation tolerances. In addition, according to another embodiment, the conductor tracks of the signal conductors 13, 15 and preferably the ground conductor 14 are not directly aligned with the edges of the circuit board 26 and the mounting base 25, but are slightly recessed. The amount of recess is preferably between 0.02 mm and 0.1 mm. As an example, the conductor tracks 13, 14, 15 can be recessed by 0.05 mm relative to the edges of the mounting base 25 or the circuit board 26. With these dimensions, a spacing of at least 0.12 mm, typically approximately 0.2 mm, is achieved between the opposing conductor tracks of the two conductor track assemblies 11, 12 to be connected to the solder wires. According to another embodiment, this results in a solder wire length of at least 0.2 mm, typically approximately 0.3 mm, for the solder wire connection 22.

[0042] However, in this case, even at high frequencies, inductive discontinuities occur on the signal conductors 13 , 15 , which lead to faulty impedance matching and to undesired reflections. Figure 5 An equivalent circuit diagram for this is shown, showing a wire bond 22 and a conductor track assembly having two coplanar waveguides with signal conductors 13, 15 and a ground conductor 14. The two waveguides on the mounting base 25 and the circuit board 26 have an impedance Z0 of preferably 50 ohms. The wire bond 22 provides an additional inductance L1 and accordingly increases the impedance.

[0043] Next-generation optical data connections are expected to operate at data rates of 56 GBd. At these data rates, the higher impedance of bond wires presents a significant challenge. To reduce the high impedance of bond wire connections, a CLC compensation structure is proposed. The CLC compensation structure comprises a parallel capacitor C1, a series inductor L1, and a second parallel inductor C2. Figure 6 The corresponding equivalent circuit diagram is shown. As long as their structural dimensions are smaller than the wavelength of the signal to be transmitted, inductor L1 and two capacitors C1 and C2 together form the equivalent circuit diagram of a transmission line. For example, the wavelength of a 50 GHz signal in air is 6 mm. The size of the CLC network is considered small if it is less than 1 / 10 of the signal wavelength. Therefore, in the above example, this is a maximum size of 0.6 mm.

[0044] The impedance ZCLC of the CLC network can be calculated as follows:

[0045]

[0046] Given the inductance L1 of the bonding wire, the impedance Z is determined by the capacitors C1 and C2. CLC The capacitors can be the same or different. Identical capacitors are preferred to have a symmetrical network. CLC When the impedance Z0 of the two waveguides is equal, impedance matching is achieved. In this case, the signal is not attenuated due to reflection. The additional capacitances C1 and C2 are provided by the capacitive structural elements 111 and 121. According to the above formula, the desired impedance Z can also be achieved when there is only one capacitive structural element so that one of the capacitances C1 and C2 is equal to zero. CLC Likewise, the two capacitors C1 and C2 do not necessarily have to be of the same size. However, it is preferred that the capacitors C1 and C2 are identical or at least substantially equal, thereby obtaining a symmetrical CLC network. Therefore, according to a preferred embodiment of the present invention, the two ends 110 and 120 of the conductor rail assemblies 11 and 12 have capacitive structural elements 111 and 121. Their capacitances are preferably identical or at least of the same order of magnitude, so that the ratio of the capacitances has a value in the range of 0.5 to 2.

[0047] For an embodiment in which the two ends of the conductor track assembly have capacitive structural elements, which can be attributed to a CLC network as an equivalent circuit, the capacitive structural elements are designed according to a preferred embodiment and matched to the inductance of at least one wire bond connection so that the ratio L1 / (C1+C2) is 1000 Ohm. 2 Up to 5000Ohm 2 range, preferably 1225Ohm 2 Up to 4225Ohm 2 Here, C1 and C2 are the capacitances of the capacitive structural elements and L1 is the inductance of at least one bonding wire connection 22. In the case of multiple bonding wires, L1 represents the total inductance of these bonding wires connecting the two signal conductors 13, 15. 2 Up to 5000Ohm 2 range, preferably 1225Ohm 2 Up to 4225Ohm 2 The range of values also applies in a corresponding manner when a capacitive structural element 111 or 121 is provided on only one signal conductor 13, 15. In this case, C1 or C2 is equal to zero, or the ratio L1 / C has the above-mentioned values, where C is the capacitance of the capacitive structural element.

[0048] In general, without being limited to a specific embodiment, it is preferred that the impedance of the arrangement of the at least one capacitive structural element and the at least one bond wire connection 22, preferably the arrangement of a CNC network consisting of two capacitive structural elements 111, 121 connected by at least one bond wire connection, is in the range of 20 ohms to 80 ohms. An impedance in the range of 35 ohms to 65 ohms is preferred.

[0049] According to a further preferred embodiment, the gap is bridged by a plurality of parallel connected bonding wires 22, which are in contact with the signal conductors 13. Figure 1 and Figure 2 As shown, the parallel bonding wire connections 22 reduce not only the ohmic resistance but also the inductance. Preferably, the gap-bridging connection of the signal conductor is made with a double bonding wire connection.

[0050] Furthermore, the inductance of one or more bond wire connections is generally preferably in the range of 50 pH to 800 pH; particularly preferably 100 pH to 600 pH. The inductance L of a simple bond wire connection can be expressed as L=l bond 1nH / mm estimated, where l bond Indicates the length of the bond wire in millimeters. In the case of a double bond wire connection, i.e. two parallel bond wires, the inductance is halved.

[0051] The length of the one or more bonding wires is preferably in the range of 0.25 mm to 0.75 mm, particularly preferably in the range of 0.3 mm to 0.6 mm. This bonding wire length and / or inductance is particularly suitable for achieving a sufficient gap width on the one hand and good compensation by means of one or two capacitive components on the other hand.

[0052] Figure 7 An enlarged detail of the mounting base 25 and the circuit board 26 with the conductor rail assemblies 11 , 12 is shown. Figure 7 is an example of a preferred embodiment of a capacitive structural element 111, 121, which includes a widening portion of the signal conductor 13, 15 at the end portion 110, 120 of the conductor rail assembly 11, 12. In another preferred design, the widening portion is trapezoidal as shown. As shown, the signal conductor 13, 15 widens from a width w0 to a width w1. Without being limited to the example shown and regardless of whether the widening portion is formed as a trapezoid or another shape, in one design, the signal conductor 13, 15 is widened by at least a factor of 1.5. According to one example, the signal conductor 13, 15 is widened from a width of 0.1 mm to a width of 0.2 mm, i.e. by a factor of 2, and according to another example to a width of 0.3 mm, i.e. by a factor of 3. In order to achieve an effective capacitance increase, in another embodiment, the spacing between the signal conductor 13, 15 and the at least one ground conductor 14 measured in a direction perpendicular to the longitudinal direction of the signal conductor 13, 15 remains essentially constant. This embodiment is also Figure 7 . The width w3 of the gap 17 remains unchanged, since the ground conductor 14 is set back in a direction perpendicular to the longitudinal direction of the signal conductors 13, 15 to the same extent as the widening of the signal conductors 13, 15. Without being limited to the example shown, in one embodiment, the width of the gap 17 between the ground conductor 14 and the signal conductors 13, 15 changes in the widened region by a factor of 1.5 at most, wherein the width is measured perpendicular to the longitudinal direction of the signal conductors 13, 15. According to another embodiment, the spacing between the ground conductor 14 and the signal conductors 13 and / or 15 can be reduced so that they are used as capacitive structural elements 111, 121 or are part of capacitive structural elements 111, 121. Then Figure 7 In the example shown, the spacing w4 is made smaller than the spacing w3. Therefore, without being limited to the example shown, in a development of the present invention, the capacitive structural elements 111, 121 include a reduced spacing w4 from the ground conductor 14 to the signal conductors 13, 15 at the end 110 or 120 of the conductor rail assembly 11, 12.

[0053] If the capacitive structural elements 111 , 121 , which are preferably designed as trapezoidal widenings, are dimensioned appropriately, the high impedance of the wire bond 22 can be fully compensated. This compensation is possible as will be shown below using FEM-EM field simulations on the base 1 .

[0054] Three models were simulated over a frequency range up to 55 GHz. In model 1, the signal conductors do not terminate in a widening section and therefore represent coplanar waveguides without compensating for the inductance L1 of the wirebond connections. The width of the signal conductors is 0.1 mm. In model 2, a suitable trapezoidal widening section is provided, with both signal conductors 13 and 15 widening from a width of 0.1 mm to a width of 0.2 mm, i.e., by a factor of 2. In the otherwise identical model 3, the signal conductors 13 and 15 widen to a width of 0.3 mm, i.e., by a factor of 3.

[0055] Scattering parameters were obtained as a result of the FEM simulation. Parameter S21 is the forward transmission coefficient, and parameter S11 is the input reflection coefficient. For the simulated door 1, it was assumed that the feedthrough conductor was located outside the base 1 or on an insulating material surface on the side of the base 1 opposite the conductor rail assemblies 11 and 12. Door 2 was located at the end of the conductor rail assembly 12, to which the electronic component 2 was connected.

[0056] Figure 8 A graph of the forward transmission coefficient S21 as a function of frequency is shown for the aforementioned model. Figure 9 The corresponding graph of the input reflection coefficient S11 is shown. Curves (1), (2), and (3) are the simulation values of models 1, 2, and 3, respectively.

[0057] The forward transmission coefficient S21 is almost unaffected by the presence and size of the capacitive structural elements. Figure 8 The curves in Figure 2 overlap almost exactly. However, there is a significant effect on the input reflection coefficient S11. The reflection attenuation in Models 2 and 3 is between 5 and 10 dB lower than in Model 1, i.e., without capacitive structural elements in the conductor track structure.

[0058] Figure 10 TDR diagrams (TDR = "Time-domain reflectometry") of impedance as a function of time are shown for three different models. The diagram shows the impedance of a signal path as a function of the propagation time of the RF signal. This time is therefore a measure of the longitudinal position along the signal path.

[0059] A peak is shown starting at approximately 1.055 nanoseconds. This peak is significantly related to the size of the model or the trapezoid as the capacitive structural element 111, 121. The highest impedance value of 58 Ohm is shown in model 1 or curve (1). Model 2 with a trapezoid of suitable size shows a lower impedance of 55 Ohm. The lowest impedance of 52 Ohm is achieved by model 3, i.e. a trapezoid in which the conductor track is widened from a width of 0.1 mm to a width of 0.3 mm at the gap 20. The overall minimum reflection attenuation ( Figure 9 ).according to Figure 10 As can be generally seen from the graph, the capacitive structural elements 111, 121 can be designed so that the impedance of the input line with a resistance of 50 ohms does not rise above 55 ohms in the region between the capacitive structural elements 111, 121. However, in both models with capacitive structural elements, the impedance rise is particularly smaller than in curve (1). Thus, in the improved embodiment, the impedance rise in the region between the capacitive structural elements 111, 121 is less than 5 ohms.

[0060] Simulation results show that the proposed CLC compensation network can offset the adverse effects of wirebond connections and provide impedance matching for the connections. This compensation is also effective for data rates up to at least 55 GHz. Therefore, the described mount 1 is particularly well-suited for high-speed applications, such as optical transmission at 56 GBd.

[0061] The base 1 alone or when assembled with an electronic component 2, such as an EML diode, does not usually form a complete electronic component, because a closed housing is usually provided for this purpose, which surrounds the electronic component. Therefore, according to another embodiment, an electronic component 10 is provided with a housing 5 and a base 1 as described above. Such an electronic component 10 is Figure 11 is shown in a schematic cross-sectional view. Housing 5 is also partially formed by base 1, specifically, its base body 3. Base body 3 can be connected to other housing parts, such as a cover 50 having a window 51. Cover 50 with window 51 preferably surrounds electronic component 2 on support 18 in an airtight manner. Electronic component 2, in the form of a phototransmitter, such as an EML diode, or a photoreceiver, can then transmit or receive signals through window 51. Cover 50 can, for example, be welded or soldered to base 1.

[0062] The capacitive structural elements 111 , 121 are important for improving the high-frequency properties of the chassis 1 . As already mentioned, the capacitive structural elements 111 , 121 can also be designed differently from the illustrated special embodiment of the trapezoidal widening of the signal conductors 13 , 15 . Figure 12 and Figure 13 For this purpose, further embodiments of capacitive structural elements 111, 121 are shown. Figure 12The embodiment is based on the fact that the capacitance at the gap 20 is increased by a dielectric body 122. Therefore, the capacitive structural element includes a dielectric body. For example, a dielectric coating can be applied to the gap-side ends of the conductor rail assemblies 11, 12. The capacitance can thus be increased particularly effectively when the dielectric coating, or generally the dielectric body 122, covers the gap 17 between the ground conductor 14 and the corresponding signal conductor 13, 15, as shown. According to one embodiment, a dielectric body 122 can be provided in each case, which covers the gap 17 and, as shown, leaves the area of the signal conductor 13, 15 free for applying the wire bond. It is also conceivable to apply the dielectric body 122 after the wire bond connection has been established and, for example, to simultaneously embed the contact points of the conductor rail and the wire bond.

[0063] according to Figure 13 In an exemplary embodiment, the capacitive structural element may include a conductive bridge 123 . Figure 13 For this purpose, a mounting base 25 or a circuit board 26 with corresponding conductor rail assemblies 11, 12 is shown in a perspective view, the ends 110, 120 of which point toward the gap. In the region of the ends of the conductor rail assemblies 11, 12, a bridge 123 may be provided, which spans the signal conductor 13 or 15 and is connected to the ground conductor 14. The bridge 123 forms a small capacitor.

[0064] Different embodiments of capacitive structural elements can also be combined with one another. Thus, bridge 123 can be configured, for example, as a conductive coating on a dielectric coating. These structural elements can also be present in addition to widenings of the signal conductor. Furthermore, the widening can have a variety of alternative shapes besides a trapezoidal shape, such as a round or rectangular head or a widening on only one side, such as in the shape of a flag.

[0065] Reference Signs List

[0066] 1 base

[0067] 2 Electronic components

[0068] 3 1 base

[0069] 4 Feedthrough

[0070] 5. Housing

[0071] 6 Insulation materials

[0072] 7 Opening

[0073] 8 Feedthrough conductor

[0074] 9 Platform

[0075] 10 Electronic components

[0076] 11, 12 conductor rail assembly

[0077] 13, 15 signal conductors

[0078] 14 Grounding conductor

[0079] 16 Thermoelectric Cooling Elements

[0080] 17 The interval between 14 and 13, 15

[0081] 18 bracket

[0082] 20 gap

[0083] 22, 23 Wire connectors

[0084] 25 Mount

[0085] 26 circuit boards

[0086] 27 Temperature Sensor

[0087] 28 Monitor diode

[0088] 50 hood

[0089] 51 Window

[0090] 110, 120 11, 12 ends

[0091] 111, 121 Capacitive structural elements

[0092] 122 dielectric

[0093] 141 dorsal electrode

[0094] 142 vias

[0095] 261, 262, 26 side edges

Claims

1. A base (1) for an electronic component (10), the base having a base body (3) comprising a plurality of electrical feedthroughs (4), wherein the feedthroughs (4) each have an opening (7) sealed with an insulating material (6), at least one feedthrough conductor (8) extending through the insulating material to be electrically insulated from the base body (3), and wherein - a thermoelectric cooling element (16) is fixed to the base body (3) so that the thermoelectric cooling element (16) can dissipate waste heat generated during operation to the base body (3), and wherein - a support (18) for an electronic component (2) is fastened to the thermoelectric cooling element (16) in such a way that the support (18) can be cooled by means of the thermoelectric cooling element (16), and wherein A first conductor track assembly (11) having a first signal conductor (13) and at least one ground conductor (14) is provided, wherein the first signal conductor is connected to a feed-through conductor (8); a second conductor track assembly (12) for connecting an electronic component is provided on the support (18), wherein the second conductor track assembly (12) has a second signal conductor (15) and at least one ground conductor (14); wherein the two conductor track assemblies (11, 12) are separated by a gap (20), and wherein the gap (20) is bridged by a wire bond (22), wherein the wire bond Two signal conductors (13, 15) and a ground conductor (14) are connected, and at least one of the opposite ends (110, 120) of the conductor track components (11, 12) at the gap has a capacitive structural element (111, 121), the capacitive structural element increases the capacitance per unit length of the conductor track components (11, 12) in the region of the capacitive structural element (111, 121), and the capacitive structural element (111, 121) has at least one of the following features: widened portions of the signal conductors (13, 15) at the ends (110, 120) of the conductor rail assemblies (11, 12); dielectric (122); Conductive bridge (123); A reduced spacing between a ground conductor (14) and a signal conductor (13) at ends (110, 120) of the conductor rail assembly (11, 12).

2. The base (1) according to claim 1, characterized by at least one of the following features: - the widened portion of the signal conductor (13, 15) is trapezoidal, - the signal conductors (13, 15) are widened by at least a factor of 1.5, - the width of the spacing (17) between the ground conductor (14) and the signal conductor (13, 15) in the region of the widening portion varies by a maximum factor of 1.5, wherein the width is measured perpendicular to the signal conductor (13, 15), - The impedance increase in the region between the capacitive structural elements (111, 121) is less than 5 Ohm.

3. The base (1) according to claim 1 or 2, characterized in that: At least one of the conductor track assemblies (11, 12) is configured as a coplanar waveguide.

4. The base (1) according to claim 1 or 2, characterized in that: The two ends (110, 120) of the conductor rail assembly (11, 12) have capacitive structural elements (111, 121), wherein the base has at least one of the following features: - the ratio of the capacitances of the structural elements (111, 121) has a value in the range of 0.5 to 2; - the impedance of the assembly having the capacitive structural element (111, 121) and at least one wire bond (22) arranged at both ends (110, 120) of the conductor rail assembly (11, 12) has a value in the range of 20 Ohm to 80 Ohm; - The ratio L1 / (C1+C2) has a resistance of 1000 Ohm 2 Up to 5000 Ohm 2 , wherein C1 and C2 represent the capacitance of the capacitive structural element (111, 121) and L1 represents the inductance of the at least one bonding wire connection (22).

5. The base (1) according to claim 1 or 2, characterized in that: The electronic component (2) is fixed on a mounting base (25), which has a second conductor rail assembly (12).

6. The base (1) according to claim 1 or 2, characterized in that The base has a platform (9) on which a first conductor rail arrangement (11) is arranged, wherein the platform (9) is separated from a support (18) for the electronic component (2) by a gap (20).

7. The base (1) according to claim 6, characterized in that The first conductor rail assembly (11) is arranged on a circuit board (26), and the circuit board is fixed on the platform (9).

8. The base (1) according to claim 7, characterized by at least one of the following features: - a back electrode (141) in the form of a conductive layer is arranged on a side of the printed circuit board (26) opposite the first conductor track assembly (11), wherein at least one ground conductor (14) of the conductor track assembly (11) is connected to the back electrode (141) via at least one conductive connection, - the at least one ground conductor (14) is electrically connected to the platform (9), - the direction of the signal conductor (13) of the conductor rail assembly (11) changes by at least 45° from the direction of the feed-through conductor (8) connected to the signal conductor in a direction collinear with the feed-through conductor (8) in the direction of the electronic component (2), The printed circuit board (26) has two opposite end edges and two adjacent opposite side edges (261, 262), wherein one of the end edges points toward the base body (3), and wherein the gap (20) is formed at one of the side edges (261, 262).

9. The base (1) according to claim 7, characterized in that A backside electrode (141) in the form of a conductive layer is arranged on a side of the printed circuit board (26) opposite the first conductor track assembly (11), wherein at least one ground conductor (14) of the conductor track assembly (11) is connected to the backside electrode (141) via a plurality of conductive connections.

10. The base (1) according to claim 1 or 2, characterized in that The electronic component (2) is a photoelectric converter in the form of a laser diode.

11. The base (1) according to claim 1 or 2, characterized by at least one of the following features: - when viewed in the direction opposite to the signal line, at least one ground conductor (14) of the conductor rail assembly (11) extends beyond the center point of the solder connection (30) of the feed-through conductor (8) to the signal line (13), - the width of the gap (20) is at least 0.1 mm, - the distance between the opposite conductor rails to be connected of the two conductor rail assemblies (11, 12) is at least 0.12 mm, - the length of the welding wire of the welding wire connector (22) is at least 0.2 mm, - The inductance of the at least one bond wire connection has a value in the range of 50 pH to 800 pH.

12. An electronic component (10) comprising a housing (5) and a base (1) according to any one of the preceding claims.

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