processing device

Abstract

Provided is a processing device capable of quickly confirming a part of an automatic operation of the processing device and a result of the operation. The processing device includes a selection unit that selects two or more constituent elements from among a plurality of constituent elements including a holding unit, a processing unit, a robot unit, a temporary placement unit, a carrying-in unit, a cleaning unit, and a carrying-out unit, and a control unit that processes a workpiece using a part of a path corresponding to the constituent elements selected by the selection unit among paths through which the workpiece passes when the workpiece is processed automatically using the plurality of constituent elements.

Description

TECHNICAL FIELD

[0001] The present application relates to a processing apparatus. BACKGROUND

[0002] As disclosed in Patent Literature 1, a processing apparatus for processing a workpiece automatically includes, for example, at least a chuck table that holds a workpiece, a processing unit that processes the workpiece using a processing tool, a carrying-in unit that carries the workpiece to the chuck table, a cassette placement table for placing a cassette in which workpieces are stored in a shelf shape, a cleaning unit that cleans the workpiece, a carrying-out unit that carries the workpiece held on the chuck table to the cleaning unit, and a touch panel for inputting a processing condition of the processing apparatus and displaying a processing state.

[0003] In such a processing apparatus, when automatic operation is started, the workpiece is taken out of the cassette by a robot and carried to the chuck table by the carrying-in unit. The workpiece held on the chuck table is processed by the processing unit. After that, the workpiece is carried to the cleaning unit by the carrying-out unit, cleaned by the cleaning unit, and stored in the cassette by the robot.

[0004] Patent Literature 1: Japanese Patent Application Publication No. 2018-122421

[0005] In addition, when the workpiece is processed based on a processing condition used for the first time, it is desirable to confirm the processing result as soon as possible. In addition, in a case where a carrying pad of the carrying-in unit and the carrying-out unit or a mechanical hand of the robot is replaced, it is desirable to confirm that the workpiece can be carried normally as soon as possible.

[0006] However, when a series of automatic operations are performed, time is required until the processing result or the carrying state can be confirmed. SUMMARY

[0007] Therefore, an object of the present application is to provide a processing apparatus capable of quickly confirming a part of the automatic operation and a result of the operation.

[0008] According to one aspect of the present application, there is provided a processing apparatus which automatically processes a workpiece, the processing apparatus including: a holding unit which holds the workpiece; a processing unit which processes the workpiece using a processing tool; a cassette placement table unit which places a cassette which stores a plurality of workpieces; a robot unit which takes out the workpiece from the cassette or stores the workpiece in the cassette; a temporary placement unit which temporarily places the workpiece taken out from the cassette; a carrying-in unit which carries the workpiece temporarily placed in the temporary placement unit into the holding unit; a cleaning unit which cleans the workpiece; a carrying-out unit which carries the workpiece held in the holding unit to the cleaning unit; a selection unit which selects two or more units from among a plurality of units including the holding unit, the processing unit, the robot unit, the temporary placement unit, the carrying-in unit, the cleaning unit, and the carrying-out unit; and a control unit which processes the workpiece using a part of a path through which the workpiece passes when the workpiece is automatically processed using the plurality of units, the part of the path corresponding to the units selected by the selection unit.

[0009] Preferably, the processing apparatus further includes a touch panel which displays a configuration diagram which shows a configuration when the plurality of units are viewed from above by a plurality of illustrations respectively corresponding to the plurality of units, and the selection unit selects the units corresponding to the illustrations touched in the configuration diagram displayed on the touch panel.

[0010] In the processing apparatus according to one aspect of the present application, only a part of the processing performed on the workpiece related to the units selected by the operator can be selectively performed. That is, only the processing to be confirmed can be performed, and thus the confirmation time of the operator can be shortened. BRIEF DESCRIPTION OF DRAWINGS

[0011] Figure 1 is a perspective view showing the configuration of the processing apparatus.

[0012] Figure 2 is an explanatory view showing a display example of the touch panel.

[0013] Figure 3 is an explanatory view showing an example of a configuration diagram showing the units selected by the operator.

[0014] Figure 4 is an explanatory view showing another example of a configuration diagram showing the units selected by the operator.

[0015] Figure 5 is an explanatory view showing still another example of a configuration diagram showing the units selected by the operator.

[0016] BRIEF DESCRIPTION OF DRAWINGS

[0017] 100: wafer; 101: front surface; 104: back surface; 105: protective tape; 1: processing apparatus; 10: first apparatus base; 11: second apparatus base; 12: first column; 13: second column; 15: housing; 20: rough grinding feed unit; 21: fine grinding feed unit; 30: rough grinding unit; 31: fine grinding unit; 5: chuck table; 50: holding surface; 6: rotary table; 51: first height gauge; 52: second height gauge; 60: touch panel; 70: control unit; 72: selection unit; 152: temporary placement unit; 155: robot; 156: cleaning unit; 160: first cassette placement table; 161: first cassette; 162: second cassette placement table; 163: second cassette; 170: carrying-in unit; 172: carrying-out unit; 500: arrangement diagram; 501 to 510: arrow; 600: apparatus state display column. DETAILED DESCRIPTION

[0018] Hereinafter, an embodiment of the present application will be described in detail with reference to the drawings. Figure 1 The processing apparatus 1 shown has a rough grinding unit 30 and a fine grinding unit 31, and the wafer 100 held on any one of the chuck tables 5 is ground by the rough grinding unit 30 and the fine grinding unit 31.

[0019] Figure 1 The wafer 100 shown is an example of a workpiece, and is a circular semiconductor wafer, for example. A device not shown is formed on the front surface 101 of the wafer 100. The front surface 101 of the wafer 100 is oriented downward in the Z direction in the middle, and is protected by the protective tape 105. The back surface 104 of the wafer 100 becomes a processed surface on which grinding processing is performed. Figure 1

[0020] The processing apparatus 1 has a first apparatus base 10 and a second apparatus base 11 arranged at the rear (+Y direction side) of the first apparatus base 10. The first apparatus base 10 becomes a carrying-in and carrying-out area 401 in which the wafer W is carried in and carried out, and the like. The second apparatus base 11 becomes a processing area 402. In this processing area 402, the wafer 100 held on the chuck table 5 is processed by the rough grinding unit 30 or the fine grinding unit 31.

[0021] The first cassette placement table 160 and the second cassette placement table 162, which are examples of cassette placement unit, are provided on the front surface side (-Y direction side) of the first apparatus base 10. The first cassette (unloading cassette) 161 in which the wafer 100 before processing is stored is placed on the first cassette placement table 160. The second cassette (loading cassette) 163 in which the wafer 100 after processing is stored is placed on the second cassette placement table 162.

[0022] ​Box 161 and Box 263 have multiple shelves inside, and each shelf holds one chip 100. That is, Box 161 and Box 263 are configured as shelves to hold multiple chips 100.

[0023] The openings (not shown) of the first box 161 and the second box 163 face the +Y direction. A robot 155, as an example of a robot unit, is disposed on the +Y direction side of these openings. The robot 155 has a holding surface for holding the wafer 100. The robot 155 moves (stores) the processed wafer 100 into the second box 163. Furthermore, the robot 155 removes the unprocessed wafer 100 from the first box 161 and places it on the temporary placement worktable 154 of the temporary placement unit 152.

[0024] Temporary placement unit 152 is used to temporarily place the wafer 100 taken from the first box 161 and is located adjacent to the robot 155. Temporary placement unit 152 has a temporary placement stage 154 and an alignment unit 153. Alignment unit 153 has a plurality of alignment pins arranged on the outside of the temporary placement stage 154 and a slider that moves the alignment pins radially along the temporary placement stage 154. By moving the alignment pins radially toward the center of the temporary placement stage 154, the diameter of the circle connecting the plurality of alignment pins is reduced, so that the wafer 100 placed on the temporary placement stage 154 with its back side 104 facing upward is aligned (centered) in a predetermined position.

[0025] A loading unit 170 is provided adjacent to the temporary placement unit 152. The loading unit 170 loads the wafer 100, which is temporarily placed on the temporary placement unit 152, onto the chuck stage 5. The loading unit 170 has a suction pad (transfer pad) 171, which has a suction surface for attracting and holding the back side 104 of the wafer 100. The loading unit 170 attracts and holds the wafer 100, which is temporarily placed on the temporary placement stage 154, through the suction pad 171, and loads it onto the holding surface 50 of the chuck stage 5 located near the temporary placement unit 152 within the processing area 402.

[0026] The chuck stage 5 is an example of a holding unit for holding the wafer 100, and it has a holding surface 50 for attracting and holding the wafer 100. The holding surface 50 is in communication with an attraction source (not shown) and can attract and hold the wafer 100 via a protective band 105. The chuck stage 5 is capable of rotating about a central axis that passes through the center of the holding surface 50 and extends in the Z-axis direction while the wafer 100 is attracted and held by the holding surface 50.

[0027] In this embodiment, three chuck worktables 5 are equally spaced on the upper surface of the rotary worktable 6 mounted on the second device base 11, arranged in a circle centered on the center of the rotary worktable 6. A rotation axis (not shown) for rotating the rotary worktable 6 is located at the center of the rotary worktable 6. The rotary worktable 6 can rotate about an axis extending in the Z-axis direction via this rotation axis. As the rotary worktable 6 rotates, the three chuck worktables 5 revolve around it. Thus, the chuck worktables 5 can be sequentially positioned near the temporary placement unit 152, below the rough grinding unit 30, and below the fine grinding unit 31.

[0028] A first post 12 is erected at the rear (+Y direction side) of the second device base 11. A rough grinding unit 30 for rough grinding the wafer 100 and a rough grinding feed unit 20 for grinding the rough grinding unit 30 are provided on the front surface of the first post 12. The rough grinding unit 30 is an example of a processing unit that processes the wafer 100 using a processing tool.

[0029] The rough grinding feed unit 20 has a pair of guide rails 201 parallel to the Z-axis direction, a lifting worktable 203 sliding on the guide rails 201, a ball screw 200 parallel to the guide rails 201, a motor 202 that drives the ball screw 200 to rotate, and a bracket 204 mounted on the front surface (front) of the lifting worktable 203. The bracket 204 holds the rough grinding unit 30.

[0030] The lifting worktable 203 is slidably mounted on the guide rail 201. A nut (not shown) is fixed to the rear surface (back side) of the lifting worktable 203. A ball screw 200 is screwed into this nut. The motor 202 is connected to one end of the ball screw 200.

[0031] In the rough grinding feed unit 20, the ball screw 200 is rotated by the motor 202, and the lifting table 203 moves along the guide rail 201 in the Z-axis direction. Consequently, the bracket 204 mounted on the lifting table 203 and the rough grinding unit 30 held on the bracket 204 also move together with the lifting table 203 in the Z-axis direction. Thus, the rough grinding feed unit 20 causes the rough grinding unit 30 to perform grinding feed along the Z-axis direction.

[0032] The rough grinding unit 30 includes: a spindle housing 301 fixed to a bracket 204; a spindle 300 rotatably held in the spindle housing 301; a motor 302 that drives the spindle 300 to rotate; a wheel mounting base 303 mounted on the lower end of the spindle 300; and a grinding wheel 304 detachably connected to the lower surface of the wheel mounting base 303.

[0033] The spindle housing 301 is held in the bracket 204 in a manner that extends along the Z-axis. The spindle 300 extends along the Z-axis in a manner that is perpendicular to the holding surface 50 of the chuck table 5 and is rotatably supported in the spindle housing 301.

[0034] The motor 302 is connected to the upper end of the spindle 300. The spindle 300 rotates about a rotation axis extending along the Z-axis via the motor 302.

[0035] The wheel mounting base 303 is formed in the shape of a circular plate, which is fixed to the lower end (front end) of the spindle 300 and rotates as the spindle 300 rotates. The wheel mounting base 303 supports the grinding wheel 304.

[0036] The grinding wheel 304 is formed to have a diameter approximately the same as that of the wheel mounting base 303. The grinding wheel 304 includes an annular wheel base (ring base) 305 formed of a metal material such as aluminum alloy. Multiple rough grinding tools 306, approximately cuboid in shape, are arranged and fixed in a ring around the lower surface of the wheel base 305. The rough grinding tools 306 rotate due to the rotation of the spindle 300, thereby grinding the back surface 104 of the wafer 100 held on the chuck table 5. The rough grinding tools 306 are an example of machining tools and contain relatively large abrasive grains.

[0037] A grinding water flow path extending along the Z-axis is formed inside the spindle 300. A grinding water supply unit (not shown) is connected to this grinding water flow path. Grinding water supplied from the grinding water supply unit to the spindle 300 is sprayed downwards from the opening at the lower end of the grinding water flow path toward the rough grinding tool 306 and reaches the contact area between the rough grinding tool 306 and the wafer 100.

[0038] A first height gauge 51 is provided adjacent to the chuck stage 5 located below the rough grinding unit 30. The first height gauge 51 measures the thickness of the wafer 100, for example, during rough grinding, either in a contact or non-contact manner.

[0039] Furthermore, a second post 13 is erected adjacent to the first post 12 along the X-axis direction at the rear of the second device base 11. A fine grinding unit 31 for fine grinding the wafer 100 and a fine grinding feed unit 21 for feeding the fine grinding unit 31 are disposed on the front surface of the second post 13. The fine grinding unit 31 is an example of a processing unit that processes the wafer 100 using a processing tool.

[0040] The fine grinding feed unit 21 has the same structure as the rough grinding feed unit 20, enabling the fine grinding unit 31 to perform grinding feed along the Z-axis direction. The fine grinding unit 31 has a fine grinding wheel 307 instead of the rough grinding wheel 306, but otherwise has the same structure as the rough grinding unit 30. The fine grinding wheel 307 is an example of a machining tool, containing relatively small abrasive grains.

[0041] A second height gauge 52 is provided adjacent to the chuck stage 5 located below the fine grinding unit 31. The second height gauge 52 measures the thickness of the wafer 100, for example, during fine grinding, either in a contact or non-contact manner.

[0042] The precision-ground wafer 100 is removed by the transfer unit 172. The transfer unit 172 transfers the wafer 100 held on the chuck table 5 to the cleaning unit 156.

[0043] The take-out unit 172 has a suction pad (transfer pad) 173, which has a suction surface for attracting and holding the back side 104 of the wafer 100. The take-out unit 172 uses the suction pad 173 to attract and hold the back side 104 of the finely ground wafer 100 placed on the chuck table 5. Then, the take-out unit 172 removes the wafer 100 from the chuck table 5 and transfers it to the rotary table 157 of the single-sheet cleaning unit 156.

[0044] The cleaning unit 156 is a rotary cleaning unit for cleaning the wafer 100. The cleaning unit 156 has a rotary stage 157 for holding the wafer 100 and nozzles 158 for spraying cleaning water and drying air toward the rotary stage 157.

[0045] In the cleaning unit 156, the rotary table 157 of the wafer 100 is kept rotating, and cleaning water is sprayed toward the back surface 104 of the wafer 100, which is then rotated and cleaned. Then, dry air is blown onto the wafer 100 to dry it.

[0046] After being cleaned by the cleaning unit 156, the wafer 100 is moved by the robot 155 into the second box 163 on the second box placement stage 162.

[0047] Furthermore, the processing apparatus 1 has a housing 15 covering the first apparatus base 10 and the second apparatus base 11. A touch panel 60 is provided on the side of the housing 15. Various information, such as processing conditions, related to the processing apparatus 1 is displayed on the touch panel 60. In addition, the touch panel 60 is also used to set various information, such as processing conditions. Thus, the touch panel 60 functions as an input unit for inputting information and also as a display unit for displaying information.

[0048] Furthermore, the processing apparatus 1 has a control unit 70 inside. The control unit 70 has a CPU that performs calculations according to a control program and a storage medium such as a memory. The control unit 70 performs various processes and provides unified control over all components of the processing apparatus 1. In addition, the control unit 70 has a selection unit 72.

[0049] The functions of the control unit 70 and the selection unit 72, as well as the operation of the processing device 1, will be explained below.

[0050] In the processing apparatus 1 of this embodiment, the wafer 100 can be processed automatically using the above-mentioned multiple constituent elements (units, components).

[0051] That is, the control unit 70 can automatically perform the following actions: using robot 155 to take wafer 100 out of the first box 161 and transfer it to temporary placement unit 152; using transfer unit 170 to transfer wafer 100 into chuck table 5; using rough grinding unit 30 and fine grinding unit 31 to grind wafer 100; using transfer unit 172 to transfer wafer 100 to cleaning unit 156; using cleaning unit 156 to clean wafer 100; and using robot 155 to store the cleaned wafer 100 into second box 163.

[0052] Furthermore, in the processing apparatus 1, it is possible to selectively perform only a portion of the processing of each of the aforementioned components according to the operator's requirements. That is, the wafer 100 can be processed using only a portion of the path that corresponds to the selected component in the path that the wafer 100 takes when processing the wafer 100 fully automatically using multiple components.

[0053] like Figure 2 As shown, on the left side of the touch panel 60 of the processing device 1, there is a message display bar 400 for displaying messages to the operator and a device status display bar 600 for indicating the set status (device status) of the processing device 1.

[0054] The device status display bar 600 shows the type of chuck worktable 5 used, the selected box (1 or 2) and slot (1 to 25) in the first box (unloading box) 161, and the selected box (1 or 2) and slot (1 to 25) in the second box (loading box) 163.

[0055] In addition, the device status display bar 600 shows the usage status (used or unused) of the temporary placement unit 152, the loading unit 170, the unloading unit 172, the holding surface cleaning unit, and the cleaning unit 156, as well as the status (used, unused, or confirmed) of the rough grinding unit 30 and the fine grinding unit 31. The holding surface cleaning unit cleans the holding surface 50 of the chuck table 5.

[0056] Additionally, a configuration diagram 500 showing illustrations of each component (unit) is displayed on the right side of the touch panel 60. This configuration diagram 500 is a diagram showing the configuration of each component as viewed from above from the top of the processing apparatus 1.

[0057] In addition, Figure 2 In the configuration diagram 500 shown, the names of each component are recorded in the illustrations of each component and labeled with parentheses. Figure 1 The labels shown.

[0058] Additionally, configuration diagram 500 shows information related to the wafer 100 (number of wafers removed, number of wafers placed, and number of wafers stored) in the first bin 161 on the first bin stage 160 and the second bin 163 on the second bin stage 162. Furthermore, the measurement results of the thickness of the wafer 100 measured by the first height gauge 51 and the second height gauge 52 can also be shown.

[0059] Additionally, in configuration diagram 500, arrows 501 to 510 are shown between the illustrations of the various components. These arrows 501 to 510 correspond to a portion of the entire path (processing path) related to the processing of the wafer 100 that connects the various components. For example, arrow 501 corresponds to a portion of the path from the first tray stage 160 (first tray 161) to the robot 155, that is, the portion of the path related to the robot 155 removing (unloading) the wafer 100.

[0060] Furthermore, in this embodiment, the operator touches an illustration of at least two constituent elements in the configuration diagram 500 shown on the touch panel 60. Upon receiving this touch, the selection unit 72 of the control unit 70 selects at least two constituent elements corresponding to the touched illustration.

[0061] Next, the control unit 70 uses the configuration diagram 500 to indicate at least two selected components and a portion of the processing paths (partial paths) through these components. Furthermore, the control unit 70 processes the wafer 100 using the selected components in the partial paths associated with those components, according to the operator's instructions.

[0062] For example, in Figure 3 In the example shown, the operator wants to implement the following processes (1-1) to (1-5).

[0063] (1-1) The chip 100 is moved from the first box 161 of the first box placement stage 160 to the temporary placement unit 152.

[0064] (1-2) The wafer 100 is moved from the temporary placement unit 152 to the chuck stage 5 via the transfer unit 170.

[0065] (1-3) The wafer 100 held on the chuck table 5 is rough ground by the rough grinding unit 30.

[0066] (1-4) The coarsely ground wafer 100 is moved to the cleaning unit 156 by the moving unit 172.

[0067] (1-5) The process ends by cleaning the wafer 100 through the cleaning unit 156.

[0068] In this scenario, the operator touches the illustrations of the right side of robot 155, temporary placement unit 152, loading unit 170, chuck table 5, rough grinding unit 30, unloading unit 172, and cleaning unit 156 in configuration diagram 500. Upon receiving this instruction, selection unit 72 of control unit 70 selects robot 155, temporary placement unit 152, loading unit 170, chuck table 5, rough grinding unit 30, unloading unit 172, and cleaning unit 156.

[0069] Furthermore, in this embodiment, the illustration of robot 155 is divided into a right side and a left side, allowing the operator to touch either side or both. By touching the right side of the illustration of robot 155, the operator can select the process of robot 155 retrieving wafer 100 from the first tray 161 on the first tray placement stage 160. On the other hand, by touching the left side of the illustration of robot 155, the operator can select the process of robot 155 storing wafer 100 in the second tray 163 on the second tray placement stage 162.

[0070] Furthermore, in the configuration diagram 500, the control unit 70 applies shading (e.g., dotted shading) to the illustrations of the robot 155, temporary placement unit 152, loading unit 170, chuck table 5, rough grinding unit 30, unloading unit 172, and cleaning unit 156, which are selected components, and uses white to represent the illustrations of other unselected components. Additionally, in this example, for the robot 155, the control unit 70 only applies shading to the right side of the illustration.

[0071] Next, the control unit 70 determines the partial path traversed by the chip 100 based on the selected constituent elements, and applies shading (e.g., diagonal shading) to the arrows representing the determined partial path, while using white to represent other arrows. In this example, shading is applied to arrows 501, 502, 503, 504, 506, 507, and 508.

[0072] Then, the control unit 70 performs the processes shown in (1-1) to (1-5), for example, according to the start instruction issued by the operator using the touch panel 60.

[0073] Furthermore, in Figure 4 In the example shown, the operator wants to implement the following processes (2-1) to (2-6).

[0074] (2-1) The chip 100 is placed on the temporary placement unit 152 to begin.

[0075] (2-2) The wafer 100 is moved from the temporary placement unit 152 to the chuck stage 5 via the transfer unit 170.

[0076] (2-3) The wafer 100 held on the chuck table 5 is rough ground by the rough grinding unit 30.

[0077] (2-4) The wafer 100 after rough grinding is finely ground by the fine grinding unit 31.

[0078] (2-5) The finely ground wafer 100 is moved to the cleaning unit 156 by the moving unit 172.

[0079] (2-6) The process ends by cleaning the wafer 100 through the cleaning unit 156.

[0080] In this case, the operator touches the illustrations of the temporary placement unit 152, the loading unit 170, the chuck table 5, the rough grinding unit 30, the fine grinding unit 31, the unloading unit 172, and the cleaning unit 156 in the configuration diagram 500. Upon receiving this instruction, the selection unit 72 of the control unit 70 selects the temporary placement unit 152, the loading unit 170, the chuck table 5, the rough grinding unit 30, the fine grinding unit 31, the unloading unit 172, and the cleaning unit 156.

[0081] Then, the control unit 70 shades the illustrations of the temporary placement unit 152, the loading unit 170, the chuck table 5, the rough grinding unit 30, the fine grinding unit 31, the unloading unit 172, and the cleaning unit 156, which are the selected components, and uses white to indicate the illustrations of other components that were not selected.

[0082] Next, the control unit 70 determines a portion of the path traversed by the chip 100 based on the selected constituent elements, and shades the arrows representing the determined portion of the path, while using white to represent other arrows. In this example, arrows 503, 504, 505, 506, 507, and 508 are shaded.

[0083] Then, as shown in (2-1), the operator places the chip 100 on the temporary placement unit 152. The operator then, for example, uses the touch panel 60 to issue a start instruction to the control unit 70. As a result, the control unit 70 performs the processes shown in (2-2) to (2-6).

[0084] Next, in Figure 5 In the example shown, the operator wants to implement the following processes (3-1) to (3-7).

[0085] (3-1) Start by holding the chip 100 on the chuck stage 5.

[0086] (3-2) The wafer 100 held on the chuck table 5 is rough ground by the rough grinding unit 30.

[0087] (3-3) In order to confirm the ground surface 104 of the rough-ground wafer 100, the chuck stage 5 holding the wafer 100 is moved to the front of the device (near the loading unit 170).

[0088] (3-4) After the operator selected to stop based on the confirmation result, only rough grinding was performed and the process ended. No cleaning was performed. After the operator selected to continue, the wafer 100 after rough grinding was finely ground by the fine grinding unit 31.

[0089] (3-5) The finely ground wafer 100 is moved to the cleaning unit 156 by the moving unit 172.

[0090] (3-6) The wafer 100 is cleaned by the cleaning unit 156.

[0091] (3-7) The cleaned wafer 100 is collected into the second box 163 of the second box placement stage 162 by the robot 155.

[0092] In this configuration, the operator touches the illustration on the left side of the chuck table 5, rough grinding unit 30, fine grinding unit 31, transfer unit 172, cleaning unit 156, and robot 155 in the configuration diagram 500. Upon receiving this instruction, the selection unit 72 of the control unit 70 selects the chuck table 5, rough grinding unit 30, fine grinding unit 31, transfer unit 172, cleaning unit 156, and robot 155.

[0093] Then, the control unit 70 applies shading to the illustrations of the chuck table 5, rough grinding unit 30, fine grinding unit 31, transfer unit 172, cleaning unit 156, and robot 155, which are the selected components, and uses white to represent the illustrations of other unselected components. Additionally, in this example, for robot 155, the control unit 70 only applies shading to the left side of the illustration.

[0094] Next, the control unit 70 determines a portion of the path traversed by the chip 100 based on the selected constituent elements, and shades the arrows representing the determined portion of the path, while using white to represent the other arrows. In this example, arrows 505, 506, 507, 508, 509, and 510 are shaded.

[0095] Then, as shown in (3-1), the operator holds the wafer 100 on the chuck stage 5. Afterwards, the operator, for example, uses the touch panel 60 to issue a start instruction to the control unit 70. The control unit 70 then performs the processes shown in (3-2) to (3-7).

[0096] In addition, in this example, as shown in (3-3), in order to confirm the back side 104 of the ground surface of the wafer 100 after rough grinding, the chuck stage 5 holding the wafer 100 is moved forward of the device (near the loading unit 170).

[0097] Therefore, the operator touches the illustration of the rough grinding unit 30 in the configuration diagram 500 in a predetermined manner for instructing the control unit 70 to perform the action. For example, the operator touches the illustration of the rough grinding unit 30 in the configuration diagram 500 in a manner different from touching the illustrations of other selected components (e.g., long press or double press).

[0098] Upon receiving this instruction, the control unit 70 applies a profile line of a different shape (e.g., mesh-like) to the rough grinding unit 30, which is different from the profile of other selected components, and performs a process to move the chuck table 5 forward after rough grinding, as shown in (3-3). Then, after the operator confirms the ground surface, the control unit 70 ends the process or performs the processes shown in (3-4) to (3-7) according to the operator's instructions.

[0099] As described above, in this embodiment, it is possible to selectively perform only a portion of the processing performed on the wafer 100 that relates to the components selected by the operator within the processing apparatus 1. Therefore, the operator can perform only the processing they wish to verify, thus shortening the verification time.

[0100] For example, in use Figure 4 In the example described, the processing result of the newly generated processing conditions can be confirmed in a short time. That is, since the actions of moving the wafer 100 out of the first box 161 and storing the wafer 100 in the second box 163 can be eliminated, the time for confirming the processing result can be shortened.

[0101] Furthermore, for example, by placing the wafer 100 in the temporary placement unit 152 and touching the illustrations of the temporary placement unit 152, the loading unit 170, and the chuck table 5 in the configuration diagram 500, and issuing a start instruction to the control unit 70, the operator can confirm the loading action of loading only the wafer 100 into the chuck table 5 in a short time.

[0102] Furthermore, in this embodiment, when an operator touches an illustration of at least two constituent elements (units) in the configuration diagram 500 shown on the touch panel 60, the selection unit 72 of the control unit 70 selects at least two constituent elements corresponding to the touched illustration. At this time, for Figure 2 The components shown in the device status display bar 600, which indicates the status of the processing device 1 (device status), that are set to "unused" can also be set to be unselectable.

[0103] In addition, the selected at least two components can be consecutive in a pre-defined path.

Claims

1. A processing apparatus that automatically processes a workpiece along a processing path, wherein, The processing device has the following features: A holding unit that holds the workpiece. A processing unit that uses processing tools to process a workpiece; A box-mounted platform unit for holding shelf-shaped boxes for storing multiple workpieces; A robot unit that retrieves the workpiece from the box or stores the workpiece in the box; A temporary placement unit for temporarily placing the workpiece removed from the box; The receiving unit moves the workpiece temporarily placed in the temporary placement unit into the holding unit; A cleaning unit that cleans the workpiece; as well as The transfer unit moves the workpiece held in the holding unit to the cleaning unit. The processing path involves using a robotic unit to remove the workpiece from the box and transport it to the temporary placement unit, using an infeed unit to move the workpiece into the holding unit, using a processing unit to process the workpiece, using an outfeed unit to move the workpiece to the cleaning unit, using the cleaning unit to clean the workpiece, and using the robotic unit to store the cleaned workpiece back into the box, thus allowing the workpiece to pass through the paths of each component. The processing apparatus also includes a selection unit that selects two or more constituent elements from a plurality of constituent elements, including the holding unit, the processing unit, the robot unit, the temporary placement unit, the loading unit, the cleaning unit, and the unloading unit. as well as The control unit processes the workpiece in a partial path using two or more components selected by the selection unit. The partial path is a part of the processing path corresponding to the two or more components selected by the selection unit.

2. The processing apparatus according to claim 1, wherein, The processing apparatus also has a touch panel that displays a configuration diagram. This diagram uses multiple illustrations corresponding to the various constituent elements to represent the configuration of the constituent elements when viewed from above. The selection unit selects the constituent element corresponding to the illustration touched in the configuration diagram displayed on the touch panel. The control unit uses the configuration diagram to display this part of the path.

Images