Configurable heat sink

Abstract

The present invention discloses a configurable heat sink, and specifically discloses an apparatus, system and technology for cooling a computer processor. In at least one embodiment, the system includes one or more processors and a heat sink connected to the one or more processors through a flexible heat pipe, and the position of the heat sink is adjustable.

Description

Technical Field

[0001] At least one embodiment is directed to a heat sink for cooling one or more processors. For example, at least one embodiment is directed to a heat sink for cooling one or more graphics processing units. Background Art

[0002] Computer processors generate a lot of heat. The efficiency of the technology used to cool computer processors can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] Figure 1 A configurable heat sink assembly having a loop thermosyphon is shown according to at least one embodiment;

[0004] Figure 2 A configurable heat sink assembly according to at least one embodiment is shown;

[0005] Figure 3 A system including two or more configurable heat sink assemblies according to at least one embodiment is shown;

[0006] Figure 4 A system including two or more angularly configurable heat sink assemblies according to at least one embodiment is shown;

[0007] Figure 5 An example of a graphics processing unit having an adjustable heat sink is shown in accordance with at least one embodiment;

[0008] Figure 6 A heat sink assembly having a multi-position support according to at least one embodiment is shown;

[0009] Figure 7 An exemplary process for configuring a heat sink assembly according to at least one embodiment is shown;

[0010] Figure 8 illustrates an exemplary data center in accordance with at least one embodiment;

[0011] Fig. 9 A processing system according to at least one embodiment is shown;

[0012] Fig.10 A computer system according to at least one embodiment is shown;

[0013] Fig.11 A system according to at least one embodiment is shown;

[0014] Fig.12 An exemplary integrated circuit according to at least one embodiment is shown;

[0015] Fig.13A computing system according to at least one embodiment is shown;

[0016] Fig.14 An APU is shown according to at least one embodiment;

[0017] Fig.15 A CPU according to at least one embodiment is shown;

[0018] Fig.16 An exemplary accelerator integrated slice is shown in accordance with at least one embodiment;

[0019] Fig.17A and Fig. 17B An exemplary graphics processor is shown in accordance with at least one embodiment;

[0020] Fig.18A illustrates a graphics core according to at least one embodiment;

[0021] Fig.18B A GPGPU is shown according to at least one embodiment;

[0022] Fig.19A illustrates a parallel processor according to at least one embodiment;

[0023] Fig.19B illustrates a processing cluster according to at least one embodiment;

[0024] Fig.19C A graphics multiprocessor is shown in accordance with at least one embodiment;

[0025] Fig. 20 A graphics processor according to at least one embodiment is shown;

[0026] Fig.21 A processor according to at least one embodiment is shown;

[0027] Fig. 22 A processor according to at least one embodiment is shown;

[0028] Fig.23 illustrates a graphics processor core according to at least one embodiment;

[0029] Fig.24 illustrates a PPU according to at least one embodiment;

[0030] Fig.25 shows a GPC according to at least one embodiment;

[0031] Fig.26 A streaming multiprocessor is shown according to at least one embodiment;

[0032] Fig. 27A software stack for a programming platform according to at least one embodiment is shown;

[0033] Fig.28 According to at least one embodiment, Fig. 27 CUDA implementation of the software stack;

[0034] Fig.29 According to at least one embodiment, Fig. 27 ROCm implementation of the software stack;

[0035] Fig.30 According to at least one embodiment, Fig. 27 OpenCL implementation of the software stack;

[0036] Fig.31 illustrates software supported by a programming platform according to at least one embodiment;

[0037] Fig.32 According to at least one embodiment, Figure 27-30 Compiled code executed on the programming platform;

[0038] Fig.33 According to at least one embodiment, Figure 27-30 More detailed compiled code executed on the programming platform;

[0039] Fig.34 Transforming source code prior to compiling the source code according to at least one embodiment is shown;

[0040] Fig.35A A system configured to compile and execute CUDA source code using different types of processing units according to at least one embodiment is shown;

[0041] Fig.35B A method configured to compile and execute using a CPU and a CUDA-enabled GPU according to at least one embodiment is shown. Fig.35A CUDA source code system;

[0042] Fig.35C A method configured to compile and execute using a CPU and a non-CUDA enabled GPU according to at least one embodiment is shown. Fig.35A CUDA source code system;

[0043] Fig.36 According to at least one embodiment, Fig.35C An example kernel converted by the CUDA to HIP conversion tool;

[0044] Fig.37 In more detail, the Fig.35CA non-CUDA-enabled GPU; and

[0045] Fig.38 shows how threads of an exemplary CUDA grid are mapped to Fig.37 different computing units. DETAILED DESCRIPTION

[0046] Figure 1 A configurable heat sink assembly with a loop thermosyphon is shown according to at least one embodiment. In at least one embodiment, the heat sink assembly 100 is attached to one or more processors 106 to dissipate heat generated by the one or more processors 106. In at least one embodiment, the heat sink assembly 100 includes a heat sink 102 whose position is adjustable. In at least one embodiment, the adjustment improves the airflow to the heat sink 102, thereby increasing heat dissipation. In at least one embodiment, the adjustment improves the airflow to another heat sink other than the heat sink 102, which is mounted in a shared chassis with the heat sink 102. In at least one embodiment, the improvement in airflow includes one or more of the following: increasing airflow pressure, increasing airflow velocity, reducing preheating of air by other components, and increasing utilization of airflow.

[0047] In at least one embodiment, the heat sink 102 comprises a thermally conductive material, such as an aluminum alloy, copper, a copper-tungsten alloy or pseudo-alloy, various other metal alloys, various composite materials, diamond and diamond-based materials, etc. In at least one embodiment, the heat sink 102 is shaped to facilitate efficient heat transfer or heat dissipation. In at least one embodiment, the heat sink 102 includes fins or protrusions to facilitate efficient heat transfer or heat dissipation. In at least one embodiment, the heat sink 102 is a component of a loop siphon system. In at least one embodiment, the heat sink 102 includes a condenser. In at least one embodiment, the heat sink 102 includes a loop siphon condenser. In at least one embodiment, the heat sink 102 includes a heat exchanger. In at least one embodiment, the heat sink 102 includes a radiator.

[0048] In at least one embodiment, the heat sink assembly 100 includes a base 104. In at least one embodiment, the heat sink assembly 100 is attached to the one or more processors 106 via the base 104. In at least one embodiment, the base 104 is attached to the one or more processors 106 using a material that promotes a thermal interface between the base 104 and the one or more processors 106. In at least one embodiment, the thermal interface includes a thermal adhesive, thermal grease, thermal pads, or some other attachment mechanism or promoter that is compatible with or promotes thermal conductivity. In at least one embodiment, the connection or attachment between the heat sink 102 and the one or more processors 106 is a thermal connection such that heat can be transferred from the processor 106 to the heat sink 102.

[0049] In at least one embodiment, the base 104 includes a reservoir 105 for storing a material that can be heated by heat generated by the operation of the one or more processors 106. In at least one embodiment, the material is a liquid, a gas, a vapor, or some combination thereof. In at least one embodiment, the reservoir 105 is an evaporator of a loop siphon system.

[0050] In at least one embodiment, the base 104 is connected to a flexible heat pipe, such as flexible tubes 108a, 108b. In at least one embodiment, the flexible heat pipe (such as flexible tubes 108a, 108b) can be bent, twisted, or otherwise reoriented when attached to the base 104 and the heat sink 102 so that the position of the heat sink 102 can be adjusted. In at least one embodiment, the flexible heat pipe (such as flexible tubes 108a, 108b) has sufficient flexibility to allow the heat sink position to be adjusted within a desired adjustment range.

[0051] In at least one embodiment, the connection between the base 104 and the flexible tubes 108a, 108b is achieved through an outlet on the base 104. In at least one embodiment, the flexible tube 108a transports material (e.g., gas, liquid, vapor, or a combination thereof) from the reservoir 105 of the base 104 to the heat sink 102. In at least one embodiment, the flexible tube 108b is connected to an inlet on the base 104. In at least one embodiment, the flexible tube 108b transports material from the heat sink 102 to the reservoir 105. In at least one embodiment, the operation of one or more processors 104 causes the material in the reservoir 105 to be heated by the heat generated by the operation of the one or more processors 106. The material is transported to the heat sink 102 through the flexible tube 108a, and then the material is cooled. The material is then returned to the base 104 via another flexible tube 108b.

[0052] In at least one embodiment, the flexible tubes 108a, 108b are connected to the radiator 102. In at least one embodiment, the flexible tubes 108a, 108b are connected to respective inlets and outlets of the radiator 102. Material from the flexible tube 108a enters through the inlet, circulates through the radiator 102 and cools, and then returns through the outlet.

[0053] In at least one embodiment, the position of the heat sink 102 is adjustable. In at least one embodiment, the position of the heat sink 102 is adjustable diagonally, horizontally, vertically, or rotationally. For example, in at least one embodiment, the heat sink 102 can be raised or lowered in vertical adjustment. In at least one embodiment, the heat sink 102 can be shifted to the left, right, forward, or backward in horizontal adjustment. In at least one embodiment, in diagonal adjustment, one end of the heat sink 102 can be raised relative to the other end. In at least one embodiment, in rotational adjustment, the heat sink 102 can be rotated around an axis. In at least one embodiment, the horizontal and vertical adjustments are relative to a plane defined by a surface on which one or more processors are mounted. In such an embodiment, the vertical adjustment is perpendicular to the plane, and the horizontal adjustment is parallel to the plane.

[0054] In at least one embodiment, the heat sink 102 and the base 104 are attached to each other via one or more supports 110. In at least one embodiment, the supports 110 facilitate adjustment of the position of the heat sink 102. In at least one embodiment, the adjustment can be performed when the heat sink 102 is connected to the base 104 via the flexible tubes 108a, 108b. In at least one embodiment, the heat sink assembly 100 can be provided as an integrated unit that can be installed and adjusted according to a specific chassis configuration. For example, in at least one embodiment, the heat sink assembly 100 can adjust its position during or after installation in the chassis to accommodate placement constraints imposed by other components on the chassis to optimize airflow to the heat sink 102, or to optimize airflow to other components.

[0055] In at least one embodiment, the heat sink 102, the flexible tubes 108a, 108b and the base 104 are components of a loop thermosyphon system. In an embodiment, the material in the reservoir or the evaporator in the base 104 is heated by the heat generated by the operation of one or more processors 106. In at least one embodiment, the material can be converted into a gas or vapor in whole or in part by heating. In at least one embodiment, the material is then transferred to the heat sink 102 through the flexible tube 108a. In at least one embodiment, the heat sink 102 includes a condenser or a plate heat exchanger. In at least one embodiment, the material circulates through the heat sink 102 and is cooled. In at least one embodiment, the heat from the material is transferred to the heat sink 102 and is dissipated.

[0056] In at least one embodiment, airflow over the heat sink 102 aids in heat dissipation. In at least one embodiment, increased airflow over the heat sink 102 improves heat dissipation. In at least one embodiment, lower temperature air in the airflow over the heat sink 102 improves heat dissipation. In at least one embodiment, the airflow from the heat sink 102 can have an elevated temperature due to heat dissipation, so that airflow to other components (including other heat sinks) can have an elevated temperature.

[0057] Figure 2 A configurable heat sink assembly according to at least one embodiment is shown. In at least one embodiment, the heat sink assembly 200 includes a heat sink 202, a flexible heat pipe 208, and a base 204. In at least one embodiment, the heat sink assembly 200 also includes a support 210.

[0058] In at least one embodiment, the heat sink 202 is designed for heat transfer or heat dissipation. In at least one embodiment, the heat sink 202 includes a thermally conductive material, such as aluminum alloy, copper, copper-tungsten alloy or pseudo alloy, various other metal alloys, various composite materials, diamond and diamond-based materials, etc. In at least one embodiment, the heat sink 202 is shaped to facilitate efficient heat transfer or heat dissipation. In at least one embodiment, the heat sink 202 includes fins or protrusions to facilitate efficient heat transfer or heat dissipation.

[0059] In at least one embodiment, the heat sink assembly 200 includes a base 204. In at least one embodiment, the heat sink 202 is attached to the one or more processors via the base 204. In at least one embodiment, the base 204 is attached to the one or more processors 206 using a material that promotes a thermal interface between the base 204 and the one or more processors 206. In at least one embodiment, the thermal interface includes a thermal adhesive, thermal grease, a thermal pad, or some other attachment mechanism or promoter that is compatible with or promotes thermal conductivity. In at least one embodiment, the base 204 is a component of a loop siphon system.

[0060] In at least one embodiment, the base 204 is heated by heat emitted by the operation of the one or more processors 206. In at least one embodiment, the heat is transferred to the flexible heat pipe 208. In at least one embodiment, the flexible heat pipe 208 is attached to the base 204. In at least one embodiment, the flexible heat pipe 208 is attached to the base 204 using a material that promotes a thermal interface between the base 204 and the one or more processors 106. In at least one embodiment, the thermal interface includes a thermal adhesive, thermal grease, thermal pads, or some other attachment mechanism or promoter that is compatible with or promotes thermal conductivity.

[0061] In at least one embodiment, the flexible heat pipe 208 can be bent, twisted, or otherwise reoriented when attached to the base 204 and the heat sink 202 so that the heat sink 102 can be configured in different positions. In at least one embodiment, the flexible heat pipe 208 has sufficient flexibility to allow a desired adjustment range of the heat sink 202.

[0062] In at least one embodiment, the flexible heat pipe 208 is attached to the heat sink 202. In at least one embodiment, the flexible heat pipe 208 is attached to the heat sink 202 using a material that promotes a thermal interface between the base 104 and the one or more processors 106. In at least one embodiment, the thermal interface includes a thermal adhesive, thermal grease, thermal pads, or some other attachment mechanism or promoter that is compatible with or promotes thermal conductivity.

[0063] In at least one embodiment, the heat sink 202 is position adjustable. In at least one embodiment, the position of the heat sink 202 is diagonally, horizontally, vertically, or rotationally adjustable. For example, in at least one embodiment, the heat sink 202 can be raised or lowered in vertical adjustment. In at least one embodiment, the heat sink 202 can be horizontally adjusted to the left, right, forward, or backward. In at least one embodiment, in diagonal adjustment, one end of the heat sink 202 can be raised relative to the other end. In at least one embodiment, in rotational adjustment, the heat sink 202 can be rotated around an axis. In at least one embodiment, the horizontal and vertical adjustments are relative to a plane defined by a surface on which one or more processors 206 are mounted. In such an embodiment, the vertical adjustment is perpendicular to the plane, and the horizontal adjustment is parallel to the plane.

[0064] In at least one embodiment, the heat sink 202 and the base 204 are attached to each other via one or more supports 210. In at least one embodiment, the supports 210 facilitate adjustment of the position of the heat sink 202. In at least one embodiment, the adjustment can be performed when the heat sink 202 is connected to the base 204 via a flexible heat pipe 208. In at least one embodiment, the heat sink assembly 200 can be provided as an integrated unit that can be installed and adjusted to adapt to a specific chassis configuration. For example, in at least one embodiment, the heat sink assembly 200 can be adjusted during or after installation in the chassis so that its positioning can adapt to the constraints imposed by other components on the chassis. In at least one embodiment, the positioning of the heat sink 202 is adjusted to optimize the airflow to the heat sink 202, or to optimize the airflow to another component in the chassis (such as another heat sink).

[0065] Figure 3A system including two or more configurable heat sink assemblies according to at least one embodiment is shown. In at least one embodiment, chassis 300 includes two or more heat sink assemblies, each heat sink assembly including a heat sink 302 attached to a base 304 by a flexible heat pipe and one or more supports. In at least one embodiment, chassis 300 is a housing or other casing. In at least one embodiment, chassis 300 is a motherboard or other circuit board.

[0066] In at least one embodiment, fan 318 facilitates airflow 310 over chassis 300. In at least one embodiment, airflow 310 over chassis 300 is facilitated by airflow inlet 316 and fan 318.

[0067] In at least one embodiment, airflow 310A is drawn by fan 318 through airflow inlet 316 and into chassis 300. In at least one embodiment, airflow 310A flows around, over, or through heat sink 302A where it is heated. Heated airflow 312A from heat sink 302A is drawn out of chassis 300 by fan 318 as airflow 314.

[0068] In at least one embodiment, the airflow 310B is drawn by the fan 318 through the airflow inlet 316 and into the chassis 300. In at least one embodiment, most of the airflow 310B is below the heat sink 302A. In at least one embodiment, the airflow 310B is not significantly heated by the heat sink 302 and is delivered to the second heat sink 302B having a cooler temperature. The second heat sink 302B dissipates heat into the airflow 310B as heated airflow 312B. The heated airflow 312B is then drawn out of the chassis 300 by the fan 318. In at least one embodiment, the cooler temperature of the airflow 310 improves heat dissipation of the second heat sink 302B.

[0069] In at least one embodiment, the respective positions of the heat sinks 302A, B can be adjusted to accommodate a variety of chassis configurations. In at least one embodiment, the adjustments can be made during or after the processor 306 and heat sink assembly is mounted to the chassis 300. In at least one embodiment, the positions of the processors 306A, B are fixed, as are the positions of the corresponding bases 304A, B. However, in at least one embodiment, the positions of the heat sinks 302A, B can be adjusted, for example, to improve airflow or accommodate placement within the chassis 300 even though other components may otherwise prevent such placement. In at least one embodiment, the positioning of the heat sinks 302A, B is made more flexible based on the adjustments, allowing the heat sinks 302A, B to be made larger than they actually are.

[0070] Figure 4A system including two or more angularly configurable heat sink assemblies according to at least one embodiment is shown. In at least one embodiment, chassis 400 includes two or more heat sink assemblies, each heat sink assembly including a heat sink 402 attached to a base 404 by a flexible heat pipe and one or more supports.

[0071] In at least one embodiment, fan 418 facilitates airflow 410 over chassis 400. In at least one embodiment, airflow 410 over chassis 400 is facilitated by airflow inlet 416 and fan 418.

[0072] In at least one embodiment, the airflow 410B is drawn by the fan 418 through the airflow inlet 416 and into the chassis 400. In at least one embodiment, the airflow 410B flows at a distance above the first heat sink 402A such that its temperature is substantially unaffected by the heat sink 402A. In at least one embodiment, the airflow 410B is received by the second heat sink 402B to help dissipate heat from the second heat sink 402B. The heated airflow 412B from the heat sink 402B can then be exhausted from below the heat sink 402B and drawn out of the chassis 400 by the fan 418 as the airflow 414.

[0073] In at least one embodiment, the airflow 410A is drawn by the fan 418 through the airflow inlet 416 and into the chassis 400. In at least one embodiment, the airflow 410A is received by the heat sink 402A, helping the heat sink 402A to dissipate heat. In at least one embodiment, the heated airflow 412A is then discharged from below the heat sink 402A as airflow 412A and drawn out of the chassis 400 as airflow 414. In at least one embodiment, the second heat sink 402B is elevated relative to the first heat sink 402A so that the airflow 412A does not substantially affect the operation of the second heat sink 402B. In at least one embodiment, the adjustment can be performed during or after the corresponding heat sink assembly is installed on the chassis 400.

[0074] In at least one embodiment, the respective positions of the heat sinks 402A, 402B can be adjusted to accommodate various chassis configurations. In at least one embodiment, the adjustments can be made during or after the processor 406, heat sink assembly, and other components are mounted to the chassis 400. For example, in at least one embodiment, the positions of the processors 406A, B are fixed, as are the positions of the corresponding pedestals 304A, B, because the pedestals are attached to the corresponding processors 406A, B. However, in at least one embodiment, the positions of the heat sinks 402A, 402B can be adjusted to improve airflow or accommodate placement within the chassis 400, even if the components mounted therein may otherwise prevent such placement. In at least one embodiment, the heat sinks 402A, B can be larger than they actually are.

[0075] In at least one embodiment, baffles are added to chassis 400 to further optimize or adjust airflow. In at least one embodiment, the baffles include a material for blocking airflow. In at least one embodiment, the baffles are inserted to seal the gap between the adjusted heat sink position and the chassis wall or divider.

[0076] In at least one embodiment, the heat sink positions 402A, 402B are adjusted to increase airflow utilization. In at least one embodiment, airflow utilization includes utilization of the airflow generated by the fan 418. For example, in at least one embodiment, the fan generates the airflow, and a portion of the airflow is directed to the heat sink 402A, 402B. In at least one embodiment, increasing the size of the portion can improve heat dissipation of the heat sink 402A, 402B. In at least one embodiment, this improvement can occur even if some percentage of the airflow includes preheated air.

[0077] Figure 5 An example of a graphics processing unit with an adjustable heat sink according to at least one embodiment is shown. In at least one embodiment, chassis 500 includes a base plate 520 on which various components are mounted. In at least one embodiment, base plate 520 is a motherboard. In at least one embodiment, the components mounted to base plate 520 include a power supply 510, a microprocessor 506, a memory 508, and a fan bank 504. In at least one embodiment, base plate 520 includes one or more slots for mounting hardware (such as a graphics card) including a graphics processing unit (GPU). In at least one embodiment, the slot is a peripheral component interface ("PCI") slot. In at least one embodiment, the slot is a high-speed PCI slot, such as a PCI-E and PCI-X slot.

[0078] In at least one embodiment, the configuration of components such as power supply 510, microprocessor 506, memory 508, and fan assembly 504 is completed before identifying the graphics card to be installed in chassis 500. For example, in at least one embodiment, the chassis 500 configuration is determined without identifying which graphics card or graphics cards are to be installed. In at least one embodiment, baseboard 520 includes one or more slots for installing graphics cards, such as PCI, PCI-E, or PCI-X slots. In at least one embodiment, the configuration of the slots is completed before identifying the graphics card to be installed in chassis 500.

[0079] In at least one embodiment, graphics cards 502A-D are mounted on substrate 520. In at least one embodiment, a graphics card (such as any of graphics cards 502A-D) includes a heat sink assembly (such as Figure 1 or the heat sink assembly depicted in 2) and one or more processors (such as a graphics processing unit).

[0080] In at least one embodiment, the heat sink 503A-D of the graphics card 502A-D is adjusted to allow the graphics card 502A-D to be placed within the chassis 500, or mounted on the base plate 520. In at least one embodiment, the placement is achieved by adjusting the heat sink position. For example, in at least one embodiment, a component such as the fan assembly 504 can prevent the installation of a graphics card with a non-configurable heat sink, especially if the size of the heat sink is larger than a standard size. In at least one embodiment, the graphics card 502A-D includes a larger than standard sized heat sink 503A-D, but can be assembled into a chassis designed for a standard sized heat sink by adjusting the heat sink positioning. In at least one embodiment, due to having a larger surface area than a standard sized heat sink, the graphics card with the enlarged heat sink is able to dissipate heat more efficiently than a corresponding graphics card with a standard sized heat sink.

[0081] Figure 6 A heat sink assembly with a multi-position support is shown according to at least one embodiment. In at least one embodiment, the heat sink assembly 600 includes a heat sink 602 connected to a base 604 by a flexible heat pipe 608. In at least one embodiment, the flexible heat pipe 608 corresponds to Figure 1or the flexible heat pipe depicted in 2. In at least one embodiment, the heat sink assembly also includes supports 610A, 610B attached to the base 604. In at least one embodiment, connector pins 612A, B on the heat sink 602 are connected to the supports 610A, B. In at least one embodiment, the connector pins 612A, B are inserted through the slots 614A, B of the supports 610A, B. In at least one embodiment, a configurable lock 616A can be placed on the support 610A to secure the connector pin 612A to a position in the slot 614A, thereby securing the heat sink 602 to a specific position. In at least one embodiment, the configurable lock 616A, B does not require tools when used to secure the heat sink 602 to a position. In at least one embodiment, the configuration of the configurable lock 616A, B includes the lock being attached to the connector pin 612A, B at a position on the lock that secures the heat sink 602 in a plurality of possible positions.

[0082] In at least one embodiment, the slots 614A, B and the configurable locks 616A, B are capable of securing each connector pin 612A, B to one of four positions A, B, C, D on the corresponding slot 614A, B. In at least one embodiment, the left connector pin 612A can be placed in position A or B on the left support 610A, and the right connector pin 614B can be placed in position A or B on the right support 610B. Likewise, in at least one embodiment, the left connector pin 612A can be placed in position C or D on the left support 610A, and the right connector pin 614B can be placed in position C or D on the right support 610B. Placing in these different positions allows the heat sink 602 to be adjusted horizontally, vertically, and diagonally.

[0083] Figure 7 An exemplary process 700 for configuring a heat sink assembly according to at least one embodiment is shown. Figure 7 Depicted as a sequence of steps, the depicted sequence should not be interpreted as limiting the scope of potential embodiments to only those embodiments that conform to the depicted sequence. For example, the depicted steps may be reordered or performed in parallel except where logically necessary. In at least some embodiments, certain steps may be omitted. In at least some embodiments, additional steps may be added.

[0084] At 702, in at least one embodiment, a heat sink assembly is provided. In at least one embodiment, the heat sink assembly includes a base, a flexible heat pipe, and a heat sink.

[0085] In at least one embodiment, the heat sink assembly is provided as a unit and then attached to one or more processors by an original equipment manufacturer, an end user, or other entity. In at least one embodiment, the one or more processors include a graphics processing unit. In at least one embodiment, the one or more processors are a central processing unit ("CPU").

[0086] At 704, in at least one embodiment, a processor assembly is provided. In at least one embodiment, the processor assembly includes one or more processors and a heat sink assembly attached to the one or more processors. In at least one embodiment, the one or more processors include a graphics processing unit. In at least one embodiment, the one or more processors are CPUs. In at least one embodiment, the processor assembly is a graphics card.

[0087] At 706, in at least one embodiment, a processor assembly is installed in a chassis. In at least one embodiment, a processor assembly (such as a graphics card) is installed by electrically connecting the processor assembly to a motherboard. In at least one embodiment, installation of the processor assembly includes inserting a connector of the processor assembly into a slot on a motherboard, such as a PCI, PCI-E, or PCI-X slot.

[0088] At 708, in at least one embodiment, the position of the heat sink is adapted to the chassis configuration. In at least one embodiment, the adapting includes positioning the heat sink to fit within a particular chassis configuration. For example, in at least one embodiment, the heat sink is oversized and its position is manipulated to fit within a chassis designed for a processor assembly whose heat sink has a smaller size. In at least one embodiment, the heat sink is adjusted so that its position does not interfere with the placement of other components within the chassis.

[0089] At 710, in at least one embodiment, the position of the radiator is adapted to maximize airflow to the components in the chassis. In at least one embodiment, the radiator is raised or lowered to improve airflow to another component, such as another radiator. In at least one embodiment, the radiator is angled to improve airflow to another component. In at least one embodiment, the radiator is displaced horizontally, vertically, or in some other direction to improve airflow to another component. In at least one embodiment, the radiator is raised, lowered, angled, or displaced horizontally, vertically, or in some other direction to improve airflow to the radiator.

[0090] At 712, in at least one embodiment, the position of the radiator is adapted to minimize the delivery of preheated airflow to components in the chassis. In at least one embodiment, the radiator is raised or lowered to avoid preheating air that is delivered to another component (such as another radiator). In at least one embodiment, the radiator is angled to avoid delivering preheated air to another component. In at least one embodiment, the radiator is displaced horizontally, vertically, or in some other direction to avoid delivering preheated air to another component. In at least one embodiment, preheated air is avoided by moving the radiator out of the path of delivering airflow to the component.

[0091] At 714, in at least one embodiment, baffles are added to the chassis to further improve airflow to components in the chassis. For example, in at least one embodiment, baffles are added to improve airflow pressure, prevent pre-heated air from leaking, redirect airflow to a zone or compartment, etc. In at least one embodiment, baffles are added to the area between the regulated location of the radiator and the chassis wall or divider.

[0092] In at least one embodiment, a method of manufacturing a computing device includes placing a heat sink assembly (such as Figure 1-6 ) is installed in a computing device chassis, and then adjusting the position of the heat sink of the assembly. In at least one embodiment, the adjustment is used to improve airflow to one or more of the heat sink, other heat sinks, or other components in the chassis. In at least one embodiment, the adjustment does not require tools.

[0093] In at least one embodiment, a method of providing a graphics card includes providing a heat sink assembly (such as a heat sink assembly) attached to one or more processors. Figure 1-6 In at least one embodiment, the heat sink of the graphics card can be adjusted by the manufacturer of the computing device including the graphics card.

[0094] In at least one embodiment, a card including a parallel processing unit is provided with a heat sink assembly attached to the parallel processing unit, such as Figure 1-6 Any of those heat sink assemblies depicted in .

[0095] In the following description, numerous specific details are set forth to provide a more thorough understanding of at least one embodiment. However, it will be apparent to one skilled in the art that the inventive concept may be practiced without one or more of these specific details.

[0096] Data Center

[0097] Figure 8An example data center 800 is shown in accordance with at least one embodiment. In at least one embodiment, the data center 800 includes, but is not limited to, a data center infrastructure layer 810, a framework layer 820, a software layer 830, and an application layer 840.

[0098] In at least one embodiment, Figure 8 As shown, the data center infrastructure layer 810 may include a resource coordinator 812, grouped computing resources 814, and node computing resources ("node CRs") 816(1)-816(N), where "N" represents any complete positive integer. In at least one embodiment, the node CRs 816(1)-816(N) may include, but are not limited to, any number of central processing units ("CPUs") or other processors (including accelerators, field programmable gate arrays ("FPGAs"), graphics processors, etc.), memory devices (e.g., dynamic read-only memories), storage devices (e.g., solid-state drives or disk drives), network input / output ("NW I / O") devices, network switches, virtual machines ("VMs"), power modules and cooling modules, etc. In at least one embodiment, one or more of the node CRs 816(1)-816(N) may be a server having one or more of the above computing resources.

[0099] In at least one embodiment, the grouped computing resources 814 may include a separate grouping of node CRs housed in one or more racks (not shown), or many racks (also not shown) housed in data centers at various geographic locations. The separate grouping of node CRs within the grouped computing resources 814 may include computing, network, memory or storage resources that can be configured or allocated to support groupings of one or more workloads. In at least one embodiment, several node CRs including a CPU or processor may be grouped in one or more racks to provide computing resources to support one or more workloads. In at least one embodiment, one or more racks may also include any number of power modules, cooling modules and network switches in any combination.

[0100] In at least one embodiment, resource coordinator 812 may configure or otherwise control one or more node CRs 816(1)-816(N) and / or grouped computing resources 814. In at least one embodiment, resource coordinator 812 may include a software design infrastructure ("SDI") management entity for data center 800. In at least one embodiment, resource coordinator 812 may include hardware, software, or some combination thereof.

[0101] In at least one embodiment, Figure 8As shown, the framework layer 820 includes, but is not limited to, a job scheduler 832, a configuration manager 834, a resource manager 836, and a distributed file system 838. In at least one embodiment, the framework layer 820 may include a framework that supports software 852 of the software layer 830 and / or one or more applications 842 of the application layer 840. In at least one embodiment, the software 852 or the application 842 may include a web-based service software or application, such as a service or application provided by Amazon Web Services, Google Cloud, and Microsoft Azure. In at least one embodiment, the framework layer 820 may be, but is not limited to, a free and open source software network application framework, such as Apache SparkTM (hereinafter referred to as "Spark") that can utilize the distributed file system 838 for large-scale data processing (e.g., "big data"). In at least one embodiment, the job scheduler 832 may include a Spark driver to facilitate scheduling of workloads supported by various layers of the data center 800. In at least one embodiment, the configuration manager 834 may be able to configure different layers, such as the software layer 830 and the framework layer 820 including Spark and a distributed file system 838 for supporting large-scale data processing. In at least one embodiment, the resource manager 836 can manage clustered or grouped computing resources mapped to or allocated to support the distributed file system 838 and the job scheduler 832. In at least one embodiment, the clustered or grouped computing resources can include grouped computing resources 814 on the data center infrastructure layer 810. In at least one embodiment, the resource manager 836 can coordinate with the resource coordinator 812 to manage these mapped or allocated computing resources.

[0102] In at least one embodiment, the software 852 included in the software layer 830 may include software used by at least a portion of the node CRs 816(1)-816(N), the grouped computing resources 814, and / or the distributed file system 838 of the framework layer 820. The one or more types of software may include, but are not limited to, Internet web page search software, email virus scanning software, database software, and streaming video content software.

[0103] In at least one embodiment, the one or more applications 842 included in the application layer 840 may include one or more types of applications used by at least a portion of the node CRs 816(1)-816(N), the grouped computing resources 814, and / or the distributed file system 838 of the framework layer 820. The one or more types of applications may include, but are not limited to, CUDA applications.

[0104] In at least one embodiment, any of the configuration manager 834, resource manager 836, and resource coordinator 812 can implement any number and type of self-modification actions based on any number and type of data acquired in any technically feasible manner. In at least one embodiment, the self-modification actions can relieve a data center operator of the data center 800 from making potentially bad configuration decisions and can avoid underutilized and / or poorly performing portions of the data center.

[0105] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0106] Computer-based systems

[0107] The following figures set forth, but are not limiting of, exemplary computer-based systems that may be used to implement at least one embodiment.

[0108] Fig. 9 A processing system 900 is shown in accordance with at least one embodiment. In at least one embodiment, the system 900 includes one or more processors 902 and one or more graphics processors 908, and may be a single processor desktop system, a multi-processor workstation system, or a server system having a large number of processors 902 or processor cores 907. In at least one embodiment, the processing system 900 is a processing platform incorporated within a system-on-chip (SoC) integrated circuit for use in a mobile, handheld, or embedded device.

[0109] In at least one embodiment, the processing system 900 may include or be incorporated into a server-based gaming platform, including a gaming console, a mobile gaming console, a handheld gaming console, or an online gaming console for gaming and media consoles. In at least one embodiment, the processing system 900 is a mobile phone, a smart phone, a tablet computing device, or a mobile Internet device. In at least one embodiment, the processing system 900 may also include a wearable device coupled to or integrated in a wearable device, such as a smart watch wearable device, a smart glasses device, an augmented reality device, or a virtual reality device. In at least one embodiment, the processing system 900 is a television or set-top box device having one or more processors 902 and a graphical interface generated by one or more graphics processors 908.

[0110] In at least one embodiment, one or more processors 902 each include one or more processor cores 907 to process instructions that, when executed, perform operations for system and user software. In at least one embodiment, each of the one or more processor cores 907 is configured to process a specific instruction set 909. In at least one embodiment, the instruction set 909 can facilitate complex instruction set computing (CISC), reduced instruction set computing (RISC), or calculate by very long instruction words (VLIW). In at least one embodiment, a plurality of processor cores 907 can each process a different instruction set 909, which can include instructions that contribute to emulating other instruction sets. In at least one embodiment, the processor core 907 can also include other processing devices, such as a digital signal processor (DSP).

[0111] In at least one embodiment, the processor 902 includes a cache memory (cache) 904. In at least one embodiment, the processor 902 can have a single internal cache or multiple levels of internal cache. In at least one embodiment, the cache memory is shared between the various components of the processor 902. In at least one embodiment, the processor 902 also uses an external cache (e.g., a level 3 (L3) cache or a last level cache (LLC)) (not shown), which can share the logic between the processor cores 907 using known cache coherence techniques. In at least one embodiment, the processor 902 additionally includes a register file 906, and the processor 902 may include different types of registers (e.g., integer registers, floating point registers, status registers, and instruction pointer registers) for storing different types of data. In at least one embodiment, the register file 906 may include general registers or other registers.

[0112] In at least one embodiment, one or more processors 902 are coupled to one or more interface buses 910 to transmit communication signals, such as address, data, or control signals, between the processor 902 and other components in the system 900. In at least one embodiment, the interface bus 910 can be a processor bus in one embodiment, such as a version of a direct media interface (DMI) bus. In at least one embodiment, the interface bus 910 is not limited to a DMI bus, and can include one or more peripheral component interconnect buses (e.g., PCI, PCI Express), a memory bus, or other types of interface buses. In at least one embodiment, the processor 902 includes an integrated memory controller 916 and a platform controller hub 930. In at least one embodiment, the memory controller 916 facilitates communication between storage devices and other components of the processing system 900, while the platform controller hub (PCH) 930 provides connections to input / output (I / O) devices through a local I / O bus.

[0113] In at least one embodiment, the storage device 920 may be a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, a flash memory device, a phase change memory device, or have appropriate performance for use as a processor memory. In at least one embodiment, the storage device 920 may be used as a system memory of the processing system 900 to store data 922 and instructions 921 for use when one or more processors 902 execute an application or process. In at least one embodiment, the memory controller 916 is also coupled to an optional external graphics processor 912, which may communicate with one or more graphics processors 908 in the processor 902 to perform graphics and media operations. In at least one embodiment, the display device 911 may be connected to the processor 902. In at least one embodiment, the display device 911 may include one or more of the internal display devices, such as in a mobile electronic device or portable computer device or an external display device connected via a display interface (e.g., a display port (DisplayPort) or the like). In at least one embodiment, the display device 911 may include a head mounted display (HMD), such as a stereoscopic display device for virtual reality (VR) applications or augmented reality (AR) applications.

[0114] In at least one embodiment, the platform controller hub 930 enables peripheral devices to be connected to the storage device 920 and the processor 902 via a high-speed I / O bus. In at least one embodiment, the I / O peripherals include, but are not limited to, an audio controller 946, a network controller 934, a firmware interface 928, a wireless transceiver 926, a touch sensor 925, a data storage device 924 (e.g., a hard drive, flash memory, etc.). In at least one embodiment, the data storage device 924 can be connected via a memory interface (e.g., SATA) or via a peripheral bus, such as a peripheral component interconnect bus (e.g., PCI, PCIe). In at least one embodiment, the touch sensor 925 can include a touch screen sensor, a pressure sensor, or a fingerprint sensor. In at least one embodiment, the wireless transceiver 926 can be a Wi-Fi transceiver, a Bluetooth transceiver, or a mobile network transceiver, such as a 3G, 4G, or long-term evolution (LTE) transceiver. In at least one embodiment, the firmware interface 928 enables communication with the system firmware, and can be, for example, a unified extensible firmware interface (UEFI). In at least one embodiment, the network controller 934 can enable network connection to a wired network. In at least one embodiment, a high performance network controller (not shown) is coupled to the interface bus 910. In at least one embodiment, the audio controller 946 is a multi-channel high definition audio controller. In at least one embodiment, the processing system 900 includes an optional legacy I / O controller 940 for coupling legacy (e.g., Personal System 2 (PS / 2)) devices to the processing system 900. In at least one embodiment, the platform controller hub 930 may also be connected to one or more universal serial bus (USB) controllers 942 that connect input devices such as a keyboard and mouse 943 combination, a camera 944, or other USB input devices.

[0115] In at least one embodiment, instances of memory controller 916 and platform controller hub 930 may be integrated into a discrete external graphics processor, such as external graphics processor 912. In at least one embodiment, platform controller hub 930 and / or memory controller 916 may be external to one or more processors 902. For example, in at least one embodiment, processing system 900 may include external memory controller 916 and platform controller hub 930, which may be configured as a memory controller hub and a peripheral controller hub in a system chipset that communicates with processor 902.

[0116] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0117] Fig.10 A computer system 1000 is shown in accordance with at least one embodiment. In at least one embodiment, the computer system 1000 may be a system with interconnected devices and components, a SOC, or some combination. In at least one embodiment, the computer system 1000 is formed by a processor 1002, which may include an execution unit for executing instructions. In at least one embodiment, the computer system 1000 may include, but is not limited to, components, such as the processor 1002, which employs an execution unit including logic to execute algorithms for processing data. In at least one embodiment, the computer system 1000 may include a processor, such as Intel Corporation of Santa Clara, California, available from Processor family, XeonTM, XScaleTM and / or StrongARMTM, Core TM or Nervana TM microprocessor, although other systems (including PCs with other microprocessors, engineering workstations, set-top boxes, etc.) may also be used. In at least one embodiment, computer system 1000 may execute a version of the WINDOWS operating system available from Microsoft Corporation of Redmond, Wash., although other operating systems (e.g., UNIX and Linux), embedded software, and / or graphical user interfaces may also be used.

[0118] In at least one embodiment, computer system 1000 can be used in other devices, such as handheld devices and embedded applications. Some examples of handheld devices include cellular phones, Internet Protocol (Internet Protocol) devices, digital cameras, personal digital assistants ("PDAs"), and handheld PCs. In at least one embodiment, embedded applications can include microcontrollers, digital signal processors ("DSPs"), SoCs, network computers ("NetPCs"), set-top boxes, network hubs, wide area network ("WAN") switches, or any other system that can execute one or more instructions according to at least one embodiment.

[0119] In at least one embodiment, computer system 1000 may include, but is not limited to, processor 1002, which may include, but is not limited to, one or more execution units 1008, which may be configured to execute Compute Unified Device Architecture (“CUDA”) ( Developed by NVIDIA Corporation of Santa Clara, California) program. In at least one embodiment, a CUDA program is at least a portion of a software application written in the CUDA programming language. In at least one embodiment, the computer system 1000 is a single processor desktop or server system. In at least one embodiment, the computer system 1000 may be a multi-processor system. In at least one embodiment, the processor 1002 may include, but is not limited to, a CISC microprocessor, a RISC microprocessor, a VLIW microprocessor, a processor that implements an instruction set combination, or any other processor device, such as a digital signal processor. In at least one embodiment, the processor 1002 may be coupled to a processor bus 1010, which may transmit data signals between the processor 1002 and other components in the computer system 1000.

[0120] In at least one embodiment, processor 1002 may include, but is not limited to, a level 1 ("L1") internal cache memory ("cache") 1004. In at least one embodiment, processor 1002 may have a single internal cache or multiple levels of internal cache. In at least one embodiment, cache memory may reside external to processor 1002. In at least one embodiment, processor 1002 may include a combination of internal and external caches. In at least one embodiment, register file 1006 may store different types of data in various registers, including but not limited to integer registers, floating point registers, status registers, and instruction pointer registers.

[0121] In at least one embodiment, an execution unit 1008, including but not limited to logic to perform integer and floating point operations, is also located in the processor 1002. The processor 1002 may also include a microcode ("ucode") read-only memory ("ROM") for storing microcode for certain macroinstructions. In at least one embodiment, the execution unit 1008 may include logic for processing a packed instruction set 1009. In at least one embodiment, by including the packed instruction set 1009 in the instruction set of the general purpose processor 1002, and the associated circuitry to execute the instructions, operations used by many multimedia applications may be performed using packed data in the general purpose processor 1002. In at least one embodiment, many multimedia applications may be executed faster and more efficiently by using the full width of the processor's data bus to perform operations on packed data, which may not require the transfer of smaller units of data on the processor's data bus to perform one or more operations on one data element at a time.

[0122] In at least one embodiment, execution unit 1008 may also be used in microcontrollers, embedded processors, graphics devices, DSPs, and other types of logic circuits. In at least one embodiment, computer system 1000 may include, but is not limited to, memory 1020. In at least one embodiment, memory 1020 may be implemented as a DRAM device, an SRAM device, a flash memory device, or other storage device. Memory 1020 may store instructions 1019 and / or data 1021 represented by data signals that may be executed by processor 1002.

[0123] In at least one embodiment, the system logic chip can be coupled to the processor bus 1010 and the memory 1020. In at least one embodiment, the system logic chip can include, but is not limited to, a memory controller hub ("MCH") 1016, and the processor 1002 can communicate with the MCH 1016 via the processor bus 1010. In at least one embodiment, the MCH 1016 can provide a high bandwidth memory path 1018 to the memory 1020 for instruction and data storage and for storage of graphics commands, data, and textures. In at least one embodiment, the MCH 1016 can initiate data signals between the processor 1002, the memory 1020, and other components in the computer system 1000, and bridge data signals between the processor bus 1010, the memory 1020, and the system I / O 1022. In at least one embodiment, the system logic chip can provide a graphics port for coupling to a graphics controller. In at least one embodiment, the MCH 1016 may be coupled to the memory 1020 via a high bandwidth memory path 1018 , and the graphics / video card 1012 may be coupled to the MCH 1016 via an Accelerated Graphics Port (“AGP”) interconnect 1014 .

[0124] In at least one embodiment, computer system 1000 may use system I / O 1022 as a proprietary hub interface bus to couple MCH 1016 to I / O controller hub ("ICH") 1030. In at least one embodiment, ICH 1030 may provide direct connection to certain I / O devices through a local I / O bus. In at least one embodiment, the local I / O bus may include, but is not limited to, a high-speed I / O bus used to connect peripheral devices to memory 1020, chipsets, and processor 1002. Examples may include, but are not limited to, an audio controller 1029, a firmware hub ("Flash BIOS") 1028, a wireless transceiver 1026, a data store 1024, a traditional I / O controller 1023 including user input 1025 and a keyboard interface, a serial expansion port 1027 (e.g., USB), and a network controller 1034. Data store 1024 may include a hard drive, a floppy drive, a CD-ROM device, a flash memory device, or other mass storage device.

[0125] In at least one embodiment, Fig.10 A system comprising interconnected hardware devices or "chips" is shown. In at least one embodiment, Fig.10 An exemplary SoC may be shown. In at least one embodiment, Fig.10The devices shown in can be interconnected with a proprietary interconnect, a standardized interconnect (eg, PCIe), or some combination thereof. In at least one embodiment, one or more components of system 1000 are interconnected using a compute express link (CXL) interconnect.

[0126] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0127] Fig.11 A system 1100 is shown in accordance with at least one embodiment. In at least one embodiment, the system 1100 is an electronic device utilizing a processor 1110. In at least one embodiment, the system 1100 can be, for example but not limited to, a notebook computer, a tower server, a rack server, a blade server, a laptop computer, a desktop computer, a tablet computer, a mobile device, a phone, an embedded computer, or any other suitable electronic device.

[0128] In at least one embodiment, system 1100 may include, but is not limited to, a processor 1110 communicatively coupled to any suitable number or kind of components, peripherals, modules, or devices. In at least one embodiment, processor 1110 is coupled using a bus or interface, such as an I2C bus, a system management bus ("SMBus"), a low pin count (LPC) bus, a serial peripheral interface ("SPI"), a high-definition audio ("HDA") bus, a serial advanced technology attachment ("SATA") bus, a USB (versions 1, 2, 3), or a universal asynchronous receiver / transmitter ("UART") bus. In at least one embodiment, Fig.11 A system is shown, which includes interconnected hardware devices or "chips". In at least one embodiment, Fig.11 An exemplary SoC may be shown. In at least one embodiment, Fig.11 The devices shown in can be interconnected with a proprietary interconnect, a standardized interconnect (e.g., PCIe), or some combination thereof. In at least one embodiment, Fig.11 One or more components of the system are interconnected using Compute Express Link (CXL) interconnect lines.

[0129] In at least one embodiment, Fig.11The display 1124, touch screen 1125, touch pad 1130, near field communication unit ("NFC") 1145, sensor hub 1140, thermal sensor 1146, fast chipset ("EC") 1135, trusted platform module ("TPM") 1138, BIOS / firmware / flash memory ("BIOS, FW Flash") 1122, DSP 1160, solid state disk ("SSD") or hard disk drive ("HDD") 1120, wireless local area network unit ("WLAN") 1150, Bluetooth unit 1152, wireless wide area network unit ("WWAN") 1156, global positioning system (GPS) 1155, camera ("USB 3.0 camera") 1154 (e.g., USB 3.0 camera) or low power double data rate ("LPDDR") memory unit ("LPDDR3") 1115 implemented in, for example, the LPDDR3 standard. Each of these components can be implemented in any suitable manner.

[0130] In at least one embodiment, other components may be communicatively coupled to the processor 1110 through the components discussed above. In at least one embodiment, an accelerometer 1141, an ambient light sensor (“ALS”) 1142, a compass 1143, and a gyroscope 1144 may be communicatively coupled to the sensor hub 1140. In at least one embodiment, a thermal sensor 1139, a fan 1137, a keyboard 1146, and a touchpad 1130 may be communicatively coupled to the EC 1135. In at least one embodiment, a speaker 1163, an earphone 1164, and a microphone (“mic”) 1165 may be communicatively coupled to an audio unit (“audio codec and class D amplifier”) 1164, which in turn may be communicatively coupled to the DSP 1160. In at least one embodiment, the audio unit 1164 may include, for example, but not limited to, an audio encoder / decoder (“codec”) and a class D amplifier. In at least one embodiment, a SIM card (“SIM”) 1157 may be communicatively coupled to the WWAN unit 1156. In at least one embodiment, components such as the WLAN unit 1150 and the Bluetooth unit 1152 and the WWAN unit 1156 may be implemented as a next generation form factor (NGFF).

[0131] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0132] Fig.12 An exemplary integrated circuit 1200 according to at least one embodiment is shown. In at least one embodiment, the exemplary integrated circuit 1200 is a SoC, which can be manufactured using one or more IP cores. In at least one embodiment, the integrated circuit 1200 includes one or more application processors 1205 (e.g., CPU), at least one graphics processor 1210, and may additionally include an image processor 1215 and / or a video processor 1220, any of which may be a modular IP core. In at least one embodiment, the integrated circuit 1200 includes peripheral or bus logic, which includes a USB controller 1225, a UART controller 1230, a SPI / SDIO controller 1235, and an I2S / I2C controller 1240. In at least one embodiment, the integrated circuit 1200 may include a display device 1245 coupled to one or more of a high-definition multimedia interface (HDMI) controller 1250 and a mobile industry processor interface (MIPI) display interface 1255. In at least one embodiment, storage may be provided by a flash subsystem 1260, including flash memory and a flash controller. In at least one embodiment, a memory interface may be provided via a memory controller 1265 for accessing SDRAM or SRAM memory devices. In at least one embodiment, some integrated circuits also include an embedded security engine 1270 .

[0133] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0134] Fig.13A computing system 1300 is shown in accordance with at least one embodiment. In at least one embodiment, the computing system 1300 includes a processing subsystem 1301 having one or more processors 1302 and a system memory 1304 communicating via an interconnect path that may include a memory hub 1305. In at least one embodiment, the memory hub 1305 may be a separate component within a chipset component or may be integrated within the one or more processors 1302. In at least one embodiment, the memory hub 1305 is coupled to an I / O subsystem 1311 via a communication link 1306. In at least one embodiment, the I / O subsystem 1311 includes an I / O hub 1307 that may enable the computing system 1300 to receive input from one or more input devices 1308. In at least one embodiment, the I / O hub 1307 may enable a display controller, included in the one or more processors 1302, to provide output to the one or more display devices 1310A. In at least one embodiment, the one or more display devices 1310A coupled to I / O hub 1307 may include local, internal, or embedded display devices.

[0135] In at least one embodiment, the processing subsystem 1301 includes one or more parallel processors 1312 coupled to the memory hub 1305 via a bus or other communication link 1313. In at least one embodiment, the communication link 1313 can be one of many standard-based communication link technologies or protocols, such as but not limited to PCIe, or can be a communication interface or communication structure for a vendor. In at least one embodiment, the one or more parallel processors 1312 form a parallel or vector processing system in a computational concentration, which can include a large number of processing cores and / or processing clusters, such as a multi-integrated core (MIC) processor. In at least one embodiment, the one or more parallel processors 1312 form a graphics processing subsystem that can output pixels to one of the one or more display devices 1310A coupled via the I / O hub 1307. In at least one embodiment, the one or more parallel processors 1312 may also include a display controller and display interface (not shown) to enable direct connection to one or more display devices 1310B.

[0136] In at least one embodiment, system storage unit 1314 can be connected to I / O hub 1307 to provide a storage mechanism for computing system 1300. In at least one embodiment, I / O switch 1316 can be used to provide an interface mechanism to enable connection between I / O hub 1307 and other components, such as network adapter 1318 and / or wireless network adapter 1319 that can be integrated into the platform, as well as various other devices that can be added through one or more additional devices 1320. In at least one embodiment, network adapter 1318 can be an Ethernet adapter or another wired network adapter. In at least one embodiment, wireless network adapter 1319 can include one or more of Wi-Fi, Bluetooth, NFC, or other network devices including one or more radios.

[0137] In at least one embodiment, computing system 1300 may include other components not explicitly shown, including USB or other port connections, optical storage drives, video capture devices, etc., which may also be connected to I / O hub 1307. Fig.13 The communication paths that interconnect the various components in the system can be implemented using any suitable protocol, such as a PCI (Peripheral Component Interconnect)-based protocol (e.g., PCIe), or other bus or point-to-point communication interfaces and / or protocols (e.g., NVLink high-speed interconnect or interconnect protocol).

[0138] In at least one embodiment, one or more parallel processors 1312 include circuits optimized for graphics and video processing (including, for example, video output circuits) and constitute a graphics processing unit (GPU). In at least one embodiment, one or more parallel processors 1312 include circuits optimized for general processing. In at least one embodiment, the components of the computing system 1300 can be integrated with one or more other system elements on a single integrated circuit. For example, in at least one embodiment, one or more parallel processors 1312, memory hub 1305, processor 1302, and I / O hub 1307 can be integrated into a system-on-chip (SoC) integrated circuit. In at least one embodiment, the components of the computing system 1300 can be integrated into a single package to form a system-in-package (SIP) configuration. In at least one embodiment, at least a portion of the components of the computing system 1300 can be integrated into a multi-chip module (MCM), which can be interconnected with other multi-chip modules into a modular computing system. In at least one embodiment, the I / O subsystem 1311 and the display device 1310B are omitted from the computing system 1300.

[0139] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0140] Processing system

[0141] The following figures illustrate, but are not limited to, exemplary processing systems that may be used to implement at least one embodiment.

[0142] Fig.14 An accelerated processing unit ("APU") 1400 is shown in accordance with at least one embodiment. In at least one embodiment, the APU 1400 was developed by AMD, Inc. of Santa Clara, California. In at least one embodiment, the APU 1400 may be configured to execute application programs, such as CUDA programs. In at least one embodiment, the APU 1400 includes, but is not limited to, a core complex 1410, a graphics complex 1440, a fabric 1460, an I / O interface 1470, a memory controller 1480, a display controller 1492, and a multimedia engine 1494. In at least one embodiment, the APU 1400 may include, but is not limited to, any combination of any number of core complexes 1410, any number of graphics complexes 1440, any number of display controllers 1492, and any number of multimedia engines 1494. For purposes of illustration, multiple instances of similar objects are represented herein by reference numerals, where the reference numeral identifies the object and the number in parentheses identifies the desired instance.

[0143] In at least one embodiment, core complex 1410 is a CPU, graphics complex 1440 is a GPU, and APU 1400 is a processing unit that is not limited to 1410 and 1440 integrated onto a single chip. In at least one embodiment, some tasks may be assigned to core complex 1410, while other tasks may be assigned to graphics complex 1440. In at least one embodiment, core complex 1410 is configured to execute main control software associated with APU 1400, such as an operating system. In at least one embodiment, core complex 1410 is the main processor of APU 1400, which controls and coordinates the operations of other processors. In at least one embodiment, core complex 1410 issues commands that control the operations of graphics complex 1440. In at least one embodiment, core complex 1410 may be configured to execute host executable code derived from CUDA source code, and graphics complex 1440 may be configured to execute device executable code derived from CUDA source code.

[0144] In at least one embodiment, core complex 1410 includes, but is not limited to, cores 1420(1)-1420(4) and L3 cache 1430. In at least one embodiment, core complex 1410 may include, but is not limited to, any number of cores 1420 and any combination of any number and type of caches. In at least one embodiment, cores 1420 are configured to execute instructions of a particular instruction set architecture ("ISA"). In at least one embodiment, each core 1420 is a CPU core.

[0145] In at least one embodiment, each core 1420 includes, but is not limited to, a fetch / decode unit 1422, an integer execution engine 1424, a floating point execution engine 1426, and an L2 cache 1428. In at least one embodiment, the fetch / decode unit 1422 fetches instructions, decodes these instructions, generates micro-operations, and dispatches separate micro-instructions to the integer execution engine 1424 and the floating point execution engine 1426. In at least one embodiment, the fetch / decode unit 1422 can dispatch one micro-instruction to the integer execution engine 1424 and another micro-instruction to the floating point execution engine 1426 at the same time. In at least one embodiment, the integer execution engine 1424 performs, but is not limited to, integer and memory operations. In at least one embodiment, the floating point engine 1426 performs, but is not limited to, floating point and vector operations. In at least one embodiment, the fetch-decode unit 1422 dispatches micro-instructions to a single execution engine that replaces both the integer execution engine 1424 and the floating point execution engine 1426.

[0146] In at least one embodiment, each core 1420(i) may access an L2 cache 1428(i) included in the core 1420(i), where i is an integer representing a specific instance of the core 1420. In at least one embodiment, each core 1420 included in the core complex 1410(j) is connected to other cores 1420 included in the core complex 1410(j) via an L3 cache 1430(j) included in the core complex 1410(j), where j is an integer representing a specific instance of the core complex 1410. In at least one embodiment, a core 1420 included in a core complex 1410(j) may access all L3 caches 1430(j) included in the core complex 1410(j), where j is an integer representing a specific instance of the core complex 1410. In at least one embodiment, the L3 cache 1430 may include, but is not limited to, any number of slices.

[0147] In at least one embodiment, graphics complex 1440 can be configured to perform computational operations in a highly parallel manner. In at least one embodiment, graphics complex 1440 is configured to perform graphics pipeline operations, such as drawing commands, pixel operations, geometry calculations, and other operations associated with rendering an image to a display. In at least one embodiment, graphics complex 1440 is configured to perform operations that are not related to graphics. In at least one embodiment, graphics complex 1440 is configured to perform both graphics-related operations and graphics-independent operations.

[0148] In at least one embodiment, graphics complex 1440 includes, but is not limited to, any number of compute units 1450 and L2 cache 1442. In at least one embodiment, compute units 1450 share L2 cache 1442. In at least one embodiment, L2 cache 1442 is partitioned. In at least one embodiment, graphics complex 1440 includes, but is not limited to, any number of compute units 1450 and any number (including zero) and type of caches. In at least one embodiment, graphics complex 1440 includes, but is not limited to, any number of specialized graphics hardware.

[0149] In at least one embodiment, each computing unit 1450 includes, but is not limited to, any number of SIMD units 1452 and shared memory 1454. In at least one embodiment, each SIMD unit 1452 implements a SIMD architecture and is configured to perform operations in parallel. In at least one embodiment, each computing unit 1450 can execute any number of thread blocks, but each thread block is executed on a single computing unit 1450. In at least one embodiment, thread blocks include, but are not limited to, any number of execution threads. In at least one embodiment, a work group is a thread block. In at least one embodiment, each SIMD unit 1452 executes a different warp. In at least one embodiment, a warp is a group of threads (e.g., 16 threads), where each thread in a warp belongs to a single thread block and is configured to process different data sets based on a single instruction set. In at least one embodiment, a prediction can be used to disable one or more threads in a warp. In at least one embodiment, a channel is a thread. In at least one embodiment, a work item is a thread. In at least one embodiment, a wavefront is a warp. In at least one embodiment, different wavefronts in a thread block can be synchronized together and communicated via a shared memory 1454.

[0150] In at least one embodiment, fabric 1460 is a system interconnect that facilitates data and control transfers across core complex 1410, graphics complex 1440, I / O interface 1470, memory controller 1480, display controller 1492, and multimedia engine 1494. In at least one embodiment, APU 1400 may include, but is not limited to, any number and type of system interconnects in addition to or in lieu of fabric 1460 that facilitate data and control transfers across any number and type of directly or indirectly linked components that may be internal or external to APU 1400. In at least one embodiment, I / O interface 1470 represents any number and type of I / O interfaces (e.g., PCI, PCI-Extended (“PCI-X”), PCIe, Gigabit Ethernet (“GBE”), USB, etc.). In at least one embodiment, various types of peripherals are coupled to I / O interface 1470. In at least one embodiment, peripheral devices coupled to I / O interface 1470 may include, but are not limited to, a keyboard, a mouse, a printer, a scanner, a joystick or other type of game controller, a media recording device, an external storage device, a network interface card, etc.

[0151] In at least one embodiment, display controller AMD92 displays images on one or more display devices, such as liquid crystal display (LCD) devices. In at least one embodiment, multimedia engine 240 includes, but is not limited to, any number and type of multimedia-related circuits, such as video decoders, video encoders, image signal processors, etc. In at least one embodiment, memory controller 1480 facilitates data transfer between APU 1400 and unified system memory 1490. In at least one embodiment, core complex 1410 and graphics complex 1440 share unified system memory 1490.

[0152] In at least one embodiment, the APU 1400 implements a memory subsystem including, but not limited to, any number and type of memory controllers 1480 and memory devices (e.g., shared memory 1454) that may be dedicated to a component or shared among multiple components. Components. In at least one embodiment, the APU 1400 implements a cache subsystem including, but not limited to, one or more cache memories (e.g., L2 cache 1528, L3 cache 1430, and L2 cache 1442), each of which may be component-private or shared among any number of components (e.g., core 1420, core complex 1410, SIMD unit 1452, compute unit 1450, and graphics complex 1440).

[0153] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0154] Fig.15A CPU 1500 according to at least one embodiment is shown. In at least one embodiment, the CPU 1500 is developed by AMD, Inc. of Santa Clara, California. In at least one embodiment, the CPU 1500 may be configured to execute an application program. In at least one embodiment, the CPU 1500 is configured to execute a main control software, such as an operating system. In at least one embodiment, the CPU 1500 issues commands to control the operation of an external GPU (not shown). In at least one embodiment, the CPU 1500 may be configured to execute a host executable code derived from a CUDA source code, and the external GPU may be configured to execute a device executable code derived from such a CUDA source code. In at least one embodiment, the CPU 1500 includes, but is not limited to, any number of core complexes 1510, structures 1560, I / O interfaces 1570, and memory controllers 1580.

[0155] In at least one embodiment, core complex 1510 includes, but is not limited to, cores 1520(1)-1520(4) and L3 cache 1530. In at least one embodiment, core complex 1510 may include, but is not limited to, any number of cores 1520 and any combination of any number and type of caches. In at least one embodiment, core 1520 is configured to execute instructions of a specific ISA. In at least one embodiment, each core 1520 is a CPU core.

[0156] In at least one embodiment, each core 1520 includes, but is not limited to, a fetch / decode unit 1522, an integer execution engine 1524, a floating point execution engine 1526, and an L2 cache 1528. In at least one embodiment, the fetch / decode unit 1522 fetches instructions, decodes these instructions, generates micro-operations, and dispatches separate micro-instructions to the integer execution engine 1524 and the floating point execution engine 1526. In at least one embodiment, the fetch / decode unit 1522 can dispatch one micro-instruction to the integer execution engine 1524 and another micro-instruction to the floating point execution engine 1526 at the same time. In at least one embodiment, the integer execution engine 1524 performs, but is not limited to, integer and memory operations. In at least one embodiment, the floating point engine 1526 performs, but is not limited to, floating point and vector operations. In at least one embodiment, the fetch-decode unit 1522 dispatches micro-instructions to a single execution engine that replaces both the integer execution engine 1524 and the floating point execution engine 1526.

[0157] In at least one embodiment, each core 1520(i) may access an L2 cache 1528(i) included in the core 1520(i), where i is an integer representing a specific instance of the core 1520. In at least one embodiment, each core 1520 included in a core complex 1510(j) is connected to other cores 1520 in the core complex 1510(j) via an L3 cache 1530(j) included in the core complex 1510(j), where j is an integer representing a specific instance of the core complex 1510. In at least one embodiment, a core 1520 included in a core complex 1510(j) may access all L3 caches 1530(j) included in the core complex 1510(j), where j is an integer representing a specific instance of the core complex 1510. In at least one embodiment, the L3 cache 1530 may include, but is not limited to, any number of slices.

[0158] In at least one embodiment, fabric 1560 is a system interconnect that facilitates data and control transfers across core complexes 1510(1)-1510(N) (where N is an integer greater than zero), I / O interface 1570, and memory controller 1580. In at least one embodiment, CPU 1500 may include, in addition to or in lieu of fabric 1560, but is not limited to, any number and type of system interconnects that facilitate data and control transfers across any number and type of directly or indirectly linked components that may be internal or external to CPU 1500. In at least one embodiment, I / O interface 1570 represents any number and type of I / O interfaces (e.g., PCI, PCI-X, PCIe, GBE, USB, etc.). In at least one embodiment, various types of peripherals are coupled to I / O interface 1570. In at least one embodiment, peripherals coupled to I / O interface 1570 may include, but are not limited to, a display, a keyboard, a mouse, a printer, a scanner, a joystick or other type of game controller, a media recording device, an external storage device, a network interface card, and the like.

[0159] In at least one embodiment, memory controller 1580 facilitates data transfers between CPU 1500 and system memory 1590. In at least one embodiment, core complex 1510 and graphics complex 1540 share system memory 1590. In at least one embodiment, CPU 1500 implements a memory subsystem, which includes, but is not limited to, any number and type of memory controllers 1580 and memory devices that may be dedicated to one component or shared between multiple components. In at least one embodiment, CPU 1500 implements a cache subsystem, which includes, but is not limited to, one or more cache memories (e.g., L2 cache 1528 and L3 cache 1530), each of which may be private to a component or shared between any number of components (e.g., core 1520 and core complex 1510).

[0160] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0161] Fig.16 An exemplary accelerator integrated slice 1690 according to at least one embodiment is shown. As used herein, a "slice" includes a specified portion of the processing resources of an accelerator integrated circuit. In at least one embodiment, the accelerator integrated circuit provides cache management, memory access, environment management, and interrupt management services on behalf of multiple graphics processing engines in multiple graphics acceleration modules. The graphics processing engines may each include a separate GPU. Optionally, the graphics processing engine may include different types of graphics processing engines within the GPU, such as a graphics execution unit, a media processing engine (e.g., a video encoder / decoder), a sampler, and a blit engine. In at least one embodiment, the graphics acceleration module may be a GPU with multiple graphics processing engines. In at least one embodiment, the graphics processing engines may be individual GPUs integrated on a general package, line card, or chip.

[0162] The application effective address space 1682 within the system memory 1614 stores process elements 1683. In one embodiment, the process element 1683 is stored in response to a GPU call 1681 from an application 1680 executing on the processor 1607. The process element 1683 contains the processing state of the corresponding application 1680. The work descriptor (WD) 1684 contained in the process element 1683 can be a single job requested by the application or may contain a pointer to a job queue. In at least one embodiment, the WD 1684 is a pointer to a job request queue in the application effective address space 1682.

[0163] Graphics acceleration module 1646 and / or each graphics processing engine can be shared by all or part of the processes in the system. In at least one embodiment, an infrastructure for establishing a processing state and sending WD 1684 to graphics acceleration module 1646 to start a job in a virtualized environment can be included.

[0164] In at least one embodiment, a dedicated process programming model is implemented for . In this model, a single process owns a graphics acceleration module 1646 or an individual graphics processing engine. Since the graphics acceleration module 1646 is owned by a single process, the hypervisor initializes the accelerator integrated circuit for the owning partition, and the operating system initializes the accelerator integrated circuit for the owning partition when the graphics acceleration module 1646 is allocated.

[0165] In operation, the WD acquisition unit 1691 in the accelerator integrated slice 1690 acquires the next WD 1684, which includes an indication of work to be completed by one or more graphics processing engines of the graphics acceleration module 1646. Data from the WD 1684 can be stored in registers 1645 for use by a memory management unit (MMU) 1639, an interrupt management circuit 1647, and / or an environment management circuit 1648, as shown. For example, one embodiment of the MMU 1639 includes a segment / page roaming circuit for accessing a segment / page table 1686 within an OS virtual address space 1685. The interrupt management circuit 1647 can process an interrupt event (INT) 1692 received from the graphics acceleration module 1646. When performing a graph operation, an effective address 1693 generated by the graphics processing engine is converted to an actual address by the MMU 1639.

[0166] In one embodiment, the same register set 1645 is replicated for each graphics processing engine and / or graphics acceleration module 1646 and can be initialized by a hypervisor or operating system. Each of these replicated registers can be included in an accelerator integrated slice 1690. An exemplary register that can be initialized by a hypervisor is shown in Table 1.

[0167] Table 1 – Registers initialized by the hypervisor

[0168]

[0169]

[0170] Example registers that may be initialized by the operating system are shown in Table 2.

[0171] Table 2 – Operating System Initialization Registers

[0172] 1 Process and thread identification 2 Effective Address (EA) environment save / restore pointer 3 Virtual Address (VA) Accelerator Utilization Record Pointer 4 Virtual Address (VA) stores the segment table pointer 5 Mask of Authority 6 Job Descriptor

[0173] In one embodiment, each WD 1684 is specific to a specific graphics acceleration module 1646 and / or a specific graphics processing engine. It contains all the information needed by the graphics processing engine to do its work or work, or it can be a pointer to a memory location where the application has established a command queue for the work to be done.

[0174] Fig.17A and Fig. 17B An exemplary graphics processor according to at least one embodiment of the present invention is shown. In at least one embodiment, any exemplary graphics processor can be manufactured using one or more IP cores. In addition to the illustrations, other logic and circuits can be included in at least one embodiment, including additional graphics processors / cores, peripheral interface controllers, or general-purpose processor cores. In at least one embodiment, the exemplary graphics processor is used in a SoC.

[0175] Fig.17A An exemplary graphics processor 1710 of a SoC integrated circuit is shown, which may be manufactured using one or more IP cores, in accordance with at least one embodiment. Fig. 17B An additional exemplary graphics processor 1740 of a SoC integrated circuit is shown, which may be manufactured using one or more IP cores, according to at least one embodiment. In at least one embodiment, Fig.17A The graphics processor 1710 is a low power graphics processor core. In at least one embodiment, Fig. 17B The graphics processor 1740 is a higher performance graphics processor core. In at least one embodiment, each graphics processor 1710, 1740 can be Fig.12 A variant of graphics processor 1210.

[0176] In at least one embodiment, the graphics processor 1710 includes a vertex processor 1705 and one or more fragment processors 1715A-1715N (e.g., 1715A, 1715B, 1715C, 1715D to 1715N-1 and 1715N). In at least one embodiment, the graphics processor 1710 can execute different shader programs via separate logic, so that the vertex processor 1705 is optimized to perform operations for the vertex shader program, while one or more fragment processors 1715A-1715N perform fragment (e.g., pixel) shading operations for fragments or pixels or shader programs. In at least one embodiment, the vertex processor 1705 performs the vertex processing stage of the 3D graphics pipeline and generates primitives and vertex data. In at least one embodiment, the fragment processors 1715A-1715N use the primitives and vertex data generated by the vertex processor 1705 to generate a frame buffer displayed on a display device. In at least one embodiment, fragment processors 1715A-1715N are optimized to execute fragment shader programs as provided in the OpenGL API, which can be used to perform similar operations as pixel shader programs provided in the Direct 3D API.

[0177] In at least one embodiment, graphics processor 1710 additionally includes one or more MMUs 1720A-1720B, caches 1725A-1725B, and circuit interconnects 1730A-1730B. In at least one embodiment, one or more MMUs 1720A-1720B provide a mapping of virtual to physical addresses for graphics processor 1710, including for vertex processor 1705 and / or fragment processors 1715A-1715N, which may reference vertex or image / texture data stored in memory in addition to vertex or image / texture data stored in one or more caches 1725A-1725B. In at least one embodiment, one or more MMUs 1720A-1720B may synchronize with other MMUs within the system, including with Fig.12 One or more MMUs associated with one or more application processors 1205, image processor 1215, and / or video processor 1220 enable each processor 1205-1220 to participate in a shared or unified virtual memory system. In at least one embodiment, one or more circuit interconnects 1730A-1730B enable graphics processor 1710 to connect to other IP cores within the SoC via an internal bus of the SoC or via a direct connection.

[0178] In at least one embodiment, graphics processor 1740 includes Fig.17AOne or more MMUs 1720A-1720B, caches 1725A-1725B, and circuit interconnects 1730A-1730B of a graphics processor 1710. In at least one embodiment, a graphics processor 1740 includes one or more shader cores 1755A-1755N (e.g., 1755A, 1755B, 1755C, 1755D, 1755E, 1755F, to 1755N-1 and 1755N) that provide a unified shader core architecture in which a single core or type or core can execute all types of programmable shader code, including shader program code for implementing vertex shaders, fragment shaders, and / or compute shaders. In at least one embodiment, the plurality of shader cores may vary. In at least one embodiment, the graphics processor 1740 includes an inter-core task manager 1745 that acts as a thread dispatcher to dispatch execution threads to one or more shader cores 1755A-1755N and a tiling unit 1758 to accelerate tile operations for tile-based rendering, in which rendering operations of a scene are subdivided in image space, for example, to exploit local spatial coherence within a scene or to optimize use of internal caches.

[0179] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0180] Fig.18A 1800 according to at least one embodiment. In at least one embodiment, the graphics core 1800 may include Fig.12 In at least one embodiment, the graphics core 1800 may be Fig. 17B1755A-1755N. In at least one embodiment, the graphics core 1800 includes a shared instruction cache 1802, a texture unit 1818, and a cache / shared memory 1820, which are common to the execution resources within the graphics core 1800. In at least one embodiment, the graphics core 1800 may include multiple slices 1801A-1801N or partitions of each core, and the graphics processor may include multiple instances of the graphics core 1800. The slices 1801A-1801N may include support logic including a local instruction cache 1804A-1804N, a thread scheduler 1806A-1806N, a thread dispatcher 1808A-1808N, and a set of registers 1810A-1810N. In at least one embodiment, slices 1801A-1801N may include a set of additional function units (AFUs) 1812A-1812N, floating point units (FPUs) 1814A-1814N, integer arithmetic logic units (ALUs) 1816A-1816N, address calculation units (ACUs) 1813A-1813N, double precision floating point units (DPFPUs) 1815A-1815N, and matrix processing units (MPUs) 1817A-1817N.

[0181] In one embodiment, the FPU 1814A-1814N can perform single-precision (32-bit) and half-precision (16-bit) floating-point operations, while the DPFPU 1815A-1815N can perform double-precision (64-bit) floating-point operations. In at least one embodiment, the ALU 1816A-1816N can perform variable-precision integer operations with 8-bit, 16-bit, and 32-bit precision, and can be configured for mixed-precision operations. In at least one embodiment, the MPU 1817A-1817N can also be configured for mixed-precision matrix operations, including half-precision floating-point operations and 8-bit integer operations. In at least one embodiment, the MPU 1817A-1817N can perform various matrix operations to accelerate CUDA programs, including enabling support for accelerated general matrix-to-matrix multiplication (GEMM). In at least one embodiment, the AFU 1812A-1812N can perform additional logical operations that are not supported by the floating-point or integer units, including trigonometric operations (e.g., Sine, Cosine, etc.).

[0182] Fig.18BA general purpose graphics processing unit (GPGPU) 1830 in at least one embodiment is shown. In at least one embodiment, GPGPU 1830 is highly parallel and suitable for deployment on a multi-chip module. In at least one embodiment, GPGPU 1830 can be configured to enable highly parallel computing operations to be performed by a GPU array. In at least one embodiment, GPGPU 1830 can be directly linked to other instances of GPGPU 1830 to create a multi-GPU cluster to improve the execution time for CUDA programs. In at least one embodiment, GPGPU 1830 includes a host interface 1832 to enable connection with a host processor. In at least one embodiment, host interface 1832 is a PCIe interface. In at least one embodiment, host interface 1832 can be a manufacturer-specific communication interface or communication structure. In at least one embodiment, GPGPU 1830 receives commands from a host processor and dispatches execution threads associated with those commands to a group of computing clusters 1836A-1836H using a global scheduler 1834. In at least one embodiment, compute clusters 1836A-1836H share cache memory 1838. In at least one embodiment, cache memory 1838 may be used as a higher level cache for cache memories within compute clusters 1836A-1836H.

[0183] In at least one embodiment, GPGPU 1830 includes memory 1844A-1844B coupled to compute clusters 1836A-1836H via a set of memory controllers 1842A-1842B. In at least one embodiment, memory 1844A-1844B may include various types of memory devices, including dynamic random access memory (DRAM) or graphics random access memory, such as synchronous graphics random access memory (SGRAM), including graphics double data rate (GDDR) memory.

[0184] In at least one embodiment, computing clusters 1836A-1836H each include a set of graphics cores, such as Fig.18A The graphics core 1800, which may include multiple types of integer and floating point logic units, may perform computational operations at various precisions, including computations suitable for use with CUDA programs. For example, in at least one embodiment, at least a subset of the floating point units in each of the compute clusters 1836A-1836H may be configured to perform 16-bit or 32-bit floating point operations, while a different subset of the floating point units may be configured to perform 64-bit floating point operations.

[0185] In at least one embodiment, multiple instances of GPGPU 1830 may be configured to operate as a computing cluster. Computing clusters 1836A-1836H may implement any technically feasible communication technology for synchronization and data exchange. In at least one embodiment, multiple instances of GPGPU 1830 communicate through host interface 1832. In at least one embodiment, GPGPU 1830 includes an I / O hub 1839 that couples GPGPU 1830 with GPU link 1840, enabling direct connection to other instances of GPGPU 1830. In at least one embodiment, GPU link 1840 is coupled to a dedicated GPU to GPU bridge that enables communication and synchronization between multiple instances of GPGPU 1830. In at least one embodiment, GPU link 1840 is coupled to a high-speed interconnect to send and receive data to other GPGPUs or parallel processors. In at least one embodiment, multiple instances of GPGPU 1830 are located in separate data processing systems and communicate via network devices accessible via host interface 1832. In at least one embodiment, GPU link 1840 may be configured to be connected to a host processor, in addition to or in lieu of host interface 1832. In at least one embodiment, GPGPU 1830 may be configured to execute CUDA programs.

[0186] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0187] Fig.19A A parallel processor 1900 is shown in accordance with at least one embodiment. In at least one embodiment, various components of the parallel processor 1900 may be implemented using one or more integrated circuit devices, such as a programmable processor, an application specific integrated circuit (ASIC), or an FPGA.

[0188] In at least one embodiment, parallel processor 1900 includes parallel processing unit 1902. In at least one embodiment, parallel processing unit 1902 includes I / O unit 1904, which enables communication with other devices, including other instances of parallel processing unit 1902. In at least one embodiment, I / O unit 1904 can be directly connected to other devices. In at least one embodiment, I / O unit 1904 is connected to other devices by using a hub or switch interface (e.g., memory hub 1305). In at least one embodiment, the connection between memory hub 1305 and I / O unit 1904 forms a communication link. In at least one embodiment, I / O unit 1904 is connected to host interface 1906 and memory crossbar switch 1916, wherein host interface 1906 receives commands for performing processing operations and memory crossbar switch 1916 receives commands for performing memory operations.

[0189] In at least one embodiment, when the host interface 1906 receives the command buffer via the I / O unit 1904, the host interface 1906 can direct work operations to execute those commands to the front end 1908. In at least one embodiment, the front end 1908 is coupled with a scheduler 1910, which is configured to distribute commands or other work items to the processing array 1912. In at least one embodiment, the scheduler 1910 ensures that the processing array 1912 is properly configured and in a valid state before assigning tasks to the processing array 1912 in the processing array 1912. In at least one embodiment, the scheduler 1910 is implemented by firmware logic executed on a microcontroller. In at least one embodiment, the microcontroller-implemented scheduler 1910 can be configured to perform complex scheduling and work distribution operations at coarse and fine granularity, thereby achieving fast preemption and context switching of threads executing on the processing array 1912. In at least one embodiment, the host software can prove the workload for scheduling on the processing array 1912 through one of a plurality of graphics processing doorbells. In at least one embodiment, the workload may then be automatically distributed across the processing array 1912 by scheduler 1910 logic within a microcontroller that includes scheduler 1910 .

[0190] In at least one embodiment, the processing array 1912 may include up to "N" processing clusters (e.g., cluster 1914A, cluster 1914B, through cluster 1914N). In at least one embodiment, each cluster 1914A-1914N of the processing array 1912 may execute a large number of concurrent threads. In at least one embodiment, the scheduler 1910 may allocate work to the clusters 1914A-1914N of the processing array 1912 using a variety of scheduling and / or work allocation algorithms, which may vary depending on the workload generated by each program or type of computation. In at least one embodiment, scheduling may be handled dynamically by the scheduler 1910, or may be assisted in part by compiler logic during the compilation of program logic configured to be executed by the processing array 1912. In at least one embodiment, different clusters 1914A-1914N of the processing array 1912 may be allocated to process different types of programs or to perform different types of computations.

[0191] In at least one embodiment, the processing array 1912 can be configured to perform various types of parallel processing operations. In at least one embodiment, the processing array 1912 is configured to perform general-purpose parallel computing operations. For example, in at least one embodiment, the processing array 1912 can include logic to perform processing tasks including filtering video and / or audio data, performing modeling operations including physics operations, and performing data transformations.

[0192] In at least one embodiment, the processing array 1912 is configured to perform parallel graphics processing operations. In at least one embodiment, the processing array 1912 may include additional logic to support the execution of such graphics processing operations, including but not limited to texture sampling logic to perform texture operations, as well as tessellation logic and other vertex processing logic. In at least one embodiment, the processing array 1912 may be configured to execute shader programs related to graphics processing, such as but not limited to vertex shaders, tessellation shaders, geometry shaders, and pixel shaders. In at least one embodiment, the parallel processing unit 1902 may transfer data from the system memory via the I / O unit 1904 for processing. In at least one embodiment, during processing, the transferred data may be stored to an on-chip memory (e.g., parallel processor memory 1922) during processing and then written back to the system memory.

[0193] In at least one embodiment, when parallel processing unit 1902 is used to perform graph processing, scheduler 1910 can be configured to divide the processing workload into tasks of approximately equal size to better distribute graphics processing operations to multiple clusters 1914A-1914N of processing array 1912. In at least one embodiment, portions of processing array 1912 can be configured to perform different types of processing. For example, in at least one embodiment, a first portion can be configured to perform vertex shading and topology generation, a second portion can be configured to perform tessellation and geometry shading, and a third portion can be configured to perform pixel shading or other screen space operations to generate a rendered image for display. In at least one embodiment, intermediate data generated by one or more of clusters 1914A-1914N can be stored in a buffer to allow the intermediate data to be transferred between clusters 1914A-1914N for further processing.

[0194] In at least one embodiment, the processing array 1912 can receive processing tasks to be performed via the scheduler 1910, which receives commands defining the processing tasks from the front end 1908. In at least one embodiment, the processing tasks can include an index of the data to be processed, which can include surface (patch) data, primitive data, vertex data, and / or pixel data, as well as state parameters and commands defining how to process the data (e.g., what program to execute). In at least one embodiment, the scheduler 1910 can be configured to obtain the index corresponding to the task, or can receive the index from the front end 1908. In at least one embodiment, the front end 1908 can be configured to ensure that the processing array 1912 is configured to a valid state before starting the workload specified by the incoming command buffer (e.g., batch buffer, push buffer, etc.).

[0195] In at least one embodiment, each of the one or more instances of parallel processing unit 1902 can be coupled to parallel processor memory 1922. In at least one embodiment, parallel processor memory 1922 can be accessed via memory crossbar switch 1916, which can receive memory requests from processing array 1912 and I / O unit 1904. In at least one embodiment, memory crossbar switch 1916 can access parallel processor memory 1922 via memory interface 1918. In at least one embodiment, memory interface 1918 can include multiple partition units (e.g., partition unit 1920A, partition unit 1920B to partition unit 1920N), which can each be coupled to a portion of parallel processor memory 1922 (e.g., memory units). In at least one embodiment, the plurality of partition units 1920A-1920N are configured to be equal to the number of memory cells, such that the first partition unit 1920A has a corresponding first memory cell 1924A, the second partition unit 1920B has a corresponding memory cell 1924B, and the Nth partition unit 1920N has a corresponding Nth memory cell 1924N. In at least one embodiment, the number of partition units 1920A-1920N may not be equal to the number of memory devices.

[0196] In at least one embodiment, memory units 1924A-1924N may include various types of memory devices, including dynamic random access memory (DRAM) or graphics random access memory, such as synchronous graphics random access memory (SGRAM), including graphics double data rate (GDDR) memory. In at least one embodiment, memory units 1924A-1924N may also include 3D stacked memory, including but not limited to high bandwidth memory (HBM). In at least one embodiment, rendering targets such as frame buffers or texture maps may be stored across memory units 1924A-1924N, allowing partition units 1920A-1920N to write portions of each rendering target in parallel to efficiently use the available bandwidth of parallel processor memory 1922. In at least one embodiment, local instances of parallel processor memory 1922 may be excluded in favor of a unified memory design utilizing system memory in combination with local cache memory.

[0197] In at least one embodiment, any of the clusters 1914A-1914N of the processing array 1912 can process data to be written to any memory unit 1924A-1924N within the parallel processor memory 1922. In at least one embodiment, the memory crossbar 1916 can be configured to transmit the output of each cluster 1914A-1914N to any partition unit 1920A-1920N or another cluster 1914A-1914N, and the cluster 1914A-1914N can perform other processing operations on the output. In at least one embodiment, each cluster 1914A-1914N can communicate with the memory interface 1918 through the memory crossbar 1916 to read from or write to various external storage devices. In at least one embodiment, memory crossbar switch 1916 has connections to memory interface 1918 to communicate with I / O unit 1904, and connections to local instances of parallel processor memory 1922 to enable processing units within different processing clusters 1914A-1914N to communicate with system memory or other memory that is not local to parallel processing unit 1902. In at least one embodiment, memory crossbar switch 1916 may use virtual channels to separate traffic flows between clusters 1914A-1914N and partition units 1920A-1920N.

[0198] In at least one embodiment, multiple instances of parallel processing unit 1902 may be provided on a single plug-in card, or multiple plug-in cards may be interconnected. In at least one embodiment, different instances of parallel processing unit 1902 may be configured to interoperate, even if different instances have different numbers of processing cores, different numbers of local parallel processor memories, and / or other configuration differences. For example, in at least one embodiment, some instances of parallel processing unit 1902 may include higher precision floating point units relative to other instances. In at least one embodiment, a system incorporating one or more instances of parallel processing unit 1902 or parallel processor 1900 may be implemented in a variety of configurations and form factors, including but not limited to desktop, laptop or handheld personal computers, servers, workstations, game consoles, and / or embedded systems.

[0199] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0200] Fig.19B 1 shows a processing cluster 1994 according to at least one embodiment. In at least one embodiment, the processing cluster 1994 is included in a parallel processing unit. In at least one embodiment, the processing cluster 1994 is Fig.19A In at least one embodiment, processing cluster 1994 can be configured to execute many threads in parallel, where the term "thread" refers to an instance of a specific program executed on a specific set of input data. In at least one embodiment, single instruction multiple data (SIMD) instruction issuance technology is used to support the parallel execution of a large number of threads without providing multiple independent instruction units. In at least one embodiment, single instruction multiple thread (SIMT) technology is used to support the parallel execution of a large number of generally synchronized threads, which uses a common instruction unit that is configured to issue instructions to a group of processing engines within each processing cluster 1994.

[0201] In at least one embodiment, the operation of the processing cluster 1994 can be controlled by a pipeline manager 1932 that assigns processing tasks to SIMT parallel processors. In at least one embodiment, the pipeline manager 1932 Fig.19A The scheduler 1910 receives instructions and manages the execution of these instructions through the graphics multiprocessor 1934 and / or the texture unit 1936. In at least one embodiment, the graphics multiprocessor 1934 is an exemplary instance of a SIMT parallel processor. However, in at least one embodiment, various types of SIMT parallel processors of different architectures may be included in the processing cluster 1994. In at least one embodiment, one or more instances of the graphics multiprocessor 1934 may be included in the processing cluster 1994. In at least one embodiment, the graphics multiprocessor 1934 may process data, and the data crossbar 1940 may be used to distribute the processed data to one of multiple possible destinations (including other shader units). In at least one embodiment, the pipeline manager 1932 may facilitate the distribution of processed data by specifying the destination of the processed data to be distributed via the data crossbar 1940.

[0202] In at least one embodiment, each graphics multiprocessor 1934 within a processing cluster 1994 may include the same set of function execution logic (e.g., arithmetic logic unit, load store unit (LSU), etc.). In at least one embodiment, the function execution logic may be configured in a pipelined manner, where new instructions may be issued before previous instructions are completed. In at least one embodiment, the function execution logic supports a variety of operations, including integer and floating point arithmetic, comparison operations, Boolean operations, shifts, and calculations of various algebraic functions. In at least one embodiment, the same functional unit hardware may be utilized to perform different operations, and any combination of functional units may be present.

[0203] In at least one embodiment, the instructions transmitted to the processing cluster 1994 constitute threads. In at least one embodiment, a group of threads executed across a group of parallel processing engines is a thread group. In at least one embodiment, the thread group executes the program on different input data. In at least one embodiment, each thread within a thread group can be assigned to a different processing engine within the graphics multiprocessor 1934. In at least one embodiment, a thread group can include fewer threads than the number of processing engines within the graphics multiprocessor 1934. In at least one embodiment, when the number of threads included in the thread group is less than the number of processing engines, one or more processing engines may be idle during the cycle that is processing the thread group. In at least one embodiment, a thread group can also include more threads than the number of processing engines within the graphics multiprocessor 1934. In at least one embodiment, when the thread group includes more threads than the number of processing engines within the graphics multiprocessor 1934, processing can be performed in consecutive clock cycles. In at least one embodiment, multiple thread groups can be executed simultaneously on the graphics multiprocessor 1934.

[0204] In at least one embodiment, graphics multiprocessor 1934 includes internal cache memory to perform load and store operations. In at least one embodiment, graphics multiprocessor 1934 can abandon the internal cache and use cache memory (e.g., L1 cache 1948) within processing cluster 1994. In at least one embodiment, each graphics multiprocessor 1934 can also access partition units (e.g., Fig.19A1920A-1920N) that are shared between all processing clusters 1994 and can be used to transfer data between threads. In at least one embodiment, graphics multiprocessor 1934 can also access off-chip global memory, which can include one or more of local parallel processor memory and / or system memory. In at least one embodiment, any memory external to parallel processing unit 1902 can be used as global memory. In at least one embodiment, processing cluster 1994 includes multiple instances of graphics multiprocessor 1934, which can share common instructions and data that can be stored in L1 cache 1948.

[0205] In at least one embodiment, each processing cluster 1994 may include an MMU 1945 configured to map virtual addresses to physical addresses. In at least one embodiment, one or more instances of MMU 1945 may reside in Fig.19A 1918. In at least one embodiment, the MMU 1945 includes a set of page table entries (PTEs) that are used to map virtual addresses to physical addresses of tiles (talk more about tiles) and optionally to cache line indices. In at least one embodiment, the MMU 1945 may include an address translation lookaside buffer (TLB) or cache that may reside within the graphics multiprocessor 1934 or L1 cache 1948 or processing cluster 1994. In at least one embodiment, the physical addresses are processed to assign surface data access locality for efficient request interleaving between partition units. In at least one embodiment, the cache line index may be used to determine whether a request for a cache line is a hit or miss.

[0206] In at least one embodiment, the processing clusters 1994 can be configured such that each graphics multiprocessor 1934 is coupled to a texture unit 1936 to perform texture mapping operations, which may involve, for example, determining texture sample locations, reading texture data, and filtering texture data. In at least one embodiment, texture data is read from an internal texture L1 cache (not shown) or from an L1 cache within the graphics multiprocessor 1934, and texture data is retrieved from an L2 cache, local parallel processor memory, or system memory as needed. In at least one embodiment, each graphics multiprocessor 1934 outputs processed tasks to a data crossbar 1940 to provide the processed tasks to another processing cluster 1994 for further processing or to store the processed tasks in an L2 cache, local parallel processor memory, or system memory via a memory crossbar 1916. In at least one embodiment, a pre-raster operations unit (preROP) 1942 is configured to receive data from the graphics multiprocessor 1934, direct the data to a ROP unit, which may communicate with a partition unit (e.g., Fig.19A In at least one embodiment, the PreROP 1942 unit may perform optimizations for color blending, organize pixel color data, and perform address translation.

[0207] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0208] Fig.19C A graphics multiprocessor 1996 is shown according to at least one embodiment. In at least one embodiment, the graphics multiprocessor 1996 is Fig.19B 1934. In at least one embodiment, the graphics multiprocessor 1996 is coupled to the pipeline manager 1932 of the processing cluster 1994. In at least one embodiment, the graphics multiprocessor 1996 has an execution pipeline that includes, but is not limited to, an instruction cache 1952, an instruction unit 1954, an address mapping unit 1956, a register file 1958, one or more GPGPU cores 1962, and one or more LSUs 1966. The GPGPU cores 1962 and the LSUs 1966 are coupled to the cache memory 1972 and the shared memory 1970 via a memory and cache interconnect 1968.

[0209] In at least one embodiment, the instruction cache 1952 receives the instruction stream to be executed from the pipeline manager 1932. In at least one embodiment, the instructions are cached in the instruction cache 1952 and dispatched for execution by the instruction unit 1954. In one embodiment, the instruction unit 1954 can dispatch instructions as thread groups (e.g., warps), assigning each thread of the thread group to a different execution unit within the GPGPU core 1962. In at least one embodiment, the instructions can access any local, shared, or global address space by specifying an address within the unified address space. In at least one embodiment, the address mapping unit 1956 can be used to convert addresses in the unified address space into different memory addresses that can be accessed by the LSU 1966.

[0210] In at least one embodiment, register file 1958 provides a set of registers for the functional units of graphics multiprocessor 1996. In at least one embodiment, register file 1958 provides temporary storage for operands for data paths connected to the functional units (e.g., GPGPU core 1962, LSU 1966) of graphics multiprocessor 1996. In at least one embodiment, register file 1958 is divided between each functional unit so that a dedicated portion of register file 1958 is allocated to each functional unit. In at least one embodiment, register file 1958 is divided between different thread groups being executed by graphics multiprocessor 1996.

[0211] In at least one embodiment, the GPGPU cores 1962 may each include an FPU and / or ALU for executing instructions of the graphics multiprocessor 1996. The GPGPU cores 1962 may be similar in architecture or the architecture may be different. In at least one embodiment, the first portion of the GPGPU core 1962 includes a single-precision FPU and an integer ALU, while the second portion of the GPGPU core includes a double-precision FPU. In at least one embodiment, the FPU may implement the IEEE 754-2008 standard for floating-point arithmetic or enable variable-precision floating-point arithmetic. In at least one embodiment, the graphics multiprocessor 1996 may additionally include one or more fixed-function or special-function units to perform specific functions, such as copying rectangles or pixel blending operations. In at least one embodiment, one or more of the GPGPU cores 1962 may also include fixed or special-function logic.

[0212] In at least one embodiment, the GPGPU core 1962 includes SIMD logic capable of executing a single instruction to multiple sets of data. In at least one embodiment, the GPGPU core 1962 can physically execute SIMD4, SIMD8, and SIMD16 instructions, and logically execute SIMD1, SIMD2, and SIMD32 instructions. In at least one embodiment, the SIMD instructions for the GPGPU core can be generated by a shader compiler at compile time, or automatically generated when executing a program written and compiled for a single program multiple data (SPMD) or SIMT architecture. In at least one embodiment, multiple threads of a program configured for a SIMT execution model can be executed by a single SIMD instruction. For example, in at least one embodiment, eight SIMT threads that perform the same or similar operations can be executed in parallel by a single SIMD8 logic unit.

[0213] In at least one embodiment, the memory and cache interconnect 1968 is an interconnect network that connects each functional unit of the graphics multiprocessor 1996 to the register file 1958 and the shared memory 1970. In at least one embodiment, the memory and cache interconnect 1968 is a crossbar interconnect that allows the LSU 1966 to implement load and store operations between the shared memory 1970 and the register file 1958. In at least one embodiment, the register file 1958 can operate at the same frequency as the GPGPU core 1962, so that the latency of data transfer between the GPGPU core 1962 and the register file 1958 is very low. In at least one embodiment, the shared memory 1970 can be used to enable communication between threads executing on the functional units within the graphics multiprocessor 1996. In at least one embodiment, the cache memory 1972 can be used as, for example, a data cache to cache texture data communicated between the functional units and the texture unit 1936. In at least one embodiment, the shared memory 1970 can also be used as a program managed cache. In at least one embodiment, in addition to automatically cached data stored in cache memory 1972, threads executing on GPGPU core 1962 may programmatically store data in shared memory.

[0214] In at least one embodiment, a parallel processor or GPGPU as described herein is communicatively coupled to a host / processor core to accelerate graphics operations, machine learning operations, pattern analysis operations, and various general-purpose GPU (GPGPU) functions. In at least one embodiment, the GPU can be communicatively coupled to the host processor / core via a bus or other interconnect (e.g., a high-speed interconnect such as PCIe or NVLink). In at least one embodiment, the GPU can be integrated with the core on the same package or chip and communicatively coupled to the core via an internal processor bus / interconnect (i.e., inside the package or chip). In at least one embodiment, regardless of the manner in which the GPU is connected, the processor core can assign work to the GPU in the form of a sequence of commands / instructions contained in the WD. In at least one embodiment, the GPU then uses dedicated circuits / logic to efficiently process these commands / instructions.

[0215] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0216] Fig. 20 Graphics processor 2000 is shown in accordance with at least one embodiment. In at least one embodiment, graphics processor 2000 includes ring interconnect 2002, pipeline front end 2004, media engine 2037, and graphics cores 2080A-2080N. In at least one embodiment, ring interconnect 2002 couples graphics processor 2000 to other processing units, including other graphics processors or one or more general purpose processor cores. In at least one embodiment, graphics processor 2000 is one of many processors integrated within a multi-core processing system.

[0217] In at least one embodiment, the graphics processor 2000 receives batches of commands via the ring interconnect 2002. In at least one embodiment, the input commands are interpreted by a command streamer 2003 in a pipeline front end 2004. In at least one embodiment, the graphics processor 2000 includes scalable execution logic to perform 3D geometry processing and media processing via graphics cores 2080A-2080N. In at least one embodiment, for 3D geometry processing commands, the command streamer 2003 provides the commands to a geometry pipeline 2036. In at least one embodiment, for at least some media processing commands, the command streamer 2003 provides the commands to a video front end 2034, which is coupled to a media engine 2037. In at least one embodiment, the media engine 2037 includes a video quality engine (VQE) 2030 for video and image post-processing, and a multi-format encoding / decoding (MFX) 2033 engine for providing hardware accelerated media data encoding and decoding. In at least one embodiment, geometry pipeline 2036 and media engine 2037 each generate execution threads for thread execution resources provided by at least one graphics core 2080A.

[0218] In at least one embodiment, the graphics processor 2000 includes scalable thread execution resources featuring modular graphics cores 2080A-2080N (sometimes referred to as core slices), each of which has multiple sub-cores 2050A-2050N, 2060A-2060N (sometimes referred to as core sub-slices). In at least one embodiment, the graphics processor 2000 can have any number of graphics cores 2080A to 2080N. In at least one embodiment, the graphics processor 2000 includes a graphics core 2080A having at least a first sub-core 2050A and a second sub-core 2060A. In at least one embodiment, the graphics processor 2000 is a low-power processor having a single sub-core (e.g., 2050A). In at least one embodiment, the graphics processor 2000 includes multiple graphics cores 2080A-2080N, each of which includes a group of first sub-cores 2050A-2050N and a group of second sub-cores 2060A-2060N. In at least one embodiment, each of the first sub-cores 2050A-2050N includes at least a first set of execution units (EUs) 2052A-2052N and media / texture samplers 2054A-2054N. In at least one embodiment, each of the second sub-cores 2060A-2060N includes at least a second set of execution units 2062A-2062N and samplers 2064A-2064N. In at least one embodiment, each of the sub-cores 2050A-2050N, 2060A-2060N shares a set of shared resources 2070A-2070N. In at least one embodiment, the shared resources include a shared cache memory and pixel operation logic.

[0219] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0220] Fig.21 A processor 2100 is shown according to at least one embodiment. In at least one embodiment, the processor 2100 may include, but is not limited to, logic circuits for executing instructions. In at least one embodiment, the processor 2100 may execute instructions, including x86 instructions, ARM instructions, special instructions for ASICs, and the like. In at least one embodiment, the processor 2110 may include registers for storing packed data, such as 64-bit wide MMXTM registers in microprocessors enabled by Intel Corporation, Santa Clara, California, using MMX technology. In at least one embodiment, MMX registers available in integer and floating point form may operate with packed data elements, which are accompanied by SIMD and streaming SIMD extension ("SSE") instructions. In at least one embodiment, 128-bit wide XMM registers associated with SSE2, SSE3, SSE4, AVX or higher versions (generally referred to as "SSEx") technology may hold such packed data operands. In at least one embodiment, the processor 2110 may execute instructions to accelerate CUAD programs.

[0221] In at least one embodiment, the processor 2100 includes an in-order front end ("front end") 2101 to fetch instructions to be executed and prepare instructions for later use in the processor pipeline. In at least one embodiment, the front end 2101 may include several units. In at least one embodiment, an instruction prefetcher 2126 fetches instructions from memory and provides the instructions to an instruction decoder 2128, which in turn decodes or interprets the instructions. For example, in at least one embodiment, the instruction decoder 2128 decodes the received instructions into one or more operations of so-called "microinstructions" or "micro-operations" (also referred to as "micro-operations" or "microinstructions") for execution. In at least one embodiment, the instruction decoder 2128 parses the instructions into opcodes and corresponding data and control fields, which can be used by the microarchitecture to perform the operations. In at least one embodiment, the trace cache 2130 can assemble the decoded microinstructions into a program-ordered sequence or trace in the microinstruction queue 2134 for execution. In at least one embodiment, when the trace cache 2130 encounters a complex instruction, the microcode ROM 2132 provides the microinstructions required to complete the operation.

[0222] In at least one embodiment, some instructions may be converted into a single micro-operation, while other instructions may require several micro-operations to complete the entire operation. In at least one embodiment, if more than four micro-operations are required to complete an instruction, the instruction decoder 2128 may access the microcode ROM 2132 to execute the instruction. In at least one embodiment, the instruction may be decoded into a small number of micro-operations for processing at the instruction decoder 2128. In at least one embodiment, if multiple micro-operations are required to complete the operation, the instruction may be stored in the microcode ROM 2132. In at least one embodiment, the trace cache 2130 references the entry point programmable logic array ("PLA") to determine the correct micro-instruction pointer for reading the microcode sequence from the microcode ROM 2132 to complete one or more instructions according to at least one embodiment. In at least one embodiment, after the microcode ROM 2132 completes the micro-operation sequencing of the instruction, the front end 2101 of the machine may resume fetching micro-operations from the trace cache 2130.

[0223] In at least one embodiment, an out-of-order execution engine ("out-of-order engine") 2103 can prepare instructions for execution. In at least one embodiment, the out-of-order execution logic has multiple buffers to smooth and reorder the instruction stream to optimize performance when the instructions go down the pipeline and are scheduled for execution. The out-of-order execution engine 2103 includes, but is not limited to, a distributor / register renamer 2140, a memory microinstruction queue 2142, an integer / floating point microinstruction queue 2144, a memory scheduler 2146, a fast scheduler 2102, a slow / general floating point scheduler ("slow / general FP scheduler") 2104, and a simple floating point scheduler ("simple FP scheduler") 2106. In at least one embodiment, the fast scheduler 2102, the slow / general floating point scheduler 2104, and the simple floating point scheduler 2106 are also collectively referred to as "microinstruction schedulers 2102, 2104, 2106". The distributor / register renamer 2140 allocates the machine buffers and resources required for each microinstruction to execute in sequence. In at least one embodiment, the allocator / register renamer 2140 renames the logical registers into entries in the register file. In at least one embodiment, the allocator / register renamer 2140 also allocates entries for each microinstruction in one of two microinstruction queues, a memory microinstruction queue 2142 for memory operations and an integer / floating point microinstruction queue 2144 for non-memory operations, in front of the memory scheduler 2146 and the microinstruction schedulers 2102, 2104, 2106. In at least one embodiment, the microinstruction schedulers 2102, 2104, 2106 determine when the microinstructions are ready to execute based on the readiness of their slave input register operand sources and the availability of the execution resource microinstructions that need to be completed. In at least one embodiment, the fast scheduler 2102 of at least one embodiment can schedule on every half of the main clock cycle, while the slow / general floating point scheduler 2104 and the simple floating point scheduler 2106 can schedule once per main processor clock cycle. In at least one embodiment, microinstruction schedulers 2102, 2104, 2106 arbitrate between dispatch ports to schedule microinstructions for execution.

[0224] In at least one embodiment, execution block 2111 includes, but is not limited to, integer register file / branch network 2108, floating point register file / branch network ("FP register file / branch network") 2110, address generation units ("AGUs") 2112 and 2114, fast arithmetic logic units ("fast ALUs") 2116 and 2118, slow ALU 2120, floating point ALU ("FP") 2122, and floating point move unit ("FP move") 2124. In at least one embodiment, integer register file / branch network 2108 and floating point register file / bypass network 2110 are also referred to herein as "register files 2108, 2110". In at least one embodiment, ALUs 2112 and 2114, fast ALUs 2116 and 2118, slow ALU 2120, floating point ALU 2122, and floating point move unit 2124 are also referred to herein as "execution units 2112, 2114, 2116, 2118, 2120, 2122, and 2124." In at least one embodiment, an execution block may include, but is not limited to, any number (including zero) and type of register files, branch networks, address generation units, and execution units (in any combination).

[0225] In at least one embodiment, register files 2108, 2110 can be arranged between microinstruction schedulers 2102, 2104, 2106 and execution units 2112, 2114, 2116, 2118, 2120, 2122 and 2124. In at least one embodiment, integer register file / branch network 2108 performs integer operations. In at least one embodiment, floating point register file / branch network 2110 performs floating point operations. In at least one embodiment, each of register files 2108, 2110 can include but is not limited to a branch network that can bypass or forward the just completed result that has not yet been written to the register file to a new slave object. In at least one embodiment, register files 2108, 2110 can communicate data with each other. In at least one embodiment, integer register file / branch network 2108 can include but is not limited to two separate register files, one register file for low-order 32-bit data, and a second register file for high-order 32-bit data. In at least one embodiment, floating point register file / branch network 2110 may include, but is not limited to, 128-bit wide entries, since floating point instructions typically have operands that are 64 to 128 bits wide.

[0226] In at least one embodiment, the execution units 2112, 2114, 2116, 2118, 2120, 2122, 2124 can execute instructions. In at least one embodiment, the register files 2108, 2110 store integer and floating point data operand values ​​that the microinstructions need to execute. In at least one embodiment, the processor 2100 may include, but is not limited to, any number of execution units 2112, 2114, 2116, 2118, 2120, 2122, 2124 and combinations thereof. In at least one embodiment, the floating point ALU 2122 and the floating point move unit 2124 can perform floating point, MMX, SIMD, AVX and SSE or other operations, including specialized machine learning instructions. In at least one embodiment, the floating point ALU 2122 may include, but is not limited to, a 64-bit by 64-bit floating point divider to perform division, square root and remainder micro-operations. In at least one embodiment, floating point hardware may be used to process instructions involving floating point values. In at least one embodiment, ALU operations can be passed to fast ALUs 2116, 2118. In at least one embodiment, fast ALUs 2116, 2118 can perform fast operations with an effective delay of half a clock cycle. In at least one embodiment, most complex integer operations enter slow ALU 2120, because slow ALU 2120 can include, but is not limited to, integer execution hardware for long-delay type operations, such as multipliers, shifts, flag logic, and branch processing. In at least one embodiment, memory load / store operations can be performed by AGUS 2112, 2114. In at least one embodiment, fast ALU 2116, fast ALU 2118, and slow ALU 2120 can perform integer operations on 64-bit data operands. In at least one embodiment, fast ALU 2116, fast ALU 2118, and slow ALU 2120 can be implemented to support various data bit sizes including 16, 32, 128, 256, etc. In at least one embodiment, the floating point ALU 2122 and floating point move unit 2124 can be implemented to support a range of operands having bits of various widths. In at least one embodiment, the floating point ALU 2122 and floating point move unit 2124 can operate on 128-bit wide packed data operands in conjunction with SIMD and multimedia instructions.

[0227] In at least one embodiment, microinstruction schedulers 2102, 2104, 2106 schedule dependent operations before the parent load completes execution. In at least one embodiment, since microinstructions can be speculatively scheduled and executed in processor 2100, processor 2100 can also include logic for handling memory misses. In at least one embodiment, if the data load in the data cache misses, there may be dependent operations running in the pipeline, which temporarily prevents the scheduler from having the correct data. In at least one embodiment, a replay mechanism tracks and re-executes instructions that use incorrect data. In at least one embodiment, it may be necessary to replay dependent operations and independent operations may be allowed to complete. In at least one embodiment, the scheduler and replay mechanism of at least one embodiment of the processor may also be designed to capture instruction sequences for text string comparison operations.

[0228] In at least one embodiment, the term "register" may refer to an onboard processor storage location that can be used as part of an instruction to identify an operand. In at least one embodiment, registers may be those that can be used from outside the processor (from a programmer's perspective). In at least one embodiment, registers may not be limited to a particular type of circuit. On the contrary, in at least one embodiment, registers can store data, provide data, and perform the functions described herein. In at least one embodiment, the registers described herein can be implemented using a variety of different techniques by circuits within the processor, such as dedicated physical registers, physical registers dynamically allocated using register renaming, a combination of dedicated and dynamically allocated physical registers, etc. In at least one embodiment, integer registers store 32-bit integer data. The register file of at least one embodiment also includes eight multimedia SIMD registers for packaging data.

[0229] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0230] Fig. 22A processor 2200 is shown in accordance with at least one embodiment. In at least one embodiment, the processor 2200 includes, but is not limited to, one or more processor cores (cores) 2202A-2202N, an integrated memory controller 2214, and an integrated graphics processor 2208. In at least one embodiment, the processor 2200 may include additional cores up to and including the additional processor core 2202N represented by the dashed box. In at least one embodiment, each processor core 2202A-2202N includes one or more internal cache units 2204A-2204N. In at least one embodiment, each processor core may also have access to one or more shared cache units 2206.

[0231] In at least one embodiment, the internal cache units 2204A-2204N and the shared cache unit 2206 represent a cache memory hierarchy within the processor 2200. In at least one embodiment, the cache memory units 2204A-2204N may include at least one level of instruction and data within each processor core and one or more levels of cache in a shared mid-level cache, such as L2, L3, Level 4 (L4), or other levels of cache, where the highest level of cache is classified as LLC before external memory. In at least one embodiment, cache coherency logic maintains coherency between the various cache units 2206 and 2204A-2204N.

[0232] In at least one embodiment, the processor 2200 may also include a set of one or more bus controller units 2216 and a system agent core 2210. In at least one embodiment, the one or more bus controller units 2216 manage a set of peripheral buses, such as one or more PCI or PCI Express buses. In at least one embodiment, the system agent core 2210 provides management functions for various processor components. In at least one embodiment, the system agent core 2210 includes one or more integrated memory controllers 2214 to manage access to various external memory devices (not shown).

[0233] In at least one embodiment, one or more processor cores 2202A-2202N include support for multiple threads simultaneously. In at least one embodiment, system agent core 2210 includes components for coordinating and operating processor cores 2202A-2202N during multithreaded processing. In at least one embodiment, system agent core 2210 may additionally include a power control unit (PCU) that includes logic and components to adjust one or more power states of processor cores 2202A-2202N and graphics processor 2208.

[0234] In at least one embodiment, the processor 2200 additionally includes a graphics processor 2208 to perform graphics processing operations. In at least one embodiment, the graphics processor 2208 is coupled to a shared cache unit 2206 and a system agent core 2210 including one or more integrated memory controllers 2214. In at least one embodiment, the system agent core 2210 also includes a display controller 2211 for driving the graphics processor output to one or more coupled displays. In at least one embodiment, the display controller 2211 may also be a separate module coupled to the graphics processor 2208 via at least one interconnect, or may be integrated within the graphics processor 2208.

[0235] In at least one embodiment, a ring-based interconnect unit 2212 is used to couple the internal components of the processor 2200. In at least one embodiment, alternative interconnect units may be used, such as point-to-point interconnects, switched interconnects, or other technologies. In at least one embodiment, the graphics processor 2208 is coupled to the ring interconnect 2212 via an I / O link 2213.

[0236] In at least one embodiment, I / O link 2213 represents at least one of a variety of I / O interconnects, including packaged I / O interconnects that facilitate communication between various processor components and high-performance embedded memory modules 2218 (e.g., eDRAM modules). In at least one embodiment, each of processor cores 2202A-2202N and graphics processor 2208 uses embedded memory module 2218 as a shared LLC.

[0237] In at least one embodiment, the processor cores 2202A-2202N are homogeneous cores that execute a common instruction set architecture. In at least one embodiment, the processor cores 2202A-2202N are heterogeneous in terms of ISA, wherein one or more processor cores 2202A-2202N execute a common instruction set, while one or more other processor cores 2202A-2202N execute a subset of a common instruction set or a different instruction set. In at least one embodiment, the processor cores 2202A-2202N are heterogeneous in terms of microarchitecture, wherein one or more cores with relatively high power consumption are coupled with one or more power cores with lower power consumption. In at least one embodiment, the processor 2200 can be implemented on one or more chips or as a SoC integrated circuit.

[0238] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0239] Fig.23 A graphics processor core 2300 is shown in accordance with at least one described embodiment. In at least one embodiment, the graphics processor core 2300 is included within a graphics core array. In at least one embodiment, the graphics processor core 2300 (sometimes referred to as a core slice) may be one or more graphics cores within a modular graphics processor. In at least one embodiment, the graphics processor core 2300 is an example of a graphics core slice, and the graphics processors described herein may include multiple graphics core slices based on target power and performance envelopes. In at least one embodiment, each graphics core 2300 may include a fixed function block 2330 coupled to multiple sub-cores 2301A-2301F, also referred to as sub-slices, which include modular blocks of general purpose and fixed function logic.

[0240] In at least one embodiment, fixed function block 2330 includes a geometry / fixed function pipeline 2336, which may be shared by all sub-cores in graphics processor 2300, for example, in lower performance and / or lower power graphics processor implementations. In at least one embodiment, geometry / fixed function pipeline 2336 includes a 3D fixed function pipeline, a video front end unit, a thread generator and thread dispatcher, and a unified return buffer manager that manages a unified return buffer.

[0241] In at least one embodiment, the fixed function block 2330 also includes a graphics SoC interface 2337, a graphics microcontroller 2338, and a media pipeline 2339. The graphics SoC interface 2337 provides an interface between the graphics core 2300 and other processor cores in the SoC integrated circuit system. In at least one embodiment, the graphics microcontroller 2338 is a programmable subprocessor that can be configured to manage various functions of the graphics processor 2300, including thread dispatching, scheduling, and preemption. In at least one embodiment, the media pipeline 2339 includes logic that helps decode, encode, pre-process, and / or post-process multimedia data including image and video data. In at least one embodiment, the media pipeline 2339 implements media operations via requests to calculation or sampling logic within the sub-cores 2301-2301F.

[0242] In at least one embodiment, the SoC interface 2337 enables the graphics core 2300 to communicate with a general application processor core (e.g., a CPU) and / or other components within the SoC, including memory hierarchy elements such as shared LLC memory, system RAM, and / or embedded on-chip or packaged DRAM. In at least one embodiment, the SoC interface 2337 may also enable communication with fixed-function devices within the SoC (e.g., a camera imaging pipeline), and enable the use and / or implementation of global memory atomics that can be shared between the graphics core 2300 and the CPU within the SoC. In at least one embodiment, the SoC interface 2337 may also implement power management controls for the graphics core 2300 and enable interfaces between the clock domain of the graphics core 2300 and other clock domains within the SoC. In at least one embodiment, the SoC interface 2337 enables command buffers to be received from a command stream converter and a global thread dispatcher, which are configured to provide commands and instructions to each of one or more graphics cores within the graphics processor. In at least one embodiment, commands and instructions may be dispatched to media pipeline 2339 when media operations are to be performed, or may be assigned to geometry and fixed function pipelines (e.g., geometry and fixed function pipeline 2336, geometry and fixed function pipeline 2314) when graph processing operations are to be performed.

[0243] In at least one embodiment, the graphics microcontroller 2338 can be configured to perform various scheduling and management tasks for the graphics core 2300. In at least one embodiment, the graphics microcontroller 2338 can perform graph and / or compute workload scheduling on various graphics parallel engines within the execution unit (EU) arrays 2302A-2302F, 2304A-2304F in the sub-cores 2301A-2301F. In at least one embodiment, host software executing on a CPU core of a SoC including the graphics core 2300 can submit a workload to one of a plurality of graphics processor doorbells, which invokes scheduling operations on the appropriate graphics engine. In at least one embodiment, the scheduling operations include determining which workload to run next, submitting the workload to the command stream converter, preempting existing workloads running on the engine, monitoring the progress of the workload, and notifying the host software when the workload is completed. In at least one embodiment, graphics microcontroller 2338 may also facilitate low power or idle states for graphics core 2300, thereby providing graphics core 2300 with the ability to save and restore registers across low power state transitions within graphics core 2300 independent of an operating system and / or graphics driver software on the system.

[0244] In at least one embodiment, the graphics core 2300 may have more or fewer sub-cores than the sub-cores 2301A-2301F shown, up to N modular sub-cores. For each set of N sub-cores, in at least one embodiment, the graphics core 2300 may also include shared function logic 2310, shared and / or cache memory 2312, geometry / fixed function pipelines 2314, and additional fixed function logic 2316 to accelerate various graphics and compute processing operations. In at least one embodiment, the shared function logic 2310 may include logic units (e.g., samplers, math and / or inter-thread communication logic) that may be shared by each of the N sub-cores within the graphics core 2300. The shared and / or cache memory 2312 may be the LLC for the N sub-cores 2301A-2301F within the graphics core 2300, and may also be used as a shared memory accessible by multiple sub-cores. In at least one embodiment, geometry / fixed function pipeline 2314 may be included in place of geometry / fixed function pipeline 2336 within fixed function block 2330 and may include the same or similar logic units.

[0245] In at least one embodiment, the graphics core 2300 includes additional fixed function logic 2316, which may include various fixed function acceleration logic for use by the graphics core 2300. In at least one embodiment, the additional fixed function logic 2316 includes an additional geometry pipeline for use in position-only shading. In position-only shading, there are at least two geometry pipelines, and in the full geometry pipeline and the culling pipeline within the geometry / fixed function pipelines 2316, 2336, it is an additional geometry pipeline that may be included in the additional fixed function logic 2316. In at least one embodiment, the culling pipeline is a trimmed version of the full geometry pipeline. In at least one embodiment, the full pipeline and the culling pipeline can execute different instances of an application, each with a separate environment. In at least one embodiment, position-only shading can hide long culling runs for discarded triangles, so that shading can be completed earlier in some cases. For example, in at least one embodiment, the culling pipeline logic in the additional fixed function logic 2316 can execute position shaders in parallel with the main application and generally generate critical results faster than the full pipeline because the culling pipeline obtains and masks the position attributes of the vertices without having to perform rasterization and render the pixels to the frame buffer. In at least one embodiment, the culling pipeline can use the generated critical results to calculate visibility information for all triangles, regardless of whether they are culled. In at least one embodiment, the full pipeline (which in this case may be called a replay pipeline) can consume visibility information to skip culled triangles to mask only visible triangles that are ultimately passed to the rasterization stage.

[0246] In at least one embodiment, the additional fixed function logic 2316 may also include general purpose processing acceleration logic, such as fixed function matrix multiplication logic, for implementing a slowed down CUAD program.

[0247] In at least one embodiment, a set of execution resources is included within each graphics sub-core 2301A-2301F, which can be used to perform graphics, media, and compute operations in response to requests from a graphics pipeline, a media pipeline, or a shader program. In at least one embodiment, the graphics sub-core 2301A-2301F includes multiple EU arrays 2302A-2302F, 2304A-2304F, thread dispatch and inter-thread communication (TD / IC) logic 2303A-2303F, 3D (e.g., texture) samplers 2305A-2305F, media samplers 2306A-2306F, shader processors 2307A-2307F, and shared local memory (SLM) 2308A-2308F. Each of the EU arrays 2302A-2302F, 2304A-2304F includes multiple execution units, which are GUGPUs capable of servicing graphics, media, or computing operations, performing floating-point and integer / fixed-point logic operations, including graphics, media, or computing shader programs. In at least one embodiment, the TD / IC logic 2303A-2303F performs local thread dispatching and thread control operations for the execution units within the sub-core, and facilitates communication between threads executed on the execution units of the sub-core. In at least one embodiment, the 3D samplers 2305A-2305F can read data associated with textures or other 3D graphics into memory. In at least one embodiment, the 3D samplers can read texture data differently based on the configured sampling state and texture format associated with a given texture. In at least one embodiment, the media samplers 2306A-2306F can perform similar read operations based on the type and format associated with the media data. In at least one embodiment, each graphics sub-core 2301A-2301F may alternatively include a unified 3D and media sampler. In at least one embodiment, threads executing on execution units within each sub-core 2301A-2301F may utilize shared local memory 2308A-2308F within each sub-core to enable threads executing within a thread group to execute using a common pool of on-chip memory.

[0248] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0249] Fig.24 A parallel processing unit ("PPU") 2400 is shown according to at least one embodiment. In at least one embodiment, the PPU 2400 is configured with machine-readable code that, if executed by the PPU 2400, causes the PPU 2400 to perform some or all of the processes and techniques described throughout this document. In at least one embodiment, the PPU 2400 is a multithreaded processor implemented on one or more integrated circuit devices, and utilizes multithreading as a latency hiding technique designed to process computer-readable instructions (also referred to as machine-readable instructions or simply instructions) executed in parallel on multiple threads. In at least one embodiment, a thread refers to an execution thread and is an instance of a group of instructions configured to be executed by the PPU 2400. In at least one embodiment, the PPU 2400 is a graphics processing unit ("GPU") configured to implement a graphics rendering pipeline for processing three-dimensional ("3D") graphics data to generate two-dimensional ("2D") image data for display on a display device (such as an LCD device). In at least one embodiment, the PPU 2400 is used to perform calculations, such as linear algebra operations and machine learning operations. Fig.24 The example parallel processor is shown for illustrative purposes only, and should be construed as a non-limiting example of a processor architecture implemented in at least one embodiment.

[0250] In at least one embodiment, one or more PPUs 2400 are configured to accelerate high performance computing (“HPC”), data center, and machine learning applications. In at least one embodiment, one or more PPUs 2400 are configured to accelerate CUDA programs. In at least one embodiment, PPU 2400 includes, but is not limited to, I / O unit 2406, front end unit 2410, scheduler unit 2412, work distribution unit 2414, hub 2416, crossbar switch (“Xbar”) 2420, one or more general processing clusters (“GPC”) 2418, and one or more partition units (“memory partition units”) 2422. In at least one embodiment, PPU 2400 is connected to a host processor or other PPU 2400 via one or more high-speed GPU interconnects (“GPU interconnects”) 2408. In at least one embodiment, PPU 2400 is connected to a host processor or other peripheral devices via interconnect 2402. In one embodiment, PPU 2400 is connected to a local memory including one or more memory devices (“memory”) 2404. In at least one embodiment, memory device 2404 includes, but is not limited to, one or more dynamic random access memory ("DRAM") devices. In at least one embodiment, one or more DRAM devices are configured and / or configurable as a high bandwidth memory ("HBM") subsystem, and multiple DRAM dies are stacked within each device.

[0251] In at least one embodiment, the high-speed GPU interconnect 2408 may refer to a wire-based multi-lane communication link that the system uses to scale and includes one or more PPUs 2400 ("CPUs") in conjunction with one or more CPUs, supporting cache coherency between the PPU 2400 and the CPUs and CPU mastering. In at least one embodiment, the high-speed GPU interconnect 2408 transmits data and / or commands to other units of the PPU 2400, such as one or more copy engines, video encoders, video decoders, power management units, and / or other units in the PPU 2400 through the hub 2416. Fig.24 Other components that may not be explicitly shown.

[0252] In at least one embodiment, I / O unit 2406 is configured to receive data from a host processor ( Fig.24In at least one embodiment, the I / O unit 2406 communicates with the host processor directly through the system bus 2402 or through one or more intermediate devices (e.g., a memory bridge). In at least one embodiment, the I / O unit 2406 can communicate with one or more other processors (e.g., one or more PPUs 2400) via the system bus 2402. In at least one embodiment, the I / O unit 2406 implements a PCIe interface for communicating over a PCIe bus. In at least one embodiment, the I / O unit 2406 implements an interface for communicating with external devices.

[0253] In at least one embodiment, the I / O unit 2406 decodes packets received via the system bus 2402. In at least one embodiment, at least some of the packets represent commands configured to cause the PPU 2400 to perform various operations. In at least one embodiment, the I / O unit 2406 sends the decoded commands to various other units of the PPU 2400 as specified by the commands. In at least one embodiment, the commands are sent to the front end unit 2410 and / or to the hub 2416 or other units of the PPU 2400, such as one or more replication engines, video encoders, video decoders, power management units, etc. ( Fig.24 In at least one embodiment, I / O unit 2406 is configured to route communications between various logical units of PPU 2400.

[0254] In at least one embodiment, a program executed by a host processor encodes a command stream in a buffer that provides a workload to the PPU 2400 for processing. In at least one embodiment, the workload includes instructions and data to be processed by those instructions. In at least one embodiment, the buffer is an area in memory that is accessible (e.g., read / write) by both the host processor and the PPU 2400—the host interface unit can be configured to access the buffer in the system memory connected to the system bus 2402 via the memory request transmitted via the I / O unit 2406 through the system bus 2402. In at least one embodiment, the host processor writes the command stream to the buffer and then sends a pointer indicating the start of the command stream to the PPU 2400, so that the front end unit 2410 receives one or more command stream pointers and manages one or more command streams, reads commands from the command stream and forwards the commands to the various units of the PPU 2400.

[0255] In at least one embodiment, the front end unit 2410 is coupled to a scheduler unit 2412 that configures the various GPCs 2418 to process tasks defined by one or more command streams. In at least one embodiment, the scheduler unit 2412 is configured to track state information related to the various tasks managed by the scheduler unit 2412, where the state information may indicate which GPC 2418 the task is assigned to, whether the task is active or inactive, a priority associated with the task, etc. In at least one embodiment, the scheduler unit 2412 manages multiple tasks that are executed on one or more GPCs 2418.

[0256] In at least one embodiment, the scheduler unit 2412 is coupled to a work distribution unit 2414, which is configured to dispatch tasks for execution on the GPCs 2418. In at least one embodiment, the work distribution unit 2414 tracks a plurality of scheduled tasks received from the scheduler unit 2412 and the work distribution unit 2414 manages a pending task pool and an active task pool for each GPC 2418. In at least one embodiment, the pending task pool includes a plurality of time slots (e.g., 32 time slots) containing tasks assigned to be processed by a particular GPC 2418; the active task pool may include a plurality of time slots (e.g., 4 time slots) for tasks actively processed by the GPC 2418, such that as one of the tasks in the GPC 2418 completes execution, the task is evicted from the active task pool of the GPC 2418 and one of the other tasks is selected from the pending task pool and scheduled for execution on the GPC 2418. In at least one embodiment, if the active task is idle on GPC 2418, such as while waiting for data dependencies to be resolved, the active task is evicted from GPC 2418 and returned to the pending task pool, while another task in the pending task pool is selected and scheduled for execution on GPC 2418.

[0257] In at least one embodiment, work distribution unit 2414 communicates with one or more GPCs 2418 via XBar 2420. In at least one embodiment, XBar 2420 is an interconnect network that couples many units of PPU 2400 to other units of PPU 2400 and can be configured to couple work distribution unit 2414 to a specific GPC 2418. In at least one embodiment, other units of one or more PPU 2400 can also be connected to XBar 2420 through hub 2416.

[0258] In at least one embodiment, the tasks are managed by the scheduler unit 2412 and assigned to one of the GPCs 2418 by the work distribution unit 2414. The GPC 2418 is configured to process the tasks and produce results. In at least one embodiment, the results can be consumed by other tasks in the GPC 2418, routed to different GPCs 2418 through the XBar 2420, or stored in the memory 2404. In at least one embodiment, the results can be written to the memory 2404 through the partition unit 2422, which implements a memory interface for writing data to or reading data from the memory 2404. In at least one embodiment, the results can be transmitted to another PPU 2400 or CPU via the high-speed GPU interconnect 2408. In at least one embodiment, the PPU 2400 includes, but is not limited to, U partition units 2422, which is equal to the number of separate and different memory devices 2404 coupled to the PPU 2400.

[0259] In at least one embodiment, the host processor executes a driver core that implements an application programming interface (API) that enables one or more applications executing on the host processor to schedule operations for execution on the PPU 2400. In one embodiment, multiple computing applications are executed simultaneously by the PPU 2400, and the PPU 2400 provides isolation, quality of service (“QoS”), and independent address spaces for multiple computing applications. In at least one embodiment, the application generates instructions (e.g., in the form of API calls) that cause the driver core to generate one or more tasks for execution by the PPU 2400, and the driver core outputs the tasks to one or more streams processed by the PPU 2400. In at least one embodiment, each task includes one or more related thread groups, which may be referred to as warps. In at least one embodiment, a warp includes multiple related threads (e.g., 32 threads) that can be executed in parallel. In at least one embodiment, a cooperative thread may refer to multiple threads, including instructions for executing tasks and exchanging data through a shared memory.

[0260] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0261] Fig.25FIG. 2 shows a GPC 2500 according to at least one embodiment. In at least one embodiment, the GPC 2500 is Fig.24 2418. In at least one embodiment, each GPC 2500 includes, but is not limited to, multiple hardware units for processing tasks, and each GPC 2500 includes, but is not limited to, a pipeline manager 2502, a pre-raster operations unit ("PROP") 2504, a raster engine 2508, a work distribution crossbar ("WDX") 2516, a memory management unit ("MMU") 2518, one or more data processing clusters ("DPCs") 2506, and any suitable combination of components.

[0262] In at least one embodiment, the operation of the GPC 2500 is controlled by a pipeline manager 2502. In at least one embodiment, the pipeline manager 2502 manages the configuration of one or more DPCs 2506 to process tasks assigned to the GPC 2500. In at least one embodiment, the pipeline manager 2502 configures at least one of the one or more DPCs 2506 to implement at least a portion of a graphics rendering pipeline. In at least one embodiment, the DPC 2506 is configured to execute vertex shader programs on a programmable streaming multiprocessor (“SM”) 2514. In at least one embodiment, the pipeline manager 2502 is configured to route packets received from the work distribution unit to appropriate logic units within the GPC 2500, and in at least one embodiment, some packets may be routed to fixed function hardware units in the PROP 2504 and / or the raster engine 2508, while other packets may be routed to the DPC 2506 for processing by the primitive engine 2512 or the SM 2514. In at least one embodiment, pipeline manager 2502 configures at least one of DPCs 2506 to implement a neural network model and / or a computational pipeline. In at least one embodiment, pipeline manager 2502 configures at least one of DPCs 2506 to execute at least a portion of a CUDA program.

[0263] In at least one embodiment, PROP unit 2504 is configured to route data generated by raster engine 2508 and DPC 2506 to a raster operations ("ROP") unit in a partition unit, such as described above in conjunction with Fig.242422, etc., described in more detail. In at least one embodiment, the PROP unit 2504 is configured to perform optimizations for color blending, organize pixel data, perform address translation, and the like. In at least one embodiment, the raster engine 2508 includes, but is not limited to, a plurality of fixed-function hardware units configured to perform various raster operations, and in at least one embodiment, the raster engine 2508 includes, but is not limited to, a setup engine, a coarse raster engine, a culling engine, a clipping engine, a fine raster engine, a tile aggregation engine, and any suitable combination thereof. In at least one embodiment, the setup engine receives the transformed vertices and generates plane equations associated with the geometric primitives defined by the vertices; the plane equations are transmitted to the coarse raster engine to generate coverage information for the basic primitives (e.g., an x, y coverage mask for the tile); the output of the coarse raster engine is transmitted to the culling engine, where fragments associated with primitives that fail the z test are culled, and to the clipping engine, where fragments outside the viewing frustum are clipped. In at least one embodiment, the clipped and culled fragments are passed to a fine raster engine to generate properties for the pixel fragments based on the plane equations generated by the setup engine. In at least one embodiment, the output of the raster engine 2508 includes fragments to be processed by any appropriate entity (e.g., by a fragment shader implemented within the DPC 2506).

[0264] In at least one embodiment, each DPC 2506 included in GPC 2500 includes, but is not limited to, an M-pipeline controller ("MPC") 2510; a primitive engine 2512; one or more SMs 2514; and any suitable combination thereof. In at least one embodiment, MPC 2510 controls the operation of DPC 2506, routing packets received from pipeline manager 2502 to appropriate units in DPC 2506. In at least one embodiment, packets associated with vertices are routed to primitive engine 2512, which is configured to fetch vertex attributes associated with the vertices from memory; conversely, packets associated with shader programs may be sent to SM 2514.

[0265] In at least one embodiment, SM 2514 includes, but is not limited to, a programmable stream processor configured to process tasks represented by multiple threads. In at least one embodiment, SM 2514 is multithreaded and configured to execute multiple threads (e.g., 32 threads) from a specific thread group simultaneously, and implements a single instruction, multiple data ("SIMD") architecture, wherein each thread in a group of threads (e.g., a warp) is configured to process different data sets based on the same instruction set. In at least one embodiment, all threads in a thread group execute the same instruction. In at least one embodiment, SM 2514 implements a single instruction, multiple thread ("SIMT") architecture, wherein each thread in a group of threads is configured to process different data sets based on the same instruction set, but wherein individual threads in a thread group are allowed to diverge during execution. In at least one embodiment, a program counter, call stack, and execution state are maintained for each warp, thereby achieving concurrency between warps and serial execution within the warp when threads in the warp diverge. In another embodiment, a program counter, call stack, and execution state are maintained for each individual thread, thereby enabling equal concurrency between all threads within and between warps. In at least one embodiment, execution state is maintained for each individual thread, and threads executing the same instruction can be converged and executed in parallel to improve efficiency. Fig.26 At least one embodiment of SM 2514 is described in more detail.

[0266] In at least one embodiment, MMU 2518 is used between GPC 2500 and memory partitioning unit (e.g., Fig.24 The MMU 2518 provides an interface between the partition unit 2422 of the memory, and provides virtual address to physical address translation, memory protection, and arbitration of memory requests. In at least one embodiment, the MMU 2518 provides one or more translation lookaside buffers ("TLBs") for performing translation of virtual addresses to physical addresses in memory.

[0267] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0268] Fig.26 Streaming multiprocessor ("SM") 2600 is shown in accordance with at least one embodiment. In at least one embodiment, SM 2600 is Fig.25 SM 2514. In at least one embodiment, SM 2600 includes, but is not limited to, instruction cache 2602; one or more scheduler units 2604; register file 2608; one or more processing cores ("cores") 2610; one or more special function units ("SFUs") 2612; one or more load / store units ("LSUs") 2614; interconnect network 2616; shared memory / level 1 ("L1") cache 2618; and any suitable combination thereof. In at least one embodiment, a work distribution unit schedules tasks for execution on a general processing cluster ("GPC") of a parallel processing unit ("PPU"), and each task is assigned to a specific data processing cluster ("DPC") within a GPC, and if the task is associated with a shader program, the task is assigned to one of SM 2600. In at least one embodiment, scheduler unit 2604 receives tasks from the work distribution unit and manages instruction scheduling for one or more thread blocks assigned to SM 2600. In at least one embodiment, the scheduler unit 2604 schedules thread blocks to execute as warps of parallel threads, where each thread block is assigned at least one warp. In at least one embodiment, each warp executes a thread. In at least one embodiment, the scheduler unit 2604 manages a plurality of different thread blocks, assigns warps to different thread blocks, and then dispatches instructions from a plurality of different cooperative groups to various functional units (e.g., processing cores 2610, SFUs 2612, and LSUs 2614) in each clock cycle.

[0269] In at least one embodiment, "cooperative groups" may refer to a programming model for organizing groups of communicating threads that allows developers to express the granularity at which threads are communicating, thereby enabling the expression of richer and more efficient parallel decompositions. In at least one embodiment, the cooperative launch API supports synchronization between thread blocks to execute parallel algorithms. In at least one embodiment, the API of the conventional programming model provides a single, simple construct for synchronizing cooperative threads: a barrier across all threads of a thread block (e.g., a syncthreads() function). However, in at least one embodiment, programmers can define thread groups at a granularity smaller than a thread block and synchronize within the defined group to achieve higher performance, design flexibility, and software reuse in the form of a collective group-wide functional interface. In at least one embodiment, cooperative groups enable programmers to explicitly define thread groups at sub-block and multi-block granularity and perform collective operations, such as synchronizing threads in a cooperative group. In at least one embodiment, the sub-block granularity is as small as a single thread. In at least one embodiment, the programming model supports clean composition across software boundaries, so that libraries and utility functions can be safely synchronized in their local environment without having to make assumptions about convergence. In at least one embodiment, the cooperation group primitives enable new patterns of cooperative parallelism, including but not limited to producer-consumer parallelism, opportunistic parallelism, and global synchronization over an entire grid of thread blocks.

[0270] In at least one embodiment, the dispatch unit 2606 is configured to send instructions to one or more of the functional units, and the scheduler unit 2604 includes but is not limited to two dispatch units 2606 that enable two different instructions from the same thread warp to be dispatched per clock cycle. In at least one embodiment, each scheduler unit 2604 includes a single dispatch unit 2606 or additional dispatch units 2606.

[0271] In at least one embodiment, each SM 2600 includes, in at least one embodiment, but is not limited to, a register file 2608 that provides a set of registers for the functional units of the SM 2600. In at least one embodiment, the register file 2608 is divided between each functional unit, so that a dedicated portion of the register file 2608 is allocated to each functional unit. In at least one embodiment, the register file 2608 is divided between different thread warps executed by the SM 2600, and the register file 2608 provides temporary storage for operands of the data paths connected to the functional units. In at least one embodiment, each SM 2600 includes, but is not limited to, a plurality of L processing cores 2610. In at least one embodiment, the SM 2600 includes, but is not limited to, a large number (e.g., 128 or more) of different processing cores 2610. In at least one embodiment, each processing core 2610 includes, in at least one embodiment, but is not limited to, a fully pipelined, single-precision, double-precision, and / or mixed-precision processing unit, including, but not limited to, a floating-point arithmetic logic unit and an integer arithmetic logic unit. In at least one embodiment, the floating-point arithmetic logic unit implements the IEEE 754-2008 standard for floating-point arithmetic. In at least one embodiment, processing core 2610 includes, but is not limited to, 64 single precision (32-bit) floating point cores, 64 integer cores, 32 double precision (64-bit) floating point cores, and 8 tensor cores.

[0272] In at least one embodiment, the tensor core is configured to perform matrix operations. In at least one embodiment, one or more tensor cores are included in the processing core 2610. In at least one embodiment, the tensor core is configured to perform deep learning matrix arithmetic, such as convolution operations for neural network training and reasoning. In at least one embodiment, each tensor core operates on a 4×4 matrix and performs a matrix multiplication and accumulation operation D=A×B+C, where A, B, C, and D are 4×4 matrices.

[0273] In at least one embodiment, the matrix multiplication inputs A and B are 16-bit floating point matrices, and the accumulation matrices C and D are 16-bit floating point or 32-bit floating point matrices. In at least one embodiment, the tensor core performs a 32-bit floating point accumulation operation on the 16-bit floating point input data. In at least one embodiment, the 16-bit floating point multiplication uses 64 operations and obtains a full-precision product, which is then accumulated with other intermediate products using 32-bit floating point addition to perform a 4x4x4 matrix multiplication. In at least one embodiment, the tensor core is used to perform larger two-dimensional or higher-dimensional matrix operations composed of these smaller elements. In at least one embodiment, an API (such as a CUDA-C++ API) exposes specialized matrix loads, matrix multiplications and accumulations, and matrix storage operations to efficiently use tensor cores from CUDA-C++ programs. In at least one embodiment, at the CUDA level, the warp level interface assumes a 16×16 size matrix across all 32 warp threads.

[0274] In at least one embodiment, each SM 2600 includes, but is not limited to, M SFUs 2612 that perform special functions (e.g., attribute evaluation, reciprocal square root, etc.). In at least one embodiment, the SFUs 2612 include, but are not limited to, tree traversal units configured to traverse a hierarchical tree data structure. In at least one embodiment, the SFUs 2612 include, but are not limited to, texture units configured to perform texture map filtering operations. In at least one embodiment, the texture units are configured to load texture maps (e.g., 2D arrays of texture pixels) from memory and sample the texture maps to produce sampled texture values ​​for use by shader programs executed by the SM 2600. In at least one embodiment, the texture maps are stored in a shared memory / L1 cache 2618. In at least one embodiment, the texture units implement texture operations (such as filtering operations) using mip-maps (e.g., texture maps with different levels of detail). In at least one embodiment, each SM 2600 includes, but is not limited to, two texture units.

[0275] In at least one embodiment, each SM 2600 includes, but is not limited to, N LSUs 2614 that implement load and store operations between shared memory / L1 cache 2618 and register file 2608. In at least one embodiment, each SM 2600 includes, but is not limited to, an interconnect network 2616 that connects each functional unit to register file 2608, and the LSUs 2614 connect to register file 2608 and shared memory / L1 cache 2618. In at least one embodiment, the interconnect network 2616 is a crossbar switch that can be configured to connect any functional unit to any register in register file 2608, and to connect the LSUs 2614 to memory locations in register file 2608 and shared memory / L1 cache 2618.

[0276] In at least one embodiment, the shared memory / L1 cache 2618 is an array of on-chip memory that allows data storage and communication between the SM 2600 and the primitive engines and between threads in the SM 2600 in at least one embodiment. In at least one embodiment, the shared memory / L1 cache 2618 includes, but is not limited to, a storage capacity of 128KB and is located in the path from the SM 2600 to the partition unit. In at least one embodiment, the shared memory / L1 cache 2618 is used in at least one embodiment for caching reads and writes. In at least one embodiment, one or more of the shared memory / L1 cache 2618, the L2 cache, and the memory is a backing store.

[0277] In at least one embodiment, data cache and shared memory functions are combined into a single memory block, providing improved performance for both types of memory access. In at least one embodiment, the capacity is used by programs that do not use the shared memory or as a cache, for example, if the shared memory is configured to use half of the capacity, the texture and load / store operations can use the remaining capacity. According to at least one embodiment, the integration within the shared memory / L1 cache 2618 enables the shared memory / L1 cache 2618 to be used as a high throughput pipeline for streaming data while providing high bandwidth and low latency access to frequently reused data. In at least one embodiment, when configured for general parallel computing, a simpler configuration can be used compared to graphics processing. In at least one embodiment, a fixed-function GPU is bypassed, thereby creating a simpler programming model. In at least one embodiment, in a general parallel computing configuration, the work distribution unit directly allocates and distributes blocks of threads to DPCs. In at least one embodiment, threads in a block execute the same program, use unique thread IDs in computations to ensure that each thread generates unique results, use SM 2600 to execute the program and perform computations, use shared memory / L1 cache 2618 to communicate between threads, and use LSU 2614 to read and write global memory through shared memory / L1 cache 2618 and memory partitioning units. In at least one embodiment, when configured for general parallel computing, SM 2600 writes commands to scheduler unit 2604 that can be used to start new work on a DPC.

[0278] In at least one embodiment, the PPU is included in or coupled to a desktop computer, a laptop computer, a tablet computer, a server, a supercomputer, a smartphone (e.g., wireless, handheld device), a PDA, a digital camera, a vehicle, a head mounted display, a handheld electronic device, etc. In at least one embodiment, the PPU is implemented on a single semiconductor substrate. In at least one embodiment, the PPU is included in a system on a chip ("SoC") along with one or more other devices (e.g., additional PPUs, memory, a RISC CPU, an MMU, a digital-to-analog converter ("DAC"), etc.).

[0279] In at least one embodiment, the PPU may be included on a graphics card that includes one or more storage devices. The graphics card may be configured to connect to a PCIe slot on a desktop computer motherboard. In at least one embodiment, the PPU may be an integrated GPU ("iGPU") included in a chipset of the motherboard.

[0280] In at least one embodiment, the components of the figure are cooled by a heat sink assembly connected to the components by a flexible heat pipe. In at least one embodiment, the flexible heat pipe includes a loop thermosyphon. In at least one embodiment, the position of the heat sink is adjustable, and the heat sink is connected to the figure. In at least one embodiment, adjustment of the position of the heat sink improves airflow to the heat sink, or to other components or heat sinks. In at least one embodiment, improved airflow improves cooling efficiency.

[0281] Software Construction for General Computing

[0282] The following figures illustrate, but are not limited to, exemplary software configurations for implementing at least one embodiment.

[0283] Fig. 27 A software stack for a programming platform according to at least one embodiment is shown. In at least one embodiment, a programming platform is a platform for utilizing hardware on a computing system to accelerate computing tasks. In at least one embodiment, a software developer can access the programming platform through libraries, compiler instructions, and / or extensions to a programming language. In at least one embodiment, the programming platform can be, but is not limited to, CUDA, Radeon Open Compute Platform ("ROCm"), OpenCL (OpenCL developed by Khronosgroup), TM ), SYCL, or Intel One API.

[0284] In at least one embodiment, the software stack 2700 of the programming platform provides an execution environment for the application 2701. In at least one embodiment, the application 2701 may include any computer software that can be launched on the software stack 2700. In at least one embodiment, the application 2701 may include, but is not limited to, artificial intelligence ("AI") / machine learning ("ML") applications, high performance computing ("HPC") applications, virtual desktop infrastructure ("VDI"), or data center workloads.

[0285] In at least one embodiment, the application 2701 and the software stack 2700 run on the hardware 2707. In at least one embodiment, the hardware 2707 may include one or more GPUs, CPUs, FPGAs, AI engines, and / or other types of computing devices that support programming platforms. In at least one embodiment, for example, using CUDA, the software stack 2700 may be vendor-specific and only compatible with devices from a specific vendor. In at least one embodiment, for example, in using OpenCL, the software stack 2700 can be used with devices from different vendors. In at least one embodiment, the hardware 2707 includes a host connected to one or more devices, which can be accessed via an application programming interface (API) call to perform computing tasks. In at least one embodiment, compared to the host in the hardware 2707, it may include but is not limited to a CPU (but may also include a computing device) and its memory, and the devices in the hardware 2707 may include but are not limited to a GPU, FPGA, AI engine or other computing device (but may also include a CPU) and its memory.

[0286] In at least one embodiment, the software stack 2700 of the programming platform includes, but is not limited to, multiple libraries 2703, runtime 2705, and device kernel drivers 2706. In at least one embodiment, each library in the library 2703 may include data and programming code that can be used by a computer program and utilized during software development. In at least one embodiment, the library 2703 may include, but is not limited to, pre-written code and subroutines, classes, values, type specifications, configuration data, documentation, help data, and / or message templates. In at least one embodiment, the library 2703 includes functions optimized for execution on one or more types of devices. In at least one embodiment, the library 2703 may include, but is not limited to, functions for performing math, deep learning, and / or other types of operations on the device. In at least one embodiment, the library 2803 is associated with a corresponding API 2802, which may include one or more APIs that expose functions implemented in the library 2803.

[0287] In at least one embodiment, the application 2701 is written as source code that is compiled into executable code as follows: Figure 32-342701. In at least one embodiment, the executable code of the application 2701 can be run at least in part on an execution environment provided by the software stack 2700. In at least one embodiment, during the execution of the application 2701, code that needs to be run on the device (as opposed to the host) can be obtained. In this case, in at least one embodiment, the runtime 2705 can be called to load and start the necessary code on the device. In at least one embodiment, the runtime 2705 can include any technically feasible runtime system that can support the execution of the application 2701.

[0288] In at least one embodiment, runtime 2705 is implemented as one or more runtime libraries associated with a corresponding API (which is shown as API 2704). In at least one embodiment, one or more such runtime libraries may include, but are not limited to, functions for memory management, execution control, device management, error handling, and / or synchronization, etc. In at least one embodiment, memory management functions may include, but are not limited to, functions for allocating, deallocating, and copying device memory and transferring data between host memory and device memory. In at least one embodiment, execution control functions may include, but are not limited to, functions for launching functions on a device (sometimes referred to as "kernels" when the function is a global function callable from the host), and functions for setting property values ​​in buffers maintained by the runtime library for a given function to be executed on the device.

[0289] In at least one embodiment, the runtime library and corresponding API 2704 may be implemented in any technically feasible manner. In at least one embodiment, one (or any number of) APIs may expose a low-level set of functions for fine-grained control of a device, while another (or any number of) APIs may expose such a higher-level set of functions. In at least one embodiment, a high-level runtime API may be built on top of the low-level APIs. In at least one embodiment, one or more runtime APIs may be language-specific APIs layered on top of a language-independent runtime API.

[0290] In at least one embodiment, the device kernel driver 2706 is configured to facilitate communication with the underlying device. In at least one embodiment, the device kernel driver 2706 can provide APIs such as API 2704 and / or low-level functions that other software depends on. In at least one embodiment, the device kernel driver 2706 can be configured to compile the intermediate representation ("IR") code into binary code at runtime. In at least one embodiment, for CUDA, the device kernel driver 2706 can compile non-hardware-specific parallel thread execution ("PTX") IR code into binary code (cache compiled binary code) for a specific target device at runtime, which is sometimes also referred to as "final" code. In at least one embodiment, doing so can allow the final code to run on a target device, which may not exist when the source code is initially compiled into PTX code. Alternatively, in at least one embodiment, the device source code can be compiled into binary code offline without the need for the device kernel driver 2706 to compile the IR code at runtime.

[0291] Fig.28 According to at least one embodiment, Fig. 27 2801. In at least one embodiment, the CUDA software stack 2800 on which the application 2801 can be launched includes a CUDA library 2803, a CUDA runtime 2805, a CUDA driver 2807, and a device kernel driver 2808. In at least one embodiment, the CUDA software stack 2800 is executed on hardware 2809, which may include a CUDA-enabled GPU developed by NVIDIA Corporation of Santa Clara, California.

[0292] In at least one embodiment, the application 2801, the CUDA runtime 2805, and the device kernel driver 2808 can respectively perform functions similar to the application 2701, the runtime 2705, and the device kernel driver 2706, and the above combination Fig. 27It is described. In at least one embodiment, the CUDA driver 2807 includes a library (libcuda.so) that implements the CUDA driver API 2806. In at least one embodiment, similar to the CUDA runtime API 2804 implemented by the CUDA runtime library (cudart), the CUDA driver API 2806 can disclose but is not limited to functions for memory management, execution control, device management, error handling, synchronization and / or graphics interoperability, etc. In at least one embodiment, the CUDA driver API 2806 is different from the CUDA runtime API 2804 in that the CUDA runtime API 2804 simplifies device code management by providing implicit initialization, context (similar to process) management, and module (similar to dynamically loaded library) management. In contrast to the high-level CUDA runtime API 2804, in at least one embodiment, the CUDA driver API 2806 is a low-level API that provides finer-grained control over the device, particularly with respect to context and module loading. In at least one embodiment, the CUDA driver API 2806 can disclose functions for context management that are not disclosed by the CUDA runtime API 2804. In at least one embodiment, the CUDA driver API 2806 is also language-independent and supports, for example, OpenCL in addition to the CUDA runtime API 2804. Furthermore, in at least one embodiment, the development libraries including the CUDA runtime 2805 can be considered separate from the driver components, including the user-mode CUDA driver 2807 and the kernel-mode device driver 2808 (sometimes also referred to as a "display" driver).

[0293] In at least one embodiment, the CUDA library 2803 may include, but is not limited to, a math library, a deep learning library, a parallel algorithm library, and / or a signal / image / video processing library, which may be utilized by parallel computing applications (e.g., application 2801). In at least one embodiment, the CUDA library 2803 may include a math library, such as the cuBLAS library, which is an implementation of the Basic Linear Algebra Subroutines ("BLAS") for performing linear algebra operations; the cuFFT library for computing fast Fourier transforms ("FFTs"), and the cuRAND library for generating random numbers, etc. In at least one embodiment, the CUDA library 2803 may include a deep learning library, such as the cuDNN library for primitives for deep neural networks and the TensorRT platform for high-performance deep learning inference, etc.

[0294] Fig.29 According to at least one embodiment, Fig. 27In at least one embodiment, the ROCm software stack 2900 on which the application 2901 can be launched includes a language runtime 2903, a system runtime 2905, a thunk 2907, a ROCm kernel driver 2908, and a device kernel driver. In at least one embodiment, the ROCm software stack 2900 is executed on hardware 2909, which may include a ROCm-enabled GPU developed by AMD, Inc. of Santa Clara, California.

[0295] In at least one embodiment, application 2901 may execute in conjunction with the above Fig. 27 In addition, in at least one embodiment, the language runtime 2903 and the system runtime 2905 can perform functions similar to those of the application 2701 discussed above. Fig. 27 In at least one embodiment, the language runtime 2903 and the system runtime 2905 are different in that the system runtime 2905 is a language-independent runtime that implements the ROCr system runtime API 2904 and utilizes the heterogeneous system architecture ("HSA") runtime API. In at least one embodiment, the HSA runtime API is a thin user mode API that exposes interfaces for accessing and interacting with the AMD GPU, including functions for memory management, execution control of kernels dispatched by the architecture, error handling, system and agent information, and runtime initialization and shutdown. In at least one embodiment, compared to the system runtime 2905, the language runtime 2903 is an implementation of a language-specific runtime API 2902 layered on top of the ROCr system runtime API 2904. In at least one embodiment, the language runtime API may include, but is not limited to, a portable heterogeneous computing interface ("HIP") language runtime API, a heterogeneous computing compiler ("HCC") language runtime API, or an OpenCL API, among others. In particular, the HIP language is an extension of the C++ programming language with a functionally similar version of the CUDA mechanism, and in at least one embodiment, the HIP language runtime API includes a combination of the above Fig.28 Functions similar to the CUDA runtime API 2804 discussed above, such as those used for memory management, execution control, device management, error handling, synchronization, etc.

[0296] In at least one embodiment, thunk (ROCt) 2907 is an interface that can be used to interact with the underlying ROCm driver 2908. In at least one embodiment, the ROCm driver 2908 is a ROCk driver, which is a combination of the AMDGPU driver and the HSA kernel driver (amdkfd). In at least one embodiment, the AMDGPU driver is a device kernel driver for GPUs developed by AMD that performs the above combined Fig. 27 The HSA kernel driver 2706 is a device kernel driver that allows different types of processors to more efficiently share system resources via hardware features.

[0297] In at least one embodiment, various libraries (not shown) may be included in the ROCm software stack 2900 above the language runtime 2903 and provide for integration with the above. Fig.28 The various libraries may include, but are not limited to, math, deep learning, and / or other libraries, such as a hipBLAS library that implements functions similar to CUDA cuBLAS, a rocFFT library similar to CUDA cuFFT for computing FFT, and the like.

[0298] Fig.30 According to at least one embodiment, Fig. 27 In at least one embodiment, the OpenCL software stack 3000 on which the application 3001 can be launched includes an OpenCL framework 3005, an OpenCL runtime 3006, and a driver 3007. In at least one embodiment, the OpenCL software stack 3000 is executed on hardware 2809 that is not vendor-specific. In at least one embodiment, because devices developed by different vendors support OpenCL, specific OpenCL drivers may be required to interoperate with hardware from such vendors.

[0299] In at least one embodiment, the application 3001, the OpenCL runtime 3006, the device kernel driver 3007 and the hardware 3008 can respectively execute the above combined Fig. 27 The discussed applications 2701, runtime 2705, device kernel driver 2706, and hardware 2707 have similar functionality. In at least one embodiment, the application 3001 also includes an OpenCL kernel 3002 having code to be executed on the device.

[0300] In at least one embodiment, OpenCL defines a "platform" that allows a host to control devices connected to the host. In at least one embodiment, the OpenCL framework provides a platform layer API and a runtime API, shown as platform API 3003 and runtime API 3005. In at least one embodiment, the runtime API 3005 uses contexts to manage the execution of kernels on devices. In at least one embodiment, each identified device can be associated with a respective context, and the runtime API 3005 can use the context to manage the command queue, program objects and kernel objects, shared memory objects, etc. of the device. In at least one embodiment, the platform API 3003 exposes functions that allow device contexts to be used to select and initialize devices, submit work to devices via command queues, and enable data transfer from and to devices, etc. In addition, in at least one embodiment, the OpenCL framework provides various built-in functions (not shown), including mathematical functions, relational functions, image processing functions, etc.

[0301] In at least one embodiment, compiler 3004 is also included in OpenCL framework 3005. In at least one embodiment, source code can be compiled offline before executing the application or compiled online during execution of the application. In contrast to CUDA and ROCm, OpenCL applications in at least one embodiment can be compiled online by compiler 3004, which is included to represent any number of compilers that can be used to compile source code and / or IR code (e.g., Standard Portable Intermediate Representation ("SPIR-V") code) into binary code. Alternatively, in at least one embodiment, OpenCL applications can be compiled offline before executing such applications.

[0302] Fig.31 Software supported by a programming platform according to at least one embodiment is shown. In at least one embodiment, the programming platform 3104 is configured to support various programming models 3103, middleware and / or libraries 3102, and frameworks 3101 that the application 3100 can rely on. In at least one embodiment, the application 3100 can be an AI / ML application implemented using, for example, a deep learning framework (e.g., MXNet, PyTorch, or TensorFlow), which can rely on libraries such as cuDNN, NVIDIA Collective Communications Library ("NCCL"), and / or NVIDIA Developer Data Loading Library ("DALI") CUDA libraries to provide accelerated computing on the underlying hardware.

[0303] In at least one embodiment, programming platform 3104 can be a combination of the above Fig.28 , Fig.29 and Fig.30 One of the CUDA, ROCm, or OpenCL platforms described. In at least one embodiment, the programming platform 3104 supports multiple programming models 3103, which are abstractions of the underlying computing system that allow the expression of algorithms and data structures. In at least one embodiment, the programming model 3103 can expose features of the underlying hardware to improve performance. In at least one embodiment, the programming model 3103 can include, but is not limited to, CUDA, HIP, OpenCL, C++ Accelerated Massive Parallelism ("C++AMP"), Open Multiprocessing ("OpenMP"), Open Accelerators ("OpenACC"), and / or Vulcan Compute.

[0304] In at least one embodiment, the library and / or middleware 3102 provides an abstract implementation of the programming model 3104. In at least one embodiment, such a library includes data and programming code that can be used by a computer program and utilized during software development. In at least one embodiment, in addition to those that can be obtained from the programming platform 3104, such middleware also includes software that provides services to applications. In at least one embodiment, the library and / or middleware 3102 may include, but is not limited to, cuBLAS, cuFFT, cuRAND and other CUDA libraries, or rocBLAS, rocFFT, rocRAND and other ROCm libraries. In addition, in at least one embodiment, the library and / or middleware 3102 may include NCCL and ROCm communication collection libraries ("RCCL") libraries that provide communication routines for GPUs, MIOpen libraries for deep learning acceleration and / or intrinsic libraries for linear algebra, matrix and vector operations, geometric transformations, numerical solvers, and related algorithms.

[0305] In at least one embodiment, application framework 3101 relies on library and / or middleware 3102. In at least one embodiment, each application framework 3101 is a software framework for implementing a standard structure of application software. Returning to the AI / ML example discussed above, in at least one embodiment, AI / ML applications can be implemented using a framework such as Caffe, Caffe2, TensorFlow, Keras, PyTorch, or MxNet deep learning framework.

[0306] Fig.32 Compiled code according to at least one embodiment is shown to Figure 27-30In at least one embodiment, compiler 3201 receives source code 3200, which includes both host code and device code. In at least one embodiment, compiler 3201 is configured to convert source code 3200 into host executable code 3202 for execution on the host and device executable code 3203 for execution on the device. In at least one embodiment, source code 3200 can be compiled offline before executing the application, or compiled online during execution of the application.

[0307] In at least one embodiment, source code 3200 may include code in any programming language supported by compiler 3201, such as C++, C, Fortran, etc. In at least one embodiment, source code 3200 may be included in a single-source file having a mixture of host code and device code, and indicating the location of the device code therein. In at least one embodiment, the single-source file may be a .cu file including CUDA code or a .hip.cpp file including HIP code. Alternatively, in at least one embodiment, source code 3200 may include multiple source code files, rather than a single source file, in which host code and device code are separated.

[0308] In at least one embodiment, compiler 3201 is configured to compile source code 3200 into host executable code 3202 for execution on a host and device executable code 3203 for execution on a device. In at least one embodiment, compiler 3201 performs operations including parsing source code 3200 into an abstract system tree (AST), performing optimizations, and generating executable code. In at least one embodiment where source code 3200 includes a single source file, compiler 3201 can separate device code from host code in such a single source file, compile the device code and host code into device executable code 3203 and host executable code 3202, respectively, and link device executable code 3203 and host executable code 3202 together in a single file, as described below with respect to Fig.33 discussed in more detail.

[0309] In at least one embodiment, the host executable code 3202 and the device executable code 3203 can be in any suitable format, such as binary code and / or IR code. In the case of CUDA, in at least one embodiment, the host executable code 3202 can include native object code, and the device executable code 3203 can include code in a PTX intermediate representation. In at least one embodiment, in the case of ROCm, both the host executable code 3202 and the device executable code 3203 can include target binary code.

[0310] Fig.33 is a compiled code according to at least one embodiment to Figure 27-30 3301 is a more detailed illustration of the execution on one of the programming platforms of . In at least one embodiment, the compiler 3301 is configured to receive the source code 3300, compile the source code 3300, and output an executable file 3308. In at least one embodiment, the source code 3300 is a single source file, such as a .cu file, a .hip.cpp file, or a file in other formats, which includes both host code and device code. In at least one embodiment, the compiler 3301 can be, but is not limited to, the NVIDIA CUDA compiler ("NVCC") for compiling CUDA code in .cu files, or the HCC compiler for compiling HIP code in .hip.cpp files.

[0311] In at least one embodiment, compiler 3301 includes compiler front end 3302, host compiler 3305, device compiler 3306, and linker 3309. In at least one embodiment, compiler front end 3302 is configured to separate device code 3304 from host code 3303 in source code 3300. In at least one embodiment, device code 3304 is compiled by device compiler 3306 into device executable code 3308, which may include binary code or IR code as described. In at least one embodiment, host code 3303 is separately compiled by host compiler 3305 into host executable code 3307. In at least one embodiment, for NVCC, host compiler 3305 may be, but is not limited to, a general C / C++ compiler that outputs native object code, and device compiler 3306 may be, but is not limited to, a low-level virtual machine ("LLVM")-based compiler that forks the LLVM compiler infrastructure and outputs PTX code or binary code. In at least one embodiment, for HCC, both the host compiler 3305 and the device compiler 3306 can be, but are not limited to, LLVM-based compilers that output target binary code.

[0312] In at least one embodiment, after source code 3300 is compiled into host executable code 3307 and device executable code 3308, linker 3309 links host and device executable code 3307 and 3308 together in executable file 3310. In at least one embodiment, native object code for the host and PTX or binary code for the device may be linked together in an Executable and Linkable Format ("ELF") file, which is a container format for storing object code.

[0313] Fig.343402 is a program that converts source code before compiling it according to at least one embodiment. In at least one embodiment, source code 3400 is passed through conversion tool 3401, which converts source code 3400 into converted source code 3402. In at least one embodiment, compiler 3403 is used to compile converted source code 3402 into host executable code 3404 and device executable code 3405, which is similar to the process of compiler 3201 compiling source code 3200 into host executable code 3202 and device executable code 3203, as described above in conjunction with Fig.32 discussed.

[0314] In at least one embodiment, the conversion performed by conversion tool 3401 is used to port source code 3400 to execute in an environment different from that on which it was originally intended to run. In at least one embodiment, conversion tool 3401 may include, but is not limited to, a HIP converter for "hipifying" CUDA code for a CUDA platform into HIP code that can be compiled and executed on a ROCm platform. In at least one embodiment, conversion of source code 3400 may include parsing source code 3400 and converting calls to APIs provided by one programming model (e.g., CUDA) to corresponding calls to APIs provided by another programming model (e.g., HIP), as described below in conjunction with Figures 35A-36 Returning to the example of porting CUDA code, in at least one embodiment, calls to the CUDA runtime API, CUDA driver API, and / or CUDA library can be converted to corresponding HIP API calls. In at least one embodiment, the automatic conversion performed by the conversion tool 3401 may sometimes be incomplete, requiring additional manual work to fully port the source code 3400.

[0315] Configuring GPUs for general computing

[0316] The following figures illustrate, but are not limited to, exemplary architectures for compiling and executing computing source code according to at least one embodiment.

[0317] Fig.35AA system 3500 is shown configured to compile and execute CUDA source code 3510 using different types of processing units in accordance with at least one embodiment. In at least one embodiment, the system 3500 includes, but is not limited to, CUDA source code 3510, a CUDA compiler 3550, a host executable 3570(1), a host executable 3570(2), a CUDA device executable 3584, a CPU 3590, a CUDA-enabled GPU 3594, a GPU 3592, a CUDA to HIP conversion tool 3520, a HIP source code 3530, a HIP compiler driver 3540, an HCC 3560, and an HCC device executable 3582.

[0318] In at least one embodiment, the CUDA source code 3510 is a collection of human-readable code of the CUDA programming language. In at least one embodiment, the CUDA code is a human-readable code of the CUDA programming language. In at least one embodiment, the CUDA programming language is an extension of the C++ programming language, which includes but is not limited to a mechanism for defining device code and distinguishing device code from host code. In at least one embodiment, the device code is a source code that can be executed in parallel on a device after compilation. In at least one embodiment, the device can be a processor optimized for parallel instruction processing, such as a CUDA-enabled GPU 3590, GPU 3592, or another GPGPU. In at least one embodiment, the host code is a source code that can be executed on a host after compilation. In at least one embodiment, the host is a processor optimized for sequential instruction processing, such as a CPU 3590.

[0319] In at least one embodiment, the CUDA source code 3510 includes, but is not limited to, any number (including zero) of global functions 3512, any number (including zero) of device functions 3514, any number (including zero) of host functions 3516, and any number (including zero) of host / device functions 3518. In at least one embodiment, global functions 3512, device functions 3514, host functions 3516, and host / device functions 3518 can be mixed in the CUDA source code 3510. In at least one embodiment, each global function 3512 is executable on a device and can be called from a host. Therefore, in at least one embodiment, one or more of the global functions 3512 can serve as an entry point for a device. In at least one embodiment, each global function 3512 is a kernel. In at least one embodiment and in a technique called dynamic parallelism, one or more global functions 3512 define a kernel that can be executed on a device and can be called from such a device. In at least one embodiment, the kernel is executed N times (where N is any positive integer) in parallel by N different threads on a device during execution.

[0320] In at least one embodiment, each device function 3514 executes on a device and can only be called from such a device. In at least one embodiment, each host function 3516 executes on a host and can only be called from such a host. In at least one embodiment, each host / device function 3516 defines both a host version of a function that is executable on a host and can only be called from such a host, and a device version of a function that is executable on a device and can only be called from such a device.

[0321] In at least one embodiment, the CUDA source code 3510 may also include, but is not limited to, any number of calls to any number of functions defined by the CUDA runtime API 3502. In at least one embodiment, the CUDA runtime API 3502 may include, but is not limited to, any number of functions executed on the host for allocating and deallocating device memory, transferring data between host memory and device memory, managing systems with multiple devices, and the like. In at least one embodiment, the CUDA source code 3510 may also include any number of calls to any number of functions specified in any number of other CUDA APIs. In at least one embodiment, the CUDA API may be any API designed to be used by CUDA code. In at least one embodiment, the CUDA API includes, but is not limited to, the CUDA runtime API 3502, the CUDA driver API, an API for any number of CUDA libraries, and the like. In at least one embodiment and relative to the CUDA runtime API 3502, the CUDA driver API is a lower-level API, but may provide finer-grained control over the device. In at least one embodiment, examples of CUDA libraries include, but are not limited to, cuBLAS, cuFFT, cuRAND, cuDNN, and the like.

[0322] In at least one embodiment, the CUDA compiler 3550 compiles input CUDA code (e.g., CUDA source code 3510) to generate host executable code 3570 (1) and CUDA device executable code 3584. In at least one embodiment, the CUDA compiler 3550 is NVCC. In at least one embodiment, the host executable code 3570 (1) is a compiled version of the host code included in the input source code executable on the CPU 3590. In at least one embodiment, the CPU 3590 can be any processor optimized for sequential instruction processing.

[0323] In at least one embodiment, the CUDA device executable code 3584 is a compiled version of the device code included in the input source code executable on the CUDA-enabled GPU 3594. In at least one embodiment, the CUDA device executable code 3584 includes, but is not limited to, binary code. In at least one embodiment, the CUDA device executable code 3584 includes, but is not limited to, IR code, such as PTX code, which is further compiled by the device driver at runtime into binary code for a specific target device (e.g., a CUDA-enabled GPU 3594). In at least one embodiment, the CUDA-enabled GPU 3594 can be any processor optimized for parallel instruction processing and supporting CUDA. In at least one embodiment, the CUDA-enabled GPU 3594 is developed by NVIDIA Corporation of Santa Clara, California.

[0324] In at least one embodiment, the CUDA to HIP conversion tool 3520 is configured to convert the CUDA source code 3510 into a functionally similar HIP source code 3530. In at least one embodiment, the HIP source code 3530 is a collection of human-readable code in the HIP programming language. In at least one embodiment, the HIP code is a human-readable code in the HIP programming language. In at least one embodiment, the HIP programming language is an extension of the C++ programming language, which includes but is not limited to a functionally similar version of the CUDA mechanism for defining device code and distinguishing device code from host code. In at least one embodiment, the HIP programming language may include a subset of the functionality of the CUDA programming language. In at least one embodiment, for example, the HIP programming language includes but is not limited to a mechanism for defining global functions 3512, but such a HIP programming language may lack support for dynamic parallelism, and therefore, the global functions 3512 defined in the HIP code can only be called from the host.

[0325] In at least one embodiment, the HIP source code 3530 includes, but is not limited to, any number (including zero) of global functions 3512, any number (including zero) of device functions 3514, any number (including zero) of host functions 3516, and any number (including zero) of host / device functions 3518. In at least one embodiment, the HIP source code 3530 may also include any number of calls to any number of functions specified in the HIP runtime API 3532. In one embodiment, the HIP runtime API 3532 includes, but is not limited to, functionally similar versions of a subset of functions included in the CUDA runtime API 3502. In at least one embodiment, the HIP source code 3530 may also include any number of calls to any number of functions specified in any number of other HIP APIs. In at least one embodiment, the HIP API may be any API designed for use by HIP code and / or ROCm. In at least one embodiment, the HIP API includes, but is not limited to, the HIP runtime API 3532, the HIP driver API, an API for any number of HIP libraries, an API for any number of ROCm libraries, and the like.

[0326] In at least one embodiment, the CUDA to HIP conversion tool 3520 converts each kernel call in the CUDA code from CUDA syntax to HIP syntax, and converts any number of other CUDA calls in the CUDA code to any number of other functionally similar HIP calls. In at least one embodiment, a CUDA call is a call to a function specified in the CUDA API, and a HIP call is a call to a function specified in the HIP API. In at least one embodiment, the CUDA to HIP conversion tool 3520 converts any number of calls to functions specified in the CUDA runtime API 3502 to any number of calls to functions specified in the HIP runtime API 3532.

[0327] In at least one embodiment, the CUDA to HIP conversion tool 3520 is a tool called hipify-perl, which performs a text-based conversion process. In at least one embodiment, the CUDA to HIP conversion tool 3520 is a tool called hipify-clang, which performs a more complex and robust conversion process relative to hipify-perl, which involves parsing the CUDA code using clang (compiler front end) and then converting the resulting symbols. In at least one embodiment, in addition to those modifications performed by the CUDA to HIP conversion tool 3520, correctly converting the CUDA code to HIP code may also require modifications (e.g., manual editing).

[0328] In at least one embodiment, the HIP compiler driver 3540 is a front end that determines the target device 3546 and then configures a compiler compatible with the target device 3546 to compile the HIP source code 3530. In at least one embodiment, the target device 3546 is a processor optimized for parallel instruction processing. In at least one embodiment, the HIP compiler driver 3540 can determine the target device 3546 in any technically feasible manner.

[0329] In at least one embodiment, if the target device 3546 is CUDA compatible (e.g., a CUDA-enabled GPU 3594), the HIP compiler driver 3540 generates HIP / NVCC compile commands 3542. In at least one embodiment and in conjunction with Fig.35B As described in more detail, HIP / NVCC compile command 3542 configures CUDA compiler 3550 to compile HIP source code 3530 using, but not limited to, HIP to CUDA translation headers and CUDA runtime libraries. In at least one embodiment and in response to HIP / NVCC compile command 3542, CUDA compiler 3550 generates host executable code 3570(1) and CUDA device executable code 3584.

[0330] In at least one embodiment, if the target device 3546 is not compatible with CUDA, the HIP compiler driver 3540 generates HIP / HCC compilation commands 3544. In at least one embodiment and in conjunction with Fig.35C Described in more detail, the HIP / HCC compile command 3544 configures the HCC 3560 to compile the HIP source code 3530 using the HCC header and the HIP / HCC runtime library. In at least one embodiment and in response to the HIP / HCC compile command 3544, the HCC 3560 generates a host executable code 3570 (2) and an HCC device executable code 3582. In at least one embodiment, the HCC device executable code 3582 is a compiled version of the device code included in the HIP source code 3530 that can be executed on the GPU 3592. In at least one embodiment, the GPU 3592 can be any processor that is optimized for parallel instruction processing, is not compatible with CUDA, and is compatible with HCC. In at least one embodiment, the GPU 3592 is developed by AMD, Inc. of Santa Clara, California. In at least one embodiment, the GPU 3592 is a GPU 3592 that is not CUDA-enabled.

[0331] For illustrative purposes only, Fig.35A3500 and 3502. In at least one embodiment, three different flows that can be implemented to compile CUDA source code 3510 for execution on CPU 3590 and different devices are depicted. In at least one embodiment, the direct CUDA flow compiles CUDA source code 3510 for execution on CPU 3590 and CUDA-enabled GPU 3594 without converting CUDA source code 3510 to HIP source code 3530. In at least one embodiment, the indirect CUDA flow converts CUDA source code 3510 to HIP source code 3530 and then compiles HIP source code 3530 for execution on CPU 3590 and CUDA-enabled GPU 3594. In at least one embodiment, the CUDA / HCC flow converts CUDA source code 3510 to HIP source code 3530 and then compiles HIP source code 3530 for execution on CPU 3590 and GPU 3592.

[0332] A direct CUDA flow that can be implemented in at least one embodiment can be depicted by a dashed line and a series of bubble annotations A1-A3. In at least one embodiment, and as indicated by bubble annotation A1, a CUDA compiler 3550 receives a CUDA source code 3510 and a CUDA compile command 3548 that configures the CUDA compiler 3550 to compile the CUDA source code 3510. In at least one embodiment, the CUDA source code 3510 used in the direct CUDA flow is written in the CUDA programming language, which is based on other programming languages ​​other than C++ (e.g., C, Fortran, Python, Java, etc.). In at least one embodiment, and in response to the CUDA compile command 3548, the CUDA compiler 3550 generates a host executable code 3570 (1) and a CUDA device executable code 3584 (indicated by bubble annotation A2). In at least one embodiment and as indicated by bubble annotation A3, the host executable code 3570 (1) and the CUDA device executable code 3584 can be executed on a CPU 3590 and a CUDA-enabled GPU 3594, respectively. In at least one embodiment, the CUDA device executable code 3584 includes, but is not limited to, binary code. In at least one embodiment, the CUDA device executable code 3584 includes, but is not limited to, PTX code, and is further compiled into binary code for a specific target device at runtime.

[0333] The indirect CUDA flow that can be implemented in at least one embodiment can be described by a dashed line and a series of bubble notes B1-B6. In at least one embodiment and as shown in bubble note B1, the CUDA to HIP conversion tool 3520 receives the CUDA source code 3510. In at least one embodiment and as shown in bubble note B2, the CUDA to HIP conversion tool 3520 converts the CUDA source code 3510 to HIP source code 3530. In at least one embodiment and as shown in bubble note B3, the HIP compiler driver 3540 receives the HIP source code 3530 and determines whether the target device 3546 is CUDA enabled.

[0334] In at least one embodiment and as indicated by bubble note B4, the HIP compiler driver 3540 generates HIP / NVCC compile commands 3542 and sends both the HIP / NVCC compile commands 3542 and the HIP source code 3530 to the CUDA compiler 3550. Fig.35B As described in more detail, the HIP / NVCC compile command 3542 configures the CUDA compiler 3550 to compile the HIP source code 3530 using, but not limited to, the HIP to CUDA translation header and the CUDA runtime library. In at least one embodiment and in response to the HIP / NVCC compile command 3542, the CUDA compiler 3550 generates a host executable code 3570 (1) and a CUDA device executable code 3584 (indicated by bubble comment B5). In at least one embodiment and as indicated by bubble comment B6, the host executable code 3570 (1) and the CUDA device executable code 3584 can be executed on a CPU 3590 and a CUDA-enabled GPU 3594, respectively. In at least one embodiment, the CUDA device executable code 3584 includes, but is not limited to, binary code. In at least one embodiment, the CUDA device executable code 3584 includes, but is not limited to, PTX code and is further compiled into binary code for a specific target device at runtime.

[0335] The CUDA / HCC flow that can be implemented in at least one embodiment can be described by a solid line and a series of bubble comments C1-C6. In at least one embodiment and as shown in bubble comment C1, the CUDA to HIP conversion tool 3520 receives the CUDA source code 3510. In at least one embodiment and as shown in bubble comment C2, the CUDA to HIP conversion tool 3520 converts the CUDA source code 3510 to the HIP source code 3530. In at least one embodiment and as shown in bubble comment C3, the HIP compiler driver 3540 receives the HIP source code 3530 and determines that the target device 3546 is not CUDA-enabled.

[0336] In at least one embodiment, the HIP compiler driver 3540 generates a HIP / HCC compile command 3544 and sends both the HIP / HCC compile command 3564 and the HIP source code 3530 to the HCC 3560 (indicated by bubble comment C4). Fig.35C As described in more detail, HIP / HCC compile command 3564 configures HCC 3560 to compile HIP source code 3530 using, but not limited to, HCC headers and HIP / HCC runtime libraries. In at least one embodiment and in response to HIP / HCC compile command 3544, HCC 3560 generates host executable code 3570(2) and HCC device executable code 3582 (indicated by bubble comment C5). In at least one embodiment and as indicated by bubble comment C6, host executable code 3570(2) and HCC device executable code 3582 can be executed on CPU 3590 and GPU 3592, respectively.

[0337] In at least one embodiment, after converting the CUDA source code 3510 to the HIP source code 3530, the HIP compiler driver 3540 can then be used to generate executable code for the CUDA-enabled GPU 3594 or GPU 3592 without re-implementing the CUDA to HIP conversion tool 3520. In at least one embodiment, the CUDA to HIP conversion tool 3520 converts the CUDA source code 3510 to the HIP source code 3530, which is then stored in memory. In at least one embodiment, the HIP compiler driver 3540 then configures the HCC 3560 to generate the host executable code 3570 (2) and the HCC device executable code 3582 based on the HIP source code 3530. In at least one embodiment, the HIP compiler driver 3540 then configures the CUDA compiler 3550 to generate the host executable code 3570 (1) and the CUDA device executable code 3584 based on the stored HIP source code 3530.

[0338] Fig.35B 3590 and a CUDA-enabled GPU 3594 are configured to compile and execute Fig.35A In at least one embodiment, the system 3504 includes, but is not limited to, the CUDA source code 3510, a CUDA to HIP conversion tool 3520, a HIP source code 3530, a HIP compiler driver 3540, a CUDA compiler 3550, a host executable code 3570(1), a CUDA device executable code 3584, a CPU 3590, and a CUDA-enabled GPU 3594.

[0339] In at least one embodiment and as previously incorporated herein Fig.35A As described, CUDA source code 3510 includes, but is not limited to, any number (including zero) of global functions 3512, any number (including zero) of device functions 3514, any number (including zero) of host functions 3516, and any number (including zero) of host / device functions 3518. In at least one embodiment, CUDA source code 3510 also includes, but is not limited to, any number of calls to any number of functions specified in any number of CUDA APIs.

[0340] In at least one embodiment, the CUDA to HIP conversion tool 3520 converts the CUDA source code 3510 into HIP source code 3530. In at least one embodiment, the CUDA to HIP conversion tool 3520 converts each kernel call in the CUDA source code 3510 from CUDA syntax to HIP syntax, and converts any number of other CUDA calls in the CUDA source code 3510 into any number of other functionally similar HIP calls.

[0341] In at least one embodiment, the HIP compiler driver 3540 determines that the target device 3546 is CUDA-enabled and generates HIP / NVCC compile commands 3542. In at least one embodiment, the HIP compiler driver 3540 then configures the CUDA compiler 3550 via the HIP / NVCC compile commands 3542 to compile the HIP source code 3530. In at least one embodiment, as part of configuring the CUDA compiler 3550, the HIP compiler driver 3540 provides access to a HIP to CUDA translation header 3552. In at least one embodiment, the HIP to CUDA translation header 3552 translates any number of mechanisms (e.g., functions) specified in any number of HIP APIs to any number of mechanisms specified in any number of CUDA APIs. In at least one embodiment, the CUDA compiler 3550 uses the HIP to CUDA translation header 3552 in conjunction with a CUDA runtime library 3554 corresponding to the CUDA runtime API 3502 to generate host executable code 3570 (1) and CUDA device executable code 3584. In at least one embodiment, the host executable code 3570(1) and the CUDA device executable code 3584 can then be executed on the CPU 3590 and the CUDA-enabled GPU 3594, respectively. In at least one embodiment, the CUDA device executable code 3584 includes, but is not limited to, binary code. In at least one embodiment, the CUDA device executable code 3584 includes, but is not limited to, PTX code and is further compiled into binary code for a specific target device at runtime.

[0342] Fig.35C A system 3506 is shown that is configured to compile and execute using a CPU 3590 and a non-CUDA enabled GPU 3592 according to at least one embodiment. Fig.35A CUDA source code 3510. In at least one embodiment, system 3506 includes, but is not limited to, CUDA source code 3510, CUDA to HIP conversion tool 3520, HIP source code 3530, HIP compiler driver 3540, HCC 3560, host executable code 3570(2), HCC device executable code 3582, CPU 3590, and GPU 3592.

[0343] In at least one embodiment, and as previously described herein in conjunction with Fig.35AAs described, CUDA source code 3510 includes, but is not limited to, any number (including zero) of global functions 3512, any number (including zero) of device functions 3514, any number (including zero) of host functions 3516, and any number (including zero) of host / device functions 3518. In at least one embodiment, CUDA source code 3510 also includes, but is not limited to, any number of calls to any number of functions specified in any number of CUDA APIs.

[0344] In at least one embodiment, the CUDA to HIP conversion tool 3520 converts the CUDA source code 3510 into HIP source code 3530. In at least one embodiment, the CUDA to HIP conversion tool 3520 converts each kernel call in the CUDA source code 3510 from CUDA syntax to HIP syntax, and converts any number of other CUDA calls in the source code 3510 into any number of other functionally similar HIP calls.

[0345] In at least one embodiment, the HIP compiler driver 3540 then determines that the target device 3546 is not CUDA-enabled and generates HIP / HCC compile commands 3544. In at least one embodiment, the HIP compiler driver 3540 then configures the HCC 3560 to execute the HIP / HCC compile commands 3544 to compile the HIP source code 3530. In at least one embodiment, the HIP / HCC compile commands 3544 configure the HCC 3560 to generate host executable code 3570 (2) and HCC device executable code 3582 using, but not limited to, a HIP / HCC runtime library 3558 and an HCC header 3556. In at least one embodiment, the HIP / HCC runtime library 3558 corresponds to the HIP runtime API 3532. In at least one embodiment, the HCC header 3556 includes, but is not limited to, any number and type of interoperability mechanisms for the HIP and HCC. In at least one embodiment, the host executable code 3570 ( 2 ) and the HCC device executable code 3582 may be executed on the CPU 3590 and the GPU 3592 , respectively.

[0346] Fig.36 According to at least one embodiment, Fig.35C35. In at least one embodiment, the CUDA source code 3510 divides the overall problem that a given kernel is designed to solve into relatively coarse sub-problems that can be solved independently using thread blocks. In at least one embodiment, each thread block includes, but is not limited to, an arbitrary number of threads. In at least one embodiment, each sub-problem is divided into relatively small pieces that can be solved in parallel by the threads in the thread block in a cooperative manner. In at least one embodiment, threads within a thread block can collaborate by sharing data through shared memory and by synchronizing execution to coordinate memory access.

[0347] In at least one embodiment, the CUDA source code 3510 organizes the thread blocks associated with a given kernel into a one-dimensional, two-dimensional, or three-dimensional grid of thread blocks. In at least one embodiment, each thread block includes, but is not limited to, any number of threads, and the grid includes, but is not limited to, any number of thread blocks.

[0348] In at least one embodiment, a kernel is a function in device code defined using the "__global__" declaration specifier. In at least one embodiment, the CUDA kernel launch syntax 3610 is used to specify the size of the grid on which the kernel is executed for a given kernel call and the associated streams. In at least one embodiment, the CUDA kernel launch syntax 3610 is specified as "KernelName<<<GridSize,BlockSize,SharedMemorySize,Stream> >>(KernelArguments);". In at least one embodiment, the execution configuration syntax is a "<<< ... >>>" construct that is inserted between the kernel name ("KernelName") and the parenthesized list of kernel parameters ("KernelArguments"). In at least one embodiment, the CUDA kernel launch syntax 3610 includes, but is not limited to, a CUDA launch function syntax rather than an execution configuration syntax.

[0349] In at least one embodiment, "GridSize" is of type dim3 and specifies the dimensions and size of the grid. In at least one embodiment, type dim3 is a CUDA-defined structure that includes, but is not limited to, unsigned integers x, y, and z. In at least one embodiment, if z is not specified, z defaults to 1. In at least one embodiment, if y is not specified, y defaults to 1. In at least one embodiment, the number of thread blocks in the grid is equal to the product of GridSize.x, GridSize.y, and GridSize.z. In at least one embodiment, "BlockSize" is of type dim3 and specifies the dimensions and size of each thread block. In at least one embodiment, the number of threads per thread block is equal to the product of BlockSize.x, BlockSize.y, and BlockSize.z. In at least one embodiment, each thread executing a kernel is given a unique thread ID that can be accessed within the kernel through a built-in variable (e.g., "threadIdx").

[0350] In at least one embodiment, with respect to CUDA kernel launch syntax 3610, "SharedMemorySize" is an optional parameter that specifies the number of bytes in shared memory that are dynamically allocated for each thread block for a given kernel call in addition to statically allocated memory. In at least one embodiment and with respect to CUDA kernel launch syntax 3610, SharedMemorySize defaults to zero. In at least one embodiment and with respect to CUDA kernel launch syntax 3610, "stream" is an optional parameter that specifies the associated stream and defaults to zero to specify the default stream. In at least one embodiment, a stream is a sequence of commands that are executed in order (which may be issued by different host threads). In at least one embodiment, different streams can execute commands out of order or simultaneously with respect to each other.

[0351] In at least one embodiment, the CUDA source code 3510 includes, but is not limited to, a kernel definition and a main function for an exemplary kernel "MatAdd". In at least one embodiment, the main function is host code executed on a host and includes, but is not limited to, a kernel call that causes the kernel MatAdd to execute on a device. In at least one embodiment, as shown, the kernel MatAdd adds two matrices A and B of size NxN, where N is a positive integer, and stores the result in matrix C. In at least one embodiment, the main function defines the threadsPerBlock variable as 16x16 and the numBlocks variable as N / 16 x N / 16. In at least one embodiment, the main function then specifies the kernel call "MatAdd<<<numBlocks, threadsPerBlock>>>(A, B, C);". In at least one embodiment, and according to the CUDA kernel launch syntax 3610, the kernel MatAdd is executed using a grid of thread blocks of size N / 16 × N / 16, where each thread block is of size 16 × 16. In at least one embodiment, each thread block includes 256 threads, a grid with enough blocks is created so that each matrix element has one thread, and each thread in the grid executes the kernel MatAdd to perform a pairwise addition.

[0352] In at least one embodiment, while converting the CUDA source code 3510 to HIP source code 3530, the CUDA-to-HIP conversion tool 3520 converts each kernel call in the CUDA source code 3510 from the CUDA kernel launch syntax 3610 to the HIP kernel launch syntax 3620 and converts any number of other CUDA calls in the source code 3510 to any number of other functionally similar HIP calls. In at least one embodiment, the HIP kernel launch syntax 3620 is specified as "hipLaunchKernelGGL(KernelName, GridSize, BlockSize, SharedMemorySize, Stream, KernelArguments);". In at least one embodiment, each of KernelName, GridSize, BlockSize, ShareMemorySize, Stream, and KernelArguments in the HIP kernel launch syntax 3620 has the same meaning as in the CUDA kernel launch syntax 3610 (previously described herein). In at least one embodiment, the parameters SharedMemorySize and Stream are required in the HIP kernel launch syntax 3620 while being optional in the CUDA kernel launch syntax 3610.

[0353] In at least one embodiment, in addition to causing the kernel MatAdd to execute on the device, Fig.36 A portion of the HIP source code 3530 depicted in Fig.36 3510. In at least one embodiment, kernel MatAdd is defined in HIP source code 3530 with the same “__global__” declaration specifier as kernel MatAdd is defined in CUDA source code 3510. In at least one embodiment, the kernel call in HIP source code 3530 is “hipLaunchKernelGGL(MatAdd, numBlocks, threadsPerBlock, 0, 0, A, B, C);”, while the corresponding kernel call in CUDA source code 3510 is “MatAdd<<<numBlocks,threadsPerBlock> >>(A, B, C);".

[0354] Fig.37 In more detail, the Fig.35C 3592. In at least one embodiment, the GPU 3592 is developed by AMD of Santa Clara. In at least one embodiment, the GPU 3592 can be configured to perform computing operations in a highly parallel manner. In at least one embodiment, the GPU 3592 is configured to perform graphics pipeline operations, such as drawing commands, pixel operations, geometric calculations, and other operations associated with rendering an image to a display. In at least one embodiment, the GPU 3592 is configured to perform operations unrelated to graphics. In at least one embodiment, the GPU 3592 is configured to perform both operations related to graphics and operations unrelated to graphics. In at least one embodiment, the GPU 3592 can be configured to execute device code included in the HIP source code 3530.

[0355] In at least one embodiment, GPU 3592 includes, but is not limited to, any number of programmable processing units 3720, command processor 3710, L2 cache 3722, memory controller 3770, DMA engine 3780(1), system memory controller 3782, DMA engine 3780(2), and GPU controller 3784. In at least one embodiment, each programmable processing unit 3720 includes, but is not limited to, workload manager 3730 and any number of compute units 3740. In at least one embodiment, command processor 3710 reads commands from one or more command queues (not shown) and distributes the commands to workload manager 3730. In at least one embodiment, for each programmable processing unit 3720, the associated workload manager 3730 distributes work to the compute units 3740 included in the programmable processing unit 3720. In at least one embodiment, each compute unit 3740 can execute any number of thread blocks, but each thread block executes on a single compute unit 3740. In at least one embodiment, a work group is a thread block.

[0356] In at least one embodiment, each computing unit 3740 includes, but is not limited to, any number of SIMD units 3750 and shared memory 3760. In at least one embodiment, each SIMD unit 3750 implements a SIMD architecture and is configured to perform operations in parallel. In at least one embodiment, each SIMD unit 3750 includes, but is not limited to, a vector ALU 3752 and a vector register file 3754. In at least one embodiment, each SIMD unit 3750 executes a different warp. In at least one embodiment, a warp is a group of threads (e.g., 16 threads), wherein each thread in the warp belongs to a single thread block and is configured to process different data sets based on a single instruction set. In at least one embodiment, predictions can be used to disable one or more threads in the warp. In at least one embodiment, a channel is a thread. In at least one embodiment, a work item is a thread. In at least one embodiment, a wavefront is a warp. In at least one embodiment, different wavefronts in a thread block can be synchronized together and communicated via a shared memory 3760.

[0357] In at least one embodiment, the programmable processing unit 3720 is referred to as a "shader engine". In at least one embodiment, each programmable processing unit 3720 includes, but is not limited to, any number of dedicated graphics hardware in addition to the compute unit 3740. In at least one embodiment, each programmable processing unit 3720 includes, but is not limited to, any number (including zero) of geometry processors, any number (including zero) of rasterizers, any number (including zero) of rendering backends, a workload manager 3730, and any number of compute units 3740.

[0358] In at least one embodiment, the compute units 3740 share an L2 cache 3722. In at least one embodiment, the L2 cache 3722 is partitioned. In at least one embodiment, all compute units 3740 in a GPU 3592 can access GPU memory 3790. In at least one embodiment, the memory controller 3770 and the system memory controller 3782 facilitate data transfers between the GPU 3592 and a host, and the DMA engine 3780 (1) enables asynchronous memory transfers between the GPU 3592 and the host. In at least one embodiment, the memory controller 3770 and the GPU controller 3784 facilitate data transfers between the GPU 3592 and other GPUs 3592, and the DMA engine 3780 (2) enables asynchronous memory transfers between the GPU 3592 and other GPUs 3592.

[0359] In at least one embodiment, GPU 3592 includes, but is not limited to, any number and type of system interconnects that facilitate data and control transfers between any number and type of directly or indirectly linked components within or outside GPU 3592. In at least one embodiment, GPU 3592 includes, but is not limited to, any number and type of I / O interfaces (e.g., PCIe) coupled to any number and type of peripheral devices. In at least one embodiment, GPU 3592 may include, but is not limited to, any number (including zero) of display engines and any number (including zero) of multimedia engines. In at least one embodiment, GPU 3592 implements a memory subsystem that includes, but is not limited to, any number and type of memory controllers (e.g., memory controller 3770 and system memory controller 3782) and memory devices (e.g., shared memory 3760) dedicated to one component or shared between multiple components. In at least one embodiment, GPU3592 implements a cache subsystem that includes, but is not limited to, one or more cache memories (e.g., L2 cache 3722), each of which can be private or shared among any number of components (e.g., SIMD units 3750, compute units 3740, and programmable processing units 3720).

[0360] Fig.38 38 shows how threads of an exemplary CUDA grid 3820 are mapped to Fig.373740. In at least one embodiment, and for illustration purposes only, the grid 3820 has a GridSize of BX times BY times 1 and a BlockSize of TX times TY times 1. Thus, in at least one embodiment, the grid 3820 includes, but is not limited to, (BX*BY) thread blocks 3830, each of which includes, but is not limited to, (TX*TY) threads 3840. The threads 3840 are Fig.38 Depicted as a curved arrow.

[0361] In at least one embodiment, grid 3820 is mapped to programmable processing units 3720(1), which include, but are not limited to, compute units 3740(1)-3740(C). In at least one embodiment and as shown, (BJ*BY) thread blocks 3830 are mapped to compute unit 3740(1), and the remaining thread blocks 3830 are mapped to compute unit 3740(2). In at least one embodiment, each thread block 3830 may include, but are not limited to, any number of warps, and each warp is mapped to Fig.37 Different SIMD units 3750.

[0362] In at least one embodiment, the warps in a given thread block 3830 may be synchronized together and communicate through a shared memory 3760 included in the associated compute unit 3740. For example and in at least one embodiment, the warps in thread block 3830 (BJ, 1) may be synchronized together and communicate through a shared memory 3760 (1). For example and in at least one embodiment, the warps in thread block 3830 (BJ+1, 1) may be synchronized together and communicate through a shared memory 3760 (2).

[0363] Other variations are within the spirit of the present disclosure. Thus, while the disclosed technology is susceptible to various modifications and alternative constructions, certain illustrated embodiments thereof are shown in the drawings and have been described in detail above. However, it should be understood that there is no intention to limit the disclosure to one or more specific forms disclosed, but on the contrary, it is intended to cover all modifications, alternative constructions, and equivalents that fall within the spirit and scope of the present disclosure as defined by the appended claims.

[0364] Unless otherwise noted or clearly contradictory to the context, in the context of describing the disclosed embodiments (particularly in the context of the appended claims), the use of the terms "one" and "an" and "the" and similar references should be interpreted as covering the singular and plural, rather than as definitions of terms. Unless otherwise noted, the terms "include", "have", "include" and "contain" should be interpreted as open terms (meaning "including but not limited to") unless otherwise noted. The term "connected" (which refers to a physical connection when unmodified) should be interpreted as partially or completely included, attached to or connected together, even if there are some interventions. Unless otherwise noted herein, references to numerical ranges herein are intended only to be used as a shorthand method of referring to each individual value falling within the range, respectively, and each individual value is incorporated into the specification as if it were individually described herein. Unless otherwise noted or contradictory to the context, the use of the term "set" (e.g., "item set") or "subset" should be interpreted as a non-empty set including one or more members. Furthermore, unless otherwise indicated or contradicted by context, the term "subset" of a corresponding set does not necessarily mean a proper subset of the corresponding set, but rather a subset and a corresponding set may be equivalent.

[0365] Unless expressly indicated otherwise or clearly contradicted by context, conjunctions such as phrases of the form "at least one of A, B, and C" or "at least one of A, B and C" are understood in context to be generally used to refer to an item, clause, or the like that may be A or B or C, or any non-empty subset of the set A and B and C. For example, in the illustrative example of a set having three members, the conjunction phrases "at least one of A, B, and C" and "at least one of A, B and C" refer to any of the following sets: {A}, {B}, {C}, {A, B}, {A, C}, {B, C}, {A, B, C}. Thus, such conjunction language is not generally intended to imply that certain embodiments require the presence of at least one of A, at least one of B, and at least one of C. In addition, unless expressly indicated otherwise or contradicted by context, the term "plurality" refers to a plural state (e.g., "plurality of items" means a plurality of items). The number of items in a plurality of items is at least two, but may be more if expressly indicated or indicated by context. Further, the phrase "based on" means "based at least in part on" rather than "based solely on" unless otherwise specified or clear from context.

[0366] Unless otherwise indicated herein or clearly contradictory to the context, the operations of the processes described herein may be performed in any suitable order. In at least one embodiment, processes such as those described herein (or variations and / or combinations thereof) are performed under the control of one or more computer systems configured with executable instructions and are implemented as code (e.g., executable instructions, one or more computer programs, or one or more applications) that are jointly executed on one or more processors by hardware or a combination thereof. In at least one embodiment, the code is stored on a computer-readable storage medium in the form of, for example, a computer program that includes a plurality of instructions that can be executed by one or more processors. In at least one embodiment, the computer-readable storage medium is a non-transitory computer-readable storage medium that excludes transient signals (e.g., propagated transient electrical or electromagnetic transmissions), but includes non-transitory data storage circuits (e.g., buffers, caches, and queues). In at least one embodiment, code (e.g., executable code or source code) is stored on a set of one or more non-transitory computer-readable storage media (or other memory for storing executable instructions) on which executable instructions are stored, which, when executed by one or more processors of a computer system (i.e., as a result of being executed), causes the computer system to perform the operations described herein. In at least one embodiment, a set of non-transitory computer-readable storage media includes a plurality of non-transitory computer-readable storage media, and one or more of the individual non-transitory storage media in the plurality of non-transitory computer-readable storage media lacks all the code, but the plurality of non-transitory computer-readable storage media stores all the code together. In at least one embodiment, the executable instructions are executed so that different instructions are executed by different processors, for example, a non-transitory computer-readable storage medium stores instructions, and a main central processing unit ("CPU") executes some instructions, while a graphics processing unit ("GPU") executes other instructions. In at least one embodiment, different components of the computer system have separate processors, and different processors execute different subsets of instructions.

[0367] Thus, in at least one embodiment, a computer system is configured to implement one or more services that individually or collectively perform the operations of the processes described herein, and such a computer system is configured with applicable hardware and / or software that enables the implementation of the operations. In addition, a computer system that implements at least one embodiment of the present disclosure is a single device, and in another embodiment is a distributed computer system that includes multiple devices that operate in different ways, so that the distributed computer system performs the operations described herein, and so that a single device does not perform all operations.

[0368] The use of any and all examples or exemplary language (e.g., "such as") provided herein is intended only to better illustrate embodiments of the present disclosure and does not limit the scope of the disclosure unless otherwise required. No language in the specification should be construed as indicating that any non-claimed element is essential to practicing the disclosure.

[0369] All references, including publications, patent applications, and patents, cited herein are hereby incorporated by reference to the same extent as if each reference were individually and specifically indicated to be incorporated by reference and were set forth in its entirety herein.

[0370] In the specification and claims, the terms "coupled" and "connected," as well as their derivatives, may be used. It should be understood that these terms may not be intended as synonyms for each other. On the contrary, in specific examples, "connected" or "coupled" may be used to indicate that two or more elements are in direct or indirect physical or electrical contact with each other. "Coupled" may also mean that two or more elements are not in direct contact with each other, but still cooperate or interact with each other.

[0371] Unless explicitly stated otherwise, it is to be understood that throughout the specification, terms such as “processing”, “computing”, “calculating”, “determining” and the like refer to the actions and / or processes of a computer or computing system or similar electronic computing device that processes and / or converts data represented as physical quantities (e.g., electronic) in registers and / or memories of the computing system into other data similarly represented as physical quantities in the memories, registers or other such information storage, transmission or display devices of the computing system.

[0372] In a similar manner, the term "processor" may refer to any device or part of a memory that processes electronic data from registers and / or memory and converts the electronic data into other electronic data that can be stored in registers and / or memory. As a non-limiting example, a "processor" may be a CPU or a GPU. A "computing platform" may include one or more processors. As used herein, a "software" process may include, for example, software and / or hardware entities that perform work over time, such as tasks, threads, and intelligent agents. Similarly, each process may refer to multiple processes to execute instructions sequentially or in parallel, continuously or intermittently. The terms "system" and "method" may be used interchangeably herein, as long as a system may embody one or more methods, and a method may be considered a system.

[0373] In this document, reference may be made to obtaining, acquiring, receiving or inputting analog or digital data into a subsystem, a computer system or a computer-implemented machine. The process of obtaining, acquiring, receiving or inputting analog and digital data can be accomplished in a variety of ways, such as by receiving data as a parameter of a function call or a call to an application programming interface. In some implementations, the process of obtaining, acquiring, receiving or inputting analog or digital data can be accomplished by transmitting data via a serial or parallel interface. In another implementation, the process of obtaining, acquiring, receiving or inputting analog or digital data can be accomplished by transmitting data from a providing entity to an acquiring entity via a computer network. Reference may also be made to providing, outputting, transmitting, sending or presenting analog or digital data. In various examples, the process of providing, outputting, transmitting, sending or presenting analog or digital data can be accomplished by transmitting data as an input or output parameter of a function call, an application programming interface or an interprocess communication mechanism.

[0374] Although the above discussion sets forth example implementations of the described techniques, other architectures may be used to implement the described functionality and are intended to fall within the scope of the present disclosure. In addition, although specific responsibilities are defined above for discussion purposes, various functions and responsibilities may be allocated and divided in different ways, depending on the circumstances.

[0375] Furthermore, although the subject matter has been described in language specific to structural features and / or methodological acts, it should be understood that the subject matter claimed in the appended claims is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as exemplary forms of implementing the claims.

Claims

1. A system, include: one or more processors; as well as a heat sink connected to the one or more processors via a flexible heat pipe; as well as One or more support members, each of the support members including at least one slot having a plurality of positions to secure at least one of the plurality of positions to a connector pin of the heat sink, wherein the position of the heat sink is at least vertically adjusted by moving the connector pin from a first position to a second position in the at least one slot. 2 . The system of claim 1 , wherein the one or more processors include one or more graphics processing units.

3. The system of claim 1, wherein the flexible heat pipe comprises a loop siphon.

4. The system of claim 1, wherein the position of the heat sink is adjustable to a plurality of positions to improve heat dissipation of the heat sink.

5. The system of claim 1, wherein the position of the heat sink is adjustable to improve at least one of utilization, velocity, or temperature of airflow to the second heat sink.

6. The system of claim 1, wherein the position of the heat sink is adjustable to accommodate the positioning of the heat sink on a chassis.

7. The system of claim 1, further comprising a mounting device comprising one or more attachment points, the one or more attachment points allowing for adjustment of the position of the heat sink.

8. The system of claim 1, wherein the position of the heat sink is at least one of: adjusted angularly, horizontally, or vertically relative to a plane defined by a surface on which the one or more processors are mounted.

9. A system, include: heat sink; as well as a flexible heat pipe for connection to one or more processors; One or more support members, each of the support members including at least one slot having a plurality of positions to secure at least one of the plurality of positions to a connector pin of the heat sink, wherein the position of the heat sink is at least vertically adjusted by moving the connector pin from a first position to a second position in the at least one slot.

10. The system of claim 9, wherein the flexible heat pipe comprises a loop siphon.

11. The system of claim 10, wherein the heat sink is connected to the one or more processors through a reservoir base.

12. The system of claim 9, wherein the heat sink is adjustable to a plurality of positions.

13. The system of claim 9, wherein the position of the heat sink is adjustable to maximize airflow to the second heat sink.

14. The system of claim 9, wherein the position of the heat sink is adjustable to reduce the temperature of the air flow to the second heat sink.

15. The system of claim 9, wherein the position of the heat sink is adjustable to accommodate the positioning of the heat sink on a chassis.

16. The system of claim 9, further comprising a mounting device comprising one or more attachment points, the one or more attachment points allowing for adjustment of the position of the heat sink.

17. A method, include: providing a heat sink that can be connected to one or more processors via a flexible heat pipe; One or more support members are provided, each of the support members including at least one slot having a plurality of positions for fixing at least one of the plurality of positions to a connector pin of the heat sink, wherein the position of the heat sink is at least vertically adjusted by moving the connector pin from a first position to a second position in the at least one slot.

18. The method of claim 17, wherein the flexible heat pipe comprises a loop siphon.

19. The method according to claim 18, further comprising: include: The flexible heat pipe is connected to the one or more processors through a reservoir base.

20. The method according to claim 17, further comprising: include: The position of the heat sink is adjusted to maximize airflow to the heat sink.

21. The method according to claim 17, further comprising include: The position of the radiator is adjusted to maximize airflow to the second radiator.

22. The method according to claim 17, further comprising: include: The position of the heat sink is adjusted to reduce the temperature of the air flow to the second heat sink.

23. The method according to claim 17, further comprising include: The position of the radiator is adjusted to accommodate the positioning of the radiator on the chassis.

24. A graphics card, include: one or more graphics processing units; as well as a heat sink connected to the one or more graphics processing units via a flexible heat pipe; One or more support members, each of the support members including at least one slot having a plurality of positions to secure at least one of the plurality of positions to a connector pin of the heat sink, wherein the position of the heat sink is at least vertically adjusted by moving the connector pin from a first position to a second position in the at least one slot.

25. The graphics card of claim 24, further comprising a support for attaching the heat sink to the graphics card, the support comprising a plurality of mounting points for securing the heat sink in one of a plurality of positions.

26. The graphics card of claim 24, wherein the heat sink is at least one of raised or lowered.

27. The graphics card of claim 24, wherein the adjustment of the position comprises tilting the heat sink.

28. The graphics card of claim 24, wherein the flexible heat pipe comprises a loop siphon.

29. The graphics card of claim 24, wherein the flexible heat pipe comprises a base that attaches the heat sink to the one or more graphics processing units.

30. The graphics card of claim 24, wherein adjustment of the position improves airflow to the heat sink.

31. The graphics card of claim 24, wherein adjustment of the position improves airflow to the second heat sink.

Images