Thermal dissipation and anti-mechanical structure of space electronic devices

Abstract

The present invention provides a heat dissipation and anti-mechanical structure for space electronic devices, comprising: a mounting base, a first insulating pad, an insulating sleeve, a vibration isolation mechanism, a second insulating pad, a damper, a heat-conducting filler, a limit fixing member, an insulating sheet, a graphene heat conductor, and a press clip. The present invention utilizes the principle of vibration isolators and a new type of high-efficiency heat conduction technology, and designs a structure suitable for high-power electronic devices of space payloads with high-efficiency heat dissipation and anti-mechanical characteristics according to the space payload environment and application characteristics; the present invention is applicable to the heat dissipation and anti-mechanical design of electronic devices used in space payloads and other aerospace instruments; the present invention can improve the heat dissipation efficiency of space electronic devices, reduce the influence of the mechanical environment on space electronic devices, and increase the stability and reliability of large-mass and high-power space electronic devices.

Description

Technical Field

[0001] The present invention belongs to the technical field of aerospace, and particularly relates to a heat dissipation and anti-mechanical structure for space electronic devices. Background Art

[0002] Space high-power electronic devices are generally used in the circuits of core components such as high-voltage calibration light sources, power supplies for high-voltage photon counting detectors, and large-area imaging detectors. Limited by power consumption and functions, such electronic devices have the characteristics of high power consumption, large mass, and complex structure. Their poor mechanical adaptability, difficult heat dissipation and fixation are technical problems in space environment use. Therefore, anti-mechanical installation and fixation and efficient heat dissipation technologies have always been the key technologies and research focuses of space high-power electronic devices. Summary of the Invention

[0003] The purpose of the present invention is to overcome the defects of the prior art and propose a heat dissipation and anti-mechanical structure for space electronic devices.

[0004] To achieve the above purpose, the present invention adopts the following specific technical solutions:

[0005] A heat dissipation and anti-mechanical structure for space electronic devices provided by the present invention includes: a mounting base, a first insulating pad mounted on the lower surface of the mounting base, an insulating sleeve for insulating the pins of the space electronic device, a shock isolation mechanism fixed on the mounting base for supporting the space electronic device, a second insulating pad laid on the shock isolation mechanism, a damper located between the space electronic device and the mounting base for absorbing mechanical vibration energy, a heat-conducting filler coated on the upper surface of the space electronic device, an insulating sheet for insulating between the limit fixing member and the space electronic device, a limit fixing member pressing on the upper end of the insulating sheet for positioning the space electronic device, a graphene heat conductor with a heat-conducting end sandwiched between the insulating sheet and the heat-conducting filler for heat conduction and heat dissipation, and a pressing clip pressing on the heat dissipation end of the graphene heat conductor for ensuring the fixed position and reliable contact of the heat dissipation end.

[0006] Preferably, on the mounting base, there are provided external mounting holes, first threaded holes for fixing the limit fixing member, pin mounting holes corresponding to the positions of the pins of the space electronic device, and second threaded holes for fixing the shock isolation mechanism.

[0007] Preferably, the first insulating pad is made of insulating and heat-insulating materials, and a plurality of through holes are provided on the first insulating pad, and the through holes respectively correspond to the external mounting holes, the first threaded holes, and the positions of the pins of the space electronic device.

[0008] Preferably, the insulating sleeve has a flange-type structure, and the outer cylindrical surface of the insulating sleeve fits with the pin mounting hole; the inner hole diameter of the insulating sleeve is larger than the pin diameter of the space electronic device, realizing insulation between the pin and the mounting base without directly contacting the pin; the lower end surface of the flange of the insulating sleeve is used for axially limiting the insulating sleeve.

[0009] Preferably, the shock isolation mechanism is a metal elastic structural member formed by integral machining and is fixed to the mounting base by screws.

[0010] Preferably, the damper is formed by filling the gap between the space electronic device and the mounting base with water vapor-sensitive colloidal materials of different compositions and curing at room temperature.

[0011] Preferably, the insulating sheet is a U-shaped insulating sheet.

[0012] Preferably, the limiting and fixing member is installed on the mounting base by screws, and presses and fixes the graphene heat conductor, the space electronic device, and the shock isolation mechanism on the mounting base from top to bottom.

[0013] Preferably, the graphene heat conductor is made of a new type of heat-conducting graphene dielectric material and encapsulated with a thin film material.

[0014] The present invention can achieve the following technical effects:

[0015] The present invention is applicable to the heat dissipation and anti-mechanical design of electronic devices used in space payloads and other aerospace instruments; the present invention can improve the heat dissipation efficiency of space electronic devices, reduce the influence of the mechanical environment on space electronic devices, and increase the stability and reliability of large-mass and high-power-consumption space electronic devices. Description of the Drawings

[0016] Figure 1 It is a front cross-sectional view of the heat dissipation and anti-mechanical structure of the space electronic device according to an embodiment of the present invention.

[0017] Figure 2 It is a side cross-sectional view of the heat dissipation and anti-mechanical structure of the space electronic device according to an embodiment of the present invention.

[0018] Figure 3 It is a perspective view of the heat dissipation and anti-mechanical structure of the space electronic device according to an embodiment of the present invention.

[0019] The reference numerals therein include: mounting base 1, first insulating pad 2, insulating sleeve 3, shock isolation mechanism 4, second insulating pad 5, damper 6, space electronic device 7, heat-conducting filler 8, limiting and fixing member 9, insulating sheet 10, graphene heat conductor 11, press clip 12, first screw 13, second screw 14. Detailed Embodiments

[0020] In the following, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, the same modules are denoted by the same reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, their detailed descriptions will not be repeated.

[0021] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation to the present invention.

[0022] The specific structure of the present invention will be described in detail below with reference to the accompanying drawings:

[0023] As Figure 1 , Figure 2 and Figure 3 shown, the present invention provides a heat dissipation and anti-mechanical structure for a space electronic device, including: a mounting base 1, a first insulating pad 2, an insulating sleeve 3, a shock isolation mechanism 4, a second insulating pad 5, a damper 6, a heat-conducting filler 8, a limit fixing member 9, an insulating sheet 10, a graphene heat conductor 11, and a press clip 12.

[0024] On the mounting base 1, an external mounting hole, a first threaded hole for fixing the limit fixing member 9, a pin mounting hole corresponding to the pin position of the space electronic device 7, and a second threaded hole for fixing the shock isolation mechanism 4 are machined. The external mounting hole is used to cooperate with a screw to mount the mounting base 1 at a specified position according to actual usage requirements; the first threaded hole for fixing the limit fixing member 9 cooperates with a first screw 13; the pin mounting hole corresponding to the pin position of the space electronic device 7 cooperates with the insulating sleeve 3, and the inner wall of the hole does not have direct contact with the pins; the second threaded hole for fixing the shock isolation mechanism 4 cooperates with a second screw 14; in actual application, the mounting base 1 can be an independent structure, or can be a part of other structural members or directly machine various holes on other structural members according to usage requirements to carry the heat dissipation and anti-mechanical structure of the space electronic device.

[0025] The first insulating pad 2 is made of a high-strength insulating and heat-insulating material. In the embodiment of the present invention, polyimide material is selected, which can ensure that its space environment adaptability, strength and insulation performance meet the actual usage requirements. The first insulating pad 2 is provided with a plurality of through holes, which respectively correspond to the external mounting hole on the mounting base 1, the first threaded hole for fixing the limit fixing member 9 on the mounting base 1, and the pin position of the space electronic device 7. In actual use, the first insulating pad 2 is sandwiched between the circuit board and the mounting base 1 to play an insulating role.

[0026] The insulating sleeve 3 is of a flange type structure and is made of a high-strength insulating and heat-insulating material. In the embodiment of the present invention, polyimide material is selected. The outer cylindrical surface of the insulating sleeve 3 fits with the pin mounting holes on the mounting base 1; the inner hole diameter of the insulating sleeve 3 is larger than the pin diameter of the space electronic device 7, realizing the insulation between the pins and the mounting base 1 without directly contacting the pins; the number of insulating sleeves 3 corresponds to the number of pins; the lower end surface of the flange of the insulating sleeve 3 is used for axially limiting the insulating sleeve 3; the insulating sleeve 3 is fixed on the mounting base 1 by the damper 6.

[0027] The shock isolation mechanism 4 is a metal elastic structural member integrally processed. There are two shock isolation mechanisms 4 in total, symmetrically distributed on the mounting base 1, and each shock isolation mechanism 4 is fixed on the mounting base 1 by a second screw 14 (as Figure 2 shown). The shock isolation mechanism 4 has a high support stiffness and appropriate flexibility, and its stiffness coefficient is determined by the mass of the space electronic device 7 and the characteristic frequency required by the actual mechanical environment. In the embodiment of the present invention, the shock isolation mechanism 4 is integrally processed from titanium alloy material. Selecting titanium alloy material can ensure that the strength and mechanical stability of the shock isolation mechanism 4 meet the actual use requirements.

[0028] The second insulating pad 5 is laid on the upper surface of the shock isolation mechanism 4, and together with the shock isolation mechanism 4, it bears the space electronic device 7 and insulates the shock isolation mechanism 4 from the space electronic device 7. The second insulating pad 5 is made of a high-strength insulating and heat-insulating material. In the embodiment of the present invention, polyimide material is selected, which can ensure that its space environment adaptability, strength and insulation performance meet the actual use requirements at the same time.

[0029] The damper 6 is formed by filling the gap between the space electronic device 7 and the mounting base 1 with a water vapor-sensitive colloidal material of different compositions and curing at room temperature. The damper 6 is used to absorb mechanical vibration energy and limit the vibration energy transmission in a specific frequency band, and its damping coefficient is determined according to the magnification of the mechanical load that the space electronic device 7 can withstand at the first-order frequency. In the embodiment of the present invention, the damper 6 is made by curing room temperature vulcanized silicone rubber for space use, and the damping coefficient of the damper 6 can be adjusted by changing the components of the vulcanized silicone rubber.

[0030] After confirming that the positional relationship and installation state of the mounting base 1, the insulating sleeve 3, the shock isolation mechanism 4, the second insulating pad 5, the heat-conducting filler 8, the graphene heat conductor 11 and the limit fixing member 9 with respect to the space electronic device 7 are normal, a liquid phase change damping material is filled between the space electronic device 7 and the mounting base 1, and after curing at room temperature, the damper 6 is formed. When filling the damping material, a baffle tooling can be used to limit the spatial position of the damping material, and the baffle tooling is removed after the damping material is completely cured to form the damper 6. After the damper 6 is cured, the pins of the space electronic device 7 and the insulating sleeve 3 are fixed.

[0031] The heat-conducting filler 8 is coated on the upper surface of the space electronic device 7 and is connected to the heat-conducting end of the graphene heat conductor 11, which is used to reduce the thermal resistance between the heat exchange interface of the space electronic device 7 and the graphene heat conductor 11 and improve the heat-conducting efficiency. In the embodiment of the present invention, the heat-conducting filler 8 is selected as a heat-conducting silicone grease material for space use.

[0032] The limit fixing part 9 is fixed on the mounting base 1 by two first screws 13, and presses and fixes the insulating sheet 10, the graphene heat conductor 11, the space electronic device 7, the second insulating pad 5, and the shock isolation mechanism 4 on the mounting base 1 from top to bottom. (As Figure 1 and Figure 2 shown)

[0033] The limit fixing part 9 is used to limit the displacements of the space electronic device 7 in three spatial directions when it is subjected to mechanical loads, prevent damage to the space electronic device 7, and at the same time ensure the stability and reliability of the heat-conducting interface between the graphene heat conductor 11 and the space electronic device 7. The limit fixing part 9 is also used to limit the displacement of the shock isolation mechanism 4 in the non-main support direction.

[0034] The insulating sheet 10 is a U-shaped insulating sheet, which is used to insulate between the limit fixing part 9 and the space electronic device 7 and is made of a high-strength insulating and heat-insulating material; in the embodiment of the present invention, polyimide material is selected, which can ensure that its space environmental adaptability, strength, and insulation performance meet the actual use requirements.

[0035] The graphene heat conductor 11 is a heat dissipation device made of a multi-layer novel and highly efficient heat-conducting graphene medium and encapsulated with a high-strength thin film material. Its length can be appropriately stretched, and it has the properties of high-efficiency heat conduction, insulation, anti-bending, moisture-proof, and mildew-proof. In the embodiment of the present invention, the surface of the graphene heat conductor 11 is encapsulated with polyimide material.

[0036] The two ends of the graphene heat conductor 11 are respectively a heat-conducting end and a heat-dissipating end. The heat-conducting end is clamped between the insulating sheet 10 and the heat-conducting filler 8, and the heat-dissipating end is fixed at a designated heat-dissipating position by the press clip 12 according to actual use requirements.

[0037] The press clip 12 presses on the heat-dissipating end of the graphene heat conductor 11, which is used to ensure the fixed position and reliable contact of the heat-dissipating end. In the embodiment of the present invention, screws are used to fix the press clip 12 at the designated heat-dissipating position.

[0038] In summary, the heat dissipation and anti-mechanical structure of the space electronic device proposed by the present invention utilizes the principle of vibration isolator and a new type of high-efficiency heat conduction technology. According to the space load environment and application characteristics, a structure suitable for high-power electronic devices of space loads, with the characteristics of high-efficiency heat dissipation and anti-mechanics, is designed. The present invention is applicable to the heat dissipation and anti-mechanical design of electronic devices used in space loads and other aerospace instruments; the present invention can improve the heat dissipation efficiency of space electronic devices, reduce the influence of the mechanical environment on space electronic devices, and increase the stability and reliability of large-mass and high-power space electronic devices.

[0039] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0040] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.

[0041] The above specific implementation manners of the present invention do not constitute a limitation to the protection scope of the present invention. Any other corresponding changes and deformations made according to the technical concept of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A heat dissipation and mechanical resistance structure for a space electronic device, characterized in that Including: An installation base, a limit fixing member, a first insulating pad installed on the lower surface of the installation base, an insulating sleeve for insulating the pins of a space electronic device, a shock isolation mechanism fixed on the installation base for supporting the space electronic device, a second insulating pad laid on the shock isolation mechanism, a damper located between the space electronic device and the installation base for absorbing mechanical vibration energy, a heat-conducting filler coated on the upper surface of the space electronic device, an insulating sheet for insulating between the limit fixing member and the space electronic device, a limit fixing member pressing on the upper end of the insulating sheet for positioning the space electronic device, a graphene heat conductor with a heat-conducting end sandwiched between the insulating sheet and the heat-conducting filler for heat conduction and heat dissipation, and a press clip pressing on the heat-dissipating end of the graphene heat conductor for ensuring the fixed position and reliable contact of the heat-dissipating end.

2. The heat dissipation and mechanical resistance structure of the space electronic device according to claim 1, characterized in that, On the installation base, there are external installation holes, first threaded holes for fixing the limit fixing member, pin installation holes corresponding to the positions of the pins of the space electronic device, and second threaded holes for fixing the shock isolation mechanism.

3. The heat dissipation and mechanical resistance structure of the space electronic device according to claim 2, characterized in that, The first insulating pad is made of an insulating and heat-insulating material, and there are a plurality of through holes on the first insulating pad, and the through holes respectively correspond to the external installation holes, the first threaded holes, and the positions of the pins of the space electronic device.

4. The heat dissipation and mechanical resistance structure of the space electronic device according to claim 2, characterized in that, The insulating sleeve is of a flange type structure, and the outer cylindrical surface of the insulating sleeve fits with the pin installation hole; the inner hole diameter of the insulating sleeve is larger than the diameter of the pins of the space electronic device, realizing the insulation between the pins of the space electronic device and the installation base without directly contacting the pins of the space electronic device; the lower end surface of the flange of the insulating sleeve is used for axially limiting the insulating sleeve.

5. The heat dissipation and mechanical resistance structure of the space electronic device according to claim 1, characterized in that, The shock isolation mechanism is a metal elastic structural member integrally processed and formed, and is fixed on the installation base by screws.

6. The heat dissipation and anti-mechanical structure of the space electronic device according to claim 1, characterized in that The damper is made by using a moisture-sensitive colloidal material and filling the gap between the space electronic device and the installation base, and curing at room temperature.

7. The heat dissipation and anti-mechanical structure of the space electronic device according to claim 1, characterized in that, The insulating sheet is a U-shaped insulating sheet.

8. The heat dissipation and anti-mechanical structure of the space electronic device according to claim 1, characterized in that The limit fixing member is installed on the installation base by screws, and presses and fixes the graphene heat conductor, the space electronic device, and the shock isolation mechanism on the installation base from top to bottom.

9. The heat dissipation and mechanical resistance structure of the space electronic device according to claim 1, characterized in that, The graphene heat conductor is made by using a heat-conducting graphene medium material and encapsulating it with a thin film material.

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