Intelligent System for Dynamically Measuring Microstress during the Solidification Process of Adhesive for Optical Element Bonding and Its Usage Method

Abstract

The present invention discloses an intelligent system for dynamically measuring the micro-stress during the solidification process of an adhesive for optical elements and its usage method. The system includes a mechanical sensing system, a data acquisition and signal processing system, and a result analysis and display system. The steps include: 1) Starting the intelligent system, filling a liquid solidifying adhesive to be measured with a thickness of d in a solidifying adhesive filling groove; 2) Adjusting the quick-adjustment handle of the macro-distance adjustment structure upwards until the distance between the upper liquid surface of the liquid solidifying adhesive to be measured in the solidifying adhesive filling groove and the upper bonding block is less than l; 3) Adjusting the slow-adjustment handle of the macro-distance adjustment structure to make the liquid solidifying adhesive to be measured in the solidifying adhesive filling groove closely adhere to the lower bottom surface of the upper bonding block; 4) The result analysis and display system 3 calculates the average instantaneous stress within the time period t according to the dynamic force physical signal. The present invention can significantly display the changing trends of the dynamic micro-stress and the ambient temperature, and overcomes the difficulties in the output and analysis processing of stress measurement data.

Description

Technical Field

[0001] The present invention relates to the technical field of dynamic micro stress measurement, specifically to an intelligent system for dynamically measuring micro stress during the solidification process of glue used for bonding optical elements and its usage method. Background Art

[0002] Compared with mechanical connection methods, the glue bonding method has the advantages of light weight, low cost, small stress, and low assembly difficulty. In recent years, in the field of space remote sensing, the use of glue bonding technology to install optical elements has become increasingly popular in the glue filling of opto-mechanical products. For high-precision optical elements, even under the action of tiny stress of the adhesive during the assembly process, surface shape changes will occur, affecting the optical imaging quality of the lens. Currently, there is no publicly available literature on the research of the assembly problem of high-precision optical elements induced by tiny stress abroad, and there is also a great lack of basic data on adhesive micro stress related to the assembly of ultra-precision optical elements in China. Generally speaking, the problem of micro stress assembly of high-precision optical elements is still in the exploratory stage. Aiming at the measurement problem of tiny stress during the solidification process of optical element glue bonding, which is difficult to be realized by traditional stress measurement methods and measuring instruments due to the long solidification time of the glue and small stress values, and the problem that the measured values cannot be accurately and effectively output for numerical analysis and processing, it is particularly important to invent a high-precision dynamic micro force measurement system. Summary of the Invention

[0003] The purpose of the present invention is to provide an intelligent system for dynamically measuring micro stress during the solidification process of glue used for bonding optical elements, including a mechanical sensing system, a data acquisition and signal processing system, and a result analysis and display system;

[0004] The mechanical sensing system collects in real time the physical signals of the force in the vertical direction during the solidification of the adhesive and the physical signals of the temperature of the measurement environment, and transmits them to the data acquisition and signal processing system;

[0005] The mechanical sensing system includes a mounting base, a glue filling workbench, a dynamic force transmission structure, a temperature sensor, a high-rigidity support structure I, a high-rigidity support structure II, and a force sensor;

[0006] The dynamic force transmission structure is installed on the mounting base;

[0007] The glue filling workbench includes an upper bonding block, a lower bonding block, and a macro adjustment structure;

[0008] The upper bonding block is bolted to the dynamic force transmission structure;

[0009] The upper surface of the lower bonding block is provided with a solidified glue filling groove; the solidified glue filling groove is filled with the liquid solidified glue to be measured;

[0010] The macro adjustment structure is bolted to the high-rigidity support structure I;

[0011] The macro adjustment structure is connected to the lower bonding block;

[0012] The macro adjustment structure drives the lower bonding block to move upward, so that the upper surface of the lower bonding block is bonded to the lower surface of the upper bonding block;

[0013] The axes of the upper bonding block and the lower bonding block are collinear, and the surfaces of the upper bonding block and the lower bonding block are horizontal.

[0014] The macro adjustment structure includes a macro adjustment structure body, a macro adjustment structure quick adjustment handle, a macro adjustment structure slow adjustment handle, a macro adjustment structure handle locking screw, a locking nut, and a lower bonding block locking screw;

[0015] The macro adjustment structure body is connected to the high-rigidity support structure I through a locking nut;

[0016] The macro adjustment structure body is connected to the lower bonding block through a lower bonding block locking screw;

[0017] The macro adjustment structure body is a telescopic structure.

[0018] The macro adjustment structure quick adjustment handle is connected to the macro adjustment structure body through a macro adjustment structure handle locking screw;

[0019] The macro adjustment structure quick adjustment handle drives the macro adjustment structure body to move upward;

[0020] The macro adjustment structure slow adjustment handle is connected to the macro adjustment structure body through a macro adjustment structure handle locking screw;

[0021] The macro adjustment structure slow adjustment handle adjusts the length of the macro adjustment structure body.

[0022] The dynamic force transmission structure includes a power column, a connecting large screw, a connecting small screw, and a sensor contact seat;

[0023] The power column is installed on the mounting base;

[0024] The sensor contact seat is fixed to the power column through a connecting large screw;

[0025] The force sensor is connected to the sensor contact seat through a connecting small screw.

[0026] The temperature sensor detects the ambient temperature and sends it to the data acquisition and signal processing system;

[0027] The high-rigidity support structure I is bolted to the high-rigidity support structure II;

[0028] The high-rigidity support structure II is bolted to the mounting base;

[0029] The force sensor monitors the dynamic force physical signals received by the dynamic force transmission structure and sends them to the data acquisition and signal processing system;

[0030] The data acquisition and signal processing system preprocesses the dynamic force physical signals and temperature signals and transmits them to the result analysis and display system;

[0031] The data acquisition and signal processing system includes a data acquisition module, a data processing module, and a data communication module;

[0032] The data acquisition module receives the dynamic force physical signals and temperature signals and converts them into dynamic force electrical signals and temperature electrical signals; the data acquisition module transmits the dynamic force electrical signals and temperature electrical signals to the data processing module;

[0033] The data processing module converts the received electrical signals into digital signals and performs filtering and noise reduction; the data processing module transmits the filtered dynamic force digital signals and temperature digital signals to the data communication module;

[0034] The data communication module transmits the dynamic force digital signals and temperature digital signals to the result analysis and display system.

[0035] The result analysis and display system calculates the average instantaneous stress within the t period based on the dynamic force physical signals.

[0036] The result analysis and display system includes a memory, a data analysis module, and a result display module;

[0037] The memory receives and stores the dynamic force digital signals and temperature digital signals transmitted by the data acquisition and signal processing system;

[0038] The data analysis module retrieves the dynamic force digital signals and temperature digital signals stored in the memory and restores them to dynamic force physical signals and temperature signals;

[0039] The data analysis module calculates the average instantaneous dynamic stress within the t period based on the physical signals and transmits it to the result display module;

[0040] The result display module displays the average instantaneous dynamic stress and temperature.

[0041] The result analysis and display system further includes an alarm module; the data analysis module stores a minimum stress threshold and an error threshold;

[0042] When the error between the average instantaneous dynamic stresses of two adjacent time periods is less than the error threshold, the current average instantaneous dynamic stress is less than or equal to the minimum stress threshold, or the average instantaneous dynamic stress does not change within T time, the data analysis module sends an alarm signal to the alarm module;

[0043] After receiving the alarm signal, the alarm module issues an alarm and the measurement ends.

[0044] The data analysis module generates a dynamic force-time curve and a temperature-time history curve, and displays them through the result display module.

[0045] A method for using an intelligent system for dynamic measurement of micro-stresses during the solidification process of glue for bonding optical elements includes the following steps:

[0046] 1) Set up an intelligent system for dynamic measurement of micro-stresses during the solidification process of glue for bonding optical elements;

[0047] After setting up the intelligent system for dynamic measurement of micro-stresses during the solidification process of glue for bonding optical elements, the intelligent system was calibrated.

[0048] 2) Configure the liquid solidifying glue to be measured;

[0049] 3) Start the intelligent system, and fill the solidifying glue filling groove with the liquid solidifying glue to be measured with a thickness of d; during the filling process, the temperature sensor monitors the ambient temperature and sends it to the result analysis and display system;

[0050] 4) Turn up the quick adjustment handle of the macro adjustment structure until the distance between the upper liquid surface of the liquid solidifying glue to be measured in the solidifying glue filling groove and the upper bonding block is less than l; during the adjustment process, the temperature sensor monitors the ambient temperature and sends it to the result analysis and display system;

[0051] 5) Adjust the slow adjustment handle of the macro adjustment structure to make the liquid solidifying glue to be measured in the solidifying glue filling groove closely adhere to the lower bottom surface of the upper bonding block until the error between the average instantaneous dynamic stresses of two adjacent time periods is greater than the error threshold, the current average instantaneous dynamic stress is less than or equal to the minimum stress threshold, or the average instantaneous dynamic stress does not change within T time, and stop the adjustment; during the adjustment process, the force sensor monitors the dynamic force physical signal received by the dynamic force transmission structure and sends it to the data acquisition and signal processing system; the temperature sensor monitors the ambient temperature and sends it to the result analysis and display system;

[0052] 6) The data acquisition and signal processing system preprocesses the dynamic force physical signal and the temperature signal, and transmits them to the result analysis and display system;

[0053] 7) The result analysis and display system calculates the average instantaneous stress within the t time period according to the dynamic force physical signal.

[0054] It should be noted that the mechanical sensing system 1 provided by the present invention uses the internal micro-force sensor 1-7 to sense the physical signal of the dynamic force generated by the adhesive solidification in real time, and uses the temperature sensor 1-4 to sense the ambient temperature of the adhesive solidification in real time. The physical signals of the adhesive solidification force and the temperature physical signal of the measurement environment are automatically collected by the data acquisition and signal processing system 2, and the above physical force signals are converted into electrical signals; the above electrical signals are converted into digital signals, and the digital signals are filtered; the filtered data is transmitted to the memory, and then transmitted to the external result analysis and display system through the lower-shaped data line. After the result data analysis, a dynamic micro-stress value data group and a temperature value data group are formed, and the dynamic stress-time and temperature-time history curves are displayed in real time by the system. If the collected data error is abnormal, or the average instantaneous stress data is too low, or the system automatically alerts after stabilizing to a certain value.

[0055] The technical effect of the present invention is beyond doubt. The present invention has the following beneficial effects:

[0056] 1) It solves the problem that the traditional stress measurement method and measurement instrument are difficult to monitor the micro-stress during the solidification process and record the ambient temperature due to the long adhesive solidification time and small stress value of the adhesive used for bonding optical elements.

[0057] 2) The present invention has a good design logic, adopts a modular design, has a high sensitivity of the induction system, intelligent data analysis, and is convenient to operate. By using this system, the dynamic micro-stress during the adhesive solidification process can be measured very effectively. The micro-distance adjustment structure of the adhesive filling workbench 1-2 (all structures of 1-2 except 1-2-2 and 1-2-3) can accurately control the adhesive spot thickness of the measurement object adhesive, with simple debugging, strong practicability, and is conducive to popularization.

[0058] 3) During the optical element adhesive solidification process, the adhesive gradually solidifies from a liquid state to a solid state over several hours. The invention can directly calculate the instantaneous dynamic stress through the recognition and data processing of macroscopic micro-forces without pasting strain gauges, overcoming the difficulty that the existing stress measurement system cannot measure the micro-stress of adhesive solidification;

[0059] 4) The present invention can realize the whole process automation from the physical signals of force and temperature to digital signals and then to graphic signal output, and is transmitted to the result analysis and display system 3 through the export system. Through the data analysis software, dynamic stress-time and temperature-time history curves are generated, which can more clearly display the change trends of dynamic micro-stress and ambient temperature, overcoming the difficulties of stress measurement data output and analysis and processing. Therefore, this system is more convenient to use;

[0060] 5) The result data display and export system 2 of the present invention uses a USB-serial port and has the advantage of fast data transmission. The micro-force acquisition system uses an ADS1230 high-precision analog-to-digital converter, which has better gain stability than the existing stress measurement systems and higher accuracy of measurement data;

[0061] 6) The present invention has a simple structure, convenient operation and strong practicability. It adopts a double-workbench structure and can measure the stress of two groups of adhesive coagulation simultaneously. The invention can also automatically calculate the measured dynamic micro-force value and temperature value to generate an average instantaneous stress curve and a temperature change curve, and output and display them on the same coordinate axis at the same time, which is convenient for comprehensive analysis. Brief Description of the Drawings

[0062] Figure 1 is the logical diagram of the system composition of the present invention;

[0063] Figure 2 is the schematic diagram of the overall system solution of the present invention;

[0064] Figure 3 is the schematic diagram of the structure of the micro-force mechanical sensing system of the present invention;

[0065] Figure 4 is the schematic diagram of the structure and connection of the micro-force sensor of the present invention;

[0066] Figure 5 is the schematic diagram of the glue layer thickness control structure during the implementation process of the system of the present invention;

[0067] Figure 6 is the schematic diagram of the measurement data transmission during the implementation process of the system of the present invention;

[0068] In the figure, 1 - mechanical perception system, 2 - data acquisition and signal processing system, 3 - result analysis and display system, 1-1 mounting base, 1-2 glue filling workbench, 1-3 dynamic force transmission structure, 1-4 ambient temperature sensor, 1-5 high-rigidity support structure I, 1-6 high-rigidity support structure II, 1-7 high-precision force sensor, 1-8 data transmission line, 1-9 result data information transmission interface, support chassis 1-10, 1-3-1 power column, 1-3-2 connecting large screw, 1-3-3 connecting small screw, 1-3-4 sensor contact seat, 1-7-1 micro-force sensor body, 1-7-2 sensor micro-force strain perception structure I, 1-7-3 sensor micro-force strain perception structure II, 1-3 power column part, 1-5 high-rigidity support structure, 1-2-1 upper bonding block fastening screw, 1-2-2 upper bonding block, 1-2-3 lower bonding block, 1-2-4 macro adjustment structure body, 1-2-5 macro adjustment structure quick adjustment handle, 1-2-6 macro adjustment structure slow adjustment handle, 1-2-7 macro adjustment structure handle locking screw, 1-2-8 locking nut for the macro adjustment structure body and the high-rigidity support structure 1-5, 1-2-9 upper bonding block locking screw, 1-2-10 filled glue layer. Detailed implementation manner

[0069] The present invention will be further described below in conjunction with embodiments, but it should not be understood that the above-mentioned subject matter scope of the present invention is limited to the following embodiments. Without departing from the above technical idea of the present invention, various substitutions and changes made according to ordinary technical knowledge and customary means in the art should be included within the protection scope of the present invention.

[0070] Embodiment 1:

[0071] Refer to Figures 1 to 6 , an intelligent system for dynamically measuring micro-stress during the solidification process of glue for bonding optical elements, including a mechanical perception system 1, a data acquisition and signal processing system 2, and a result analysis and display system 3;

[0072] The mechanical perception system 1 collects in real time the physical signals of the force in the vertical direction during the solidification of the glue and the physical signals of the temperature of the measurement environment, and transmits them to the data acquisition and signal processing system 2;

[0073] The mechanical perception system 1 includes a mounting base 1-1, a glue filling workbench 1-2, a dynamic force transmission structure 1-3, a temperature sensor 1-4, a high-rigidity support structure I 1-5, a high-rigidity support structure II 1-6, and a force sensor 1-7;

[0074] The dynamic force transmission structure 1-3 is installed on the mounting base 1-1;

[0075] The adhesive filling workbench 1-2 includes an upper bonding block 1-2-2, a lower bonding block 1-2-3 and a micro-adjustment structure;

[0076] The upper bonding block 1-2-2 is bolted to the dynamic force transmission structure 1-3;

[0077] The upper surface of the lower bonding block 1-2-3 is provided with a solidifying glue filling groove; the solidifying glue filling groove is filled with the liquid solidifying glue to be tested;

[0078] The micro-adjustment structure is bolted to the high-rigidity support structure I 1-5;

[0079] The micro-adjustment structure is connected to the lower bonding block 1-2-3;

[0080] The micro-adjustment structure drives the lower bonding block 1-2-3 to move upward, so that the upper surface of the lower bonding block 1-2-3 is bonded to the lower surface of the upper bonding block 1-2-2;

[0081] The axes of the upper bonding block 1-2-2 and the lower bonding block 1-2-3 are collinear, and the surfaces of the upper bonding block 1-2-2 and the lower bonding block 1-2-3 are horizontal.

[0082] The micro-adjustment structure includes a micro-adjustment structure body 1-2-4, a micro-adjustment structure quick-adjustment handle 1-2-5, a micro-adjustment structure slow-adjustment handle 1-2-6, a micro-adjustment structure handle locking screw 1-2-7, a locking nut 1-2-8, and a lower bonding block locking screw 1-2-9;

[0083] The micro-adjustment structure body 1-2-4 is connected to the high-rigidity support structure I 1-5 through the locking nut 1-2-8;

[0084] The micro-adjustment structure body 1-2-4 is connected to the lower bonding block 1-2-3 through the lower bonding block locking screw 1-2-9;

[0085] The micro-adjustment structure body 1-2-4 is a telescopic structure.

[0086] The micro-adjustment structure quick-adjustment handle 1-2-5 is connected to the micro-adjustment structure body 1-2-4 through the micro-adjustment structure handle locking screw 1-2-7;

[0087] The micro-adjustment structure quick-adjustment handle 1-2-5 drives the micro-adjustment structure body 1-2-4 to move upward;

[0088] The micro-adjustment structure slow-adjustment handle 1-2-6 is connected to the micro-adjustment structure body 1-2-4 through the micro-adjustment structure handle locking screw 1-2-7;

[0089] The slow - adjustment handle 1 - 2 - 6 of the macro - adjustment structure controls the telescopic process of the macro - adjustment structure body 1 - 2 - 4, thereby adjusting the length of the macro - adjustment structure body 1 - 2 - 4.

[0090] The dynamic force transmission structure 1 - 3 includes a power column 1 - 3 - 1, a connecting large screw 1 - 3 - 2, a connecting small screw 1 - 3 - 3, and a sensor contact seat 1 - 3 - 4;

[0091] The power column 1 - 3 - 1 is installed on the mounting base 1 - 1;

[0092] The sensor contact seat 1 - 3 - 4 is fixed to the power column 1 - 3 - 1 through the connecting large screw 1 - 3 - 2;

[0093] The force sensor 1 - 7 is connected to the sensor contact seat 1 - 3 - 4 through the connecting small screw 1 - 3 - 3.

[0094] The force sensor 1 - 7 includes a micro - force sensor body 1 - 7 - 1, a sensor micro - force strain perception structure I 1 - 7 - 2, and a sensor micro - force strain perception structure II 1 - 7 - 3. The sensor micro - force strain perception structure I 1 - 7 - 2 and the sensor micro - force strain perception structure II 1 - 7 - 3 are located inside the micro - force sensor body 1 - 7 - 1 and are used to monitor dynamic force physical signals.

[0095] The temperature sensor 1 - 4 detects the ambient temperature and sends it to the data acquisition and signal processing system 2;

[0096] The high - stiffness support structure I 1 - 5 is bolt - connected to the high - stiffness support structure II 1 - 6;

[0097] The high - stiffness support structure II 1 - 6 is bolt - connected to the mounting base 1 - 1;

[0098] The force sensor 1 - 7 monitors the dynamic force physical signals received by the dynamic force transmission structure 1 - 3 and sends them to the data acquisition and signal processing system 2;

[0099] The data acquisition and signal processing system 2 pre - processes the dynamic force physical signals and temperature signals and transmits them to the result analysis and display system 3;

[0100] The data acquisition and signal processing system 2 includes a data acquisition module, a data processing module, and a data communication module;

[0101] The data acquisition module receives the dynamic force physical signals and temperature signals and converts them into dynamic force electrical signals and temperature electrical signals; the data acquisition module transmits the dynamic force electrical signals and temperature electrical signals to the data processing module;

[0102] The data processing module converts the received electrical signal into a digital signal and performs filtering and noise reduction; the data processing module transmits the filtered dynamic force digital signal and temperature digital signal to the data communication module;

[0103] The data communication module transmits the dynamic force digital signal and temperature digital signal to the result analysis and display system 3.

[0104] The result analysis and display system 3 calculates the average instantaneous stress within the t period according to the dynamic force physical signal.

[0105] The result analysis and display system 3 includes a memory, a data analysis module, and a result display module;

[0106] The memory receives and stores the dynamic force digital signal and temperature digital signal transmitted by the data acquisition and signal processing system 2;

[0107] The data analysis module retrieves the dynamic force digital signal and temperature digital signal stored in the memory and restores them to the dynamic force physical signal and temperature signal;

[0108] The data analysis module calculates the average instantaneous dynamic stress within the t period according to the physical signal and transmits it to the result display module;

[0109] The result display module displays the average instantaneous dynamic stress and temperature.

[0110] The result analysis and display system 3 further includes an alarm module; the data analysis module stores a minimum stress threshold and an error threshold;

[0111] When the error between the average instantaneous dynamic stresses of two adjacent periods is less than the error threshold, the current average instantaneous dynamic stress is less than or equal to the minimum stress threshold, or the average instantaneous dynamic stress does not change within the T time, the data analysis module sends an alarm signal to the alarm module;

[0112] After receiving the alarm signal, the alarm module issues an alarm and the measurement ends.

[0113] The data analysis module generates a dynamic force-time curve and a temperature-time history curve and displays them through the result display module.

[0114] Embodiment 2:

[0115] An intelligent system for dynamically measuring the microstress during the solidification process of an adhesive for bonding optical elements, comprising:

[0116] The mechanical sensing system 1 includes a high-precision force sensor 1-7, a dynamic force transmission structure 1-3, high-rigidity support structures 1-5 and 1-6, a glue-filled workbench 1-2 and a mounting base 1-1. The dynamic force transmission structure 1-3 further includes a power column 1-3-1, a connecting large screw 1-3-2, a connecting small screw 1-3-3 and a sensor contact seat 1-3-4. The glue-filled workbench 1-2 further includes an upper bonding block 1-2-2, a lower bonding block 1-2-3 and a micro-adjustment structure (all structures of 1-2 except 1-2-2 and 1-2-3). The glue filling thickness is controlled by the micro-adjustment structure. The dynamic stress value during the glue solidification process is transmitted to the data acquisition and signal processing system 2 through the force sensor 1-7. The mechanical sensing system 1 also has a support chassis 1-10 for supporting the mounting base 1-1.

[0117] The mechanical sensing system 1 uses the internal micro force sensor 1-7 to sense the physical signal of the dynamic force generated by the glue solidification in real time, and uses the temperature sensor 1-4 to sense the ambient temperature of the glue solidification in real time. The physical signal of the glue solidification force and the temperature physical signal of the measurement environment are automatically collected by the data acquisition and signal processing system 2, and the above physical force signal is converted into an electrical signal; the above electrical signal is converted into a digital signal, and the digital signal is filtered; the data obtained after filtering is transmitted to the memory, and then transmitted to the external result analysis and display system through the lower-shaped data line. After the result data analysis, a dynamic micro stress value data set and a temperature value data set are formed, and the system displays the dynamic stress-time and temperature-time history curves in real time. If the collected data error is abnormal, or the average instantaneous stress data is too low, or the system will automatically remind after stabilizing to a certain value. This system has intelligence.

[0118] The upper bonding block 1-2-2 and the lower bonding block 1-2-3 are used to complete the glue connection. The upper surface of the lower bonding block 1-2-3 is provided with a circular filling groove with a diameter of 18 mm and a depth of 0.5 mm for filling the solidified glue, which can adapt to the filling of various specifications of glue spot thickness. The glue spot thickness of the measurement object glue can be accurately controlled through the micro-adjustment structure of the glue-filled workbench 1-2 (all structures of 1-2 except 1-2-2 and 1-2-3). The filling glue spot thickness can be quantitatively controlled and the operation is simple and time-saving.

[0119] The data acquisition and signal processing system 2 includes a data acquisition module, a data communication module, a data processing module, a signal transmission interface and connections, etc. The physical signal of the glue solidification force in the vertical direction and the temperature physical signal of the measurement environment are collected in real time through the mechanical sensing system 1, and the above physical force signal is converted into an electrical signal; the above electrical signal is converted into a digital signal, and the digital signal is filtered; the data obtained after filtering is transmitted to the memory.

[0120] The data acquisition and signal processing system 2 includes a data conversion module, a data acquisition module, and a data communication module, which can convert physical force signals into electrical signals, convert the above electrical signals into digital signals, filter the digital signals, and transmit the filtered data to a memory.

[0121] The result analysis and display system 3 includes a data memory for dynamic stress and temperature data, data analysis software, a result display screen, etc. The data analysis software is used for sorting and analog analysis of the measured dynamic force and temperature data, converting the force data into average instantaneous stress values, and controlling and managing data export, etc. The data display screen is used for displaying the measured dynamic stress and temperature data.

[0122] The result analysis and display system 3 is provided with a data display screen, which automatically displays the measured values of instantaneous adhesive stress. By generating dynamic stress-time and temperature-time history curves through the data analysis software, the change trends of dynamic micro-stress and ambient temperature can be more clearly displayed, overcoming the difficulties of stress measurement data output and analysis and processing.

[0123] An intelligent system for dynamically measuring micro-stress during the solidification process of an adhesive for bonding optical elements performs data interaction through a data transmission line 1-8 and transmits data to an external storage device (such as a host computer, a storage disk, etc.) through a result data information transmission interface 1-9.

[0124] Example 3:

[0125] The usage method of an intelligent system for dynamically measuring micro-stress during the solidification process of an adhesive for bonding optical elements includes the following steps:

[0126] 1) Build an intelligent system for dynamically measuring micro-stress during the solidification process of an adhesive for bonding optical elements;

[0127] After building the intelligent system for dynamically measuring micro-stress during the solidification process of an adhesive for bonding optical elements, the intelligent system was calibrated.

[0128] 2) Configure the liquid solidifying adhesive to be measured;

[0129] 3) Start the intelligent system, and fill the solidifying adhesive filling tank with the liquid solidifying adhesive to be measured with a thickness of d; during the filling process, the temperature sensor 1-4 monitors the ambient temperature and sends it to the result analysis and display system 3;

[0130] 4) Turn up the quick adjustment handle 1-2-5 of the macro adjustment structure until the distance between the upper liquid surface of the liquid solidifying adhesive to be measured in the solidifying adhesive filling tank and the upper bonding block 1-2-2 is less than l; during the adjustment process, the temperature sensor 1-4 monitors the ambient temperature and sends it to the result analysis and display system 3;

[0131] 5) Adjust the slow - adjustment handle 1 - 2 - 6 of the macro - micro adjustment structure so that the liquid solidifying glue to be measured in the solidifying glue filling groove is in close contact with the lower bottom surface of the upper bonding block 1 - 2 - 2 until the error between the average instantaneous dynamic stresses of two adjacent time periods is greater than the error threshold, the current average instantaneous dynamic stress is less than or equal to the minimum stress threshold, or the average instantaneous dynamic stress does not change within T time, then stop the adjustment; during the adjustment process, the force sensor 1 - 7 monitors the physical signal of the dynamic force received by the dynamic force transmission structure 1 - 3 and sends it to the data acquisition and signal processing system 2; the temperature sensor 1 - 4 monitors the ambient temperature and sends it to the result analysis and display system 3;

[0132] 6) The data acquisition and signal processing system 2 pre - processes the physical signal of the dynamic force and the temperature signal and transmits them to the result analysis and display system 3;

[0133] 7) The result analysis and display system 3 calculates the average instantaneous stress within the t time period according to the physical signal of the dynamic force.

[0134] Example 4:

[0135] The usage method of the intelligent system for dynamic measurement of micro - stress during the solidification process of the glue for bonding optical elements includes the following steps:

[0136] 1) System assembly and preliminary inspection process: Assemble the whole system tightly according to the schematic diagram Figure 2 and place the assembled system on a horizontal table. Check the axial alignment of the upper bonding block 1 - 2 - 2 and the lower bonding block 1 - 2 - 3 and the parallelism of the bonding end faces. If the deviation is large, fine - tune it to the standard position, and then check whether the signal of the mechanical sensing system 1 can be effectively transmitted to the result analysis and display system 3 through the data acquisition and signal processing system 2. If the system signal transmission is normal, the preliminary inspection process ends. Otherwise, check whether the connections of each port are correctly connected.

[0137] 2) Pre - preparation of glue process: Prepare two or one portion of two kinds of liquid solidifying glue to be measured according to the correct ratio of the experimental purpose and the test adhesive (object). The type of solidifying glue is selected as the mixed glue of type A and type B of 2216, where the ratio of A / B glue is 7 / 5.

[0138] 3) System debugging and calibration process: First, clear the system data. Turn up the quick-adjust handle 1-2-5 of the macro-adjustment structure to raise the lower bonding block 1-2-3 until it is close to the bottom surface of the upper bonding block 1-2-2. At this time, adjust the slow-adjust handle 1-2-6 of the macro-adjustment structure to raise the lower bonding block 1-2-3 until it contacts the bottom surface of the upper bonding block 1-2-2. At this time, the result analysis and display system 3 will automatically remind to release a warning signal until the system reminds that it has reached the position, and then stop the operation. Record the height value at this time. Move the lower bonding block 1-2-3 down to a specified position through the macro-adjustment handle 1-2-5, and use 10g and 15g weights to calibrate the measurement accuracy of the mechanical sensing system 1 in turn.

[0139] 4) Initial glue filling and measurement process: Fill the circular filling groove of the lower glue-bonding block 1-2-3 with liquid glue of an appropriate thickness (0.05mm << d << 0.5mm) (the actual glue injection volume is determined by the experimental purpose and implemented through a precision glue injection volume tool). Turn on the temperature sensor 1-4 to sense the ambient temperature of the glue solidification in real time during the measurement process. Turn up the quick-adjust handle 1-2-5 of the macro-adjustment structure to make the upper liquid surface of the liquid glue in the lower bonding block 1-2-3 just close to the bottom surface of the upper bonding block 1-2-2. Start the result analysis and display system 3. At this time, adjust the slow-adjust handle 1-2-6 of the macro-adjustment structure to make the upper liquid surface of the liquid glue in the lower bonding block 1-2-3 closely adhere to the bottom surface of the upper bonding block 1-2-2 at the recorded height, so that the change in the bonding force tends to be stable. Stop adjusting the macro-adjustment. Use the data acquisition and signal processing system 2 to transfer the collected data to the result analysis and display system 3 to display and store the dynamic stress-time and temperature-time history curves in real time. If the average instantaneous stress stabilizes to a certain value, the system will automatically prompt the solidification (shrinkage or expansion) force of the filled glue and the average stress value, and the system will automatically analyze and give the stress trend line. If there is an abnormal error in the collected data during the measurement process, the system will also automatically remind that the test is incorrect. If measuring the solidification stress of two kinds of glue at the same time, a second workbench is needed, and just repeat steps three and four above.

[0140] 5) Glue replacement process: Loosen the locking screw 1-2-1 in the reverse direction to disconnect the upper bonding block 1-2-2 from the power column 1-3-1. Then, through the macro-adjustment handle 1-2-5, lower the lower glue-bonding block 1-2-3 together with the solidified test glue 1-2-10 and its upper bonding block 1-2-2 as a whole to the standard position. Loosen the locking screw 1-2-7 on the lower glue-bonding block 1-2-3 to remove the lower bonding block 1-2-3, clean the old glue, and wait for the next test.

[0141] 6) Retest process: Clean the upper and lower adhesive blocks 1-2-2 and 1-2-3, assemble the upper adhesive block 1-2-2 into the assembly hole of the power column 1-3-1, and rotate the screw 1-2-1 to lock the upper bonding block 1-2-2 with the power column 1-3-1. Repeat the above steps for measurement until the experiment ends.

[0142] 7) Result analysis process: The system will automatically sort, compare and analyze according to the dynamic stress-time and temperature-time history curves of the two solidifying adhesives stored in the result analysis and display system 3, and automatically generate a brief analysis report.

Claims

1. An intelligent system for dynamically measuring micro-stress during the solidification process of glue for bonding optical elements, characterized in that, It includes a mechanical sensing system (1), a data acquisition and signal processing system (2), and a result analysis and display system (3). The mechanical sensing system (1) collects in real time the physical signals of the force of the viscose solidification in the vertical direction and the physical signals of the temperature of the measurement environment, and transmits them to the data acquisition and signal processing system (2). The mechanical sensing system (1) includes a mounting base (1-1), a viscose filling workbench (1-2), a dynamic force transmission structure (1-3), a temperature sensor (1-4), a high-rigidity support structure I (1-5), a high-rigidity support structure II (1-6), and a force sensor (1-7). The dynamic force transmission structure (1-3) is mounted on the mounting base (1-1). The viscose filling workbench (1-2) includes an upper bonding block (1-2-2), a lower bonding block (1-2-3), and a micro-adjustment structure. The upper bonding block (1-2-2) is bolted to the dynamic force transmission structure (1-3). The upper surface of the lower bonding block (1-2-3) is provided with a solidified glue filling groove; the solidified glue filling groove is filled with the liquid solidified glue to be measured. The micro-adjustment structure is bolted to the high-rigidity support structure I (1-5). The micro-adjustment structure is connected to the lower bonding block (1-2-3). The micro-adjustment structure drives the lower bonding block (1-2-3) to move upward, so that the upper surface of the lower bonding block (1-2-3) is bonded to the lower surface of the upper bonding block (1-2-2). The temperature sensor (1-4) detects the ambient temperature and sends it to the data acquisition and signal processing system (2). The high-rigidity support structure I (1-5) is bolted to the high-rigidity support structure II (1-6). The high-rigidity support structure II (1-6) is bolted to the mounting base (1-1). The force sensor (1-7) monitors the physical signals of the dynamic force received by the dynamic force transmission structure (1-3) and sends them to the data acquisition and signal processing system (2). The data acquisition and signal processing system (2) preprocesses the physical signals of the dynamic force and the temperature signals and transmits them to the result analysis and display system (3). The result analysis and display system (3) calculates the average instantaneous stress within the t period according to the physical signals of the dynamic force. The dynamic force transmission structure (1-3) includes a power column (1-3-1), a connecting large screw (1-3-2), a connecting small screw (1-3-3), and a sensor contact seat (1-3-4). The force sensor (1-7) includes a micro force sensor body (1-7-1), a sensor micro force strain sensing structure I (1-7-2), and a sensor micro force strain sensing structure II (1-7-3).

2. The intelligent system for dynamically measuring micro-stress during the solidification process of glue for bonding optical elements according to claim 1, characterized in that, The power column (1-3-1) is mounted on the mounting base (1-1). The sensor contact seat (1-3-4) is fixed to the power column (1-3-1) by the connecting large screw (1-3-2). The force sensor (1-7) is connected to the sensor contact seat (1-3-4) by the connecting small screw (1-3-3).

3. The intelligent system for dynamically measuring micro-stress during the solidification process of glue for bonding optical elements according to claim 1, characterized in that, The data acquisition and signal processing system (2) includes a data acquisition module, a data processing module, and a data communication module. The data acquisition module receives dynamic force physical signals and temperature signals, and converts them into dynamic force electrical signals and temperature electrical signals; The data acquisition module transmits the dynamic force electrical signal and the temperature electrical signal to the data processing module; The data processing module converts the received electrical signals into digital signals and performs filtering and noise reduction; The data processing module transmits the filtered dynamic force digital signal and temperature digital signal to the data communication module; The data communication module transmits the dynamic force digital signal and the temperature digital signal to the result analysis and display system (3).

4. The intelligent system for dynamically measuring micro-stress during the solidification process of glue for bonding optical elements according to claim 1, characterized in that, The result analysis and display system (3) includes a memory, a data analysis module, and a result display module; The memory receives and stores the dynamic force digital signal and the temperature digital signal transmitted by the data acquisition and signal processing system (2); The data analysis module retrieves the dynamic force digital signal and the temperature digital signal stored in the memory, and restores them to dynamic force physical signals and temperature signals; The data analysis module calculates the average instantaneous dynamic stress within the t period according to the physical signal and transmits it to the result display module; The result display module displays the average instantaneous dynamic stress and the temperature.

5. The intelligent system for dynamically measuring micro-stress during the solidification process of the adhesive for optical element bonding according to claim 4, characterized in that, The result analysis and display system (3) further includes an alarm module; the data analysis module stores a stress minimum threshold and an error threshold; When the error between the average instantaneous dynamic stresses of two adjacent periods is less than the error threshold, the current average instantaneous dynamic stress is less than or equal to the stress minimum threshold, or the average instantaneous dynamic stress does not change within the T time, the data analysis module sends an alarm signal to the alarm module; After receiving the alarm signal, the alarm module issues an alarm and the measurement ends.

6. The intelligent system for dynamically measuring micro-stress during the solidification process of the adhesive for optical element bonding according to claim 5, characterized in that, The data analysis module generates a dynamic force-time curve and a temperature-time history curve, and displays them through the result display module.

7. The intelligent system for dynamically measuring micro-stress during the solidification process of the adhesive for optical element bonding according to claim 1, characterized in that, The axes of the upper bonding block (1-2-2) and the lower bonding block (1-2-3) are collinear, and the surfaces of the upper bonding block (1-2-2) and the lower bonding block (1-2-3) are horizontal.

8. The intelligent system for dynamically measuring micro-stress during the solidification process of the adhesive for optical element bonding according to claim 1, characterized in that, The macro adjustment structure includes a macro adjustment structure body (1-2-4), a macro adjustment structure quick adjustment handle (1-2-5), a macro adjustment structure slow adjustment handle (1-2-6), a macro adjustment structure handle locking screw (1-2-7), a locking nut (1-2-8), and a lower bonding block locking screw (1-2-9); The macro adjustment structure body (1-2-4) is connected to the high-rigidity support structure I (1-5) through the locking nut (1-2-8); The macro adjustment structure body (1-2-4) is connected to the lower bonding block (1-2-3) through the lower bonding block locking screw (1-2-9); The macro adjustment structure body (1-2-4) is a telescopic structure; The macro adjustment structure quick adjustment handle (1-2-5) is connected to the macro adjustment structure body (1-2-4) through the macro adjustment structure handle locking screw (1-2-7); The macro adjustment structure quick adjustment handle (1-2-5) drives the macro adjustment structure body (1-2-4) to move upward; The slow - adjustment handle (1 - 2 - 6) of the macro - adjustment structure is connected to the macro - adjustment structure body (1 - 2 - 4) through the macro - adjustment structure handle locking screw (1 - 2 - 7). The slow - adjustment handle (1 - 2 - 6) of the macro - adjustment structure adjusts the length of the macro - adjustment structure body (1 - 2 - 4).

9. The method for using the intelligent system for dynamically measuring micro-stress during the solidification process of the adhesive for optical element bonding according to any one of claims 1-8, characterized in that, It includes the following steps: 1) Build an intelligent system for dynamic measurement of micro - stress during the solidification process of the adhesive for optical element bonding; 2) Configure the liquid solidifying adhesive to be measured; 3) Start the intelligent system, and fill the liquid solidifying adhesive to be measured with a thickness of d in the solidifying adhesive filling groove; during the filling process, the temperature sensor (1 - 4) monitors the ambient temperature and sends it to the result analysis and display system (3); 4) Adjust the fast - adjustment handle (1 - 2 - 5) of the macro - adjustment structure until the distance between the upper liquid surface of the liquid solidifying adhesive to be measured in the solidifying adhesive filling groove and the upper bonding block (1 - 2 - 2) is less than l; during the adjustment process, the temperature sensor (1 - 4) monitors the ambient temperature and sends it to the result analysis and display system (3); 5) Adjust the slow - adjustment handle (1 - 2 - 6) of the macro - adjustment structure to make the liquid solidifying adhesive to be measured in the solidifying adhesive filling groove closely adhere to the lower bottom surface of the upper bonding block (1 - 2 - 2) until the error between the average instantaneous dynamic stresses of two adjacent time periods is greater than the error threshold, the current average instantaneous dynamic stress is less than or equal to the minimum stress threshold, or the average instantaneous dynamic stress does not change within T time, and then stop the adjustment; During the adjustment process, the force sensor (1 - 7) monitors the physical signal of the dynamic force received by the dynamic force transmission structure (1 - 3) and sends it to the data acquisition and signal processing system (2); the temperature sensor (1 - 4) monitors the ambient temperature and sends it to the result analysis and display system (3); 6) The data acquisition and signal processing system (2) pre - processes the physical signals of the dynamic force and the temperature signal and transmits them to the result analysis and display system (3); 7) The result analysis and display system (3) calculates the average instantaneous stress within the t time period according to the physical signal of the dynamic force.

10. The method for using the intelligent system for dynamically measuring micro-stress during the solidification process of the adhesive for optical element bonding according to claim 9, characterized in that, After building the intelligent system for dynamic measurement of micro - stress during the solidification process of the adhesive for optical element bonding, the intelligent system was calibrated.

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