A sensor simulator with DSI3 interface and interface implementation method

Abstract

The present invention provides a sensor simulator with a DSI3 interface and an interface implementation method. The sensor simulator comprises: a microcontroller unit, which realizes bus communication with the terminal through a bus transceiver; a plurality of DSI3 driver chips, wherein the analog signal output by the microcontroller unit communicates with the DSI3 driver chip through a serial port, and the data is converted into data in the form of a DS1 bus and sent out; a power detection circuit, wherein when the vehicle body automatic parking controller drives the ultrasonic sensor to be tested to work, the terminal sends an instruction to the sensor simulator through the bus, and the sensor simulator exchanges data with the vehicle body automatic parking controller through multiple DSI3 data channels, sends analog signals to the vehicle body parking controller, and receives the state data fed back by the vehicle body parking controller, so that the discrete device used to simulate the DSI3 interface in the prior art can be replaced, and the sensor driver chip is adopted to realize the DSI3 interactive interface between the sensor simulator and the vehicle body automatic parking controller.

Description

Technical Field

[0001] The present invention relates to the technical field of sensor equipment detection, in particular to a sensor simulator with a DSI3 interface and an interface realization method. Background Art

[0002] Different automatic parking solutions use different methods to sense and detect obstacles around the vehicle. One commonly used technical solution uses ultrasonic and visual fusion to configure ultrasonic sensors at both ends of the front and rear bumpers of the vehicle, thereby forming an ultrasonic sensing radar circle covering the outer contour of the vehicle. When parking, the ultrasonic sensor continuously sends signals to the surroundings and receives signals returned by surrounding obstacles, and determines the distance of the obstacle based on the time difference between sending and receiving signals.

[0003] Naturally, this automatic parking technology has high requirements for the stability and consistency of the ultrasonic sensor itself and its configuration software. Therefore, the function of the ultrasonic sensor needs to be verified before installation. Due to the lack of tools that can replace the actual vehicle to verify the ultrasonic radar chip software bug, the bug can only be solved by real vehicle testing. Further, the actual development process is to verify the operation of the sensor and software in different vehicles, and even multiple vehicles are required to test the possible causes of the bug. Therefore, based on the previous technology, this vehicle sensor simulation test method not only has low test efficiency, but also brings extremely high testing costs including vehicle purchase and site.

[0004] Due to the rapid development of ultrasonic sensor applications, the trend of technological development and innovation inevitably requires that simulation testing methods gradually replace real vehicle testing, making simulation testing methods the mainstream of ultrasonic sensor testing. The simulation test method is to configure ultrasonic sensors on the test bench structure and place them in a simulated environment with real obstacles to achieve various simulation scenarios of real vehicle parking. During the actual test, the sensor to be tested is placed in the scene, and the radar signal generated by the ultrasonic radar of the operating bench and the test software is input to the ultrasonic radar simulator in a bus manner. The ultrasonic radar simulation simulator simulates the chip operation of the real ultrasonic radar and outputs the signal to the video interface of the controller according to the protocol. In this way, through repeated simulations, its response in different parking scenarios can be tested. This greatly reduces the test cost and improves the test efficiency.

[0005] Correspondingly, the improvement of technical requirements for sensors will inevitably lead to an increasing demand for simulation testing of ultrasonic waves in the laboratory. Earlier sensor testing tools mostly used mature single-wire interfaces (OWI), which have complex analog signal circuits, many external auxiliary devices, and cumbersome test systems, and are not easy to move. In addition, due to the use of voltage acquisition signals, it is difficult to ensure its operational stability. In addition, the communication transmission signal rate is low, which can no longer meet the speed of sensor development and the needs of product innovation. With the emergence of the third-generation distributed system interface (DSI3), the use of DSI3 interface sensor simulators to replace the old interface simulators has become a new problem in sensor simulation testing.

[0006] Under the current technology, there are already a small number of simulators with DSI3 interfaces. However, due to the lack of a suitable chip driver, the existing technology to implement the DSI3 interface is essentially to simulate the DSI3 interface through discrete devices, and it is not possible to truly enable the simulator to have the function of the DSI3 interface. In view of this, the existing technology should be improved to solve the above technical problems existing in ultrasonic sensor testing. Summary of the invention

[0007] In view of the deficiencies in the prior art, the present invention provides a sensor simulator with a DSI3 interface that can replace the discrete devices used to simulate the DSI3 interface in the prior art, and adopts a sensor driver chip to realize the DSI3 interactive interface between the sensor simulator and the vehicle body automatic parking controller, and provides an implementation method for realizing the DSI3 interface interaction between the sensor simulator and the vehicle body automatic parking controller.

[0008] To solve the above technical problems, the present invention adopts a sensor simulator with a DSI3 interface, which communicates with a vehicle body automatic parking controller and communicates with a terminal through a bus. The sensor simulator includes: a microcontroller unit, which is connected to a display unit and communicates with the terminal through a bus transceiver; multiple DSI3 data channels, which correspond to the DSI3 master station of the vehicle body automatic parking controller, and each of the DSI3 data channels communicates with the microcontroller unit to send the converted DSI3 data to the sensor simulator; a power detection circuit, which is respectively connected to the microcontroller unit of the sensor simulator and the power supply of the vehicle body automatic parking controller, wherein when the vehicle body automatic parking controller drives the ultrasonic sensor to be tested to work, the terminal sends an instruction to the sensor simulator through the bus, and the sensor simulator exchanges data with the vehicle body automatic parking controller through the multiple DSI3 data channels, and sends a simulation signal to the vehicle body automatic parking controller, and the vehicle body automatic parking controller sends status data to the sensor simulator, and finally displays it on the display unit.

[0009] Preferably, each of the DSI3 data channels is driven by a sensor driver chip, and each of the sensor driver chips realizes serial port communication with the micro control unit via a universal asynchronous receiver-transmitter.

[0010] Further preferably, the power supply detection circuit includes a boost power supply chip and a first MOS switch, the output end of the boost power supply chip is connected to the first MOS switch, wherein the boost power supply chip is connected in parallel with two adjustment resistors, and the boost power supply chip outputs different voltages through the adjustment resistors, and the first MOS switch is a three-channel single-pole double-throw MOS switch, which controls the first MOS switch to achieve switching of different input voltages at the power supply end of the sensor driver chip.

[0011] Still further preferably, the first channel interface of the first MOS switch is connected to the output voltage of the boost power supply chip, the second channel interface is connected to the working voltage of the sensor simulator, the third channel interface is grounded, and the micro control unit configures multiple logic pins of the first MOS switch, wherein the multiple logic pins of the first MOS switch are respectively configured to correspond to overvoltage, short circuit and short power supply, so that when the first MOS switch is placed in the corresponding gear, the sensor driver chip is switched between overvoltage, short power supply and short circuit test conditions.

[0012] Still further preferably, it also includes a second MOS switch, which is connected to the signal end of the sensor driver chip, and the micro control unit configures multiple logic pins of the second MOS switch, wherein the multiple logic pins of the second MOS switch correspond to open circuit, short circuit and short power supply respectively, so that when the second MOS switch is placed in the corresponding gear, the signal end of the sensor driver chip is switched between open circuit, short circuit and short power supply test conditions.

[0013] More preferably, the first MOS switch is an ADG5433 three-channel switch.

[0014] Correspondingly, another aspect of the present invention provides a method for implementing the DSI3 interface of a sensor simulator, which is applied to a sensor simulator prepared according to the aforementioned content, and includes the following steps: step S1 of configuring multiple DSI3 data channels on the sensor simulator and a DSI3 master station on the vehicle body automatic parking controller; step S2 of configuring multiple DSI3 data channels to realize serial port communication with the microcontroller unit of the sensor simulator.

[0015] Preferably, the steps of configuring multiple DSI3 data channels on the sensor simulator and the DSI3 master station on the vehicle body automatic parking controller include: step S11 of configuring the sensor driver chip, using the sensor driver chip as an analog signal encoding chip to realize current acquisition and analysis; step S12 of configuring the sensor driver chip to communicate through a universal asynchronous receiver-transmitter, and realizing DSI3 bus signal simulation at the interactive interface of the sensor simulator.

[0016] Further preferably, the method further comprises a step S3 of configuring a power supply detection circuit of the sensor simulator and connecting the power supply detection circuit to the sensor to be tested.

[0017] Further preferably, the step S3 of configuring the power detection circuit of the driver chip includes the following steps: a step S31 of configuring a boost power chip, configuring at least one adjustment resistor connected to the boost power chip, and making the boost power chip output high voltage by adjusting the resistor; a step S32 of configuring a power detection circuit including the boost power chip and a first MOS switch connected to the output end of the boost power chip, and switching different test conditions of the power end of the sensor driver chip; a step S33 of configuring a second MOS switch connected to the signal end of the sensor driver chip, and controlling the second MOS switch to be placed in a corresponding gear position so that the sensor driver chip switches between different test conditions.

[0018] Due to the adoption of the above technical solution, the present invention has the following beneficial technical effects compared with the prior art:

[0019] 1. Although the simulation of the interface using discrete devices can achieve the technical purpose of simulation detection to a certain extent, it is only a simulation of the DSI3 interface rather than a true DSI3 interface for the sensor simulator, so the transmission rate of the communication transmission signal still cannot reach the level of DSI3. The technical bottleneck of the previous technology that could only use discrete devices to simulate the interface is the lack of a suitable driving method to enable the sensor simulator to convert from unstable voltage signal collection to stable and efficient current collection. In the present invention, two ELMOS E524 chips are used to form serial communication between the universal asynchronous receiver and transmitter and the microcontroller unit, thereby realizing multiple DSI3 data channels on the sensor simulator and establishing the correspondence between the sensor simulator and the vehicle body automatic parking controller, that is, realizing the DSI3 interface interaction between the sensor simulator and the vehicle body automatic parking controller, while simplifying the wiring complexity of the test system circuit;

[0020] 2. Corresponding to the implementation of the DSI3 interface, it is necessary to improve the external functional mode under the existing test environment. In the prior art, in order to meet different voltage tests, multiple auxiliary devices need to be connected externally, and the working voltage is switched by converting different devices. The external power supply test method directly leads to the low overall integration of the test equipment, bloated volume, and difficulty in moving. An easy-to-think-of idea is to improve the external power supply method to internal power supply, and realize the switching of different working voltages inside the device through effective technical means, which greatly improves the device integration and reduces the size of the device. Therefore, in the present invention, the above technical effects are achieved through the following two aspects:

[0021] 1) The boost power chip is configured with a three-channel switch to form a voltage detection circuit. The boost power chip is connected in parallel with two adjustable resistors. The output voltage of the boost power chip can be adjusted through the adjustable resistors. The three channel voltage interfaces of the three-channel switch correspond to the output voltage of the boost power chip, the working voltage of the sensor simulator and the ground respectively. In this way, the three-channel switch is controlled to be placed in different gears, which realizes the switching of different input voltages at the power supply end of the sensor driver chip;

[0022] 2) In order to meet the needs of different test conditions, another three-channel switch is configured to adapt to the internal power supply and connected to the signal end of the sensor driver chip. The logic pins of the switch are configured by the microcontroller unit so that different gears are adapted to different test conditions. In this way, the three-channel switch is controlled to be placed in different gears, which means that the signal end of the sensor driver chip is switched between open circuit, short circuit and short power supply conditions;

[0023] 3. The significance of the ultrasonic sensor simulator that realizes the DSI3 interface is that it can realize echo simulation, that is, it realizes multi-channel transmission of ultrasonic waves. Each channel can simulate multiple obstacles, and by setting the echo distance, the direct echo distance and the indirect echo distance can be simulated; and in the obstacle state simulation, sensor faults such as power supply short circuit, ground short circuit, open circuit, aftershock too long or too short are realized, as well as power supply obstacles such as power supply too high or too low, short circuit, etc. are realized; and the bus protocol is used to respond to the above simulation process, thereby meeting the real-time and synchronization requirements of the simulation test;

[0024] 4. The three-channel switch uses the ADG5433 three-channel single-pole double-throw MOS switch. Since an insulating oxide layer is provided between its NDMOS and PDMOS transistors, unlike the junction-isolated switch, there is no parasitic junction between the transistors of the three-channel single-pole double-throw MOS switch, which significantly improves the latching phenomenon of the switch.

[0025] 5. The sensor simulator prepared based on the above-mentioned DSI3 interface implementation method can remove the restrictions of existing tests on equipment and sites, directly simulate various test failures of ultrasonic sensors in the laboratory, quickly respond to the occurrence of failures, and efficiently analyze the location and cause of the failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a flow chart showing a method for implementing a sensor simulator DSI3 interface according to a preferred embodiment of the present invention;

[0027] Figure 2 is a flow chart showing Figure 1 The process of configuring multiple DSI3 data channels on the sensor simulator;

[0028] Figure 3 is a circuit structure diagram showing the equivalent circuit structure of the sensor driving chip in the preferred embodiment;

[0029] Figure 4 is a flow chart showing the process of configuring the power supply detection circuit of the driving chip in the preferred embodiment of the present invention;

[0030] Figure 5 is a circuit structure diagram showing an equivalent circuit structure of a power supply detection circuit in the preferred embodiment;

[0031] Figure 6 is a schematic diagram showing the logic circuit structure of the ADG5433 switch;

[0032] Figure 7 is a circuit structure diagram showing the equivalent circuit structure of the test condition switching switch in the preferred embodiment;

[0033] Figure 8 is a framework diagram showing the structure of a sensor with a DSI3 interface according to another preferred embodiment of the present invention;

[0034] Fig. 9 A framework diagram showing Figure 8 The connection structure of the sensor with DSI3 interface and the vehicle body automatic parking controller is shown. DETAILED DESCRIPTION

[0035] The following will describe an embodiment of a sensor simulator with a DSI3 interface and an interface implementation method according to the present invention with reference to the accompanying drawings. It will be appreciated by those skilled in the art that the described embodiments may be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the drawings and descriptions are illustrative in nature and are not intended to limit the scope of protection of the claims. In addition, in this specification, the drawings are not drawn to scale and the same reference numerals represent the same parts.

[0036] It should be noted that the expressions “first” and “second” used in the embodiments of the present invention are intended to distinguish two non-identical entities with the same name or non-identical parameters. It can be seen that “first” and “second” are only for the convenience of expression and should not be understood as limitations on the embodiments of the invention. The subsequent embodiments will not explain this one by one.

[0037] The preferred embodiments of the present invention are proposed to solve the following technical problems in the prior art:

[0038] 1) The sensor simulator cannot truly interact with the vehicle's automatic parking controller via the DSI3 interface bus;

[0039] 2) In order to meet the testing needs of the sensor simulator under different working voltages, the existing method cannot be separated from the external power supply method, so the circuit wiring is bloated, the external equipment is complicated, and the existing simulation test cannot completely get rid of real obstacles during the test process, resulting in a large demand for test space and the overall test system is difficult to move in the test environment.

[0040] Therefore, in order to solve the above-mentioned technical problem 1, the first aspect of the preferred embodiment of the present invention is to realize the DSI3 interface communication between the sensor simulator and the vehicle body automatic parking controller. Figure 1 FIG. 1 is a flow chart showing a method for implementing a sensor simulator DSI3 interface according to a preferred embodiment of the present invention. Figure 1 In this preferred embodiment, the method for implementing the sensor simulator DSI3 interface includes the following steps:

[0041] S1, configure multiple DSI3 data channels on the sensor simulator and the DSI3 master station on the vehicle body automatic parking controller;

[0042] S2. Configure multiple DSI3 data channels to realize serial port communication with the microcontroller unit of the sensor simulator.

[0043] Figure 2 is a flow chart showing Figure 1 The process of configuring multiple DSI3 data channels on the sensor simulator is described in detail. Specifically, in step S1, its essence is to realize the mapping of multiple DSI3 data channels with the channels in the DSI3 master station on the vehicle body automatic parking controller, that is, to realize the DSI3 communication between the sensor simulator and the vehicle body automatic parking controller. In the present invention, twelve sensor driver chips are used to realize 12 DSI3 interface channels. In this preferred embodiment, the sensor driver chip is an ELMOS E524.17 chip, and each driver chip is connected to the micro control unit of the sensor simulator through a universal asynchronous receiver and transmitter (Uart), thereby realizing serial port communication between the sensor driver chip and the micro control unit (MCU) of the sensor simulator. Figure 3 FIG. 2 is a circuit structure diagram showing the equivalent circuit structure of the sensor driver chip in the preferred embodiment. Figure 3 As shown, the VSUP pin of the E524 chip is connected to the US pin of its P1 interface, the DSI_O pin is connected to the P2 interface, and its DSI pin is connected to the DIS pin of the P1 interface. It can be seen that in this preferred embodiment, the sensor driver chip is used as the simulator encoding chip, thereby replacing the existing voltage acquisition signal and then changing it to a current acquisition signal.

[0044] On the basis of realizing the DSI3 interface interaction, it is also necessary to solve the second aspect of the existing technical problem, that is, to configure the internal power supply. Figure 4 FIG. 2 is a flow chart showing the process of configuring the power supply detection circuit of the driver chip in the preferred embodiment of the present invention. Figure 4 , the process of configuring the sensor driver chip power detection circuit includes the following steps:

[0045] S31, configuring a boost power chip, and configuring at least one regulating resistor connected to the boost power chip, and making the boost power chip output high voltage by regulating the resistor;

[0046] S32, configuring a power detection circuit including the boost power chip and a first MOS switch connected to the output end of the boost power chip, and switching different test conditions of the power end of the sensor driver chip;

[0047] S33, configuring a second MOS switch connected to the signal terminal of the sensor driver chip, and controlling the second MOS switch to be placed in a corresponding gear position so that the signal terminal of the sensor driver chip switches between different test conditions.

[0048] Specifically, see Figure 5 , Figure 5 is a circuit structure diagram, which shows the equivalent circuit structure of the power detection circuit in the preferred embodiment, wherein U202 is a boost power chip. In addition to the normal working voltage, the boost power chip also needs to be configured with an adjustable resistance to adjust the output voltage of the boost power chip, that is, see Figure 5 , R215 and R217 are connected in parallel to the FB pin of U202, so as to achieve the purpose of voltage regulation by adjusting the resistance values ​​of R215 and R217. For example, in this preferred embodiment, the three output voltages of the boost power chip are configured as high voltage 18V, low voltage 12V and ground voltage respectively.

[0049] Next, a switch is required to switch the boost power chip between different output voltages. Figure 5 U201 is a three-channel switch that meets the requirements. In this preferred embodiment, the ADG5433 three-channel single-pole double-throw MOS switch is used as the switching switch. Since an insulating oxide layer is provided between the NDMOS and PDMOS transistors, unlike the junction-isolated switch, there is no parasitic junction between the transistors of the three-channel single-pole double-throw MOS switch, thereby significantly improving the latching phenomenon of the switch. Next, see Figure 6 , Figure 6 FIG. 1 is a schematic diagram showing the logic circuit structure of the ADG5433 switch, wherein the S1A pin of the ADG5433 switch is connected to the output voltage (18V) of the boost power chip as the first channel interface, the S2A pin is connected to the working voltage (12V) of the sensor simulator as the second channel interface, and the S3A pin is grounded as the third channel voltage interface. Then, the EN input pin, IN1 pin, IN2 pin, and IN3 pin are configured, for example, as follows:

[0050] 1) When IN1 is set to 1, the D1 switch is turned to S1A, and the other two paths are in the SxB position. At this time, the normal output voltage of the device is pulled to 18V;

[0051] 2) When IN2 is set to 1, D2 switch is turned to S2A, and the other two paths are in SxB position. At this time, the normal output voltage of the device is pulled to 12V;

[0052] 3) When IN3 is set to 1, the D3 switch is turned to S3A, and the other two paths are in the SxB position. At this time, the normal output voltage of the device is pulled to ground.

[0053] According to the above configuration example, the logic level of the chip pin is controlled by a microcontroller (such as a single-chip microcomputer), that is, the switching of the input voltage of the boost power chip is realized inside the device. The significance of realizing the switching of the output voltage of the boost power chip internally is that when the power supply of the device is diagnosed, a large number of external power supply devices and cumbersome connections between them can be omitted, and the power supply detection and diagnosis of the device and the power supply status of the device can be completed inside the device.

[0054] Another aspect of the present invention is to configure a three-channel switch on the sensor driver chip to provide different test conditions for the signal end of the sensor driver chip, such as open circuit, short circuit and short power supply. Figure 7 , Figure 7 The circuit structure diagram shows the equivalent circuit structure of the test condition switch in the preferred embodiment. In the preferred embodiment, the test condition switch also uses the ADG5433 three-channel single-pole double-throw MOS switch, whose EN pin corresponds to DLAG_F_4, IN1 pin corresponds to OV_F_4 (open circuit), IN2 pin corresponds to SHORT_F_4 (short circuit), and IN3 pin corresponds to OPEN_F_4 (open circuit). Then, according to the configuration method similar to the three-channel switch of the boost power chip, the microcontroller unit configures the test condition switch so that when the test condition switch is placed in different gears, the signal end of the sensor driver chip switches between open circuit, short circuit and short power supply conditions. The significance of switching the test conditions of the sensor driver chip internally is also to meet the needs of the device for conditional diagnosis, which can save a large number of external power supply devices and the bloated connections between them, and complete the state switching inside the device to diagnose the fault state of the sensor driver chip.

[0055] Another aspect of the preferred embodiment of the present invention is to prepare a sensor simulator with a DSI3 interface according to the implementation method of the DSI3 interface described above. In the simulation test of the sensor, the sensor simulator can realize DSI3 data communication with the vehicle body automatic parking controller. Figure 8 FIG. 2 is a frame diagram showing the structure of a sensor with a DSI3 interface according to another preferred embodiment of the present invention. Figure 8The sensor simulator with DSI3 interface described in the preferred embodiment of the present invention includes a microcontroller unit 100 as a processor, twelve sensor driver chips 200, each of which realizes one DSI3 data channel, and each of which realizes serial communication with the microcontroller unit 100 through a universal asynchronous receiver-transmitter (Uart). The microcontroller unit 100 is powered by a power management module 300, which is connected to an external display device to output the processing results on the display device, and the microcontroller unit 100 communicates with a processing terminal 400 through a bus transceiver for CAN communication, and the processing terminal can be a PC, a mobile terminal, etc. It also includes a power detection circuit 500, one end of which is connected to the microcontroller unit 100, and the other end is connected to the power supply of the vehicle body automatic parking controller, so that the output voltage of the sensor simulator is switched during the power detection.

[0056] Fig. 9 A framework diagram showing Figure 8 The connection structure of the sensor with DSI3 interface and the vehicle body automatic parking controller is shown. According to the DSI3 interface implementation method described above, two ELMOS E524 chips are used as sensor driver chips to implement 12 DSI3 data channels and form an interactive interface with the 12 data channels in the DSI3 master station of the vehicle body automatic parking controller 600.

[0057] During the actual test, the sensor simulator is connected to the 12V power supply of the power management module 300, thereby starting the sensor simulator. The external processing terminal 400 sends instructions to the sensor simulator through the bus in the CAN bus communication mode. After receiving the instructions sent by the processing terminal 400, the sensor simulator exchanges data with the body automatic parking controller 600 through the 12-way DSI3 data channel. The body automatic parking controller 600 drives the ultrasonic sensor, and also feeds back the state of the driven ultrasonic sensor to the sensor simulator through the 12-way DSI3 data channel interaction interface. The sensor simulator displays the data fed back by the body automatic parking controller 600 through its own or an external display device.

[0058] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the attached claims.

Claims

1. A sensor simulator with a DSI3 interface, which communicates with a vehicle body automatic parking controller and communicates with a terminal through a bus, characterized in that: The sensor simulator comprises: A micro control unit, which is connected to the display unit and realizes bus communication with the terminal through a bus transceiver; Multiple DSI3 data channels, the multiple DSI3 data channels correspond to the DSI3 master station of the vehicle body automatic parking controller, each DSI3 data channel is driven by a sensor driver chip, each sensor driver chip realizes serial port communication with the microcontroller unit through a universal asynchronous receiver-transmitter transmitter to send the converted DSI3 data to the sensor simulator, and the sensor driver chip is used as a simulator encoding chip to obtain a current acquisition signal; A power detection circuit is connected to the microcontroller unit of the sensor simulator and the power supply of the vehicle body automatic parking controller, wherein: When the vehicle body automatic parking controller drives the ultrasonic sensor to be tested to work, the terminal sends instructions to the sensor simulator through the bus, the sensor simulator exchanges data with the vehicle body automatic parking controller through multiple DSI3 data channels, and sends analog signals to the vehicle body automatic parking controller, the vehicle body automatic parking controller sends status data to the sensor simulator, and finally displays it on the display unit.

2. The sensor simulator with a DSI3 interface according to claim 1, characterized in that: The power detection circuit includes a boost power chip and a first MOS switch, wherein the output end of the boost power chip is connected to the first MOS switch, wherein: The boost power chip is connected in parallel with two regulating resistors, and the boost power chip outputs different voltages through the regulating resistors. The first MOS switch is a three-channel single-pole double-throw MOS switch, and the first MOS switch is controlled to realize the switching of different input voltages at the power supply end of the sensor driver chip.

3. The sensor simulator with a DSI3 interface according to claim 2, characterized in that: The first channel interface of the first MOS switch is connected to the output voltage of the boost power chip, the second channel interface is connected to the working voltage of the sensor simulator, and the third channel interface is grounded. The micro control unit configures multiple logic pins of the first MOS switch, wherein: The multiple logic pins of the first MOS switch are respectively configured to correspond to overvoltage, short circuit and short power supply, so that when the first MOS switch is placed in the corresponding gear, the sensor driver chip is switched between overvoltage, short power supply and short circuit test conditions.

4. The sensor simulator with a DSI3 interface according to claim 3, characterized in that: It also includes a second MOS switch, which is connected to the signal end of the sensor driver chip, and the micro control unit configures multiple logic pins of the second MOS switch, wherein: The multiple logic pins of the second MOS switch correspond to open circuit, short circuit and short power supply respectively, so that when the second MOS switch is placed in the corresponding gear, the signal terminal of the sensor driving chip is switched between open circuit, short circuit and short power supply test conditions.

5. The sensor simulator with a DSI3 interface according to any one of claims 2 to 4, characterized in that: The first MOS switch is an ADG5433 three-channel switch.

6. A method for implementing a DSI3 interface of a sensor simulator, the method being applied to a sensor simulator prepared according to any one of claims 1 to 5, characterized in that: The method comprises the following steps: Step S1 of configuring multiple DSI3 data channels on the sensor simulator and the DSI3 master station on the vehicle body automatic parking controller; Step S2 of configuring multiple DSI3 data channels to realize serial port communication with the micro control unit of the sensor simulator.

7. The method for implementing the sensor simulator DSI3 interface according to claim 6, characterized in that: The steps of configuring multiple DSI3 data channels on the sensor simulator and the DSI3 master station on the vehicle body automatic parking controller include: Step S11 of configuring a sensor driving chip, using the sensor driving chip as an analog signal encoding chip to implement current acquisition and analysis; The sensor driver chip is configured to communicate via a universal asynchronous receiver / transmitter, and a DSI3 bus signal simulation is implemented at the interactive interface of the sensor simulator in step S12.

8. The method for implementing the sensor simulator DSI3 interface according to claim 7, characterized in that: The method also includes step S3 of configuring a power supply detection circuit of the sensor simulator and connecting the power supply detection circuit to the sensor to be tested.

9. The method for implementing the sensor simulator DSI3 interface according to claim 8, characterized in that: The step S3 of configuring the power supply detection circuit of the sensor simulator comprises the following steps: Step S31 of configuring a boost power chip, configuring at least one adjusting resistor connected to the boost power chip, and making the boost power chip output high voltage by adjusting the resistor; Step S32 of configuring a power detection circuit including the boost power chip and a first MOS switch connected to the output end of the boost power chip, and switching different test conditions of the power end of the sensor driving chip; The step S33 of configuring a second MOS switch connected to the signal terminal of the sensor driving chip is to control the second MOS switch to be placed in a corresponding gear position so that the signal terminal of the sensor driving chip switches between different test conditions.

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