Aligner device and method for position offset correction of a workpiece

Abstract

Provided is an aligner device configured to detect the positional deviation amount of a plurality of workpieces. The aligner device includes: a robot; a workpiece lifting mechanism; a plurality of sensors (31) configured to detect the outer shape of a plate-shaped workpiece that is brought into proximity with or contact with the sensor surface by the workpiece lifting mechanism; a positional deviation amount calculation unit (6) configured to calculate the positional deviation amount of each plate-shaped workpiece in the X, Y, and θ directions from a reference position based on the outer shape of each plate-shaped workpiece acquired by each sensor (31); an X-Y direction positional deviation amount correction unit (81) configured to correct the X direction positional deviation amount and the Y direction positional deviation amount for each plate-shaped workpiece based on the positional deviation amount in the X-Y directions calculated by the positional deviation amount calculation unit (6); and a θ direction positional deviation amount correction unit (82) configured to correct the positional deviation amount in the θ direction for each plate-shaped workpiece based on the positional deviation amount in the θ direction calculated by the positional deviation amount calculation unit (6).

Description

Technical Field

[0001] This disclosure relates to techniques for correcting positional deviations of objects. In particular, this disclosure relates to alignment devices and methods for correcting positional deviations of workpieces. More specifically, this disclosure relates to techniques for detecting the amount of positional deviation of a plate-shaped workpiece (e.g., a semiconductor wafer) relative to a reference position and for correcting the positional deviation of the plate-shaped workpiece based on the detected amount of positional deviation. Background Technology

[0002] As an example, in semiconductor manufacturing, a semiconductor wafer (hereinafter also simply referred to as "wafer") is first moved into a loading interlock chamber, and then a transport robot moves the wafer from the loading interlock chamber into a processing chamber. The wafer needs to be correctly moved into a reference position within the processing chamber based on the content to be processed there. Therefore, conventionally, in the stage before the workpiece is moved into the processing chamber, an alignment device, such as that shown in Patent Document 1, is used. This alignment device is configured to detect the positional deviation of a wafer in both the planar direction (XY direction) and the rotational direction (θ direction). By using the detected positional deviation information, the transport robot can correct the positional deviation in both the XY and θ directions while moving the wafer to the reference position within the processing chamber.

[0003] On the other hand, in semiconductor manufacturing processes, to shorten the time required for transporting objects (tact time), a multi-segment arm transport robot (multi-segment hand transport robot), as shown in Patent Document 2, has been proposed. This transport robot can transport multiple wafers simultaneously, thus shortening the tact time. To enable the use of the multi-segment hand transport robot, the loading interlock chamber and the processing chamber are configured to hold multiple wafers with a given interval in the vertical direction.

[0004] However, there is still room for improvement in conventional handling systems using multi-segment hand-held handling robots. For example, these conventional handling systems are not designed to handle situations requiring proper placement of wafers in reference positions within the processing chamber. Furthermore, the conventional alignment device shown in Patent Document 1 can only detect the positional deviation of one wafer. Therefore, even if the alignment device of Patent Document 1 is used in the multi-segment hand-held handling robot of Patent Document 2, a reduction in handling cycle time is practically impossible.

[0005] Prior art literature

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2015-195328

[0008] Patent Document 2: Japanese Patent Application Publication No. 2013-135099 Summary of the Invention

[0009] In view of the above, this disclosure addresses the issue of providing a technique capable of detecting the positional deviation of multiple workpieces. Furthermore, this disclosure addresses the issue of providing a technique capable of correcting the positional deviation of workpieces based on the detected positional deviation.

[0010] Methods for solving problems

[0011] To address the aforementioned issues, the following technical means are employed in this disclosure.

[0012] The alignment device provided by the first aspect of this disclosure includes: a robotic arm having multiple hand bodies capable of loading and holding plate-shaped workpieces and arranged in the vertical direction; a workpiece lifting mechanism capable of individually lifting the plate-shaped workpieces carried by the robotic arm and placed on the hand bodies, and lowering them from the lifted state; multiple sensors having downward-facing sensor surfaces capable of detecting the shape of the plate-shaped workpieces approaching or contacting the sensor surfaces via the workpiece lifting mechanism, and arranged at given intervals in the vertical direction; a position deviation calculation unit that calculates the position deviation of each plate-shaped workpiece from a reference position in the X, Y, and θ directions based on the shape of each plate-shaped workpiece obtained by the sensors; an XY direction position deviation correction unit that corrects the X and Y direction position deviations of each plate-shaped workpiece based on the XY direction position deviations calculated by the position deviation calculation unit; and a θ direction position deviation correction unit that corrects the θ direction position deviation of each plate-shaped workpiece based on the θ direction position deviation calculated by the position deviation calculation unit.

[0013] Preferably, the alignment device includes a control unit for controlling the XY direction position deviation correction unit and the θ direction position deviation correction unit.

[0014] Preferably, the workpiece lifting mechanism has a pin that supports the plate-shaped workpiece from below. The XY direction position deviation correction unit corrects the position by moving the pin of the workpiece lifting mechanism in the XY direction based on the X direction position deviation and the Y direction position deviation. The θ direction position deviation correction unit corrects the position by rotating the pin of the workpiece lifting mechanism supporting the plate-shaped workpiece in the θ direction based on the θ direction position deviation.

[0015] The position deviation correction method for a plate-shaped workpiece provided by the second aspect of this disclosure is a position deviation correction method for a plate-shaped workpiece using an alignment device. The alignment device includes: a robotic arm having multiple hand bodies capable of loading and holding the plate-shaped workpiece and arranged vertically; a workpiece lifting mechanism capable of lifting the plate-shaped workpieces carried by the robotic arm and placed on the hand bodies, and lowering them from the lifted state; multiple sensors having downward-facing sensor surfaces capable of detecting the shape of the plate-shaped workpieces approaching or contacting the sensor surfaces via the workpiece lifting mechanism, and arranged at given intervals in the vertical direction; a position deviation calculation unit that calculates the position deviation of each plate-shaped workpiece from a reference position in the X, Y, and θ directions based on the shape of each plate-shaped workpiece obtained by the sensors; and an XY direction position deviation correction unit that corrects the position deviation in the XY directions calculated by the position deviation calculation unit. The method includes: a deviation amount correction unit for the X-direction and Y-direction position deviations of the aforementioned plate-shaped workpieces; a θ-direction position deviation correction unit for correcting the θ-direction position deviations of the aforementioned plate-shaped workpieces based on the θ-direction position deviations calculated by the aforementioned position deviation calculation unit; and a control unit for controlling the XY-direction and θ-direction position deviation correction units. The workpiece lifting mechanism has a pin supporting the plate-shaped workpieces from below. The XY-direction position deviation correction unit corrects the deviation by moving the pin of the workpiece lifting mechanism in the XY direction based on the X-direction and Y-direction position deviations. The θ-direction position deviation correction unit corrects the deviation by rotating the pin of the workpiece lifting mechanism supporting the plate-shaped workpieces in the θ direction based on the θ-direction position deviation. The position deviation correction method includes:

[0016] In the plate-shaped workpiece loading step, the aforementioned robotic arm is moved so that the plate-shaped workpiece placed on the aforementioned arm body is positioned at the calibration reference position above the aforementioned sensors.

[0017] In the plate-shaped workpiece lifting step, the plate-shaped workpiece is lifted from each of the hand bodies by raising the pin of the workpiece lifting mechanism and bringing the plate-shaped workpiece close to or in contact with the sensor.

[0018] The shape acquisition step involves acquiring the shape of each of the plate-shaped workpieces using the aforementioned sensors.

[0019] The position deviation calculation step involves calculating the position deviation of the plate-shaped workpiece in the X, Y, and θ directions from the reference position based on the obtained external shape.

[0020] The θ-direction position correction step involves lowering the pin of the workpiece lifting mechanism to place the plate-shaped workpiece above each arm, and rotating the pin based on the θ-direction position deviation calculated by the position deviation calculation unit.

[0021] The XY direction position correction step, based on the position deviations in the X, Y, and θ directions, moves the pins of the workpiece lifting mechanism in the XY directions so that the plate-shaped workpieces are placed at the reference positions on the hands; and

[0022] In the post-correction transfer step, the plate-shaped workpiece with the XY-direction position corrected is lowered by lowering the pin of the workpiece lifting mechanism, and then transferred to the corresponding hand body.

[0023] Invention Effects

[0024] According to the alignment device with the above structure, the external shape of a plate-shaped workpiece can be acquired by a sensor having a planar sensor surface, and the positional deviation of the plate-shaped workpiece from a reference position can be calculated based on the image of the acquired external shape. Therefore, the physical structure that can be used to detect the positional deviation of a plate-shaped workpiece is thin.

[0025] Therefore, the alignment device described above can simultaneously detect and correct the positional deviation of multiple plate-shaped workpieces handled by a multi-segment robotic arm. This, for example, can significantly shorten the handling cycle time of semiconductor wafers in semiconductor processes, including positional deviation correction.

[0026] Other features and advantages of this disclosure will become clearer from the following detailed description with reference to the accompanying drawings. Attached Figure Description

[0027] Figure 1 This is a perspective view showing the overall alignment device involved in this disclosure.

[0028] Figure 2 yes Figure 1 A top view of the alignment device shown.

[0029] Figure 3 This is a block diagram illustrating the structure of the alignment device involved in this disclosure.

[0030] Figure 4 It is used for explanation Figure 1 A diagram showing the operational state of the alignment device.

[0031] Figure 5 It is used for explanation Figure 1 A diagram showing the operational state of the alignment device.

[0032] Figure 6 It is along Figure 5 A sectional view along line 6-6.

[0033] Figure 7 It is used for explanation Figure 1 A diagram showing the operational state of the alignment device.

[0034] Figure 8 It is along Figure 7 A sectional view along line 8-8.

[0035] Figure 9 It is used for explanation Figure 1 A top view of the alignment device in operation.

[0036] Figure 10 It is used for explanation Figure 1 A top view of the alignment device in operation.

[0037] Figure 11 It is used for explanation Figure 1 A diagram showing the operational state of the alignment device.

[0038] Figure 12 It is along Figure 11 A sectional view along line 12-12.

[0039] Figure 13 It is used for explanation Figure 1 A top view of the alignment device in operation.

[0040] Figure 14 It is used for explanation Figure 1 A diagram showing the operational state of the alignment device.

[0041] Figure 15 It is along Figure 14 A sectional view along line 15-15.

[0042] Figure 16 It is used for explanation Figure 1 A diagram showing the operational state of the alignment device.

[0043] Figure 17 It is along Figure 16 A sectional view along line 17-17.

[0044] Figure 18 It is used for explanation Figure 1 A diagram showing the operational state of the alignment device.

[0045] Figure 19 It is along Figure 18A sectional view along line 19-19. Detailed Implementation

[0046] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0047] Figures 1-4 An alignment device A1 according to one embodiment of this disclosure is shown.

[0048] like Figures 1-3 As shown, the alignment device A1 operates in cooperation with the robot arm 1. The alignment device A1 has multiple sensors arranged isolated from each other in the vertical direction. In the illustrated example, the alignment device A1 has five sensors 31, 32, 33..., but this disclosure should not be limited to this. Furthermore, in the illustrated example, the sensors 31, 32, 33... are isolated from each other in the vertical direction at a predetermined interval, but this disclosure should not be limited to this. In addition to the multiple sensors, the alignment device A1 also has a workpiece lifting mechanism 5, a position deviation calculation unit 6, a first position deviation correction unit 81, a second position deviation correction unit 82, and a control unit 7. The position deviation calculation unit 6 calculates the position deviation of the workpieces Wa, Wb, Wc... relative to a reference position based on information related to the shape of the workpieces Wa, Wb, Wc... sent from each of the sensors 31, 32, 33... respectively. In the illustrated example, each sensor 31, 32, 33... sends information related to the outer edge shape of a corresponding workpiece (“workpiece outer edge shape information”) to the position deviation calculation unit 6, but this disclosure should not be limited thereto. Furthermore, in the illustrated example, the first position deviation correction unit 81 is an XY direction position deviation correction unit that corrects the position deviation of the workpiece in the XY direction, and the second position deviation correction unit 82 is an θ direction position deviation correction unit that corrects the position deviation of the workpiece in the θ direction, but this disclosure should not be limited thereto.

[0049] The robotic arm 1 includes a support body 12 and a plurality of hand bodies 131, 132, 133... arranged at equal intervals along the vertical direction of the support body. The support body 12 is, for example, provided as the end arm of a multi-joint robot (not shown). The hand bodies 131, 132, 133... are capable of holding workpieces (e.g., semiconductor wafers) Wa, Wb, Wc... on their upper surfaces. Furthermore, the spacing between adjacent hand bodies 131, 132, 133... can be varied or not. The robotic arm 1 has the function of being able to move each hand body 131, 132, 133... in the horizontal direction (XY direction) while simultaneously maintaining at least a horizontal posture by a control manipulator (not shown). The shapes of each hand body 131, 132, 133... are as follows... Figure 1 , Figure 2As shown, they become bifurcated. Each of the hands 131, 132, 133... is preferably configured to be able to adsorb the placed semiconductor wafers Wa, Wb, Wc... onto its surface by vacuum pressure. The shape of the hands 131, 132, 133... is not limited, and can also be trifurcated or other shapes.

[0050] Sensors 31, 32, 33... have the function of capturing the shape of an object as an image through contact or proximity without contact. In the illustrated example, each sensor 31, 32, 33... is configured to sense the planar (two-dimensional) shape of an object located below it. Figure 4 As shown, each sensor 31, 32, 33... is mounted on the lower surface of sensor platforms 41a, 41b, 41c... with the sensor surfaces 311, 321, 331... facing down. Sensor platforms 41a, 41b, 41c... are supported by a frame 4 (e.g., support column 414) (see reference). Figure 1 , Figure 2 Examples of such sensors 31, 32, 33... include sensors that utilize electrostatic recognition technology to identify the presence of objects, as used in touchscreens, or sensors obtained by arranging multiple imaging elements such as CCDs in a planar manner.

[0051] In the illustrated example, sensors 31, 32, 33... identify the external shapes of semiconductor wafers Wa, Wb, Wc... Therefore, the shape of the plane of each sensor 31, 32, 33... is sufficient to identify the external shape of the semiconductor wafer, taking into account the possible positional deviations of Wa, Wb, Wc... in the XY directions. For example, each sensor 31, 32, 33... as... Figure 2 The shape shown can be a circle, a polygon (rectangle, etc.), or a ring.

[0052] like Figure 5As shown, the workpiece lifting mechanism 5 has multiple workpiece support members 51, 52, 53... As an example, each workpiece support member is cylindrical or pin-shaped, but this disclosure is not limited to this; the shape of the workpiece support member is not particularly limited as long as it has the functions described below. For ease of explanation, the workpiece support member will be referred to as a "pin" below. The workpiece lifting mechanism 5 has the function of supporting semiconductor wafers Wa, Wb, Wc... from below via pins 51, 52, 53... Furthermore, the workpiece lifting mechanism 5 has the function of raising and lowering pins 51, 52, 53... thereby raising and lowering semiconductor wafers Wa, Wb, Wc...; the function of moving pins 51, 52, 53... in the XY direction; and the function of rotating pins 51, 52, 53... around a vertical axis. Therefore, the workpiece lifting mechanism 5 has multiple robotic arms 511, 521, 531... and multiple support bases 512, 522, 532... The aforementioned pins 51, 52, 53... are respectively located at the ends of robotic arms 511, 521, 531... The base ends of robotic arms 511, 521, 531... cooperate with lifting mechanisms (not shown) inside support bases 512, 522, 532... Furthermore, this lifting mechanism cooperates with actuators (not shown) in the X and Y directions. Further, the rotation of the motors (not shown) located at the base ends of robotic arms 511, 521, 531... is transmitted within the support bases 512, 522, 532... via pulley drive mechanisms (not shown) assembled within the robotic arms 511, 521, 531..., thereby enabling the pins 51, 52, 53... to rotate. Pins 51, 52, 53... are typically located at the center of sensor stages 41a, 41b, 41c... when viewed from above, and robotic arms 511, 521, 531... pass beneath the sensor stages and extend to the outside of the sensor stages 41a, 41b, 41c..., reaching support bases 512, 522, 532... Pins 51, 52, 53... also have a circular upper surface of a size capable of stably holding semiconductor wafers Wa, Wb, Wc... in place. Preferably, pins 51, 52, 53... are configured to adsorb semiconductor wafers Wa, Wb, Wc... Regarding the adsorption method, for example, an adsorption method using vacuum pressure (or relatively low pressure) using a vacuum pump, etc., can be considered, but this disclosure should not be limited to this. In the illustrated example, the function of moving pins 51, 52, 53... in the XY direction corresponds to the XY direction position deviation correction unit 81 ( Figure 4 Furthermore, the function of rotating pins 51, 52, 53... around the vertical axis corresponds to the position deviation correction unit 82 in the θ direction. Figure 4 ).

[0053] Semiconductor wafers Wa, Wb, Wc... such as Figure 1, Figure 2 As shown, it is typically a circular plate with an irregular portion formed on its outer periphery for detecting rotational posture in the circumferential direction. This irregular portion is, for example, a notch obtained by removing a portion of the outer periphery of a semiconductor wafer; in the illustrated example, it is a notch Wal, but it can also be a directional plane (not shown). In semiconductor processing, semiconductor wafers Wa, Wb, Wc… are moved into a processing chamber and subjected to a given process. Depending on the processing, the semiconductor wafers Wa, Wb, Wc… need to be correctly positioned at reference positions in the XY and θ directions. According to this disclosure, the positional deviation of each semiconductor wafer Wa, Wb, Wc… can be corrected before the multi-segment robot 1 moves multiple semiconductor wafers Wa, Wb, Wc… into the processing chamber simultaneously.

[0054] The position deviation calculation unit 6 calculates the position deviation of the semiconductor wafers Wa, Wb, Wc, etc. from the reference position based on the shapes of the semiconductor wafers Wa, Wb, Wc, etc., acquired by the sensors 31, 32, 33, etc., as images. Specifically, as shown in the figure... Figure 10 As shown, the center of the image of the semiconductor wafer is determined. For example, the center of the outer perimeter of the semiconductor wafer images Wa', Wb', Wc'... is set to O1. On the other hand, the reference position where the center of the semiconductor wafer Wa, Wb, Wc... should be located is set to C1. The position deviation calculation unit 6 calculates the deviations δxa, δxb, δxc... in the X direction and δya, δyb, δyc... in the Y direction based on the center O1 and the reference position C1 (based on the relative position of the center O1 with respect to the reference position C1). Furthermore, the position deviation calculation unit 6 calculates the deviations δθa, δθb, δθc... in the θ direction based on the position (or orientation, etc.) of the slot Wa1 in the images Wa', Wb', Wc'... and the reference position N1 where the slot Wa1 of the semiconductor wafer Wa, Wb, Wc... should be located.

[0055] The alignment device A1 of the above structure can be operated, for example, as follows.

[0056] like Figure 4 As shown, pins 51, 52, 53... are in a given minimum operating position relative to sensor stages 41a, 41b, 41c... and their rotation center planes are aligned with each other. The robotic arm 1, which holds semiconductor wafers Wa, Wb, Wc... on its respective hands 131, 132, 133..., moves along the X-direction. Figure 5 , Figure 6As shown, until each hand body 131, 132, 133... reaches the calibration reference position, each semiconductor chip Wa, Wb, Wc... is positioned below each sensor 31, 32, 33... At this time, each semiconductor chip Wa, Wb, Wc... is a chip that has been transported together from the multi-segment box (not shown) and the loading interlock chamber (not shown). Therefore, it is generally in a state of positional deviation relative to each hand body 131, 132, 133... in the XY direction and / or the θ direction. Figure 5 , Figure 6 In the state shown, the reference position C1 that the semiconductor wafers Wa, Wb, Wc, etc. should be located relative to each of the hand bodies 131, 132, 133... is set to coincide with the rotation center of the pins 51, 52, 53...

[0057] Next, as Figure 7 , Figure 8 As shown, pins 51, 52, 53... are raised, lifting each semiconductor chip Wa, Wb, Wc... from each hand body 131, 132, 133..., bringing each semiconductor chip Wa, Wb, Wc... close to the lower surface of each sensor 31, 32, 33... However, to avoid contamination of the surfaces of each semiconductor chip Wa, Wb, Wc..., they are prevented from contacting each sensor 31, 32, 33... When transferring semiconductor chips Wa, Wb, Wc... from each hand body 131, 132, 133... to pins 51, 52, 53..., the adsorption of semiconductor chips Wa, Wb, Wc... by each arm 131, 132, 133... is set to closed, while the adsorption of semiconductor chips Wa, Wb, Wc... by pins 51, 52, 53... is set to open. In this state, sensors 31, 32, 33... acquire the external shape of each semiconductor wafer Wa, Wb, Wc... as described above, and use this as image data. The position deviation calculation unit 6, upon receiving this image data, calculates, as described above, the position deviation from the reference positions C1, N1 for each semiconductor wafer Wa, Wb, Wc..., namely, the position deviation δxa, δxb, δxc... in the X direction, the position deviation δya, δyb, δyc... in the Y direction, and the position deviation δθa, δθb, δθc... in the θ direction. Figure 9 , Figure 10 ).

[0058] Next, as Figure 11 , Figure 12As shown, while holding each semiconductor wafer Wa, Wb, Wc..., pins 51, 52, 53... are lowered a given distance. In this state, the semiconductor wafers Wa, Wb, Wc... separate upwards from each of the hands 131, 132, 133... Next, as... Figure 13 As shown, pins 51, 52, 53, etc., are rotated (for example, by an amount δθa, δθb, δθc, etc., in the direction of eliminating the deviation) corresponding to the positional deviations δθa, δθb, δθc, etc., of each semiconductor wafer Wa, Wb, Wc, etc. This causes each slot Wa1 to be located in the X direction passing through the center O1 of each semiconductor wafer Wa, Wb, Wc, etc. In this way, the positional deviations δθa, δθb, δθc, etc., of each semiconductor wafer Wa, Wb, Wc, etc., in the θ direction are corrected.

[0059] After correcting the positional deviations δθa, δθb, δθc... in the θ direction, the positional deviations in the XY directions of each semiconductor wafer Wa, Wb, Wc... are corrected. Furthermore, the positional deviations in the XY directions during this stage (i.e., after correcting the θ-direction positional deviation) are not... Figure 10 The initial position deviations shown are δxa, δxb, δxc..., δya, δyb, δyc... . Figure 13 , Figure 14 , Figure 15 As shown, the center O1 of semiconductor wafers Wa, Wb, Wc... rotates around the rotation center C1 by δθa, δθb, δθc... as each pin 51, 52, 53... rotates, and then stops. The position deviations (secondary position deviations) δxa', δxb', δxc'..., δya', δyb', δyc'... calculated based on this stopping position and the rotation center C1 are the position deviations in the XY directions that are being corrected.

[0060] Next, as Figure 16 , Figure 17 As shown, the pins 51, 52, 53... in the state where each semiconductor wafer Wa, Wb, Wc... is held in place are moved by the amounts of the secondary positional deviations δxa', δxb', δxc'..., δya', δyb', δyc'... of δxa', δxb', δxc'..., δya', δyb', δyc'... in the X and Y directions, respectively. Then, as... Figure 18 , Figure 19As shown, pins 51, 52, 53... are lowered and transferred to the corresponding hands 131, 132, 133... for each semiconductor wafer Wa, Wb, Wc... At this time, the adsorption of semiconductor wafers Wa, Wb, Wc... for pins 51, 52, 53... is set to closed, and the adsorption of semiconductor wafers Wa, Wb, Wc... for each hand 131, 132, 133... is set to open. This operation can be performed simultaneously for each semiconductor wafer Wa, Wb, Wc... Furthermore, the semiconductor wafers Wa, Wb, Wc... transferred to each hand 131, 132, 133... are positioned at the desired locations in all directions (X direction, Y direction, and θ direction) relative to each hand 131, 132, 133... For example, in... Figure 18 as well as Figure 19 In the state shown (viewed along two mutually orthogonal directions), semiconductor wafers Wa, Wb, Wc... are properly positioned relative to reference position C1 and placed on each hand body 131, 132, 133...

[0061] Then, with the semiconductor wafers Wa, Wb, Wc... held in reference positions in the XY directions of each of the hand bodies 131, 132, 133..., the robot arm 1 retracts from the frame 4 and transports the multiple semiconductor wafers Wa, Wb, Wc... to the given next process.

[0062] As described above, the alignment device A1 with the above structure can acquire the external shape of the plate-shaped workpiece (semiconductor wafer) Wa, Wb, Wc, etc., through sensors 31, 32, 33, etc., which have planar sensor surfaces 311, 321, 331, etc. Furthermore, the positional deviation of the semiconductor wafer Wa, Wb, Wc, etc. from the reference position can be calculated based on the image of the acquired external shape. In this way, the positional deviation detection unit of the semiconductor wafer Wa, Wb, Wc, etc., can be formed in a thin shape according to the alignment device A1.

[0063] Based on the aforementioned thin-walled position deviation detection unit, it is possible to simultaneously detect and correct the position deviation of multiple semiconductor wafers Wa, Wb, Wc... handled by the multi-segment robotic arm 1. This significantly reduces the handling cycle time of semiconductor wafers Wa, Wb, Wc... in semiconductor processes, including position deviation correction.

[0064] This disclosure is not limited to the embodiments described above, and all modifications within the scope of the matters described in the claims are included within the scope of this disclosure.

[0065] In the above embodiments, to avoid contamination of the surfaces of the semiconductor wafers Wa, Wb, Wc..., the semiconductor wafers Wa, Wb, Wc... are not in contact with the sensors 31, 32, 33.... As another embodiment, for example, if surface contamination of the semiconductor wafers is not a problem, the semiconductor wafers Wa, Wb, Wc... may be in contact with the sensors 31, 32, 33....

Claims

1. An alignment device comprising: A robotic arm has multiple hand bodies, each capable of holding and supporting a plate-shaped workpiece, arranged in the vertical direction. The workpiece lifting mechanism is capable of lifting the plate-shaped workpieces that are transported by the aforementioned robotic arms and placed on the aforementioned arm bodies, and lowering them from the lifted state. Multiple sensors, each having a downward-facing flat sensor surface, are capable of detecting the shape of the plate-shaped workpiece that approaches or contacts the sensor surface via the workpiece lifting mechanism, and are arranged at a given interval in the vertical direction. The position deviation calculation unit calculates the position deviation of each plate-shaped workpiece from the reference position in the X, Y and θ directions based on the external shape of each plate-shaped workpiece obtained by the above sensors. The XY direction position deviation correction unit corrects the X and Y direction position deviations of each plate-shaped workpiece based on the XY direction position deviations calculated by the position deviation calculation unit. as well as The θ-direction position deviation correction unit corrects the θ-direction position deviation for each of the plate-shaped workpieces based on the θ-direction position deviation calculated by the position deviation calculation unit.

2. The alignment device according to claim 1, wherein, It also includes a control unit that controls the aforementioned XY-direction position deviation correction unit and the aforementioned θ-direction position deviation correction unit.

3. An alignment device comprising: A robotic arm has multiple hand bodies, each capable of holding and supporting a plate-shaped workpiece, arranged in the vertical direction. The workpiece lifting mechanism is capable of lifting the plate-shaped workpieces that are transported by the aforementioned robotic arms and placed on the aforementioned arm bodies, and lowering them from the lifted state. Multiple sensors, each having a downward-facing flat sensor surface, are capable of detecting the shape of the plate-shaped workpiece that approaches or contacts the sensor surface via the workpiece lifting mechanism, and are arranged at a given interval in the vertical direction. The position deviation calculation unit calculates the position deviation of each plate-shaped workpiece from the reference position in the X, Y and θ directions based on the external shape of each plate-shaped workpiece obtained by the above sensors. The XY direction position deviation correction unit corrects the X and Y direction position deviations of each plate-shaped workpiece based on the XY direction position deviations calculated by the position deviation calculation unit. The θ-direction position deviation correction unit corrects the θ-direction position deviation for each of the plate-shaped workpieces based on the θ-direction position deviation calculated by the position deviation calculation unit. and The control unit controls the aforementioned XY direction position deviation correction unit and the aforementioned θ direction position deviation correction unit. The aforementioned workpiece lifting mechanism has a pin that supports the aforementioned plate-shaped workpiece from below. The aforementioned XY direction position deviation correction unit corrects the position by moving the aforementioned pin of the aforementioned workpiece lifting mechanism in the XY direction based on the aforementioned X direction position deviation and the aforementioned Y direction position deviation. The aforementioned θ direction position deviation correction unit corrects the position by rotating the aforementioned pin of the aforementioned workpiece lifting mechanism that supports the aforementioned plate-shaped workpiece in the θ direction based on the aforementioned θ direction position deviation.

4. A method for correcting position deviation of a plate-shaped workpiece, which is a method for correcting position deviation of a plate-shaped workpiece using an alignment device, wherein the alignment device comprises: A robotic arm has multiple hand bodies, each capable of holding and supporting a plate-shaped workpiece, arranged in the vertical direction. The workpiece lifting mechanism is capable of lifting the plate-shaped workpieces that are transported by the aforementioned robotic arms and placed on the aforementioned arm bodies, and lowering them from the lifted state. Multiple sensors, each having a downward-facing flat sensor surface, are capable of detecting the shape of the plate-shaped workpiece that approaches or contacts the sensor surface via the workpiece lifting mechanism, and are arranged at a given interval in the vertical direction. The position deviation calculation unit calculates the position deviation of each plate-shaped workpiece from the reference position in the X, Y and θ directions based on the external shape of each plate-shaped workpiece obtained by the above sensors. The XY direction position deviation correction unit corrects the X and Y direction position deviations of each plate-shaped workpiece based on the XY direction position deviations calculated by the position deviation calculation unit. The θ-direction position deviation correction unit corrects the θ-direction position deviation for each of the plate-shaped workpieces based on the θ-direction position deviation calculated by the position deviation calculation unit. as well as The control unit controls the aforementioned XY direction position deviation correction unit and the aforementioned θ direction position deviation correction unit. The aforementioned workpiece lifting mechanism has a pin that supports the plate-shaped workpiece from below. The XY direction position deviation correction unit corrects the position by moving the pin of the workpiece lifting mechanism in the XY direction based on the X-direction and Y-direction position deviations. The θ direction position deviation correction unit corrects the position by rotating the pin of the workpiece lifting mechanism supporting the plate-shaped workpiece in the θ direction based on the θ-direction position deviation. The position deviation correction method includes: In the plate-shaped workpiece loading step, the aforementioned robotic arm is moved so that the plate-shaped workpiece placed on the aforementioned arm body is positioned at the calibration reference position above the aforementioned sensors. In the plate-shaped workpiece lifting step, the plate-shaped workpiece is lifted from each of the hand bodies by raising the pin of the workpiece lifting mechanism and bringing the plate-shaped workpiece close to or in contact with the sensor. The shape acquisition step involves acquiring the shape of each of the plate-shaped workpieces using the aforementioned sensors. The position deviation calculation step involves calculating the position deviation of the plate-shaped workpiece in the X, Y, and θ directions from the reference position based on the obtained external shape. The θ-direction position correction step involves lowering the pin of the workpiece lifting mechanism to place the plate-shaped workpiece so that it is positioned above each of the hand bodies, and rotating the pin based on the θ-direction position deviation calculated by the position deviation calculation unit. The XY direction position correction step, based on the position deviations in the X, Y, and θ directions, moves the pins of the workpiece lifting mechanism in the XY directions so that the plate-shaped workpieces are placed at the reference positions on the hands; and In the post-correction transfer step, the plate-shaped workpiece with the XY-direction position corrected is lowered by lowering the pin of the workpiece lifting mechanism, and then transferred to the corresponding hand body.

Images