A fixing and electrical connection structure of atomizer gasification chip

Abstract

The present invention discloses a fixing and electrical connection structure of an atomizer vaporization chip, which belongs to the technical field of electronic atomizers, and comprises a fixed shell, an upper cover plate and a silicon substrate, wherein the fixed shell is a coverless box body, the upper cover plate is snapped on the top of the fixed shell, and the upper cover plate is hinged to the edge of the fixed shell, a chip fixing bracket is arranged on the inner wall of the fixed shell, the silicon substrate is fixedly mounted on the chip fixing bracket, and a plurality of atomization channels are opened on the silicon substrate; the present invention completes the fixing and installation of the silicon substrate by making the silicon substrate small and placing it in the chip fixing bracket, closing the upper cover plate, elastically electrically connecting a contact plate against the silicon substrate, and at the same time, electrically connecting with the outside through a positive plate and a negative plate, the fixing and installation operation is simple and convenient, there is no need to deliberately enlarge the silicon substrate, thereby reducing the manufacturing cost, and the silicon substrate can be disassembled and replaced by opening the upper cover plate, and the structural design is ingenious.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic atomizers, and in particular relates to a fixing and electrical connection structure of an atomizer gasification chip. Background Art

[0002] The structure of the electronic atomizer is a heating component, which is powered by a battery to generate heat, causing the oil next to it to evaporate and form smoke. It also has a fragile and easily damaged chip inside, such as a ceramic chip, which is composed of a liquid inlet, ceramic and a heating film. The ceramic is sintered at high temperature to form a bowl-shaped structure, and the heating film is designed into a specific shape and attached to the ceramic surface. During operation, the heating film heats the liquid coming in from the air inlet to form mist by evenly generating heat. The installation of the chip is very difficult.

[0003] The Chinese patent (CN201920824270.2) discloses an electronic atomizer, including a suction nozzle, which has a suction port; an oil cup, the lower end of the oil cup is open, the upper end is closed and a channel connected to the outside is established, one end of the channel is connected to the suction port, and the other end of the channel is tightly fitted with a silicone bracket, the upper end of the silicone bracket has an air outlet, connected to the channel, the silicone bracket also has an oil through hole, and the oil through hole and the air outlet are independent of each other; a heating element, the upper end of which has an oil seepage groove, the oil seepage groove is connected to the oil through hole, and the upper part of the heating element is installed in the silicone bracket; a plastic bracket, which has an installation inner hole inside, and after the heating element and the silicone bracket are assembled, it is installed in the installation inner hole, and the plastic bracket and the silicone bracket jointly form an air vent connecting the heating wire at the lower end of the heating element and the channel; a base, which is installed to the lower end opening of the oil cup; an ejector pin, which is connected to the heating wire of the heating element, and the ejector pin is exposed on the lower surface of the base.

[0004] At present, silicon vaporization chips can avoid heavy metal pollution, and have the advantages of uniform vaporization droplet particles and less carbonization, so they are widely used. However, in order to make silicon vaporization chips into standard sizes for electrical connections on the market, the silicon vaporization chips need to be enlarged, which increases the production cost of the chips. In addition, the chip structure of silicon vaporization chips is low in strength and brittle, and is easily damaged during installation and fixation, making installation difficult. Summary of the invention

[0005] The purpose of the present invention is to solve the problem that the silicon vaporization chip needs to be enlarged for use, the chip structure of the silicon vaporization chip is low in strength and brittle, resulting in high manufacturing cost and difficulty in fixing and installing, and to propose a fixing and electrical connection structure for the atomizer vaporization chip.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a fixing and electrical connection structure of an atomizer vaporization chip, which includes a fixed shell, an upper cover plate and a silicon substrate, the fixed shell is a coverless box body, the upper cover plate is snapped on the top of the fixed shell, and the upper cover plate is hinged to the edge of the fixed shell, a chip fixing bracket is arranged on the inner wall of the fixed shell, the silicon substrate is fixedly mounted on the chip fixing bracket, a plurality of atomization channels are opened on the silicon substrate, a tube body extending to the interior of the fixed shell is arranged at the bottom of the fixed shell, a gap is left between the end of the tube body and the bottom wall of the silicon substrate, a flocculent layer is filled in the gap, an atomization outlet is formed inside the tube body, and the atomization outlet is connected to the outside of the fixed shell, a liquid storage tank is formed between the outer wall of the tube body and the inner wall of the fixed shell, an elastic electrical connection contact plate is arranged on the upper cover plate, the elastic electrical connection contact plate is pressed against the silicon substrate, and the elastic electrical connection contact plate is electrically connected to the silicon substrate.

[0007] As a further description of the above technical solution:

[0008] A cover plate door buckle is hinged on the outer wall of the fixed shell, and the cover plate door buckle is clamped and fixed to the upper cover plate.

[0009] As a further description of the above technical solution:

[0010] A sealing ring is arranged between the upper cover plate and the edge of the fixed shell.

[0011] As a further description of the above technical solution:

[0012] The flocculent layer is made of cotton or glass fiber.

[0013] As a further description of the above technical solution:

[0014] The elastic electrical connection contact plate includes a positive plate and a negative plate, one end of the positive plate and one end of the negative plate both abut against the silicon substrate, and the other end of the positive plate and the other end of the negative plate both extend above the upper cover plate.

[0015] As a further description of the above technical solution:

[0016] Two atomizing electrodes are arranged on the top wall of the silicon substrate, and the positive electrode plate and the negative electrode plate respectively abut against the two atomizing electrodes.

[0017] As a further description of the above technical solution:

[0018] The atomization channel is located around the flocculent layer.

[0019] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0020] In the present invention, the silicon substrate is made small and placed in a chip fixing bracket, and after closing the upper cover, the elastically electrically connected contact plate is pressed against the silicon substrate, so that the fixed installation of the silicon substrate can be completed. At the same time, it is electrically connected to the outside through the positive plate and the negative plate. The fixed installation operation is simple and convenient, and there is no need to deliberately enlarge the silicon substrate, which reduces the production cost. The silicon substrate can be disassembled and replaced by opening the upper cover, and the structural design is ingenious. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the fixing and electrical connection structure of an atomizer vaporization chip.

[0022] Figure 2 A reference for the use status of the fixing and electrical connection structure of an atomizer vaporization chip Figure 1 .

[0023] Figure 3 A reference for the use status of the fixing and electrical connection structure of an atomizer vaporization chip Figure 2 .

[0024] Legend:

[0025] 1. Fixed shell; 2. Upper cover; 3. Silicon substrate; 4. Chip fixing bracket; 5. Atomization channel; 6. Tube body; 7. Gap; 8. Flocculent layer; 9. Atomization outlet; 10. Liquid storage tank; 11. Elastic electrical connection contact plate; 111. Positive plate; 112. Negative plate; 12. Cover door buckle; 13. Sealing ring; 14. Atomization electrode. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1-3The present invention provides a technical solution: a fixing and electrical connection structure of an atomizer vaporization chip, comprising a fixed shell 1, an upper cover plate 2 and a silicon substrate 3, wherein the fixed shell 1 is a coverless box body, the upper cover plate 2 is snapped on the top of the fixed shell 1, and the upper cover plate 2 is hinged to the edge of the fixed shell 1, a chip fixing bracket 4 is arranged on the inner wall of the fixed shell 1, the silicon substrate 3 is fixedly mounted on the chip fixing bracket 4, a plurality of atomization channels 5 are opened on the silicon substrate 3, and a bottom of the fixed shell 1 is provided with a chip fixing bracket 4 extending to the fixed shell 1. A tube body 6 is provided inside the fixed shell 1, a gap 7 is left between the end of the tube body 6 and the bottom wall of the silicon substrate 3, the gap 7 is filled with a flocculent layer 8, an atomization outlet 9 is formed inside the tube body 6, and the atomization outlet 9 is connected to the outside of the fixed shell 1, and a liquid storage tank 10 is formed between the outer wall of the tube body 6 and the inner wall of the fixed shell 1, and an elastic electrical connection contact plate 11 is provided on the upper cover plate 2, the elastic electrical connection contact plate 11 is pressed against the silicon substrate 3, and the elastic electrical connection contact plate 11 is electrically connected to the silicon substrate 3;

[0028] A cover plate door buckle 12 is hinged on the outer wall of the fixed shell 1, and the cover plate door buckle 12 is clamped and fixed to the upper cover plate 2, so as to facilitate the fixation between the fixed shell 1 and the upper cover plate 2;

[0029] A sealing O-ring 13 is provided between the upper cover plate 2 and the edge of the fixed housing 1 to ensure the sealing between the upper cover plate 2 and the fixed housing 1;

[0030] The flocculent layer 8 is made of cotton or glass fiber to prevent excessive atomized liquid from seeping out of the atomization outlet 9 after cooling;

[0031] The elastic electrical connection contact plate 11 includes a positive plate 111 and a negative plate 112. One end of the positive plate 111 and one end of the negative plate 112 both abut against the silicon substrate 3. The other end of the positive plate 111 and the other end of the negative plate 112 both extend above the upper cover plate 2 to establish an electrical connection channel between the silicon substrate 3 and the outside, and support the silicon substrate 3. As the upper cover plate 2 is opened and closed, the elastic electrical connection contact plate 11 is connected and disconnected.

[0032] Two atomizing electrodes 14 are arranged on the top wall of the silicon substrate 3, and the positive plate 111 and the negative plate 112 respectively abut against the two atomizing electrodes 14, and the upper cover plate 2 is closed;

[0033] The atomization channel 5 is located around the flocculent layer 8 to ensure that the smoke enters the flocculent layer 8 evenly for filtration;

[0034] Working principle: First, place the silicon substrate 3 on the chip fixing bracket 4, close the upper cover 2, the upper cover 2 presses the sealing O-ring 13, and hinges and rotates the cover door buckle 12 to fix the upper cover 2 and the fixed shell 1. At this time, the elastic electrical connection contact plate 11 presses against the atomizing electrode 14 on the silicon substrate 3, so that the silicon substrate 3 is firmly fixed. Secondly, the positive plate 111 and the negative plate 112 establish an electrical connection between the silicon substrate 3 and the outside. Finally, when the silicon substrate 3 needs to be inspected and replaced, release the cover door buckle 12 from the upper cover 2, open the upper cover 2, and at the same time, remove the elastic electrical connection contact plate 11 from the surface of the silicon substrate 3, and take the silicon substrate 3 out of the chip fixing bracket 4.

[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A fixing and electrical connection structure of an atomizer gasification chip, characterized in that: The invention comprises a fixed shell (1), an upper cover plate (2) and a silicon substrate (3); the fixed shell (1) is a box body without a cover; the upper cover plate (2) is snap-fitted to the top of the fixed shell (1), and the upper cover plate (2) is hinged to the edge of the fixed shell (1); a chip fixing bracket (4) is arranged on the inner wall of the fixed shell (1); the silicon substrate (3) is fixedly mounted on the chip fixing bracket (4); a plurality of atomization channels (5) are opened on the silicon substrate (3); a tube body (6) extending to the interior of the fixed shell (1) is arranged at the bottom of the fixed shell (1); the tube body (6) ) and the bottom wall of the silicon substrate (3), a gap (7) is left between the end of the tube body (6) and the bottom wall of the silicon substrate (3), the gap (7) is filled with a flocculent layer (8), an atomization outlet (9) is formed inside the tube body (6), and the atomization outlet (9) is connected to the outside of the fixed shell (1), and a liquid storage tank (10) is formed between the outer wall of the tube body (6) and the inner wall of the fixed shell (1), and an elastic electrical connection contact plate (11) is provided on the upper cover plate (2), the elastic electrical connection contact plate (11) is pressed against the silicon substrate (3), and the elastic electrical connection contact plate (11) is electrically connected to the silicon substrate (3).

2. The fixing and electrical connection structure of the atomizer vaporization chip according to claim 1, characterized in that: A cover plate door catch (12) is hinged on the outer wall of the fixed shell (1), and the cover plate door catch (12) is clamped and fixed to the upper cover plate (2).

3. The fixing and electrical connection structure of the atomizer vaporization chip according to claim 1, characterized in that: A sealing O-ring (13) is provided between the upper cover plate (2) and the edge of the fixed housing (1).

4. The fixing and electrical connection structure of the atomizer vaporization chip according to claim 1, characterized in that: The flocculent layer (8) is cotton or glass fiber.

5. The fixing and electrical connection structure of the atomizer vaporization chip according to claim 1, characterized in that: The elastic electrical connection contact plate (11) comprises a positive plate (111) and a negative plate (112), one end of the positive plate (111) and one end of the negative plate (112) both abut against the silicon substrate (3), and the other end of the positive plate (111) and the other end of the negative plate (112) both extend above the upper cover plate (2).

6. The fixing and electrical connection structure of the atomizer vaporization chip according to claim 5, characterized in that: Two atomizing electrodes (14) are arranged on the top wall of the silicon substrate (3), and the positive electrode plate (111) and the negative electrode plate (112) respectively abut against the two atomizing electrodes (14).

7. The fixing and electrical connection structure of the atomizer vaporization chip according to claim 1, characterized in that: The atomization channel (5) is located around the flocculent layer (8).

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