A fixture for electroplating compound semiconductor microwave chips

Abstract

The present invention discloses a fixture for electroplating compound semiconductor microwave chips, which relates to the field of electroplating technology. A fixture for electroplating compound semiconductor microwave chips comprises a base plate, wherein lifting devices are provided on both sides of the top of the base plate, a connecting rod is fixedly connected to one side of the lifting device, a cross bar is fixedly connected to the bottom of the connecting rod, a fixture is provided in the middle of the cross bar, and the fixture comprises a limit frame, an action rod is movably connected to the inner wall of the two ends of the limit frame, one end of the action rod is fixedly connected to a clamp, and one end of the return spring is fixedly connected to one side of the clamp. The present invention enables the chip to be immersed in the electrolyte through the lifting device chip by setting the limiting part and the clamp. When adding additives or conductive materials such as copper in the hole during electroplating, the limit frame is limited by the limit rod to keep it highly stable and reduce errors.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating, in particular to an electroplating fixture for compound semiconductor microwave chips. Background Art

[0002] Traditional through-hole plating uses electroplating to fill through-silicon vias (TSVs). While this method offers cost advantages and a simple process, achieving defect-free filling within vias with a large depth-to-width ratio is challenging. Key challenges include: concentrated electric field lines at the via opening; and differences in metal ion concentration between the via opening and the via bottom. Consequently, conductive materials like copper are difficult to deposit at the bottom during the electroplating process, leading to premature sealing of the via and resulting in defects within the hole.

[0003] 5G microwave chips are a top priority in the current chip development industry. Compared with traditional chips, 5G microwave chips need to have a high degree of integration, which is equivalent to adding more communication antennas inside. The various process requirements of the chip have been improved. The through-hole plating of traditional chips is no longer suitable for 5G microwave chips, because the through-holes used in 5G microwave chips have smaller diameters and higher precision. Whether the through-hole plating is spraying additives or connecting conductive materials, due to the extremely small through-hole diameter, slight deviations will cause chip defects. Therefore, during the through-hole plating process, the chip needs to maintain a high degree of stability. To this end, the present invention proposes a new solution. Summary of the Invention

[0004] The object of the present invention is to provide a fixture for electroplating compound semiconductor microwave chips to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a fixture for electroplating compound semiconductor microwave chips, comprising a base plate, lifting devices are provided on both sides of the top of the base plate, a connecting rod is fixedly connected to one side of the lifting device, a cross bar is fixedly connected to the bottom of the connecting rod, a fixture is provided in the middle of the cross bar, the fixture comprises a limit frame, an action rod is movably connected to the inner walls of both ends of the limit frame, one end of the action rod is fixedly connected to a splint, a reset spring is sleeved on the surface of the action rod, one end of the reset spring is fixedly connected to one side of the splint, and a limiting groove is provided on the other side of the splint.

[0006] Preferably, the middle parts of both ends of the limit frame are fixedly connected to rotating rods, one end of one of the rotating rods is movably connected to one side of the middle part of the cross bar, and the other end of the rotating rod on the other side is provided with a first motor, which is fixedly connected to one side of the cross bar.

[0007] Preferably, the surface of the cross bar is movably connected with a limiting part, and the limiting part includes a sliding block, and a limiting rod is fixedly connected between every two sliding blocks. The inner wall of the sliding block is movably connected to the surface of the cross bar, and one side of the sliding block is fixedly connected to the limiting block. The middle part of the limiting block is movably connected to a bidirectional threaded screw. A second motor is provided on one side of the cross bar, and the output end of the second motor is fixedly connected to one end of the bidirectional threaded screw.

[0008] Preferably, the lifting device includes a support column, and there are multiple support columns, one of which is provided with a slide groove on one side, and a threaded rod is movably connected between the top and bottom of the slide groove, a stepper motor is fixedly connected to the top of the support column, and the output end of the stepper motor is fixedly connected to one end of the threaded rod, a slider is movably connected to the surface of the threaded rod, and one side of the slider is fixedly connected to the top side of the connecting rod, and the lifting device is connected to the cross bar through the connecting rod.

[0009] Preferably, one side of the crossbar is fixedly connected to a fixing block, and one side of the fixing block is fixedly connected to a second motor.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] (1) The fixture for electroplating compound semiconductor microwave chips enables the chip to be immersed in the electrolyte through the lifting device by setting the limiting parts and the fixture. When adding additives or conductive materials such as copper into the hole during electroplating, the limiting rod is used to limit the limiting frame to keep it highly stable and reduce errors.

[0012] (2) The electroplating fixture for compound semiconductor microwave chips has a relatively simple working principle, but a good effect, and basically does not require manual assistance for operation, and the operation process is simple. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0014] Figure 2 It is a schematic diagram of the limiting member structure of the present invention;

[0015] Figure 3 Schematic diagram of the fixture structure of the present invention;

[0016] Figure 4 It is a schematic structural diagram of the right shaft side of the present invention.

[0017] In the figure: 1. Base plate; 2. Lifting device; 201. Support column; 202. Slide groove; 203. Threaded rod; 204. Slider; 205. Stepper motor; 3. Connecting rod; 4. Cross bar; 5. Clamp; 501. Limiting frame; 502. Action rod; 503. Return spring; 504. Clamp; 505. Limiting groove; 506. Rotating rod; 507. First motor; 6. Limiting member; 601. Sliding block; 602. Limiting rod; 603. Limiting block; 604. Fixed block; 605. Bidirectional threaded screw; 606. Second motor. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] It should be noted that, in the description of the present invention, the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] Furthermore, it should be understood that for the sake of ease of description, the sizes of the various components shown in the drawings are not drawn according to actual proportions. For example, the thickness or width of certain layers may be exaggerated relative to other layers.

[0021] It should be noted that like numbers and letters represent similar items in the following figures, so once an item is defined or described in one figure, it will not need to be further discussed and described in detail in the description of the subsequent figures.

[0022] like Figure 1-4As shown, the present invention provides a technical solution: a fixture for electroplating compound semiconductor microwave chips, comprising a base plate 1, with lifting devices 2 provided on both sides of the top of the base plate 1 for adjusting the height of the fixture 5, and a plating liquid tank provided below the device to facilitate plating liquid electrolysis of the microwave chip, one side of the lifting device 2 is fixedly connected to a connecting rod 3, the bottom of the connecting rod 3 is fixedly connected to a cross bar 4, and a fixture 5 is provided in the middle of the cross bar 4, the fixture 5 includes a limit frame 501, and the inner walls of both ends of the limit frame 501 are movably connected to an action rod 502, one end of the action rod 502 is fixedly connected to a clamping plate 504, and through the action of the clamping plate 504 and the return spring 503, it has elasticity, can clamp the chip in the middle and play a limiting role, the surface of the action rod 502 is sleeved with a return spring 503, one end of the return spring 503 is fixedly connected to one side of the clamping plate 504, and the other side of the clamping plate 504 is provided with a limiting groove 505.

[0023] Preferably, the middle parts of both ends of the limit frame 501 are fixedly connected with a rotating rod 506, one end of one of the rotating rods 506 is movably connected to one side of the middle part of the cross bar 4, and the other end of the rotating rod 506 on the other side is provided with a first motor 507, the first motor 507 is fixedly connected to one side of the cross bar 4, and the surface of the cross bar 4 is movably connected with a limiting member 6, the limiting member 6 includes a sliding block 601, and a limiting rod 602 is fixedly connected between each two sliding blocks 601. The inner wall of the sliding block 601 is movably connected to the surface of the cross bar 4, and one side of the sliding block 601 is fixedly connected to the inner wall of the sliding block 601. A fixedly connected limit block 603 is provided, and a bidirectional threaded screw 605 is movably connected to the middle of the limit block 603. A second motor 606 is provided on one side of the cross bar 4. The output end of the second motor 606 is fixedly connected to one end of the bidirectional threaded screw 605. The bidirectional threaded screw 605 can enable the limit block 603 to drive the sliding blocks 601 on both sides to move closer to the middle, and then fix the limit frame 501 under the action of the limit rod 602. In the three-dimensional packaging of semiconductor chips, through-holes are used as the interconnection method, which is the mainstream direction of packaging, and the corresponding through-hole electroplating technology is the key to the development of three-dimensional packaging. Traditional through-hole electroplating is achieved by electroplating to fill silicon through-holes. Electroplating to fill through-holes has its cost advantages. These through-holes usually have an aperture of tens of microns. The deviation or jitter of one end during the electroplating process will also cause errors. Therefore, the stability of the fixture is enhanced by the dual limitation of the clamp 504 and the limit rod 602. The lifting device 2 includes a support column 201, and the support column 201 is provided with multiple ones. One of the support columns 201 is provided with a slide groove 202 on one side, and a threaded rod 203 is movably connected between the top and bottom of the slide groove 202. A stepper motor 205 is fixedly connected to the top of the support column 201, and the output end of the stepper motor 205 is fixedly connected to one end of the threaded rod 203. A slider 204 is movably connected to the surface of the threaded rod 203, and one side of the slider 204 is fixedly connected to the top side of the connecting rod 3. The lifting device 2 is connected to the cross bar 4 through the connecting rod 3, and one side of the cross bar 4 is fixedly connected to a fixed block 604. A second motor 606 is fixedly connected to one side of the fixing block 604. The materials of various components of the fixture 5 of the device are silicon carbide ceramic materials, which can resist strong acid corrosion.

[0024] This device is a fixture for electroplating compound semiconductor microwave chips. Through-hole electroplating is generally the key to the development of three-dimensional packaging of microwave chips. The through-holes on the chip are usually only 50um to 100um in diameter, with extremely small apertures. During the electroplating process, it is difficult for the conductive material to settle at the bottom, and additives are generally required to achieve a printing and leveling effect. During this process, the microwave chip must remain extremely stable. The slightest error may result in incomplete filling. Therefore, this device adopts a dual-stability structure. The microwave chip is placed between clamps 504 to achieve a first level of fixation. To facilitate the processing and immersion electroplating of the microwave chip, a motor is provided on one side of the limit frame 501 to control the rotation of the limit frame 501. In this way, the limit frame 501 is limited by the rotating rod 506, which is still unstable. Therefore, a limit member 6 is provided. The limit member 6 drives the bidirectional threaded screw 605 to rotate via the second motor 606, so that the limit block 603 drives the limit rod 602 to move closer to the center, clamping the limit frame 501 in the middle to fix it, so that the microwave chip can maintain high stability during electroplating.

[0025] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A fixture for electroplating compound semiconductor microwave chips, comprising a base plate (1), characterized in that: The bottom plate (1) is provided with lifting devices (2) on both sides of the top, the lifting device (2) is fixedly connected to a connecting rod (3) on one side, the connecting rod (3) is fixedly connected to a cross bar (4) at the bottom, and a clamp (5) is provided in the middle of the cross bar (4), the clamp (5) comprises a limit frame (501), the inner walls of both ends of the limit frame (501) are movably connected to an action rod (502), one end of the action rod (502) is fixedly connected to a clamp (504), a return spring (503) is sleeved on the surface of the action rod (502), one end of the return spring (503) is fixedly connected to one side of the clamp (504), and a limit slot (505) is provided on the other side of the clamp (504); The middle parts of both ends of the limit frame (501) are fixedly connected to rotating rods (506), one end of one of the rotating rods (506) is movably connected to one side of the middle part of the cross bar (4), and the other end of the rotating rod (506) on the other side is provided with a first motor (507), and the first motor (507) is fixedly connected to one side of the cross bar (4); The surface of the cross bar (4) is movably connected to a limiting member (6), and the limiting member (6) includes a sliding block (601). A limiting rod (602) is fixedly connected between every two sliding blocks (601). The inner wall of the sliding block (601) is movably connected to the surface of the cross bar (4), wherein one side of the sliding block (601) is fixedly connected to a limiting block (603). The middle part of the limiting block (603) is movably connected to a bidirectional threaded screw (605). A second motor (606) is provided on one side of the cross bar (4), and an output end of the second motor (606) is fixedly connected to one end of the bidirectional threaded screw (605).

2. The electroplating fixture for compound semiconductor microwave chips according to claim 1, characterized in that: The lifting device (2) comprises a support column (201), wherein a plurality of support columns (201) are provided, wherein a slide groove (202) is provided on one side of one of the support columns (201), a threaded rod (203) is movably connected between the top and bottom of the slide groove (202), a stepping motor (205) is fixedly connected to the top of the support column (201), an output end of the stepping motor (205) is fixedly connected to one end of the threaded rod (203), a slider (204) is movably connected to the surface of the threaded rod (203), one side of the slider (204) is fixedly connected to one side of the top of the connecting rod (3), and the lifting device (2) is connected to the cross bar (4) via the connecting rod (3).

3. The electroplating fixture for compound semiconductor microwave chips according to claim 1, characterized in that: One side of the crossbar (4) is fixedly connected to a fixed block (604), and one side of the fixed block (604) is fixedly connected to a second motor (606).

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