LED chip detection method, device, system and terminal equipment

Abstract

The present application is applicable to the field of LED display technology, and provides a method, device, system and terminal equipment for detecting LED chips, wherein the method comprises: inputting a first electrical signal to an LED light group through a control system, lighting up the LED light group, obtaining light signals corresponding to different optical parameters of the LED light group through an optical probe; performing photoelectric conversion on the light signal, and outputting a second electrical signal; comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal, and locating defective LED chips in the LED light group. Through the present application, the problem that only unlit LED chips can be identified through image algorithms, and the accuracy of detecting LED chips with other defects is low, can be solved, and the accuracy of detecting LED chips with various defects can be improved.

Description

Technical Field

[0001] The present application belongs to the field of LED display technology, and in particular, relates to a detection method, device, system and terminal equipment for an LED chip. Background Art

[0002] With the development of science and technology, LED (Light Emitting Diode) display screens, lamps and other products are widely used in people's lives and industrial production processes. The size of LED chips used in traditional lamps can reach 1000 microns × 1000 microns × 1000 microns. When testing LED chips during the production process, manual multimeters or bridges can be used. However, the size of micro-pitch LED chips or mini LED chips is hundreds of times smaller than that of traditional LED chips, and multimeters or bridges can no longer be used. Testing tools such as tools.

[0003] At present, for micro-pitch LED chips or mini LED chips, the automated optical inspection (AOI) equipment can be used to take pictures of the luminous LED chips after lighting the LED light board, and locate the unlit bad pixels through image algorithm analysis. However, it is unable to identify bad LED chips with other defects, resulting in low accuracy in LED chip detection. Summary of the invention

[0004] The embodiments of the present application provide a method, apparatus, system and terminal device for detecting an LED chip, which can solve the problem of low accuracy in detecting LED chips through image algorithm analysis.

[0005] In a first aspect, an embodiment of the present application provides a method for detecting an LED chip, the method comprising:

[0006] A control system inputs a first electrical signal to an LED light group, and after lighting the LED light group, an optical probe is used to obtain optical signals corresponding to different optical parameters of the LED light group; the optical signal is photoelectrically converted to output a second electrical signal; a standard electrical signal corresponding to the optical parameter is compared and analyzed with the second electrical signal to locate defective LED chips in the LED light group.

[0007] In a possible implementation manner of the first aspect, the first electrical signal is a square wave drive signal with a preset duty cycle;

[0008] The control system inputs a first electrical signal to the LED light group, and after lighting the LED light group, an optical signal of the LED light group is obtained through an optical probe, including:

[0009] After the control system inputs the square wave driving signal with the preset duty cycle to the LED light group according to the preset timing, the light signal carrying the sinusoidal waveform in the LED light group is obtained through the optical probe.

[0010] In a possible implementation manner of the first aspect, performing photoelectric conversion on the optical signal to output a second electrical signal includes:

[0011] The light signal carrying a sinusoidal waveform in the LED light group is photoelectrically converted to obtain the second electrical signal of the preset timing.

[0012] In a possible implementation manner of the first aspect, the preset time sequence corresponds to the position coordinates of each LED chip in the LED light group; and comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED light group includes:

[0013] The standard electrical signal corresponding to the optical parameter is compared and analyzed with the second electrical signal to determine a target value in the second electrical signal that does not match the standard electrical signal; and the position coordinates of the defective LED chip in the LED lamp group are determined according to the time period corresponding to the target value in the preset timing.

[0014] In a possible implementation manner of the first aspect, the method further includes:

[0015] According to the preset timing and the preset duty cycle, the voltage value of the standard electrical signal is compared with the voltage value of the second electrical signal; if there is a difference between the voltage value of the first electrical signal and the voltage value of the second electrical signal corresponding to the same time period in the preset timing, it is determined that the LED chip at the coordinate position corresponding to the time period is defective.

[0016] In a possible implementation manner of the first aspect, after acquiring the optical signal of the LED light group by using the optical probe, the method further includes:

[0017] According to preset standard optical parameters, data calibration is performed on the optical signal to obtain a calibrated optical signal.

[0018] In a possible implementation manner of the first aspect, comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group further includes:

[0019] If the optical parameter is a brightness signal, the first time period of the standard electrical signal in the preset timing corresponds to a standard voltage value, and the voltage value of the second electrical signal in the first time period of the preset timing is zero, then it is determined that the LED chip at the coordinate position corresponding to the first time period is not bright; if the voltage value of the second electrical signal corresponding to the second time period in the preset timing is greater than or less than the voltage value of the standard electrical signal, then it is determined that the brightness value of the LED chip at the coordinate position corresponding to the second time period is greater than or less than the standard brightness value.

[0020] In a possible implementation manner of the first aspect, comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group further includes:

[0021] If the optical parameter is an illumination signal, the standard electrical signal corresponding to the illumination signal is compared and analyzed with the second electrical signal to locate the LED chip with the light normal offset defect in the LED light group; if the optical parameter is a chromaticity signal, the standard electrical signal corresponding to the chromaticity signal is compared and analyzed with the second electrical signal to locate the LED chip with the light distribution offset defect in the LED light group.

[0022] In a second aspect, an embodiment of the present application provides a detection device for an LED chip, comprising:

[0023] An acquisition unit, used for inputting a first electrical signal to the LED light group in the control system, lighting up the LED light group, and acquiring optical signals corresponding to different optical parameters of the LED light group through an optical probe;

[0024] a photoelectric conversion unit, configured to perform photoelectric conversion on the optical signal and output a second electrical signal;

[0025] The processing unit is used to compare and analyze the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group.

[0026] In a third aspect, an embodiment of the present application provides a detection system for an LED chip, comprising a control system, an LED light group, at least one optical probe and at least one processor; wherein the control system is used to input a first electrical signal into the LED light group; the at least one optical probe is used to obtain light signals corresponding to different optical parameters of the LED light group, and perform photoelectric conversion on the light signals to obtain second electrical signals; the at least one processor is used to compare and analyze the standard electrical signals corresponding to the optical parameters with the second electrical signals to locate defective LED chips in the LED light group.

[0027] In a fourth aspect, an embodiment of the present application provides a terminal device, comprising at least one optical probe, a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the described method when executing the computer program.

[0028] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program implements the described method when executed by a processor.

[0029] In a sixth aspect, an embodiment of the present application provides a computer program product, which, when executed on a terminal device, enables the terminal device to execute any of the methods described in the first aspect above.

[0030] It can be understood that the beneficial effects of the second to sixth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0031] Compared with the prior art, the beneficial effects of the embodiments of the present application are as follows: through the embodiments of the present application, after the control system inputs a first electrical signal to the LED light group and the LED light group is lit, an optical probe is used to obtain optical signals corresponding to different optical parameters of the LED light group; the optical signal is photoelectrically converted to output a second electrical signal; the standard electrical signal corresponding to the optical parameter is compared and analyzed with the second electrical signal to locate the defective LED chip in the LED light group; the optical signal actually emitted by the LED chip is obtained, and the optical signal is photoelectrically converted to obtain the second electrical signal, and the second electrical signal is compared and analyzed with the standard electrical signal corresponding to each optical parameter, so that not only the LED chip with the non-lighting defect in the LED light group can be located, but also the LED chips with other defects can be identified and located, thereby greatly improving the accuracy of LED chip detection; the invention has strong ease of use and practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0033] Figure 1 It is a schematic diagram of the system architecture of an application scenario provided by an embodiment of the present application;

[0034] Figure 2 It is a flowchart of an LED chip detection method provided by an embodiment of the present application;

[0035] Figure 3 is a schematic diagram of the LED chip detection principle provided by an embodiment of the present application;

[0036] Figure 4 is a schematic diagram of an LED light board and a light group provided in an embodiment of the present application;

[0037] Figure 5 It is a schematic diagram of inputting an electrical signal to an LED light group provided by an embodiment of the present application;

[0038] Figure 6 This is a schematic diagram of waveform signal comparison of an LED lamp group provided in an embodiment of the present application;

[0039] Figure 7 It is a structural schematic diagram of an LED chip detection device provided in one embodiment of the present application;

[0040] Figure 8 It is a schematic diagram of the structure of the terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0042] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0043] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0044] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.

[0045] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0046] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0047] With the development of industrial production, products involving LEDs have also begun to enter the micron level. For example, the size of a mini LED chip can reach 100×200 microns and the thickness can reach 80 microns. Compared with traditional products, the vertical area is reduced by nearly 50 times and the volume is reduced by nearly 600 times. Therefore, in the process of product production, it is no longer possible to use manual multimeters, bridges and other tools for testing. The AOI equipment used in traditional technology is to light up the LED light group, take a photo of the light-emitting LED light group, analyze it through image algorithms, and locate the unlit bad points in the LED light group. However, other defects such as overbrightness, dimness, color error, normal deviation of light, and light distribution deviation also affect the display effect of the product. The traditional AOI equipment cannot identify and locate defects caused by other optical parameters, so the accuracy of LED chip detection is low, especially for micron-level products, the detection effect is poor.

[0048] See also Figure 1 , a schematic diagram of the system architecture of an application scenario provided by an embodiment of the present application. Figure 1As shown, the LED chip 11 is arranged on the LED substrate 12, and the LED substrate can be a substrate used for a micro-pitch LED display screen. When the LED chip is detected, the LED substrate is placed on a fixed platform 13, and the fixed platform 13 can be a high-precision optical platform to ensure the accuracy of positioning during the measurement process. The optical probe 10 is located directly above the LED chip, and the center normal of the optical probe 10 is perpendicular to the plane where the LED chip is located. During the detection process, the optical probe 10 can be set at a fixed position directly above the LED chip for measurement, or it can be moved directly above the LED chip for measurement. When it is set to a fixed position for measurement, it can be fixed directly above the middle position of each column or row of LED light groups on the LED substrate, and one column or one row of LED chips can be detected in turn; when it is moved directly above the LED chip for measurement, the optical probe can be moved at a uniform speed directly above a column or a row of LED light groups along the direction of a column or a row of LED light groups, combined with the timing and duty cycle of the input electrical signal, to detect one column or a row of LED chips in turn.

[0049] After the control system inputs a preset timing electrical signal to the LED light group composed of a column or a row of LED chips 11, the optical probe 10 collects the light signal emitted by the LED light group; wherein the optical probe is a device that can measure different optical parameters, for example, the optical probe can be set as an illuminance meter, a brightness meter, a colorimeter, etc., which can collect different optical parameters such as the illuminance signal, brightness signal and colorimetric signal of the LED light group; that is, the light signal of the LED light group obtained by the optical probe can be an illuminance signal, a brightness signal and a colorimetric signal, etc. The optical probe can also be provided with an optical analysis instrument such as a charge coupled device image sensor (CCD) SLR camera, which can measure optical parameters such as the wavelength and spectrum of the light emitted by the LED chip after lighting.

[0050] The terminal device can obtain a second electrical signal corresponding to the optical signal with different optical parameters by performing photoelectric conversion on the measured optical signal; the standard electrical signal corresponding to the different optical parameters is compared and analyzed with the second electrical signal, and the defective LED chip in the LED lamp group is located according to the comparison and analysis results.

[0051] Through the embodiments of the present application, by measuring the light signals of different optical parameters by the optical probe, converting the light signals into photoelectricity, and comparing the converted electrical signals with the standard electrical signals, it is possible to locate and mark LED chips with defects such as dimming, over-brightness, incorrect color, light normal deviation, and light distribution deviation, rather than just identifying dim LED chips. This allows for determination of whether each LED chip meets the requirements, thereby improving the accuracy of LED chip detection and providing reliable data basis for subsequent maintenance, consistency analysis, etc.

[0052] The following is a specific example of the process of detecting LED chips. Figure 2 FIG. 1 is a flow chart of an LED chip detection method provided by an embodiment of the present application. Figure 2 As shown, the method comprises the following steps:

[0053] Step S201, after the control system inputs a first electrical signal to the LED light group and lights up the LED light group, the terminal device obtains optical signals corresponding to different optical parameters of the LED light group through an optical probe.

[0054] In some embodiments, based on the characteristics of active light emission of LED chips and the principle of LED semiconductor characteristics, the control system inputs a first electrical signal to the LED light group to drive the LED chip to emit light. The first electrical signal can be a voltage square wave driving signal with a preset duty cycle, and the LED chip is lit when it is high. The LED light group is a light group composed of a column or a row of LED chips on an LED substrate, and the first electrical signal input by L is used to sequentially drive a column or a row of LED chips according to a preset timing.

[0055] By setting the duty cycle of the first electrical signal, the light-emitting time of the LED chip can be controlled. By setting a preset timing, the control system controls the LED chips of the LED lamp group to emit light in a set order and time. The preset timing corresponds to the coordinates of the physical position of the LED chip (such as Figure 5 As shown in Figure (b), the correspondence between the electrical signal controlling the light-emitting sequence and the physical position of the LED chip is that the electrical signal in the time period t1 to t1+a corresponds to the light-emitting of the LED chip at the physical position 1-1-R, and the electrical signal in the time period t2 to t2+a corresponds to the light-emitting of the LED chip at the physical position 1-2-R, where a is the input duration of the high-level signal in the duty cycle of the first electrical signal).

[0056] Exemplarily, the control system can establish wired or wireless communication with the terminal device. After the control system inputs a first electrical signal to the LED light group, the terminal device collects the light signal of the LED light group through an optical probe; the control system can also be an integrated device on the terminal device, which is uniformly controlled by the terminal device.

[0057] It should be noted that the preset timing of the first electrical signal input by the control system corresponds to the timing of the light signal of each LED chip in the LED light group collected by the optical probe.

[0058] In addition, the optical probe can be an optical device equipped with one or more optical analysis instruments such as a brightness meter, a colorimeter, an illuminance meter, a charge coupled device image sensor (CCD), and a single-lens reflex camera. The above optical analysis instruments can also be set in different optical probes. When collecting the light signal of the LED light group, the light signals of different optical parameters of the LED light group can be obtained through multiple optical probes, or the light signals of different optical parameters of the LED light group can be collected through an optical probe equipped with multiple optical analysis instruments.

[0059] It can be understood that the optical probe can be fixed directly above the LED chip, and facing the LED chip located in the middle position in a row or column of LED chips, to collect the light signal of the LED chips in the row or column; it can also be moved according to the light emission timing of the LED chip and the physical position of the LED chip, to collect the light signals of the LED chips in the row or column in sequence, without specific limitation here.

[0060] In some embodiments, the first electrical signal is a square wave driving signal with a preset duty cycle; after the control system inputs the first electrical signal to the LED light group and lights up the LED light group, the terminal device obtains optical signals corresponding to different optical parameters of the LED light group through the optical probe, including:

[0061] After the control system inputs a square wave driving signal with a preset duty cycle to the LED light group according to a preset timing, the terminal device obtains the light signal carrying a sinusoidal waveform in the LED light group through the optical probe.

[0062] In some embodiments, the preset duty cycle is the time ratio of the high level signal to the low level signal in the square wave drive signal, or the time ratio of the high voltage to the low voltage. The control system sets the input timing and duty cycle of the first electrical signal so that the optical probe obtains the sinusoidal light signal emitted by each LED chip in the LED lamp group.

[0063] In some embodiments, after the terminal device acquires the optical signals corresponding to the different optical parameters of the LED light group through the optical probe, the detection method further includes:

[0064] According to preset standard optical parameters, the terminal device performs data calibration on the optical signal to obtain a calibrated optical signal.

[0065] In some embodiments, after the terminal device collects optical signals of different optical parameters through the optical probe, it will perform data calibration on the optical signal. The standard optical parameter is the difference between the optical parameter actually collected by the optical probe at the preset position and the actual emitted optical signal after the first electrical signal is input to the normal LED chip; when the LED chip is normal, the actual emitted optical signal can obtain the same voltage value or current value as the standard electrical signal corresponding to the optical parameter after photoelectric conversion.

[0066] It should be noted that different light signal acquisition methods (fixed or mobile) are used, and the parameter values ​​used for data correction of light signals are also different, and the preset standard optical parameters corresponding to different acquisition methods are also different. When the position of the optical probe is fixed, the LED chip at each position in a row or column of LED light groups corresponds to a unique standard optical parameter, that is, a row or column of LED light groups can correspond to a set of standard optical parameters; thus, the light signal of each LED chip obtained is calibrated by the preset standard light intensity parameters corresponding to the LED chips at different positions, and a calibrated light signal is obtained.

[0067] Similarly, when the optical probe is moving for measurement, the light signals of each LED chip in a row or column of LED light groups obtained correspond to unique standard optical parameters, that is, a row or column of LED light groups corresponds to a set of standard optical parameters. For example, assuming that the chips of the LED light group are all normal, if the optical probe is fixed above the LED chip in the middle of a row or column of LED light groups to collect the light signals of the LED light group, then the parameters of the light signals of the LED chips on the two sides collected (such as illumination value, brightness value or chromaticity value, etc.) are smaller than the parameters of the light signals of the LED chips located in the middle position, then it is necessary to perform data calibration on the parameters of the light signals of the LED chips collected at different positions according to the standard optical parameters corresponding to different positions to obtain the calibrated light signals. In addition, if the optical probe collects a brightness signal, the brightness signal is calibrated by the standard optical parameters corresponding to the brightness parameters; if the optical probe collects an illumination signal, the illumination signal is calibrated by the standard optical parameters corresponding to the illumination parameters.

[0068] It can be understood that, for the method of collecting light signals at a fixed position of the optical probe, there is a set of standard optical parameters corresponding to the LED chips at different positions; for the method of collecting light signals when the optical probe is moving, there is a set of standard optical parameters corresponding to the moving speed and the timing of the light signals; that is, based on the normal light-emitting characteristics of the LED chips, the standard optical parameters can be multiple sets of different reference values ​​set for each row or column of LED light groups according to the method of collecting light signals and the preset timing and preset duty cycle of the input electrical signals.

[0069] Step S202: The terminal device performs photoelectric conversion on the optical signal and outputs a second electrical signal.

[0070] In some embodiments, the optical signal acquired by the terminal device through the optical probe may be a signal of an optical parameter such as an illumination signal, a brightness signal, and a chromaticity signal; the terminal device performs photoelectric conversion on the collected optical signal, and may perform photoelectric conversion on the illumination signal, the brightness signal, and the chromaticity signal to obtain a second electrical signal corresponding to the optical parameter.

[0071] It should be noted that the terminal device can be provided with one or more optical probes to respectively collect optical signals corresponding to different optical parameters, perform photoelectric conversion on the optical signals of different optical parameters, and obtain second electrical signals corresponding to different optical parameters. The optical signal can also be a signal corresponding to an optical parameter measured by other optical analysis instruments and can be converted by photoelectric conversion, and is not limited to the illumination signal, brightness signal and chromaticity signal mentioned above. In addition, the optical signal for photoelectric conversion can be a parameter calibrated by standard optical parameters.

[0072] In some embodiments, the terminal device performs photoelectric conversion on the optical signal and outputs a second electrical signal; including:

[0073] The terminal device performs photoelectric conversion on the light signal carrying the sinusoidal waveform in the LED light group to obtain the second electrical signal with a preset timing.

[0074] In some embodiments, since LED chips are light-emitting semiconductors, based on their light-emitting characteristics, a sinusoidal light signal carried by each LED chip in the LED light group can be obtained under a preset timing drive signal. The light signal is photoelectrically converted, and the obtained second electrical signal has the same timing as the drive signal and the light signal, that is, a second electrical signal with a preset timing is obtained. Figure 3 As shown, a schematic diagram of the LED chip detection principle provided by an embodiment of the present application, a square wave driving signal with a preset timing (input electrical signal) is input, and the obtained optical signal is photoelectrically converted to obtain an electrical signal with the same timing (output electrical signal). Figure 5 As shown in (a) and (b) of the figure, according to the preset timing sequence tN, corresponding to the physical position of each LED chip, an electrical signal is input, and each LED chip in a row or column of LED lamp groups is driven in sequence according to the timing, and a second electrical signal corresponding to the LED lamp group in the corresponding row or column is output according to the preset timing.

[0075] It is understandable that LED chips are light-emitting semiconductors with a response speed of microseconds. By controlling the length of time the electrical signal is input, the length of time the LED emits light is controlled, commonly known as the duty cycle. Figure 3As shown, an electrical signal is input to the LED, and the LED emits a light signal, which is then converted into an electrical signal through a photoelectric conversion device and then output. According to the light-emitting characteristics of the LED chip, after the square wave driving signal is input, the optical probe can collect the sinusoidal light signal of each LED chip, and after the sinusoidal light signal of the LED chip is photoelectrically converted, a second electrical signal with a square wave waveform and the same timing can be obtained.

[0076] In some embodiments, after photoelectric conversion, a threshold range is set based on a standard electrical signal. If the electrical signal after photoelectric conversion is within the threshold range of the standard electrical signal, the LED chip is determined to meet the requirements. For example, for a certain LED chip, the voltage value of the second electrical signal obtained by photoelectric conversion of the measured brightness signal is m, and the voltage of the standard electrical signal of the brightness parameter corresponding to the LED chip when it is normal is M, and the threshold range is set to ±5 volts. If M-5≤m≤M+5, the second electrical signal corresponding to the LED chip is corrected to the voltage value of the standard electrical signal, and it can be determined that the LED chip is a chip that meets the requirements. If m<M-5 or m>M+5, the actual voltage of the LED chip is displayed, and it can be determined that the LED chip has a dark or overbright defect and is a chip that does not meet the requirements.

[0077] In step S203, the terminal device compares and analyzes the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group.

[0078] In some embodiments, the standard electrical signal corresponding to the optical parameter is determined by the conversion relationship between the optical signal and the electrical signal; that is, under normal circumstances, the standard electrical signal corresponding to the illumination parameter of the collected LED chip is determined according to the conversion relationship between the illumination signal and the electrical signal, the standard electrical signal corresponding to the brightness parameter of the collected LED chip is determined according to the conversion relationship between the brightness signal and the electrical signal, and the standard electrical signal corresponding to the chromaticity parameter of the collected LED chip is determined according to the conversion relationship between the chromaticity signal and the electrical signal.

[0079] Among them, if the LED chip has light normal deviation or light distribution deviation, it will also affect the display effect of the LED product, and the LED chip will also be determined as a defective product. In the actual detection process, by obtaining the light signal corresponding to the different optical parameters of the LED chip, and performing photoelectric conversion on the light signal to obtain a second electrical signal; the second electrical signal is compared and analyzed with the standard electrical signal to identify the LED chips with the above defects in a row or column of LED light groups. For example, by collecting the brightness signal of the LED light group, performing photoelectric conversion on the brightness signal, obtaining the second electrical signal corresponding to the brightness signal, and comparing the standard electrical signal corresponding to the brightness parameter with the second signal, it is possible to detect LED chips with defects such as dark brightness, overbrightness or light normal deviation; for example, by obtaining the illumination signal, performing photoelectric conversion, and comparing the second electrical signal after the illumination signal is converted with the standard electrical signal corresponding to the illumination parameter, it is also possible to detect LED chips with defects such as light distribution deviation; thus, not only the dim LED chips can be identified, but also the accuracy of LED chip detection can be improved, providing a reliable data basis for subsequent maintenance and other work.

[0080] In some embodiments, the terminal device compares and analyzes the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group, including:

[0081] A1. The terminal device compares and analyzes the standard electrical signal corresponding to the optical parameter with the second electrical signal to determine a target value in the second electrical signal that does not match the standard electrical signal;

[0082] A2. The terminal device determines the position coordinates of the defective LED chip in the LED light group according to the time period corresponding to the target value in the preset timing.

[0083] In some embodiments, the preset timing sequence corresponding to the input first electrical signal and the converted second electrical signal corresponds to the position coordinates of each LED chip in the LED light group. Figure 4 Shown is a schematic diagram of an LED light panel and a light group provided in one embodiment of the present application. Figure 4 The LED chips are shown in the figure, R represents red chip, G represents green chip, B represents blue chip, N represents Nth column, and L represents Lth row. The LED chips of the same color in each row (or LED chips of three colors in the Lth row) can be tested as a LED light group, or the LED chips of three colors in each column (or LED chips of the same color) can be tested as a LED light group. Figure 4The position coordinates of each LED chip on the light board, 1-1-R corresponds to the red LED chip at the first row and the first column, 1-1-G corresponds to the green LED chip at the first row and the first column, 1-1-B corresponds to the blue LED chip at the first row and the first column, 1-NR corresponds to the red LED chip at the first row and the Nth column, L-1-R corresponds to the red LED chip at the Lth row and the first column, and so on. Each LED chip corresponds to a physical position coordinate.

[0084] See also Figure 5 , a schematic diagram of inputting an electrical signal to an LED light group provided by an embodiment of the present application. Figure 5 As shown in (a) and (b) of the figure, the preset timing of the input electrical signal corresponding to each row of LED light groups corresponds to the physical position coordinates of the LED chips in each row. For example, for the red LED light group in the first row, the input electrical signal or the output electrical signal in the time period t1 to t2 corresponds to the red LED chip at the position coordinate 1-1-R.

[0085] In some embodiments, the detection method further comprises:

[0086] According to the preset timing and the preset duty cycle, the terminal device compares the voltage value of the standard electrical signal with the voltage value of the second electrical signal; if there is a difference between the voltage value of the first electrical signal and the voltage value of the second electrical signal corresponding to the same time period in the preset timing, it is determined that the LED chip at the coordinate position corresponding to the time period is defective.

[0087] For example, the parameter for comparing the standard electrical signal with the second electrical signal may be a voltage value or a current value. If the LED chip is normal, then within the same time period of the preset timing, the voltage value or current value in the output second electrical signal should be equal to the voltage value or current value of the standard electrical signal. Figure 5 Figure (b) and Figure 6 As shown in Figure (a), if the LED chip meets the requirements, the output second electrical signal has the same waveform as the standard electrical signal; if they are not equal, Figure 6 As shown in Figures (b) and (c) in the figure, the LED chips that are lit in this time period do not meet the requirements, and the LED chips that do not meet the requirements are determined based on the position coordinates of the LED chips corresponding to this time period in the preset timing.

[0088] See also Figure 6 , a schematic diagram of waveform signal comparison of an LED light group provided by an embodiment of the present application. Figure 6As shown in Figure (a), when the LED light group is normal, the timing of the electrical signal input, the timing of the standard electrical signal, and the timing of the electrical signal after the collected light signal is photoelectrically converted correspond to each other, and the waveforms of the standard electrical signal and the electrical signal after photoelectric conversion are the same. Figure 6 As shown in Figure (b), the voltage value of the output electrical signal corresponding to the LED chip at the 1-3-R position and the LED chip at the 1-7-R position is different from the voltage value of the standard electrical signal, and the voltage value of the output electrical signal is zero. Figure 6 As shown in Figure (c), the voltage values ​​of the output electrical signals corresponding to the LED chips at the 1-4-R position and the 1-6-R position are different from the voltage values ​​of the standard electrical signals. If there is a difference in the voltage values, it is determined that the LED chips at the corresponding coordinate positions have defects such as no light, dim light, over light, light normal deviation, light distribution deviation, and color deviation.

[0089] In some embodiments, the terminal device compares and analyzes the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED light group, and further includes:

[0090] If the optical parameter is a brightness value, the first time period of the standard electrical signal in the preset timing corresponds to a standard voltage value, and the voltage value corresponding to the first time period of the second electrical signal in the preset timing is zero, then it is determined that the LED chip at the coordinate position corresponding to the first time period is not bright; if the voltage value of the second electrical signal corresponding to the second time period in the preset timing is greater than or less than the voltage value of the standard electrical signal, then it is determined that the brightness value of the LED chip at the coordinate position corresponding to the second time period is greater than or less than the standard brightness value.

[0091] In some embodiments, different optical parameters correspond to different photoelectric conversion relationships, and the corresponding standard electrical signal values ​​are also different; at the same time, the light signal values ​​of different optical parameters after collecting the LED chip lit by the same input electrical signal are also different. Figure 5 The first electrical signal of the first row of red LED light groups and the electrical signal for analysis and comparison are shown in (b) of FIG. 1 ; after the first row of red LED light groups are lit up by the same first electrical signal, optical signals of different optical parameters are collected by different optical analysis instruments, such as illuminance signal, light chromaticity signal and light brightness signal; the waveforms of the corresponding standard electrical signals corresponding to the optical signals of different optical parameters have the same timing, but the corresponding parameter values ​​are different, such as Figure 5 As shown in Figure (b), the standard electrical signal corresponding to the illuminance signal, the standard electrical signal corresponding to the chromaticity signal, and the standard electrical signal corresponding to the brightness signal have the same timing and different parameter values.

[0092] In addition, when the LED chip is normal, different optical parameters, in all time periods of the preset timing, the waveform of the second electrical signal is exactly the same as the waveform of the standard electrical signal, such as Figure 5 (b) shows the waveform of the electrical signal for comparative analysis.

[0093] like Figure 6 As shown in Figure (b), if the currently collected signal is the brightness signal of the LED chip, then in the preset timing, the voltage value of the output electrical signal corresponding to the time period from t3 to t4 and the time period from t7 to t8 is different from the voltage value of the standard electrical signal, and the voltage value of the output electrical signal is zero. Then, according to the corresponding relationship between the preset timing and the LED position coordinates, the red LED chips at the positioning position coordinates 1-3-R and 1-7-R are not bright, thereby detecting the LED chips that do not meet the requirements.

[0094] like Figure 6 As shown in Figure (c), if the currently collected signal is the brightness signal of the LED chip, then in the preset timing, the voltage value of the corresponding output electrical signal in the time period from t4 to t5 and the time period from t6 to t7 is different from the voltage value of the standard electrical signal, and the output electrical signal in the time period from t4 to t5 is less than the voltage value of the standard electrical signal, and the output electrical signal in the time period from t6 to t7 is greater than the voltage value of the standard electrical signal. According to the corresponding relationship between the preset timing and the LED position coordinates, the red LED chip at the positioning position coordinate 1-4-R is dim and the red LED chip at 1-6-R is too bright, thereby detecting the LED chip that does not meet the requirements.

[0095] In some embodiments, the terminal device compares and analyzes the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group, including:

[0096] If the optical parameter is an illumination signal, the standard electrical signal corresponding to the illumination signal is compared and analyzed with the second electrical signal to locate the LED chip with the light normal offset defect in the LED light group; if the optical parameter is a chromaticity signal, the standard electrical signal corresponding to the chromaticity signal is compared and analyzed with the second electrical signal to locate the LED chip with the light distribution offset defect in the LED light group.

[0097] For example, Figure 6The waveform comparison diagram shown in Figure (c) is also applicable to the electrical signals for comparison corresponding to the illumination signal and the chromaticity signal respectively in the optical parameters. In the preset timing, the voltage values ​​of the output electrical signals corresponding to the time periods t4 to t5 and t6 to t7 are different from the voltage values ​​of the standard electrical signals, and the output electrical signals in the time period t4 to t5 are less than the voltage values ​​of the standard electrical signals, and the output electrical signals in the time period t6 to t7 are greater than the voltage values ​​of the standard electrical signals. According to the corresponding relationship between the preset timing and the LED position coordinates, the red LED chips at the location coordinates 1-4-R and 1-6-R have defects such as light normal offset, light distribution offset or color irregularity, thereby detecting LED chips that do not meet the requirements.

[0098] It should be noted that Figure 6 The waveform diagrams of the input electrical signal, the standard electrical signal, and the electrical signal after the collected optical signal is converted into photoelectric form shown in the figure can represent the waveform corresponding to any optical parameter, such as the waveform diagrams of the standard electrical signal corresponding to the illuminance signal, the light brightness signal, or the electrical signal output after the photoelectric conversion. Figure 5 and Figure 6 The waveform diagrams of the input electrical signal, the standard electrical signal, and the electrical signal output after photoelectric conversion are only qualitative examples. The specific values ​​can be determined according to the photoelectric conversion relationship corresponding to the optical parameters. The above diagrams are only schematic illustrations and are not used to limit the process of comparative analysis in the detection method proposed in the embodiments of the present application.

[0099] Through this embodiment, after the control system inputs the first electrical signal to the LED light group and the LED light group is lit, the optical signal corresponding to the different optical parameters of the LED light group is obtained through the optical probe; the optical signal is photoelectrically converted to output a second electrical signal; the standard electrical signal corresponding to the optical parameter is compared and analyzed with the second electrical signal to locate the defective LED chip in the LED light group; by obtaining the light signal actually emitted by the LED chip and performing photoelectric conversion on the light signal to obtain the second electrical signal, the second electrical signal is compared and analyzed with the standard electrical signal corresponding to each optical parameter, not only the LED chip with the non-lighting defect in the LED light group can be located, but also the LED chips with other defects can be identified and located, for example, defects such as overbrightness, dim brightness, incorrect color, light normal deviation, and light distribution deviation, etc.; the accuracy of LED chip detection is greatly improved.

[0100] In addition, the micro-pitch chips are all independent patches of three colors: red, green, and blue (RGB). In actual applications, the position of each chip, the amount of solder paste used, and the reflow temperature are all different. The embodiments of the present application can be used to perform quantitative analysis on each chip; and the mass production of micro-pitch is mainly determined by the equipment accuracy and process level. The embodiments of the present application can also improve the process level, which can greatly improve the competitiveness of the product.

[0101] It should be noted that the embodiments of the present application are applicable to the optical measurement of all LED display screens, and are more suitable for the measurement of mini LEDs, micro LEDs and micro-pitch products, but are not limited to the measurement of micro-pitch products.

[0102] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0103] Corresponding to the LED chip detection method described in the above embodiment, Figure 7 A structural block diagram of an LED chip detection device provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0104] Reference Figure 7 , the device comprises:

[0105] An acquisition unit 71 is used for inputting a first electrical signal to the LED light group in the control system, lighting up the LED light group, and acquiring optical signals corresponding to different optical parameters of the LED light group through an optical probe;

[0106] The photoelectric conversion unit 72 is used to perform photoelectric conversion on the optical signal and output a second electrical signal;

[0107] The processing unit 73 is used to compare and analyze the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group.

[0108] An embodiment of the present application also provides a detection system for LED chips, comprising a control system, an LED light group, at least one optical probe and at least one processor; wherein the control system is used to input a first electrical signal into the LED light group; the at least one optical probe is used to obtain light signals corresponding to different optical parameters of the LED light group, and perform photoelectric conversion on the light signals to obtain second electrical signals; the at least one processor is used to compare and analyze the standard electrical signals corresponding to the optical parameters with the second electrical signals to locate defective LED chips in the LED light group.

[0109] It should be noted that the information interaction, execution process, etc. between the above-mentioned devices / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0110] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0111] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments can be implemented.

[0112] An embodiment of the present application provides a computer program product. When the computer program product runs on a mobile terminal, the mobile terminal can implement the steps in the above-mentioned method embodiments when executing the computer program product.

[0113] Figure 8 This is a schematic diagram of the structure of a terminal device 8 provided in an embodiment of the present application. Figure 8 As shown, the terminal device 8 of this embodiment includes: at least one processor 80 ( Figure 8 Only one is shown) a processor, a memory 81, and a computer program 82 stored in the memory 81 and executable on the at least one processor 80, wherein the processor 80 implements the steps in any of the above-mentioned detection method embodiments when executing the computer program 82; the terminal device 8 also includes at least one optical probe 83, which is used to obtain the light signal of the LED light group after the LED chip is lit, and perform photoelectric conversion on the light signal to obtain a second electrical signal.

[0114] The terminal device 8 may be a computing device such as a desktop computer, a notebook, a PDA, or a cloud server. The terminal device 8 may include, but is not limited to, a processor 80 and a memory 81. Those skilled in the art will appreciate that Figure 8 It is only an example of the terminal device 8 and does not constitute a limitation on the terminal device 8. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, etc.

[0115] The processor 80 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0116] In some embodiments, the memory 81 may be an internal storage unit of the terminal device 8, such as a hard disk or memory of the terminal device 8. In other embodiments, the memory 81 may also be an external storage device of the terminal device 8, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the terminal device 8. Further, the memory 81 may also include both an internal storage unit of the terminal device 8 and an external storage device. The memory 81 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of the computer program, etc. The memory 81 may also be used to temporarily store data that has been output or is to be output.

[0117] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium can at least include: any entity or device that can carry the computer program code to the camera / terminal device, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, RandomAccess Memory), electric carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a disk or an optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals and telecommunication signals.

[0118] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0119] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0120] In the embodiments provided in the present application, it should be understood that the disclosed devices / terminal equipment and methods can be implemented in other ways. For example, the device / terminal equipment embodiments described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0121] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0122] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for detecting an LED chip, characterized in that: The method comprises: The control system inputs a first electrical signal to the LED light group, and after the LED light group is lit, an optical probe is used to obtain optical signals corresponding to different optical parameters of the LED light group; wherein the optical probe is an optical device provided with a brightness meter, a colorimeter, an illuminance meter, a charge-coupled device image sensor, and a variety of optical analysis instruments in a single-lens reflex camera; Performing photoelectric conversion on the optical signal to output a second electrical signal; Comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED light group, including: if the optical parameter is an illumination signal, comparing and analyzing the standard electrical signal corresponding to the illumination signal with the second electrical signal to locate the LED chip in the LED light group with a light normal deviation defect; if the optical parameter is a chromaticity signal, comparing and analyzing the standard electrical signal corresponding to the chromaticity signal with the second electrical signal to locate the LED chip in the LED light group with a light distribution deviation defect; The first electrical signal is a square wave driving signal with a preset duty cycle; The control system inputs a first electrical signal to the LED light group, and after lighting the LED light group, an optical probe is used to obtain optical signals corresponding to different optical parameters of the LED light group, including: After the control system inputs the square wave driving signal with the preset duty cycle to the LED light group according to the preset timing, the light signal carrying the sine waveform in the LED light group is obtained through the optical probe; the preset timing corresponds to the timing of the light signal; the preset timing corresponds to the position coordinates of each LED chip in the LED light group; The method can realize the positioning and marking of LED chips with various defects such as dimming, over-brightness, incorrect color, light normal deviation and light distribution deviation; The performing photoelectric conversion on the optical signal to output a second electrical signal comprises: Performing photoelectric conversion on the light signal carrying a sinusoidal waveform in the LED light group to obtain the second electrical signal of the preset timing; The comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group includes: Comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal, and determining a target value in the second electrical signal that does not match the standard electrical signal; Determining the position coordinates of the defective LED chip in the LED lamp group according to the time period corresponding to the target value in the preset time sequence; The method further comprises: Comparing the voltage value of the standard electrical signal with the voltage value of the second electrical signal according to the preset timing and the preset duty cycle; If there is a difference between the voltage value of the first electrical signal and the voltage value of the second electrical signal corresponding to the same time period in the preset time sequence, it is determined that the LED chip at the coordinate position corresponding to the time period is defective.

2. The method according to claim 1, characterized in that After obtaining the optical signals corresponding to the different optical parameters of the LED light group through the optical probe, the method further includes: According to preset standard optical parameters, data calibration is performed on the optical signal to obtain a calibrated optical signal.

3. The method according to claim 1, characterized in that The comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group further includes: If the optical parameter is a brightness signal, the first time period of the standard electrical signal in the preset time sequence corresponds to a standard voltage value, and the voltage value of the second electrical signal in the first time period in the preset time sequence is zero, it is determined that the LED chip at the coordinate position corresponding to the first time period is not lit; If the voltage value of the second electrical signal corresponding to the second time period in the preset timing is greater than or less than the voltage value of the standard electrical signal, it is determined that the brightness value of the LED chip at the coordinate position corresponding to the second time period is greater than or less than the standard brightness value.

4. A detection device for LED chips, characterized in that: include: An acquisition unit is used for inputting a first electrical signal to the LED light group in the control system, and after lighting the LED light group, acquiring light signals corresponding to different optical parameters of the LED light group through an optical probe; the first electrical signal is a square wave driving signal with a preset duty cycle; wherein the optical probe is an optical device provided with a brightness meter, a colorimeter, an illuminance meter, a charge-coupled device image sensor, and a variety of optical analysis instruments in a single-lens reflex camera; a photoelectric conversion unit, configured to perform photoelectric conversion on the optical signal and output a second electrical signal; A processing unit, used for comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal, and locating the defective LED chip in the LED light group, including: if the optical parameter is an illumination signal, then comparing and analyzing the standard electrical signal corresponding to the illumination signal with the second electrical signal, and locating the LED chip with the light normal deviation defect in the LED light group; if the optical parameter is a chromaticity signal, then comparing and analyzing the standard electrical signal corresponding to the chromaticity signal with the second electrical signal, and locating the LED chip with the light distribution deviation defect in the LED light group; after the control system inputs the first electrical signal to the LED light group and lights up the LED light group, obtaining the light signals corresponding to different optical parameters of the LED light group through the optical probe, including: after the control system inputs the square wave driving signal with the preset duty cycle to the LED light group according to the preset timing, obtaining the light signal carrying a sine waveform in the LED light group through the optical probe; the preset timing corresponds to the timing of the light signal; the preset timing corresponds to the position coordinates of each LED chip in the LED light group; The device can realize the positioning and marking of LED chips with various defects such as dimming, over-brightness, incorrect color, light normal deviation and light distribution deviation; The performing photoelectric conversion on the optical signal to output a second electrical signal comprises: Performing photoelectric conversion on the light signal carrying a sinusoidal waveform in the LED light group to obtain the second electrical signal of the preset timing; The comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group includes: Comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal, and determining a target value in the second electrical signal that does not match the standard electrical signal; Determining the position coordinates of the defective LED chip in the LED lamp group according to the time period corresponding to the target value in the preset time sequence; The device is also used for: Comparing the voltage value of the standard electrical signal with the voltage value of the second electrical signal according to the preset timing and the preset duty cycle; If there is a difference between the voltage value of the first electrical signal and the voltage value of the second electrical signal corresponding to the same time period in the preset time sequence, it is determined that the LED chip at the coordinate position corresponding to the time period is defective.

5. A LED chip detection system, characterized in that: It includes a control system, an LED light group, at least one optical probe and at least one processor; wherein, The control system is used to input a first electrical signal to the LED light group; the control system is specifically used to input a square wave driving signal with a preset duty cycle to the LED light group according to a preset timing, and the first electrical signal is a square wave driving signal with a preset duty cycle; The at least one optical probe is used to obtain light signals corresponding to different optical parameters of the LED light group, and perform photoelectric conversion on the light signals to output a second electrical signal; the at least one optical probe is specifically used to obtain the light signal carrying a sinusoidal waveform in the LED light group after the control system inputs the square wave driving signal with the preset duty cycle to the LED light group according to the preset timing; the preset timing corresponds to the timing of the light signal; the preset timing corresponds to the position coordinates of each LED chip in the LED light group; wherein the optical probe is an optical device provided with a brightness meter, a colorimeter, an illuminance meter, a charge-coupled device image sensor, and a variety of optical analysis instruments in a SLR camera; The at least one processor is used to compare and analyze the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED light group, including: if the optical parameter is an illumination signal, then comparing and analyzing the standard electrical signal corresponding to the illumination signal with the second electrical signal to locate the LED chip with the light normal deviation defect in the LED light group; if the optical parameter is a chromaticity signal, then comparing and analyzing the standard electrical signal corresponding to the chromaticity signal with the second electrical signal to locate the LED chip with the light distribution deviation defect in the LED light group; The system can realize the positioning and marking of LED chips with various defects such as dimming, over-brightness, incorrect color, light normal deviation and light distribution deviation; The performing photoelectric conversion on the optical signal to output a second electrical signal comprises: Performing photoelectric conversion on the light signal carrying a sinusoidal waveform in the LED light group to obtain the second electrical signal of the preset timing; The comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal to locate the defective LED chip in the LED lamp group includes: Comparing and analyzing the standard electrical signal corresponding to the optical parameter with the second electrical signal, and determining a target value in the second electrical signal that does not match the standard electrical signal; Determining the position coordinates of the defective LED chip in the LED lamp group according to the time period corresponding to the target value in the preset time sequence; The system is also used to: Comparing the voltage value of the standard electrical signal with the voltage value of the second electrical signal according to the preset timing and the preset duty cycle; If there is a difference between the voltage value of the first electrical signal and the voltage value of the second electrical signal corresponding to the same time period in the preset time sequence, it is determined that the LED chip at the coordinate position corresponding to the time period is defective.

6. A terminal device, characterized in that: The method comprises at least one optical probe, a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the method according to any one of claims 1 to 3 when executing the computer program.

7. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method according to any one of claims 1 to 3 is implemented.

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