A multi-chip packaging structure for microwave communication

Abstract

The present invention discloses a multi-chip packaging structure for microwave communication, and relates to the field of microwave communication technology. A multi-chip packaging structure for microwave communication comprises a heat dissipation substrate, a chip is arranged on the top of the heat dissipation substrate, a packaging shell is fixedly connected to the top of the heat dissipation substrate, a limiting frame is fixedly connected to the top of the heat dissipation substrate, the chip is located inside the limiting frame, a bottom plate is fixedly connected to the top of the heat dissipation substrate, the bottom plate is adapted to the limiting frame, and a plurality of second through grooves are provided on both sides of the top of the bottom plate, and the second through grooves are distributed at equal distances. The present invention can make the heat dissipation glue fit closely with the bottom plate through the cooperation of the limiting frame, the bottom plate, the first through groove and the second through groove, and increase the contact area of ​​the heat dissipation glue, thereby making it difficult for the heat dissipation glue and the chip to be delaminated, and improve the coverage of the heat dissipation glue on the chip, thereby enhancing the thermal conductivity of the product.

Description

Technical Field

[0001] The present invention relates to the technical field of microwave communication, in particular to a multi-chip packaging structure for microwave communication. Background Art

[0002] With the development of technology, the computing speed of chips has increased significantly, and the functions have become increasingly rich. The heat energy generated by the operation of the chips has also increased accordingly. Therefore, the chip package urgently needs to solve its heat dissipation problem.

[0003] Mounting a heat sink cover is currently an effective way to solve the chip heat dissipation problem. However, the traditional packaging structure is to superimpose the heat sink cover and the chip on a flat surface through heat sink glue. This simple flat superposition makes the bonding between the heat sink glue and the chip very "fragile". Because the heat sink glue itself does not have strong bonding force, and in the subsequent heat treatment process of chip packaging, the material is frequently deformed by heat, so the heat sink glue is very likely to be delaminated in the area around the chip. This delamination greatly reduces the coverage of the heat sink glue on the chip, thereby seriously affecting the thermal conductivity of the product. Summary of the invention

[0004] The object of the present invention is to provide a multi-chip packaging structure for microwave communication to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a multi-chip packaging structure for microwave communication, comprising a heat dissipation substrate, a chip is arranged on the top of the heat dissipation substrate, a packaging shell is fixedly connected to the top of the heat dissipation substrate, a limiting frame is fixedly connected to the top of the heat dissipation substrate, the chip is located inside the limiting frame, a bottom plate is fixedly connected to the top of the heat dissipation substrate, the bottom plate is adapted to the limiting frame, a plurality of second through grooves are opened on both sides of the top of the bottom plate, the second through grooves are distributed at equal distances, a plurality of first through grooves are opened on the front and back sides of the bottom plate, the first through grooves are distributed at equal distances, a plurality of fixing plates are arranged on both sides of the top of the bottom plate, the fixing plates are all located in the second through grooves, a plurality of connecting rods are fixedly connected to the outside of the fixing plates, one end of the connecting rods is fixedly connected to the bottom plate, and a plurality of through holes are evenly opened on the top of the bottom plate.

[0006] Preferably, a plurality of fixing blocks are fixedly connected to both sides of the top of the limiting frame, a heat sink foot is fixedly connected to the top of the fixing block, and a plurality of sliding grooves are provided on both sides of the top of the packaging shell, and the sliding grooves are adapted to the heat sink foot.

[0007] Preferably, strip grooves are provided on both sides of the bottom of the packaging shell, and the strip grooves are matched with the heat sink.

[0008] Preferably, a plurality of pins are fixedly connected to the bottom of the chip, and the pins are adapted to the through holes.

[0009] Preferably, a plurality of pin holes are evenly formed on the bottom of the heat dissipation substrate, and a plurality of wiring balls are fixedly connected to the bottom of the heat dissipation substrate.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] (1) The multi-chip packaging structure for microwave communication can make the heat dissipation adhesive fit closely with the bottom plate through the cooperation of the setting limit frame, the bottom plate, the first through groove and the second through groove, and increase the contact area of ​​the heat dissipation adhesive so that it is difficult for the heat dissipation adhesive and the chip to be delaminated, thereby increasing the coverage rate of the heat dissipation adhesive on the chip, thereby enhancing the thermal conductivity of the product.

[0012] (2) The multi-chip packaging structure for microwave communication can enhance the heat dissipation performance and improve the heat dissipation efficiency by setting a limit frame, heat dissipation feet and heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a front structural schematic diagram of the present invention;

[0014] Figure 2 It is a schematic diagram of the shaft side structure of the present invention;

[0015] Figure 3 It is a schematic diagram of the disassembled front structure of the present invention after removing the heat dissipation substrate;

[0016] Figure 4 For the present invention Figure 3 Schematic diagram of the axial structure;

[0017] Figure 5 It is a schematic diagram of the axial side structure of the limit frame of the present invention;

[0018] Figure 6 It is a schematic diagram of the axial structure of the bottom plate of the present invention;

[0019] Figure 7 It is a schematic diagram of the enlarged structure of part A of the present invention.

[0020] In the figure: 1, heat dissipation substrate; 101, wiring ball; 2, packaging shell; 3, chip; 4, limit frame; 401, heat sink; 402, fixing block; 403, heat dissipation foot; 5, bottom plate; 501, first through groove; 502, second through groove; 503, through hole; 504, fixing plate; 505, connecting rod. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that, in the description of the present invention, the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0023] Furthermore, it should be understood that for the sake of ease of description, the sizes of the various components shown in the drawings are not drawn according to actual proportions. For example, the thickness or width of certain layers may be exaggerated relative to other layers.

[0024] It should be noted that like reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined or described in one drawing, it will not require further detailed discussion and description in the description of the subsequent drawings.

[0025] like Figure 1-7 As shown, the present invention provides a technical solution: a multi-chip packaging structure for microwave communication, including a heat dissipation substrate 1, a chip 3 is arranged on the top of the heat dissipation substrate 1, the chip 3 is a microwave radio frequency chip, the microwave radio frequency chip is a component of a microwave radio frequency integrated circuit, and is a core technology in the field of wireless communication, a packaging shell 2 is fixedly connected to the top of the heat dissipation substrate 1, a limiting frame 4 is fixedly connected to the top of the heat dissipation substrate 1, the limiting frame 4 is made of heat dissipation material, the chip 3 is located inside the limiting frame 4, a bottom plate 5 is fixedly connected to the top of the heat dissipation substrate 1, the bottom plate 5 is adapted to the limiting frame 4, a plurality of second through grooves 502 are opened on both sides of the top of the bottom plate 5, and the number of the second through grooves 502 is 6, and the second through grooves 502 are semicircular, and the second through grooves 502 are equidistantly distributed. The front and back sides of the base plate 5 are provided with multiple first through grooves 501, and the first through grooves 501 are equidistantly distributed. The number of the first through grooves 501 is 11, and the first through grooves 501 are semi-slot shaped. Multiple fixing plates 504 are arranged on both sides of the top of the base plate 5, and the fixing plates 504 are all located in the second through grooves 502. Multiple connecting rods 505 are fixedly connected to the outside of the fixing plates 504, and one end of the connecting rods 505 is fixedly connected to the base plate 5. A plurality of through holes 503 are evenly opened on the top of the base plate 5, and the pins at the bottom of the chip 3 can pass through the through holes 503, so as to facilitate the wiring operation.

[0026] Among them, multiple fixing blocks 402 are fixedly connected on both sides of the top of the limit frame 4, and heat sink feet 403 are fixedly connected on the top of the fixing blocks 402, which can improve the heat dissipation effect and enable the heat to be conducted to the heat dissipation substrate 1 as quickly as possible, so that the chip 3 can operate at a high speed. Multiple sliding grooves are provided on both sides of the top of the packaging shell 2, and the sliding grooves are adapted to the heat dissipation feet 403. Strip grooves are provided on both sides of the bottom of the packaging shell 2, and the strip grooves are adapted to the heat dissipation fins 401, so that the packaging shell 2 can be tightly attached to the heat dissipation substrate 1 and will not be blocked by the heat dissipation fins 401. Multiple pins are fixedly connected to the bottom of the chip 3, and the pins are adapted to the through holes 503. Multiple pin holes are evenly provided at the bottom of the heat dissipation substrate 1, and the pin holes are adapted to the pins at the bottom of the chip 3, thereby facilitating wiring operations. Multiple wiring balls 101 are fixedly connected to the bottom of the heat dissipation substrate 1, and the wiring balls 101 are solder balls that can be directly soldered to the circuit board, which is firmly fixed and simple to operate.

[0027] When the chip 3 is packaged with the heat dissipation substrate 1, the heat dissipation glue is first sprayed between the limit frame 4 and the chip 3, and the heat dissipation glue further flows to the base plate 5. Due to the provision of the first through groove 501, the heat dissipation glue flows into the first through groove 501, and the heat dissipation glue further flows into the second through groove 502, so that the heat dissipation glue covers the first through groove 502 and the gap between the connecting rod 505, thereby increasing the coverage area of ​​the heat dissipation glue and improving the retention ability of the heat dissipation glue, making it difficult for the heat dissipation glue to fall off, and making it difficult for the heat dissipation glue and the chip 3 to be delaminated. The provision of the limit frame 4, the heat dissipation foot 403 and the heat sink 401 can enhance the heat dissipation performance and improve the heat dissipation efficiency.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-chip packaging structure for microwave communication, comprising a heat dissipation substrate (1), a chip (3) being arranged on the top of the heat dissipation substrate (1), and a packaging shell (2) being fixedly connected to the top of the heat dissipation substrate (1), characterized in that: The top of the heat dissipation substrate (1) is fixedly connected to a limiting frame (4), the chip (3) is located inside the limiting frame (4), the top of the heat dissipation substrate (1) is fixedly connected to a bottom plate (5), the bottom plate (5) is adapted to the limiting frame (4), a plurality of second through slots (502) are provided on both sides of the top of the bottom plate (5), the second through slots (502) are distributed at equal distances, a plurality of first through slots (501) are provided on the front and back of the bottom plate (5), the first through slots (501) are distributed at equal distances, a plurality of fixing plates (504) are provided on both sides of the top of the bottom plate (5), the fixing plates (504) are all located in the second through slots (502), a plurality of connecting rods (505) are fixedly connected to the outside of the fixing plates (504), one end of the connecting rods (505) is fixedly connected to the bottom plate (5), and a plurality of through holes (503) are evenly provided on the top of the bottom plate (5).

2. The multi-chip package structure for microwave communication according to claim 1, characterized in that: A plurality of fixed blocks (402) are fixedly connected to both sides of the top of the limit frame (4), a heat sink (403) is fixedly connected to the top of the fixed blocks (402), and a plurality of sliding grooves are provided on both sides of the top of the packaging shell (2), and the sliding grooves are compatible with the heat sink (403).

3. The multi-chip package structure for microwave communication according to claim 1, characterized in that: Both sides of the bottom of the packaging shell (2) are provided with strip grooves, and the strip grooves are matched with the heat sink (401).

4. The multi-chip package structure for microwave communication according to claim 1, characterized in that: A plurality of pins are fixedly connected to the bottom of the chip (3), and the pins are adapted to the through holes (503).

5. The multi-chip package structure for microwave communication according to claim 1, characterized in that: A plurality of pin holes are evenly arranged on the bottom of the heat dissipation substrate (1), and a plurality of wiring balls (101) are fixedly connected to the bottom of the heat dissipation substrate (1).

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