Chip ejection structure

Abstract

The present invention discloses a chip ejection structure for ejecting at least one chip of a wafer attached to a carrier plate to facilitate subsequent processes. The chip ejection structure comprises a cylinder, an ejection module, a displacement limit module and a reset member. The positioning carrier of the cylinder is fixed in the cylinder. The displacement limit module and the reset member are used to control the displacement amount of the ejection member of the ejection module to eject the chip, so as to separate the chip from the wafer.

Description

Technical Field

[0001] The invention relates to a chip ejection structure, in particular to a chip ejection structure for controlling the ejection displacement of a wafer. Background Art

[0002] Please refer to Taiwan Invention Patent Application No. 101147959 "Chip Separation Device", which discloses that the third abutting module 140 and the spacer 160 are movably arranged in the accommodating groove A. When the third transmission member 142 of the third abutting module 140 moves upward, the third transmission member 142 will push the second elastic member 170, and the second elastic member 170 will push the spacer 160 at the same time, thereby causing the displacement of the third abutting module 140 to be difficult to control.

[0003] When the displacement of the third abutting module 140 is insufficient, the chip 310 of the wafer 300 cannot be separated from the wafer 300 , or the chip 310 separated from the wafer 300 is still attached to the adhesive layer 400 over a large area, which is not conducive to the vacuum nozzle 500 sucking the chip 310 .

[0004] Alternatively, when the displacement of the third abutting module 140 is too large, the area of ​​the chip 310 separated from the wafer 300 attached to the adhesive layer 400 will be too small, so the chip 310 may be separated from the adhesive layer 400 and fall off before the vacuum nozzle 500 absorbs the chip 310. Summary of the invention

[0005] The main purpose of the present invention is to control the displacement of the chip of the wafer by the pushing member of the pushing module through the displacement limiting module, so as to separate the chip from the wafer and facilitate the vacuum suction nozzle to suck the chip.

[0006] A chip ejection structure of the present invention comprises a cylinder, a push module, a displacement limit module and a reset member, the cylinder having a cylinder wall, a accommodating space, an opening and a positioning platform, the accommodating space is connected to the opening, the positioning platform is located in the accommodating space, and the positioning platform is fixed to the cylinder wall, the positioning platform divides the accommodating space into a first accommodating space and a second accommodating space, the push module is arranged in the first accommodating space, the push module has a push rod and a push member, the push member is combined with the first end of the push rod, and the push member is used to The chip is pushed, and the displacement limit module is movably arranged in the second accommodating space. The displacement limit module has a pushed platform and a coupling member. The end portion of the coupling member is coupled to the second end portion of the push rod. The displacement limit module can be pushed by the driving member to move toward the positioning platform so that the coupling member pushes the push rod and the pushing member pushes the chip. The reset member is arranged between the positioning platform and the pushed platform. The reset member is used to push the displacement limit module so that the positioning platform and the pushed platform have a variable spacing.

[0007] Furthermore, the positioning platform has a first action hole, and the push rod or the combining member is movably inserted into the first action hole.

[0008] Furthermore, the reset member includes a first compression spring, one end of the first compression spring abuts against the positioning platform, the other end of the first compression spring abuts against the pushed platform, and the first compression spring surrounds the coupling member.

[0009] Furthermore, the displacement limit module also includes a push plate, the reset member includes a second compression spring, the push plate is combined with the combining member, and the push plate is limited between the positioning platform and the pushed platform, one end of the second compression spring abuts against the positioning platform, and the other end abuts against the push plate, and the second compression spring surrounds the combining member.

[0010] Furthermore, the pushed platform has a first through hole, the aperture of which is larger than the outer diameter of the head of the coupling member, and the head of the coupling member is located in the first through hole.

[0011] Furthermore, the head protrudes from a surface of the pushed platform, and the surface faces the driving member.

[0012] Further, the pushed plate abuts against the head of the coupling member, and the pushed plate is limited between the positioning platform and the head.

[0013] Furthermore, the thrust plate has a third through hole, the coupling piece is movably disposed through the third through hole, and the aperture of the third through hole is smaller than the outer diameter of the head of the coupling piece.

[0014] Furthermore, the second end of the push rod is provided with a first screw hole, the terminal end of the coupling member has an external thread, and the terminal end of the coupling member is screwed into the first screw hole.

[0015] Furthermore, the pushing module has a shell, which is arranged in the first accommodating space, the push rod and the pushing member are arranged in the shell, and the displacement limiting module also has at least one guide column, the positioning platform has a second action hole, and the pushed platform has a second through hole, the guide column is movably penetrated through the second through hole and the second action hole, and the joint of the guide column is combined with the shell, the outer diameter of the head of the guide column is not less than the inner diameter of the second through hole, so that the head of the guide column is restricted outside the pushed platform, and the pushed platform is combined with the positioning platform by the guide column.

[0016] Furthermore, the housing is provided with a second screw hole, the engaging portion of the guide column has an external thread, and the engaging portion is screwed into the second screw hole.

[0017] Furthermore, the reset member includes a third compression spring, the third compression spring surrounds the guide column, one end of the third compression spring abuts against the pushed platform, and the other end of the third compression spring abuts against the shell through the second through hole.

[0018] Furthermore, the shell is movably disposed in the first accommodating space, and the shell can be selectively moved close to the opening or away from the opening.

[0019] Furthermore, the barrel includes a first barrel portion and a second barrel portion, the first barrel portion and the second barrel portion are independent entities, the second barrel portion is combined with the first barrel portion, the first barrel portion surrounds the first accommodating space, and the second barrel portion surrounds the second accommodating space.

[0020] Furthermore, the positioning platform is provided with the second cylindrical portion.

[0021] Furthermore, the chip ejection structure also includes a cover, which covers the opening, and the cover has at least one first ventilation hole, the first ventilation hole is connected to the first accommodating space, the positioning platform has at least one second ventilation hole, the second ventilation hole is connected to the first accommodating space and the second accommodating space, the pushed platform has at least one third ventilation hole, and the first ventilation hole, the first accommodating space, the second ventilation hole, the second accommodating space and the third ventilation hole constitute a ventilation channel.

[0022] The present invention controls the displacement of the chip lifted by the pushing member of the pushing module by means of the variable spacing between the positioning platform and the pushed platform, so as to avoid the problem caused by insufficient or excessive displacement of the chip pushed by the pushing member. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:

[0024] Figure 1 A schematic diagram showing a chip ejection structure and a driving component assembly according to an embodiment of the present invention is shown;

[0025] Figure 2 A schematic diagram of an exploded view of a chip ejection structure and a driving component according to an embodiment of the present invention is shown;

[0026] Figure 3 An exploded schematic diagram of a chip ejection structure according to an embodiment of the present invention is shown;

[0027] Figure 4 A cross-sectional schematic diagram showing a chip ejection structure and a driving component according to an embodiment of the present invention is shown;

[0028] Figure 5 A schematic cross-sectional view of a chip ejection structure according to an embodiment of the present invention is shown;

[0029] Figure 6 A schematic three-dimensional cross-sectional view of a cylinder of a chip ejection structure according to an embodiment of the present invention is shown;

[0030] Figure 7 A three-dimensional cross-sectional schematic diagram of a cylinder of a chip ejection structure according to another embodiment of the present invention is shown.

[0031]

Explanation of symbols

[0032] 10: Carrier 20: Wafer

[0033] 21: Chip 100: Chip ejection structure

[0034] 110: cylinder 110a: first cylinder part

[0035] 110b: Second cylindrical portion 111: Cylindrical wall

[0036] 112: Accommodation space 112a: First accommodation space

[0037] 112b: second accommodation space 113: opening

[0038] 114: Positioning stage 114a: First action hole

[0039] 114b: second operating hole 114c: second ventilation hole

[0040] 120: Push module 121: Push rod

[0041] 121a: first end 121b: second end

[0042] 121c: first screw hole 122: push piece

[0043] 123: housing 123a: second screw hole

[0044] 130: Displacement limit module 131: Pushed platform

[0045] 131a: first through hole 131b: second through hole

[0046] 131c: third vent hole 131d: surface

[0047] 132: Connecting piece 132a: Head

[0048] 132b: terminal end 133: push plate

[0049] 133a: third through hole 134: guide post

[0050] 134a: Joint 134b: Head

[0051] 140: reset element 141: first compression spring

[0052] 142: Second compression spring 143: Third compression spring

[0053] 150: Cover 151: First vent hole

[0054] 200: Driving parts DETAILED DESCRIPTION

[0055] See also Figure 1 , Figure 2 and Figure 4 In one embodiment of the present invention, a chip ejection structure 100 is used to lift at least one chip 21 of a wafer 20 attached to a carrier 10 to facilitate subsequent processes (such as pick-and-place handling and flip-chip processes, etc.).

[0056] See also Figure 1 , Figure 3 and Figure 4 The chip ejection structure 100 includes a cylinder 110, a push module 120, a displacement limit module 130 and a reset member 140. The cylinder 110 has a cylinder wall 111, a receiving space 112, an opening 113 and a positioning platform 114. The receiving space 112 is connected to the opening 113. The positioning platform 114 is located in the receiving space 112 and is fixed to the cylinder wall 111. The positioning platform 114 divides the receiving space 112 into a first receiving space 112a and a second receiving space 112b. Preferably, the chip ejection structure 100 further includes a cover 150. The cover 150 covers the opening 113. The cover 150 has at least one first vent hole 151. The first vent hole 151 is connected to the first receiving space 112a. The first vent hole 151 is used to adsorb the carrier 10 with the wafer 20 attached thereto.

[0057] See also Figure 3 , Figure 4 and Figure 6 The barrel 110 includes a first barrel portion 110a and a second barrel portion 110b. In this embodiment, the first barrel portion 110a and the second barrel portion 110b are independent entities. Alternatively, please refer to Figure 7 In different embodiments, the barrel 110 is integrally formed, and the first barrel portion 110 a and the second barrel portion 110 b are two parts of the barrel 110 .

[0058] See also Figure 3 , Figure 4 , Figure 5 and Figure 6 In the present embodiment, the first barrel portion 110a and the second barrel portion 110b are described as independent entities, but the present invention is not limited thereto. The second barrel portion 110b is combined with the first barrel portion 110a, the first barrel portion 110a surrounds the first accommodating space 112a, the second barrel portion 110b surrounds the second accommodating space 112b, and the positioning platform 114 is provided with the second barrel portion 110b.

[0059] See also Figure 3 and Figure 4 The pushing module 120 is disposed in the first accommodating space 112a. The pushing module 120 has a push rod 121 and a push member 122. The push member 122 is combined with the first end 121a of the push rod 121. In different embodiments, the push rod 121 and the push member 122 can be integrally formed. The push member 122 is used to push the carrier 10 attached to the wafer 20 so that the chip 21 of the wafer 20 is separated from the wafer 20. In this embodiment, the pushing module 120 also has a shell 123. The shell 123 is disposed in the first accommodating space 112a. The pushing module 120 is combined with the shell 123 and the push rod 121 and the push member 122 are disposed in the shell 123.

[0060] See also Figure 3 , Figure 4 and Figure 5 The displacement limiting module 130 is movably disposed in the second accommodating space 112b. The displacement limiting module 130 has a pushed platform 131 and a coupling member 132. The end portion 132b of the coupling member 132 is coupled to the second end portion 121b of the push rod 121. In this embodiment, the positioning platform 114 has a first action hole 114a. The push rod 121 or the coupling member 132 is movably penetrated in the first action hole 114a. Preferably, the positioning platform 114 has at least one second ventilation hole 114c. The second ventilation hole 114c communicates with the first accommodating space 112a and the second accommodating space 112b. Please refer to Figure 1 , Figure 2 and Figure 4 The displacement limiting module 130 can be pushed by the driving member 200 and move toward the positioning platform 114, so that the coupling member 132 pushes the push rod 121, and the pushing member 122 pushes the carrier 10 attached to the wafer 20, so that the chip 21 of the wafer 20 is separated from the wafer 20.

[0061] See also Figure 3 and Figure 4 The reset member 140 is disposed between the positioning platform 114 and the pushed platform 131. The reset member 140 is used to push the displacement limiting module 130 so that a variable distance exists between the positioning platform 114 and the pushed platform 131. In this embodiment, the reset member 140 includes one of the first compression spring 141, the second compression spring 142 and the third compression spring 143, or the reset member 140 includes the first compression spring 141, the second compression spring 142 and the third compression spring 143, that is, the reset member 140 may include the first compression spring 141 and the second compression spring 142, or, the reset member 140 may include the first compression spring 141 and the third compression spring 143, or, the reset member 140 may include the second compression spring 142 and the third compression spring 143, or, the reset member 140 may include the first compression spring 141, the second compression spring 142 and the third compression spring 143.

[0062] See also Figure 3 and Figure 4 When the restoring member 140 includes the first compression spring 141 , one end of the first compression spring 141 abuts against the positioning platform 114 , and the other end abuts against the pushed platform 131 , and the first compression spring 141 surrounds the coupling member 132 .

[0063] See also Figure 3 , Figure 4 and Figure 5When the reset member 140 includes the second compression spring 142, the displacement limiting module 130 further includes a push plate 133, the push plate 133 is combined with the combining member 132, and the push plate 133 is limited between the positioning platform 114 and the pushed platform 131, one end of the second compression spring 142 abuts against the positioning platform 114, the other end of the second compression spring 142 abuts against the push plate 133, and the second compression spring 142 surrounds the combining member 132. In this embodiment, the pushed platform 131 has a first through hole 131a, and the aperture of the first through hole 131a is larger than the head 114 of the combining member 132. 32a, the head 132a of the coupling member 132 is located in the first through hole 131a, preferably, the pushed plate 133 abuts against the head 132a of the coupling member 132, the pushed plate 133 is limited between the positioning platform 114 and the head 132a, the pushed plate 133 has a third through hole 133a, the coupling member 132 is movably penetrated by the third through hole 133a, the aperture of the third through hole 133a is smaller than the outer diameter of the head 132a of the coupling member 132, and the head 132a protrudes from the surface 131d of the pushed platform 131, and the surface 131d faces the driving member 200.

[0064] See also Figure 3 , Figure 4 and Figure 5 In this embodiment, the reset member 140 includes the first compression spring 141 and the second compression spring 142. When the driving member 200 moves toward the positioning platform 114, the driving member 200 first contacts the head 132a of the coupling member 132 and pushes the coupling member 132. The coupling member 132 pushes the push rod 121, so that the push member 122 protrudes from the cover 150. The push member 122 protruding from the cover 150 pushes the carrier 10 to form a first push action, pushing the top of the carrier 10. The pushing member 122 forces the chip 21 to break away from the wafer 20. Preferably, the pushed platform 131 has at least one third ventilation hole 131c. The first ventilation hole 151, the first accommodating space 112a, the second ventilation hole 114c, the second accommodating space 112b and the third ventilation hole 131c constitute a ventilation channel. The suction device (not shown) absorbs the carrier 10 to the cover 150 through the ventilation channel to prevent the carrier 10 from shifting when the pushing member 122 pushes the carrier 10 and the chip 21.

[0065] See also Figure 3 and Figure 4The second end portion 121b of the push rod 121 is provided with a first screw hole 121c, and the terminal portion 132b of the coupling member 132 has an external thread. The terminal portion 132b of the coupling member 132 is screwed into the first screw hole 121c. By adjusting the coupling depth between the coupling member 132 and the first screw hole 121c, the displacement of the push rod 121 of the pushing module 120 and the pushing member 122 pushing the chip can be adjusted, so that the chip 21 is separated from the wafer 20, so as to facilitate the vacuum suction nozzle (not shown) to suck the chip.

[0066] See also Figure 3 and Figure 4 The displacement limiting module 130 also has at least one guide column 134, the positioning platform 114 has a second action hole 114b, the pushed platform 131 has a second through hole 131b, the guide column 134 is movably penetrated in the second through hole 131b and the second action hole 114b, and the engaging portion 134a of the guide column 134 is combined with the shell 123. In this embodiment, the shell 123 is provided with a second screw hole 123a, and the engaging portion 134a of the guide column 134 has an external thread, and the engaging portion 134a is screwed into the second screw hole 123a. By adjusting the combining depth of the guide column 134 and the second screw hole 123a, the displacement amount of the push rod 121 of the pushing module 120 and the pushing member 122 pushing the chip can be adjusted.

[0067] See also Figure 3 and Figure 4 The outer diameter of the head 134 b of the guide post 134 is not less than the inner diameter of the second through hole 131 b, so that the head 134 b of the guide post 134 is restricted outside the pushed platform 131 , and the pushed platform 131 is combined with the positioning platform 114 through the guide post 134 .

[0068] See also Figure 3 and Figure 4 When the driving member 200 moves toward the positioning platform 114 and pushes the connecting member 132, if the driving member 200 continues to move toward the positioning platform 114, the driving member 200 will then contact and push the pushed platform 131, so that the pushed platform 131 and the connecting member 132 rise synchronously to form a second pushing action.

[0069] See also Figure 3 and Figure 4When the return member 140 includes the third compression spring 143, the third compression spring 143 surrounds the guide column 134, and one end of the third compression spring 143 abuts against the pushed platform 131, and the other end of the third compression spring 143 abuts against the shell 123 through the second action hole 114b. In the present embodiment, the shell 123 is movably disposed in the first accommodating space 112a, and the shell 123 can be selectively close to the opening 113 or away from the opening 113.

[0070] See also Figure 3 and Figure 4 When the driving member 200 moves toward the positioning platform 114 and pushes the coupling member 132 and the pushed platform 131, if the driving member 200 continues to move toward the positioning platform 114, the driving member 200 will then contact and push the guide column 134, so that the pushed platform 131, the coupling member 132, the guide column 134, the shell 123 and the pushing module 120 rise synchronously to form a third pushing action.

[0071] The present invention controls the displacement of the chip 21 by the pushing member 122 of the pushing module 120 through the variable spacing between the positioning platform 114 and the pushed platform 131, so as to avoid the problem caused by insufficient or excessive displacement of the chip 21 by the pushing member 122.

[0072] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of the technical solution of the present invention.

Claims

1. A chip ejection structure, characterized in that: Include: The cylinder body has a cylinder wall, a containing space, an opening and a positioning platform, wherein the containing space is connected to the opening, the positioning platform is located in the containing space, and the positioning platform is fixed to the cylinder wall, and the positioning platform divides the containing space into a first containing space and a second containing space; A pushing module is disposed in the first accommodating space, and comprises a push rod and a pushing member, wherein the pushing member is combined with a first end portion of the push rod; A displacement limiting module is movably arranged in the second accommodating space, and comprises a pushed platform, a coupling member and a pushed plate, wherein the end portion of the coupling member is coupled to the second end portion of the push rod, and the pushed plate is coupled to the coupling member, and the displacement limiting module can be pushed by the driving member to move toward the positioning platform, so that the coupling member pushes the push rod, and the pushing member pushes the chip; as well as A reset member is arranged between the positioning platform and the pushed platform, and is used to push the displacement limiting module so that a variable distance is provided between the positioning platform and the pushed platform. The reset member includes a second compression spring, and the second compression spring surrounds the coupling member. One end of the second compression spring abuts against the positioning platform, and the other end abuts against the pushed plate, so that the pushed plate is limited between the positioning platform and the pushed platform.

2. The chip ejection structure according to claim 1, characterized in that: The positioning platform has a first action hole, and the push rod or the combining member is movably inserted into the first action hole.

3. The chip ejection structure according to claim 1, characterized in that: The reset component includes a first compression spring, one end of the first compression spring abuts against the positioning platform, the other end of the first compression spring abuts against the pushed platform, and the first compression spring surrounds the combining component.

4. The chip ejection structure according to claim 1, characterized in that: The pushed platform has a first through hole, the aperture of which is larger than the outer diameter of the head of the combining member, and the head of the combining member is located in the first through hole.

5. The chip ejection structure according to claim 4, characterized in that: The head protrudes from a surface of the pushed platform, and the surface faces the driving member.

6. The chip ejection structure according to claim 4, characterized in that: The pushed plate abuts against the head of the combining member, and the pushed plate is limited between the positioning platform and the head.

7. The chip ejection structure according to claim 6, characterized in that: The push plate has a third through hole, the combining piece is movably arranged through the third through hole, and the aperture of the third through hole is smaller than the outer diameter of the head of the combining piece.

8. The chip ejection structure according to claim 1, characterized in that: The second end of the push rod is provided with a first screw hole, the terminal end of the coupling member has an external thread, and the terminal end of the coupling member is screwed into the first screw hole.

9. The chip ejection structure according to claim 1, characterized in that: The pushing module has a shell, which is arranged in the first accommodating space. The push rod and the pushing member are arranged in the shell. The displacement limiting module also has at least one guide column. The positioning platform has a second action hole, and the pushed platform has a second through hole. The guide column is movably penetrated through the second through hole and the second action hole, and the joint part of the guide column is combined with the shell. The outer diameter of the head of the guide column is not less than the inner diameter of the second through hole, so that the head of the guide column is restricted outside the pushed platform, and the pushed platform is combined with the positioning platform through the guide column.

10. The chip ejection structure according to claim 9, characterized in that: The housing is provided with a second screw hole, the engaging portion of the guide column has an external thread, and the engaging portion is screwed into the second screw hole.

11. The chip ejection structure according to claim 9 or 10, characterized in that: The reset member includes a third compression spring, which surrounds the guide column, and one end of the third compression spring abuts against the pushed platform, and the other end of the third compression spring abuts against the shell through the second action hole.

12. The chip ejection structure according to claim 11, characterized in that: The shell is movably disposed in the first accommodating space, and the shell can be selectively moved close to the opening or away from the opening.

13. The chip ejection structure according to claim 1, characterized in that: The cylinder includes a first cylinder part and a second cylinder part. The first cylinder part and the second cylinder part are independent entities. The second cylinder part is combined with the first cylinder part. The first cylinder part surrounds the first accommodating space, and the second cylinder part surrounds the second accommodating space.

14. The chip ejection structure according to claim 13, characterized in that: The second cylindrical portion is disposed on the positioning platform.

15. The chip ejection structure according to claim 1, characterized in that: It also includes a cover, which covers the opening, and the cover has at least one first ventilation hole, the first ventilation hole is connected to the first accommodating space, the positioning platform has at least one second ventilation hole, the second ventilation hole is connected to the first accommodating space and the second accommodating space, the pushed platform has at least one third ventilation hole, the first ventilation hole, the first accommodating space, the second ventilation hole, the second accommodating space and the third ventilation hole constitute a ventilation channel.

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