A solder resist developing system

Abstract

The invention discloses a solder mask developing system, which relates to printed circuit board developing, and comprises: a developing machine, which is used for spraying developing liquid on the printed circuit board; and a hole washing device, which is used for flushing water into the conductive holes of the printed circuit board; wherein, there are at least two developing machines, and the hole washing device is arranged between the two developing machines, which helps to clean the ink in the conductive holes.

Description

Technical Field

[0001] The invention relates to the field of printed circuit board development, in particular to a solder mask development system. Background Art

[0002] PCB, also known as printed circuit board, is used to support and connect electronic components. A printed circuit board includes at least a substrate and a conductive layer attached to the substrate. The production process of a printed circuit board is as follows: first, the conductive layer is ground and polished. Then, photosensitive ink is applied to the ground and polished surface, which will solidify when exposed to light. The side of the board with photosensitive ink is exposed, that is, the places where the circuit is required are illuminated to solidify the photosensitive ink in these locations, thereby forming a protective film. Then it is developed, and the uncured photosensitive ink is cleaned with a developer, so that only the locations that have been exposed to light are protected by the photosensitive ink, and the conductive layer in the locations that have not been exposed to light will be exposed. The last step is etching, and the printed circuit board is pickled to corrode the locations where the conductive layer is not covered by the photosensitive film.

[0003] In order to improve production efficiency, the development of printed circuit boards generally adopts solder resist developers. The general process of existing solder resist developers is: board input --- development 1 --- development 2 --- development 3 --- water washing -- board drying; the problem that solder resist developers generally cannot solve is: ink will enter the via hole, the via hole will be blocked by ink, and it is difficult for the developer to enter the hole, resulting in the ink in the via hole being difficult to clean. Summary of the invention

[0004] In order to clean the ink in the via hole, the present application provides a solder mask developing system, which includes:

[0005] A developer, used to spray developer solution on printed boards;

[0006] A hole washing device is used to flush water into the via holes of the printed circuit board;

[0007] There are at least two developers, and the hole washing device is arranged between the two developers.

[0008] By adopting the above technical scheme, after one development, the via holes of the printed circuit board are flushed by using a hole washing device to clean the ink in the via holes that has reacted with the developer solution, thereby facilitating the developer solution of the next level to smoothly enter the via holes, and clean the ink in the via holes after the reaction; at the same time, the water washing and punching has no effect on the ink reaction of the solution on the surface of the printed circuit board, thereby ensuring that the reaction time between the board surface of the printed circuit board and the ink in the via holes and the solution is as close as possible, thereby helping to ensure that the thinner line width ink on the surface of the printed circuit board meets the line width requirements.

[0009] Optionally, the hole washing device includes a box body, with openings at both ends of the box body in the horizontal direction, wherein one opening is an inlet and the other is an outlet; a conveying structure for conveying printed circuit boards is installed in the box body, one end of the conveying structure is located at the inlet, and the other end extends to the outlet; a flushing structure is installed in the box body, and the flushing structure includes a plurality of nozzles for flushing water into the conductive holes of the printed circuit boards, and the nozzles are connected to a water inlet pipe, and the water inlet pipe is used to connect to a pressure water source.

[0010] By adopting the above technical solution, the pressure water source delivers water to the nozzle through the water inlet pipe, and the nozzle is used to flush the via holes of the printed circuit board to flush out the ink that reacts with the previous level of developer solution. The impact force of the water flow is used to clean the via holes, thereby improving the cleaning effect.

[0011] Optionally, the nozzle includes an upper nozzle and a lower nozzle, the upper nozzle is located above the conveying structure, and the lower nozzle is located below the conveying structure.

[0012] By adopting the above technical solution, two surfaces opposite to each other of some printed circuit boards are provided with through holes, and both are blind holes. The through holes on the opposite sides of these printed circuit boards can be cleaned, thereby improving the cleaning efficiency.

[0013] Optionally, the conveying structure includes a plurality of conveying rollers, which are horizontally arranged and rotatably connected to the box body, and the conveying rollers include a first conveying roller and a second conveying roller, the first conveying roller is located above the second conveying roller, the first conveying roller is used to abut against the upper surface of the printed circuit board, and the second conveying roller is used to abut against the lower surface of the printed circuit board; the conveying structure also includes a driving structure for driving the conveying rollers to rotate.

[0014] By adopting the above technical solution, the printed circuit board is clamped by the first conveying roller and the second conveying roller, so as to avoid the printed circuit board moving due to the impact of water flow, thereby preventing the flushing effect from being affected.

[0015] Optionally, the conveying structure is provided with a clearance gap for the nozzle to pass through, the upper nozzle is aligned with the second conveying roller, and the lower nozzle is aligned with the first conveying roller.

[0016] By adopting the above technical solution, the conveying roller supports the printed circuit board to overcome the impact force of the water flow sprayed from the nozzle, alleviate the bending degree of the printed circuit board caused by flushing, and reduce the damage of the printed circuit board.

[0017] Optionally, the water inlet pipe is equipped with a pulse structure, which includes a shell, a cylindrical cavity is provided in the shell, a water inlet connected to a pressure water source is provided on the side wall of the shell, and two water outlets are provided on the side wall of the shell away from the water inlet, and the two water outlets are arranged along the axial direction of the cavity; a cylindrical rotor is rotatably connected in the shell, the side wall of the rotor is in contact with the inner wall of the cavity, an annular flow channel is provided on the side wall of the rotor, and the end faces of the flow channel at both ends along the axial direction of the rotor are flow channel end walls, the normal vector of the flow channel end wall forms an angle α with the rotation axis of the rotor, and the angle α satisfies the following conditions: Dsinα≥d; wherein D is the diameter of the rotor, and d is the diameter of the water outlet; when the rotor rotates, the water inlet is alternately connected to the two water outlets through the flow channel, and the two water outlets are connected to the water inlet pipe; the shell is connected to a third drive motor that drives the rotor to rotate.

[0018] By adopting the above technical solution, the driving motor drives the rotor to rotate, and the rotation of the rotor makes the water inlet alternately connected with the two water outlets through the flow channel, so that the water entering the water inlet pipe is pulsed. When the continuous water flow impacts the blind hole of the conducting hole, the water will rebound and gush out from the blind hole, thereby colliding with the water flow that needs to impact the conducting hole later, and finally affecting the cleaning effect. However, the pulse impact method can alleviate the above situation and also has the effect of saving water.

[0019] Optionally, the rotor includes a rotating shaft and wedge-shaped disks sleeved on both ends of the rotating shaft, the rotating shaft is coaxially arranged with the shell and rotatably connected to the shell, and the third drive motor drives the rotating shaft to rotate; the end wall of the flow channel is opened on the end surface of the wedge-shaped disk facing each other, the wedge-shaped disk and the rotating shaft are circumferentially fixed and axially slidingly connected, the shell is provided with an axial driving structure for driving the two wedge-shaped disks to slide toward each other, and the rotating shaft sleeve is provided with a spring that applies thrust in opposite directions to the two wedge-shaped disks.

[0020] By adopting the above technical solution, during the rotation process, the axial drive structure is used to drive the wedge-shaped disks to slide toward each other, so that the volume of the flow channel is reduced, and the pressure in the flow channel is increased accordingly, thereby increasing the single impact force of the pulsed water flow.

[0021] Optionally, the axial drive structure includes a first protrusion fixedly connected to the inside of the shell end and a second protrusion fixedly connected to an end face of the wedge disk away from the flow channel, the first protrusion is close to the side of the water inlet, the wedge disk is provided with an annular sliding groove on the end face away from the flow channel, the first protrusion is inserted into the sliding groove, the second protrusion is fixedly connected to the bottom wall of the sliding groove, the second protrusion is provided with two pieces and the two second protrusions are symmetrically arranged with respect to the central axis of the rotor, and the second protrusion is close to one end of the inclination direction of the end wall of the flow channel.

[0022] By adopting the above technical solution, during the rotation of the rotor, when the first protrusion and the second protrusion collide, the two wedge-shaped disks slide toward each other; when the first protrusion and the second protrusion are offset and no longer collide, under the action of the spring, the two wedge-shaped disks slide in opposite directions. The axis drive structure uses the power of the drive motor to drive the rotor to realize the axial movement of the wedge-shaped disk, which has a simple structure and is easy to produce.

[0023] In summary:

[0024] First, a hole washing device is connected between the two developing devices. After the development of the previous stage, the hole washing device is used to wash the conductive holes of the printed circuit board to clean the ink in the conductive holes that has reacted with the developing solution, thereby facilitating the next stage of developing solution to smoothly enter the conductive holes;

[0025] Secondly, water will not react to the ink on the surface of the printed board, so the ink on the printed board surface and in the via hole reacts with the developer solution at each level at basically the same time, which helps to ensure that the ink with fine line width on the printed board surface and in the via hole meets the line width requirements;

[0026] Thirdly, the nozzle includes an upper nozzle located above the conveying structure and a lower nozzle located below the conveying structure, which is used to clean the printed circuit board with through holes on both sides, thereby improving the cleaning effect;

[0027] Fourthly, the pulse structure is used to make the nozzle spray water in a pulsed manner, which improves the flushing effect while saving water. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a wireframe diagram used to illustrate the overall system in an embodiment of the present application.

[0029] Figure 2 It is a cross-sectional view of an embodiment of the present application for showing the internal structure of the hole washing device.

[0030] Figure 3 yes Figure 2 AA cross-sectional view.

[0031] Figure 4 It is a cross-sectional view used to demonstrate the pulse structure of an embodiment of the present application.

[0032] Figure 5 yes Figure 4 Enlarged view of part B.

[0033] Description of reference numerals:

[0034] 100, hole washing device; 101, box; 102, conveying structure; 103, flushing structure; 104, first conveying roller; 105, second conveying roller; 106, driving structure; 107, first driving motor; 108, second driving motor; 110, water inlet pipe; 111, nozzle; 112, upper nozzle; 113, lower nozzle; 114, clearance gap; 200, pulse structure; 201, shell; 203, Water inlet; 204, water outlet; 205, rotor; 206, flow channel; 207, flow channel end wall; 208, third drive motor; 209, rotating shaft; 210, wedge-shaped disk; 211, axial drive structure; 212, first protrusion; 213, second protrusion; 214, spring; 215, sliding groove; 400, plate feeder; 500, developer; 600, plate washer; 700, plate dryer; 800, plate discharger. DETAILED DESCRIPTION

[0035] The following is combined with Figure 1-5 This application is described in further detail.

[0036] Reference Figure 1 , the present application embodiment discloses a solder mask developing system, comprising:

[0037] Trigger 400;

[0038] The developer 500 is connected to the outlet of the board feeder 400 and is used to spray developer solution on the printed board to develop the printed board;

[0039] The plate washer 600 uses clean water to wash the developed printed board and remove the developing solution on the printed board;

[0040] The plate drying machine 700 is used to dry the printed circuit board cleaned by the plate washing machine 600;

[0041] Board ejector 800;

[0042] There are at least two developers 500, so that the ink on the printed board reacts fully with the developer solution. In this embodiment, there are three developers 500, and the printed board passes through the three developers 500 in sequence. The inlet of the plate washer 600 is connected to the outlet of a developer 500 far away from the plate feeder 400. The outlet of the plate washer 600 is connected to the inlet of the plate dryer 700. The outlet of the plate dryer 700 is connected to the plate outlet 800.

[0043] Reference Figure 1 The ink on the printed circuit board will also enter the conductive holes of the printed circuit board, blocking the conductive holes, making it difficult for the developer to enter the conductive holes, making it difficult to clean the ink in the holes.

[0044] Reference Figure 1In order to alleviate the above technical problems, the solder resist developing system further includes a hole washing device 100. One of the above hole washing devices 100 is installed between two adjacent developing machines 500, that is, there are two hole washing devices 100 in this embodiment. After the previous level of development, the via holes of the printed circuit board are washed by the hole washing device 100. The washing time of each printed circuit board is 5-8 seconds, and the ink in the via holes that has reacted with the developer solution is washed clean, so as to facilitate the next level of developer solution to smoothly enter the via holes and clean the ink in the via holes after the reaction.

[0045] Reference Figure 2 , the hole washing device 100 comprises:

[0046] The box body 101 has openings at both ends in the horizontal direction, one opening is an inlet connected to the upper-level developer 500, and the other is an outlet connected to the lower-level developer 500;

[0047] A conveying structure 102, one end of which is located at the inlet of the box 101 and the other end of which extends to the outlet of the box 101, is used to convey the printed circuit board;

[0048] The flushing structure 103 is used to spray water on the via holes of the printed circuit board to flush out the ink that reacted with the previous level of developing solution.

[0049] The conveying structure 102 includes conveying rollers. There are multiple conveying rollers and they are arranged horizontally, and both ends of the conveying rollers are rotatably connected to the box body 101. The conveying rollers include a first conveying roller 104 and a second conveying roller 105. The first conveying roller 104 is located above the second conveying roller 105. When the conveying structure 102 conveys the printed board, the first conveying roller 104 abuts against the upper surface of the printed board, and the second conveying roller 105 abuts against the lower surface of the printed board. The first conveying roller 104 and the second conveying roller 105 clamp the printed board and convey it forward.

[0050] Reference Figure 3 The conveying structure 102 also includes a driving structure 106 for driving the conveying rollers to rotate. The driving structure 106 includes a first driving motor 107 and a second driving motor 108. The first driving motor 107 is fixedly connected to the box body 101, and its main shaft is coaxially fixedly connected to a first conveying roller 104. Two adjacent first conveying rollers 104 are linked by belt transmission. The second driving motor 108 is fixedly connected to the box body 101, and its main shaft is coaxially fixedly connected to a second conveying roller 105. Two adjacent second conveying rollers 105 are linked by belt transmission. The driving structure 106 drives all the conveying rollers to rotate, wherein the rotation direction of the first conveying roller 104 is opposite to the rotation direction of the second conveying roller 105.

[0051] Reference Figure 2The flushing structure 103 includes a water inlet pipe 110 and a nozzle 111. The water inlet pipe 110 is fixedly connected to the box body 101. The water inlet pipe 110 is arranged in parallel with the conveying roller. In this embodiment, there are four water inlet pipes 110, two of which are located above the conveying structure 102, and the other two are located below the conveying structure 102.

[0052] Reference Figure 2 The water inlet pipe 110 is evenly distributed with a plurality of the above-mentioned nozzles 111 along its length. The nozzles 111 are fixedly connected to the water inlet pipe 110, and the two are in communication.

[0053] Reference Figure 2 The nozzle 111 is used to flush water to the conductive holes of the printed circuit board. The spray direction of the nozzle 111 is toward the conveying structure 102 and is vertically arranged, so that the water flow sprayed by it is parallel to the conductive holes. The nozzle 111 includes an upper nozzle 112 and a lower nozzle 113, the upper nozzle 112 is located above the conveying structure 102, and the lower nozzle 113 is located below the conveying structure 102.

[0054] Reference Figure 2 In order to reduce the loss of kinetic energy of water under the action of air resistance, the nozzle 111 needs to be as close to the printed circuit board as possible. To this end, the upper and lower surfaces of the conveying structure 102 are provided with a clearance gap 114 for the nozzle 111 to penetrate. At the position where the upper nozzle 112 needs to be penetrated, the first conveying roller 104 is not installed, thereby forming a clearance gap 114 on the upper surface of the conveying structure 102; at the position where the lower nozzle 113 needs to be penetrated, the second conveying roller 105 is not installed, thereby forming a clearance gap 114 on the lower surface of the conveying structure 102. The nozzle 111 is penetrated in the clearance gap 114, the upper nozzle 112 is aligned with a second conveying roller 105, and the lower nozzle 113 is aligned with a first conveying roller 104. The conveying roller is used to bear the pressure of the water flow sprayed by the nozzle 111, rather than the elastic force generated by the bending deformation of the printed circuit board itself, so as to reduce the bending degree of the printed circuit board caused by the water flow sprayed by the nozzle 111 and reduce the damage to the printed circuit board.

[0055] Some of the via holes on printed circuit boards are blind holes. When a continuous water flow hits the blind holes, the water will rebound and gush out of the blind holes, thereby colliding with the water flow that needs to hit the via holes later, thereby affecting the cleaning effect produced by the water flow hitting the via holes.

[0056] Reference Figure 4In order to alleviate the above problems, a pulse structure 200 is installed on the water inlet pipe 110. The pulse structure 200 includes a cylindrical shell 201, and the shell 201 is fixedly connected to the outside of the box 101. A cylindrical cavity is provided in the shell 201, and a water inlet 203 connected to the cavity is provided on the side wall of the shell 201. The water inlet 203 is located in the middle position of the axial direction of the shell 201. The water inlet 203 is used to communicate with a pressure water source, and the pressure water source can have a water pump. The pressure of the pressure water source is 8~12bar.

[0057] Reference Figure 4 Two water outlets 204 connected to the cavity are provided on the side wall of the housing 201 away from the water inlet 203. The two water outlets 204 are arranged along the axial direction of the cavity, and the water outlets 204 are connected one-to-one with the water inlet pipe 110. The two water inlet pipes 110 on the same side are connected to the same pulse structure 200.

[0058] Reference Figure 4 The pulse structure 200 also includes a rotor 205 rotatably connected to the housing 201. The rotor 205 is cylindrical, and its side wall is in contact with the inner wall of the cavity. The side wall of the rotor 205 is provided with an annular flow channel 206, and the flow channel 206 is inclined. The end surfaces of the flow channel 206 along the axial ends of the rotor 205 are flow channel end walls 207. The normal vector of the flow channel end wall 207 forms an angle α with the rotation axis of the rotor 205, and the angle α satisfies the following conditions:

[0059] Dsinα≥d

[0060] in:

[0061] D is the diameter of the rotor 205;

[0062] d is the diameter of the water outlet 204 .

[0063] Reference Figure 4 The distance between the channel end walls 207 along the axial direction of the cavity is greater than twice Dsinα, so that the water inlet 203 is always connected to the channel 206. When the rotor 205 rotates, the water inlet 203 is alternately connected to the two water outlets 204 through the channel 206, so that the water entering the water inlet pipe 110 is pulsed.

[0064] Reference Figure 4 The housing 201 is fixedly connected with a third drive motor 208, and the main shaft of the third drive motor 208 is coaxially fixedly connected with the rotor 205. The third drive motor 208 is used to drive the rotor 205 to rotate.

[0065] Reference Figure 4The rotor 205 includes a rotating shaft 209 and a wedge-shaped disc 210 sleeved on both ends of the rotating shaft 209. The rotating shaft 209 is coaxially connected to the housing 201, and the main shaft of the third driving motor 208 is coaxially fixedly connected to the rotating shaft 209. Splines are provided at both ends of the rotating shaft 209, and the wedge-shaped disc 210 is provided with a spline groove adapted thereto. The wedge-shaped disc 210 slides along the length direction of the rotating shaft 209, and the rotation of the rotating shaft 209 can drive the wedge-shaped disc 210 to rotate. The flow channel end wall 207 is provided on the end surface of the wedge-shaped disc 210 facing each other.

[0066] Reference Figure 4 Both axial ends of the housing 201 are provided with axial driving structures 211 for driving the two wedge-shaped disks 210 to slide toward each other.

[0067] Reference Figure 4 and Figure 5 The axial driving structure 211 includes a first protrusion 212 fixedly connected to the inner wall of one end of the housing 201. There are two first protrusions 212, which are symmetrically arranged with respect to the central axis of the housing 201, and one of the first protrusions 212 is close to the water inlet 203.

[0068] Reference Figure 4 and Figure 5 The end surface of the wedge-shaped disk 210 away from the flow channel 206 is provided with an annular sliding groove 215, and the sliding groove 215 is coaxially arranged with the rotor 205. The axis driving structure 106 also includes a second protrusion 213 fixedly connected to the bottom of the sliding groove 215. The second protrusion 213 is two pieces and is symmetrically arranged with respect to the central axis of the rotor 205, and the second protrusion 213 is close to the inclined end of the flow channel end wall 207.

[0069] Reference Figure 4 and Figure 5 During the rotation of the rotor 205, when the first protrusion 212 and the second protrusion 213 collide, the two wedge-shaped disks 210 slide toward each other. When the two wedge-shaped disks 210 slide toward each other, the volume of the flow channel 206 decreases, and the pressure in the flow channel 206 increases, thereby increasing the single impact force of the pulsed water flow.

[0070] Reference Figure 4 The rotating shaft 209 is sleeved with a spring 214, one end of the spring 214 abuts against one flow channel end wall 207, and the other end of the spring 214 abuts against the other flow channel end wall 207. When the first protrusion 212 and the second protrusion 213 are staggered and no longer abut, under the action of the spring 214, the two wedge-shaped disks 210 slide in opposite directions.

[0071] The implementation principle of a solder resist developing system in the embodiment of the present application is as follows: the printed board enters the solder resist developing system through the board feeder 400, and then passes through three developers 500 and two hole washing devices 100, and the printed board undergoes development-washing of the vias-development-washing of the vias-development. Then it enters the board washer 600, and the developed printed board is washed with clean water to remove the developing solution on the printed board. The printed board washed with clean water enters the board dryer 700 to dry the printed board. Finally, the printed board comes out of the board output machine 800.

[0072] Between the secondary development, the via holes of the printed board are washed by the hole washing device 100 to wash away the ink in the via holes that has reacted with the developer solution, so that the developer solution of the next level developer 500 can enter the via holes and the ink in the via holes can fully react with the developer solution. At the same time, the water washing and punching has no effect on the ink on the surface of the printed board, thereby ensuring that the reaction time between the printed board surface and the ink in the via holes and the developer solution is as close as possible, which helps to ensure that the thinner line width ink on the surface of the printed board meets the line width requirements.

[0073] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A solder resist developing system, characterized in that: include: A developer (500) is used to spray developer solution on the printed board; A hole washing device (100) for flushing water into the via holes of a printed circuit board; There are at least two developing machines (500), and the hole washing device (100) is arranged between the two developing machines (500); The hole washing device (100) comprises a box (101), both ends of the box (101) in the horizontal direction are provided with openings, wherein one opening is an inlet and the other is an outlet; a conveying structure (102) for conveying a printed circuit board is installed in the box (101), one end of the conveying structure (102) is located at the inlet and the other end extends to the outlet; a flushing structure (103) is installed in the box (101), the flushing structure (103) comprises a plurality of nozzles (111) for flushing water into the conductive holes of the printed circuit board, the nozzles (111) are connected to the inlet and the outlet. A water pipe (110), wherein the water inlet pipe (110) is used to communicate with a pressure water source, the water inlet pipe (110) is installed with a pulse structure (200), the pulse structure (200) comprises a shell (201), a cylindrical cavity is provided in the shell (201), a water inlet (203) connected to the pressure water source is provided on the side wall of the shell (201), two water outlets (204) are provided at a position of the side wall of the shell (201) away from the water inlet (203), and the two water outlets (204) are arranged along the axial direction of the cavity; a rotating connection is provided in the shell (201) A cylindrical rotor (205) is provided, wherein the side wall of the rotor (205) is fitted with the inner wall of the cavity, and an annular flow channel (206) is provided on the side wall of the rotor (205). The end surfaces of the flow channel (206) at both ends of the axial direction of the rotor (205) are flow channel end walls (207), and the normal vector of the flow channel end wall (207) forms an angle α with the rotation axis of the rotor (205), and the angle α satisfies the following conditions: Dsinα≥d; wherein D is the diameter of the rotor (205), and d is the diameter of the water outlet (204); when the rotor (205) rotates, the water inlet (204) is 03) is alternately connected to two water outlets (204) through a flow channel (206), and both of the two water outlets (204) are connected to a water inlet pipe (110); the housing (201) is connected to a third drive motor (208) for driving the rotor (205) to rotate, the rotor (205) comprises a rotating shaft (209) and wedge-shaped disks (210) sleeved on both ends of the rotating shaft (209), the rotating shaft (209) is coaxially arranged with the housing (201) and the rotating shaft (209) is rotatably connected to the housing (201), and the third drive motor (208) drives the rotating shaft (209) to rotate;The flow channel end wall (207) is formed on the end surface of the wedge-shaped disk (210) facing each other. The wedge-shaped disk (210) is circumferentially fixed and axially slidably connected to the rotating shaft (209). The housing (201) is provided with an axial driving structure (211) for driving the two wedge-shaped disks (210) to slide toward each other. The rotating shaft (209) is sleeved with a spring (214) for applying thrusts in opposite directions to the two wedge-shaped disks (210). The nozzle (111) comprises an upper nozzle (112) and a lower nozzle (113). The upper nozzle (112) is located above the conveying structure (102), and the lower nozzle (113) is located below the conveying structure (102). The axial driving structure (211) comprises a first protrusion (212) fixedly connected to the inside of the housing end and a second protrusion (213) fixedly connected to an end surface of the wedge-shaped disk (210) away from the flow channel (206). ; 2. A solder resist developing system according to claim 1, characterized in that: The conveying structure (102) comprises a plurality of conveying rollers, which are arranged horizontally and rotatably connected to the box body (101), the conveying rollers comprising a first conveying roller (104) and a second conveying roller (105), the first conveying roller (104) being located above the second conveying roller (105), the first conveying roller (104) being used to abut against the upper surface of the printed board, and the second conveying roller (105) being used to abut against the lower surface of the printed board; the conveying structure (102) further comprises a driving structure (106) for driving the conveying rollers to rotate.

3. A solder resist developing system according to claim 2, characterized in that: The conveying structure (102) is provided with a clearance gap (114) for the nozzle (111) to pass through, the upper nozzle (112) is aligned with the second conveying roller (105), and the lower nozzle (113) is aligned with the first conveying roller (104).

4. A solder resist developing system according to claim 1, characterized in that: The first protrusion (212) is located on a side close to the water inlet (203); the wedge-shaped disk (210) is provided with an annular sliding groove (215) on an end surface away from the flow channel (206); the first protrusion (212) is inserted into the sliding groove (215); the second protrusion (213) is fixedly connected to the bottom wall of the sliding groove (215); two second protrusions (213) are provided and the two second protrusions (213) are symmetrically arranged with respect to the central axis of the rotor (205); the second protrusion (213) is located close to one end of the flow channel end wall (207) in an inclined direction.

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