Radiator and communication device

Abstract

The application discloses a heat radiator, comprising a heat radiating substrate and a heat radiating fin group arranged on the surface of the heat radiating substrate, wherein the inner surface of the heat radiating substrate is used for mounting a heating component, the heat radiating fin group is arranged on the outer surface of the heat radiating substrate, the heat radiating fin group comprises two groups of opposite and staggered inclined heat radiating fin groups, vertical air channels are arranged in the middle of the two groups of inclined heat radiating fin groups, each group of inclined heat radiating fin groups comprises a plurality of inclined heat radiating fins, open V-shaped spaces are formed between the heat radiating fins of the two groups of inclined heat radiating fin groups, and the heat radiating fins are filled with refrigerant working medium. The heat radiator has good heat exchange effect, can meet the heat exchange requirement of new high-power wireless communication equipment, and has the advantages of simple structure, convenient operation and wide application. The application further provides a communication equipment comprising the heat radiator, and the heat radiator has good heat dissipation effect on the heating component of the communication equipment, and can effectively prolong the service life and operation effect of the device.

Description

Technical Field

[0001] This invention relates to the field of passive heat dissipation technology, and more specifically, to a heat sink. Furthermore, it also relates to a communication device incorporating the aforementioned heat sink. Background Technology

[0002] Communication equipment generates significant heat during operation, especially new 5G wireless transceivers, which generate more than three times the heat of older 4G devices. Electronic devices are highly sensitive to temperature; if the generated heat cannot be dissipated in time, it can lead to equipment malfunction and prevent normal operation.

[0003] For heat sinks installed on communication equipment, air cooling is often used, especially for wireless transceivers, which are often suspended on towers or rooftops and are unattended for long periods of time, so passive cooling methods are often used.

[0004] In existing technologies, the heat dissipation of wireless transceivers often utilizes the housing as a heat sink substrate, with heat dissipation fins on the outer surface of the housing to increase the heat exchange area and enhance heat transfer capacity. Most heat sinks consist of vertically parallel heat dissipation fins, forming ventilation channels between adjacent fins. Heat-generating components inside the communication device are mounted on the inner surface of the housing or transfer heat to the inner surface of the housing through various heat transfer methods. Therefore, when the heat-generating components inside the communication device generate heat, the heat is transferred through the heat sink housing to the heat dissipation fins, and then the air between the heat sink and the air is heated through convection heat transfer. The heated air undergoes a density change and begins to move upwards along the channels, thus being discharged outside the heat sink. Meanwhile, cooler air from the outside, due to the discharge of the hot air, is replenished from the bottom of the channels. This allows the heat sink to continuously remove the heat generated by the heat-generating components inside the communication device through natural convection heat transfer, maintaining the communication device at a suitable operating temperature.

[0005] Currently, there are two main heat dissipation solutions. The first is to use a blown plate to replace the original fins and install it vertically on the heat sink base plate for heat dissipation. The second is to use a metal material with high thermal conductivity and improve the natural convection heat transfer capacity by changing the arrangement angle and method of the fins, thereby enhancing the heat transfer efficiency of the heat sink.

[0006] To address the increasing heat generation of wireless communication devices, the primary heat dissipation method for wireless transceivers is to replace the original high thermal conductivity metal fins with inflatable plates. However, since the evaporation and recirculation of the working fluid inside the inflatable plate can only occur through gravity, a good evaporation process cannot be formed on the upper part of the substrate. This results in poor heat dissipation capacity on the upper part of the substrate, meaning that the thermal conductivity of the inflatable plate varies along its height, preventing it from fully realizing its optimal heat exchange performance.

[0007] Furthermore, methods that enhance natural convection heat transfer by altering the fin arrangement suffer from low fin efficiency due to the low thermal conductivity of the fins themselves. Fins are typically made of solid materials such as copper and aluminum alloys, but even the best thermal conductivity of metals is only around 400 W / m·K. This results in low heat transfer efficiency, and the significant temperature difference between the fins on the substrate and at the fin tips severely impacts the heat dissipation efficiency of the radiator. In other words, existing heat transfer methods cannot meet the heat transfer requirements of new high-power wireless communication devices.

[0008] In summary, how to provide a device with good heat exchange performance that can better meet the heat exchange requirements of new high-power wireless communication equipment is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0009] In view of this, the purpose of the present invention is to provide a heat sink with good heat exchange effect, which can better meet the heat exchange requirements of new high-power wireless communication equipment.

[0010] Another object of the present invention is to provide a communication device including the above-mentioned heat sink, which has good heat dissipation effect on the heat-generating components of the communication device, and can effectively improve the service life and operation performance of the device.

[0011] To achieve the above objectives, the present invention provides the following technical solution:

[0012] A heat sink includes: a heat sink substrate and a heat sink fin assembly disposed on the surface of the heat sink substrate. The inner surface of the heat sink substrate is used to mount heat-generating components. The heat sink fin assembly is disposed on the outer surface of the heat sink substrate. The heat sink fin assembly includes two sets of obliquely arranged heat sink fins arranged opposite each other. A vertical air channel is provided between the two sets of obliquely arranged heat sink fins. Each obliquely arranged heat sink fin assembly includes a plurality of obliquely arranged heat sink fins. An open V-shape is formed between the heat sink fins of the two sets of obliquely arranged heat sink fins. The heat sink fins are filled with a refrigerant.

[0013] In one embodiment, the two sets of inclined heat dissipation fins are arranged in an alternating manner to facilitate mixing of the rising airflow in the vertical air channel.

[0014] In one embodiment, the two sets of inclined heat dissipation fins have the same structure, and the heat dissipation fins are heat spreaders, blown plates, or thermosiphon plates.

[0015] In one embodiment, adjacent heat dissipation fins in the same inclined heat dissipation fin group are arranged parallel to each other and at equal intervals.

[0016] In one embodiment, the heat dissipation fins are provided with a space channel for filling the refrigerant, the space channel including a passage formed by brazing metal plates or by blowing.

[0017] In one embodiment, the outer shell of the heat dissipation fins comprises a high thermal conductivity material.

[0018] In one embodiment, the heat dissipation fins are smooth sheet-like fins, corrugated fins, or grooved fins.

[0019] In one embodiment, the angle of inclination between the heat dissipation fins and the horizontal plane is 30° to 60°.

[0020] A heat sink includes: a heat sink substrate and a heat sink fin assembly disposed on the surface of the heat sink substrate. The heat sink fin assembly includes: a first fin assembly inclined at a first preset angle to the surface of the heat sink substrate, the first fin assembly including a plurality of first heat sink fins; and a second fin assembly inclined at a second preset angle to the surface of the heat sink substrate, the second fin assembly including a plurality of second heat sink fins. The first fin assembly and the second fin assembly are disposed opposite to each other. Both the first heat sink fins and the second heat sink fins are filled with a refrigerant. A vertical air channel is provided between the first fin assembly and the second fin assembly. The bottom of the first heat sink fin and the bottom of the corresponding second heat sink fin are not on the same horizontal line.

[0021] A communication device includes: a heat-generating element and a heat sink as described in any one of the preceding claims, wherein the heat sink is connected to the heat-generating element to dissipate heat from the heat-generating element.

[0022] When using the heat sink provided by this invention, firstly, the heat sink is installed on the outer surface of the heat-generating components of the wireless communication device, that is, the heat-generating components can be installed on the inner surface of the heat sink substrate. The heat from the heat-generating components is transferred from the inner surface of the heat sink substrate to the outer surface of the heat sink substrate through thermal conduction on the heat sink substrate. Subsequently, the heat is transferred to the heat sink fin assembly. The fins of the heat sink fin assembly dissipate the heat into the natural environment by contacting the air in each air channel.

[0023] Furthermore, because the heat dissipation fins of the two sets of heat dissipation fins form an open V-shape, meaning the fins on both sides are not closed and form an upward-facing structure, a vertical air channel is left between them. This allows cool air from the environment to enter the vertical air channel and move upward along it. The interval between adjacent heat dissipation fins in each angled heat dissipation fin set forms an angled air channel. When cool air moves upward in the vertical air channel, since the angled air channel is interconnected with the vertical air channel, the cool air will move from the vertical air channel to the angled air channel. The airflow in the angled air channel carries away the heat from each heat dissipation fin. After passing through the aforementioned air channels, the heated gas can flow back into the environment, thus dissipating heat for the wireless communication equipment. Moreover, the heated air will move upward at a faster angle under the action of natural convection, thereby increasing the gas flow speed and allowing more heat to be carried to the environment by the flowing gas, further improving the heat dissipation effect of the radiator and accelerating the cooling of the communication equipment.

[0024] Because the heat sink fins are filled with refrigerant, when the fins are tilted at a certain angle on the heat sink substrate, the refrigerant can flow and extend along the inside of the fins, increasing the range for phase change reactions. This means that even with the same refrigerant charge, two-phase heat exchange can occur at the top of the fins, and the completely submerged portion at the bottom of the fins will be reduced. This significantly improves the heat exchange capacity of individual fins at various locations, thereby increasing the heat exchange efficiency of the fin assembly. Furthermore, the radiator provided by this invention has a simple structure, is easy to operate, and can be widely used.

[0025] In summary, the heat exchanger provided by this invention has good heat exchange performance, can meet the heat exchange requirements of new high-power wireless communication equipment, and has a simple structure and is easy to operate, so it can be widely used.

[0026] In addition, the present invention also provides a communication device including the above-mentioned heat sink, which has good heat dissipation effect on the heat-generating components of the communication device, and can effectively improve the service life and operation effect of the device. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0028] Figure 1 A three-dimensional structural schematic diagram of the heat sink provided by the present invention;

[0029] Figure 2 This is the front view of the radiator;

[0030] Figure 3 for Figure 2 AA cross-section view;

[0031] Figure 4 This is a schematic diagram of the heat sink fins.

[0032] Figure 5 A schematic diagram of an internal cavity structure for a heat sink fin;

[0033] Figure 6 This is a schematic diagram of another internal cavity structure for heat dissipation fins;

[0034] Figure 7 This is a schematic diagram of another type of internal cavity structure for heat dissipation fins.

[0035] Figure 1-7 middle:

[0036] 1 is the heat dissipation substrate, 2 is the heat-generating component, 3 is the heat dissipation fin assembly, 4 is the oblique air channel, 5 is the heat dissipation fin, 6 is the oblique heat dissipation fin assembly, 7 is the vertical air channel, 8 is the outer shell, 9 is the spatial channel, and 10 is the refrigerant. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] The core of this invention is to provide a heat sink with good heat exchange effect, which can meet the heat exchange requirements of new high-power wireless communication devices. Furthermore, it has a simple structure, is easy to operate, and can be widely used.

[0039] Another core aspect of this invention is to provide a communication device that includes the aforementioned heat sink. This communication device has good heat dissipation performance for its heat-generating components, which can effectively improve the service life and operational efficiency of the device.

[0040] Please refer to Figures 1 to 7 ,in, Figure 1 A three-dimensional structural schematic diagram of the heat sink provided by the present invention; Figure 2 This is the front view of the radiator; Figure 3 for Figure 2 AA cross-section view; Figure 4 This is a schematic diagram of the heat sink fins. Figure 5A schematic diagram of an internal cavity structure for a heat sink fin; Figure 6 This is a schematic diagram of another internal cavity structure for heat dissipation fins; Figure 7 This is a schematic diagram of another type of internal cavity structure for heat dissipation fins.

[0041] This specific embodiment provides a heat sink, including: a heat sink substrate 1 and a heat sink fin assembly 3 disposed on the surface of the heat sink substrate 1. The inner surface of the heat sink substrate 1 is used to mount heat-generating components 2. The heat sink fin assembly 3 is disposed on the outer surface of the heat sink substrate 1. The heat sink fin assembly 3 includes two sets of obliquely arranged heat sink fin assemblies 6 arranged opposite each other. A vertical air channel 7 is provided between the two sets of obliquely arranged heat sink fin assemblies 6. Each obliquely arranged heat sink fin assembly 6 includes several obliquely arranged heat sink fins 5. An open V-shape is formed between the heat sink fins 5 of the two sets of obliquely arranged heat sink fin assemblies 6. The heat sink fins 5 are filled with a refrigerant 10.

[0042] It should be noted that the heat dissipation substrate 1 can be the back panel of the wireless communication device, and the heat-generating components 2 of the wireless communication device should be in close contact with the inner surface of the heat dissipation substrate 1. For example, the heat-generating components 2 can be attached to the inner surface of the heat dissipation substrate 1 or directly mounted on the inner surface of the heat dissipation substrate 1 so that heat can be quickly transferred to the heat dissipation substrate and the heat dissipation fin assembly 3.

[0043] It should also be noted that because there is an oblique air channel 4 between adjacent heat dissipation fins 5 in the same group, cold air can dissipate heat from the heat dissipation fins 5 through this oblique air channel 4. Furthermore, in one embodiment, the two sets of oppositely arranged oblique heat dissipation fin groups 6 can refer to two sets of oblique heat dissipation fin groups 6 arranged symmetrically for ease of installation. Alternatively, they can refer to two sets of oblique heat dissipation fin groups 6 arranged in a staggered manner to better mix the rising airflow in the vertical air channel 7, thereby improving heat exchange efficiency. Moreover, the structures of the two sets of oblique heat dissipation fin groups 6 can be identical or different.

[0044] In other embodiments, the heat dissipation fins 5 of the same group of inclined heat dissipation fins 6 can be set to different tilt angles, or the heat dissipation fins 5 of different groups of inclined heat dissipation fins 6 can be set to different tilt angles.

[0045] Additionally, it should be noted that the open V-shape here refers to a structure with two sets of oblique heat dissipation fins 6 forming an upward-facing opening, where the heat dissipation fins 5 that are close to each other are not closed or connected, but rather have a vertical air channel 7 to facilitate airflow. The open V-shape can also include an upward-facing structure formed by two sets of oblique heat dissipation fins 6 arranged in an alternating manner, where the heat dissipation fins 5 on both sides are staggered, and the ends (points) of two corresponding heat dissipation fins 5 near the vertical air channel 7 are not on the same horizontal line, and these two heat dissipation fins 5 are not closed or connected, i.e., staggered.

[0046] In other embodiments, when the angles of the two sets of inclined heat dissipation fin groups 6 and their heat dissipation fins 5 are set differently, the open V-shape here can also be of other forms, and the heat dissipation fins 5 can also be of other structures, that is, it can be determined according to the actual structure.

[0047] For example, vertical heat dissipation fin groups can be installed at both ends of the vertical air channel 7, and oblique heat dissipation fin groups 6 can be installed on both sides of the vertical air channel 7. The spacing between the vertical heat dissipation fins of the vertical heat dissipation fin groups is larger than the size of the vertical air channel 7 to avoid affecting the airflow. The fins of the oblique heat dissipation fin groups 6 are staggered, which can accelerate the entry of cold air from the vertical air channel 7 into the oblique air channels 4 on both sides, thereby improving the heat dissipation effect of the radiator. Moreover, the oblique heat dissipation fin groups 6 located on the same side of the vertical air channel 7 can also include two or more oblique heat dissipation fin groups 6 with different inclination angles.

[0048] In one possible implementation, the shape of the vertical heat dissipation fins in the two vertical heat dissipation fin groups and the shape of the oblique heat dissipation fins in the at least two oblique heat dissipation fin groups 6 can be any of the following: plate-shaped, columnar, and tubular. That is, the shape of the heat dissipation fins 5 can be arbitrarily set, as long as it can increase the heat dissipation area of ​​the heat sink. For example, it can be any of the following: plate-shaped, columnar, and tubular. A common shape is plate-shaped heat dissipation fins, which are easy to process and have a large surface area, resulting in a large heat dissipation area.

[0049] In practical applications, the structure, material, shape, position, and size of the heat dissipation substrate 1 and the heat dissipation fin group 3 can be determined according to the actual situation and needs.

[0050] When using the heat sink provided by the present invention, firstly, the heat sink is installed on the outer surface of the heat-generating component 2 of the wireless communication device, that is, the heat-generating component 2 can be installed on the inner surface of the heat sink substrate 1. The heat from the heat-generating component 2 is transferred from the inner surface of the heat sink substrate 1 to the outer surface of the heat sink substrate 1 through heat conduction on the heat sink substrate 1. Subsequently, the heat is transferred to the heat sink fin assembly 3. The fins of the heat sink fin assembly 3 dissipate the heat into the natural environment by contacting the air in each air channel.

[0051] Furthermore, since the heat dissipation fins 5 of the two sets of heat dissipation fin groups 3 form an open V-shape, that is, the heat dissipation fins 5 on both sides are not closed and form an upward-facing structure, a vertical air channel 7 is left between them, allowing cold air from the environment to enter the vertical air channel 7 and move upward along the vertical air channel 7. The interval between adjacent heat dissipation fins 5 in each inclined heat dissipation fin group 6 is an inclined air channel 4. When cold air moves upward in the vertical air channel 7, since the inclined air channel 4 is connected to the vertical air channel 7, the cold air will move from the vertical air channel 7 to the inclined air channel 4. The air flow in the inclined air channel 4 will carry away the heat from each heat dissipation fin 5. After passing through the above air channels, the heated gas can flow back into the environment, thereby dissipating heat for the wireless communication device. Moreover, the heated air will move upward at a faster speed under the action of natural convection, thereby increasing the gas flow speed and allowing more heat to be carried to the environment by the flowing gas, further improving the heat dissipation effect of the radiator and accelerating the heat dissipation of the communication device.

[0052] Since the heat dissipation fins 5 are filled with refrigerant 10, when the heat dissipation fins 5 are inclined at a certain angle on the heat dissipation substrate 1 as described above, the refrigerant 10 can flow and extend along the inside of the heat dissipation fins 5, increasing the range of phase change reaction. That is, with the same amount of refrigerant 10, a larger inner surface of the heat dissipation fins 5 is covered by the refrigerant, resulting in a two-phase heat exchange process. This significantly improves the heat exchange capacity of a single heat dissipation fin 5 at various locations, thereby improving the heat exchange efficiency of the heat dissipation fin assembly 3. Moreover, the radiator provided by this invention has a simple structure and is easy to operate, making it suitable for widespread use.

[0053] In summary, the heat exchanger provided by this invention has good heat exchange performance, can meet the heat exchange requirements of new high-power wireless communication equipment, and has a simple structure and is easy to operate, so it can be widely used.

[0054] In one embodiment, the two sets of oblique heat dissipation fins 6 are arranged in an alternating manner to facilitate mixing of the rising airflow in the vertical air channel 7.

[0055] In this embodiment, since the two sets of inclined heat dissipation fins 6 are arranged in an alternating manner, the vertical air channel 7 and the inclined air channel 4 are more fully interconnected, which is conducive to promoting the entry of cold air into the radiator and the exit of hot air from the radiator, and forming a chimney effect, thereby reducing the impact of the air channel changing from a vertical channel to an inclined channel.

[0056] In one embodiment, the two sets of inclined heat dissipation fins 6 have the same structure, and the heat dissipation fins 5 are heat spreaders, blown plates, or thermosiphon plates.

[0057] It should be noted that the two sets of inclined heat dissipation fin groups 6 here have the same structure, meaning that the inclination angle, size, and other structural features of the heat dissipation fins 5 in each set of inclined heat dissipation fin groups 6 are identical. The heat dissipation fins 5 are made of heat spreaders, inflatable plates, or thermosiphon plates to effectively improve their heat dissipation efficiency. The outer shell 8 of the heat spreader, inflatable plate, or thermosiphon plate is generally made of solid material and filled with a refrigerant 10. During operation, a phase change process can occur inside, thereby effectively improving its heat conduction and dissipation capabilities.

[0058] It should also be noted that the heat dissipation substrate 1 and the heat dissipation fins 5 of the radiator can both be made of two-phase heat exchange units such as heat exchange plates, blown plates, and thermosiphon plates. Alternatively, the heat dissipation substrate 1 can be made of solid material, and the heat dissipation fins 5 can be fixed to the heat dissipation substrate 1 by welding, pressing, or other methods.

[0059] In practical applications, the material, structure, position, and quantity of the heat dissipation fins 5 can be determined according to the actual situation and needs.

[0060] In one embodiment, adjacent heat dissipation fins 5 in the same inclined heat dissipation fin group 6 are arranged parallel to each other and at equal intervals. This helps ensure that the inclined air channels 4 between adjacent heat dissipation fins 5 are of the same size, ensuring that the amount of cold air flowing through the channels is the same. In other words, it helps ensure that the heat dissipation effect of each heat dissipation fin 5 is comparable, avoiding a situation where some heat dissipation fins 5 have good heat dissipation effects while others have poor heat dissipation effects. Moreover, the uniform arrangement of heat dissipation fins 5 parallel to each other and at equal intervals on the heat dissipation substrate 1 helps ensure that the tilt angle of each heat dissipation fin 5 is the same, ensuring that the heat dissipation effect of the refrigerant 10 inside is the same, which helps improve the overall heat dissipation effect of the device and facilitates uniform installation operations.

[0061] In practical applications, parameters such as the tilt angle of the heat dissipation fins 5 and the spacing between adjacent heat dissipation fins 5 can be determined according to the actual situation and needs.

[0062] In one embodiment, the heat sink fin 5 is provided with a space channel 9 for charging the refrigerant 10. The space channel 9 includes a passage formed by brazing a metal plate or by blowing.

[0063] In this embodiment, the heat dissipation fins 5 are provided with a space channel 9, which can be filled with refrigerant 10, improving the reflux effect of the space channel 9 and enhancing the internal circulation of the refrigerant 10, thereby improving the heat dissipation effect of the heat dissipation fins 5. Figures 5 to 7 As shown, this represents three other configurations of the spatial channel 9 within the heat dissipation fins 5: a large, interconnected channel, parallel channels, and multiple interconnected channels. The spatial channel 9 in the diagram is used to fill the refrigerant 10. A metal plate structure is installed within the cavity to form different channels, thereby improving the refrigerant 10's reflux effect.

[0064] In practical applications, the space channel 9 inside the heat dissipation fin 5 can be designed into other shapes according to the actual situation and needs.

[0065] It should be further explained that when charging the refrigerant 10, the space channel 9 of the heat dissipation fins 5 needs to be evacuated first, and then a certain amount of refrigerant 10 is charged so that liquid and gaseous refrigerant 10 exist in the space channel 9 at the same time, thereby ensuring the heat transfer and heat dissipation effect of the refrigerant 10.

[0066] Furthermore, the charge amount of refrigerant 10 needs to be determined by the heat that a single heat sink fin 5 should dissipate, the characteristics of refrigerant 10, and the characteristics of the space channels 9 of the heat sink fin 5. Therefore, in practical applications, the specific charge amount of refrigerant 10 can be determined according to the actual situation and needs.

[0067] In one embodiment, the housing 8 of the heat dissipation fin 5 comprises a high thermal conductivity material.

[0068] It should be noted that the top of the heat sink fin 5 generally does not contain the refrigerant 10; it primarily dissipates heat through this high thermal conductivity material component. Therefore, setting the outer shell 8 of the heat sink fin 5 as a high thermal conductivity material component can ensure and effectively improve the heat conduction and dissipation efficiency of the heat sink fin 5. The high thermal conductivity material here can be copper, aluminum alloy, or a high thermal conductivity composite material, etc.

[0069] In practical applications, the shape, material, and size of the outer shell 8 of the heat dissipation fins 5 can be determined according to the actual situation and needs.

[0070] In one embodiment, the heat dissipation fins 5 are smooth sheet-like fins, corrugated fins, or grooved fins.

[0071] It should be noted that if the heat dissipation fins 5 are smooth, flat fins, their smooth outer surface causes little air disturbance, resulting in poor heat dissipation. However, if the heat dissipation fins 5 are corrugated or grooved, their surface area for heat dissipation is larger, and they cause greater air disturbance, leading to better heat exchange and dissipation. In practical applications, the shape and heat dissipation area of ​​the heat dissipation fins 5 can be determined based on actual conditions and requirements.

[0072] In one embodiment, the angle of inclination between the heat dissipation fins 5 and the horizontal plane is 30° to 60°.

[0073] It should be noted that tilting the heat dissipation fins 5 can improve the heat dissipation effect. The tilt angle between the heat dissipation fins 5 and the horizontal plane can be 0° to 90°, and the heat dissipation effect will be better when the tilt angle is 30° to 60°.

[0074] It should be noted that the tilt angle affects the heat exchange efficiency of the radiator. Furthermore, the tilt angle setting is affected by the required heat dissipation and the size of the heat dissipation substrate 1. Therefore, in practical applications, technicians can obtain a suitable value based on theoretical calculations and multiple orthogonal experiments to optimize the heat exchange effect of the heat dissipation fins 5.

[0075] The present invention provides a heat sink, comprising: a heat sink substrate 1 and a heat sink fin assembly 3 disposed on the surface of the heat sink substrate 1. The heat sink fin assembly 3 includes: a first fin assembly inclined at a first preset angle to the surface of the heat sink substrate 1, the first fin assembly including a plurality of first heat sink fins; and a second fin assembly inclined at a second preset angle to the surface of the heat sink substrate 1, the second fin assembly including a plurality of second heat sink fins. The first fin assembly and the second fin assembly are disposed opposite to each other. Both the first heat sink fins and the second heat sink fins are filled with a refrigerant 10. A vertical air channel 7 is provided between the first fin assembly and the second fin assembly. The bottom of the first heat sink fin and the bottom of the corresponding second heat sink fin are not on the same horizontal line.

[0076] In one embodiment, the first fin group and the second fin group can be configured as devices with identical structures to facilitate manufacturing. Therefore, the first preset angle and the second preset angle are the same, the spacing between adjacent first heat dissipation fins and the spacing between adjacent second heat dissipation fins are the same, and the first heat dissipation fins and the second heat dissipation fins have the same shape and structure.

[0077] It should be noted that the first and second fin groups are arranged opposite each other, with the first and second preset angles being the same. The spacing between adjacent first heat dissipation fins is the same as the spacing between adjacent second heat dissipation fins. The first and second heat dissipation fins have the same shape and structure, and are both filled with refrigerant 10. This means that the first and second fin groups have completely identical shapes, structures, and dimensions, and are arranged correspondingly in the vertical air channels 7. However, the bottom of the first heat dissipation fin and the bottom of the corresponding second heat dissipation fin are not on the same horizontal line. This means that the first and second fin groups are staggered. In other words, the first fin group can be moved upward relative to the second fin group by a certain distance, which will cause the first heat dissipation fin and the corresponding second heat dissipation fin to be misaligned. This can effectively promote the entry of cold air into the radiator and the exit of hot air from the radiator, forming a chimney effect, thereby effectively improving the overall heat exchange efficiency of the radiator.

[0078] In practical applications, the shape, size, structure, position, and material of the heat dissipation substrate 1, preset angle, first fin group, and second fin group can be determined according to the actual situation and needs.

[0079] It should be noted that the terms "first fin group" and "first fin assembly," "first heat dissipation fin" and "second heat dissipation fin" mentioned in this application are only used to distinguish different positions and do not indicate any order.

[0080] Furthermore, it should be noted that the heat sink provided by this invention replaces the original solid heat sink fins 5, which are made of a single solid material such as metal, alloy, or graphene, or a combination of multiple solid materials, with high thermal conductivity heat dissipation units composed of solid materials and refrigerant 10, such as heat spreaders, inflatable plates, or thermosiphon plates, which undergo internal phase change processes. This device improves the thermal conductivity of the heat sink fins 5, thus better transferring the heat from the heat-generating component 2 from the heat dissipation substrate 1 to the entire heat sink fin assembly 3, thereby improving the overall heat exchange efficiency of the heat sink.

[0081] Furthermore, the refrigerant 10 inside the high thermal conductivity heat dissipation unit of the heat sink fins 5 relies on gravity for condensation, reflux, and evaporation. However, if the heat sink fins 5 are installed vertically as in a traditional radiator, the upper part of the fins 5 will not be able to contact the refrigerant 10, nor will it be able to utilize the phase change process of the refrigerant 10 to improve the thermal conductivity. As a result, the temperature distribution of the entire heat sink fins 5 will be very uneven. The upper part of the fins can only conduct heat through the solid material of the outer shell 8, and the bottom fins, because they are always submerged in the refrigerant 10, only contain liquid refrigerant 10 and cannot undergo phase change reaction heat exchange. Ultimately, this will also seriously affect the heat exchange efficiency of the heat sink fins 5.

[0082] However, the heat sink provided by the present invention has the heat sink fins 5 tilted at a certain angle on the heat sink substrate 1, which effectively increases the effective length of the wetted area inside the individual heat sink fins 5. This allows a two-phase heat exchange process to occur even in the upper part of the fins under the same refrigerant charge 10, and the part that is completely submerged at the bottom will also be reduced. These improvements can greatly improve the heat exchange capacity of the individual heat sink fins 5 at various positions, thereby improving the heat exchange efficiency of the heat sink fins 5.

[0083] Furthermore, the two sets of staggered angled heat dissipation fins 6, as well as the various air channels between the two sets of angled heat dissipation fins 6, can effectively promote the entry of cold air into the radiator and the exit of hot air from the radiator, forming a chimney effect, thereby effectively improving the overall heat exchange efficiency of the radiator.

[0084] The present invention also provides a communication device, comprising: a heat-generating component 2 and a heat sink as described above, wherein the heat sink is connected to the heat-generating component 2 to dissipate heat from the heat-generating component 2. The structure of other parts of this communication device is described in the prior art and will not be repeated here.

[0085] In addition, it should be noted that the orientation or positional relationship indicated by "vertical", "oblique", "up" etc. in this application document is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the purpose of simplifying the description and making it easier to understand, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0086] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. Any combination of all embodiments provided by this invention is within the scope of protection of this invention and will not be elaborated upon here.

[0087] The heat sink and communication device provided by the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make several improvements and modifications to the present invention without departing from the principles of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A radiator, comprising: A heat dissipation substrate (1) and a heat dissipation fin assembly (3) disposed on the surface of the heat dissipation substrate (1), characterized in that the heat dissipation fin assembly (3) includes two sets of oppositely arranged oblique heat dissipation fin assemblies (6), a vertical air channel (7) is provided between the two sets of oblique heat dissipation fin assemblies (6), each set of oblique heat dissipation fin assemblies (6) includes several oblique heat dissipation fins (5), an open V-shape is formed between the heat dissipation fins (5) of the two sets of oblique heat dissipation fin assemblies (6), and the heat dissipation fins (5) are filled with a refrigerant (10); the heat dissipation fins (5) are heat spreaders, inflatable plates, or thermosiphon plates; the heat dissipation fins (5) are provided with a space channel (9) for filling the refrigerant (10), the space channel (9) includes a connecting The space includes a large channel, parallel channels, and multiple interconnected channels; the space channel (9) includes a passage formed by brazing metal plates or by blowing; the heat dissipation fins (5) are tilted on the heat dissipation substrate (1) to increase the effective length of the wetted area inside the individual heat dissipation fins (5), thereby improving the heat exchange capacity of the individual heat dissipation fins (5) at each position under the same charge of the refrigerant (10), and the refrigerant (10) in the heat dissipation fins (5) undergoes condensation reflux and evaporation processes by gravity; the heat dissipation fins (5) are smooth sheet-like fins, corrugated fins, or grooved fins; the tilt angle between the heat dissipation fins (5) and the horizontal plane is 30° to 60°.

2. The radiator according to claim 1, characterized in that, The two sets of inclined heat dissipation fins (6) are arranged in an alternating manner to facilitate mixing of the rising airflow in the vertical air channel (7).

3. The radiator according to claim 2, characterized in that, The two sets of inclined heat dissipation fin groups (6) have the same structure.

4. The radiator according to claim 3, characterized in that, In the same inclined heat dissipation fin group (6), adjacent heat dissipation fins (5) are arranged parallel to each other and at equal intervals.

5. The radiator according to any one of claims 1 to 4, characterized in that, The outer shell (8) of the heat dissipation fins (5) comprises a high thermal conductivity material.

6. A radiator, comprising: A heat dissipation substrate (1) and a heat dissipation fin assembly (3) disposed on the surface of the heat dissipation substrate (1), characterized in that the heat dissipation fin assembly (3) comprises: A first fin group is inclined at a first preset angle to the surface of the heat dissipation substrate (1), the first fin group including a plurality of first heat dissipation fins; and a second fin group is inclined at a second preset angle to the surface of the heat dissipation substrate (1), the second fin group including a plurality of second heat dissipation fins, the first fin group and the second fin group are arranged opposite to each other. Both the first and second heat dissipation fins are filled with refrigerant (10); A vertical air channel (7) is provided between the first fin group and the second fin group, and the bottom of the first heat dissipation fin and the bottom of the corresponding second heat dissipation fin are not on the same horizontal line.

7. A communication device, characterized in that, include: The heat-generating component (2) and the heat sink according to any one of claims 1 to 6, wherein the heat sink is connected to the heat-generating component (2) to dissipate heat from the heat-generating component (2).

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