Silicon rod slicing thick slice scribing device and scribing method

Abstract

The present invention proposes a device for marking thick slices cut from a silicon rod, comprising a support assembly for support and an adjustment assembly for positioning, wherein the space enclosed by the support assembly and the adjustment assembly is sufficient for the silicon rod to pass through, and the adjustment assembly drives the support assembly to move along the width direction of the silicon rod. The present invention also proposes a method for marking thick slices cut from a silicon rod. The marking device proposed by the present invention ensures coordination with each plane of the silicon rod, can quickly locate the position of the thick slice to be cut and mark it, has a simple structure and is easy to operate, has strong practicality, and has high work efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of auxiliary devices for solar silicon wafer production, and in particular relates to a silicon rod slicing thick slice scribing device and a scribing method thereof. Background Art

[0002] Silicon wafers are made by cutting silicon rods on multi-wire saws. However, due to the uneven processing of the end face of the silicon rod, the thickness of the silicon wafers cut from the end face of the silicon rod is uneven, resulting in a low yield of the end face silicon wafers. At the same time, if the thickness of the silicon wafer near the end face of the silicon rod is too thin, the diamond wire near the end face of the silicon rod will be broken or jump due to the small support force of the silicon wafer, which will affect the cutting effect of other adjacent diamond wires and further affect the quality of other silicon wafers. Therefore, it is necessary to cut a certain width of silicon wafers from the end face of the silicon rod, that is, to cut thick slices, to ensure the stability of the diamond wire operation and the cutting quality of the silicon wafers. Therefore, the marking of the thick slices is the key to ensure the arrangement of the diamond wire and the cutting of silicon wafers.

[0003] The existing marking of thick slices is completed in the cutting room of the silicon rod installed in the online cutting machine equipment. It is necessary to open the cutting room doors on both sides. After the silicon rod is installed, multiple rulers are used to mark according to the position of the diamond wire. The operator needs to adjust the ruler at multiple angles to mark. At the same time, due to the unstable reference degree of the ruler and the different operating proficiency of the staff, the marking is inaccurate. In addition, the space in the cutting room is limited, and multiple people are required to cooperate in marking, which is very prone to safety accidents. At the same time, due to the limitation of the operating space, the marking is inaccurate, which seriously affects the cutting quality and the output rate of silicon rods per kilogram. In addition, the work efficiency is low, which seriously restricts the production efficiency. Summary of the invention

[0004] The present invention provides a silicon rod slicing thick slice scribing device and a silicon rod slicing method, which solves the technical problem that the scribing method in the prior art seriously causes inaccurate scribing of slicing thick slices, affecting the cutting quality and silicon rod output rate.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A silicon rod slicing and thick slice scribing device, comprising:

[0007] A bracket assembly for supporting and an adjustment assembly for positioning;

[0008] The space enclosed by the support assembly and the adjustment assembly is sufficient for the silicon rod to pass through and be set;

[0009] The adjusting component drives the support component to move along the width direction of the silicon rod.

[0010] Furthermore, the bracket assembly has:

[0011] A first bracket and a second bracket are arranged in parallel, wherein the lower end surfaces of the first bracket and the second bracket are arranged flush with each other and at least one set of side edges are arranged in alignment;

[0012] The first bracket is connected to the second bracket through the adjustment assembly;

[0013] The second bracket moves together with the adjusting assembly along the length direction of the adjusting assembly.

[0014] Furthermore, the second bracket is provided with a slot, and the slot is penetrated by the adjustment component;

[0015] The slot hole is a groove with an opening facing outward, and at least one side of the groove is fixedly connected to the adjustment component.

[0016] Furthermore, the adjustment assembly includes a base plate, a track placed on the base plate, and a slider adapted to the track;

[0017] One end of the bottom plate is connected to the first bracket, and the other end is suspended in the air;

[0018] The bottom plate has at least one edge close to the end surface of the silicon rod, which is arranged perpendicular to the length direction of the silicon rod;

[0019] The distance between the bottom plate and the two side edges of the first bracket is the same and is adapted to the thickness of the thick slices cut from the silicon rod.

[0020] Furthermore, it also includes a baffle assembly, which is located below the adjustment assembly and is disposed on a side of the support assembly close to the silicon rod.

[0021] Furthermore, the partition assembly comprises a first partition and a second partition, the first partition is arranged close to the first bracket and the top surface of the first partition is connected to the lower end surface of the adjustment assembly;

[0022] The second partition is disposed close to the second bracket;

[0023] The first baffle and the second baffle are respectively arranged in parallel with the first bracket and the second bracket;

[0024] The height of the second partition is not greater than the height of the first partition.

[0025] A method for marking thick silicon rod slices by swinging, using any of the marking devices described above, comprising the following steps:

[0026] The space enclosed by the support assembly and the adjustment assembly is arranged around the outer wall of the silicon rod;

[0027] Arranging the support assembly close to any one of the silicon rod end faces, and making the side edge of the support assembly close to the silicon rod end face on that side flush with the silicon rod end face;

[0028] Scribing is performed along the side edge of the adjustment assembly close to the end surface of the silicon rod.

[0029] Furthermore, before scribing along the side edge of the adjusting assembly close to the end face of the silicon rod, the method further includes:

[0030] The step of moving the second support along the track close to one side of the silicon rod is performed.

[0031] Furthermore, the second bracket moves along the track close to one side of the silicon rod until the second bracket contacts the side wall of the silicon rod.

[0032] Further, after executing the scribing along the side edge of the adjusting component close to the end face of the silicon rod, the method includes:

[0033] Executing the movement of the second support along the track away from one side of the silicon rod;

[0034] Executing the support assembly and the adjustment assembly and arranging the support assembly close to the other end face of the silicon rod, and the side edge of the support assembly close to the other end face of the silicon rod is flush with the side end face of the silicon rod;

[0035] The second support moves along the track close to one side of the silicon rod until the second support contacts the side wall of the silicon rod;

[0036] Scribing is performed along the side edge of the adjusting component close to the side end surface of the silicon rod.

[0037] Compared with the prior art, the scribing device and scribing method designed in the present invention have a simple structure and are easy to operate. They can not only ensure the coordination with the planes of the silicon rod, but also quickly locate the position of the slab to be cut and perform scribing. They are highly practical and have high work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a three-dimensional diagram of a scribing device according to an embodiment of the present invention;

[0039] Figure 2 is a front view of a scribing device according to an embodiment of the present invention;

[0040] Figure 3 is a top view of a scribing device according to an embodiment of the present invention;

[0041] Figure 4 is a schematic structural diagram of a scribing device according to another embodiment of the present invention;

[0042] Figure 5It is a schematic structural diagram of the cooperation between a scribing device and a silicon rod according to an embodiment of the present invention.

[0043] In the figure:

[0044] 10. Bracket assembly 11. First bracket 12. Second bracket

[0045] 13. slot 20. adjustment component 21. bottom plate

[0046] 22, track 23, slider 30, partition assembly

[0047] 31, first separator 32, second separator 40, silicon rod DETAILED DESCRIPTION

[0048] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0049] This embodiment provides a silicon rod slicing thick slice scribing device, such as Figure 1-3 As shown, there is a support assembly 10 for support and an adjustment assembly 20 for positioning. The space enclosed by the support assembly 10 and the adjustment assembly 20 is sufficient for the silicon rod 40 to pass through. The adjustment assembly 20 can drive the support assembly 10 to move horizontally left and right along the width direction of the silicon rod 40.

[0050] Specifically, the support assembly 10 has a first support 11 and a second support 12 arranged in parallel, the first support 11 and the second support 12 are both arranged along the length direction of the silicon rod 40, the lower end surfaces of the first support 11 and the second support 12 are arranged flush, and at least one set of side edges of the first support 11 and the second support 12 are arranged in an aligned manner, at least when the scribing device is placed for surveying, at least one set of vertically arranged side edges is arranged in an aligned manner, and the aligned side edges are arranged in an aligned manner with the end faces of the horizontally placed silicon rod 40, thereby ensuring the reference of the scribing device. Preferably, the two sets of vertical side edges of the first support 11 and the second support 12 are arranged in an aligned manner, that is, the widths of the first support 11 and the second support 12 are the same, which is more conducive to aligning both sides of the support assembly 10 with the end faces of the silicon rod 40 when the scribing device is coaxially moved, facilitating the accurate identification of the vertical reference alignment surface, without the need to disassemble the scribing device from one end of the silicon rod 40 and then turn the direction to move to the other end, saving coordination time, improving work efficiency, and being more conducive to manufacturing the first support 11 and the second support 12. The first bracket 11 is connected to the second bracket 12 through the adjustment component 20. The specific connection method will be described in detail later. The second bracket 12 and the adjustment component 20 can move together along the length direction of the adjustment component 20, that is, the adjustment component 20 drives the second bracket 12 to move horizontally in the width direction of the silicon rod 40, so that the second bracket 12 moves closer to the silicon rod 40 or away from the silicon rod 40. It is portable and easy to operate and has a simple configuration.

[0051] Furthermore, a slot hole 13 is provided on one side of the second bracket 12 near the lower end flush surface, and the slot hole 13 is set through the thickness direction of the second bracket 12, so that the slot hole 13 can be set through the adjustment component 20. The area of ​​the slot hole 13 is not less than the area of ​​the cross section of the adjustment component 20, that is, it is sufficient for the adjustment component 20 to freely pass through and move as a whole. The position of the slot hole 13 can be set in the middle of the width of the second bracket 12, or it can be set offset near any side edge in the width direction of the second bracket 12, and the shape of the slot hole 13 can be adapted to the cross section of the adjustment component 20, or it can be any shape larger than the cross section area of ​​the adjustment component 20, as long as it can ensure that the adjustment component 20 can slide through the slot hole 13 as a whole.

[0052] Preferably, the slot 13 is a groove with an opening facing outward, that is, the slot 13 is a U-shaped structure groove arranged near the vertical side of the second bracket 12 and with an opening facing outward, and at least one side of the slot 13 of the groove structure is fixedly connected to the adjustment component 20, so that the slot 13 is fixed on the adjustment component 20 and slides together with the adjustment component 20, and the adjustment component 20 can drive the second bracket 12 to slide horizontally along the length direction of the adjustment component 20. In this embodiment, the width and depth of the slot 13 of the U-shaped groove structure are greater than the width and height of the cross section of the adjustment component 20, and the horizontal upper side and the opposite side away from the opening of the slot 13 are fixedly connected to the adjustment component 20, so as to ensure the stability of the connection between the second bracket 12 and the adjustment component 20, facilitate the fixed connection between the second bracket 12 and the adjustment component 20, and also facilitate the observation of the fit between the second bracket 12 and the side wall of the silicon rod 40.

[0053] Further, the adjustment assembly 20 includes a bottom plate 21, a track 22 placed on the bottom plate 21, and a slider 23 matched with the track 22. One end of the bottom plate 21 is fixedly connected to the first bracket 11. The connection method can be bolt connection, glue bonding, welding connection, or other connection methods, as long as the bottom plate 21 and the first bracket 11 can be fixedly connected together. The other end of the bottom plate 21 is suspended. The bottom plate 21 has at least one side of the side close to the end face of the silicon rod 40 arranged perpendicular to the length direction of the silicon rod 40. Preferably, the bottom plate 21 is perpendicular to the width direction of the first bracket 11 and is arranged perpendicular to the height of the first bracket 11. The purpose is to ensure that the bottom plate 21 can be parallel to the side wall of the upper end face of 40, so that the second bracket 12, the bottom plate 21, and the first bracket 11 can form a rectangular structure that matches the cross section of the silicon rod 40. The first bracket 11 and the second bracket 12 are arranged in parallel and are flush with the end surface of the silicon rod 40. Therefore, no matter whether the end surface of the silicon rod 40 is flat or not, as long as the outer edge of the first bracket 11 or the second bracket 12 is aligned with the end surface of the silicon rod 40 and the bottom plate 21 is arranged perpendicular to the length direction of the silicon rod 40, the position of the slab to be cut can be ensured to be within the size range, and the cutting accuracy of the silicon rod 40 can be ensured.

[0054] Furthermore, the distance between the bottom plate 21 and the two side edges of the first bracket 11 is the same and is adapted to the thickness of the thick slices cut from the silicon rod 40. Then, after the first bracket 11 is fitted with the side edge of the silicon rod 40, the slider 23 is adjusted to drive the second support plate 12 to move close to the other side edge of the silicon rod 40 until it is fitted with the silicon rod 40. At the same time, since the lower end surfaces of the first bracket 11 and the second bracket 12 are flush with the lower end surface of the silicon rod 40 and are placed on the same work surface, after ensuring that the side edge of the first bracket 11 close to the end surface of the silicon rod 40 is flush with the end surface of the silicon rod 40, the distance between the side edge of the bottom plate 21 close to the end surface of the silicon rod 40 and the end surface of the silicon rod 40 is the thickness of the thick slices, that is, the side edge of the bottom plate 21 close to the end surface of the silicon rod 40 is the marking position.

[0055] In this embodiment, the first bracket 11 and the second bracket 12 can be made of metal material or resin plate; the bottom plate 21 is made of resin plate. When the first bracket 11, the second bracket 12 and the bottom plate 21 are all made of resin plate material, the structure is as follows Figure 4 As shown, the structure made of the resin plate can prevent the silicon rod 40 from directly contacting the metal material, thereby avoiding the metal ions from adhering to the silicon rod 40 and affecting the performance of the silicon wafer.

[0056] Furthermore, when the first bracket 11 and the second bracket 12 are both made of metal material, the marking device further includes a partition assembly 30, the structure of which is as follows: Figure 1-3 As shown, the partition assembly 30 is located directly below the adjustment assembly 20 and is placed on the side of the bracket assembly 10 close to the silicon rod 40. The partition assembly 30 includes a first partition 31 and a second partition 32. The first partition 31 is arranged close to the first bracket 11 and the upper end surface of the first partition 31 is fixedly connected to the lower end surface of the bottom plate 21; the second partition 32 is arranged close to the second bracket 12. The first partition 31 and the second partition 32 are arranged in parallel with the first bracket 11 and the second bracket 12 respectively. The width of the first partition 31 and the second partition 32 is not greater than the width of the first bracket 11 and the second bracket 12, and the height H2 of the second partition 32 is not greater than the height H1 of the first partition 31. In this embodiment, the first partition 31 and the second partition 32 are made of resin plates. The first partition 31 and the second partition 32 made of resin plates can prevent the bracket assembly 10 made of metal from directly contacting the silicon rod 40, and can also further improve the stability of the support adjustment assembly 20, so that the scribing device as a whole is more stable and has higher matching strength.

[0057] like Figure 5As shown, during the marking process, the marking device proposed in this embodiment can be used to mark the silicon rod 40 before it is installed in the cutting chamber. The silicon rod 40 is placed horizontally on the workbench, and the first partition 31 is first set in close contact with the side wall of the silicon rod 40 and the edge of the bracket assembly 10 close to the end face of the silicon rod 40 is aligned with the end face of the silicon rod 40. Then, the second bracket 12 is driven to move on the track 22 close to one side of the silicon rod 40 by adjusting the slider 32, and the second partition 32 is set in contact with the other side wall of the silicon rod 40. The reference position of the thick slice can be quickly determined, and the marking can be performed directly along the side edge of the bottom plate 21 close to the end face of the silicon rod 40. The operation is convenient, the controllability is high, and the marking is accurate. The marking work can be completed without the cooperation of multiple people. The work is efficient and safe, and the processing accuracy of the thick slices cut by the silicon rod 40 can be fully guaranteed, which can save more time for subsequent processing.

[0058] For silicon rods 40 whose height is less than that of the bottom plate 21, the first bracket 11 and the second bracket 12 can be fixed to the horizontal side of the silicon rod 40 during marking, and the bottom plate 21 is only suspended above the silicon rod 40. The marking can still be performed with reference to the side of the bottom plate 21 close to the end face of the silicon rod 40, which does not affect the marking effect. For silicon rods 40 whose height is greater than that of the bottom plate 21, the first bracket 11, the second bracket 12 and the bottom plate 21 can be tightly matched with the three sides of the silicon rod 40 during marking, and the first bracket 11 and the second bracket 12 are suspended. As long as the side of the first bracket 11 and the second bracket 12 close to the end face of the silicon rod 40 is flush with the end face of the silicon rod 40, marking can be performed along the side of the bottom plate 21 close to the end face of the silicon rod 40 to ensure marking accuracy.

[0059] The scribing device proposed in the present invention is fixed on one side and is closely attached to the side wall of the silicon rod 40, and the other end is slidably adjusted. The scribing device can be adapted to silicon rods 40 of different widths and sizes, has a wide range of applications, and is easy to promote; the overall structure is light and the number of components is small, all components can be made of conventional materials, no special configuration is required, the cost is low, and it is easy to process.

[0060] A method for marking thick silicon rod slices by swinging, using any of the marking devices described above, comprising the following steps:

[0061] The first step is to arrange the space enclosed by the support assembly 10 and the adjustment assembly 20 around the outer wall of the silicon rod 40 .

[0062] Specifically, the silicon rod 40 is placed horizontally on a workbench, and the first bracket 11 and the second bracket 12 are respectively placed on both sides of the silicon rod 40 along the length direction of the silicon rod 40 , and the bottom frame 21 is adjusted so that the bottom frame 21 is arranged along the width direction of the silicon rod 40 .

[0063] Step 2: Arrange the support assembly 10 close to the end face of any silicon rod 40 , and make the side edge of the support assembly 10 close to the end face of the silicon rod 40 flush with the end face of the silicon rod 40 .

[0064] Specifically, the first partition plate 31 is firstly arranged in close contact with the side wall of the silicon rod 40 and the edge of the bracket assembly 10 close to the end face of the silicon rod 40 is aligned with the end face of the silicon rod 40. Therefore, no matter whether the end face of the silicon rod 40 is flat or not, as long as the outer edge of the first bracket 11 or the second bracket 12 is aligned with the end face of the silicon rod 40, the bottom plate 21 can be arranged perpendicular to the length direction of the silicon rod 40.

[0065] Step 3: The second bracket 12 moves along the track 22 close to the side of the silicon rod 40 until the second partition plate 32 contacts the side wall of the silicon rod 40 .

[0066] Specifically, the second bracket 12 is driven to move on the track 22 close to the side of the silicon rod 40 by adjusting the slider 32, and the second partition 32 is arranged to fit the other side wall of the silicon rod 40, thereby ensuring that the first bracket 11, the bottom plate 21 and the second bracket 12 form a rectangular structure and are arranged close to the outer wall of the silicon rod 40, thereby clamping the silicon rod 40, ensuring the stability of the marking device, and facilitating the marking operation.

[0067] Step 4: Scribing is performed along the side edge of the adjustment assembly 20 close to the end surface of the silicon rod 40 .

[0068] Since the distance between the bottom plate 21 and the two side edges of the first bracket 11 is the same and the distance is adapted to the thickness of the slicing thick slice of the silicon rod 40, after the first bracket 11 is fitted with the side edge of the silicon rod 40, the slider 23 is adjusted to drive the second support plate 12 to move to the other side edge close to the silicon rod 40 until it is fitted with the silicon rod 40. At the same time, since the lower end surfaces of the first bracket 11 and the second bracket 12 are flush with the lower end surface of the silicon rod 40 and are placed on the same work surface, after ensuring that the side edge of the first bracket 11 close to the end surface of the silicon rod 40 is flush with the end surface of the silicon rod 40, the distance between the side edge of the bottom plate 21 close to the end surface of the silicon rod 40 and the end surface of the silicon rod 40 is the thickness of the slicing thick slice, that is, the side edge of the bottom plate 21 close to the end surface of the silicon rod 40 is the marking position, and then a line is drawn along the side edge of the bottom plate 21 close to the end surface of the silicon rod 40 to complete the marking work of the slicing thick slice on one side of the silicon rod 40 at this end.

[0069] Step 5: The second support 12 moves along the track 22 away from the silicon rod 40 .

[0070] Specifically, after the marking is completed, the slider 23 is adjusted to drive the second bracket 12 to move along the track 22 away from the silicon rod 40 to temporarily separate the marking device from the silicon rod 40, so as to prepare to mark the silicon rod 40 at the other end.

[0071] Step 6: Execute the support assembly 10 and the adjustment assembly 20, and place the support assembly 10 close to the other end face of the silicon rod 40, and the side of the support assembly close to the other end face of the silicon rod 40 is flush with the end face of the silicon rod 40 on this side.

[0072] This step is the same as the second step, that is, the first partition plate 31 is closely arranged on the side wall of the silicon rod 40 and the edge of the bracket assembly 10 close to the end face of the silicon rod 40 is aligned with the end face of the silicon rod 40, thereby ensuring that the bottom plate 21 is arranged perpendicular to the length direction of the silicon rod 40.

[0073] Step 7: The second bracket 12 moves along the track 22 close to one side of the silicon rod 40 until the second bracket 12 contacts the side wall of the silicon rod 40 .

[0074] This step is the same as the third step, that is, the slider 32 is adjusted to drive the second bracket 12 to move on the track 22 close to the silicon rod 40, and the second partition 32 is arranged to fit the other side wall of the silicon rod 40, thereby ensuring that the first bracket 11, the bottom plate 21 and the second bracket 12 form a rectangular structure and are arranged close to the outer wall of the silicon rod 40, thereby clamping the silicon rod 40, ensuring the stability of the marking device, and facilitating the marking operation.

[0075] Step 8: Scribe along the side edge of the adjusting assembly 20 close to the end surface of the silicon rod 40 .

[0076] Specifically, this step is the same as the fourth step, that is, after ensuring that the side edge of the first bracket 11 close to the end face of the silicon rod 40 is flush with the end face of the silicon rod 40, the distance between the side edge of the bottom plate 21 close to the end face of the silicon rod 40 and the end face of the silicon rod 40 is the thickness of the thick slice, that is, the side edge of the bottom plate 21 close to the end face of the silicon rod 40 is the marking position, and then the marking work of the thick slice on one side of the silicon rod 40 at this end can be completed by marking along the side edge of the bottom plate 21 close to the end face of the silicon rod 40.

[0077] The scribing device designed by the present invention has a simple structure and is easy to operate. It can not only ensure the coordination with each plane of the silicon rod, but also quickly locate the position of the slab to be cut and perform scribing. It has strong practicality and high working efficiency.

[0078] The present invention first makes the outer wall of the bracket assembly flush with the end face of the silicon rod, and then drives the second bracket to fit with the other side wall of the silicon rod by adjusting the position of the slider, so as to quickly determine the reference position of the thick slices cut. The operation is convenient, the controllability is high, and the marking is accurate. The marking work can be completed without the cooperation of multiple people. The work efficiency is high and safe and controllable. The processing accuracy of the thick slices cut from the silicon rod can be fully guaranteed, and more time can be saved for subsequent processing.

[0079] The partition assembly made of resin plate can prevent the bracket assembly made of metal from directly contacting the silicon rod, and can also improve the stability of the support adjustment assembly, so that the marking device as a whole is more stable and has higher matching strength.

[0080] The present invention adopts a single-side fixing method to be closely set with the side wall of the silicon rod, and the other end can be slidably adjusted to adapt to silicon rods of different widths and sizes. It has a wide range of applications and is easy to promote. The overall structure is light and the number of components is small. All components can be prepared with conventional materials, no special configuration is required, the cost is low and it is easy to process.

[0081] The above embodiments of the present invention are described in detail, and the contents are only preferred embodiments of the present invention, and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of application of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A method for marking silicon rods by slicing thick slices, characterized in that: The marking device is used for marking, wherein the marking device has: A bracket assembly for supporting and an adjustment assembly for positioning; The space enclosed by the support assembly and the adjustment assembly is sufficient for the silicon rod to pass through and be set; The adjusting component drives the support component to move along the width direction of the silicon rod; The bracket assembly comprises: A first bracket and a second bracket are arranged in parallel, wherein the lower end surfaces of the first bracket and the second bracket are arranged flush with each other and at least one set of side edges are arranged in alignment; The first bracket is connected to the second bracket through the adjustment assembly; The adjustment assembly includes a base plate, a track placed on the base plate, and a slider adapted to the track; The second bracket is provided with a slot hole, and the adjusting component penetrates the slot hole; The slot hole is a groove with an opening facing outward, and at least one side of the groove is fixedly connected to the slider; One end of the bottom plate is connected to the first bracket, and the other end is suspended in the air; The bottom plate has at least one edge close to the end surface of the silicon rod, which is arranged perpendicular to the length direction of the silicon rod; The distance between the bottom plate and the two side edges of the first bracket is the same and is adapted to the thickness of the silicon rod sliced ​​thick slices; The second bracket moves together with the slider along the length direction of the track; The marking steps include: The space enclosed by the support assembly and the adjustment assembly is arranged around the outer wall of the silicon rod; Arranging the support assembly close to any one of the silicon rod end faces, and making the side edge of the support assembly close to the silicon rod end face on that side flush with the silicon rod end face; Performing scribing along the side edge of the adjusting assembly close to the end surface of the silicon rod; The method is characterized in that, before scribing along the side edge of the adjusting assembly close to the end face of the silicon rod, the method further comprises: Executing the step of moving the second bracket along the track close to one side of the silicon rod; The second support moves along the track close to one side of the silicon rod until the second support contacts the side wall of the silicon rod.

2. A method for marking silicon rods by slicing thick slices according to claim 1, characterized in that: It also includes a baffle assembly, which is located below the adjusting assembly and is disposed on a side of the bracket assembly close to the silicon rod.

3. A method for marking thick silicon rod slices according to claim 2, characterized in that: The partition assembly comprises a first partition and a second partition, wherein the first partition is arranged close to the first bracket and the top surface of the first partition is connected to the lower end surface of the adjustment assembly; The second partition is disposed close to the second bracket; The first baffle and the second baffle are respectively arranged in parallel with the first bracket and the second bracket; The height of the second partition is not greater than the height of the first partition.

4. A method for marking silicon rods by slicing thick slices according to any one of claims 1 to 3, characterized in that: After executing the scribing along the side edge of the adjusting assembly close to the end face of the silicon rod, the method comprises: Executing the movement of the second support along the track away from one side of the silicon rod; Executing the support assembly and the adjustment assembly and arranging the support assembly close to the other end face of the silicon rod, and the side edge of the support assembly close to the other end face of the silicon rod is flush with the side end face of the silicon rod; The second support moves along the track close to one side of the silicon rod until the second support contacts the side wall of the silicon rod; Scribing is performed along the side edge of the adjusting component close to the side end surface of the silicon rod.

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