A film-making process for the working surface of commutator carbon segments

Abstract

The present invention relates to a substrate, including a top plate, a bottom plate, a stopper assembly and an adjusting device, wherein the top plate is provided with a plurality of carbon sheet holes, and the bottom plate is provided with the same number of carbon sheet columns corresponding to the positions of the carbon sheet holes and adapted thereto, the height of the carbon sheet column plus the thickness of the commutator carbon sheet is equal to the depth of the carbon sheet hole, the diameter of the carbon sheet hole is not less than the outer diameter of the commutator carbon sheet, a reset member is provided between the top plate and the bottom plate, the adjusting device controls the carbon sheet column to slide in the carbon sheet hole, and the stopper assembly limits the sliding distance of the carbon sheet column. The present invention provides a film-making process for the working surface of a commutator carbon sheet with a more firm connection between a copper shell and a carbon sheet, and a substrate used in the process.

Description

Technical Field

[0001] The invention relates to the technical field of commutators, and in particular to a film-making process for a working surface of a commutator carbon sheet. Background Art

[0002] The commutator is a key component that allows the motor to rotate continuously. The commutator consists of a welded shell and a carbon sheet. At present, the shell is mainly made of copper. The main component of the carbon sheet is carbon. Carbon and copper cannot be dissolved in each other, nor can they form intermetallic compounds, and are difficult to combine. In other words, it is difficult to weld the carbon sheet and the copper shell.

[0003] In the existing technology, a metal layer, such as copper or nickel, is often plated on the carbon surface by chemical means, and then the film-forming surface and the copper shell are bonded together by brazing to form a commutator.

[0004] The commutator formed by chemically connecting the copper shell and the carbon sheet has insufficient bonding force, which greatly shortens the service life of the commutator and cannot meet people's usage needs. Summary of the invention

[0005] In summary, in order to overcome the deficiencies of the prior art, the present invention provides a film-making process for the working surface of a commutator carbon segment in which the copper shell and the carbon segment are more firmly connected.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a substrate, comprising a top plate, a bottom plate, a limiting assembly and an adjusting device, the top plate being provided with a plurality of carbon sheet holes, the bottom plate being provided with the same number of and adaptable carbon sheet columns corresponding to the positions of the carbon sheet holes, the height of the carbon sheet column plus the thickness of the commutator carbon sheet being equal to the depth of the carbon sheet hole, the diameter of the carbon sheet hole being not less than the outer diameter of the commutator carbon sheet, a reset part being provided between the top plate and the bottom plate, the adjusting device controlling the carbon sheet column to slide in the carbon sheet hole, and the limiting assembly limiting the sliding distance of the carbon sheet column.

[0007] With such arrangement, the commutator carbon segments can be placed on the carbon segment columns in the carbon segment holes during processing, and then the substrate with the commutator carbon segments can be placed in the SLM device for processing and coating. When processing the first layer of coating, the top plate is close to the bottom plate. At this time, after the commutator carbon segments are placed in the carbon segment holes, the top surfaces of the commutator carbon segments will be in the same plane as the top surfaces of the top plates. When coating, it is only necessary to align the top surfaces of the top plates. After processing the first layer of coating, the adjustment component can be used to control the separation of the top plate and the bottom plate, so that the carbon segment columns can slide in the carbon segment holes. The sliding distance will be limited by the limiting component to the thickness of the first layer of coating. In this way, the commutator carbon segments coated with the first layer of coating can continue to be coated with the second layer of coating directly in the substrate after cleaning the powder, which makes processing more convenient.

[0008] Furthermore, a positioning column is provided on the top surface of the carbon segment column, the diameter of the positioning column is adapted to the inner diameter of the commutator carbon segment, and the diameter of the carbon segment hole is larger than the outer diameter of the commutator carbon segment.

[0009] With this arrangement, the diameter of the carbon sheet hole is larger than the outer diameter of the commutator carbon sheet. After the commutator carbon sheet is placed in, a gap will be formed between the inner wall of the carbon sheet hole and the outer wall of the commutator carbon sheet, which is convenient for removing the carbon sheet after film formation. The diameter difference between the two can be set to 3-4mm. After setting the positioning column, the commutator carbon sheet can be sleeved on the positioning column to fix its position, avoid sliding in the carbon sheet hole and causing dislocation of the SLM equipment coating, and prevent the commutator carbon sheet from contacting the inner wall of the carbon sheet hole, so as to avoid the commutator carbon sheet and the carbon sheet hole from sticking together after the metal powder melts during the processing, thereby damaging the substrate body.

[0010] Furthermore, the limiting assembly is a bolt, and a bolt hole adapted to the limiting assembly is provided on the side of the top plate facing the bottom plate, and a connecting hole that is gap-matched with the limiting assembly is provided at a position of the bottom plate corresponding to the bolt hole.

[0011] With such arrangement, the movable range is limited by inserting bolts into the connecting holes and connecting with the bolt holes, which is convenient for installation and easy for adjustment. A plurality of bolts can be arranged to be distributed at various corners of the base plate, and the positioning is more stable.

[0012] Furthermore, the reset member is a spring, and a reset groove adapted to the reset member is provided on a side of the top plate facing the bottom plate.

[0013] With such arrangement, when the regulating device is not in operation, the spring in the reset groove will push against the bottom plate, so that it will push against the limit assembly, and the structure is simple.

[0014] Furthermore, the top plate is provided with a sealing groove arranged around its side wall.

[0015] With such arrangement, a sealing ring can be sleeved in the sealing groove of the side wall of the substrate, and the sealing ring cooperated with the sealing ring on the edge of the supporting plate on the processing lifting platform can further reduce the possibility of powder falling.

[0016] Furthermore, the adjustment component is an electromagnet, which is located on a side of the top plate facing the bottom plate, and a magnetic alloy is provided on the bottom plate at a position corresponding to the adjustment component.

[0017] With such arrangement, the electromagnet on the top plate will tightly attract the bottom plate provided with the magnetic alloy when energized, and after the first layer of coating is applied, the electromagnet only needs to be powered off, and the top plate and the bottom plate will lose their adsorption force. At this time, the bottom plate will be pushed to the position limited by the limit assembly by the reset part on the top plate. The operation is convenient, and multiple electromagnets and magnetic alloys can be arranged to adsorb at multiple positions at the same time, with stronger adsorption force.

[0018] A film-making process for a commutator carbon sheet working surface comprises the following steps:

[0019] S1: Provide an SLM workbench, a first lifting platform, a processing lifting platform, a second lifting platform, a scraper, a first powder, a second powder, a high-energy beam emitter and a substrate as described in claim 6, wherein the SLM workbench is provided with a first powder trough, a processing trough and a second powder trough, the first lifting platform is adapted to the first powder trough, the substrate is adapted to the processing trough, the second lifting platform is adapted to the second powder trough, the processing trough is located between the first powder trough and the second powder trough, the substrate is located on the top of the processing lifting platform, the top plate is located on the top of the substrate, the first powder is added to the first lifting platform in the first powder trough, and the second powder is added to the second lifting platform in the second powder trough;

[0020] S2: Place the commutator carbon segment on the carbon segment column in the carbon segment hole, and use the processing lifting platform to lift the base plate to the position where the top surface of the top plate overlaps with the working surface of the SLM workbench;

[0021] S3: Use a processing lifting platform to lower the height of the substrate by a distance equal to the thickness of the first powder coating required, and use a first lifting platform to lift the first powder in the first powder tank so that the first powder is pushed above the working surface of the SLM workbench;

[0022] S4: Use a scraper to slide from one side of the first powder tank to the other side of the second powder tank on the working surface of the SLM worktable, and push the first powder on the first powder tank to above the substrate in the processing tank;

[0023] S5: The high energy beam emitter irradiates the first powder located above the commutator carbon segment;

[0024] S6: cleaning the first powder in the processing tank;

[0025] S7: De-energize the regulating component;

[0026] S8: Use a processing lifting platform to lower the height of the substrate to below the SLM workbench to a distance equal to the thickness of the coating required for the second powder, and use a first lifting platform to lift the second powder in the second powder tank so that the second powder is pushed above the working surface of the SLM workbench;

[0027] S9: Return the scraper to its original position on the working surface of the SLM workbench, and push the second powder on the second powder tank to above the substrate in the processing tank;

[0028] S10: The high energy beam emitter irradiates the second powder located above the commutator carbon segment.

[0029] With such an arrangement, the high-energy beam emitter will scan the bed of the first powder layer by layer according to the path planned in the three-dimensional CAD slice model. The scanned first powder will achieve the effect of metallurgical bonding by melting and solidifying, and finally the metal parts designed by the model will be obtained. The metal coating obtained in this way has stronger adhesion, the commutator is durable and has a long service life. The material of the first powder can be selected from materials that have affinity for carbon and affinity for the second powder. In this way, the first powder can be used as an intermediate transition layer to connect the coating of the second powder and the commutator carbon sheet. The metal coating obtained in this way has stronger adhesion, the commutator is more durable and has a longer service life. The scraper slides back and forth between the two powder grooves to scrape the two powders into the processing groove. The substrate on which the commutator carbon sheet is placed can also change the insertion depth by adjusting the components. After processing the first layer of coating, you only need to clean the powder to apply the second layer of coating, which is more convenient to operate.

[0030] Furthermore, the material of the first powder is titanium powder, and the material of the second powder is copper powder.

[0031] In this way, titanium has both the properties of affinity with carbon and affinity with copper. In addition, titanium is a transition metal with high strength, low density, high hardness, high melting point and strong corrosion resistance. Carbon-titanium alloy has the high strength and toughness of titanium alloy, and also retains the lightweight characteristics of carbon fiber. At the same time, the copper powder used in additive manufacturing and the copper material of the shell are the same element. During the welding process, the mechanical properties are better. Titanium powder uses atomized spherical powder with a powder particle size of 10μm to 20μm. The powder performance requires high purity and good fluidity. During processing, the platform in the forming chamber needs to be preheated to 50℃ to 70℃. In order to avoid oxidation of the processed parts, inert gas (such as nitrogen or argon) needs to be introduced. The purity of the inert gas is 99.99%. The thickness of the scraper powder is 0.02mm-0.05mm each time, which can be flexibly selected according to the laser processing accuracy and the size of the processed metal powder particles. The processing laser power is 80-100W, and the laser scanning The scanning speed is 20mm / s-60mm / s, the scanning spacing is 0.08-0.12mm, and the scanning direction can be reasonably selected according to different equipment to achieve a higher surface finish. The copper powder uses atomized spherical powder with a powder particle size of 15μm-30μm. The powder performance requires high purity and good fluidity. During processing, the platform in the forming chamber needs to be preheated to 150℃ to 200℃. To avoid oxidation of the processed parts, argon protective gas with a purity of 99.99% needs to be introduced. The thickness of the scraper powder is 0.02mm-0.06mm each time, which can be flexibly selected according to the laser processing accuracy and the particle size of the processed metal powder. The scanning direction can be reasonably selected according to different equipment to prepare the copper film. The equipment processing uses a green laser with a laser power of 250-300W, a laser scanning speed of 900mm / s-1050mm / s, and a scanning spacing of 40μm-55μm, which can achieve a higher surface finish.

[0032] Furthermore, after step S5, the formed first powder coating is polished by laser, and after step S10, the formed second powder coating is polished by laser.

[0033] With such settings, there are uneven burrs and spheroidization on the surface of the titanium film after processing, so laser polishing is required. Laser polishing can reduce costs, increase efficiency and obtain better surface finish. Flat-top beam fiber infrared continuous laser is used for polishing titanium film, with laser power of 70W-200W, energy density of 3J / cm2-3.82J / cm2 and pulse width of 125ns-242ns; green laser is used for polishing copper film, with laser wavelength of 515-535nm, laser power of 2W-3W and pulse frequency of 800-1000KHZ. The polishing path can be reasonably selected according to different equipment, and the polishing process needs to be carried out in argon atmosphere.

[0034] Furthermore, a powder collecting trough is provided between the processing trough and the first powder trough and the second powder trough respectively.

[0035] With such arrangement, after the scraper scrapes the first powder into the processing tank, the excess first powder will be scraped into the powder collecting tank, thereby reducing the possibility of the first powder being scraped into the second powder, and vice versa. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Schematic diagram of the structure of a substrate according to an embodiment of the present invention.

[0037] Figure 2 FIG. 4 is an exploded view of a substrate according to an embodiment of the present invention.

[0038] Figure 3 FIG. 4 is a top view of a substrate according to an embodiment of the present invention.

[0039] Figure 4 for Figure 3 AA section view.

[0040] Figure 5 for Figure 4 Enlarged view of part B.

[0041] Figure 6 Schematic diagram of the structure of the top plate of an embodiment of the present invention.

[0042] Figure 7 Schematic diagram of the film making process according to an embodiment of the present invention.

[0043] Meaning of the numbers in the figure: 1. SLM workbench, 101. First powder trough, 102. Processing trough, 103. Second powder trough, 104. Powder collecting trough, 2. First lifting platform, 3. Processing lifting platform, 4. Second lifting platform, 5. Scraper, 6. First powder, 7. Second powder, 8. High-energy beam emitter, 9. Base plate, 901. Top plate, 9011. Carbon sheet hole, 9012. Reset part, 9013. Bolt hole, 9014. Reset groove, 9015. Sealing groove, 902. Bottom plate, 9021. Carbon sheet column, 9022. Positioning column, 9023. Connecting hole, 9024. Magnetic alloy, 903. Limiting assembly, 904. Adjustment assembly. DETAILED DESCRIPTION

[0044] This specific embodiment is merely an explanation of this embodiment and is not a limitation of this embodiment. After reading this specification, those skilled in the art may make non-creative modifications to this embodiment as needed, but as long as they are within the scope of the claims of this embodiment, they are protected by patent law.

[0045] Referring to the accompanying drawings, the present invention provides the following technical solutions: a substrate 9, comprising a top plate 901, a bottom plate 902, a limiting assembly 903 and an adjusting device, the top plate 901 being provided with a plurality of carbon sheet holes 9011, the bottom plate 902 being provided with the same number of and adapted carbon sheet columns 9021 corresponding to the positions of the carbon sheet holes 9011, the height of the carbon sheet column 9021 plus the thickness of the commutator carbon sheet being equal to the depth of the carbon sheet hole 9011, the diameter of the carbon sheet hole 9011 being not less than the outer diameter of the commutator carbon sheet, a reset member 9012 being provided between the top plate 901 and the bottom plate 902, the adjusting device controlling the carbon sheet column 9021 to slide in the carbon sheet hole 9011, and the limiting assembly 903 limiting the sliding distance of the carbon sheet column 9021.

[0046] With such arrangement, during processing, the commutator carbon segments can be placed on the carbon segment columns 9021 in the carbon segment holes 9011, and then the substrate with the commutator carbon segments can be placed in the SLM device for processing and coating. When processing the first layer of coating, the top plate 901 is close to the bottom plate 902. At this time, after the commutator carbon segments are placed in the carbon segment holes 9011, the top surfaces of the commutator carbon segments will be in the same plane as the top surfaces of the top plate 901. During coating, it is only necessary to align the top surfaces of the top plate 901. After processing the first layer of coating, the adjustment component 904 can be used to control the separation of the top plate 901 and the bottom plate 902, so that the carbon segment columns 9021 can slide in the carbon segment holes 9011. The sliding distance will be limited by the limiting component 903 to the thickness of the first layer of coating. In this way, the commutator carbon segments coated with the first layer of coating can continue the second layer of coating directly in the substrate 9 after cleaning the powder, which is more convenient to process.

[0047] Preferably, in this embodiment, a positioning column 9022 is provided on the top surface of the carbon sheet column 9021, the diameter of the positioning column 9022 is adapted to the inner diameter of the commutator carbon sheet, and the diameter of the carbon sheet hole 9011 is larger than the outer diameter of the commutator carbon sheet.

[0048] With such arrangement, the diameter of the carbon sheet hole 9011 is larger than the outer diameter of the commutator carbon sheet. After the commutator carbon sheet is inserted, a gap will be formed between the inner wall of the carbon sheet hole 9011 and the outer wall of the commutator carbon sheet, which is convenient for taking out the carbon sheet after film forming. The diameter difference between the two can be set to 3-4mm. After the positioning column 9022 is set, the commutator carbon sheet can be sleeved on the positioning column 9022 to fix its position, avoid sliding in the carbon sheet hole 9011 and cause dislocation of the SLM equipment coating, and prevent the commutator carbon sheet from contacting the inner wall of the carbon sheet hole 9011, avoid the commutator carbon sheet and the carbon sheet hole 9011 from sticking together after the metal powder melts during the processing, and damage the main body of the substrate 9.

[0049] Preferably, in this embodiment, the limiting component 903 is a bolt, and a bolt hole 9013 adapted to the limiting component 903 is provided on the side of the top plate 901 facing the bottom plate 902, and a connecting hole 9023 that is loosely matched with the limiting component 903 is provided at a position corresponding to the bolt hole 9013 of the bottom plate 902.

[0050] With such arrangement, bolts are inserted into the connection holes 9023 and connected with the bolt holes 9013 to limit the range of movement, which is convenient for installation and easy for adjustment. A plurality of bolts can be arranged to be distributed at various corners of the base plate 9, so that the positioning is more stable.

[0051] Preferably, in this embodiment, the reset member 9012 is a spring, and a reset groove 9014 adapted to the reset member 9012 is provided on a side of the top plate 901 facing the bottom plate 902 .

[0052] With such arrangement, when the adjusting device is not in operation, the spring in the reset groove 9014 will push against the bottom plate 902 so that it will push against the limit assembly 903, and the structure is simple.

[0053] Preferably in this embodiment, the top plate 901 is provided with a sealing groove 9015 arranged around its side wall.

[0054] With such arrangement, a sealing ring can be sleeved in the sealing groove 9015 on the side wall of the substrate 9 , and the sealing ring on the edge of the support plate on the processing lifting platform 3 can be cooperated to further reduce the possibility of powder falling.

[0055] Preferably, in this embodiment, the adjustment component 904 is an electromagnet, which is located on a side of the top plate 901 facing the bottom plate 902 , and a magnetic alloy 9024 is provided on the bottom plate 902 at a position corresponding to the adjustment component 904 .

[0056] With such arrangement, the electromagnet on the top plate 901 will tightly attract the bottom plate 902 provided with the magnetic alloy 9024 when energized. After the first layer of coating is formed, the electromagnet only needs to be powered off, and the top plate 901 and the bottom plate 902 will lose their adsorption force. At this time, the bottom plate 902 will be pushed to the position limited by the limit assembly 903 by the reset part 9012 on the top plate 901. The operation is convenient, and multiple electromagnets and magnetic alloys 9024 can be arranged to adsorb at multiple positions at the same time, and the adsorption force is stronger.

[0057] A film-making process for a commutator carbon sheet working surface comprises the following steps:

[0058] S1: Provide an SLM workbench 1, a first lifting platform 2, a processing lifting platform 3, a second lifting platform 4, a scraper 5, a first powder 6, a second powder 7, a high-energy beam emitter 8 and a substrate 9 as described in claim 6, wherein the SLM workbench 1 is provided with a first powder trough 101, a processing trough 102 and a second powder trough 103, the first lifting platform 2 is adapted to the first powder trough 101, the substrate 9 is adapted to the processing trough 102, the second lifting platform is adapted to the second powder trough 103, the processing trough 102 is located between the first powder trough 101 and the second powder trough 103, the substrate 9 is located on the top of the processing lifting platform 3, the top plate 901 is located on the top of the substrate 9, add the first powder 6 to the first lifting platform 2 in the first powder trough 101, and add the second powder 7 to the second lifting platform 4 in the second powder trough 103;

[0059] S2: Place the commutator carbon sheet on the carbon sheet column 9021 in the carbon sheet hole 9011, and use the processing lifting platform 3 to lift the substrate 9 to a position where the top surface of the top plate 901 overlaps with the working surface of the SLM workbench 1;

[0060] S3: lowering the height of the substrate 9 by the processing lifting platform 3 to a thickness of the coating required for the first powder 6, and raising the first powder 6 in the first powder tank 101 by the first lifting platform 2, so that the first powder 6 is pushed above the working surface of the SLM workbench 1;

[0061] S4: Use the scraper 5 to slide from one side of the first powder tank 101 to the other side of the second powder tank 103 on the working surface of the SLM worktable 1 to push the first powder 6 on the first powder tank 101 onto the substrate 9 in the processing tank 102;

[0062] S5: The high energy beam emitter 8 irradiates the first powder 6 located above the commutator carbon segment;

[0063] S6: cleaning the first powder 6 in the processing tank 102;

[0064] S7: Power off the regulating component 904;

[0065] S8: Use the processing lifting platform 3 to lower the height of the substrate 9 to below the SLM workbench 1, the distance being the thickness of the coating required for the second powder 7, and use the first lifting platform 2 to lift the second powder 7 in the second powder tank 103, so that the second powder 7 is pushed above the working surface of the SLM workbench 1;

[0066] S9: Return the scraper 5 to its original position on the working surface of the SLM workbench 1, and push the second powder 7 on the second powder tank 103 onto the substrate 9 in the processing tank 102;

[0067] S10: The high energy beam emitter 8 irradiates the second powder 7 located above the commutator carbon segment.

[0068] With such arrangement, the high-energy beam emitter 8 will scan the bed of the first powder 6 layer by layer according to the path planned in the three-dimensional CAD slice model. The scanned first powder 6 is melted and solidified to achieve the effect of metallurgical bonding, and finally the metal parts designed by the model are obtained. The metal coating obtained in this way has stronger adhesion, the commutator is durable, and the service life is long. The material of the first powder 6 can be selected from materials that have affinity for carbon and affinity for the second powder 7. In this way, the first powder 6 can be used as an intermediate transition layer to connect the coating of the second powder 7 and the commutator carbon sheet. The metal coating obtained in this way has stronger adhesion, the commutator is more durable, and the service life is longer. The scraper 5 slides back and forth between the two powder grooves to scrape the two powders into the processing groove 102. The substrate 9 on which the commutator carbon sheet is placed can also change the insertion depth by adjusting the component 904. After processing the first layer of coating, you only need to clean the powder to carry out the second layer of coating, which is more convenient to operate.

[0069] Preferably, in this embodiment, the material of the first powder 6 is titanium powder, and the material of the second powder 7 is copper powder.

[0070] In this way, titanium has both the properties of affinity with carbon and affinity with copper. In addition, titanium is a transition metal with high strength, low density, high hardness, high melting point and strong corrosion resistance. Carbon-titanium alloy has the high strength and toughness of titanium alloy, and also retains the lightweight characteristics of carbon fiber. At the same time, the copper powder used in additive manufacturing and the copper material of the shell are the same element. During the welding process, the mechanical properties are better. Titanium powder uses atomized spherical powder with a powder particle size of 10μm to 20μm. The powder performance requires high purity and good fluidity. During processing, the platform in the forming chamber needs to be preheated to 50℃ to 70℃. In order to avoid oxidation of the processed parts, inert gas (such as nitrogen or argon) needs to be introduced. The purity of the inert gas is 99.99%. The thickness of the scraper powder is 0.02mm-0.05mm each time, which can be flexibly selected according to the laser processing accuracy and the size of the processed metal powder particles. The processing laser power is 80-100W, and the laser scanning The scanning speed is 20mm / s-60mm / s, the scanning spacing is 0.08-0.12mm, and the scanning direction can be reasonably selected according to different equipment to achieve a higher surface finish. The copper powder uses atomized spherical powder with a powder particle size of 15μm-30μm. The powder performance requires high purity and good fluidity. During processing, the platform in the forming chamber needs to be preheated to 150℃ to 200℃. To avoid oxidation of the processed parts, argon protective gas with a purity of 99.99% needs to be introduced. The thickness of the scraper powder is 0.02mm-0.06mm each time, which can be flexibly selected according to the laser processing accuracy and the particle size of the processed metal powder. The scanning direction can be reasonably selected according to different equipment to prepare the copper film. The equipment processing uses a green laser with a laser power of 250-300W, a laser scanning speed of 900mm / s-1050mm / s, and a scanning spacing of 40μm-55μm, which can achieve a higher surface finish.

[0071] Furthermore, after step S5, the formed first powder coating is polished by laser, and after step S10, the formed second powder coating is polished by laser.

[0072] With such settings, there are uneven burrs and spheroidization on the surface of the titanium film after processing, so laser polishing is required. Laser polishing can reduce costs, increase efficiency and obtain better surface finish. Flat-top beam fiber infrared continuous laser is used for polishing titanium film, with laser power of 70W-200W, energy density of 3J / cm2-3.82J / cm2 and pulse width of 125ns-242ns; green laser is used for polishing copper film, with laser wavelength of 515-535nm, laser power of 2W-3W and pulse frequency of 800-1000KHZ. The polishing path can be reasonably selected according to different equipment, and the polishing process needs to be carried out in argon atmosphere.

[0073] Preferably, in this embodiment, a powder collecting groove 104 is provided between the processing groove 102 and the first powder groove 101 and the second powder groove 103 .

[0074] With such arrangement, after the scraper 5 scrapes the first powder 6 into the processing tank 102 , the excess first powder 6 will be scraped into the powder collecting tank 104 , thereby reducing the possibility of the first powder 6 being scraped into the second powder 7 , and vice versa.

[0075] Although the present invention has been described in detail with reference to the aforementioned embodiments, the protection scope of the present invention is not limited thereto, and any technician familiar with the technical field can make equivalent substitutions or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A film-making process for the working surface of a commutator carbon segment, comprising the following steps: S1: Provide an SLM workbench, a first lifting platform, a processing lifting platform, a second lifting platform, a scraper, a first powder, a second powder, a high-energy beam emitter and a substrate, wherein the substrate includes a top plate, a bottom plate, a limit assembly and an adjustment device, the top plate is provided with a plurality of carbon sheet holes, the bottom plate is provided with the same number of carbon sheet columns corresponding to the positions of the carbon sheet holes and adapted thereto, the height of the carbon sheet column plus the thickness of the commutator carbon sheet is equal to the depth of the carbon sheet hole, the diameter of the carbon sheet hole is not less than the outer diameter of the commutator carbon sheet, a reset piece is provided between the top plate and the bottom plate, the adjustment device controls the carbon sheet column to slide in the carbon sheet hole, and the limit assembly limits the carbon sheet column Sliding distance; the adjustment component is an electromagnet, the electromagnet is located on the side of the top plate facing the bottom plate, the bottom plate is provided with a magnetic alloy at a position corresponding to the adjustment component, the SLM workbench is provided with a first powder trough, a processing trough and a second powder trough, the first lifting platform is adapted to the first powder trough, the base plate is adapted to the processing trough, the second lowering platform is adapted to the second powder trough, the processing trough is located between the first powder trough and the second powder trough, the base plate is located on the top of the processing lifting platform, the top plate is located on the top of the base plate, the first powder is added to the first lifting platform in the first powder trough, and the second powder is added to the second lifting platform in the second powder trough; S2: Place the commutator carbon segment on the carbon segment column in the carbon segment hole, and use the processing lifting platform to lift the base plate to the position where the top surface of the top plate overlaps with the working surface of the SLM workbench; S3: Use a processing lifting platform to lower the height of the substrate by a distance equal to the thickness of the first powder coating required, and use a first lifting platform to lift the first powder in the first powder tank so that the first powder is pushed above the working surface of the SLM workbench; S4: Use a scraper to slide from one side of the first powder tank to the other side of the second powder tank on the working surface of the SLM worktable, and push the first powder on the first powder tank to above the substrate in the processing tank; S5: The high energy beam emitter irradiates the first powder located above the commutator carbon segment; S6: cleaning the first powder in the processing tank; S7: De-energize the regulating component; S8: Use a processing lifting platform to lower the height of the substrate to below the SLM workbench to a distance equal to the thickness of the coating required for the second powder, and use a first lifting platform to lift the second powder in the second powder tank so that the second powder is pushed above the working surface of the SLM workbench; S9: Return the scraper to its original position on the working surface of the SLM workbench, and push the second powder on the second powder tank to above the substrate in the processing tank; S10: The high energy beam emitter irradiates the second powder located above the commutator carbon segment; The material of the first powder is titanium powder, and the material of the second powder is copper powder.

2. A commutator carbon segment working surface film making process according to claim 1, characterized in that: After step S5, the formed first powder coating is polished by laser, and after step S10, the formed second powder coating is polished by laser.

3. A commutator carbon segment working surface film making process according to claim 1, characterized in that: A powder collecting trough is respectively provided between the processing trough and the first powder trough and the second powder trough.

4. A commutator carbon segment working surface film making process according to claim 1, characterized in that: A positioning column is provided on the top surface of the carbon sheet column, the diameter of the positioning column is adapted to the inner diameter of the commutator carbon sheet, and the diameter of the carbon sheet hole is larger than the outer diameter of the commutator carbon sheet.

5. The film-making process for the working surface of a commutator carbon segment according to claim 1, characterized in that: The limiting assembly is a bolt, and a bolt hole adapted to the limiting assembly is provided on the side of the top plate facing the bottom plate, and a connecting hole that is gap-matched with the limiting assembly is provided at a position of the bottom plate corresponding to the bolt hole.

6. A commutator carbon segment working surface film making process according to claim 1, characterized in that: The reset member is a spring, and a reset groove adapted to the reset member is provided on one side of the top plate facing the bottom plate.

7. A commutator carbon segment working surface film making process according to claim 1, characterized in that: The top plate is provided with a sealing groove arranged around its side wall.

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