Printed wiring board and electronic device

Abstract

The printed wiring board (1X) of the present invention comprises: an electrode pad (2A) welded to an electrode (51A) of an electronic component (5); an electrode pad (2B) welded to an electrode (51B) of an electronic component (5); a blocking conductor (3A) connected to the electrode pad (2A); and a blocking conductor (3B) connected to the electrode pad (2B), wherein the blocking conductor (3A) and the blocking conductor (3B) are arranged at positions opposite to each other with a gap area (15) of an adhesive (4) arranged when bonding the electronic component (5), and the blocking conductor (3A, 3B) and the electrode pad (2A, 2B) are arranged in a manner such that the electrode pad (2A) is opposite to the gap area (15) via the blocking conductor (3A), and the electrode pad (2B) is opposite to the gap area (15) via the blocking conductor (3B).

Description

Technical Field

[0001] The present invention relates to a printed wiring board and an electronic device to which electrodes of electronic components are soldered. Background Art

[0002] As one of the methods for soldering electronic components to a printed wiring board, there is a soldering method called mixed mounting. In this method, an adhesive is applied to one surface of the printed wiring board, and a surface mounting component is mounted on the adhesive to temporarily fix the surface mounting component. Thereafter, the printed wiring board is reversed, and the electronic component wire (insertion component) is inserted into the through hole from the other surface side of the printed wiring board, and the surface mounting component and the insertion component are jet soldered together. Thus, during mixed mounting, since the surface mounting component must be kept in contact with the jet solder in a downward state, it is necessary to apply the adhesive and temporarily fix the electronic component.

[0003] In this mixed mounting, when a surface mount component is mounted on the adhesive, the adhesive is squeezed and expanded by the surface mount component on the adhesive, so that the adhesive is squeezed onto the electrode pad of the printed wiring board. In this case, the adhesive enters between the electrode of the surface mount component and the electrode pad of the printed wiring board, thereby hindering welding (metal bonding) and reducing the welding quality of the printed wiring board.

[0004] In the printed wiring board described in Patent Document 1, a frame-shaped copper foil is provided between electrode pads for preventing diffusion of an adhesive.

[0005] Patent Document 1: Japanese Utility Model Publication No. 58-175668

[0006] However, in the technology of Patent Document 1, since the frame-shaped copper foil is formed between the electrode pads, there is a problem that a short circuit is easily generated between the electrode pads via the frame-shaped copper foil during soldering. Summary of the invention

[0007] The present invention has been made in view of the above circumstances, and an object of the present invention is to obtain a printed wiring board capable of preventing a short circuit between electrode pads and suppressing the spread of an adhesive.

[0008] In order to solve the above-mentioned problems and achieve the purpose, the printed wiring board of the present invention comprises: a first electrode pad welded to a first electrode of an electronic component; a second electrode pad welded to a second electrode of the electronic component; a first blocking conductor connected to the first electrode pad; and a second blocking conductor connected to the second electrode pad. The first blocking conductor and the second blocking conductor are arranged at positions opposite to each other with an adhesive region where an adhesive is arranged when the electronic component is bonded, and the first electrode pad and the second electrode pad are arranged in such a manner that the first electrode pad is opposite to the adhesive region via the first blocking conductor, and the second electrode pad is opposite to the adhesive region via the second blocking conductor.

[0009] The printed wiring board according to the present invention has the effect of preventing a short circuit between electrode pads and suppressing the spread of an adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a plan view showing the structure of the printed wiring board according to the first embodiment.

[0011] Figure 2 It means in Figure 1 A diagram of a printed wiring board in a state where an adhesive is applied.

[0012] Figure 3 It means in Figure 2 A diagram showing a printed wiring board with electronic components mounted thereon.

[0013] Figure 4 It is used for Figure 3 FIG. 1 is a diagram illustrating the state of an adhesive when electronic components are removed from a printed wiring board.

[0014] Figure 5 Yes Figure 3 A diagram showing a state where a printed wiring board is being soldered.

[0015] Figure 6 Yes Figure 3 FIG. 1 is a diagram showing the structure of a printed wiring board after soldering of the printed wiring board.

[0016] Figure 7 This is a diagram showing a configuration of an electronic device including the printed wiring board according to the first embodiment.

[0017] Figure 8 It is a plan view showing the structure of a printed wiring board according to the second embodiment. DETAILED DESCRIPTION

[0018] Hereinafter, a printed wiring board and an electronic device according to embodiments of the present invention will be described in detail based on the drawings. In addition, the present invention is not limited to these embodiments.

[0019] Implementation Method 1

[0020] Figure 1 It is a plan view showing the structure of the printed wiring board according to the first embodiment. Figure 2 It means in Figure 1 FIG. 1 is a diagram showing a state where a printed wiring board is coated with an adhesive. Figure 1 , Figure 2 and the following Figure 3 , Figure 4 , Figure 8 In the following, the structure of the printed wiring board 1X is described with the horizontal right direction of the paper as the X-axis direction, the vertical direction of the paper as the Y-axis direction, and the direction perpendicular to the paper as the Z-axis direction.

[0021] Electrode pads 2A and 2B for joining the electronic component 5 described later are provided on the upper surface of the printed wiring board 1X. The electrode pads 2A and 2B each have a rectangular upper surface having two sides extending in the X-axis direction and two sides extending in the Y-axis direction. The electrode pads 2A and 2B are arranged on the printed wiring board 1X in such a manner that one side of the electrode pad 2A extending in the Y-axis direction and one side of the electrode pad 2B extending in the Y-axis direction are opposed to each other via a gap area 15. An adhesive 4 for bonding the electronic component 5 is arranged in the central area of ​​the gap area 15. When the electronic component 5 is bonded to the printed wiring board 1X, the electrode pad 2A and the electrode pad 2B are bridged by the electronic component 5, and the electronic component 5 is pressed from above the adhesive 4 in such a manner that the electronic component 5 is bonded to the adhesive 4.

[0022] Blocking conductors 3A and 3B are formed next to the electrode pads 2A and 2B, and the blocking conductors 3A and 3B serve as a block for the adhesive 4 when the electronic component 5 presses and expands the adhesive 4. The blocking conductor 3A prevents the adhesive 4 from entering the electrode pad 2A and prevents the solder from entering the end of the electrode 51A (the electrode end 57A described later). The blocking conductor 3B prevents the adhesive 4 from entering the electrode pad 2B and prevents the solder from entering the end of the electrode 51B (the electrode end 57B described later).

[0023] The blocking conductor 3A is connected to the electrode pad 2A, and the blocking conductor 3B is connected to the electrode pad 2B. The blocking conductor 3A is arranged between the gap region 15 and the electrode pad 2A, and the blocking conductor 3B is arranged between the gap region 15 and the electrode pad 2B. For example, the blocking conductor 3A and the electrode pad 2A are formed integrally by the same conductor, and the blocking conductor 3B and the electrode pad 2B are formed integrally by the same conductor.

[0024] In addition, the blocking conductor 3A and the electrode pad 2A may be formed separately. The blocking conductor 3B and the electrode pad 2B may be formed separately. In addition, the blocking conductor 3A and the electrode pad 2A may be different types of conductors. In addition, the blocking conductor 3B and the electrode pad 2B may be different types of conductors.

[0025] The blocking conductors 3A and 3B are configured to surround a portion of the periphery of the gap region 15. One end of each of the blocking conductors 3A and 3B is in a straight line shape, and the other end is in a curved line shape. That is, the blocking conductor 3A has a straight line side at one end in the X-axis direction, and a curved line side, namely, a curved line side 31A, at the other end. In addition, the blocking conductor 3B has a straight line side at one end in the X-axis direction, and a curved line side, namely, a curved line side 31B, at the other end. The straight line side of the blocking conductor 3A is joined to the side of the electrode pad 2A extending in the Y-axis direction, and the straight line side of the blocking conductor 3B is joined to the side of the electrode pad 2B extending in the Y-axis direction. Moreover, the curved line side 31A of the blocking conductor 3A and the curved line side 31B of the blocking conductor 3B are opposite to each other via the gap region 15.

[0026] For example, the curved side 31A of the blocking conductor 3A is an arc equidistant from the center of the slot region 15, and the curved side 31B of the blocking conductor 3B is an arc equidistant from the center of the slot region 15. In this case, since the curved sides 31A and 31B are not parallel, the distance between the curved sides 31A and 31B is different depending on different positions on the curved sides 31A and 31B.

[0027] The distance between the curved edges 31A and 31B in the X-axis direction is the longest distance (the longest distance L2) between the center of the curved edge 31A and the center of the curved edge 31B. The distance between the curved edges 31A and 31B in the X-axis direction is the shortest distance (the shortest distance L1) between the minimum Y-coordinate position of the curved edge 31A and the minimum Y-coordinate position of the curved edge 31B. Similarly, the distance between the curved edges 31A and 31B in the X-axis direction is the shortest distance (the shortest distance L1) between the maximum Y-coordinate position of the curved edge 31A and the maximum Y-coordinate position of the curved edge 31B. That is, the distance between the curved edges 31A and 31B in the X-axis direction is the longest between the center of the curved edge 31A and the center of the curved edge 31B, and becomes shorter as it moves away from the center of the curved edges 31A and 31B.

[0028] The portion of the barrier conductor 3A where the shortest distance L1 is formed is protruded when the barrier conductor 3A is viewed from above. The portion of the barrier conductor 3B where the shortest distance L1 is formed is protruded when the barrier conductor 3B is viewed from above.

[0029] Thus, the gap region 15 surrounded by the curved sides 31A and 31B is arranged to keep a specific distance from the center of the gap region 15. The adhesive 4 is applied to the center of the gap region 15 as a circular region by any method. The center of the gap region 15 is the center of the region where the electronic component 5 is mounted.

[0030] In addition, the curved edges 31A and 31B are not limited to circular arcs, and may also be curves such as elliptical arcs. In addition, the curved edges 31A and 31B may be replaced by a side shape formed by connecting a plurality of straight lines. In this case, the plurality of sides are arranged along the curve.

[0031] Figure 3 It means in Figure 2 FIG. 1 is a diagram showing a state where an electronic component is mounted on a printed wiring board 1X. The electronic component 5 is a surface mounted component mounted on the surface of the printed wiring board 1X. The sheet-like electronic component 5 has a rectangular upper surface having two sides extending in the X-axis direction and two sides extending in the Y-axis direction.

[0032] The electronic component 5 is provided with an electrode 51A soldered to the electrode pad 2A of the printed wiring board 1X, and an electrode 51B soldered to the electrode pad 2B of the printed wiring board 1X. In the electronic component 5, the electrode 51A is arranged at one end, and the electrode 51B is arranged at the other end. The surface of the central portion 55 sandwiched by the electrode 51A and the electrode 51B is formed by an insulating component. In this way, the electronic component 5 is composed of the central portion 55 whose surface is formed by the insulating component, and the electrodes 51A and 51B arranged at positions opposite to each other via the central portion 55. The distance between the electrodes 51A and 51B, that is, the inter-electrode distance is the inter-electrode distance M1. That is, Figure 3 The distance (dimension) of the central portion 55 in the X-axis direction is the inter-electrode distance M1.

[0033] Electronic component 5 is placed on printed wiring board 1X in such a manner that at least a portion of electrode 51A overlaps electrode pad 2A, at least a portion of electrode 51B overlaps electrode pad 2B, at least a portion of electrode 51A overlaps adhesive 4 , and at least a portion of electrode 51B overlaps adhesive 4 .

[0034] The longest distance L2 of the blocking conductors 3A and 3B is greater than the inter-electrode distance M1. The adhesive 4 is pressed and expanded by the electronic component 5. In addition, the blocking conductors 3A and 3B are configured to have a size and shape that allows the curved sides 31A and 31B to be covered by the electronic component 5. Therefore, the electronic component 5 is arranged on the blocking conductors 3A and 3B in such a manner that the curved sides 31A and 31B are covered by the electronic component 5. That is, the electronic component 5 is arranged in such a manner that the portions of the blocking conductors 3A and 3B that become the shortest distance L1 and the longest distance L2 are within the outer shape of the electronic component 5.

[0035] The printed wiring board 1X is provided with a through hole, and an insertion component (not shown) is inserted into the through hole from the back side of the printed wiring board 1X. The insertion component will be described later.

[0036] Thus, the printed wiring board 1X includes: an electrode pad 2A (first electrode pad) soldered to an electrode 51A (first electrode) of an electronic component 5; an electrode pad 2B (second electrode pad) soldered to an electrode 51B (second electrode) of an electronic component 5; a blocking conductor 3A (first blocking conductor) connected to the electrode pad 2A; and a blocking conductor 3B (second blocking conductor) connected to the electrode pad 2B. The blocking conductor 3A and the blocking conductor 3B are arranged at positions facing each other with a gap region 15 (adhesive region) where the adhesive 4 is arranged when the electronic component 5 is bonded, and the electrodes 51A and 51B are arranged in such a manner that the electrode pad 2A faces the gap region 15 via the blocking conductor 3A, and the electrode pad 2B faces the gap region 15 via the blocking conductor 3B.

[0037] Figure 4 It is used for Figure 3 FIG. 1 is a diagram for explaining the state of the adhesive when the electronic component is removed from the printed wiring board. When the adhesive 4 is pressed and expanded by the electronic component 5, the adhesive 4 expands in the gap area 15. Since the blocking conductors 3A and 3B are formed outside the gap area 15, the expansion of the adhesive 4 is suppressed by the blocking conductors 3A and 3B and does not reach the electrode pads 2A and 2B. The adhesive 4 that is pressed and expanded by the electronic component 5 and suppressed by the blocking conductors 3A and 3B becomes a flattened adhesive 40.

[0038] The printed wiring board 1X on which the electronic component 5 and the insert components are arranged is subjected to jet welding (flow welding).

[0039] Figure 5 Yes Figure 3 This is a diagram showing the state of soldering on a printed wiring board. Figure 5 , a side view of a printed wiring board 1X is shown. Figure 5 and the following Figure 6 In the figure, the insertion member inserted into the through hole is omitted.

[0040] After the adhesive 4 is applied to the printed wiring board 1X and the electronic component 5 is mounted on the adhesive 4, the insert component is inserted. The printed wiring board 1X is fed into a jet flow soldering device 6 for jet flow soldering. The jet flow soldering device 6 jets the printed wiring board 1X by ejecting molten solder 7 from an ejection port. In this way, the jet flow soldering device 6 performs soldering by immersing the electronic component 5 temporarily fixed by the adhesive 4 in the molten solder 7.

[0041] Figure 6 It means in Figure 3 A diagram showing the structure of a printed wiring board after soldering has been performed on the printed wiring board. Figure 6 It is shown that Figure 3 AA cross-sectional view of printed wiring board 1X shown. By jet soldering printed wiring board 1X, electrode 51A of electronic component 5 is joined to electrode pad 2A of printed wiring board 1X by solder 8A. In addition, electrode 51B of electronic component 5 is joined to electrode pad 2B of printed wiring board 1X by solder 8B.

[0042] In the ground plane (bottom surface) in contact with the printed wiring board 1X in the electronic component 5, the solder is not bonded to the electrode terminals 57A and 57B because the flattened adhesive 40 spreads to the blocking conductors 3A and 3B. The electrode terminal 57A is the boundary between the center position of the blocking conductor 3A and the center portion 55, and the electrode terminal 57B is the boundary between the center position of the blocking conductor 3B and the center portion 55.

[0043] Thus, in the first embodiment, the electrode pads 2A and 2B and the blocking conductors 3A and 3B connected to the electrode pads 2A and 2B are formed on the surface of the printed wiring board 1X. Moreover, the longest distance L2 between the blocking conductors 3A and 3B is greater than the inter-electrode distance M1 of the electronic component 5 to be mounted later. With respect to the printed wiring board 1X, the adhesive 4 is applied to the center between the electrode pads 2A and 2B, and the electronic component 5 is mounted just above the adhesive 4. As a result, the adhesive 4 is squeezed and expanded to become a flattened adhesive 40. Since the flattened adhesive 40 is suppressed from flowing onto the electrode pads 2A and 2B by the blocking conductors 3A and 3B, it does not hinder the subsequent soldering. That is, the flattened adhesive 40 does not hinder the bonding of the blocking conductor 3A with the solder 8A of the electrode pad 2A, and does not hinder the bonding of the blocking conductor 3B with the solder 8B of the electrode pad 2B. In this way, the blocking conductors 3A and 3B prevent the soldering (metal bonding) from being hindered, so that the soldering quality of the printed wiring board 1X can be prevented from being reduced.

[0044] In addition, since the longest distance L2 is greater than the inter-electrode distance M1, the adhesive 4 is adhered to the electrode ends 57A and 57B on the bottom surface of the electronic component 5. Figure 6 As shown, solder 8A, 8B is not bonded to electrode terminals 57A, 57B. Thus, even if printed wiring board 1X is deformed after soldering, cracks can be prevented from entering into electronic component 5 from electrode terminals 57A, 57B on the bottom surface of electronic component 5.

[0045] In addition, the blocking conductors 3A and 3B are arranged so that the portion forming the shortest distance L1 (the first portion of the blocking conductor 3A and the second portion of the blocking conductor 3B) is within the outer shape range (bottom surface range) of the electronic component 5. The first portion of the blocking conductor 3A is a protruding region when the blocking conductor 3A is observed from the upper surface side, and the second portion of the blocking conductor 3B is a protruding region when the blocking conductor 3B is observed from the upper surface side. According to this structure, even if the mounting position of the electronic component 5 is offset in the X-axis direction, the protruding region forming the shortest distance L1 can be easily overlapped with the electrodes 51A and 51B of the electronic component 5. The protruding region forming the shortest distance L1 of the blocking conductors 3A and 3B is a region firmly bonded to the electrodes 51A and 51B. Therefore, by setting the structure in which the protruding region forming the shortest distance L1 is converged within the outer shape range of the electronic component 5, the electrode 51A is firmly bonded to the blocking conductor 3A, and the electrode 51B is firmly bonded to the blocking conductor 3B.

[0046] Furthermore, in a printed wiring board, if the gap between electrode pads is simply enlarged, if the mounting position of the electronic component is misaligned, the electrodes of the electronic component may be separated from the electrode pads of the printed wiring board, and soldering may not be performed.

[0047] Furthermore, in a printed wiring board, when the gap between electrode pads is simply reduced, cracks may develop from the electrode terminals on the bottom surface of the electronic component and enter the inside of the electronic component due to deformation of the printed wiring board after soldering.

[0048] In addition, in a printed wiring board, when a barrier pattern independent of the electrode pad is used between the electrode pads to suppress the expansion of the adhesive, it is difficult to comply with the minimum spacing (line and space) between the conductor and the non-conductor in the printed wiring board. In addition, a short circuit is easily generated between the electrode pads through the barrier pattern during welding. Therefore, the welding quality is reduced and the insulation reliability is reduced.

[0049] Figure 7 The electronic device 100 is a diagram showing a structure of an electronic device including a printed wiring board according to the first embodiment. Figure 6 Printed wiring board 1X shown. The electronic component 5 and the insert component are soldered to the printed wiring board 1X provided in the electronic device 100 as described above.

[0050] As described above, in the first embodiment, the electrode pads 2A and the blocking conductor 3A connected to the electrode pads 2A, and the electrode pads 2B and the blocking conductor 3B connected to the electrode pads 2B are formed between the electrode pads 2A and 2B on the printed wiring board 1X. Thus, the electrode pads 2A and 2B can suppress the expansion of the adhesive 4. In addition, a wide gap area 15 can be ensured, so that a short circuit between the electrode pads 2A and 2B can be prevented. Therefore, a short circuit between the electrode pads 2A and 2B can be prevented and the expansion of the adhesive 4 can be suppressed.

[0051] Implementation Method 2

[0052] Next, use Figure 8 Embodiment 2 of the present invention will be described. In Embodiment 2, a resin is formed on the upper surfaces of barrier conductors 3A and 3B to increase the barrier for suppressing the squeeze-out of adhesive 4 .

[0053] Figure 8 FIG. 2 is a plan view showing the structure of a printed wiring board according to Embodiment 2. Figure 8 The implementation and Figure 1 In the printed wiring board 1X of the illustrated first embodiment, components having the same functions are denoted by the same reference numerals, and redundant descriptions are omitted.

[0054] Compared with the printed wiring board 1X, the printed wiring board 1Y of the second embodiment has a resin 9A formed on the barrier conductor 3A, and a resin 9B formed on the barrier conductor 3B. The resin 9A overlaps with the center of the upper surface of the barrier conductor 3A, and the resin 9B overlaps with the center of the upper surface of the barrier conductor 3B. That is, the resins 9A and 9B are arranged at the portion of the upper surface of the barrier conductors 3A and 3B where the longest distance L2 is formed. In addition, the resin 9A may overlap with the entire upper surface of the barrier conductor 3A, or may overlap with a part thereof. The resin 9B may overlap with the entire upper surface of the barrier conductor 3B, or may overlap with a part thereof.

[0055] Resins 9A and 9B are auxiliary materials used when manufacturing printed wiring board 1Y. Examples of resins 9A and 9B are solder resist and symbol printing ink. Resins 9A and 9B may be laminated only once or may be laminated multiple times.

[0056] Thus, in the printed wiring board 1Y, since the resins 9A and 9B are arranged at the locations of the barrier conductors 3A and 3B forming the longest distance L2, the barrier height is increased, and therefore the effect of preventing the flattened adhesive 40 from entering onto the electrode pads 2A and 2B is higher than that of the printed wiring board 1X.

[0057] In addition, as the coating method of the adhesive 4 of embodiments 1 and 2, there are: a method of transferring the adhesive 4 through a metal mask using a printer in the same way as solder paste printing; a method of transferring the adhesive 4 through a nozzle using an adhesive coating machine; and a method of coating the printed wiring boards 1X and 1Y by spraying the adhesive 4 with a jet dispenser, etc.

[0058] Printed wiring boards 1X and 1Y used in the first and second embodiments use a substrate made of an insulating material such as glass woven fabric, glass nonwoven fabric, or paper substrate impregnated with epoxy resin, polyimide resin, phenolic resin, or the like.

[0059] Furthermore, the material of the molten solder 7 used in the first and second embodiments can be, for example, a solder alloy (Sn-3Ag-0.5Cu) containing 3% by mass of Ag (silver), 0.5% by mass of Cu (copper), and the remainder being Sn (tin) and inevitable impurities. In addition, the material of the molten solder 7 is not limited thereto, and any one of Sn-Cu solder, Sn-Bi (bismuth) solder, Sn-In (indium) solder, Sn-Sb (antimony) solder, and Sn-Pb (lead) solder can also be used.

[0060] As described above, in the second embodiment, since the resin 9A and 9B are formed on the upper surface of the barrier conductors 3A and 3B, the barrier for preventing the adhesive 4 from squeezing out becomes high. As a result, the effect of preventing the adhesive 4 from entering the electrode pads 2A and 2B can be improved. In addition, the effect of preventing the solder 8A and 8B from entering the electrode terminals 57A and 57B can be improved.

[0061] The configuration described in the above embodiment is an example of the content of the present invention, and may be combined with other well-known technologies, or a part of the configuration may be omitted or modified within the scope not departing from the gist of the present invention.

[0062] Description of Reference Numerals

[0063] 1X, 1Y...printed wiring board; 2A, 2B...electrode pad; 3A, 3B...blocking conductor; 4...adhesive; 5...electronic component; 6...jet soldering device; 9A, 9B...resin; 15...gap area; 31A, 31B...curved edge; 40...flattened adhesive; 51A, 51B...electrode; 55...central portion; 57A, 57B...electrode end; 100...electronic device.

Claims

1. A printed wiring board, wherein: The printed wiring board comprises: A first electrode pad is welded to a first electrode of the electronic component; A second electrode pad, welded to a second electrode of the electronic component; a first barrier conductor connected to the first electrode pad and having a resin formed on an upper surface thereof; as well as a second barrier conductor connected to the second electrode pad and having a resin formed on an upper surface thereof, The first blocking conductor and the second blocking conductor are arranged at positions facing each other with an adhesive region where an adhesive is arranged when the electronic component is bonded so as to block the adhesive when the electronic component presses and expands the adhesive, and the first electrode pad and the second electrode pad are arranged so that the first electrode pad faces the adhesive region via the first blocking conductor, and the second electrode pad faces the adhesive region via the second blocking conductor. The longest distance at the location where the longest distance is formed between the first blocking conductor and the second blocking conductor in the direction in which the first electrode pad and the second electrode pad are arranged side by side is greater than the distance between the first electrode and the second electrode, that is, the distance between the electrodes, and the adhesive is bonded to the electrode ends of the first electrode and the electrode ends of the second electrode.

2. The printed wiring board according to claim 1, wherein The first barrier conductor and the second barrier conductor are arranged to surround a portion of the periphery of the adhesive region.

3. The printed wiring board according to claim 1 or 2, wherein: A first portion of the first blocking conductor that forms the shortest distance between the first blocking conductor and the second blocking conductor in the direction in which the first electrode pad and the second electrode pad are arranged side by side, and a second portion of the second blocking conductor that forms the shortest distance between the first blocking conductor and the second blocking conductor in the direction in which the first electrode pad and the second electrode pad are arranged side by side, converge within the bottom surface of the electronic component when the electronic component is mounted.

4. The printed wiring board according to claim 1 or 2, wherein The resin is a solder resist or a symbol printing ink.

5. The printed wiring board according to claim 1 or 2, wherein The first blocking conductor is formed integrally with the first electrode pad by the same conductor as the first electrode pad, and the second blocking conductor is formed integrally with the second electrode pad by the same conductor as the second electrode pad.

6. An electronic device, wherein: A printed wiring board according to any one of claims 1 to 5.

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