Sensors including interconnects with carrier membranes

Abstract

This invention relates to a sensor comprising a sensor element and interconnects. The interconnects are configured to be disposed at the sensor element. The interconnects include at least a carrier film having a metal layer disposed thereon. The interconnects are configured to provide electrical connection to the sensor element. Furthermore, this invention provides an apparatus including the sensor and a method for manufacturing the sensor.

Description

Technical Field

[0001] The present invention relates to a sensor, an apparatus including the sensor, and a method for manufacturing the sensor. Background Technology

[0002] Measuring blood flow in arteries helps doctors make accurate diagnoses and provide appropriate treatment. The measurement principle can be based on the Doppler effect. The actuator / receiver used in such a device can be based on a disc made of piezoelectric material with electrodes on the front and back sides. Electrical interconnections are formed by wires brazed to the front and back surfaces of the piezoelectric disc. This is the current state of technology for intravascular flow sensing. Another application of piezoelectric materials is in the positioning of sensors in ultrasonic fields (in situ), where disc transducers can be used.

[0003] An ultrasonic transducer array and a method of manufacturing it are known from EP0739656 A2. Each transducer element includes a piezoelectric layer and one or more acoustic matching layers. The piezoelectric layer has a concave front surface covered by a front electrode and a rear surface covered by a rear electrode.

[0004] Due to the presence of wires and brazing material, piezoelectric discs with electrical connections formed by brazing wires typically exhibit reduced or limited sensitivity and distortion. The amount of brazing material used for the electrical connections limits the transducer's resonant performance at the expense of sound pressure output.

[0005] The existing piezoelectric disk 2 in Figures 16A to 16C As shown in [the image]. Figure 16A The rear side of disk 2 is shown. Figure 16B The front side 6 of the same piezoelectric disc 2 is shown. The electrical connection between the front and rear sides is formed by brazing copper wires: a front wire 8 and a rear wire 10 are respectively attached to the front side 6 and rear side 4 of the disc 2. The piezoelectric disc 2 has holes through which the front wire 8 passes. The amount of brazing material 3 required to fix the front wire 8 may cover a considerable portion of the front side 6. Figure 16C An exemplary top view of the front side 6 is shown, in which solder covers approximately one-quarter of the front side 6.

[0006] The amount of brazing filler metal 3 applied to the front surface 6 of the transducer affects the transducer's resonant performance and sound pressure output. Furthermore, sound pressure loss may occur due to the reduced effective surface area 6 of the piezoelectric disk. Summary of the Invention

[0007] There is a need to provide transducers with improved performance and sensor integration in medical devices with size constraints.

[0008] The objective of this invention is addressed by the subject matter of the independent claims; further embodiments are included in the dependent claims. It should be noted that the aspects described below also apply to sensors, devices including the sensor, and methods for manufacturing the sensor.

[0009] According to the present invention, the sensor includes a sensor element, interconnects, and a metal layer. The interconnects are configured to be disposed at the sensor element. The interconnects include at least a carrier film having a metal layer and / or at least one wire having a metal layer. The interconnects are configured to provide electrical connection to the sensor element.

[0010] The sensor is used in a variety of medical applications, such as Doppler flow measurement and ultrasound imaging. Additionally, ultrasonic tracking of the sensor via an external ultrasound probe is also available.

[0011] The sensor includes sensor elements for (Doppler) flow measurement, ultrasound imaging, or other sensor elements used in medical devices. The sensor comprises a stack of acoustic materials, including active and passive portions. The sensor element is the active portion that generates / receives ultrasound waves. The sensor element can comprise a ceramic disk or plate of any geometry (circular, square, hexagonal, octagonal, etc.). The passive portion of the sensor functions to efficiently couple the sound waves into the desired medium.

[0012] The passive portion is provided by one or more matching layers in front of the active portion and one or more dematching layers behind the active portion. The dematching layer may include a backing material for attenuating ultrasound transmission in unwanted directions (e.g., proximal axis of the device). The dematching layer may include a non-conductive epoxy resin material. The active portion may include a single-crystal piezoelectric material. The matching layer is used to efficiently couple ultrasound waves into a medium (e.g., anatomical structures, various body fluids, etc.) in the desired direction.

[0013] The sensor element may be derived from a piezoelectric ultrasonic transmitter / sensor array or a capacitive micromachined ultrasonic transmitter / sensor array. The sensor element may comprise multiple or a single acoustic material stack. The ultrasonic transmitter / receiver element or transducer element provides an enlarged aperture for receiving ultrasonic scattering and reflection from the anatomical medium (structure, fluid) upon impact.

[0014] Interconnectors are disposed at the sensor element. The interconnector includes at least one of a carrier film and at least one wire. In other words, in the example, the interconnector includes a carrier film and an additional carrier film or carrier sheet disposed at the front or rear of the carrier film. In the example, the interconnector includes two wires attached to the front and rear sides of the sensor element for electrical connection. In the example, the interconnector includes a carrier film and at least one wire connected thereto, wherein the carrier film can provide a front, side, and rear portion and / or an additional carrier film or carrier sheet disposed at the front or rear of the carrier film.

[0015] In other words, carrier membrane

[0016] The carrier film includes PET (polyethylene terephthalate), polypropylene, or polyimide. The thickness of the carrier film ranges from about 2 to 10 micrometers, preferably about 6 micrometers, including tolerances. The carrier film also includes films, foils, or other substrates suitable for acoustic functions. The conductors include metals, such as copper or copper-beryllium.

[0017] The metal layer comprises a metal, such as gold (Au) or other precious metals, such as platinum (Pt). The metal is used to form the electrical contacts. Au or other precious metals (such as Pt) are preferred to prevent corrosion. Silver (Ag) can also be used if proper shielding is applied. The thickness of the metal layer is in the range of about 10 to 500 nanometers, preferably in the range of about 30 to 50 nanometers (including tolerances).

[0018] The carrier film, wires, or both are provided with a metal layer. Metallized carrier films and / or metallized wires provide interconnections for sensor elements (e.g., ultrasonic transducers) without compromising their acoustic properties. Compared to prior art brazed wire arrangements, metallized film interconnections disposed on sensor elements (e.g., piezoelectric transducers) and on wires improve sensor sensitivity.

[0019] When arranged at the sensor element, the attenuation caused by interconnects is reduced by providing a metallized carrier film and / or metallized wires on the sensor element. Therefore, for example, the transmission of ultrasonic waves by the sensor element can be enhanced. Furthermore, the space for interconnects on the front side of the sensor element is significantly reduced; for example, the 25-micron brazing wires in the prior art are replaced with, for example, a 6-micron metallized PET carrier film.

[0020] Therefore, ultrasonically friendly interconnects in terms of size and materials are provided. In other words, interconnects including metallized carrier films and / or wires improve the front end of sensor elements (e.g., ultrasonic transducer elements) for acoustic properties and also reduce the space required in front of sensor elements.

[0021] When the interconnects described herein replace the solder wires, additional solder material on the transducer surface, as is the case in the prior art, is avoided. Furthermore, the interconnects provide less harmful acoustic impact or even enhance sound pressure level output.

[0022] Sensor elements used with the interconnects described herein include a matching layer thickness of 20 to 100 micrometers. At predetermined frequencies, such as between 10 and 45 MHz, the thickness of the carrier may be part of the matching layer or may form the matching layer entirely by itself.

[0023] According to the example, a metal layer is disposed on at least one side of the carrier membrane. By applying a metal layer, such as Au provided with a thickness of less than 1 micrometer, to the carrier membrane, an electrical connection for the sensor element is provided without affecting its acoustic properties.

[0024] According to the example, the interconnects are configured to provide electrical connections at least on the rear side of the sensor. This provides a reduced sensor size because the interconnects require less space, thus maintaining their acoustic properties.

[0025] According to the example, a carrier film is disposed on the front side of the sensor element and configured to wrap around the side of the sensor element to the rear side of the sensor element. Therefore, the carrier film can be wrapped around the sensor element to bring the interconnects to the rear side of the sensor element. Consequently, the attenuation caused by the electrical connection on the front side of the sensor element (as in the prior art) is significantly reduced or mitigated. Wrapping a thin metallized carrier film around the sensor element to bring the front side of the interconnects to the rear side of the sensor element for electrical connection provides a sensor with improved acoustic properties. Furthermore, the front and rear carrier films can be joined using the same connection or the same bonding process.

[0026] According to the examples, the metallization carrier film is configured as a thin film or a discrete film. Thin films include a carrier film in which a metal layer and / or an insulator are deposited by sputtering or evaporation. Discrete films include organic films, such as PET (Mylar) or polyimide (Kapton), serving as a carrier for the metal layer, which is also applied by sputtering or evaporation.

[0027] As shown in the example, the carrier membrane includes a front portion, a side portion, and a rear portion. This results in improved flexibility in the arrangement of interconnects at the sensor element. The front portion is arranged at the front end of the sensor element, and the rear portion is arranged at the rear end of the sensor element. The thickness and / or dimensions of the different portions can vary.

[0028] All embodiments described below are based on the use of a single-sided metallization film (carrier film). In the examples, the film comprises PET (Mylar) or polypropylene or polyimide (Kapton) with a thickness of a few micrometers. In the examples, the metallization is a thin layer formed of Au, Pt, or Ag. Typical thickness of the metallization (metal layer): 10 to 100 nanometers. The metal is applied by sputtering or evaporation.

[0029] According to the example, the metal layer is disposed at the front and / or rear and / or side, thus away from the sensor element.

[0030] According to the example, the rear of the carrier membrane is configured as a separate section, thereby providing a metal layer away from the sensor element.

[0031] According to the example, the interconnect includes two carrier films respectively disposed on the front and rear sides of the sensor element. The two carrier films connecting the front and rear sides of the sensor can be connected to wires on the rear side of the sensor element using the same bonding process. Comparative tests show that the acoustic sensitivity at the resonant peak near 12.5 MHz is improved by approximately 4 dB compared to prior art devices.

[0032] According to the example, the wires are double-stranded wires. Both carrier membranes have a metal-coated surface, for example, an Au-coated surface, at their connection surfaces. The two wires, respectively attached to the two carrier membranes, also have plated surfaces at their contact points with the membranes. In the example, one carrier membrane is arranged on the rear side of the sensor element, at least partially covering the rear side. The two wires—referred to as double-stranded wires—comprise two copper or copper alloy wires. The metal core is insulated, and the two wires are bonded together with epoxy resin. The wires are plated with gold of approximately 1 micrometer to obtain reliable electrical contact. In the example, one wire is attached to the top of the membrane carrier, and the other wire is directly bonded to the gold-plated surface of the sensor element. A drop of adhesive (e.g., epoxy resin) on the top of the wire connection can serve as a stress relief layer.

[0033] According to the example, a carrier membrane disposed on the front side of the sensor can optionally be attached to the front side for acoustic matching. For acoustic matching, the front portion of the carrier membrane has a greater thickness than the side portion. The side portion includes a thickness suitable for bending along the sensor element. The thickness of the front portion can be calculated based on the material of the carrier and the frequency of the ultrasonic sensor element. The thickness of the front portion of the carrier should preferably be approximately an odd multiple of the wavelength of the sound wave at a given frequency (do Nascimento et al., Proceedings of the Society of Photo-Optical Instrumentation Engineers (SPIE), Vol. 5035, pp. 86-96, 2003). For example, if the carrier material is polyimide, then the thickness of the front side of the carrier should be approximately 49 micrometers for a transducer center frequency of 12.5 MHz, approximately 20 micrometers for a center frequency of 30 MHz, and approximately 14 micrometers (based on a quarter wavelength) for a center frequency of 45 MHz.

[0034] According to the present invention, an apparatus including the sensor is also provided. The apparatus includes a housing for receiving the sensor, wherein interconnects of the sensor provide electrical connection to the sensor.

[0035] The device includes a medical interventional device comprising an intravascular guidewire, catheter, and interventional needle for diagnosis and treatment. The device may also include a guidewire for evaluating intermediate lesions, multivascular or multilesional lesions, and restenosis.

[0036] According to the present invention, a method for manufacturing a sensor is also provided, the sensor including a sensor element, interconnects, and a metal layer, the method comprising the steps of: providing a metal layer at the interconnects and arranging the interconnects at the sensor element. The interconnects include at least a carrier film having the metal layer disposed thereon and / or at least one conductive wire having the metal layer disposed thereon. The interconnects are configured to provide electrical connection to the sensor element. The metal layer is applied to the carrier film before attaching the interconnects to the sensor element.

[0037] According to the example, a carrier film is disposed on the front side of the sensor element and wound around the side of the sensor element to the rear side. The carrier film provides (at least its sides) a flexible material and a suitable thickness to facilitate winding.

[0038] According to the example, the carrier film and the wires are bonded to the sensor element using the same bonding process. The bonding is performed as a cryogenic bonding process using non-conductive or conductive epoxy resin.

[0039] In this example, the thickness of the membrane support is determined by the radius of curvature at the edge. If the membrane is too thick, the outer metal layer may crack. If the membrane is too thin, handling may become problematic, meaning the membrane may require more careful handling. A few micrometers, such as 2 to 7 micrometers, has been found to be the most suitable choice for membrane support thickness.

[0040] In other words, the present invention provides interconnects for sensor elements (e.g., transducers). For example, an electrical connection can be formed using a thin (6 micrometers) PET film, metallized on one side with a thin layer (less than 1 micrometer) of, for example, Au, without adversely affecting the acoustic characteristics of the piezoelectric transducer. Furthermore, the thin metallized film can be wound around the transducer element to bring the front-side interconnect to the rear side of the piezoelectric element. The film (bringing the front electrode connection to the rear side of the transducer element) is connected to the wires at the rear side of the ultrasonic transducer element using the same bonding process.

[0041] The interconnects according to the invention can be used for other types of sensors that require front and rear electrical connections, such as thermocouples and pressure sensors.

[0042] These and other aspects of the invention will become apparent and elucidated with reference to the embodiments described below. Attached Figure Description

[0043] Exemplary embodiments of the present invention will now be described with reference to the following figures:

[0044] Figures 1A to 1B This is the first embodiment of the sensor;

[0045] Figures 2A to 2B , Figures 3A to 3B , Figures 4A to 4B , Figures 5A to 5B This is a further embodiment of the sensor;

[0046] Figures 6A to 6B , Figures 8A to 8B It is an embodiment of a sensor concept similar to that of the prior art;

[0047] Figures 7A to 7B It is the basis for manufacturing Figure 2A A flowchart of the sensor in the embodiment;

[0048] Figures 9A to 9B , Figures 10A to 10B This is a further embodiment of the sensor;

[0049] Figure 11 This is a further flowchart for manufacturing sensors and components within a housing;

[0050] Figure 12 yes Figure 11 The connection between the carrier membrane and the wire;

[0051] Figures 13A to 13C yes Figure 12 The connection between the carrier membrane and the wire;

[0052] Figures 14A to 14B This is a further embodiment of the sensor; and

[0053] Figure 15 This is a flowchart of a method for manufacturing sensors;

[0054] Figures 16A to 16C This is an embodiment of the prior art. Detailed Implementation

[0055] Certain embodiments will now be described in more detail with reference to the accompanying drawings. In the following description, the same reference numerals are used for the same elements, even in different drawings. Items defined in the description, such as detailed constructions and elements, are provided to aid in a comprehensive understanding of the exemplary embodiments. Furthermore, well-known functions or constructions are not described in detail, as this would obscure the embodiments with unnecessary detail. Additionally, expressions such as “at least one of…”, when placed before the list of elements, modify the entire list of elements without modifying any individual elements within the list.

[0056] Figures 1A to 1B , Figures 2A to 2B , Figures 3A to 3B , Figures 4A to 4B , Figures 5A to 5B , Figures 6A to 6B , Figures 7A to 7B Exemplary and schematic embodiments of sensor 1 are shown. Sensor 1 includes sensor element 5. Figure 1A-7A The rear side 9 of sensor element 5 is shown. Figure 1B-7B The front side 11 of sensor element 5 is shown. Sensor 1 includes interconnect 7. Interconnect 7 is disposed at sensor element 5 and includes a carrier film 13 and / or a rear lead 17 and / or a front lead 19, each having a metal layer 15. The carrier film 13 includes a front portion 13F, a side portion 13S, and a rear portion 13B.

[0057] The front lead wire 17 and the rear lead wire 19 are provided with bends, such that the ends of the lead wires 17 and 19 are substantially parallel to and above the rear side 9 of the sensor element 5. The interconnect 7 provides electrical connection to the sensor element 5.

[0058] In the figure, unless otherwise specified, the carrier film 13 (or its front portion 13F and rear portion 13B) is bonded to the front side 11 and the rear side 9 respectively with a thin, non-conductive double-sided adhesive (not visible in the figure).

[0059] exist Figures 1A to 1BIn this structure, a metal layer 15 is disposed on the side of the carrier film 13 facing the sensor element 5. An insulating layer 16 is disposed between the side portion 13S and the sensor element 5, and between the rear portion 13B and the sensor element 5. The front portion 13F of the carrier film 13 is disposed at the front side 11 of the sensor element 5.

[0060] The carrier film 13 is wound around the side of the sensor element 5 to the rear side 9 of the sensor element 5. The interconnect 7 attached to the front side 11 of the sensor element 5 is thus brought to the rear side 9 of the sensor element 5.

[0061] The front lead 19 has a metal layer 15, including Au, Pt, Ag, or other noble metals, at least in the area where the lead 19 contacts the carrier film 13. Electrical connection is provided by the front lead 19 attached to the rear portion 13B of the carrier film 13 and the rear lead 17 directly bonded to the rear side 9, which provides the metal-plated surface 18 of the sensor element 5. The metal-plated surface 18 of the rear side 9 may include Au, Pt, or other noble metals, such as those used for the metal layer 15. Electrical connection is provided at the rear side 9 of the sensor element 5.

[0062] In this embodiment, the metallized carrier film 13 is configured as a thin film.

[0063] exist Figures 2A to 2B In the carrier film 13, a metal layer 15 is disposed on the side of the carrier film 13 facing away from the sensor element 5. The metal layer 15 is disposed at the front portion 13F, the side portion 13S, and the rear portion 13B, thereby facing away from the sensor element 5.

[0064] The front portion 13F of the carrier membrane 13 is disposed on the front side 11 of the sensor element 5. Three portions are provided on the front side 11 of the sensor element 5: the front side 11 is metallized on the sensor element 5, and the front portion 13F is bonded to the front side 11 with the metal layer 15 facing upwards, such that no electrical connection is established between the metallized front side 11 and the front portion 13F. To form an electrical connection, a metallized diaphragm 13A is bonded to the metal layer 15, thereby facing the front side 11 and the front portion 13F. The metallized diaphragm 13A partially covers the front portion 13F (the covered area is indicated by different shading lines).

[0065] The carrier film 13 is wound around the side of the sensor element 5 to the rear side 9 of the sensor element 5. The interconnect 7 attached to the front side 11 of the sensor element 5 is thus brought to the rear side 9 of the sensor element 5.

[0066] The front lead 19 has a metal layer 15, including Au, Pt, Ag, or other noble metals, at least in the region where the lead 19 contacts the rear portion 13B of the carrier film 13. The metal layer 15 faces and is attached to the metallized lead 19, thereby providing an electrical connection. The rear lead 17 is directly bonded to the metallized surface 18 of the sensor element 5. The metallized surface 18 may include Au, Pt, or other noble metals, such as those used for the metal layer 15. The electrical connection is located at the rear side 9 of the sensor element 5.

[0067] In this embodiment, the metallized carrier film 13 is configured as a discrete film.

[0068] Figures 3A to 3B The embodiments are similar to Figures 1A to 1B Except that the carrier film 13 is configured as a discrete film, the carrier film 13 (with a metal layer 15 on its inner side) is folded around the sensor element 5. At the back side 9, the carrier film 13, i.e., the rear portion 13B of the carrier film 13, is folded backward so that the metal layer 15 faces the wire 19 (away from the sensor element 5). At the front side 11, the front portion 13F of the carrier film 13 is arranged to partially cover the front side 11. The carrier film 13 (front portion 13F and rear portion 13B) is bonded to the front side 11 and the rear side 9 respectively using a non-conductive thin double-sided adhesive (not visible in the figure).

[0069] exist Figures 4A to 4B The image shows another embodiment of sensor 1, which includes a discrete membrane as a carrier membrane 13. The carrier membrane 13 is provided with a metal layer 15 facing the sensor element 5.

[0070] An insulating layer 16 is disposed between the rear portion 13B, the side portion 13S, and the sensor element 5. The front portion 13F of the carrier film 13 is disposed at the front side 11 of the sensor element 5. The carrier film 13 is wound around the side of the sensor element 5 to the rear side 9 of the sensor element 5. Thus, the interconnect 7 attached to the front side 11 of the sensor element 5 is brought to the rear side 9 of the sensor element 5.

[0071] The front lead 19 has a metal layer 15 comprising Au, Pt, Ag, or other noble metals, at least in the region where the lead 19 contacts the carrier film 13. In this embodiment, the front lead 19 is disposed between the insulating layer 16 and the rear portion 13B of the carrier film 13.

[0072] Electrical connections are provided by a front conductor 19 attached to the rear portion 13B of the carrier film 13 and a rear conductor 17 directly bonded to the metal-plated surface 18 of the rear side 9 of the sensor element 5. The metal-plated surface 18 of the rear side 9 may include Au, Pt, or other precious metals, such as those used for the metal layer 15. The electrical connections are located at the rear side 9 of the sensor element 5.

[0073] exist Figures 5A to 5BThe image shows another embodiment of sensor 1, which includes a discrete membrane as a carrier membrane 13. The carrier membrane 13 is provided with a metal layer 15 facing the sensor element 5.

[0074] The front portion 13F of the carrier film 13 is disposed on the front side 11 of the sensor element 5, thereby partially covering the front side 11. The carrier film 13 is wound around the side of the sensor element 5 to the rear side 9 of the sensor element 5. An additional metallized carrier film 13C is partially disposed on the rear side 9, wherein the metal layer 15 faces outward, i.e., away from the sensor element 5. The rear portion 13B of the carrier film 13 is bonded to the additional metallized film carrier 13C. The front lead 19 is also bonded to the metallized film carrier 13C.

[0075] The lead wire 19 has a metal layer 15, including Au, Pt, Ag or other precious metals, in at least the area where the lead wire 19 contacts the additional metallized carrier film 13C.

[0076] Electrical connections are provided by a front lead 19 attached to an additional metallized film carrier 13C and a rear lead 17 directly bonded to a rear side 9 of the sensor element 5, which has a metallized surface 18. The rear side 9 and / or the metallized surface 9 may include Au, Pt, or other precious metals, such as those used for the metal layer 15. The electrical connections are located at the rear side 9 of the sensor element 5.

[0077] exist Figures 6A to 6B The image shows an interconnect 7 consisting only of wires. The interconnect 7 includes a front wire 19 and a rear wire 17. Both wires have a metal layer 15 at least in the region where they connect to the sensor element 5.

[0078] Electrical connection is provided by directly connecting wires 17 and 19 to the corresponding rear side 9 or front side 11.

[0079] Figure 7A , 7B A flowchart illustrating the manufacturing process of sensor 1 is shown schematically. The flowchart illustrates the steps of arranging interconnects 7 at sensor element 5. In the final step (on the right side of the figure), wires 17 and 19 are provided.

[0080] The carrier membrane 13 has a metal layer 15 and is attached to the side of the sensor element 5, such that the metal layer 15 faces away from the sensor element 5. This is in Figure 7A As shown in the figure, the carrier film 13 has an insulating material 20 on its side facing the sensor element 5.

[0081] The sequence of steps for winding the carrier film 13 is shown from left to right. After the carrier film 13 is arranged on the side of the sensor element 5, the rear portion 13B and the front portion 13F are folded toward the corresponding rear side 9 and front side 11 of the sensor element 5. The rear side 9 and the front side 11 are provided with metal surfaces 18.

[0082] The front portion 13F is not electrically connected to the front side 11. To form an electrical connection, a discrete film 13A having a metal layer 15 facing the sensor element 5 is applied to the front side 11 of the sensor element 5 (see also...). Figure 2A Metallized membrane 13A). The metal layer 15 of discrete membrane 13A provides electrical connection. Discrete membrane 13A partially covers the front portion 13F (the covered area is indicated by different shading lines for discrete membrane 13A).

[0083] The metallized front lead 19 is then connected to the carrier membrane 13, i.e., the rear portion 13B, at the rear side 9 of the sensor element 5. The rear lead 17 is connected to the rear side 9.

[0084] Figures 8A to 8B , Figures 9A to 9B , Figures 10A-10B Further embodiments of sensor 1 are illustrated schematically and exemplary. Sensor 1 includes a sensor element 5 configured as a ceramic disk. At the front side 11 of sensor element 5, a metal-plated surface 18 may include Au, Pt, or other precious metals such as those used for metal layer 15.

[0085] exist Figures 8A to 8B In the sensor element 5, a hole 22 is provided for the front lead 19 to pass through. Electrical connection is provided at the front side 11 by attaching the metallized front lead 19 (with a metal layer 15) to the metallized surface 18. At the rear side 9 of the sensor element 5, a metallized rear lead 17 is bonded to the surface of the sensor element 5.

[0086] exist Figures 9A to 9B An alternative embodiment is shown. Wires 17, 19 are connected (e.g., ultrasonically bonded) to the rear side 9 of sensor element 5 and connected to the front side 11 of sensor element 5 via a thin-film process (e.g., depositing oxide and metal layers) such as carrier film 13. A non-conductive portion 24 is provided to establish electrical insulation.

[0087] Figures 10A to 10B A further embodiment of sensor 1 is shown, wherein wires 17 and 19 are connected to the rear side 9 of sensor element 5. A discrete film serving as carrier film 13 is provided with a metal layer 15. Carrier film 13 is wound around the side of sensor element 5. The rear portion 13B of carrier film is folded back at the rear side 9 of sensor element 5 so that the metal layer 15 faces the rear wire 19.

[0088] Figure 11A further flowchart for manufacturing sensor 1 is shown. Sensor element 5 has a rear side 9 and a front side 11. Two carrier films 13 are attached to the front side 11 and the rear side 9 of sensor element 5. The carrier films 13 are single-sided metallized films 13 (metal layers 15), which are bonded and wound around sensor element 5 such that the two carrier films 13 are located at the rear side of sensor element 5. The carrier films 13 are connected to bistrand wires 31, 33.

[0089] For example, sensor 1 is received within the housing 21 of the guidewire. The housing may be attached to or integrated into an interventional medical device, such as a guidewire, catheter, or needle.

[0090] Figure 12 An example is shown Figure 11 The interconnection 7 of sensor 1 and the connection of the two-strand wires 31 and 33.

[0091] The interconnect 7 includes two carrier films 13, wherein the carrier film 13 attached to the front side 11 of the sensor element 5 is wound around one side of the sensor element 5. The carrier film 13 attached to the rear side 9 of the sensor element 5 is folded in such a way that the two carrier films 13 face each other.

[0092] The twin-strand wires 31 and 33 are bonded under pressure to the Au-plated surfaces 15 on both the carrier film 13 and the wires 31 and 33. To facilitate easy bonding of the wires to the carrier film 13, the wires are provided in a cross-hatching manner, which... Figures 13A to 13C This is even more clearly seen in the text.

[0093] Figures 13A to 13C Showing more details Figure 12 The connection between the carrier membrane 13 and the wires 31 and 33. Figure 13A A top view of the carrier membrane 13 and the wires 31 and 33 is shown. The metallized end of the wire 31 is provided with a bend 35.

[0094] from Figure 13B It is evident that the end of the other conductor 33 also has a bend 35 in the opposite direction. This is from... Figure 13C The top view is also very clear.

[0095] Figures 14A to 14B Another embodiment of sensor 1, which is shown as an alternative embodiment, is capable of having a shorter sensor assembly length.

[0096] The sensor element 5 is provided with an interconnect 7 including two carrier films 13. A metal layer 15 is provided on one side of each carrier film 13. An adhesive layer 34 is partially disposed on the carrier film 13. The carrier film 13 is folded or wrapped around one side of the sensor element 5 (from...). Figure 14B (More obviously), this results in sensor 1 having an electrical connection at its rear side 9.

[0097] Figure 14B The components of sensor 1 are shown in a side view. The carrier membrane 13 is attached to sensor element 5 via an adhesive layer 34. Figure 14B The lower carrier membrane 13 is folded toward the sensor element 5, such that the adhesive layer 34 connects the membrane carrier 13 and the sensor element 5. The other carrier membrane 13, namely... Figure 14B The upper film 13 is also folded in the same direction as the lower film 13, so that the adhesive layer 34 of the lower film 13 can be attached to the upper film 13. The folding angle is rectangular.

[0098] The final assembled sensor 1 provides an interconnect 7 having two carrier films 13 attached to each other by an adhesive layer 34. The adhesive layer 34 between the carrier films 13 is disposed near the sensor element 5. The ends of the carrier films 13 facing away from the sensor element 5 can be connected to wires for electrical connections to the sensor 1.

[0099] Figure 15 A flowchart is shown of a method for manufacturing a sensor 1, which includes sensor element 5, interconnect 7 and metal layer 15.

[0100] The method includes providing an S1 metal layer 15 at the interconnect 7, wherein the interconnect 7 includes at least a carrier film 13 on which the metal layer 15 is disposed and / or at least one wire 17, 19 on which the metal layer 15 is disposed.

[0101] Interconnector 7 is arranged at sensor element 5 in S2, wherein interconnector 7 is configured to provide electrical connection to sensor element 5.

[0102] In this embodiment, the carrier film 13 is arranged S3 on the front side 11 of the sensor element 5 and wound S4 around the side of the sensor element 5 to the rear side 9 of the sensor element 5. The carrier film 13 and the wires 17, 19 are joined to the sensor element 5 using the same bonding process S5.

[0103] It should be noted that embodiments of the invention have been described with reference to different subject matter. Specifically, claims of the method type describe some embodiments, while claims of the apparatus type describe other embodiments. However, those skilled in the art will understand from the foregoing and hereinafter description that, unless otherwise indicated, any combination of features related to different subject matter is considered to be disclosed in this application, except for any combination of features belonging to one type of subject matter. However, all features can be combined to provide a synergistic effect of a simple summation of more than one feature.

[0104] Although the invention has been illustrated and described in detail in the accompanying drawings and the foregoing description, such illustrations and descriptions should be considered illustrative or exemplary rather than restrictive. The invention is not limited to the disclosed embodiments. Based on a study of the drawings, the disclosure, and the dependent claims, those skilled in the art will understand and implement other variations of the disclosed embodiments in the practice of the claimed invention.

[0105] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite articles "a" or "an" do not exclude multiple. A single processor or other unit can perform the functions of several items recited in the claims. The mere fact that certain measures are recited in different dependent claims does not imply that combinations of these measures cannot be advantageously used. No reference numerals in the claims should be construed as limiting the scope.

Claims

1. A sensor, comprising: a sensor element (5) having two opposite sides and a lateral side; an interconnect (7) comprising an electrically insulating flexible carrier (13) configured for electrical conduction, wherein the carrier comprises two end sections (13B, 13F) at two opposite sides of a central section, wherein a first end section (13F) of the two end sections is folded over a first side (11) of the two opposite sides of the sensor element, wherein the central section of the carrier is arranged adjacent to the lateral side of the sensor element and a second end section (13F) of the two end sections is folded over a second side (9) of the two opposite sides of the sensor element, wherein the carrier is configured to transmit an electrical signal from a first electrode comprised on the first side of the sensor element to the second side of the sensor element to provide an electrical connection of the first electrode from the second side of the sensor element.

2. The sensor of claim 1, wherein, the second side of the sensor element comprises a second electrode, and the sensor element is accessible for both the first electrode and the second electrode from the second side of the sensor element.

3. The sensor of claim 2, wherein, the sensor comprises a further interconnect electrically connected with the second electrode, and the first electrode and the second electrode are accessible through the respective two interconnects.

4. The sensor of claim 3, wherein, the sensor further comprises a double stranded electrical conductor (17, 19), wherein each of the interconnects is electrically connected with one of the conductors of the double stranded electrical conductor.

5. The sensor of claim 4, wherein, a portion of the two interconnects are attached to each other to form a composite interconnect extending from the second side of the sensor element, and each electrical conductor of the double stranded electrical conductor is electrically connected on opposite sides of the composite interconnect.

6. The sensor of any one of claims 1 to 5, wherein, the sensor element is an ultrasonic sensor element, the first side of the ultrasonic sensor element is configured for acoustic matching for transmitting ultrasonic waves to and receiving ultrasonic waves from an anatomical medium, and the second side of the ultrasonic sensor element is provided with an electrically conductive ultrasonic attenuating material.

7. The sensor of claim 6, wherein, the acoustic matching at least partially comprises the first end section of the flexible carrier.

8. The sensor of claim 7, wherein, a thickness of the first end section of the flexible carrier provides full acoustic matching for a predetermined center frequency of the ultrasonic sensor element.

9. The sensor of claim 7 or 8, wherein, the first end section of the flexible carrier is thicker than the central section.

10. The sensor of claim 8, wherein, the predetermined center frequency is higher than 10 MHz.

11. The sensor of any one of claims 1 to 5, wherein, the flexible carrier comprises one of the following materials: polyethylene terephthalate, polypropylene, and polyimide.

12. An interventional medical device, comprising: a sensor (1) according to any one of claims 1 to 11; a housing (21) for receiving the sensor; and an elongated body to which the housing is attached.

13. A method of manufacturing a sensor, comprising the steps of: providing a sensor element having two opposite sides and a lateral side; providing an interconnect (7) comprising an electrically insulating flexible carrier (13) configured for electrical conduction, wherein the carrier comprises two end sections (13B, 13F) at two opposite sides of a central section, folding a first end section (13F) of the two end sections on a first side (11) of two opposite sides of the sensor element, the central section of the carrier being arranged adjacent to a lateral side of the sensor element, folding a second end section (13F) of the two end sections on a second side (9) of the two opposite sides of the sensor element, connecting a first electrode comprised on the first side of the sensor element to the second side of the sensor element by the flexible carrier for transmitting electrical signals from the second side of the sensor element to the first electrode.

14. The method of claim 13, wherein, The method further comprises: providing a further interconnect electrically connected to a second electrode comprised on the second side of the sensor element, attaching a portion of the two interconnects to each other to form a composite interconnect extending from the second side of the sensor element, providing a double stranded electrical conductor, electrically connecting each electrical conductor of the double stranded electrical conductor on opposite sides of the composite interconnect to provide electrical signals to the respective two electrodes.

15. The method of claim 13, wherein, Providing the interconnect comprises providing the flexible carrier, wherein the first end section of the flexible carrier is thicker than the central section.

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