Cutting machine main roller and cutting machine
By providing a decreasing depth trough on the side of the roller body of the cutting machine main roller, the tension of the cutting line at the outlet is increased, and the problem of insufficient tension of the outlet end in the main roller mechanism is solved, and the cutting efficiency and quality are improved.
Patent Information
- Application Number
- CN202110876281.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-07-30
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2041-07-30
AI Technical Summary
The tension at the outlet end in the main roller mechanism of the cutting machine is insufficient, which causes the cutting wire to wear and deform during the silicon wafer cutting process, affecting the cutting efficiency and quality.
A cutting machine main roller is designed, and a plurality of wire grooves are provided on the side of the roller body from the inlet end to the outlet end. The depth of the wire groove at the inlet end is greater than the depth of the wire groove at the outlet end, so that the length of the cutting line between the two main rollers arranged in the main roller mechanism is greater than the length of the cutting line at the inlet end, increasing the tension of the cutting line at the outlet end.
By increasing the tension of the cutting line at the outlet, the problem of insufficient tension in the main roller mechanism is effectively solved, the stability and cutting efficiency of the cutting line are improved, and the uniform cutting of the silicon wafer is ensured.
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Figure CN113580401B_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of photovoltaics, in particular to a cutting machine main roller and a cutting machine. Background Art
[0002] In the manufacturing process of photovoltaic modules, the silicon rods must first be cut using a cutting machine to obtain silicon wafers, and then the silicon wafers are processed and assembled to obtain photovoltaic modules that can be used to generate electricity.
[0003] The main roller mechanism in the cutting machine includes two main rollers arranged opposite to each other. The cutting wire used for cutting silicon rods is wound around the two main rollers to form a cutting wire net. During the silicon wafer cutting process, the main roller drives the cutting wire to run between the wire entry end and the wire exit end of the main roller, and the silicon rod is fed to the cutting wire net to complete the cutting of the silicon rod entering the cutting wire net. The cutting wire will deform and wear during the cutting process. Therefore, when the cutting wire runs from the wire entry end to the wire exit end, the deformation and wear of the cutting wire will cause insufficient tension of the cutting wire at the wire exit end. Summary of the invention
[0004] The invention provides a main roller of a cutting machine and a cutting machine, aiming to solve the problem of insufficient tension of a wire outlet end in a main roller mechanism of the cutting machine.
[0005] In a first aspect, an embodiment of the present application provides a main roller of a cutting machine, comprising:
[0006] A roller body, on the side of the roller body, a plurality of wire grooves for winding the cutting wire are arranged at intervals from the wire entry end of the roller body to the wire exit end of the roller body;
[0007] The depth of the wire groove at the wire inlet end is greater than the depth of the wire groove at the wire outlet end.
[0008] Optionally, the depths of the plurality of wire grooves decrease successively from the wire input end to the wire output end.
[0009] Optionally, from the line-in end to the line-out end, the roller body is divided into a plurality of roller body segments;
[0010] The wire-inlet roller body segment is located at the wire-inlet end, and the wire-outlet roller body segment is located at the wire-outlet end; the wire groove depth of the wire-inlet roller body segment is greater than the wire groove depth of the wire-outlet roller body segment;
[0011] Wherein, the depth of the wire groove in each roller body segment is the same.
[0012] Optionally, from the line entry end to the line exit end, the line groove depths of the plurality of roller body segments decrease successively.
[0013] Optionally, the difference between the depth of the wire groove at the wire input end and the depth of the wire groove at the wire output end is not less than 0.1 mm and not more than 1 mm.
[0014] Optionally, the diameter of the roller body at the line-inlet end is smaller than the diameter at the line-outlet end.
[0015] Optionally, the diameter of the roller body increases gradually from the line entry end to the line exit end.
[0016] Optionally, the diameter of the incoming roller body segment is smaller than the diameter of the outgoing roller body segment; in each of the roller body segments, the diameter of the roller body remains unchanged.
[0017] Optionally, the diameters of the plurality of roller segments increase successively from the line-entry end to the line-exit end.
[0018] In a second aspect, an embodiment of the present application provides a cutting machine, comprising the cutting machine main roller as described above.
[0019] In the embodiment of the present application, the main roller of the cutting machine includes a roller body, and a plurality of wire grooves for winding the cutting wire are arranged at intervals from the wire entry end to the wire exit end of the roller body on the side of the roller body; the wire groove depth at the wire entry end is greater than the wire groove depth at the wire exit end. Since the wire groove depth at the wire entry end of the roller body is greater than the wire groove depth at the wire exit end, in the main roller mechanism of the cutting machine, the length of the cutting wire at the wire exit end between the two main rollers arranged opposite to each other is greater than the length of the cutting wire at the wire entry end, and the cutting wire at the wire exit end can be stretched, thereby increasing the tension of the cutting wire at the wire exit end. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0021] Figure 1 A front view of a main roller of a cutting machine provided in an embodiment of the present application is shown;
[0022] Figure 2 A top view of a main roller mechanism in a cutting machine provided in an embodiment of the present application is shown;
[0023] Figure 3 A front view of another main roller of a cutting machine provided in an embodiment of the present application is shown;
[0024] Figure 4 A front view of another main roller of a cutting machine provided in an embodiment of the present application is shown;
[0025] Figure 5 A top view of a main roller mechanism in another cutting machine provided in an embodiment of the present application is shown;
[0026] Figure 6 A front view of another main roller of a cutting machine provided in an embodiment of the present application is shown.
[0027] Description of reference numerals:
[0028] 100 - roller body, 101 - wire groove, 102 - axis line, 200 - cutting line, 301 - first roller body segment, 302 - second roller body segment, 303 - third roller body segment. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0030] Reference Figure 1 , shows a main view of a cutting machine main roller provided in an embodiment of the present application, the cutting machine main roller comprises a roller body 100, on the side of the roller body, a plurality of wire grooves 101 for winding the cutting wire are arranged at intervals from the wire input end to the wire output end of the roller body; the wire groove depth at the wire input end is greater than the wire groove depth at the wire output end.
[0031] In one embodiment, the roller body 100 may be a cylinder. When the roller body is installed in a cutting machine, one end of the roller body is used for wire entry, which is the wire entry end of the roller body, and the other end is used for wire exit, which is the wire exit end of the roller body. During the silicon wafer cutting process, the wire entry end cooperates with the wire pay-off wheel in the cutting machine, and the wire exit end cooperates with the wire take-up wheel in the cutting machine. The cutting wire (the cutting wire may be a diamond wire) enters the wire entry end from the wire pay-off wheel, is wound on the surface of the roller body, and then enters the wire take-up wheel from the wire exit end. Figure 1 As shown, Figure 1 The left end of the middle roller body is the wire inlet end, and the right end is the wire outlet end. On the side of the cylinder, multiple wire grooves 101 are sequentially arranged from left to right. The wire grooves can be Figure 1 The V-shaped groove shown can also be a U-shaped groove or a trapezoidal groove, or a wire groove of other shapes. Figure 1 In the main roller shown, the groove depth H1 at the left end of the roller body is greater than the groove depth H2 at the right end of the roller body, that is, the groove depth at the inlet end is greater than the groove depth at the outlet end, so that the distance L1 between the groove bottom at the inlet end and the roller body axis 102 is less than the distance L2 between the groove bottom at the outlet end and the roller body axis 102. The specific value of the groove depth can be set according to demand, and this embodiment does not limit this.
[0032] like Figure 2 As shown, Figure 2A top view of a main roller mechanism in a cutting machine provided in an embodiment of the present application is shown. In the main roller mechanism of the cutting machine, two main rollers 100 are arranged in parallel or nearly parallel, the wire-inlet ends of the two main rollers 100 are opposite to each other, the wire-outlet ends of the two main rollers are opposite to each other, and the cutting wire 200 is wound around the two main rollers. During the silicon wafer cutting process, the cutting wire 200 enters the two roller bodies 100 from the wire-inlet ends, is wound around the sides of the two roller bodies, and forms a cutting wire net. The silicon rod is clamped by the clamping mechanism in the cutting machine and fed to the plane where the cutting wire net is located. The main roller rotates under the action of the driving mechanism, driving the cutting wire to run. When the silicon rod enters the cutting wire net, it is cut into multiple silicon wafers by the cutting wire net. Since the wire groove depth at the wire-inlet end is greater than the wire groove depth at the wire-out end, the winding distance of the cutting wire at the wire-inlet end between the two opposite main rollers is Figure 2 The first distance L3 shown, the winding distance of the outlet end is Figure 2 The first distance L3 is smaller than the second distance L4. During the silicon wafer cutting process, the cutting line gradually runs from the line input end to the line output end, that is, from Figure 2 The cutting wire runs from the left end to the right end, and the cutting wire becomes loose due to wear. During the operation of the cutting wire, the winding distance of the cutting wire changes from the smaller L3 to the larger L4, which can stretch the cutting wire at the outlet end to increase the tension of the cutting wire at the outlet end. In practical applications, the insufficient tension of the cutting wire at the outlet end caused by different cutting wires or cutting processes can be compensated by different groove depth differences.
[0033] Optionally, the difference between the depth of the wire groove at the wire inlet end and the depth of the wire groove at the wire outlet end is not less than 0.1 mm and not more than 1 mm.
[0034] In one embodiment, the difference between the depth of the wire groove at the wire inlet and the depth of the wire groove at the wire outlet can be set to be greater than or equal to 0.1 mm and less than or equal to 1 mm. Figure 1 As shown, the depth of the wire groove at the inlet end is H1, and the depth of the wire groove at the outlet end is H2, then 0.1≤(H1-H2)≤1. Among them, (H1-H2) can be any value between 0.1 mm and 1 mm, such as 0.1 mm, 0.2 mm, 0.4 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm and 1 mm. Combined with the above example, when the value of (H1-H2) is small, the difference between L4 and L3 is small. At this time, the cutting line at the outlet end can be stretched to a small extent to compensate for the tension of the cutting line. On the contrary, when the value of (H1-H2) is large, the difference between L4 and L3 is large. At this time, the cutting line at the outlet end can be stretched to a large extent to compensate for the tension of the cutting line. The specific value of (H1-H2) can be set according to demand, and this embodiment does not limit this.
[0035] In an embodiment of the present application, when the difference between the wire groove depth at the input end and the wire groove depth at the output end is greater than or equal to 0.1 mm and less than or equal to 1 mm, it is possible to avoid a large difference between the wire groove depth at the input end and the wire groove depth at the output end, while ensuring that the cutting wire at the output end has sufficient tension during the silicon wafer cutting process.
[0036] Optionally, the depths of the plurality of wire grooves decrease successively from the wire input end to the wire output end.
[0037] In one embodiment, the depths of the plurality of wire grooves on the side of the roller body may decrease in sequence from the wire entry end to the wire exit end. In combination with the above example, if N wire grooves are provided on the side of the roller body, the difference between two adjacent wire grooves V = (H1-H2) ÷ (N-1). From the wire entry end to the wire exit end, between two adjacent wire grooves, the depth of the wire groove on the left side is greater than the depth of the wire groove on the right side by V.
[0038] In the embodiment of the present application, the depth of the plurality of wire grooves decreases from the wire input end to the wire output end. During the cutting process, the tension of the cutting wire can be gradually increased from the wire input end to the wire output end, so that the silicon rod can be cut more stably. In practical applications, the depth of the wire groove can be set according to the specific needs, and it is only necessary to ensure that the depth of the wire groove at the wire output end is less than the depth of the wire groove at the wire input end.
[0039] Among them, from the inlet end to the outlet end, the depth of the wire groove decreases successively, and the tension of the cutting wire can be gradually increased. Table 1 shows the torque and wire bow values at different positions of the cutting wire net arranged in the main roller mechanism composed of main rollers with the same wire groove depth, and Table 2 shows the torque and wire bow values at different positions of the cutting wire net arranged in the main roller mechanism composed of main rollers with decreasing wire groove depth. The cutting position is the depth position of the silicon rod entering the cutting wire net. The wire bow refers to the deformation of the cutting wire net during the cutting process. The value of the wire bow can characterize different deformations and also relatively reflect the tension of the cutting wire net, that is, the smaller the wire bow, the greater the tension of the cutting wire net. The head wire bow is the wire bow of the cutting wire net at the inlet end, the tail wire bow is the wire bow at the outlet end, and the middle wire bow is the wire bow of the cutting wire net at the middle position between the inlet end and the outlet end. The torque is the driving torque of the main roller motor. The greater the torque, the greater the force required for the motor to drive the main roller to operate, which means that the wire net tension is smaller.
[0040]
[0041] Table 1
[0042]
[0043] Table 2
[0044] Comparing the values in the third, fourth and fifth columns in Table 1, it can be seen that in the cutting wire net, the value of the wire bow gradually increases from the head to the tail, indicating that the deformation of the cutting wire gradually increases, reflecting that the tension of the cutting wire in the cutting wire net gradually decreases from the wire entry end to the wire exit end. Further, combined with the values in the first and second columns in Table 1, it can be seen that during the silicon wafer cutting process, the depth position of the silicon rod entering the cutting wire net is 20 mm, 60 mm, 100 mm, 120 mm, 180 mm and 213 mm, respectively. As the depth of the silicon rod entering the cutting wire net gradually increases, the wire bow values at the head, middle and tail positions gradually increase, and the torque of the motor also gradually increases, reflecting that the greater the depth of the silicon rod entering the cutting wire net, the greater the deformation of the cutting wire from the wire entry end to the wire exit end, and the tension of the cutting wire gradually decreases.
[0045] Comparing the values at the same position in Table 1 and Table 2, it can be seen that the main roller mechanism composed of the main roller with gradually decreasing groove depth has a larger tension in cutting the wire mesh than the main roller mechanism composed of the main roller with constant groove depth, especially at the tail of the wire bow, that is, the outlet end, the main roller with gradually decreasing groove depth has a more obvious effect on compensating the tension. For example, at the cutting position of 213 mm, the wire bow value of the tail in Table 1 is 14 and the torque is 44, while the wire bow value of the tail in Table 2 is 11 and the torque is 40, which clearly reflects that the main roller mechanism corresponding to Table 2 has a smaller deformation and a larger tension at the outlet end than the main roller mechanism corresponding to Table 1. Similarly, at the cutting position of 100 mm, the wire bow value of the tail in Table 1 is 8 and the torque is 43, while the wire bow value of the tail in Table 2 is 6 and the torque is 38, which clearly reflects that the main roller mechanism corresponding to Table 2 has a smaller deformation and a larger tension at the outlet end than the main roller mechanism corresponding to Table 1. Similarly, from Table 1 and Table 2, it can be seen that the main roller mechanism composed of main rollers with gradually decreasing groove depths is relative to the main roller mechanism composed of main rollers with constant groove depths. In the middle of the wire bow, the main rollers with gradually decreasing groove depths can also reduce the deformation of the cutting line and compensate for the tension of the cutting line.
[0046] In the embodiment of the present application, the depth of the plurality of wire grooves decreases from the wire input end to the wire output end. During the cutting process, the tension of the cutting wire can be gradually increased from the wire input end to the wire output end, so that the silicon rod can be cut more stably. In practical applications, the depth of the wire groove can be set according to the specific needs, and it is only necessary to ensure that the depth of the wire groove at the wire output end is less than the depth of the wire groove at the wire input end.
[0047] In summary, in this embodiment, the main roller of the cutting machine includes a roller body, and a plurality of wire grooves for winding the cutting wire are arranged at intervals from the wire entry end to the wire exit end of the roller body on the side of the roller body; the wire groove depth at the wire entry end is greater than the wire groove depth at the wire exit end. Since the wire groove depth at the wire entry end of the roller body is greater than the wire groove depth at the wire exit end, in the main roller mechanism of the cutting machine, the length of the cutting wire at the wire exit end between the two main rollers arranged opposite to each other is greater than the length of the cutting wire at the wire entry end, and the cutting wire at the wire exit end can be stretched, thereby increasing the tension of the cutting wire at the wire exit end.
[0048] Optionally, from the incoming line end to the outgoing line end, the roller body is divided into multiple roller body segments; the incoming line roller body segment is located at the incoming line end, and the outgoing line roller body segment is located at the outgoing line end; the wire groove depth of the incoming line roller body segment is greater than the wire groove depth of the outgoing line roller body segment; wherein the wire groove depth in each roller body segment is the same.
[0049] like Figure 3 As shown, Figure 3 The front view of another main roller of a cutting machine provided by an embodiment of the present application is shown. The roller body is divided into a first roller body segment 301, a second roller body segment 302 and a third roller body segment 303 from the line-in end to the line-out end. The first roller body segment 301 is a line-in roller body segment located at the line-in end, and the third roller body segment 303 is a line-out roller body segment located at the line-out end. In the first roller body segment 301, the second roller body segment 302 and the third roller body segment 303, the line groove depth in the first roller body segment 301 is H3, the line groove depth in the second roller body segment 302 is H4, and the line groove depth in the third roller body segment 303 is H5. The depth H3 of the line groove in the first roller body segment 301 is greater than the depth H5 of the line groove in the third roller body segment 303.
[0050] Optionally, the wire groove depths of the plurality of roller body segments decrease successively from the wire entry end to the wire exit end.
[0051] In one embodiment, the depth of the wire grooves of the plurality of roller segments decreases in sequence from the wire entry end to the wire exit end. Figure 3As shown, the line groove depth H3 of the first roller segment 301 is greater than the line groove depth H4 of the second roller segment 302, the line groove depth H4 of the second roller segment 302 is greater than the line groove depth H5 of the third roller segment 303, and H3, H4 and H5 gradually decrease. For example, if H3 is greater than H4 by X, then H4 is greater than H5 by X, and X can be any value between 0.1 and 1, such as 0.1 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.8 mm, 0.9 mm and 1 mm. Among them, the distance between the bottom of the line groove in the first roller segment 301 and the axis 102 is L5, the distance between the bottom of the line groove in the second roller segment 302 and the axis 102 is L6, and the distance between the bottom of the line groove in the third roller segment 303 and the axis 102 is L7. Since H3, H4 and H5 gradually decrease, L5, L6 and L7 gradually increase. Furthermore, in the main roller mechanism, the winding distance of the cutting line can be gradually increased from the first roller body segment 301 to the third roller body segment 303, the stretching degree of the cutting line is gradually increased, and the tension of the cutting line is gradually changed.
[0052] The roller body can also be divided into 2 roller body segments, 4 roller body segments or 5 roller body segments, and the specific number of roller body segments can be set according to the needs. The lengths of the multiple roller body segments can be the same or different, and this embodiment does not limit this.
[0053] In an embodiment of the present application, the roller body is divided into a plurality of roller body segments, and the wire groove depth in the roller body segment located at the wire input end is greater than the wire groove depth in the roller body segment located at the wire output end. During the silicon wafer cutting process, the tension of the cutting wire at the wire output end can be increased, and at the same time, it can be ensured that the silicon rod can be cut to the same extent in each roller body segment.
[0054] Optionally, the diameter of the incoming roller body segment is smaller than the diameter of the outgoing roller body segment; in each roller body segment, the diameter of the roller body remains unchanged.
[0055] Optionally, the diameters of the plurality of roller segments increase successively from the line entry end to the line exit end.
[0056] like Figure 4 As shown, Figure 4 The front view of another main roller of a cutting machine provided by an embodiment of the present application is shown. The roller body is divided into a first roller body segment 301, a second roller body segment 302 and a third roller body segment 303. The diameter D1 of the incoming roller body segment (the incoming roller body segment, i.e., the first roller body segment 301) is smaller than the diameter D3 of the outgoing roller body segment (the outgoing roller body segment, i.e., the third roller body segment 303). Figure 5 As shown, Figure 5 A top view of a main roller mechanism in another cutting machine provided in an embodiment of the present application is shown, Figure 4, the axes of the two main rollers 100 are parallel or nearly parallel. When the diameter of the inlet roller body segment 301 is smaller than the diameter of the outlet roller body segment 303, the difference between the first distance L3 and the second distance L4 can be further increased, so that the cutting line can be further stretched at the outlet end to compensate for the tension of the cutting line. During the silicon wafer cutting process, the cutting line gradually runs from the inlet end to the outlet end, and the winding distance of the cutting line changes from L3 to the larger L4, which can stretch the cutting line at the outlet end and increase the tension of the cutting line at the outlet end. Therefore, when the diameter of the outlet end is larger than the diameter of the inlet end, the winding distance L4 of the outlet end can be further increased, so that the tension of the outlet end can be further compensated. In practical applications, the insufficient tension of the outlet end caused by different cutting lines or cutting processes can be compensated by different diameter differences.
[0057] In one embodiment, the diameters of the roller segment 301, the roller segment 302, and the roller segment 303 are increased in sequence. Figure 4 As shown, if the diameter D1 of the roller segment 301 is smaller than the diameter of the roller segment 302 by X, the diameter D2 of the roller segment 302 is smaller than the diameter D3 of the roller segment 303 by Y, and X is equal to Y, so that the diameters of the roller segments 301, 302 and 303 gradually increase. In practical applications, X and Y can be the same or different, that is, the diameters of each roller segment from the inlet end to the outlet end can gradually increase, or they can not gradually increase.
[0058] In the embodiment of the present application, the roller body is divided into a plurality of roller body segments, and from the outlet end to the inlet end, the diameter of the inlet roller body segment is smaller than the diameter of the outlet roller body segment, and the tension of the cutting line at the outlet end can be further increased during the silicon wafer cutting process. When the length of the cutting line from the inlet end to the outlet end between the main rollers gradually increases, the tension of the cutting line can be gradually increased from the inlet end to the outlet end, so that the cutting line can better cut the silicon rod.
[0059] Optionally, the diameter of the roller body at the line entry end is smaller than the diameter at the line exit end.
[0060] Optionally, the diameter of the roller body increases from the line entry end to the line exit end.
[0061] like Figure 6 As shown, Figure 6The front view of another main roller of a cutting machine provided by an embodiment of the present application is shown. The roller body may be truncated cone-shaped. The diameter D4 of the wire-inlet end is smaller than the diameter D5 of the wire-outlet end. From the wire-inlet end to the wire-outlet end, the diameter of the roller body gradually increases, so that the roller body is truncated cone-shaped. In combination with the above example, since the groove depth of the wire-inlet end is greater than the groove depth of the wire-outlet end, the winding distance of the cutting wire at the wire-outlet end is greater than the winding distance of the wire-in end. When the diameter of the wire-outlet end is greater than the diameter of the wire-inlet end, the winding distance of the wire-outlet end can be further increased, thereby further compensating for the tension of the wire-outlet end.
[0062] In the embodiment of the present application, since the diameter of the wire-entry end of the roller body is smaller than the diameter of the wire-exit end, the tension of the cutting wire at the wire-exit end can be further increased in the main roller mechanism. When the diameter of the main roller gradually increases from the wire-entry end to the wire-exit end, the tension of the cutting wire can be gradually increased from the wire-entry end to the wire-exit end, so that the cutting wire can better cut the silicon rod.
[0063] An embodiment of the present application also provides a cutting machine for cutting silicon wafers, comprising the main roller as described above.
[0064] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.
Claims
1. A main roller of a cutting machine, characterized in that: include: A roller body, on the side of the roller body, a plurality of wire grooves for winding the cutting wire are arranged at intervals from the wire entry end of the roller body to the wire exit end of the roller body; The depth of the wire groove at the inlet end is greater than the depth of the wire groove at the outlet end; From the line-in end to the line-out end, the roller body is divided into a plurality of roller body segments; the plurality of roller body segments include 2-5 roller body segments; The wire-inlet roller body segment is located at the wire-inlet end, and the wire-outlet roller body segment is located at the wire-outlet end; the wire groove depth of the wire-inlet roller body segment is greater than the wire groove depth of the wire-outlet roller body segment; Wherein, the depth of the wire groove in each roller body segment is the same.
2. The main roller of the cutting machine according to claim 1, characterized in that: From the line inlet to the line outlet, the depths of the plurality of line grooves decrease in sequence.
3. The main roller of the cutting machine according to claim 1, characterized in that: From the line entry end to the line exit end, the line groove depths of the plurality of roller body segments decrease in sequence.
4. The main roller of the cutting machine according to claim 1, characterized in that: The difference between the depth of the wire groove at the wire inlet end and the depth of the wire groove at the wire outlet end is not less than 0.1 mm and not more than 1 mm.
5. The main roller of the cutting machine according to claim 1 or 2, characterized in that: The diameter of the roller body at the line-inlet end is smaller than the diameter at the line-outlet end.
6. The main roller of the cutting machine according to claim 5, characterized in that: The diameter of the roller body increases from the line entry end to the line exit end.
7. The main roller of the cutting machine according to claim 1, characterized in that: The diameter of the inlet roller body segment is smaller than the diameter of the outlet roller body segment; in each roller body segment, the diameter of the roller body remains unchanged.
8. The main roller of the cutting machine according to claim 7, characterized in that: From the line-in end to the line-out end, the diameters of the plurality of roller body segments increase in sequence.
9. A cutting machine, characterized in that: It comprises a cutting machine main roller as described in any one of claims 1-8.
Citation Information
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