Apparatus, system and method for detecting weak bonds in bonded joints

Abstract

Apparatus, system and method for detecting weak bonds in bonded joints. Disclosed herein is a detection assembly for detecting weak bonds in bonded joints of parts. The detection assembly includes an electromagnetic shock wave generator configured to generate an electromagnetic shock wave that passes through a target portion of the bonded joint. The intensity of the electromagnetic shock wave is sufficient to cause the weak bond in the target portion of the bonded joint to separate and insufficient to cause the healthy bond adjacent to the weak bond in the target portion to separate. The detection assembly also includes an ultrasonic sensor configured to generate a transmit ultrasonic pulse in response to the electromagnetic shock wave generator generating the electromagnetic shock wave that passes through the target portion of the bonded joint, direct the transmit ultrasonic pulse into the target portion of the bonded joint, and receive the receive ultrasonic pulse from the target portion of the bonded joint.

Description

Technical Field

[0001] The present disclosure relates generally to non-destructive inspection of parts and, more particularly, to apparatus, systems, and methods for detecting weak bonds in bonded joints of parts. Background Art

[0002] Within a bonded joint in a part, a kissing bond is a bonded portion where the bond is in close or direct contact with the joined layers, but is either not bonded to one or both layers, or has a bond strength below acceptable levels. With many traditional inspection techniques, a kissing bond has the appearance of a healthy bond. However, the bond performance of a kissing bond is lower than that of a healthy bond. Therefore, it is desirable to detect weak bonds in parts to ensure that the part performs as expected.

[0003] Traditional systems and methods for detecting weak bonds in adhesive joints are either too inaccurate, complex, expensive, or destructive for commercial use. For example, weak bond detection results from shear speckle interferometry and mechanical testing are validated by destructive testing of the part. In other examples, thermal imaging testing does not provide valid results for thicker parts and parts with metal cores. Lamb wave testing techniques are often insensitive to weak bonds and fail to provide repeatable and consistent results. Nonlinear ultrasonic methods use two-sided access points, have low accuracy, and are difficult to implement on real parts. Laser bond inspection techniques are large and expensive to set up. Therefore, an inspection technology that can detect weak bonds in an accurate, simple, inexpensive, and nondestructive manner is desired. Summary of the Invention

[0004] The subject matter of the present application was developed in response to the current state of the art, and in particular in response to the shortcomings of conventional systems and methods for detecting weak bonds in bonded joints of parts that have not been fully addressed by currently available technology. Accordingly, the subject matter of the present application was developed to provide apparatus, systems, and methods for detecting weak bonds in bonded joints of parts that overcome at least some of the aforementioned shortcomings of the prior art.

[0005] The following is a non-exhaustive list of examples (which may or may not be claimed) of subject matter disclosed herein.

[0006] Disclosed herein is a detection assembly for detecting weak bonds in bonded joints of parts. The detection assembly includes an electromagnetic shock wave generator configured to generate electromagnetic shock waves that pass through a target portion of the bonded joint. The intensity of the electromagnetic shock wave is sufficient to cause the weak bond in the target portion of the bonded joint to separate, but not sufficient to cause the healthy bond adjacent to the weak bond in the target portion to separate. The detection assembly also includes an ultrasonic sensor configured to generate a transmitted ultrasonic pulse (a transmitted ultrasonic pulse) in response to the electromagnetic shock wave generator generating the electromagnetic shock wave that passes through the target portion of the bonded joint, guide the transmitted ultrasonic pulse to the target portion of the bonded joint, and receive a received ultrasonic pulse (a received ultrasonic pulse) from the target portion of the bonded joint. The aforementioned subject matter of this paragraph represents Example 1 of the present disclosure.

[0007] The detection assembly is movable along the part. The foregoing subject matter of this paragraph characterizes Example 2 of the present disclosure, wherein Example 2 also includes the subject matter according to Example 1 above.

[0008] The electromagnetic shock wave generator and the ultrasonic sensor are immovably fixed relative to each other.The foregoing subject matter of this paragraph characterizes Example 3 of the present disclosure, wherein Example 3 also includes the subject matter according to Example 2 above.

[0009] The ultrasonic sensor is integrated into the electromagnetic shock wave generator.The foregoing subject matter of this paragraph characterizes Example 4 of the present disclosure, wherein Example 4 also includes the subject matter according to Example 3 above.

[0010] The electromagnetic shock wave generator includes an electromagnetic dent remover.The foregoing subject matter of this paragraph characterizes Example 5 of the present disclosure, wherein Example 5 also includes subject matter according to any of Examples 1-4 above.

[0011] The electromagnetic shock wave generator can be in direct contact with the parts when the electromagnetic shock wave generator generates electromagnetic shock waves and when the ultrasonic sensor generates transmit ultrasonic pulses, directs the transmit ultrasonic pulses into the target portion of the bonded joint, and receives receive ultrasonic pulses from the target portion of the bonded joint. The foregoing subject matter of this paragraph represents Example 6 of the present disclosure, wherein Example 6 also includes subject matter according to any of the above Examples 1-5.

[0012] The present invention also discloses a system for detecting weak bonds in bonded joints of parts. The system includes a detection component, which includes an electromagnetic shock wave generator. The electromagnetic shock wave generator is configured to generate an electromagnetic shock wave that passes through a target portion of the bonded joint. The intensity of the electromagnetic shock wave is sufficient to cause the weak bond in the target portion of the bonded joint to separate, but not sufficient to cause the healthy bond adjacent to the weak bond in the target portion to separate. The detection component also includes an ultrasonic sensor, which is configured to generate a transmit ultrasonic pulse in response to the electromagnetic shock wave generator generating an electromagnetic shock wave that passes through the target portion of the bonded joint, guide the transmit ultrasonic pulse into the target portion of the bonded joint, and receive the receive ultrasonic pulse from the target portion of the bonded joint. The system also includes a controller, which is configured to synchronize the generation of the transmit ultrasonic pulse with respect to the generation of the electromagnetic shock wave. The aforementioned subject matter of this paragraph represents Example 7 of the present disclosure.

[0013] The controller includes an EM shock wave module and an ultrasonic sensing module. The EM shock wave module is configured to send a shock wave command to an electromagnetic shock wave generator. The electromagnetic shock wave generator is configured to generate an electromagnetic shock wave in response to receiving the shock wave command. The ultrasonic sensing module is configured to automatically send an ultrasonic wave command to an ultrasonic sensor in response to the EM shock wave module sending the shock wave command. The ultrasonic sensor is configured to generate and transmit an ultrasonic pulse in response to receiving the ultrasonic wave command. The foregoing subject matter of this paragraph represents Example 8 of the present disclosure, wherein Example 8 also includes subject matter according to Example 7 above.

[0014] The ultrasonic sensor is further configured to transmit ultrasonic data corresponding to one or more characteristics of received ultrasonic pulses received by the ultrasonic sensor. The ultrasonic sensing module is further configured to detect a weak bond in the bonded joint based at least on the ultrasonic data. The foregoing subject matter of this paragraph characterizes Example 9 of the present disclosure, wherein Example 9 also includes subject matter according to Example 8 above.

[0015] The electromagnetic shock wave generator and the ultrasonic sensor form a probe. The system also includes a robot. The probe is secured to the robot and can be moved along the part by the robot. The foregoing subject matter of this paragraph represents Example 10 of the present disclosure, wherein Example 10 also includes subject matter according to any of the above Examples 7-9.

[0016] The present invention further discloses a method for detecting a weak bond in a bonded joint of parts. The method includes generating an electromagnetic shock wave that passes through a target portion of the bonded joint. The intensity of the electromagnetic shock wave is sufficient to cause the weak bond in the target portion of the bonded joint to separate, but not sufficient to cause a healthy bond adjacent to the weak bond in the target portion to separate. The method also includes generating a transmit ultrasonic pulse in response to generating the electromagnetic shock wave that passes through the target portion of the bonded joint, directing the transmit ultrasonic pulse into the target portion of the bonded joint, and receiving the receive ultrasonic pulse from the target portion of the bonded joint. The foregoing subject matter of this paragraph represents Example 11 of the present disclosure.

[0017] The method further includes: identifying at least one characteristic of the received ultrasonic pulse; performing a comparison between the at least one characteristic of the received ultrasonic pulse and at least one predetermined characteristic; and determining whether a weak bond exists in the target portion of the bonded joint based on the comparison. The foregoing subject matter of this paragraph characterizes Example 12 of the present disclosure, wherein Example 12 also includes subject matter according to Example 11 above.

[0018] At least one characteristic of the received ultrasonic pulse includes a measured signal response of the received ultrasonic pulse. The at least one predetermined characteristic includes a predetermined signal response. When the measured signal response is equal to the predetermined signal response, a determination is made that a weak bond is not present. When the measured signal response is not equal to the predetermined signal response, a determination is made that a weak bond is present. The foregoing subject matter of this paragraph characterizes Example 13 of the present disclosure, wherein Example 13 also includes subject matter according to Example 12 above.

[0019] The part is made of a conductive material.The foregoing subject matter of this paragraph characterizes Example 14 of the present disclosure, wherein Example 14 also includes subject matter according to any of the above Examples 11-13.

[0020] The electromagnetic shock wave is generated by an electromagnetic shock wave generator. The electromagnetic shock wave generator is in direct contact with the parts while generating the electromagnetic shock wave and while generating transmit ultrasonic pulses, directing the transmit ultrasonic pulses into the target portion of the bonded joint, and receiving the receive ultrasonic pulses from the target portion of the bonded joint. The foregoing subject matter of this paragraph characterizes Example 15 of the present disclosure, wherein Example 15 also includes subject matter according to any of Examples 11-14 above.

[0021] The method further includes determining an intensity of the electromagnetic shock wave sufficient to cause separation of the weak bond in the target portion of the bonded joint by generating test electromagnetic shock waves through the target portion of the bonded joint of the test part and incrementally increasing the intensity of each test electromagnetic shock wave while monitoring the test part for visual signs of abnormality. The foregoing subject matter of this paragraph characterizes Example 16 of the present disclosure, wherein Example 16 also includes subject matter according to any of the above Examples 11-15.

[0022] The step of determining an intensity of the electromagnetic shock wave sufficient to cause separation of the weak bond in the target portion of the bonded joint further includes measuring a temperature of the test part after each incremental increase in the intensity of the test electromagnetic shock wave, and waiting to generate the next test electromagnetic shock wave until the temperature of the test part is at or below a predetermined threshold temperature. The foregoing subject matter of this paragraph characterizes Example 17 of the present disclosure, wherein Example 17 also includes subject matter according to Example 16 above.

[0023] The step of determining the intensity of the electromagnetic shock wave sufficient to cause separation of the weak bond in the target portion of the bonded joint further includes inspecting the test part for structural anomalies. The foregoing subject matter of this paragraph characterizes Example 18 of the present disclosure, wherein Example 18 also includes subject matter according to any of the above Examples 16-17.

[0024] The electromagnetic shock wave is generated by an electromagnetic shock wave generator. The transmitted ultrasonic pulse is generated by an ultrasonic sensor. The transmitted ultrasonic pulse is guided by the ultrasonic sensor. The received ultrasonic pulse is received by the ultrasonic sensor. The method further includes: jointly moving the electromagnetic shock wave generator and the ultrasonic sensor to a position where the electromagnetic shock wave directly contacts the target portion of the bonded joint. The foregoing subject matter of this paragraph represents Example 19 of the present disclosure, wherein Example 19 also includes subject matter according to any of the foregoing Examples 11-18.

[0025] The bonded joint of the parts includes a first layer bonded to a second layer by bonding. The bond within the target portion of the bonded joint includes a weak bond. The electromagnetic shock wave separates the first layer from the second layer at the weak bond to form a gap between the first layer and the second layer. While the first layer and the second layer are separated by the electromagnetic shock wave, at least a portion of the transmitted ultrasonic pulse is reflected from the gap to form a received ultrasonic pulse. The foregoing subject matter of this paragraph represents Example 20 of the present disclosure, wherein Example 20 also includes subject matter according to any of the above Examples 11-19.

[0026] In one or more examples and / or implementations, the described features, structures, advantages and / or characteristics of the subject matter of the present disclosure may be combined in any suitable manner. In the following description, numerous specific details are provided to thoroughly understand the examples of the subject matter of the present disclosure. Those skilled in the relevant art will recognize that the subject matter of the present disclosure may be put into practice in the absence of one or more of the specific features, details, parts, materials and / or methods of a particular example or implementation. In other cases, the additional features and advantages that may be recognized in certain examples and / or implementations may not be present in all examples or implementations. In addition, in some cases, well-known structures, materials or operations are not shown or described in detail to avoid blurring the various aspects of the subject matter of the present disclosure. The features and advantages of the subject matter of the present disclosure will become more fully apparent from the following description and the appended claims, or may be understood by the practice of the subject matter set forth herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order that the advantages of the subject matter may be more readily understood, a more particular description of the subject matter briefly described above will be provided with reference to specific examples shown in the accompanying drawings. It will be understood that these drawings, which are not necessarily drawn to scale, depict only certain examples of the subject matter and, therefore, should not be considered limiting of its scope. The subject matter will be described and explained with additional particularity and detail through the use of the accompanying drawings, in which:

[0028] Figure 1 is a schematic elevational view of a system for detecting weak bonds in bonded joints of parts according to one or more examples of the present disclosure;

[0029] Figure 2 According to one or more examples of the present disclosure Figure 1 Schematic elevation view of a system showing an electromagnetic shock wave transmitted through a target portion of a bonded joint;

[0030] Figure 3 According to one or more examples of the present disclosure Figure 1 Schematic elevational view of a system of , showing an ultrasonic pulse transmitted through a target portion of a bonded joint and a corresponding ultrasonic echo transmitted from the target portion of the bonded joint;

[0031] Figure 4 is a schematic elevational view of a system for detecting weak bonds in bonded joints of parts according to one or more examples of the present disclosure;

[0032] Figure 5 is a schematic elevational view of a system for detecting weak bonds in bonded joints of parts according to one or more examples of the present disclosure;

[0033] Figure 6 is a block diagram of a method for detecting weak bonds in bonded joints of parts according to one or more examples of the present disclosure. DETAILED DESCRIPTION

[0034] Reference throughout this specification to "one example," "an example," or similar language means that a particular feature, structure, or characteristic described in connection with the example is included in at least one example of the present disclosure. Appearances of the phrases "in one example," "in an example," and similar language throughout this specification may (but do not necessarily) all refer to the same example. Similarly, use of the term "implementation" means an implementation having a particular feature, structure, or characteristic described in connection with one or more examples of the present disclosure, however, an implementation may be associated with one or more examples in the absence of an express association indicating the contrary.

[0035] The detection assembly, system, and method disclosed herein allow for the detection of weak bonds in bonded joints. For commercial use, current systems and methods for detecting weak bonds in bonded joints are either too inaccurate, complex, expensive, or destructive. The system and method of the present application provide an accurate, simple, inexpensive, and non-destructive technique for detecting weak bonds in bonded joints. Therefore, the system and method of the present application promote the wider use of bonding (particularly adhesive bonding) in high-precision and high-performance industries (e.g., the aviation industry).

[0036] Reference Figure 1 According to one example, a system 100 for detecting a weak bond 148 in a bonded joint 136 of a part 130 is shown. Part 130 can be any of a variety of parts in any of a variety of structures. In some examples, part 130 forms all or a portion of a vehicle (e.g., an airplane, an automobile, a boat, a spacecraft, etc.). According to other examples, part 130 forms all or a portion of a non-movable structure (e.g., a building, a bridge, a tower, etc.). Bonded joint 136 of part 130 includes a first layer 132, a second layer 134, and a bond 138 between first layer 132 and second layer 134. Bond 138 bonds first layer 132 to second layer 134, or vice versa. Typically, bond 138 defines a bond line between first layer 132 and second layer 134. In some examples, bond 138 is configured to permanently bond first layer 132 and second layer 134 together. In one example, bond 138 is an adhesive bond made of an adhesive material such as an epoxy, resin, or glue. In another example, the bond 138 is a thermal bond or weld made from the molten material and optionally the filler material of the first and second layers 132, 134. Thus, the bond 138 can be made from the same material as the first and second layers 132, 134 or a different material.

[0037] First layer 132 and second layer 134 are made of a conductive material. As used herein, a conductive material is a material that allows electromagnetic shock waves to be transmitted through the material. In some examples, first layer 132 and / or second layer 134 are made partially or completely of a metallic material. In other examples, first layer 132 and / or second layer 134 are made partially or completely of a graphite fiber reinforced polymer material (e.g., a carbon fiber reinforced polymer material or a metal fiber reinforced polymer material).

[0038] As used herein, a weak bond 148 is a portion of a bond 138 in which the bond 138 is in close or direct contact with the first layer 132 and the second layer 134, but is either (1) not bonded to one or both of the first layer 132 and the second layer 134; or (2) the bond strength of the bond 138 is below an acceptable level. In other words, to many conventional inspection techniques, a weak bond 148 has the appearance of a healthy bond. However, the bond performance of the weak bond 148 is lower than that of a healthy bond. Therefore, to promote the expected performance of parts, manufacturers should be encouraged to detect the presence of weak bonds in new parts before placing them in service, and operators of parts already in service should be encouraged to detect the presence of weak bonds in such parts while they are in service.

[0039] System 100 is configured to accurately, simply, and inexpensively detect the presence of a weak bond in a bonded joint. System 100 includes a detection assembly 110 and a controller 120. Detection assembly 110 includes an electromagnetic shock wave generator 114 and an ultrasonic sensor 116. Electromagnetic shock wave generator 114 and ultrasonic sensor 116 cooperate to create and detect a void 135 (e.g., a small air gap) in a bonded joint 136. Detection of void 135 by detection assembly 110 indicates the presence of a weak bond 148 in bonded joint 136 at the location of void 135. In some examples, when detection assembly 110 detects weak bond 148, bonded joint 136 is scraped or repaired.

[0040] Reference Figure 2 , the electromagnetic shock wave generator 114 is configured to generate an electromagnetic shock wave 150 that passes through a target portion 131 of the bonded joint 136. The target portion 131 of the bonded joint 136 is any target portion of the bonded joint 136 where it is desired to inspect a weak joint. The target portion 131 occupies a corresponding target area on the first surface 140 or the second surface 142 of the bonded joint 136. The target portion 131 is identified between imaginary dashed lines in the figures.

[0041] In some examples, electromagnetic shock wave generator 114 is an electrically powered device capable of generating an electromagnetic shock wave having a selectively controllable intensity across bonded joint 136. According to one example, electromagnetic shock wave generator 114 utilizes electrical power to generate electromagnetic shock wave 150 by utilizing an electromagnetic field as a force field to generate a tensile force. Thus, in some examples, electromagnetic shock wave generator 114 comprises an electromagnetic dent remover designed to remove dents from metal panels.

[0042] The basic operating process of an electromagnetic shock wave generator 114 (e.g., a dent remover) involves discharging the two capacitor banks of the electromagnetic shock wave generator 114 into the coil of the electromagnetic shock wave generator 114. In operation, the two capacitors (slow bank and fast bank) are charged, the coil is placed on the target structure, and then the capacitors are discharged (fired) by a set of triggers. During the discharge process, the slow bank creates a magnetic field in the material. After approximately 2 ms, the fast bank capacitors dump (discharge) into the coil circuit in the opposite direction. When the slow bank thus attempts to stop the flow of current or instantaneously change the flow of current, it thereby eliminates the magnetic field in the coil and the material. The magnetic field is instantaneously cut in half in the coil and on the face of the coil. Due to the principle of steady-state energy, the material generates its own eddy currents to maintain its current energy state. The result is a differential magnetic field (force) from the front coil to the back of the material (see, e.g., Figure 1 ), thereby generating a tension pulse towards the coil face and using it to pull the first layer 132 (e.g., indent).

[0043] Thus, electromagnetic shock wave 150 includes both an electric component and a magnetic component. Electromagnetic shock wave 150 is generated and transmitted as relatively short pulses. Thus, electromagnetic shock wave generator 114 does not generate a continuous electromagnetic shock wave. Instead, in some examples, electromagnetic shock wave 150 is an electromagnetic pulse of short duration (e.g., between 1 ms and 3 ms).

[0044] Electromagnetic shock wave generator 114 is controlled to generate an electromagnetic shock wave 150 having a strength sufficient to cause weak bonds 148 in target portion 131 to separate, but insufficient to cause healthy bonds 149 adjacent to weak bonds 148 in target portion 131 to separate. Electromagnetic shock wave 150 of this strength causes weak bonds 148 in target portion 131 to temporarily separate, forming voids 135, while leaving healthy bonds 149 intact and unaffected. In some examples, the strength of electromagnetic shock wave 150 is proportional to the voltage of the power pulse supplied to electromagnetic shock wave generator 114. Therefore, the strength of electromagnetic shock wave 150 can be adjusted by adjusting the voltage of the supplied power pulse. As electromagnetic shock wave 150 propagates through target portion 131, the tension created by electromagnetic shock wave 150 acts on weak bonds 148, effectively pulling them apart, thereby causing them to separate. The tension is created in response to electromagnetic interaction between electromagnetic shock wave 150 and the conductive materials of first layer 132 and second layer 134. Furthermore, the tension is proportional to the intensity of the electromagnetic shock wave 150 .

[0045] The separation of the weak bond 148 to form the void 135 can occur in a variety of ways. In one example, the weak bond 148 separates at the bond interface between the bond 138 and the first layer 132, such that the void 135 is defined directly between the bond 138 and the first layer 132. In another example, as shown in FIG. Figure 2 As shown, weak bond 148 separates at the bond interface between bond 138 and second layer 134, such that void 135 is defined directly between bond 138 and second layer 134. According to an alternative example, where bond 138 includes an internal weakness or anomaly, weak bond 148 separates from within bond 138, thereby creating two separated portions of bond 138, such that void 135 is defined directly between the separated portions of bond 138.

[0046] Reference Figure 3 The ultrasonic sensor 116 of the detection assembly 110 is configured to generate a transmit ultrasonic pulse 152 in response to the electromagnetic shock wave 150 generated by the electromagnetic shock wave generator 114 and passing through the target portion 131 of the bonded joint 136, direct the transmit ultrasonic pulse 152 into the target portion 131 of the bonded joint 136, and receive a receive ultrasonic pulse 154 from the target portion 131 of the bonded joint 136. Thus, the ultrasonic sensor 116 includes an ultrasonic pulse generator and an ultrasonic pulse detector. In some examples, the ultrasonic pulse generator and the ultrasonic pulse detector are physically separate transducers. For example, the ultrasonic pulse generator can be a separate ultrasonic transmitter, and the ultrasonic pulse detector can be a separate ultrasonic receiver. However, in other examples, the ultrasonic pulse generator and the ultrasonic pulse detector are integrated into the same transducer. For example, the ultrasonic sensor 116 can include an ultrasonic transceiver. In some examples, the ultrasonic sensor 116 includes an array of ultrasonic pulse generators (e.g., transducers) and an array of ultrasonic pulse detectors (e.g., transducers).

[0047] Regardless of the one or more ultrasonic pulse generators, each ultrasonic pulse generator is configured to convert electrical power into a transmit ultrasonic pulse 152, and regardless of the one or more ultrasonic pulse detectors, each ultrasonic pulse detector is configured to convert a receive ultrasonic pulse 154 into an electrical signal. In some examples, each ultrasonic pulse generator and / or receiver is a piezoelectric transducer or a capacitive transducer. The piezoelectric transducer used to generate the transmit ultrasonic pulse 152 includes one or more piezoelectric crystals that change size and / or shape when electrical power is applied, causing the crystals to oscillate and generate the transmit ultrasonic pulse 152. Conversely, the piezoelectric transducer used to detect the receive ultrasonic pulse 154 includes one or more piezoelectric crystals that generate a voltage when the receive ultrasonic pulse 154 acts on them (e.g., oscillates). In some examples, as illustrated, the crystals of the one or more piezoelectric transducers oscillate to generate the transmit ultrasonic pulse 152 and, alternatively, oscillate in the presence of the receive ultrasonic pulse 154 to detect the receive ultrasonic pulse 154.

[0048] like Figure 3 and Figure 4As shown, in some examples, the ultrasonic sensor 116 is a pulse-echo (PE) ultrasonic sensor. Thus, the ultrasonic pulse detector of the ultrasonic sensor 116 is located on the same side of the part 130 as the ultrasonic pulse generator (e.g., adjacent to the first surface 140 of the part 130). When a weak bond 148 is present, at least a portion of a transmit ultrasonic pulse 152 directed into the target portion 131 reflects from the gap 135 formed when the weak bond 148 separates. The portion of the transmit ultrasonic pulse 152 reflected from the gap 135 (which can be defined as an ultrasonic echo) becomes a receive ultrasonic pulse 154. The remaining portion of the transmit ultrasonic pulse 152 is transmitted through the remaining portion of the target portion 131 of the bonded joint 136 of the part 130. The ultrasonic pulse detector of the ultrasonic sensor 116, which is on the same side of the part 130 as the ultrasonic pulse generator, is positioned to receive and detect the receive ultrasonic pulse 154.

[0049] like Figure 5 As shown, in some examples, ultrasonic sensor 116 is a through-the-air (TTU) sensor. Thus, ultrasonic sensor 116 includes a transmitting portion 117A adjacent to first surface 140 of part 130 and a detecting portion 117B on the opposite side of part 130 (e.g., adjacent to second surface 142 of part 130). When weak bonds 148 are present, at least a portion of a transmitted ultrasonic pulse 152 directed into target portion 131 is reflected or blocked by gap 135 formed when weak bonds 148 separate. The portion of transmitted ultrasonic pulse 152 that is not blocked by gap 135 and transmits through gap 135 becomes a received ultrasonic pulse 154. Detecting portion 117B of ultrasonic sensor 116, on the opposite side of part 130 from transmitting portion 117A of ultrasonic sensor 116, is positioned to receive and detect received ultrasonic pulse 154 that has passed through part 130.

[0050] According to some examples, electromagnetic shock wave generator 114 can be in direct contact with part 130 when electromagnetic shock wave generator 114 generates electromagnetic shock wave 150 and when ultrasonic transducer 116 generates transmit ultrasonic pulse 152, directs transmit ultrasonic pulse 152 into target portion 131 of bond joint 136, and receives receive ultrasonic pulse 154 from target portion 131 of bond joint 136. In one example, contact between electromagnetic shock wave generator 114 and part 130 is utilized to create a tensile force that separates weak bond 148. Although ultrasonic transducer 116 need not be in direct contact with part 130 to generate and direct ultrasonic pulse 152 into part 130, in some examples, both electromagnetic shock wave generator 114 and ultrasonic transducer 116 are in direct contact with part 130.

[0051] In some examples, detection assembly 110 is movable along part 130. As used herein, detection assembly 110 is movable along part 130 when detection assembly 110 is not permanently secured to part 130 (e.g., not fastened or attached to part 130) and can freely move from one position to the next along part 130 to allow for detection of weak bonds 148 at multiple locations along part 130.

[0052] In some examples, detection assembly 110 is manually movable (eg, by an operator's hand). In these examples, detection assembly 110 includes a handle that can be grasped by an operator to move detection assembly 110 relative to part 130.

[0053] In other examples, the detection assembly 110 can be moved in an automated manner. Figure 4 , the system 100 also includes a robot 170 and a probe 160 that is fixed to the robot 170 and can be moved by the robot 170. The robot 170 can be any of a variety of programmable robots, such as a robot arm having multiple independently articulated links or sections. The robot 170 is programmed to move the probe 160 from one position to the next along the part 130. In these examples, the detection assembly 110 forms at least a portion of the probe 160, so that the robot 170 is configured to move the detection assembly 110 from one position to the next along the part 130. At each position, the detection assembly 110 can detect the presence of a weak bond 148 in the part 130 and then move to another position to perform the same weak bond detection process.

[0054] In some examples, the electromagnetic shock wave generator 114 and the ultrasonic sensor 116 of the detection assembly 110 are immovably fixed relative to each other. In other words, in some examples, the ultrasonic sensor 116 moves only with the movement of the electromagnetic shock wave generator 114. In one example, Figure 4 As shown, the ultrasonic sensor 116 is integrated into the electromagnetic shock wave generator 114 (eg, by coupling the ultrasonic sensor 116 to a housing of the electromagnetic shock wave generator 114 ).

[0055] According to other examples, electromagnetic shock wave generator 114 and ultrasonic sensor 116 of inspection assembly 110 may be movable relative to each other. Thus, electromagnetic shock wave generator 114 and ultrasonic sensor 116 may be independently moved relative to each other into position at a location for detecting weak bonds 148 in part 130. The independent movement of electromagnetic shock wave generator 114 and ultrasonic sensor 116 may be performed manually or autonomously.

[0056] Controller 120 of system 100 is configured to synchronize the generation of transmit ultrasonic pulses 152 with respect to the generation of electromagnetic shock waves 150. In some examples, controller 120 is integrated into (e.g., on) detection assembly 110, such that controller 120 moves with detection assembly 110. However, in other examples, controller 120 is physically separated or remote from detection assembly 110, such that controller 120 does not necessarily move when detection assembly 110 moves. For example, controller 120 may form part of a standalone computer system that is communicatively coupled to detection assembly 110 via a wired or wireless connection.

[0057] Controller 120 includes an electromagnetic (EM) shock wave module 122 and an ultrasonic sensing module 124. Generally, EM shock wave module 122 controls the operation of electromagnetic shock wave generator 114, and ultrasonic sensing module 124 controls the operation of ultrasonic sensor 116.

[0058] More specifically, if Figure 2 As shown, EM shock wave module 122 is configured to send a shock wave command 144 to electromagnetic shock wave generator 114, and electromagnetic shock wave generator 114 is configured to generate an electromagnetic shock wave 150 in response to receiving shock wave command 144. Shock wave command 144 includes desired characteristics, such as intensity (e.g., voltage) and pulse duration, of electromagnetic shock wave 150. In response to shock wave command 144, electromagnetic shock wave generator 114 generates electromagnetic shock wave 150 having the desired characteristics.

[0059] like Figure 3 As shown, the ultrasonic sensing module 124 is configured to automatically send an ultrasonic wave command 146 to the ultrasonic sensor 116 in response to the EM shockwave module 122 sending the shockwave command 144, and the ultrasonic sensor 116 is configured to generate a transmit ultrasonic pulse 152 in response to receiving the ultrasonic wave command 146. The ultrasonic wave command 146 includes desired characteristics (e.g., amplitude and frequency) of the transmit ultrasonic pulse 152. In response to the ultrasonic wave command 146, the ultrasonic sensor 116 generates a transmit ultrasonic pulse 152 having the desired characteristics.

[0060] Reference Figure 3 and Figure 5In some examples, after the ultrasonic pulse detector of the ultrasonic sensor 116 receives the received ultrasonic pulse 154, the ultrasonic sensor 116 transmits ultrasonic data 162 to the ultrasonic sensing module 124 of the controller 120. The ultrasonic data 162 includes information corresponding to one or more characteristics of the received ultrasonic pulse 154. According to some examples, the one or more characteristics of the received ultrasonic pulse 154 include a signal response (e.g., amplitude, frequency, intensity, phase (timing), etc.) measured by the ultrasonic pulse detector of the ultrasonic sensor 116. In another example, corresponding to a PE ultrasonic sensor, the one or more characteristics of the received ultrasonic pulse 154 include a depth within the bonded joint 136 at which the received ultrasonic pulse 154, in the form of a pulse-echo, is generated. The ultrasonic sensing module 124 is further configured to detect a weak bond 148 within the bonded joint 136 based at least on the ultrasonic data 162. Some examples of a method 200 for detecting a weak bond 148 employed by the ultrasonic sensing module 124 are described below.

[0061] like Figure 6 As shown, according to some examples, method 200 includes (block 202) generating an electromagnetic shock wave 150 through a target portion 131 of a bonded joint 136. According to method 200, the intensity of the electromagnetic shock wave 150 is sufficient to cause separation of weak bonds 148 in the target portion 131 and is insufficient to cause separation of healthy bonds 149 in the target portion 131 that are adjacent to the weak bonds 148. In some examples, method 200 also includes (block 216) determining the intensity of the electromagnetic shock wave 150 sufficient to cause separation of the weak bonds 148 in the target portion 131 of the bonded joint 136.

[0062] According to one example, at block 216, the intensity of electromagnetic shock wave 150 sufficient to cause weak bond 148 to separate is determined by generating test electromagnetic shock waves through a target portion of the bonded joint of the test part and incrementally increasing the intensity of each test electromagnetic shock wave while monitoring the test part for visual signs of anomalies. The test part replicates part 130 to provide a physical replica of part 130. The test electromagnetic shock waves begin with an initial test electromagnetic shock wave having an initial intensity (e.g., an initial voltage). After the initial test electromagnetic shock wave is transmitted through the test part, the test part is inspected for visual signs of anomalies. The electromagnetic shock wave's transmission through the part generates heat in the part. If the generated heat is too high, burning or thermal anomalies may occur in the part, which are typically visible to an inspector. Therefore, in some implementations, the test part is inspected for thermal anomalies. If a thermal anomaly is present in the test part, the intensity of the electromagnetic shock wave is too high to detect weak bond 148 in part 130. If a thermal anomaly is not present in the test part, a new electromagnetic shock wave of increased intensity is transmitted through the test part, and the test part is again inspected for thermal anomalies.

[0063] The intensity of the test electromagnetic shock wave is incrementally increased until a visual sign of an anomaly is present or the intensity reaches a predetermined threshold intensity corresponding to the tensile strength limit of a healthy bond 149 in the part 130. The intensity of the test electromagnetic shock wave immediately preceding the test electromagnetic shock wave that causes the visual sign of an anomaly is initially selected to be an intensity of electromagnetic shock wave 150 sufficient to cause separation of the weak bond 148.

[0064] In some examples, at block 216, the intensity of electromagnetic shock wave 150 sufficient to cause separation of weak bond 148 is further determined by measuring the temperature of the test part after each incremental increase in the intensity of the test electromagnetic shock wave. Additionally, according to some examples, block 216 further includes waiting to generate a subsequent test electromagnetic shock wave until the temperature of the test part is at or below a predetermined threshold temperature. In one example, the predetermined threshold temperature is 120°F or a temperature dependent on the material of the test part. Because the test electromagnetic shock wave generates heat in the test part, if the test part is not allowed to cool, the heat may accumulate and cause the test part to reach a temperature that the material of the test part cannot withstand without damaging the material's properties.

[0065] In some examples, the intensity of the electromagnetic shock wave 150 sufficient to cause the weak bond 148 to separate is further determined at block 216 by examining the test part for structural anomalies. After initially selecting the intensity of the electromagnetic shock wave 150 sufficient to cause the weak bond 148 to separate by incrementally increasing the intensity of the test electromagnetic shock wave to ensure that the initially selected intensity does not cause unseen structural anomalies in the part 130, the test part undergoes structural testing (e.g., tension testing, compression testing, etc.). If the test part passes the structural testing, then at block 216, the initially selected intensity is determined to be the electromagnetic shock wave 150 sufficient to cause the weak bond 148 to separate.

[0066] When the intensity of the electromagnetic shock wave 150 sufficient to cause the weak bond 148 to separate is less than an intensity associated with a predetermined tensile strength limit of the healthy bond 149 (e.g., the maximum tension that the healthy bond 149 can withstand before breaking and separating), the intensity is insufficient to cause the healthy bond 149 to separate. This predetermined maximum tension of the bond 138 is based on known properties of the bond 138, the first layer 132, and the second layer 134 of the bonded joint 136 and can be determined by tensile testing of a test part.

[0067] Still refer to Figure 6According to some examples, method 200 includes: generating a transmit ultrasonic pulse 152 (block 204); directing the transmit ultrasonic pulse 152 into the target portion 131 of the bond joint 136 (block 206); and receiving the receive ultrasonic pulse 154 from the target portion 131 of the bond joint 136 (block 208). Blocks 204-208 of method 200 are performed in response to generating the electromagnetic shock wave 150 through the target portion 131 of the bond joint 136 at block 202. In some examples, the steps of blocks 204-208 are performed concurrently with the steps of block 202. In other words, there is at least some temporal overlap between the steps of block 202 and the steps of blocks 204-208. In one example, the steps of block 202 are performed first and then performed consecutively after the steps of block 202 begin. The delay in performing block 204 after performing block 202 depends on the thickness and type of material of the bond joint 136 of the part 130. In some implementations, the step of block 204 is performed after the step of block 202 to provide sufficient time for any weak bonds 148 to separate before generating and directing the transmit ultrasonic pulse 152 into the target portion 131 of the bond joint 136 .

[0068] According to some examples, the method 200 further includes: identifying at least one characteristic of the received ultrasonic pulse 154 (block 210); performing a comparison between the at least one characteristic of the received ultrasonic pulse 154 and at least one predetermined characteristic (block 212); and determining whether a weak bond 148 exists in the target portion 131 of the bond joint 136 based on the comparison (block 214). In some examples, the comparison at block 212 is performed by the ultrasonic sensing module 124 based on the ultrasonic data 162 received from the ultrasonic sensor 116.

[0069] In one example, at least one characteristic of the received ultrasonic pulse 154 includes a measured signal response of the received ultrasonic pulse 154. The measured signal response includes one or more of a measured frequency, a measured amplitude, and a measured phase (e.g., a measured timing) of the received ultrasonic pulse 154. Similarly, at least one predetermined characteristic includes a predetermined signal response, which may be one or more of a predetermined frequency, a predetermined amplitude, and a predetermined phase (e.g., a predetermined timing). The predetermined characteristic is associated with an expected characteristic of receiving the ultrasonic pulse 154 under predetermined bonding conditions in the target portion 131 of the bonded joint 136 of the part 130. In one example, the predetermined bonding conditions include only healthy bonds 149 in the target portion 131 of the bonded joint 136, such that the predetermined signal response would be the expected signal response if all bonds 138 in the target portion 131 were healthy. Therefore, if the measured signal response of the received ultrasonic pulse 154 does not correlate with (e.g., is not equal to) the predetermined signal response, the comparison results in a determination that a weak bond 148 is present, and vice versa. Of course, in some examples where the predetermined bonding condition is the presence of at least one weak bond in the target portion 131, the opposite may be true such that if the measured signal response to the received ultrasonic pulse 154 correlates with the predetermined signal response, the comparison results in a determination that a weak bond 148 is present, and vice versa.

[0070] In one example, with a Figure 2 and Figure 3 In the illustrated PE ultrasonic sensor configuration, the characteristic of the received ultrasonic pulse 154 measured is the measured depth within the bond joint 136 at which the received ultrasonic pulse 154 originates (e.g., reflected from the void 135). Correspondingly, the predetermined characteristic is the entire thickness of the target portion 131 of the bond joint 136 of the part 130. When the measured depth is equal to the entire thickness of the target portion 131 of the bond joint 136 of the part 130, a determination is made at block 214 that a weak bond 148 is not present. Conversely, when the measured depth is less than the entire thickness of the target portion 131 of the bond joint 136 of the part 130, a determination is made at block 214 that a weak bond 148 is present.

[0071] According to some examples, method 200 further includes jointly moving the electromagnetic shock wave generator 114 and the ultrasonic transducer 116 to a position where the electromagnetic shock wave 150 directly contacts the target portion 131 of the bond joint 136. After jointly moving the electromagnetic shock wave generator 114 and the ultrasonic transducer 116 in this manner, the electromagnetic shock wave generator 114 can generate the electromagnetic shock wave 150 that passes through the target portion 131, and the ultrasonic transducer 116 can generate the transmit ultrasonic pulse 152 into the target portion 131. Subsequently, method 200 includes jointly moving the electromagnetic shock wave generator 114 and the ultrasonic transducer 116 to another position where the electromagnetic shock wave 150 directly contacts a different target portion 131 of the bond joint 136. After jointly moving the electromagnetic shock wave generator 114 and the ultrasonic transducer 116 in this manner, the electromagnetic shock wave generator 114 can generate the electromagnetic shock wave 150 that passes through the different target portion 131, and the ultrasonic transducer 116 can generate the transmit ultrasonic pulse 152 into the different target portion 131. This sequence may be repeated until a desired number of target portions of the bond joint 136 have been inspected for weak bonds.

[0072] In the above description, certain terms such as "upper," "lower," "above," "below," "horizontal," "vertical," "left," "right," "above," "below," etc. may be used. These terms are used, where applicable, to provide some clarity when dealing with relative relationships. However, these terms are not intended to imply absolute relationships, positions, and / or orientations. For example, the "upper" surface of an object can be simply turned into the "lower" surface by turning the object over. However, it is still the same object. In addition, unless otherwise expressly indicated, the terms "include," "comprise," "have," and their variations mean "including but not limited to." Unless otherwise expressly indicated, an enumerated list of items does not imply that any or all items are mutually exclusive and / or mutually inclusive. Unless otherwise expressly indicated, the terms "a," "an," and "the" also mean "one or more." In addition, the term "plurality" may be defined as "at least two." In addition, unless otherwise indicated, as defined herein, a plurality of specific features does not necessarily mean every specific feature in the entire set or category of specific features.

[0073] In addition, examples of an element being "coupled" to another element in this specification may include direct and indirect coupling. A direct coupling may be defined as an element being coupled to another element and having some contact with the other element. An indirect coupling may be defined as a coupling between two elements that are not in direct contact with each other, but having one or more additional elements between the coupled elements. In addition, as used herein, fixing an element to another element may include direct fixing and indirect fixing. In addition, as used herein, "adjacent" does not necessarily mean contact. For example, an element may be adjacent to another element without being in contact with the element.

[0074] As used herein, the phrase “at least one of…” when used with a list of items means that different combinations of one or more of the listed items may be used and only one of the items in the list may be required. An item may be a specific object, thing, or category. In other words, “at least one of…” means that any combination of items or number of items from the list may be used, but not all items in the list may be required. For example, “at least one of item A, item B, and item C” may mean item A; item A and item B; item B; item A, item B, and item C; or item B and item C. In some cases, “at least one of item A, item B, and item C” may mean, for example, but not limited to, two item A, one item B, and ten item C; four item B and seven item C; or some other suitable combination.

[0075] Unless otherwise indicated, the terms "first," "second," etc., herein are used merely as labels and are not intended to impose order, position, or hierarchy requirements on the items to which these terms refer. Furthermore, reference to an item, for example, "second," does not require or preclude the presence of an item, for example, "first," or lower-numbered, and / or an item, for example, "third," or higher-numbered.

[0076] As used herein, a system, device, structure, article, element, component, or hardware that is “configured to” perform a specified function is actually capable of performing the specified function without any modification, rather than merely being likely to perform the specified function after further modification. In other words, a system, device, structure, article, element, component, or hardware that is “configured to” perform a specified function is specifically selected, created, implemented, utilized, programmed, and / or designed for the purpose of performing the specified function. As used herein, “configured to” means an existing characteristic of the system, device, structure, article, element, component, or hardware that enables the system, device, structure, article, element, component, or hardware to perform the specified function without further modification. For purposes of this disclosure, a system, device, structure, article, element, component, or hardware that is described as “configured to” perform a particular function may additionally or alternatively be described as “adapted to” and / or “operable to” perform that function.

[0077] The schematic flow charts included herein are generally described as logical flow charts. Therefore, the depicted order and labeled steps indicate an example of the proposed method. Other steps and methods that are functionally, logically, or effectively equivalent to one or more steps or portions thereof of the illustrated method are contemplated. In addition, the format and symbols employed are provided to illustrate the logical steps of the method and should not be construed as limiting the scope of the method. Although various arrow types and line types may be employed in the flow charts, they should not be construed as limiting the scope of the corresponding method. In fact, some arrows or other lines may be used only to indicate the logical flow of the method. For example, an arrow may indicate a waiting or monitoring period of unspecified duration between the enumerated steps of the depicted method. In addition, the order in which a particular method occurs may or may not strictly follow the order of the corresponding steps shown. The boxes represented by dotted lines indicate alternative operations and / or portions thereof. The dotted lines connecting the various boxes (if any) represent alternative dependencies of the operations or portions thereof. It will be understood that not all dependencies between the various disclosed operations must be represented.

[0078] Many of the functional units described in this specification have been labeled as modules to more specifically emphasize their implementation independence. For example, a module can be implemented as a hardware circuit comprising custom VLSI circuits or gate arrays, off-the-shelf semiconductors such as logic chips, transistors, or other discrete components. A module can also be implemented in programmable hardware devices such as field programmable gate arrays, programmable array logic, or programmable logic devices.

[0079] Modules may also be implemented in code and / or software for execution by various types of processors. For example, an identified code module may include one or more physical or logical blocks of executable code, which may be organized, for example, as objects, procedures, or functions. However, the executable files of the identified modules need not be physically together, but may include different instructions stored in different locations that, when logically connected together, comprise the module and achieve the stated purpose of the module.

[0080] In fact, code module can be a single instruction or many instructions, even can be distributed on a plurality of different code segments, between different programs and on a plurality of memory devices.Similarly, can mark and illustrate operation data in module herein, and can be organized in the data structure of any suitable type according to the concrete implementation of any suitable form.Operation data can be collected as a single data set, or can be distributed in different locations (comprising on different computer-readable storage devices).When module or module part are implemented with software, the software part is stored on one or more computer-readable storage devices.

[0081] Any combination of one or more computer-readable media may be utilized. The computer-readable medium may be a computer-readable storage medium. The computer-readable storage medium may be a storage device that stores code. The storage device may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, holographic, micromechanical, or semiconductor system, device, or apparatus, or any suitable combination of the foregoing.

[0082] More specific examples of storage devices (a non-exhaustive list) would include the following: an electrical connection of one or more leads, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer-readable storage medium may be any tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device.

[0083] For example, the code for performing the operations may be written in any combination of one or more programming languages, including object-oriented programming languages ​​(e.g., Python, Ruby, Java, Smalltalk, C++, etc.) and traditional procedural programming languages ​​(e.g., the "C" programming language, etc.), and / or machine languages ​​(e.g., assembly language). The code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0084] The features, structures, or characteristics described in the examples may be combined in any suitable manner. In the above description, numerous specific details, such as examples of programming, software modules, user selections, network transactions, database queries, database structures, hardware modules, hardware circuits, hardware chips, etc., are provided to provide a thorough understanding of the examples. However, those skilled in the relevant art will recognize that the examples can be practiced without one or more of the specific details or using other methods, components, materials, etc. In other cases, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the examples.

[0085] Aspects of the examples are described above with reference to schematic flow charts and / or schematic block diagrams of methods, devices, systems, and program products according to the examples. It will be understood that each block of the schematic flow charts and / or schematic block diagrams, as well as combinations of blocks in the schematic flow charts and / or schematic block diagrams, can be implemented by code. Such code can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to generate a machine, such that instructions executed by the processor of the computer or other programmable data processing device create means for implementing the functions / actions specified in the schematic flow charts and / or schematic block diagram blocks.

[0086] Code may also be stored in a storage device that can direct a computer, other programmable data processing apparatus, or other apparatus to function in a particular manner so that the instructions stored in the storage device generate an article of manufacture including instructions for implementing the functions / actions specified in the schematic flowchart and / or schematic block diagram blocks.

[0087] The code may also be loaded onto a computer, other programmable data processing device, or other apparatus to cause a series of operational steps to be executed on the computer, other programmable device, or other apparatus to generate a computer-implemented process, so that the code executed on the computer or other programmable device provides a process for implementing the functions / actions specified in the flow and / or block diagram blocks.

[0088] The schematic flowcharts and / or schematic block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of devices, systems, methods, and program products according to various examples. In this regard, each block in the schematic flowcharts and / or schematic block diagrams may represent a module, segment, or code portion, which includes one or more executable instructions of a code for implementing the specified logical function.

[0089] The subject matter may be embodied in other specific forms without departing from its spirit or essential characteristics. The described examples are to be considered in all respects as illustrative and not restrictive. All changes that come within the meaning and equivalency range of the claims are to be embraced within their scope.

[0090] Furthermore, the present disclosure includes implementations according to the following clauses:

[0091] Clause 1. A detection assembly (110) for detecting a weak bond (148) in a bonded joint (136) of a part (130), the detection assembly (110) comprising:

[0092] an electromagnetic shock wave generator (114) configured to generate an electromagnetic shock wave (150) through a target portion (131) of a bonded joint (136), wherein the electromagnetic shock wave (150) is of sufficient intensity to cause separation of weak bonds (148) in the target portion (131) of the bonded joint (136) and is insufficient to cause separation of healthy bonds (149) adjacent to the weak bonds (148) in the target portion (131); and

[0093] An ultrasonic sensor (116) is configured to generate a transmit ultrasonic pulse (152) in response to the electromagnetic shock wave generator (114) generating an electromagnetic shock wave (150) that passes through the target portion (131) of the bond joint (136), direct the transmit ultrasonic pulse (152) into the target portion (131) of the bond joint (136), and receive a receive ultrasonic pulse (154) from the target portion (131) of the bond joint (136).

[0094] Clause 2. The inspection assembly (110) of clause 1, wherein the inspection assembly (110) is movable along the part (130).

[0095] Clause 3. The detection assembly (110) of clause 2, wherein the electromagnetic shock wave generator (114) and the ultrasonic sensor (116) are immovably fixed relative to each other.

[0096] Clause 4. The detection assembly (110) of clause 3, wherein the ultrasonic sensor (116) is integrated into the electromagnetic shock wave generator (114).

[0097] Clause 5. The detection assembly (110) of any one of clauses 1 to 4, wherein the electromagnetic shock wave generator (114) comprises an electromagnetic dent remover.

[0098] Clause 6. A detection assembly (110) according to any one of clauses 1 to 5, wherein the electromagnetic shock wave generator (114) can be in direct contact with the part (130) when the electromagnetic shock wave generator (114) generates the electromagnetic shock wave (150) and when the ultrasonic sensor (116) generates a transmit ultrasonic pulse (152), directs the transmit ultrasonic pulse (152) into the target portion (131) of the bonded joint (136), and receives a receive ultrasonic pulse (154) from the target portion (131) of the bonded joint (136).

[0099] Clause 7. A system (100) for detecting a weak bond (148) in a bonded joint (136) of a part (130), the system (100) comprising:

[0100] A detection assembly (110) comprising:

[0101] an electromagnetic shock wave generator (114) configured to generate an electromagnetic shock wave (150) through a target portion (131) of a bonded joint (136), wherein the electromagnetic shock wave (150) is of sufficient intensity to cause separation of a weak bond (148) in the target portion (131) of the bonded joint (136) and is insufficient to cause separation of a healthy bond (149) adjacent to the weak bond (148) in the target portion (131); and

[0102] an ultrasonic sensor (116) configured to generate a transmit ultrasonic pulse (152) in response to the electromagnetic shock wave generator (114) generating an electromagnetic shock wave (150) that passes through the target portion (131) of the bond joint (136), direct the transmit ultrasonic pulse (152) into the target portion (131) of the bond joint (136), and receive a receive ultrasonic pulse (154) from the target portion (131) of the bond joint (136); and

[0103] A controller (120) is configured to synchronize the generation of the transmit ultrasound pulse (152) with respect to the generation of the electromagnetic shock wave (150).

[0104] Clause 8. The system (100) of clause 7, wherein:

[0105] The controller (120) includes an EM shock wave module (122) and an ultrasound sensing module (124);

[0106] The EM shock wave module (122) is configured to send a shock wave command (144) to the electromagnetic shock wave generator (114);

[0107] The electromagnetic shock wave generator (114) is configured to generate an electromagnetic shock wave (150) in response to receiving a shock wave command (144);

[0108] The ultrasonic sensing module (124) is configured to automatically send an ultrasonic wave command (146) to the ultrasonic sensor (116) in response to the EM shock wave module (122) sending the shock wave command (144); and

[0109] The ultrasonic sensor (116) is configured to generate a transmit ultrasonic pulse (152) in response to receiving the ultrasonic command (146).

[0110] Clause 9. The system (100) of clause 8, wherein:

[0111] The ultrasonic sensor (116) is further configured to transmit ultrasonic data (162) corresponding to one or more characteristics of the received ultrasonic pulses (154) received by the ultrasonic sensor (116); and

[0112] The ultrasonic sensing module (124) is also configured to detect a weak bond (148) in the bonded joint (136) based at least on the ultrasonic data (162).

[0113] Clause 10. The system (100) of any one of clauses 7 to 10, wherein:

[0114] The electromagnetic shock wave generator (114) and the ultrasonic sensor (116) form a probe (160);

[0115] The system (100) further includes a robot (170); and

[0116] The probe (160) is fixed to a robot (170) and can be moved along the part (130) by the robot (170).

[0117] Clause 11. A method (200) of detecting a weak bond (148) in a bonded joint (136) of a part (130), the method (200) comprising the steps of:

[0118] generating an electromagnetic shock wave (150) through a target portion (131) of a bonded joint (136), wherein the electromagnetic shock wave (150) is of sufficient intensity to cause separation of a weak bond (148) in the target portion (131) of the bonded joint (136) and is insufficient to cause separation of a healthy bond (149) adjacent to the weak bond (148) in the target portion (131); and

[0119] In response to generating an electromagnetic shock wave (150) through the target portion (131) of the bond joint (136):

[0120] generating a transmit ultrasonic pulse (152);

[0121] directing a transmit ultrasonic pulse (152) into a target portion (131) of the bond joint (136); and

[0122] A receive ultrasonic pulse (154) is received from a target portion (131) of a bond joint (136).

[0123] Clause 12. The method (200) of clause 11, further comprising:

[0124] identifying at least one characteristic of the received ultrasound pulse (154);

[0125] performing a comparison between at least one characteristic of the received ultrasound pulse (154) and at least one predetermined characteristic; and

[0126] A determination is made based on the comparison whether a weak bond (148) exists in the target portion (131) of the bonded joint (136).

[0127] Clause 13. The method (200) of clause 12, wherein:

[0128] The at least one characteristic of the received ultrasonic pulse (154) includes a measured signal response of the received ultrasonic pulse (154);

[0129] the at least one predetermined characteristic comprising a predetermined signal response;

[0130] When the measured signal response is equal to the predetermined signal response, determining that a weak bond is not present (148); and

[0131] When the measured signal response is not equal to the predetermined signal response, a weak bond is determined to be present (148).

[0132] Clause 14. The method (200) of any one of clauses 11 to 13, wherein the part (130) is made of an electrically conductive material.

[0133] Clause 15. The method (200) according to any one of clauses 11 to 14, wherein:

[0134] The electromagnetic shock wave (150) is generated by the electromagnetic shock wave generator (114); and

[0135] The electromagnetic shock wave generator (114) is in direct contact with the part (130) when the electromagnetic shock wave generator (114) generates electromagnetic shock waves (150) and when generating transmit ultrasonic pulses (152), directing the transmit ultrasonic pulses (152) into the target portion (131) of the bond joint (136), and receiving receive ultrasonic pulses (154) from the target portion (131) of the bond joint (136).

[0136] Clause 16. The method (200) of any one of clauses 11 to 15, further comprising: determining an intensity of the electromagnetic shock wave (150) sufficient to cause separation of the weak bond (148) in the target portion (131) of the bonded joint (136) by:

[0137] generating a test electromagnetic shock wave through a target portion of the bonded joint of the test part; and

[0138] The intensity of each test electromagnetic shock wave is incrementally increased while the test part is monitored for visual signs of damage.

[0139] Clause 17. The method (200) of clause 16, wherein the step of determining an intensity of the electromagnetic shock wave (150) sufficient to cause separation of the weak bond (148) in the target portion (131) of the bonded joint (136) further comprises:

[0140] measuring the temperature of the test part after each incremental increase in the intensity of the test electromagnetic shock wave; and

[0141] Waiting to generate a subsequent test electromagnetic shock wave until the temperature of the test part is at or below a predetermined threshold temperature.

[0142] Clause 18. The method (200) of any one of clauses 16 to 17, wherein the step of determining the intensity of the electromagnetic shock wave (150) sufficient to cause separation of the weak bond (148) in the target portion (131) of the bonded joint (136) further comprises inspecting the test part for structural damage.

[0143] Clause 19. The method (200) according to any one of clauses 11 to 18, wherein:

[0144] The electromagnetic shock wave (150) is generated by the electromagnetic shock wave generator (114);

[0145] Transmitting an ultrasonic pulse (152) generated by an ultrasonic sensor (116);

[0146] sending an ultrasonic pulse (152) guided by an ultrasonic transducer (116);

[0147] receiving an ultrasonic pulse (154) by an ultrasonic sensor (116); and

[0148] The method (200) also includes moving the electromagnetic shock wave generator (114) and the ultrasonic sensor (116) together to a position where the electromagnetic shock wave (150) directly contacts the target portion (131) of the bond joint (136).

[0149] Clause 20. The method (200) according to any one of clauses 11 to 19, wherein:

[0150] A bonded joint (136) of a part (130) includes a first layer (132) bonded to a second layer (134) by bonding (138);

[0151] The bond (138) within the target portion (131) of the bond joint (136) includes a weak bond (148);

[0152] The electromagnetic shock wave (150) separates the first layer (132) from the second layer (134) at the weak bond (148) to form a void (135) between the first layer (132) and the second layer (134); and

[0153] While the first layer (132) and the second layer (134) are being separated by the electromagnetic shock wave (150), at least a portion of the transmitted ultrasonic pulse (152) is reflected from the gap (135) to form a received ultrasonic pulse (154).

Claims

1. A system (100) for detecting a weak bond (148) in a bonded joint (136) of a part (130), the system (100) comprising: said part (130); A detection component (110), the detection component (110) comprising: an electromagnetic shock wave generator (114) comprising a slow capacitor bank, a fast capacitor bank, and a coil, wherein the electromagnetic shock wave generator (114) is configured to generate an electromagnetic shock wave (150) through a target portion (131) of the bonded joint (136) by discharging the slow capacitor bank into the coil of the electromagnetic shock wave generator and then discharging the fast capacitor bank into the coil in an opposite direction to create a differential magnetic field from the coil to the back of the bonded joint, wherein the electromagnetic shock wave (150) is strong enough to cause a weak bond (148) in the target portion (131) of the bonded joint (136) to separate and weak enough to cause a healthy bond (149) in the target portion (131) adjacent to the weak bond (148); and an ultrasonic sensor (116) configured to generate a transmit ultrasonic pulse (152) in response to the electromagnetic shock wave (150) generated by the electromagnetic shock wave generator (114) through the target portion (131) of the bonded joint (136), direct the transmit ultrasonic pulse (152) into the target portion (131) of the bonded joint (136), and receive a receive ultrasonic pulse (154) from the target portion (131) of the bonded joint (136); and A controller (120) is configured to synchronize the generation of the transmit ultrasound pulses (152) with respect to the generation of the electromagnetic shock waves (150).

2. The system (100) according to claim 1, wherein The detection assembly (110) is movable along the part (130).

3. The system (100) according to any one of claims 1 to 2, wherein: The electromagnetic shock wave generator (114) includes an electromagnetic dent remover.

4. The system (100) according to any one of claims 1 to 2, wherein: The electromagnetic shock wave generator (114) is capable of being in direct contact with the part (130) when the electromagnetic shock wave generator (114) generates the electromagnetic shock wave (150) and when the ultrasonic sensor (116) generates the transmit ultrasonic pulse (152), directs the transmit ultrasonic pulse (152) into the target portion (131) of the bond joint (136), and receives the receive ultrasonic pulse (154) from the target portion (131) of the bond joint (136).

5. The system (100) of claim 1, wherein: The controller (120) includes an EM shock wave module (122) and an ultrasound sensing module (124); The EM shock wave module (122) is configured to send a shock wave command (144) to the electromagnetic shock wave generator (114); The electromagnetic shock wave generator (114) is configured to generate the electromagnetic shock wave (150) in response to receiving the shock wave command (144); The ultrasonic sensing module (124) is configured to automatically send an ultrasonic wave command (146) to the ultrasonic sensor (116) in response to the EM shock wave module (122) sending the shock wave command (144); and The ultrasonic sensor (116) is configured to generate the transmit ultrasonic pulse (152) in response to receiving the ultrasonic command (146).

6. The system (100) of claim 5, wherein: The ultrasonic sensor (116) is further configured to transmit ultrasonic data (162) corresponding to one or more characteristics of the received ultrasonic pulses (154) received by the ultrasonic sensor (116); and The ultrasonic sensing module (124) is further configured to detect a weak bond (148) in the bonded joint (136) based at least on the ultrasonic data (162).

7. A method (200) for detecting a weak bond (148) in a bonded joint (136) of a part (130), the method (200) comprising the steps of: generating an electromagnetic shock wave (150) through a target portion (131) of the bond joint (136) by discharging a slow capacitor bank of an electromagnetic shock wave generator into a coil of the electromagnetic shock wave generator and then discharging a fast capacitor bank of the electromagnetic shock wave generator into the coil in an opposite direction to create a differential magnetic field from the coil to the back of the bond joint, wherein the electromagnetic shock wave (150) is strong enough to cause separation of a weak bond (148) in the target portion (131) of the bond joint (136) and weak enough to cause separation of a healthy bond (149) in the target portion (131) adjacent to the weak bond (148); and In response to generating the electromagnetic shock wave (150) through the target portion (131) of the bond joint (136): generating a transmit ultrasonic pulse (152); directing the transmit ultrasonic pulse (152) into the target portion (131) of the bond joint (136); and A receive ultrasonic pulse (154) is received from the target portion (131) of the bond joint (136).

8. The method (200) according to claim 7, further comprising the steps of: identifying at least one characteristic of the received ultrasound pulse (154); performing a comparison between the at least one characteristic of the received ultrasound pulse (154) and at least one predetermined characteristic; as well as Based on the comparison, it is determined whether a weak bond (148) exists in the target portion (131) of the bonded joint (136).

9. The method (200) according to claim 8, wherein: The component (130) is made of conductive material.

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