Pressure Sensors

Abstract

The present invention discloses a pressure sensor, comprising: a ceramic substrate, on the top surface of which a predetermined circuit diagram is printed and a predetermined electronic device is mounted; and a ceramic cover, which has a top wall, a peripheral wall and a receiving cavity defined by the top wall and the peripheral wall. The bottom surface of the peripheral wall of the ceramic cover is sealedly connected to the top surface of the ceramic substrate, and the electronic device is received in the receiving cavity of the ceramic cover. In the present invention, the circuit, the electronic device and the conductive terminal are directly integrated on the ceramic substrate and the ceramic cover through the LTCC technology, which greatly simplifies the manufacturing process and reduces the cost, and the ceramic substrate and the ceramic cover have extremely strong corrosion resistance and high temperature resistance.

Description

Technical Field

[0001] The invention relates to a pressure sensor. Background Art

[0002] In the prior art, the size of automotive pressure sensors is relatively large, usually with a diameter greater than 22mm and a height greater than 10mm. This makes it increasingly difficult to meet the needs of automotive customers for small-sized pressure sensors. In addition, since most automotive pressure sensors come into contact with oil and gas, they need to have reliable sealing and corrosion resistance. In order to achieve sealing and corrosion resistance, a lot of metal finishing parts and corrosion-resistant sealing materials are required, which leads to complex assembly processes, long process chains, high automation difficulty, and high material and labor costs. Summary of the invention

[0003] The purpose of the present invention is to solve at least one aspect of the above-mentioned problems and defects in the prior art.

[0004] According to one aspect of the present invention, there is provided a pressure sensor, comprising: a ceramic substrate, on the top surface of which a predetermined circuit diagram is printed and a predetermined electronic device is mounted; and a ceramic cover, having a top wall, a peripheral wall and a receiving cavity defined by the top wall and the peripheral wall. The bottom surface of the peripheral wall of the ceramic cover is sealingly connected to the top surface of the ceramic substrate, and the electronic device is received in the receiving cavity of the ceramic cover.

[0005] According to an exemplary embodiment of the present invention, the pressure sensor further comprises a conductive terminal integrated in the ceramic cover by using LTCC technology; the circuit diagram comprises a conductive pad, and the conductive terminal is welded to the conductive pad.

[0006] According to another exemplary embodiment of the present invention, the ceramic substrate is in the shape of a circular plate, but is not limited to a circular plate, the ceramic cover is in the shape of a cylinder, but is not limited to a cylinder, and the diameter of the ceramic substrate is equal to the outer diameter of the ceramic cover.

[0007] According to another exemplary embodiment of the present invention, the conductive terminal is integrated into a peripheral wall of the ceramic cover and passes through the ceramic cover in a vertical direction.

[0008] According to another exemplary embodiment of the present invention, a semi-cylindrical reinforcing rib is formed on the inner side of the peripheral wall of the ceramic cover, and the conductive terminal is integrated into the reinforcing rib on the peripheral wall.

[0009] According to another exemplary embodiment of the present invention, the conductive terminal has a first disc-shaped welding portion exposed from the bottom surface of the peripheral wall of the ceramic cover; the conductive pad has a shape and size consistent with the first disc-shaped welding portion and is welded together with the first disc-shaped welding portion.

[0010] According to another exemplary embodiment of the present invention, the conductive terminal has a second disc-shaped welding portion exposed from the top surface of the ceramic cover, and the second disc-shaped welding portion is suitable for being welded to an external wire.

[0011] According to another exemplary embodiment of the present invention, an annular welding band corresponding to the bottom surface of the peripheral wall of the ceramic cover is printed on the top surface of the ceramic substrate, and the ceramic cover and the ceramic substrate are sealingly welded together via the annular welding band.

[0012] According to another exemplary embodiment of the present invention, the bottom surface of the peripheral wall of the ceramic cover is sealingly bonded to the top surface of the ceramic substrate by an adhesive.

[0013] According to another exemplary embodiment of the present invention, the electronic device includes a pressure detection component, an integrated chip and a plurality of passive electronic components, and the pressure detection component, the integrated chip and the plurality of passive electronic components are electrically connected to each other through conductive traces on the circuit diagram.

[0014] According to another exemplary embodiment of the present invention, the pressure detection component is located at the exact center of the ceramic substrate, and a central through hole corresponding to the pressure detection component is formed on the ceramic substrate.

[0015] According to another exemplary embodiment of the present invention, the pressure sensor is in the shape of a circular button as a whole, and has a diameter of no more than 20 mm and a height of no more than 5 mm.

[0016] According to another exemplary embodiment of the present invention, the ceramic substrate and the ceramic cover are made of the same ceramic material, so that the ceramic substrate and the ceramic cover have the same thermal expansion coefficient.

[0017] In the aforementioned exemplary embodiments of the present invention, circuits, electronic devices and conductive terminals can be directly integrated on the ceramic substrate and the ceramic cover by means of LTCC (Low Temperature Co-fired Ceramic) technology, thereby greatly simplifying the manufacturing process and reducing the cost, and the ceramic substrate and the ceramic cover have extremely strong corrosion resistance and high temperature resistance.

[0018] Other objects and advantages of the present invention will become apparent from the following description of the present invention with reference to the accompanying drawings, which will help to provide a comprehensive understanding of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram showing a ceramic substrate according to an exemplary embodiment of the present invention, on which a circuit diagram has not yet been printed;

[0020] Figure 2 A schematic diagram showing a ceramic substrate according to an exemplary embodiment of the present invention, on which a circuit diagram has been printed;

[0021] Figure 3 An exploded schematic diagram showing a pressure sensor according to an exemplary embodiment of the present invention;

[0022] Figure 4 A schematic diagram showing the assembly of a pressure sensor according to an exemplary embodiment of the present invention is shown. DETAILED DESCRIPTION

[0023] The technical solution of the present invention is further specifically described below by examples and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the overall inventive concept of the present invention and should not be construed as a limitation of the present invention.

[0024] In addition, in the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. However, it is apparent that one or more embodiments may be implemented without these specific details. In other cases, known structures and devices are embodied in a schematic manner to simplify the accompanying drawings.

[0025] According to an overall technical concept of the present invention, a pressure sensor is provided, comprising: a ceramic substrate, on the top surface of which a predetermined circuit diagram is printed and a predetermined electronic device is mounted; and a ceramic cover, having a top wall, a peripheral wall and a receiving cavity defined by the top wall and the peripheral wall. The bottom surface of the peripheral wall of the ceramic cover is sealingly connected to the top surface of the ceramic substrate, and the electronic device is received in the receiving cavity of the ceramic cover.

[0026] Figure 1 A schematic diagram showing a ceramic substrate according to an exemplary embodiment of the present invention, on which a circuit diagram has not yet been printed; Figure 2 A schematic diagram showing a ceramic substrate according to an exemplary embodiment of the present invention, on which a circuit diagram has been printed; Figure 3 An exploded schematic diagram showing a pressure sensor according to an exemplary embodiment of the present invention; Figure 4A schematic diagram showing the assembly of a pressure sensor according to an exemplary embodiment of the present invention is shown.

[0027] like Figures 1 to 4 As shown, in the illustrated embodiment, the pressure sensor includes a ceramic substrate 100 and a ceramic cover 200. A predetermined circuit diagram 110 is printed on the top surface of the ceramic substrate 100 and predetermined electronic components 121, 122, 123 are mounted. The ceramic cover 200 has a top wall 210, a peripheral wall 220, and a receiving cavity 201 defined by the top wall 210 and the peripheral wall 220.

[0028] like Figures 1 to 4 As shown, in the illustrated embodiment, the bottom surface 220 a of the peripheral wall 220 of the ceramic cover 200 is sealingly connected to the top surface of the ceramic substrate 100 , and the electronic devices 121 , 122 , 123 are accommodated in the accommodating cavity 201 of the ceramic cover 200 .

[0029] In an exemplary embodiment of the present invention, in order to prevent the sealing performance of the pressure sensor from being affected by temperature, the ceramic substrate 100 and the ceramic cover 200 are made of the same ceramic material, so that the ceramic substrate 100 and the ceramic cover 200 can have the same thermal expansion coefficient.

[0030] like Figures 1 to 4 As shown, in the illustrated embodiment, the pressure sensor further includes a conductive terminal 211 integrated into the ceramic cover 200 using LTCC technology. The circuit diagram 110 includes a conductive pad 111, and the conductive terminal 211 is welded to the conductive pad 111.

[0031] like Figures 1 to 4 As shown, in the illustrated embodiment, the ceramic substrate 100 is in the shape of a circular plate, but is not limited to a circular plate, and can be other suitable shapes. The ceramic cover 200 is in the shape of a cylinder, but is not limited to a cylinder, and can be other suitable shapes. And the diameter of the ceramic substrate 100 is equal to the outer diameter of the ceramic cover 200.

[0032] like Figures 1 to 4 As shown, in the illustrated embodiment, the conductive terminal 211 is integrated into the peripheral wall 220 of the ceramic cover 200 and passes through the ceramic cover 200 in a vertical direction.

[0033] like Figures 1 to 4 As shown, in the illustrated embodiment, a semi-cylindrical reinforcing rib 220 b is formed on the inner side of the peripheral wall 220 of the ceramic cover 200 , and the conductive terminal 211 is integrated into the reinforcing rib 220 b on the peripheral wall 220 .

[0034] like Figures 1 to 4As shown, in the illustrated embodiment, the conductive terminal 211 has a first disc-shaped welding portion exposed from the bottom surface of the peripheral wall 220 of the ceramic cover 200. The conductive pad 111 has the same shape and size as the first disc-shaped welding portion and is welded to the first disc-shaped welding portion.

[0035] like Figures 1 to 4 As shown, in the illustrated embodiment, the conductive terminal 211 has a second disc-shaped welding portion exposed from the top surface of the ceramic cover 200 , and the second disc-shaped welding portion is suitable for welding with an external wire.

[0036] like Figures 1 to 4 As shown, in the illustrated embodiment, an annular welding band 130 corresponding to the bottom surface 220a of the peripheral wall 220 of the ceramic cover 200 is printed on the top surface of the ceramic substrate 100, and the ceramic cover 200 and the ceramic substrate 100 are sealed and welded together through the annular welding band 130.

[0037] like Figures 1 to 4 As shown, in the illustrated embodiment, the bottom surface 220a of the peripheral wall 220 of the ceramic cover 200 is sealingly bonded to the top surface of the ceramic substrate 100 by an adhesive.

[0038] like Figures 1 to 4 As shown, in the illustrated embodiment, the electronic devices 121, 122, 123 include a pressure detection component 121, an integrated chip 122 and multiple passive electronic components 123, and the pressure detection component 121, the integrated chip 122 and the multiple passive electronic components 123 are electrically connected to each other through conductive traces on the circuit diagram 110.

[0039] like Figures 1 to 4 As shown, in the illustrated embodiment, the pressure detection component 121 is located at the exact center of the ceramic substrate 100 , and a central through hole 101 corresponding to the pressure detection component 121 is formed on the ceramic substrate 100 .

[0040] like Figures 1 to 4 As shown, in the illustrated embodiment, a plurality of positioning pins are integrated in the peripheral wall 220 of the ceramic cover 200, and the lower ends of the positioning pins extend from the bottom surface 220a of the peripheral wall 220 of the ceramic cover 200. A plurality of blind holes corresponding to the plurality of positioning pins are formed on the top surface of the ceramic substrate 100, and the plurality of positioning pins are respectively inserted into the plurality of blind holes to prevent the ceramic cover 200 from rotating relative to the ceramic substrate 100.

[0041] like Figures 1 to 4 As shown, in the illustrated embodiment, the pressure sensor is in the shape of a circular button as a whole, and the diameter of the pressure sensor is no greater than 20 mm, and the height is no greater than 5 mm.

[0042] Those skilled in the art can understand that the embodiments described above are exemplary and can be improved by those skilled in the art. The structures described in various embodiments can be freely combined without causing conflicts in structure or principle.

[0043] Although the present invention has been described in conjunction with the accompanying drawings, the embodiments disclosed in the accompanying drawings are intended to exemplify the preferred implementations of the present invention and should not be construed as limiting the present invention.

[0044] Although some embodiments of the present general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the present general inventive concept, the scope of which is defined by the claims and their equivalents.

[0045] It should be noted that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. In addition, any element reference signs in the claims shall not be construed as limiting the scope of the present invention.

Claims

1. A pressure sensor, characterized in that: include: A ceramic substrate (100) having a predetermined circuit diagram (110) printed on its top surface and having predetermined electronic components (121, 122, 123) mounted thereon; and A ceramic cover (200) comprising a top wall (210), a peripheral wall (220), and a receiving cavity (201) defined by the top wall (210) and the peripheral wall (220). The bottom surface (220a) of the peripheral wall (220) of the ceramic cover (200) is sealingly connected to the top surface of the ceramic substrate (100), and the electronic components (121, 122, 123) are accommodated in the accommodation cavity (201) of the ceramic cover (200). The pressure sensor further comprises a conductive terminal (211) integrated into the ceramic cover (200) using LTCC technology; The circuit diagram (110) comprises a conductive pad (111), and the conductive terminal (211) is welded to the conductive pad (111). The conductive terminal (211) is integrated into the peripheral wall (220) of the ceramic cover (200) and passes through the ceramic cover (200) in a vertical direction. A semi-cylindrical reinforcing rib (220b) is formed on the inner side of the peripheral wall (220) of the ceramic cover (200), and the conductive terminal (211) is integrated into the reinforcing rib (220b) on the peripheral wall (220). An annular welding band (130) corresponding to the bottom surface (220a) of the peripheral wall (220) of the ceramic cover (200) is printed on the top surface of the ceramic substrate (100); the ceramic cover (200) and the ceramic substrate (100) are sealed and welded together via the annular welding band (130). The electronic device (121, 122, 123) comprises a pressure detection component (121), an integrated chip (122), and a plurality of passive electronic components (123); the pressure detection component (121), the integrated chip (122), and the plurality of passive electronic components (123) are electrically connected to each other via conductive traces on the circuit diagram (110); The pressure detection component (121) is located at the exact center of the ceramic substrate (100), and a center through hole (101) corresponding to the pressure detection component (121) is formed on the ceramic substrate (100).

2. The pressure sensor according to claim 1, characterized in that: The ceramic substrate (100) is in the shape of a circular plate, the ceramic cover (200) is in the shape of a cylinder, and the diameter of the ceramic substrate (100) is equal to the outer diameter of the ceramic cover (200).

3. The pressure sensor according to claim 1, characterized in that: The conductive terminal (211) has a first disc-shaped welding portion exposed from the bottom surface of the peripheral wall (220) of the ceramic cover (200); The conductive pad (111) has a shape and size consistent with the first disc-shaped welding portion, and is welded to the first disc-shaped welding portion.

4. The pressure sensor according to claim 3, characterized in that: The conductive terminal (211) has a second disc-shaped welding portion exposed from the top surface of the ceramic cover (200), and the second disc-shaped welding portion is suitable for being welded to an external wire.

5. The pressure sensor according to claim 1, characterized in that: The pressure sensor is in the shape of a circular button as a whole, and has a diameter of no more than 20 mm and a height of no more than 5 mm.

6. The pressure sensor according to claim 1, characterized in that: The ceramic substrate (100) and the ceramic cover (200) are made of the same ceramic material, so that the ceramic substrate (100) and the ceramic cover (200) have the same thermal expansion coefficient.

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