Parts mounting device and parts mounting method

Abstract

The present invention provides a parts installation device and a parts installation method, wherein the parts installation device transfers and installs the parts onto a substrate, and comprises: a conveying unit (4) which sends out a belt (1) and sequentially places the parts (2) vertically above the transfer position and processes the part of the winding belt that has been sent out; an optical observation unit (5) which irradiates the parts (2) and the substrate (3) with illumination light from a light source and branches the reflected light from the parts and the substrate into two systems to simultaneously observe the transfer target parts and the substrate; a transfer unit (8) which has a light-transmitting pressing member (6) which presses the transfer target parts from the other side of the belt, and transfers and installs the parts onto the substrate by relatively moving the pressing member and the substrate to press the parts to the transfer position; and a control unit (9) which comprehensively controls the conveying unit, the optical observation unit and the transfer unit. Thus, the parts can be transfer-installed onto the substrate with high precision.

Description

Technical Field

[0001] The present invention relates to a component mounting technology, and more particularly to a component mounting device and a component mounting method for mounting tiny components bonded to one side of a thin and long light-transmitting tape that can be wound into a roll at a predetermined arrangement pitch onto a substrate with high precision. Background Art

[0002] When mounting the microscopic parts (e.g., each dimension of the outer shape is about tens to hundreds of μm) on the substrate with high precision in the so-called reel-to-reel method, it is necessary to improve the accuracy of aligning the position of the part bonded to one side of the tape with the position to be mounted on the substrate. When the size of the part to be mounted is micron-level, even if the tape is moved at a predetermined arrangement pitch, it may not be possible to place the part directly above the mounting position. The reason is that, for example, when the tape expands and contracts in the conveying direction, its influence cannot be ignored.

[0003] Therefore, a method of aligning the parts by moving the substrate using a camera to observe the parts position is considered. However, in this case, when a component is used to press the parts from the other side of the belt, if the belt and the component are not light-transmissive, they cannot be directly observed.

[0004] On the other hand, the industry has revealed a component mounting device that is not a roll-to-roll method but uses a camera to observe the position of components through a transparent member (for example, refer to Japanese Patent Publication No. 2017-157682).

[0005] However, when a transparent glass plate is used as in the conventional component mounting device, a certain degree of strength (thickness) is required in order to press the component onto the substrate from the other side of the belt. Therefore, when observing with a microscope, for example, at a stage where the component disposed on one side of the belt and the substrate surface to be mounted on the substrate are separated in the optical axis direction, if the depth of focus is shallow, the focusing range is narrow, and it is difficult to observe simultaneously. As a result, it is difficult to transfer and mount the component onto the substrate with high precision.

[0006] Therefore, the present invention aims to deal with such a problem, and its purpose is to provide a part installation device and a part installation method that can transfer and install parts (especially the above-mentioned tiny parts) adhered to one side of a slender light-transmitting tape that can be rolled into a roll with a predetermined arrangement spacing onto a substrate with high precision. Summary of the invention

[0007] In order to achieve the above-mentioned purpose, the first invention is a part installation device for transfer-installing parts onto a substrate, which comprises: a conveying section, which places the parts adhered to one side of a thin and long light-transmitting belt that can be wound into a roll in sequence just above the transfer position to be transferred to the above-mentioned substrate by sending out the light-transmitting belt that can be wound into a roll, and winds the sent-out part of the belt into a roll; an optical observation section, which irradiates the transfer object part and the above-mentioned substrate with illumination light from a light source, and branches the reflected light from the part and the substrate into two systems to simultaneously observe the transfer object part and the above-mentioned substrate; a transfer section, which has a light-transmitting pressing member that presses the transfer object part from the other side of the belt, and presses the part to the transfer position by moving the pressing member relative to the substrate, thereby transfer-installing the part onto the above-mentioned substrate; and a control section, which comprehensively controls the conveying section, the optical observation section and the transfer section.

[0008] According to the component mounting device of the first invention, there can be provided a device which can transfer and mount components bonded to one side of an elongated light-transmitting tape that can be wound into a roll at a predetermined arrangement pitch onto a substrate with high accuracy using the above-mentioned configuration.

[0009] In addition, the second invention is a method for installing parts by transfer transfer onto a substrate, which performs the following steps: conveying processing, that is, by feeding out a slender translucent tape that can be wound into a roll, the parts adhered to one side of the tape at a predetermined arrangement pitch are placed in sequence directly above the transfer position to be transferred to the above-mentioned substrate, and at the same time, the fed portion of the tape is wound into a roll; illuminating light from a light source is irradiated onto the transfer object part and the above-mentioned substrate, and the reflected light from the part and the substrate is branched into two systems to simultaneously observe the transfer object part and the substrate; a translucent pressing member that presses the transfer object part from the other side of the belt is moved relative to the above-mentioned substrate, thereby pressing the above-mentioned part to the transfer position; and, transferring and installing the above-mentioned part onto the above-mentioned substrate.

[0010] According to the component mounting method of the second invention, components bonded to one surface of an elongated light-transmitting tape that can be wound into a roll at a predetermined arrangement pitch can be transferred and mounted on a substrate with high accuracy through the above steps. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a diagram showing the main structure of a first embodiment of a component mounting device according to the present invention.

[0012] Figure 2A To express Figure 1 A top view of one embodiment of a belt configured with multiple parts is shown.

[0013] Figure 2B for Figure 2A The AA line cross-section is shown.

[0014] Figure 2C for Figure 2B An enlarged cross-sectional view of the area enclosed by R1 is shown.

[0015] Figure 3 for Figure 1 Detailed diagram of the parts installation device shown.

[0016] Figure 4 It is an explanatory diagram showing a configuration example of a pressing member.

[0017] Figure 5A This is an explanatory diagram regarding the shape of the upper surface of the pressing member, and illustrates a case where the upper surface of the pressing member has a curved shape.

[0018] Figure 5B is an explanatory diagram related to the shape of the upper surface of the pressing member, and illustrates Figure 5A The pressing member shown has a different shape of the upper surface, and is a pressing member with a flat upper surface.

[0019] Fig. 6A This is the first photograph for examining the shape of the upper surface of the pressing member.

[0020] Figure 6B This is the second photograph for examining the shape of the upper surface of the pressing member.

[0021] Figure 6C This is the third photograph for examining the shape of the upper surface of the pressing member.

[0022] Figure 7 It is an explanatory diagram related to the shape of the lower surface of the pressing member.

[0023] Figure 8 To express Figure 1 A block diagram showing an example of the hardware configuration of the control unit shown.

[0024] Fig. 9 It is a flowchart showing the first embodiment of the component mounting method of the present invention.

[0025] Fig. 10A A first process diagram for explaining the component mounting method according to the first embodiment.

[0026] Fig. 10B A second process diagram for explaining the component mounting method of the first embodiment.

[0027] Fig. 10C This is a third process diagram for explaining the component mounting method of the first embodiment.

[0028] Fig.11A This is a fourth process diagram for explaining the component mounting method of the first embodiment.

[0029] Fig. 11B This is a fifth process diagram for explaining the component mounting method of the first embodiment.

[0030] Fig. 11C This is a sixth process diagram for explaining the component mounting method of the first embodiment.

[0031] Fig.12 The first schematic diagram is for explaining simultaneous observation of observation planes with different focal positions.

[0032] Fig.13A This is the first photograph for explaining the simultaneous observation of observation surfaces with different focal positions.

[0033] Fig. 13B This is the second photograph for explaining the simultaneous observation of observation surfaces with different focal positions.

[0034] Fig.14 The second schematic diagram is for explaining the simultaneous observation of observation planes with different focal positions.

[0035] Fig.15 This is a diagram showing the main structure of a second embodiment of the component mounting device of the present invention.

[0036] Fig.16 It is a flowchart showing the second embodiment of the component mounting method of the present invention. DETAILED DESCRIPTION

[0037] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a diagram showing the main structure of a first embodiment of a component mounting device according to the present invention.

[0038] [First embodiment]

[0039] Figure 1 The component mounting device shown mounts the micro-components 2 bonded to one side of a thin and long light-transmitting tape 1 that can be wound into a roll (hereinafter referred to as "the surface of the tape 1") at a predetermined arrangement pitch on a substrate 3 with high precision. As described above, the dimensions of the micro-components 2 are, for example, several tens to several hundreds of μm. Furthermore, the component mounting device is assumed to be used after mounting the components 2 on the substrate 3 in a predetermined arrangement pattern using other transfer techniques and removing defective components found in the inspection stage.

[0040] That is, the component mounting device is used to selectively transfer the qualified component 2 to the defective part on the substrate 3. Furthermore, the defective part refers to, for example, the unmounted part after the defective component is removed. The unmounted part also includes the missing component 2.

[0041] The component mounting device includes a conveying unit 4, an optical observation unit 5, a light irradiation unit 7, a transfer unit 8, and a control unit 9 as main components. Figure 1 The pressing member 6 shown is spatially separated from the transfer section 8 but is included in the transfer section 8 .

[0042] The conveying unit 4 performs the following processing, for example: the belt 1 is fed out in a roll-to-roll manner, so that the parts 2 adhered to the surface of the belt 1 at the same arrangement pitch are sequentially placed just above the transfer position to be transferred to the substrate 3, and the fed portion of the belt 1 is wound into a roll. The conveying unit 4 includes a feeding mechanism 41, a winding mechanism 42, and a belt control unit 43 (see Figure 3 ).

[0043] Since the parts 2 are sequentially placed just above the transfer positions set on the substrate 3, the feeding mechanism 41 performs a process of continuously or intermittently conveying the tape 1 in a certain direction. The winding mechanism 42 winds up the tape 1 after the parts 2 are peeled off by transfer. The so-called intermittent conveying means, for example, stepping movement according to the arrangement pitch of the parts 2.

[0044] Figure 2A To express Figure 1 A top view of an embodiment of a strip 1 provided with elements 2 is shown. Figure 2B for Figure 2A The AA line cross-section is shown. Figure 2C for Figure 2B An enlarged cross-sectional view of the area enclosed by R1 is shown.

[0045] in, Figure 2A The example shown in FIG. 1 shows a state where the belt 1 is partially cut. Figure 2B In the figure, the thickness of the component 2 is about several tens of μm (20 μm as an example) relative to the thickness of the belt 1 (for example, about 0.7 mm), and the belt 1 is actually thicker.

[0046] In addition, the component 2 may be, for example, a specific component installed during the manufacturing stage of a micro LED display in a UV (Ultra Violet) excitation mode. In the UV excitation mode, a micro LED (Light Emitting Diode) chip that emits UV light is combined with a color conversion chip that uses RGB phosphors composed of the three primary colors of light, namely red (R), green (G), and blue (B) as a color conversion layer to achieve full-color display. The specific component includes a micro LED chip and a color conversion chip. In the first embodiment, Figure 2A In the embodiment, for example, a color conversion chip can be used as part 2.

[0047] Tape 1 is a UV-curable adhesive tape whose adhesive force decreases under UV irradiation. Figure 2C As shown, one end surface (hereinafter referred to as "first surface") supporting a plurality of parts 2 is fixed by adhesion. The belt 1 arranges the parts 2 in an independent state on the belt 1 in a predetermined arrangement according to the same arrangement pitch P. The distance interval of the arrangement pitch P is specified for the purpose of efficiently installing the parts 2. That is, when the transfer target part 2 is set to the transfer position of the substrate 3, other parts 2 are prevented from contacting the substrate 3. Therefore, as long as the belt 1 of such a structure is used, the parts 2 can be efficiently installed. In addition, the wavelength of the ultraviolet rays used in the ultraviolet irradiation is preferably 365nm, which is generally used for ultraviolet curing.

[0048] And, if Figure 2C As shown, the tape 1 includes a base member 1a and an adhesive layer 1b laminated on one surface of the base member 1a. The first surface of the component 2 is adhered to the tape 1 via the adhesive layer 1b.

[0049] The base member 1a is made of a UV-transmitting resin in the form of a UV-curing adhesive tape. The adhesive layer 1b is a UV-curing adhesive laminated on one side of the base member 1a. However, the adhesive layer 1b does not absorb all UV rays and allows UV rays to pass through.

[0050] The tape 1 can sufficiently fix the component 2 when fixing the component 2, and the adhesive can be cured by irradiating ultraviolet light (hereinafter sometimes referred to as "ultraviolet light"), thereby reducing the adhesive force and making it easy to peel off. Therefore, it is preferable to use an ultraviolet curing adhesive tape as the tape 1.

[0051] In addition, the tape 1 has light transmittance in the wavelength range from visible light to ultraviolet light. In addition, the tape 1 is not limited to ultraviolet curing adhesive tape, and may be a resin film coated with an adhesive on the surface, or may be various adhesive tapes. However, in order to transfer and mount the component 2 to the substrate 3, the condition is that the adhesive force of the first surface of the component 2 adhering to the tape 1 is smaller than the adhesive force of the other end surface of the component 2 (hereinafter referred to as the "second surface") fixed to the transfer position of the substrate 3.

[0052] Figure 3 for Figure 1 Detailed diagram of the parts installation device shown. Figure 3 This is shown in more detail in Figure 1 The conveying unit 4, optical observation unit 5, and transfer unit 8 are shown. The tape control unit 43 of the conveying unit 4 receives instructions from the control unit 9 to control the feeding of the tape 1 by the feeding mechanism 41 and the winding of the tape 1 by the winding mechanism 42.

[0053] The optical observation section 5 irradiates the transfer target part 2 and the substrate 3 with illumination light from the illumination light source 57, and branches the reflected light from the part 2 and the substrate 3 into two systems to simultaneously observe the transfer target part 2 and the substrate 3. The optical observation section 5 provides an optical unit for irradiating the part 2 and the substrate 3 with ultraviolet rays emitted from the light irradiation section 7.

[0054] The optical observation unit 5 selectively adopts observation under auto-focus processing focusing on a specific object, and performs auto-focus processing on the substrate surface of the substrate 3 based on the reflected light from the substrate 3 guided from at least one of the two systems. Details will be described later.

[0055] like Figure 3 As shown, the optical observation unit 5 includes an objective lens 51, a first imaging lens 52, a second imaging lens 53, a first imaging unit 54, a second imaging unit 55, an imaging lens control unit 56, an illumination light source 57, and mirrors M1 to M6. Mirrors M1 and M3 are semi-transparent and semi-reflective mirrors, mirrors M2, M4, and M5 are reflecting mirrors, and mirror M6 is a dichroic mirror that reflects ultraviolet light and transmits visible light.

[0056] The objective lens 51 converges the illumination light irradiated from the light source 57 onto the component 2 and the substrate 3. Specifically, the objective lens 51 converges the light onto the first surface of the component 2 opposite to the objective lens 51, and converges the light onto the substrate surface of the substrate 3 opposite to the objective lens 51. The mirror M1 has a function as a beam splitter, and is disposed just above the objective lens 51, so that the reflected light from the component 2 and the substrate 3 is branched into two systems (the first optical path and the second optical path).

[0057] The first imaging lens 52 is disposed above the mirror M2, and uses the first optical path formed by the mirror M1 to image the reflected light from the part 2. The first optical path is included in the following optical path: the illumination light irradiated from the light source 57 is focused on the part 2 by the objective lens 51, and the reflected light from the part 2 passes through the mirrors M6 and M3 via the objective lens 51, and then is reflected 90 degrees on the reflective mirror M1, and then further reflected 90 degrees on the mirror M2 and guided to the first imaging lens 52.

[0058] The second imaging lens 53 is disposed above the mirror M1, and uses the second optical path formed by the mirror M1 to image the reflected light from the substrate 3. The second optical path is included in the following optical path: the illumination light irradiated from the light source 57 is focused on the substrate 3 by the objective lens 51, and the reflected light from the substrate 3 passes through the mirrors M6 and M3 via the objective lens 51, and then passes through the mirror M1 to be guided to the second imaging lens 53.

[0059] The first camera unit 54 is disposed above the first imaging lens 52, and captures the image of the component 2 obtained by imaging through the first imaging lens 52, converts it into data of the first image, and sends the data to the control unit 9 for analysis. The second camera unit 55 is disposed above the second imaging lens 53, and captures the image of the substrate surface of the substrate 3 obtained by imaging through the second imaging lens 53, converts it into data of the second image, and sends the data to the control unit 9 for analysis.

[0060] The imaging lens control unit 56 moves the second imaging lens 53 by contrast autofocusing as an autofocusing process before and after the substrate 3 moves vertically upward so as to match the focal position of the substrate 3. Specifically, the imaging lens control unit 56 is a member that calculates the contrast of an image obtained when the second imaging lens 53 is moved in the optical axis direction as a focusing lens by the control unit 9, and positions the second imaging lens 53 so as to make the lens position at which the maximum contrast is achieved a focus point. In the first embodiment, in order to make the description easy to understand, when the transfer target part 2 is indirectly in contact with the pressing member 6 via the belt 1, the vertical displacement is negligible, and therefore the position of the first imaging lens 52 is fixed in advance so as to match the focal position. However, since the optical observation unit 5 selectively adopts observation under the autofocusing process, the imaging lens control unit 56 may also be set to drive the first imaging lens 52 as a focusing lens and perform contrast autofocusing.

[0061] The illumination light source 57 illuminates the transfer component 2 and substrate 3 located directly below the objective lens 51. The illumination light emitted from the light source 57 passes through the objective lens 51 via the mirrors M5, M3, and M6, and illuminates the component 2 and substrate 3 as specific objects.

[0062] Figure 4 The pressing member 6 is an explanatory diagram showing an example of the structure of the pressing member 6. The pressing member 6 has light transmittance in the wavelength range from visible light to ultraviolet light, and presses the transfer target part 2 (reference Figure 3). Specifically, the pressing member 6 is preferably made of a transparent quartz glass material. In addition, the upper surface 61 and the lower surface 62 of the pressing member 6 have curved surfaces, and the curved surfaces have different curvatures. That is, the upper surface 61 of the pressing member 6 has a curved surface based on an optical point of view. In addition, the lower surface 62 has a curved surface based on a mechanical engineering point of view. Among them, from the viewpoint of not having an optical effect, the shape of the curved surface of the lower surface 62 preferably satisfies the specified optical conditions separately. Details will be used Figure 7 As described later. Figure 1 As shown, the pressing member 6 also functions as a pressing jig for supporting the belt 1 so as to bend it.

[0063] Here, Figure 4 In the embodiment, the light (illumination light) after passing through the objective lens 51 passes through the pressing member 6 and converges at the focal position of the observation surface 63 focused by the action of the objective lens 51. Then, the reflected light reflected from the observation surface 63 forms a spherical wave SW, passes through the pressing member 6 again and returns to the objective lens 51. Figure 4 Although not shown in the figure, when the first surface of the component 2 is used as the observation surface 63, the first imaging lens 52 forms an image of the reflected light from the first surface of the component 2 through the objective lens 51. Figure 4 Although not shown in the figure, when the substrate surface of the substrate 3 is used as the observation surface 63, the second imaging lens 53 forms an image of the reflected light from the substrate surface that has passed through the objective lens 51.

[0064] The pressing member 6 defines the shape of the upper surface 61 in such a manner that when the reflected light passes through the upper surface 61 of the pressing member 6 in the form of the spherical wave SW, the shape of the upper surface 61 is consistent with the curvature radius of the spherical wave SW. t Indicates that the radius of curvature R t The curvature center C1 is the focal position. The curvature radius R t The design is to have the same value as the radius of curvature of the spherical wave SW when the spherical wave SW passes through the upper surface 61. The purpose is to avoid changes in the wavefront of the spherical wave SW generated from the focal position of the observation surface 63, that is, to suppress the generation of aberrations on the upper surface 61. When the observation surface 63 contacts the lower surface 62 of the pressing member 6, the thickness T of the pressing member 6 and the radius of curvature R t Consistent.

[0065] Figure 5A 6 is an explanatory diagram related to the shape of the upper surface 61 of the pressing member 6, and illustrates a case where the upper surface 61 of the pressing member 6 has a curved surface shape. In this case, as shown in FIG. Figure 4As described above, the wavefront of the spherical wave SW does not change. That is, light is not refracted on the upper surface 61, so no aberration occurs. Figure 5B is an explanatory diagram related to the shape of the upper surface 61 of the pressing member 6, and illustrates an example of a shape different from Figure 5A The pressing member 6 shown has a top surface 61, and the top surface 61a is a flat pressing member 6a. If the top surface 61a is flat, light is refracted on the top surface 61a to generate aberrations, which reduces the resolution of the optical system and prevents high-precision transfer.

[0066] Fig. 6A This is a first photograph for examining the shape of the upper surface of the pressing member 6. In order to make the description easier to understand, the description will be given using a photograph observed under a microscope. Fig. 6A The photographs of the test board with numbers on it are shown. The row with number 1 has holes with a line width of 0.977μm, the row with number 2 has holes with a line width of 0.870μm, and the row with number 3 has holes with a line width of 0.775μm. Fig. 6A The first photograph shown is an example of a focused state.

[0067] Figure 6B The second photograph for examining the shape of the upper surface of the pressing member 6 shows an example of Fig. 6A The second photograph is taken in the state of observing through a 3mm thick light-transmitting plate. In this case, the resolution of the image is Fig. 6A The image quality has been reduced compared to the first photo taken.

[0068] In contrast, Figure 6C The third photograph is used to examine the shape of the upper surface of the pressing member 6. The photograph shown here is a photograph observed through a translucent hemispherical body with a thickness of 2.5 mm and a radius of curvature of 2.5 mm. The observation magnification of the microscope is the microscope magnification × the refractive index of the hemispherical body. In this case, the resolution of the image is equal to Figure 6B The reason for this is that the numerical aperture has increased due to the increase in refractive index, thus improving the resolution.

[0069] according to Figures 6A to 6C As can be seen from the first to third photographs shown in FIG. 1 , the shape of the upper surface 61 of the pressing member 6 is preferably designed in the following manner, that is, Figure 4 As shown, when the reflected light passes through the upper surface 61 in the form of spherical wave SW, the curvature radius is consistent with the spherical wave SW. Through this design, it is only necessary to combine the pressing member 6 with the existing objective lens 51 to realize a parts mounting device that can perform high-precision transfer without the need to design or manufacture a new objective lens dedicated to the parts mounting device.

[0070] Figure 7 6 is an explanatory diagram related to the shape of the lower surface 62 of the pressing member 6. From an optical point of view, the shape of the lower surface 62 of the pressing member 6 (the whole is omitted in the figure) is preferably a flat surface, but as long as Figure 7 If the optical path difference within the field of view (radius) s shown is within the range of the focal depth d of the objective lens 51, there is no problem even if it is a curved surface. Figure 7 The reason why the lower surface 62 is not set as a flat surface but is bent and intentionally set as a curved surface when viewed from the front is as follows. That is, since the belt 1 is transported in a roll-to-roll manner, it is preferred to Figure 1 The curvature of the belt 1 shown is in the shape of a curved surface (cylindrical surface) from a mechanical engineering point of view.

[0071] As for the pressing member 6 , for example, in the case of synthetic quartz, a pressing member 6 having a refractive index of 1.458 and an Abbe number indicating the degree of difference in the refractive index per wavelength of 67.70 is used.

[0072] In detail, Figure 7 In the embodiment, the shape of the lower surface 62 of the pressing member 6 is based on the condition that the following relationship is satisfied.

[0073] z=R b (1-cosθ) (1)

[0074] (n-1)z<d (2)

[0075] tanθ=s / R b (3)

[0076] Here, regarding each parameter, z is the distance between the lower surface 62 of the curved surface shape of the pressing member 6 and the observation surface 63, R b The curvature radius of the lower surface when the center of curvature determined by the shape of the lower surface 62 is set to C2, n is the refractive index of the material of the pressing member 6, d is the focal depth of the objective lens 51, and s is the field of view (radius). z is equivalent to the optical path length at the field of view s. The optical path length of the central part is nz because it is in a medium with a refractive index of n, and the difference in optical path length is nz-z=(n-1)z. Furthermore, when cosθ is 0 degrees, the distance (z) between the lower surface 62 of the curved surface shape of the pressing member 6 and the observation surface 63 is consistent.

[0077] Based on the above, the curvature radius R of the shape of the lower surface 62 of the pressing member 6 is determined. b It is preferred that the above-mentioned relations (1) to (3) are satisfied. That is, the conveying unit 4 adopts a roll-to-roll method, such as Figure 1As shown, the belt 1 is configured in an arc shape by the pressing member 6. If the lower surface 62 of the pressing member 6 is a curved surface, when the pressing member 6 presses the belt 1, the edges on both sides of the lower surface 62 will not cause the belt 1 to generate excess stress and deformation due to the load of the pressing member 6.

[0078] The light irradiation unit 7 irradiates light of a wavelength (e.g., 365 nm) predetermined for photoreaction toward the transfer position pre-coated with the photoreactive adhesive. The photoreactive adhesive is, for example, an ultraviolet curing adhesive that hardens under ultraviolet irradiation. As described above, the tape 1 is an adhesive tape whose adhesive force decreases under ultraviolet irradiation. The light irradiation unit 7 irradiates ultraviolet rays toward the transfer position at the moment when the transfer object part 2 is transferred to the substrate 3. The so-called above-mentioned moment means the most suitable time for the light irradiation unit 7 to irradiate light such as ultraviolet rays.

[0079] refer to Figure 3 When the light irradiation unit 7 emits ultraviolet rays, the ultraviolet rays are reflected on the mirrors M5 and M6 and guided to the transfer position through the objective lens 51. Specifically, the light irradiation unit 7 irradiates the first and second surfaces of the transfer target part 2 on the belt 1 according to the optical path of the ultraviolet rays, peels the first surface of the part 2 from the belt 1, and makes the second surface of the part 2 adhere and fix to the transfer position of the substrate 3. That is, the light irradiation unit 7 hardens the adhesive of the adhesive layer 1b of the belt 1 by ultraviolet irradiation, thereby reducing the adhesive force and peeling the part 2 from the belt 1.

[0080] On the other hand, a UV-curing adhesive is pre-coated on the unmounted portion of the component 2 on the substrate 3, and the second surface of the component 2 is placed at the transfer position (unmounted portion) of the substrate 3 to contact the adhesive. Then, the adhesive is UV-cured by ultraviolet irradiation. Thus, the component 2 is bonded and fixed to the substrate 3. That is, the ultraviolet rays emitted from the light irradiation portion 7 pass through the pressing member 6 and act on the adhesive layer 1b adhered to the first surface of the component 2. Furthermore, the ultraviolet rays are configured as follows: although they are partially absorbed by the component 2, they pass through the component 2 and act on the UV-curing adhesive.

[0081] The transfer unit 8 has a pressing member 6, which aligns the positions of the part 2 and the substrate 3 under simultaneous observation and moves the pressing member 6 and the substrate 3 relative to each other, thereby using the pressing member 6 to press the part 2 to the transfer position and transfer and install the part 2 to the substrate 3. Furthermore, the so-called relative movement includes (1) fixing the pressing member 6 and moving the substrate 3, (2) moving the pressing member 6 and fixing the substrate 3, and (3) moving the pressing member 6 and the substrate 3. (1) is adopted in the first embodiment. Here, when (2) and (3) are adopted, a lifting mechanism (omitted in the figure) is added to the part installation device to raise and lower the pressing member 6 according to the instructions of the control unit 9. In addition, the so-called transfer, in a higher-level concept, refers to bonding the transfer object part 2 to the transfer position of the substrate 3 and peeling the part 2 from the belt 1.

[0082] Specifically, the transfer unit 8 first moves the substrate 3 vertically upward while being observed by the optical observation unit 5, thereby pressing the component 2 to the transfer position of the substrate 3 from the back of the tape 1 using the pressing member 6. In other words, pressing the component 2 to the transfer position means that the pressing member 6 presses the component 2 through the tape 1, thereby positioning the component 2 at the transfer position of the substrate 3. Next, the transfer unit 8 adheres the transfer target component 2 to the transfer position of the substrate 3 by ultraviolet irradiation, and peels the component 2 from the tape 1 by ultraviolet irradiation, thereby mounting the component 2 on the substrate 3.

[0083] Regarding the detailed composition, such as Figure 3 As shown, the transfer unit 8 includes a pressing member 6, an XYZ stage 81, an adsorption stage 82, a coating device 83, and a stage control unit 84. The XYZ stage 81 has a mechanism for moving the substrate 3 in three axial directions. The adsorption stage 82 is provided on the XYZ stage 81 and adsorbs and supports the substrate 3.

[0084] The coating device 83 pre-coats the UV curing adhesive on the unmounted portion of the component 2 on the substrate 3. The coating device 83 is, for example, a high-precision dispenser that can apply the UV curing adhesive solvent to an area where each dimension of the outer shape is about several tens to several hundreds of μm. The stage control unit 84 moves the XYZ stage 81 according to the instruction from the control unit 9, thereby the coating device 83 can apply the adhesive to the unmounted portion of the component 2 with a pinpoint.

[0085] The control unit 9 performs overall control over the transport unit 4 , the optical observation unit 5 , the light irradiation unit 7 , and the transfer unit 8 .

[0086] Figure 8 To express Figure 19 is a block diagram of an example of the hardware configuration of the control unit 9 shown in FIG. The control unit 9 is a computer for control, and includes a processor 9a, a storage unit 9b, a memory 9c, an input device 9d, a communication interface 9e, a display device 9f, and a bus 9g. The processor 9a, the storage unit 9b, the memory 9c, the input device 9d, the communication interface 9e, and the display device 9f are connected to each other via the bus 9g. Furthermore, in order to send a control signal indicating, for example, the content of an operation, the control unit 9 is connected to the conveying unit 4, the optical observation unit 5, the light irradiation unit 7, and the transfer unit 8 through a communication line.

[0087] The processor 9a controls the control unit 9. The storage unit 9b is a storage device such as a HDD (Hard Disk Drive) or a flash memory, and stores programs and various data.

[0088] The memory 9c is a storage device such as a RAM (Random Access Memory), for example, for loading a program for execution by the processor 9a. The input device 9d is, for example, an input device in the form of a keyboard or a touch panel. The communication interface 9e is, for example, a communication interface for data communication. The display device 9f is, for example, a liquid crystal monitor, which displays a menu screen for operation or output results according to the instructions of the processor 9a.

[0089] The control unit 9 realizes various functions by cooperation of hardware such as the processor 9a, the storage unit 9b, and the memory 9c and programs. The programs include a control program (parts installation program) for realizing the part installation method of the present invention.

[0090] Specifically, refer to Figure 3To illustrate, the control program includes the following steps: a conveying step, that is, by feeding out the above-mentioned belt 1, the parts 2 adhered to one side of the belt 1 at a predetermined arrangement interval are placed in sequence just above the transfer position to be transferred to the substrate 3, and the fed portion of the belt 1 is wound into a roll; illuminating light from a light source 57 is irradiated onto the transfer object part 2 and the substrate 3, and the reflected light from the part 2 and the substrate 3 is branched into two systems to simultaneously observe the transfer object part 2 and the substrate 3; aligning the part 2 and the substrate 3 under simultaneous observation The transfer part 2 is pressed to the transfer position by the pressing member 6, and the substrate 3 is relatively moved to the position by the pressing member 6. When the transfer part 2 is transferred to the substrate 3, the transfer position to which the photoreactive (for example, ultraviolet curing) adhesive is applied is irradiated with light (for example, ultraviolet) of a wavelength predetermined for photoreaction. The transfer part 2 is attached to the transfer position and then peeled off from the belt 1. The control unit 9 controls the conveying unit 4, the optical observation unit 5, the light irradiation unit 7, and the transfer unit 8 in a unified manner according to the control program.

[0091] Next, a component mounting method for transfer-mounting the component 2 on the substrate 3 using the component mounting apparatus configured as described above will be described.

[0092] Fig. 9 It is a flowchart showing the first embodiment of the component mounting method of the present invention. Fig. 10A , 10B 10C are respectively a first process diagram, a second process diagram, and a third process diagram for explaining the component mounting method of the first embodiment. Fig.11A , 11B 11C are the fourth process diagram, the fifth process diagram, and the sixth process diagram respectively for explaining the component mounting method of the first embodiment. First, turn on the power supply (not shown) of the component mounting device. Figure 8 The control unit 9 shown in the figure receives an instruction input indicating the start of the action of the component mounting method via the input device 9d. Then, the control unit 9 starts to execute the control program for the component mounting method. Fig. 9 The process of the flowchart shown.

[0093] In step S1, a process of applying an adhesive to a transfer position where the component 2 is transferred on the substrate 3 is performed. Specifically, Figure 3 The XYZ stage 81 shown in the figure first moves the adsorption stage 82 adsorbing the substrate 3 according to the control of the stage control unit 84, and places the unmounted part of the component 2 directly under the discharge head (omitted in the figure) of the coating device 83. In addition, the so-called transfer position refers to the unmounted part of the component 2. Specifically, the transfer position is Fig. 10AThe recessed portion 31 shown in the figure shows a recessed shape of a portion where the component 2 is not mounted. The coating device 83 applies, for example, an ultraviolet curing adhesive to the bottom surface of the recessed portion 31 .

[0094] In the first embodiment, the coordinate data of the unmounted portion of the component 2 on the substrate 3 is stored in advance in the storage unit 9b of the control unit 9, and the XYZ platform 81 can be controlled by the platform control unit 84 to place the unmounted portion of the component 2 directly below the discharge head of the coating device 83 according to the coordinate data.

[0095] Then, the coating device 83 discharges the solvent of the adhesive from the discharge head and applies it to the transfer position (recess 31) of the substrate 3. When there are multiple unmounted locations of the component 2, the coating device 83 can apply the adhesive to the transfer position of the substrate 3 by repeatedly performing the process S1.

[0096] In step S2, the transfer position of the substrate 3 is brought to the objective lens 51 (reference Figure 3 Specifically, the stage control unit 84 controls the XYZ stage 81 to move the adsorption stage 82 having the substrate 3 adsorbed thereon, thereby moving the substrate 3 so that the transfer position of the part 2 to be transferred comes below the objective lens 51. Figure 3 The example shown in FIG. 1 is a state where the adsorption stage 82 having the substrate 3 adsorbed thereon has moved. Fig. 10A Specifically, the transfer position of the substrate 3 is moved to Figure 3 Schematic diagram of the state below the objective lens 51 shown. Furthermore, Figures 10A to 10C , Figures 11A to 11C , Fig.12 , Fig.14 The substrate 3 shown is a front view showing a portion of the substrate 3 in an enlarged manner.

[0097] In step S3, drive Figure 3 The second imaging lens 53 shown in the figure focuses on the substrate surface. Figure 3 The second camera unit 55 shown captures the image of the substrate surface of the substrate 3 obtained by imaging through the second imaging lens 53 and converts it into data of the second image, and sends the data to the control unit 9 for analysis. Then, the control unit 9 drives the second imaging lens 53 through the above-mentioned contrast autofocus to focus on the substrate surface. Then, the control unit 9 analyzes the second image to detect the transfer position of the substrate 3.

[0098] In step S4, the components 2 on the belt 1 are moved below the objective lens 51. Specifically, in step S4, the components 2 arranged on the belt 1 surface at the arrangement pitch P are placed just above the transfer position 31 to be transferred to the substrate 3. Fig. 10BSpecifically, the part 2 on the belt 1 has been moved to Figure 3 Schematic diagram of the state below the objective lens 51 shown. This state means that the part 2 has been placed just above the transfer position. Then, the part 2 becomes the transfer target part 2.

[0099] In step S5, a process of detecting the position of the component 2 using the first imaging unit 54 is performed. Specifically, Figure 3 The first imaging unit 54 shown captures the image of the part 2 formed by the first imaging lens 52, converts it into data of the first image, and sends the data to the control unit 9 for analysis. The control unit 9 analyzes the first image to detect the current position of the transfer target part 2.

[0100] In step S6, the transfer target component 2 and the substrate 3 are observed simultaneously. Fig.12 The first schematic diagram is used to illustrate the simultaneous observation of observation surfaces with different focal positions. Figure 3 In step S6, the objective lens 51 is shared, and the mirror M1 is used as a beam splitter on the upper part of the objective lens 51 to branch into two systems, and the first camera unit 54 is used to observe the part 2 (the interface between the surface of the belt 1 and the first surface of the part 2) as the first image, and the second camera unit 55 is used to observe the substrate surface of the substrate 3 as the second image.

[0101] In this case, observing the component 2 means that the first imaging unit 54 captures the image of the component 2 formed by the first imaging lens 52 through the mirrors M1 and M2, converts the image into data of the first image, and sends the data to the control unit 9 for analysis. In addition, observing the substrate 3 means that the second imaging unit 55 captures the image of the substrate surface of the substrate 3 formed by the second imaging lens 53 through the mirror M1, converts the image into data of the second image, and sends the data to the control unit 9 for analysis. Therefore, the actual image analysis is performed in the control unit 9.

[0102] Fig.13A This is the first photograph for explaining the simultaneous observation of observation surfaces with different focal positions. Fig.13A As the first photograph, an image of a surface 100 μm away from the pressing member 6 is shown. In order to make the description easier to understand, the first photograph is taken by replacing the substrate 3 with the test plate shown in FIG. 6 . The first photograph is taken before the second imaging lens 53 is moved and when the second imaging lens 53 is in the standard position. Therefore, Fig.13A The image becomes out of focus.

[0103] Fig. 13BThis is the second photograph for explaining the simultaneous observation of observation surfaces with different focal positions. Fig. 13B As the second photograph, an image that is focused by moving the second imaging lens 53 through the above-mentioned contrast auto focus is shown. Fig.12 An example is Fig. 13B Furthermore, the standard position can be, for example, Fig.14 The position of the second imaging lens 53 is shown.

[0104] Like already in Figure 4 As described above with respect to the upper surface 61 of the pressing member 6, the shape of the upper surface 61 is designed so that when the reflected light passes through the upper surface 61 in the form of a spherical wave SW, the curvature radius of the spherical wave SW is consistent with that of the spherical wave SW. Figure 5B Compared with the planar upper surface 61a shown, a higher resolution image is obtained.

[0105] also, Fig.12 In the embodiment, the part 2 is also photographed by the first camera unit 54 in a manner of focusing through the first imaging lens 52, so the control unit 9 can analyze the position of the part 2 and the transfer position of the substrate 3 based on the image of the part (first image) and the image of the substrate surface of the substrate 3 (second image) to determine the misalignment. As described in the next step S7, the control unit 9 can issue an instruction to the XYZ stage 81 to move the substrate 3 in a manner of correcting the misalignment under simultaneous observation.

[0106] In step S7, the position of the part 2 and the transfer position are aligned. Here, although the substrate 3 has been moved in step S4 so that the transfer position of the part 2 to be transferred comes under the objective lens 51, when the conveying unit 4 stops the belt 1, the transfer object part 2 may be misaligned in the front-to-back direction. The control unit 9 can, for example, analyze the overlapping area of ​​the area of ​​the second surface of the part 2 observed across the space and the area of ​​the transfer position under simultaneous observation to determine whether there is misalignment. In step S7, when misalignment occurs under simultaneous observation of the part 2 and the substrate 3, the control unit 9 issues an instruction to the XYZ platform 81 to move the substrate 3 and align the position. That is, the control unit 9 fine-tunes the relative position of the part 2 and the substrate 3. Therefore, when no misalignment occurs, the alignment of the position of the part 2 and the transfer position maintains the current state and directly transfers to the next step S8.

[0107] In step S8, the substrate 3 is raised in the Z-axis direction (vertically upward) to press the part 2 to the transfer position. Specifically, in step S8, the substrate 3 is moved in the optical axis direction, and the transfer target part 2 is pressed to the transfer position of the substrate 3 by the pressing member 6 from the back of the belt 1. Fig. 10CSpecifically, this is a schematic diagram illustrating a process of pressing the transfer target component 2 to the transfer position of the substrate 3. In step S8, the component 2 is pressed to the transfer position, so that the component 2 is positioned at the transfer position.

[0108] Fig.14 This is a second schematic diagram for explaining simultaneous observation of observation planes with different focal positions. Fig.12 In step S8 , the second imaging lens 53 is moved in the optical axis direction so that the focal position reaches the substrate surface of the substrate 3 by the contrast autofocusing described above and in conjunction with the rise of the substrate 3 in the Z-axis direction according to the analysis result of the control unit 9 . Fig.14 The state shown is a time point at which the transfer target component 2 is transferred to the substrate 3 .

[0109] In step S9 , a process of bonding and fixing the transfer target component 2 to the substrate 3 by irradiating ultraviolet rays is performed. Fig.11A The following illustrates a state where UV (ultraviolet light) is irradiated when the transfer target component 2 is transferred to the substrate 3 .

[0110] In step S10, the light irradiation unit 7 is turned off to stop the ultraviolet irradiation. Specifically, the control unit 9 measures the ultraviolet irradiation time and determines whether the ultraviolet irradiation time has reached a predetermined time. Figure 2C The adhesive layer 1b of the tape 1 shown has reduced adhesiveness and Fig.11A The adhesive in contact with the second surface of the component 2 shown has hardened and fixed to the transfer position of the substrate 3, thereby stopping the ultraviolet irradiation.

[0111] In step S11, a process of mounting the component 2 on the substrate 3 is executed. Specifically, the control unit 9 instructs the stage control unit 84 to lower the substrate 3 after the transfer target component 2 is adhered to the transfer position to peel the transfer target component 2 from the tape 1, thereby mounting the component 2 on the substrate 3. Fig. 11B The state where the transfer target component 2 is transferred and mounted on the substrate 3 is illustrated.

[0112] In addition, although Fig. 9 Although not shown in the flowchart, when the processing of step S11 is completed, the control unit 9 checks whether a predetermined number of parts 2 have been transferred and mounted on the substrate 3. If the predetermined number has not been reached, the next part 2 is to be transferred and mounted on the substrate 3, so the process returns to step S2, and the processing of steps S2 to S11 is repeated in the part mounting method of the present invention. Fig. 11C The following processing is illustrated: For the next part 2 to be transferred, the transfer position comes to Figure 3 The substrate 3 is moved in the manner shown below the objective lens 51 , and the part 2 is moved below the objective lens 51 .

[0113] On the other hand, when the predetermined number has been reached, the control unit 9 ends the Fig. 9 The process of the flowchart shown.

[0114] Based on the above, according to the first embodiment, as Figure 3 As shown, the objective lens 51 is shared, and the reflected light of the part 2 and the reflected light of the substrate 3 are branched into two systems by using a mirror M1 arranged above the objective lens 51 to simultaneously observe the part 2 and the substrate 3. Thus, the position of the part 2 and the position of the substrate 3 can be confirmed, and alignment becomes easy, so that the part 2 can be transferred and installed on the substrate 3 with high precision.

[0115] In addition, in the component mounting device of the first embodiment, the light irradiation unit 7 is configured to irradiate ultraviolet rays, but the present invention is not limited to this. The light irradiation unit 7 may be any one of (1) an ultraviolet irradiation device, (2) an infrared irradiation device, and (3) an irradiation device that selectively irradiates ultraviolet rays and infrared rays, depending on the component 2 to be mounted on the substrate 3. For example, in the case where the component 2 is configured as a micro LED chip, the substrate 3 may be configured to be solder-fixed, and the adhesive on the side of the tape 1 may be configured to be a photoreactive adhesive that exhibits thermal peeling properties under infrared irradiation. In this case, the light irradiation unit 7 may use an infrared irradiation device that irradiates light of an infrared wavelength that exhibits the thermal peeling property as a light source. Here, the infrared irradiation device irradiates, for example, an infrared laser having an oscillation wavelength of 915 nm as light of an infrared wavelength.

[0116] In addition, when the component 2 is set as a micro LED chip, the adhesive on the side of the tape 1 can also be set as an ultraviolet curing adhesive. In addition, the light irradiation unit 7 can be set as an irradiation device that selectively irradiates ultraviolet rays (for example, 365nm) and infrared rays (for example, 915nm). That is, the light irradiation unit 7 can also be equipped with the above-mentioned ultraviolet irradiation device and the above-mentioned infrared irradiation device and selectively irradiate ultraviolet rays and infrared rays under the control of the control unit 9. Among them, in the case of selectively irradiating ultraviolet rays and infrared rays, in the component installation device Figure 3 The mirror M6 shown may be replaced with a semi-transparent and semi-reflective mirror (such as PMH-30C03-10-25 / 7 manufactured by Sigma Koki Co., Ltd.) that can be used in a wide wavelength range of the ultraviolet region, visible region, and infrared region, and the configuration of the mirror may be changed as appropriate.

[0117] In the parts installation method in this case, Fig. 9In the flowchart shown, in step S1, an alloy for soldering is set at the transfer position of the substrate 3. Then, steps S2 to S7 are performed, and in step S8, the substrate 3 is raised in the Z-axis direction to set the component 2 (micro LED chip) at the transfer position. Then, before transferring to step S9, the alloy of the substrate 3 is melted and cooled by infrared irradiation from the light irradiation unit 7, and the second surface of the component 2 and the substrate 3 are fixedly bonded by the alloy.

[0118] Next, in step S9, the light irradiation unit 7 irradiates ultraviolet rays toward the adhesive bonded between the first surface of the component 2 and the tape 1. Next, after step S10, in step S11, the substrate 3 is lowered to thereby peel the component 2 from the tape 1 and mount the component 2 on the substrate 3.

[0119] As described above, according to the present invention, even when the component 2 is a micro LED chip, the component 2 can be transferred and mounted on the substrate 3 with high precision.

[0120] [Second embodiment]

[0121] Next, a second embodiment of the present invention will be described. Note that the same reference numerals are used for the same components as those of the component mounting device of the first embodiment, and the description thereof will be omitted or simplified, and the description will be mainly focused on the differences.

[0122] Fig.15 2 is a diagram showing the main structure of the second embodiment of the component mounting device of the present invention. Figure 1 Compared with the parts installation shown, Fig.15 The component mounting device shown is characterized in that the light irradiation unit 7 is not provided.

[0123] Right now, Fig.15 The component mounting device shown in the figure includes a conveying unit 4, an optical observation unit 5, a transfer unit 8, and a control unit 9 as main components. Figure 1 Same, Fig.15 The pressing member 6 shown is spatially separated from the transfer portion 8 but is included in the transfer portion 8. Figure 3 The light irradiation unit 7 and the mirror M5 are removed.

[0124] In the second embodiment, the tape 1 a is a resin film having an adhesive applied on the surface thereof, and has light transmissivity that allows visible light to pass therethrough.

[0125] Fig.16 FIG. 2 is a flowchart showing a second embodiment of the component mounting method of the present invention. Fig. 9The flowchart shown and the control program described above have been partially changed. In step S20, a dried and solidified adhesive is pre-applied to the transfer position of the substrate 3. In order to make the description easy to understand, even if there are multiple unmounted locations of the component 2, the adhesive is applied only to the transfer position to be transferred each time.

[0126] Then, in steps S21 to S27, Fig. 9 The same processing as steps S2 to S8 shown in the flowchart shown in the figure is performed. Then, in step S28, unlike the first embodiment, the part 2 is bonded and fixed to the substrate 3 without irradiating ultraviolet rays. Then, in step S29, the part 2 is mounted on the substrate 3. Among them, the part 2 is mounted on the substrate 3 by transfer in which the part 2 is bonded to the substrate 3 and the part 2 is peeled off from the tape 1a, provided that the adhesive force of the first side of the part 2 adhering to the tape 1a is smaller than the adhesive force of the second side of the part 2 fixed to the transfer position of the substrate 3.

[0127] And, although Fig.16 Although not shown in the flowchart, when the number of transferred parts 2 does not reach the predetermined number, the next part 2 needs to be transferred and installed on the substrate 3, so the process returns to step S20 and the processing of steps S20 to S29 is repeated again in the part installation method of the second embodiment.

[0128] Therefore, also in the second embodiment, similarly to the first embodiment, the component 2 can be transferred and mounted on the substrate 3 with high accuracy.

[0129] Although preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and the present invention can be modified in various forms without departing from the scope of the technical concept disclosed in the claims.

[0130] In addition, it should be noted that the order of executing each process such as actions in the apparatus and method shown in the claims, the specification, and the drawings may sometimes be executed in any order. Fig. 9 In the process of the flowchart shown in FIG. 1 , steps S2 and S3 may be performed after steps S4 and S5. Fig.16 In the processing of the flowchart shown, steps S21 and S22 may be executed after steps S23 and S24.

Claims

1. A component mounting device, which transfers and mounts a component onto a substrate, characterized in that: have: A conveying unit that feeds out a thin and long light-transmitting tape that can be wound into a roll shape, sequentially places the parts bonded to one side of the tape at a predetermined arrangement pitch just above the transfer position to be transferred to the substrate, and winds up the fed portion of the tape into a roll shape; An optical observation unit that irradiates the transfer target part and the substrate with illumination light from a light source and branches reflected light from the part and the substrate into two systems to simultaneously observe the transfer target part and the substrate; A transfer unit having a light-transmitting pressing member for pressing the transfer target part from the other side of the belt, and pressing the part to the transfer position by relatively moving the pressing member and the substrate, thereby transferring and mounting the part on the substrate; as well as a control unit that performs overall control of the transport unit, the optical observation unit, and the transfer unit, The shape of the upper surface of the pressing member is defined so as to be consistent with the curvature radius of the spherical wave when the reflected light passes through the upper surface of the pressing member in the form of a spherical wave.

2. The component mounting device according to claim 1, characterized in that: The optical observation section selectively adopts observation under auto-focus processing focused on a specific object, and performs the auto-focus processing on the substrate surface of the substrate based on the reflected light from the substrate guided from at least one of the two systems.

3. The component mounting device according to claim 1, characterized in that: The invention further comprises a light irradiation unit for irradiating the transfer position on which the photoreactive adhesive is applied in advance with light of a wavelength predetermined for photoreaction, The transfer unit mounts the component on the substrate by transfer, and the transfer is performed by adhering the transfer target component to the substrate by irradiation with light of the wavelength and peeling the component from the tape.

4. A method for mounting a component by transfer printing onto a substrate, characterized in that: Perform the following steps: A conveying process, i.e., feeding out a thin and long light-transmitting tape that can be wound into a roll shape, placing the parts bonded to one side of the tape at a predetermined arrangement pitch in order just above the transfer position to be transferred to the substrate, and winding the fed portion of the tape into a roll shape; Irradiating the transfer target part and the substrate with illumination light from a light source, and branching the reflected light from the part and the substrate into two systems to simultaneously observe the transfer target part and the substrate; The part is pressed to the transfer position by moving a light-transmitting pressing member that presses the transfer target part from the other side of the belt relative to the substrate, wherein the shape of the upper surface of the pressing member is specified to be consistent with the curvature radius of the spherical wave when the reflected light passes through the upper surface of the pressing member in the form of a spherical wave; and The parts are transferred and mounted on the substrate.

5. The component installation method according to claim 4, characterized in that: The step of irradiating the transfer position to which the photoreactive adhesive is applied in advance with light having a wavelength predetermined for photoreaction is further performed after the step of pressing the component to the transfer position.

Images