A heat dissipation mechanism based on LONpoint node core board and its use method

Abstract

The present invention discloses a heat dissipation mechanism based on a LONpoint node core board and a method of using the same, comprising a core board body, the top and bottom of the front of the core board body are fixedly connected with heat dissipation fins, the front of the heat dissipation fins are fixedly connected with connecting rods, both sides of the connecting rods are fixedly connected with vertical rods, the inner side of the vertical rods is penetrated with a mobile rod, the inner side of the mobile rods is fixedly connected with a heat dissipation bonding plate, the back of the heat dissipation bonding plate is fixedly connected with a copper plate, and the back of the copper plate is fixedly connected with a heat dissipation mesh plate. The present invention achieves the effect of rapid heat dissipation, the heat dissipation mechanism based on the LONpoint node core board and the method of using the same solves the problem that the existing core board will generate a certain amount of heat after long-term use, and the current heat dissipation methods of the core board all rely on its natural heat dissipation, and the efficiency of natural heat dissipation not only cannot keep up with the efficiency of use, but also wastes time, resulting in the problem that the overall device cannot be used due to overheating.

Description

Technical Field

[0001] The present invention relates to the technical field of core boards, and in particular to a heat dissipation mechanism of a core board based on a LONpoint node and a use method thereof. Background Art

[0002] The core board is a kind of electrical component, but the existing core board will generate a certain amount of heat after long-term use. The current heat dissipation method of the core board relies on its natural heat dissipation. The efficiency of natural heat dissipation not only cannot keep up with the efficiency of use, but also wastes time, causing the entire device to be unusable due to overheating. Summary of the invention

[0003] In order to solve the problems raised in the above background technology, the purpose of the present invention is to provide a heat dissipation mechanism based on the LONpoint node core board and its use method, which has the advantage of rapid heat dissipation and solves the problem that the existing core board will generate a certain amount of heat after long-term use. The current heat dissipation methods of the core board all rely on natural heat dissipation, and the efficiency of natural heat dissipation not only cannot keep up with the efficiency of use, but also wastes time, resulting in the problem that the entire device cannot be used due to overheating.

[0004] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a heat dissipation mechanism based on a LONpoint node core board and a method of using the same, comprising a core board body, the top and bottom of the front side of the core board body are fixedly connected with heat dissipation fins, the front side of the heat dissipation fins are fixedly connected with a connecting rod, both sides of the connecting rod are fixedly connected with vertical rods, a movable rod is penetrated through the inner side of the vertical rod, a heat dissipation bonding plate is fixedly connected to the inner side of the movable rod, a copper plate is fixedly connected to the back side of the heat dissipation bonding plate, a heat dissipation mesh plate is fixedly connected to the back side of the heat dissipation mesh plate, a heat sink is fixedly connected to the back side of the heat sink, a thermal conductive plate is fixedly connected to the back side of the heat sink, and the back side of the thermal conductive plate contacts the core board body.

[0005] As a preferred embodiment of the present invention, a sweeping plate is fixedly connected to the inner side of the movable rod and the outer side of the heat dissipation bonding plate, a fixed plate is fixedly connected to the outer side of the sweeping plate, the outer side of the fixed plate is fixedly connected to the movable rod, a fiber brush is fixedly connected to the back side of the sweeping plate, and the back side of the fiber brush is in contact with the core board body.

[0006] As a preferred embodiment of the present invention, the top and the bottom of the inner side of the heat dissipation bonding plate are fixedly connected with a disc, and the disc is used in conjunction with the heat dissipation bonding plate.

[0007] As a preferred embodiment of the present invention, a cooling plate is arranged inside the disc, and a ceramic plate is arranged on the back of the cooling plate.

[0008] As a preferred embodiment of the present invention, the top and the bottom of the outer side of the moving rod are fixedly connected with a pull ring, and the surface of the pull ring is sleeved with a pull sleeve.

[0009] As a preferred embodiment of the present invention, a moving groove is formed on the inner side of the vertical rod, and the outer side of the moving rod is slidably connected to the inside of the moving groove.

[0010] As a preferred embodiment of the present invention, the number of the heat conducting plates is four and they are evenly distributed.

[0011] As a preferred heat dissipation method of the present invention, the following steps are included:

[0012] S1: First, when the heat is too high, the heat is transferred to the surface of the heat sink through the thermal conductive sheet, and then the heat sink dissipates the heat once, and then the remaining heat is transferred to the surface of the heat dissipation mesh, and the grid in the heat dissipation mesh dissipates the heat twice, and then the residual heat continues to be transferred to the surface of the copper plate, and the copper plate evaporates the heat three times through its own internal thermal conductivity.

[0013] S2: Then the refrigeration plate inside the disc performs cooling treatment. After one treatment, a part of the cold air is isolated by the ceramic plate, and the remaining part is transferred to the surface of the core board body. Since the heat of the core board body has just been volatilized, the remaining part of the cold air is used to cool and restore the core board body.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The present invention achieves the effect of rapid heat dissipation through the coordinated use of a core board body, heat dissipation fins, connecting rods, vertical rods, mobile rods, heat dissipation bonding plates, copper plates, heat dissipation mesh plates, heat sinks and thermal conductive plates. The heat dissipation mechanism of the core board based on the LONpoint node and the use method thereof solve the problem that the existing core board will generate a certain amount of heat after long-term use, and the current heat dissipation methods of the core board all rely on natural heat dissipation, and the efficiency of natural heat dissipation not only cannot keep up with the efficiency of use, but also wastes time, resulting in the problem that the overall device cannot be used due to overheating.

[0016] 2. The present invention can more fully clean the dust on the surface of the core board body through the arrangement of the sweeping plate, the fixing plate and the fiber brush, thereby increasing the overall cleanliness.

[0017] 3. The present invention can dissipate heat for the core board body together with the heat dissipation bonding plate by setting the disc, thereby increasing the overall heat dissipation speed.

[0018] 4. The present invention can make the temperature of the core board body more stable by setting the cooling plate and the ceramic plate, thereby avoiding the phenomenon of the core board body being broken due to overheating.

[0019] 5. The present invention can facilitate users to pull the moving rod through the provision of the pull ring and the pull sleeve, thereby increasing the convenience of the users.

[0020] 6. The present invention enables the moving rod to slide more smoothly inside the vertical rod by setting the moving groove, thereby reducing the friction between the vertical rod and the moving rod.

[0021] 7. The present invention has four heat conducting sheets, which can transfer the heat of the core board body more fully and reduce the heat of the core board body. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of the present invention;

[0023] Figure 2 The structure of the present invention Figure 1 The enlarged structural diagram at A in the middle;

[0024] Figure 3 is a cross-sectional view of the structural disc of the present invention;

[0025] Figure 4 It is a rear view of the heat dissipation bonding plate of the structure of the present invention;

[0026] Figure 5 A bottom view of the sweeping plate and the fiber brush of the present invention;

[0027] Figure 6 It is a three-dimensional diagram of the local structure of the present invention.

[0028] In the figure: 1. core board body; 2. heat sink fins; 3. connecting rod; 4. vertical rod; 5. moving rod; 6. heat dissipation bonding plate; 7. copper plate; 8. heat dissipation mesh plate; 9. heat sink; 10. heat conductive plate; 11. sweeping plate; 12. fixing plate; 13. fiber brush; 14. disc; 15. cooling plate; 16. ceramic plate; 17. pull ring; 18. pull sleeve; 19. moving groove. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] like Figures 1 to 6As shown, the present invention provides a heat dissipation mechanism based on a LONpoint node core board and a method of using the same, comprising a core board body 1, the top and bottom of the front side of the core board body 1 are fixedly connected with heat dissipation fins 2, the front side of the heat dissipation fins 2 are fixedly connected with a connecting rod 3, both sides of the connecting rod 3 are fixedly connected with vertical rods 4, the inner side of the vertical rod 4 is penetrated by a moving rod 5, the inner side of the moving rod 5 is fixedly connected with a heat dissipation bonding plate 6, the back side of the heat dissipation bonding plate 6 is fixedly connected with a copper plate 7, the back side of the copper plate 7 is fixedly connected with a heat dissipation mesh plate 8, the back side of the heat dissipation mesh plate 8 is fixedly connected with a heat sink 9, the back side of the heat sink 9 is fixedly connected with a thermal conductive plate 10, and the back side of the thermal conductive plate 10 is in contact with the core board body 1.

[0031] refer to Figure 5 A sweeping plate 11 is fixedly connected to the inner side of the moving rod 5 and the outer side of the heat dissipation bonding plate 6, a fixing plate 12 is fixedly connected to the outer side of the sweeping plate 11, the outer side of the fixing plate 12 is fixedly connected to the moving rod 5, a fiber brush 13 is fixedly connected to the back side of the sweeping plate 11, and the back side of the fiber brush 13 is in contact with the core board body 1.

[0032] As a technical optimization solution of the present invention, by providing the sweeping plate 11, the fixing plate 12 and the fiber brush 13, the dust on the surface of the core board body 1 can be cleaned more thoroughly, thereby improving the overall cleanliness.

[0033] refer to Figure 1 and Figure 3 The top and bottom of the inner side of the heat dissipation bonding plate 6 are fixedly connected with a disk 14, and the disk 14 is used in conjunction with the heat dissipation bonding plate 6.

[0034] As a technical optimization solution of the present invention, by setting the disc 14, the core board body 1 can be cooled together with the heat dissipation bonding plate 6, thereby increasing the overall heat dissipation speed.

[0035] refer to Figure 3 A cooling sheet 15 is disposed inside the disk 14 , and a ceramic sheet 16 is disposed on the back of the cooling sheet 15 .

[0036] As a technical optimization solution of the present invention, by providing the cooling plate 15 and the ceramic plate 16, the temperature of the core board body 1 can be made more stable, thus avoiding the core board body 1 from being broken due to overheating.

[0037] refer to Figure 1 The top and bottom of the outer side of the moving rod 5 are fixedly connected with a pull ring 17, and the surface of the pull ring 17 is sleeved with a pull sleeve 18.

[0038] As a technical optimization solution of the present invention, the provision of the pull ring 17 and the pull sleeve 18 can facilitate the user to pull the moving rod 5, thereby increasing the convenience of the user.

[0039] refer to Figure 2 A moving groove 19 is formed on the inner side of the vertical rod 4 , and the outer side of the moving rod 5 is slidably connected to the inside of the moving groove 19 .

[0040] As a technical optimization solution of the present invention, by providing the moving groove 19 , the moving rod 5 can slide more smoothly inside the vertical rod 4 , thereby reducing the friction between the vertical rod 4 and the moving rod 5 .

[0041] refer to Figure 4 The number of the heat conducting sheets 10 is four and they are evenly distributed.

[0042] As a technical optimization solution of the present invention, by providing four heat conducting sheets 10 , the heat of the core board body 1 can be more fully transferred, thereby reducing the heat of the core board body 1 .

[0043] S1: First, when the heat is too high, the heat is transferred to the surface of the heat sink 9 through the heat conducting sheet 10, and then the heat sink 9 dissipates the heat once, and then the remaining heat is transferred to the surface of the heat dissipation mesh 8, and the grid in the heat dissipation mesh 8 dissipates the heat for a second time, and then the residual heat continues to be transferred to the surface of the copper plate 7, and the copper plate 7 volatilizes the heat three times through its own internal thermal conductivity.

[0044] S2: Then the refrigeration plate 15 inside the disc 14 performs refrigeration treatment. After one treatment, a part of the cold air is isolated by the ceramic plate 16, and the remaining part is transferred to the surface of the core board body 1. Since the heat of the core board body 1 has just been volatilized, the remaining part of the cold air is used to cool and restore the core board body 1.

[0045] The working principle and use process of the present invention are as follows: when in use, first, when the heat of the core board body 1 is too high, the heat is transferred to the surface of the heat sink 9 through the heat conducting sheet 10, and then the heat sink 9 dissipates the heat once, and then the remaining heat is transferred to the surface of the heat dissipation mesh plate 8, and the grid in the heat dissipation mesh plate 8 dissipates the heat for a second time, and then the residual heat continues to be transferred to the surface of the copper plate 7, and the copper plate 7 volatilizes the heat three times through its own thermal conductivity, and then the refrigeration sheet 15 inside the disc 14 performs refrigeration treatment, and after one treatment, a part of the cold air is isolated through the ceramic sheet 16, and the remaining part is transferred to the surface of the core board body 1. Since the heat of the core board body 1 has just been volatilized, the remaining part of the cold air is just used to cool and restore the core board body 1.

[0046] To sum up: the heat dissipation mechanism based on the LONpoint node core board and the use method thereof, through the coordinated use of the core board body 1, the heat dissipation fins 2, the connecting rods 3, the vertical rods 4, the moving rods 5, the heat dissipation bonding plate 6, the copper plate 7, the heat dissipation mesh plate 8, the heat sink 9 and the thermal conductive plate 10, achieves the effect of rapid heat dissipation. The heat dissipation mechanism based on the LONpoint node core board and the use method thereof solves the problem that the existing core board will generate a certain amount of heat after long-term use, and the current heat dissipation methods of the core board all rely on natural heat dissipation, and the efficiency of natural heat dissipation not only cannot keep up with the efficiency of use, but also wastes time, resulting in the problem that the overall device cannot be used due to overheating.

[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation mechanism for a core board based on a LONpoint node and a method for using the same, comprising a core board body (1), characterized in that: The top and bottom of the front side of the core board body (1) are fixedly connected with heat sink fins (2); the front side of the heat sink fins (2) is fixedly connected with a connecting rod (3); both sides of the connecting rod (3) are fixedly connected with vertical rods (4); a moving rod (5) is provided on the inner side of the vertical rod (4); a heat sink bonding plate (6) is fixedly connected to the inner side of the moving rod (5); a copper plate (7) is fixedly connected to the back side of the heat sink bonding plate (6); a heat sink mesh plate (8) is fixedly connected to the back side of the copper plate (7); a heat sink (9) is fixedly connected to the back side of the heat sink (9); a heat conductive plate (10) is fixedly connected to the back side of the heat conductive plate (10); and the back side of the heat conductive plate (10) is in contact with the core board body (1).

2. According to claim 1, a heat dissipation mechanism based on a LONpoint node core board and a method of using the same are characterized in that: A sweeping plate (11) is fixedly connected to the inner side of the moving rod (5) and located on the outer side of the heat dissipation bonding plate (6); a fixing plate (12) is fixedly connected to the outer side of the sweeping plate (11); the outer side of the fixing plate (12) is fixedly connected to the moving rod (5); a fiber brush (13) is fixedly connected to the back side of the sweeping plate (11); and the back side of the fiber brush (13) is in contact with the core board body (1).

3. According to claim 1, a heat dissipation mechanism based on a LONpoint node core board and a method of using the same are characterized in that: The top and bottom of the inner side of the heat dissipation bonding plate (6) are both fixedly connected with a disc (14), and the disc (14) is used in conjunction with the heat dissipation bonding plate (6).

4. The heat dissipation mechanism based on the LONpoint node core board and the method of using the same according to claim 3, characterized in that: A cooling plate (15) is arranged inside the circular disk (14), and a ceramic plate (16) is arranged on the back of the cooling plate (15).

5. The heat dissipation mechanism based on the LONpoint node core board and the method of using the same according to claim 1, characterized in that: The top and bottom of the outer side of the moving rod (5) are both fixedly connected with a pull ring (17), and the surface of the pull ring (17) is sleeved with a pull sleeve (18).

6. The heat dissipation mechanism based on the LONpoint node core board and the method of using the same according to claim 1, characterized in that: A moving groove (19) is provided on the inner side of the vertical rod (4), and the outer side of the moving rod (5) is slidably connected to the inside of the moving groove (19).

7. The heat dissipation mechanism based on the LONpoint node core board and the method of using the same according to claim 1, characterized in that: The number of the heat conducting sheets (10) is four and they are evenly distributed.

8. A heat dissipation method based on a LONpoint node core board according to any one of the above claims, characterized in that: The following steps are involved: S1: First, when the heat is too high, the heat is transferred to the surface of the heat sink (9) through the heat conducting sheet (10), and then the heat sink (9) dissipates the heat once, and then the remaining heat is transferred to the surface of the heat dissipation mesh plate (8), and the grid in the heat dissipation mesh plate 8 dissipates the heat twice, and then the remaining heat is further transferred to the surface of the copper plate (7), and the copper plate (7) volatilizes the heat three times through its internal thermal conductivity; S2: The cooling plate (15) inside the disc (14) then performs a cooling process. After one treatment, a portion of the cold air is isolated by the ceramic plate (16), and the remaining portion is transferred to the surface of the core board body (1). Since the heat of the core board body (1) has just been volatilized, the remaining portion of the cold air is used to cool and restore the core board body (1).

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