Electronic component mounting device and mounting method thereof

Abstract

The present invention relates to an electronic component mounting device and a mounting method thereof, comprising: at least one component, which is received in a component supply device and supplied, and is received in a manner that a terminal portion faces downwardly of the component supply device and a first surface is exposed upwardly, or is received in a manner that a terminal portion faces a side direction of the component supply device and a second surface is exposed upwardly; a picking component, which picks up one of the first surface or the second surface of the component; a substrate, which mounts the component; and a rotating component, which is located between the component supply device and the substrate, and when the second surface of the component is picked up by the picking component, places the picked up component and rotates the component 90 degrees so that the first surface faces the picking component.

Description

Technical Field

[0001] The present invention relates to an electronic component mounting device and a mounting method thereof, for example, to an electronic component mounting device and a mounting method thereof as follows: when picking up a component stored in a tray and installing the component on a substrate, the component can be automatically rotated according to the storage state of the component so that the pin portion of the component can be arranged to face the substrate. Background Art

[0002] In order to insert components supplied from a component supply device such as a tray, a rod, a block, etc. into a printed circuit board, the lead portion or the mounting surface of the component needs to be supplied downward (toward the substrate).

[0003] However, in many cases, components are supplied with their lead portions facing sideways, taking into account the shape of the components or the convenience of packaging and transportation of a component supply device for storage.

[0004] Since the pins of the components supplied from the component supply device are stored in a manner that faces the side direction of the component supply device, the components are stored in the component supply device in a state that is rotated 90 degrees toward the mounting surface of the printed circuit board. Therefore, the components picked up by the pickup device in the component supply device cannot be directly mounted on the printed circuit board because the pins face the side direction.

[0005] In order to mount the components on the printed circuit board according to the mounting state of the components, the worker has to manually mount the components with the lead portions mounted toward the side of the component supply device one by one on the printed circuit board.

[0006] Alternatively, in order to be able to directly mount a component rotated 90 degrees toward the side of the component feeder on a printed circuit board, the component of the component feeder is repackaged so that the pin portion of the component faces downward. In this case, a new component feeder is required that is independent of the component feeder that carries the component rotated 90 degrees, and a separate device is required for changing the storage position of the component.

[0007] In contrast, a pivot function can be used on the head that picks up the component. In this case, expensive equipment with a pivot function is required, a pivot gripper that matches the shape and size of the component is required, and a rotation radius must be ensured, so the flexibility of the head is inevitably reduced.

[0008] Therefore, in the case of components that are stored and supplied in a side direction of a component supply device, an electronic component mounting device that can rotate the components by 90 degrees so that the lead portions of the components face the printed circuit board is required.

[0009] [Prior art literature]

[0010] Korean Patent No. 10-1541838 (grant date: 2015.07.29, Dineeng Co., Ltd.) Summary of the invention

[0011] The technical problem that the present invention intends to solve is to provide an electronic component mounting device and a mounting method thereof, which are capable of rotating components supplied and received toward the side of a component supply device by 90 degrees.

[0012] Furthermore, the technical problem that the present invention intends to solve is to provide an electronic component mounting device and a mounting method thereof which can ensure a rotation space for components, facilitate the rotation of components, and have a low equipment and installation cost for a rotating device for rotating parts.

[0013] The technical problems that the present invention is intended to solve are not limited to the above-mentioned technical problems, and those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0014] An electronic component mounting device according to an embodiment of the present invention may include: at least one component, which is received in a component supply device and supplied, and is received in a manner that a terminal portion faces downwardly of the component supply device and a first surface is exposed upwardly, or is received in a manner that a terminal portion faces a side direction of the component supply device and a second surface is exposed upwardly; a picking component, which picks up one of the first surface or the second surface of the component; a substrate, which mounts the component; and a rotating component, which is located between the component supply device and the substrate, and when the second surface of the component is picked up by the picking component, places the picked up component and rotates the component 90 degrees so that the first surface faces the picking component.

[0015] It may include: a photographing component, which is arranged between the rotating component and the substrate, and confirms the adsorption state of the component picked up by the pickup component; and a control unit, which links and controls the driving actions of the rotating component and the pickup component through communication.

[0016] The device may further include an auxiliary photographing component, which is disposed between the component supply device and the rotating component and confirms the adsorption state of the component picked up by the picking component.

[0017] The device may further include: a communication component for linking the rotation action of the rotation component and the driving action of the pickup component by the control unit.

[0018] The rotating member may further include a sensor member that senses a position of the pickup member, senses placement of the component, and senses rotation of the component.

[0019] The rotating component may include: a base; a rotator, which is equipped to be able to rotate around a first axis on the base and constitutes a placement surface for placing the element; a supporting component, adjacent to the rotator, supporting the element while contacting the placement surface according to the rotation of the rotator; and a driving unit, providing power for the rotational drive of the rotator.

[0020] The seating surface may be formed with a seating groove introduced inwardly to seat and support the element.

[0021] When the rotator rotates around the first axis, one of the two side surfaces of the mounting surface of the rotator is folded with the bottom surface of the base, and the other side surface of the two sides of the mounting surface of the rotator is exposed upward, and the first surface of the element can be folded with one surface of the supporting component and the second surface of the element is exposed upward.

[0022] The driving portion may be formed to include a hydraulic cylinder.

[0023] Furthermore, the electronic component mounting method according to an embodiment of the present invention may include the following steps: providing a component supply device with a component stored in a manner such that a first surface or a second surface perpendicular to the first surface faces upward; sucking the first surface or the second surface of the component by a suction nozzle of a picking component; releasing the component sucked to the picking component to a rotating component when the second surface of the component is stored in a manner such that the component faces upward; rotating the rotating component to position the component so that the first surface of the component faces upward; sucking the first surface of the component by the suction nozzle of the picking component; and mounting the component with the first surface sucked on a substrate.

[0024] When the rotating member rotates 90 degrees, the second surface of the component may move in a side direction and the terminal portion of the component may face downward.

[0025] After the step of causing the pickup member to absorb the first surface of the component, the method may further include the step of confirming a state in which the pickup member absorbs the first surface of the component by means of a photographing member formed between the rotating member and the substrate.

[0026] The method may further include the following step: confirming the state of the pickup component adsorbing the component before the component is placed on the rotating component by means of an auxiliary photographing component between the component supply device and the rotating component.

[0027] In order to pick up the component, rotate the component and place the component, the rotating component and the picking component can be linked via a communication component.

[0028] Specific matters of other embodiments are included in the detailed description and drawings.

[0029] The electronic component mounting device and mounting method according to the embodiment of the present invention as described above have the following advantages: even when the pin portion of the component is stored in a manner facing the side of the component supply device, the component can be automatically rotated 90 degrees using a component rotation device, thereby shortening the component mounting time and improving productivity.

[0030] Furthermore, the electronic component mounting device and mounting method according to the embodiments of the present invention have a structure in which the picked-up components are placed on a rotator and the placed components rotate according to the rotation of the rotator. Therefore, they have the following advantages: the structure or composition of the rotating equipment is simple, the unit price of the equipment is low, and it is easy to ensure space for rotating components.

[0031] The effects of the present invention are not limited to the effects mentioned above, and those skilled in the art can clearly understand other effects not mentioned through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 FIG. 1 is a diagram schematically showing an electronic component mounting device according to an embodiment of the present invention.

[0033] Figure 2 This is a diagram schematically showing components stored in a component supply device in an electronic component mounting device according to an embodiment of the present invention.

[0034] Figure 3 FIG. 1 is a diagram schematically showing a rotating member in an electronic component mounting device according to an embodiment of the present invention.

[0035] Figure 4 1 is a diagram schematically showing a state in which a rotating member rotates in an electronic component mounting device according to an embodiment of the present invention.

[0036] Figure 5 is a schematic cross-sectional view of a rotating component in an electronic component mounting device according to an embodiment of the present invention.

[0037] Figure 6 is a schematic block diagram of an electronic component mounting device according to an embodiment of the present invention.

[0038] Figure 7 FIG. 1 is a diagram schematically showing rotation of a component in an electronic component mounting apparatus according to an embodiment of the present invention.

[0039] Figure 8 1 is a diagram showing an electronic component mounting device according to an embodiment of the present invention and a schematic operation diagram thereof.

[0040] Fig. 9 FIG. 1 is a schematic plan view of an electronic component mounting device according to an embodiment of the present invention.

[0041] Fig.10 This is a diagram schematically showing the overall operation of an electronic component mounting apparatus according to an embodiment of the present invention provided with an additional imaging unit.

[0042] Fig.11 FIG. 4 is a flow chart schematically showing an electronic component mounting method according to an embodiment of the present invention.

[0043] Description of reference numerals:

[0044] 10: Electronic component placement device

[0045] 20: Component supply device

[0046] 110: Components

[0047] 110a: Terminal part

[0048] 111: Side 1

[0049] 112: Side 2

[0050] 120: Pick up parts

[0051] 121: Nozzle

[0052] 130: Substrate

[0053] 140: Rotating parts

[0054] 141: Base

[0055] 142: Rotator

[0056] 142a: Placement surface

[0057] 142b: Base surface

[0058] 142c: First side

[0059] 142d: Second side

[0060] 1421: Placement Slot

[0061] 143: Support components

[0062] 145: Drive unit

[0063] 149: Sensor components

[0064] 150: Shooting components

[0065] 160: Communication components

[0066] 180: Auxiliary shooting parts

[0067] 190: Control Department DETAILED DESCRIPTION

[0068] References and Attachments Figure 1 The advantages and features of the present invention and the methods for achieving these can be clarified by the embodiments described in detail below. However, the present invention can be implemented in various forms different from each other and is not limited to the embodiments disclosed below. The purpose of providing this embodiment is to make the disclosure of the present invention complete and to fully inform the scope of the present invention to those of ordinary skill in the art to which the present invention belongs. The present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same components.

[0069] Therefore, in some embodiments, well-known process steps, well-known structures, and well-known technologies are not described in detail in order to avoid obscuring the present invention.

[0070] The terms used in this specification are used to illustrate the embodiments, rather than to limit the present invention. In this specification, unless otherwise specifically mentioned in a sentence, the singular also includes the plural. The "comprises" and / or "comprising" used in the specification are used to mean that the existence or addition of one or more other constituent elements, steps, actions and / or elements other than the mentioned constituent elements, steps, actions and / or elements is not excluded. Furthermore, "and / or" includes all combinations of the mentioned individual items and more than one.

[0071] Furthermore, the embodiments described in this specification will be described with reference to the cross-sectional views and / or schematic diagrams of the ideal example diagrams of the present invention. Therefore, the morphology of the example diagrams can be changed according to the manufacturing technology and / or the allowable error, etc. Therefore, the embodiments of the present invention are not limited to the specific morphology shown, but include changes in the morphology produced according to the manufacturing process. And in the various drawings shown in the present invention, each component can be slightly enlarged or reduced for convenience of description. Throughout the entire specification, the same reference numerals refer to the same components.

[0072] Hereinafter, the present invention will be described by referring to the drawings for explaining an electronic component mounting apparatus 10 through embodiments of the present invention.

[0073] Figure 1 FIG. 1 is a diagram schematically showing an electronic component mounting device 10 according to an embodiment of the present invention. Figure 2 1 is a diagram schematically showing components 110 stored in a component supply device 20 in an electronic component mounting device 10 according to an embodiment of the present invention.

[0074] Reference Figure 1 and Figure 2 According to an embodiment of the present invention, the electronic component mounting device 10 may include a component supply device 20, a component 110, a pickup component 120, a substrate 130, and a rotating component 140. In addition, as described below, the electronic component mounting device 10 may include a communication component 160, a sensor component 149, and a control unit 190 as described below.

[0075] The component supply device 20 is a structure that stores a plurality of components 110 , and can supply the plurality of components 110 to the electronic component mounting device 10 in order to mount the plurality of components 110 on the substrate 130 .

[0076] The component 110 is stored in the component supply device 20 and supplied, and can be mounted on the substrate 130. The component 110 can be provided with a terminal portion 110a on one side. The component 110 is stored in the component supply device 20, and in order to be mounted on the substrate 130, the terminal portion 110a needs to be arranged toward the substrate 130, that is, it needs to be arranged downward.

[0077] Therefore, when the component 110 is stored in the component supply device 20, the terminal portion 110a is preferably stored in a manner facing downwards in order to be picked up by the pickup part 120 described later and mounted on the substrate 130. However, the component supply device 20 storing the component 110 may store the component 110 from the side in consideration of the size or the damage of the terminal during transfer and the like. Specifically, the terminal portion 110a of the component 110 may be stored in a manner facing one side of the component supply device 20 and supplied to the electronic component mounting device 10.

[0078] Accordingly, the terminal portion 110a of the component 110 can be picked up by the later-described pickup component 120 in a state of facing the side direction, and thus a device capable of changing the position of the terminal portion 110a of the component 110 to face downward is required. Accordingly, a later-described rotating component 140 is provided between the component supply device 20 and the substrate 130, so that the pickup direction of the component 110 can be changed. Hereinafter, the surface of the component 110 facing the mounting surface of the terminal portion 110a may be referred to as the first surface 111, and the surface adjacent to the first surface 111 and located between the mounting surface of the terminal portion 110a and the first surface 111 may be referred to as the second surface 112. Furthermore, in the present invention, an example of a situation in which the first surface 111 and the second surface 112 are formed perpendicular to each other can be given. Accordingly, when the component 110 is stored in the component supply device 20, if the terminal portion 110a faces downward, the first surface 111 of the component 110 can be exposed upward in the component supply device 20. Furthermore, when the component 110 is stored in the component supply device 20, if the terminal portion 110a faces sideways, the second surface 112 of the component 110 can be exposed upward in the component supply device 20.

[0079] The picking-up component 120 can pick up one of the first surface 111 or the second surface 112 of the component 110 according to the storage state of the component 110 stored in the component supply device 20. If the component 110 is stored in the component supply device 20 with the first surface 111 facing upward, the picking-up component 120 will pick up the first surface 111 of the component 110 exposed upward. On the other hand, if the component 110 is stored in the component supply device 20 with the second surface 112 facing upward, the picking-up component 120 will pick up the second surface 112 of the component 110 exposed upward.

[0080] The component 110 picked up by the picking-up component 120 can be moved according to the movement of the picking-up component 120 and mounted on the substrate 130. However, the component 110 needs to be picked up in a manner such that the terminal portion 110a faces the substrate 130, that is, it needs to be picked up in a manner such that it faces downward. Therefore, if the first surface 111 of the component 110 is picked up by the picking-up component 120, the picking-up component 120 can transfer the component 110 to the substrate 130 and mount it on the substrate 130. However, in the case where the picking-up component 120 picks up the second surface 112 of the component 110 from the component supply device 20, the component 110 needs to change the picking position so that the terminal portion 110a can face the substrate 130.

[0081] Therefore, a rotating member 140 may be provided between the component supply device 20 and the substrate 130 to be able to change the terminal portion 110 a of the component 110 .

[0082] Figure 3 1 is a diagram schematically showing a rotating member 140 in the electronic component mounting device 10 according to an embodiment of the present invention. Figure 4 1 is a diagram schematically showing a state in which the rotating member 140 rotates in the electronic component mounting device 10 according to an embodiment of the present invention. Figure 5 is a schematic cross-sectional view of a rotating member 140 in an electronic component mounting device 10 according to an embodiment of the present invention.

[0083] Reference Figures 3 to 5 The rotating member 140 may be located between the component supply device 20 and the substrate 130. The rotating member 140 may be configured to rotate 90 degrees after the component 110 is placed to change the upper position of the component 110.

[0084] Specifically, when the picking-up member 120 picks up the second surface 112 of the component 110, the picking-up member 120, after being located on the rotating member 140, can place the component 110 in a state where the second surface 112 is picked up on the rotating member 140. After the component 110 is placed on the rotating member 140 in a state where the second surface 112 of the component 110 faces upward, the component 110 rotates together according to the rotation of the rotating member 140. Accordingly, the first surface 111 of the component 110 can be placed facing upward and positioned toward the picking-up member 120.

[0085] The rotating component 140 may include a base 141 , a rotator 142 , a supporting component 143 , and a driving unit 145 .

[0086] The base 141 may be located between the component supply device 20 and the substrate 130, and the supporting member 143 and the rotator 142 described later may be located above it. A coupling base that enables the base 141 to be loaded and unloaded from the electronic component mounting device 10 may also be provided below the base 141. Accordingly, the rotating member 140 may have a structure that allows it to be loaded and unloaded from the electronic component mounting device 10 as required. Furthermore, the rotating member 140 may be loaded and unloaded from the electronic component mounting device 10, and may also be attached to the electronic component mounting device 10 by changing it in accordance with the size or shape of the component 110.

[0087] The rotator 142 may be provided on the base plate 141 so as to be rotatable around the first axis 142x. The rotator 142 may include: a placement surface 142a on which the element 110 is placed; a base surface 142b opposite to the placement surface 142a; a first side surface 142c facing the supporting member 143 described later before the rotator 142 rotates; and a second side surface 142d opposite to the first side surface 142c.

[0088] The first axis 142 x may be located between an end of the first side surface 142 c and an end of the base surface 142 b to constitute a rotation center of the rotator 142 .

[0089] When the rotator 142 rotates around the first axis 142x, one of the two side surfaces of the placement surface 142a of the rotator 142 (the first side surface 142c) can be folded with the bottom surface of the base 141, and the other side surface of the two sides of the placement surface 142a of the rotator 142 (the second side surface 142d) can be exposed upward.

[0090] The placement surface 142 a may be located at an upper position before the rotation according to the rotation of the rotator 142 , and may be arranged to face a supporting member 143 to be described later after the rotation.

[0091] The placement surface 142a may be formed with a placement groove 1421 introduced into the inner side thereof so as to place and support the element 110. The placement groove 1421 may be formed to pass through from one side of the rotator 142 to the other side, that is, from the first side 142c to the second side 142d. The placement groove 1421 may be configured to correspond to the shape of the element 110. In addition, since the shape of the element 110 may be formed in various forms, at least one of the protrusions formed on both sides of the placement groove 1421 may also be configured as a variable component so as to be able to change the size of the placement groove 1421. For example, the variable component is configured to be combined with the rotator 142 by a component such as a bolt, and the variable component may make the size of the placement groove 1421 different according to the position of the rotator 142 combined with the variable component. Furthermore, the seating groove 1421 can be subjected to various changes or deformations. For example, in order to prevent the component 110 mounted on the seating groove 1421 from moving, the seating groove 1421 can be provided with an elastic component corresponding to the shape of the component 110. As a variation thereof, adsorption holes caused by air pressure can also be provided on the corresponding surface to prevent the component 110 from moving during rotation.

[0092] The support member 143 may be disposed adjacent to the rotator 142 and opposite to the first side surface 142c of the rotator 142. Also, the support member 143 may be configured to contact the seating surface 142a according to the rotation of the rotator 142 and support the element 110 seated in the seating groove 1421.

[0093] The driving unit 145 may be configured to provide power for the rotational drive of the rotator 142. The driving unit 145 according to an embodiment of the present invention may include a hydraulic cylinder. However, the structure of the driving unit 145 is not limited thereto, and may be composed of a motor, etc., and any changes or deformations may be made as long as the structure is capable of rotating the rotator 142 around the first axis 142x. As a modified example, by providing a lever for converting the vertical downward movement of the pickup component 120 into a rotational movement, an active driving unit such as a separate motor can be replaced, thereby enabling the rotation of the rotator 142.

[0094] Figure 6 is a schematic block diagram of an electronic component mounting device 10 according to an embodiment of the present invention. Figure 7 1 is a diagram schematically showing the rotation of the component 110 in the electronic component mounting device 10 according to an embodiment of the present invention.

[0095] Reference Figure 6 and Figure 7 The electronic component mounting device 10 of the present invention may also be equipped with a photographing component 150 , a control unit 190 , a communication component 160 and a sensor component 149 .

[0096] The photographing component 150 may be provided between the rotating component 140 and the substrate 130. The photographing component 150 may be provided to confirm the adsorption state of the component 110 picked up by the first surface 111 in the component supply device 20 or the rotating component 140, and the position of the terminal portion 110a when the component 110 is adsorbed. The photographing component 150 may be arranged in an upward manner. In the present invention, the photographing component 150 is a component that uses a photographed image to confirm the adsorption state or position of the component 110, but is not limited to this, and may also be replaced by another sensing component (detection unit) such as a contact sensing sensor. However, the photographing component 150 is described as an example of a sensing component in the present invention below.

[0097] The communication component 160 may be provided in order to link the rotation of the rotating component 140 with the driving of the picking component 120 by the control unit 190. That is, an operation time is required to realize the following operation: with the rotation of the rotating component 140, the component 110 is rotated so as to have a pickable shape. In order to obtain the optimal time and further to avoid interference or conflict with the picking component 120, the communication component 160 may be configured to realize communication between the driving of the rotating component 140 and the driving of the picking component 120.

[0098] The sensor component 149 may be provided on the rotating component 140, and may be configured to sense the position of the pickup component 120, sense the placement of the component 110, and sense the rotation of the component 110. The sensor component 149 may be at least one of a position sensor that detects the rotation state of the rotating component 140, a proximity sensor that detects the approach of the pickup component 120, and a pressure sensor that detects the placement of the component 110.

[0099] The control unit 190 may be configured to link and control the driving actions of the rotating member 140 and the picking member 120 through the communication of the communication unit 160. In addition, the control unit 190 may receive the detection of the sensor unit 149 and control the driving of the rotating member 140 and the picking member 120 based on the detection. As in the above-mentioned variant embodiment, if the driving or switching by the physical contact or force of the picking member can be operated, there is no need to separately configure a control unit for driving the rotating member 140.

[0100] Figure 8 1 is a diagram showing an electronic component mounting device 10 according to an embodiment of the present invention and a schematic operation diagram thereof. Fig. 9 1 is a schematic plan view of an electronic component mounting device 10 according to an embodiment of the present invention.

[0101] Reference Figure 8 and Fig. 9 , which can illustrate the operation of the electronic component mounting device 10 of the present invention.

[0102] The electronic component mounting device 10 as described above can first pick up the component 110 through the picking component 120 in a state where the component supply device 20 supplies the component to the electronic component mounting device 10. According to the state of the component 110 picked up by the picking component 120, for example, if the picking component 120 picks up the second side 112 of the component 110, the component 110 can be placed on the rotating component 140 in order to pick up the first side 111 again.

[0103] The component 110 is placed on the rotating member 140 , specifically, on the placement groove 1421 of the rotator 142 . After the component 110 is placed on the rotating member 140 , the picking member 120 may release the adsorption state and move upward.

[0104] In the state where the second surface 112 of the element 110 faces upward, the rotator 142 rotates 90 degrees around the first axis 142x. By the rotation of the rotator 142, the first side surface 142c of the rotator 142 is folded with the bottom surface of the base plate 141. And, the second side surface 142d of the rotator 142 can be exposed upward. And, the placement surface 142a can contact one side of the support member 143. Therefore, the second surface 112 of the element 110 can maintain a state of being supported by the placement groove 1421 while contacting one side of the support member 143. And, due to the 90-degree rotation of the rotator 142, the first surface 111 of the element 110 can be in a state of being exposed upward.

[0105] The pickup member 120 rotates to pick up the first surface 111 of the component 110 exposed upward. Thus, the component 110 can be picked up with the terminal portion 110a of the component 110 facing the substrate 130, and can be placed and mounted at a set position on the substrate 130.

[0106] Fig.10 1 is a diagram schematically showing the overall operation of the electronic component mounting apparatus 10 according to one embodiment of the present invention in which an additional imaging unit is provided.

[0107] Reference Fig.10 An auxiliary photographing unit 180 may be additionally provided between the component supply device 20 and the rotating unit 140. The auxiliary photographing unit 180 may be used to confirm the adsorption state of the component 110 picked up by the pickup unit 120.

[0108] Accordingly, in the Fig. 9 In the operation described in the above, after the component supply device 20 picks up the component 110 and before the component 110 is placed on the rotating member 140, the picking state of the component 110 can be additionally confirmed by the auxiliary photographing member 180. The auxiliary photographing member 180 can be arranged in an upward manner.

[0109] Fig.11 FIG. 4 is a flow chart schematically showing an electronic component mounting method according to an embodiment of the present invention.

[0110] Reference Fig.11According to an embodiment of the present invention, an electronic component mounting method may include a component providing step, a first adsorption step S10, a releasing step S20, a rotating step S30, a second adsorption step S40 and a mounting step S50.

[0111] First, the component 110 stored in the component supply device 20 with the first surface 111 or the second surface 112 perpendicular to the first surface 111 facing upward may be provided to the electronic component mounting device 10 .

[0112] After the component supply device 20 supplies the electronic component to the electronic component mounting device 10 , the pickup unit 120 moves to the component supply device 20 and absorbs the first surface 111 or the second surface 112 of the component 110 through the suction nozzle 121 ( S10 ).

[0113] When the first surface 111 of the component 110 is stored upward, the pickup member 120 picks up the first surface 111 of the component 110. Also, when the second surface 112 of the component 110 is stored upward, the pickup member 120 picks up the second surface 112 of the component 110 (first suction).

[0114] When the pickup member 120 picks up the first surface 111 of the component 110, since the terminal portion 110a is arranged toward the substrate 130, there is no need to rotate the component 110. Therefore, in this case, the component 110 can be mounted on the substrate 130 after being transferred to the imaging member 150 side and imaging the adsorption state of the component 110 while the first surface 111 is picked up by the pickup member 120.

[0115] If the component 110 is stored in the component supply device 20 with the second surface 112 facing upward, the component 110 needs to be changed in position so that the first surface 111 can be picked up by the pickup member 120. To this end, the component 110 with the second surface 112 adsorbed on the pickup member 120 is released from the pickup member 120 and mounted on the rotating member 140 (S20).

[0116] The component 110 is placed and supported on the placement surface 142a of the rotator 142, and the rotating component 140 rotates around the first axis 142x based on the support of the placement surface 142a (S30). If the rotating component 140 rotates 90 degrees, the component 110 rotates 90 degrees together with the rotation of the rotating component 140, so that the first surface 111 faces upward (S30). And, if the rotating component 140 rotates 90 degrees, the second surface 112 of the component 110 moves to the side direction and the terminal portion 110a of the component 110 faces downward.

[0117] The pickup member 120 moves toward the rotated rotating member 140 and adsorbs the first surface 111 of the component 110 exposed upward (second adsorption, S40 ).

[0118] The pickup member 120 is transferred to the imaging member 150 formed between the rotating member 140 and the substrate 130, and the imaging member 150 confirms the adsorption state of the component 110 adsorbed on the pickup member 120, the position of the terminal portion 110a, etc. (S45). The component 110 whose adsorption state and the position of the terminal portion 110a are confirmed by the imaging member 150 can be transferred to the substrate 130 and mounted (S50).

[0119] After the picking component 120 picks up the component 110 from the component supply device 20 and before transferring it to the rotating component 140, the auxiliary shooting component 180 can be used to further confirm the adsorption state of the component 110 adsorbed on the picking component 120 or the position of the terminal portion 110a (S15).

[0120] In order to pick up the component 110 , rotate the component 110 , and install the component 110 according to the various steps, the rotating component 140 and the picking component 120 may be linked via the communication component 160 .

[0121] The embodiments of the present invention are described above with reference to the accompanying drawings, but it is understood by those with ordinary knowledge in the technical field to which the present invention belongs that the present invention can be implemented in other specific forms without changing its technical ideas or essential features. Therefore, the embodiments described above should be understood to be exemplary in all aspects, rather than limiting.

Claims

1. An electronic component mounting device, comprising: At least one component is received in a component supply device and is supplied, and is received in a manner that a terminal portion faces downwardly of the component supply device and a first surface is exposed upwardly, or in a manner that a terminal portion faces a side direction of the component supply device and a second surface is exposed upwardly; Picking up a component, picking up one of the first surface or the second surface of the component; A substrate for mounting the components; as well as a rotating component, located between the component supply device and the substrate, for placing the picked-up component and rotating the component by 90 degrees so that the first surface faces the picking-up component when the second surface of the component is picked up by the picking-up component; Wherein, the rotating component comprises: base plate; A rotator, which is provided to be rotatable around the first axis on the base plate and has a placement surface formed with a placement groove for placing and supporting the element introduced inwardly; A supporting member is adjacent to the rotator and supports the element while being in contact with the setting surface according to the rotation of the rotator.

2. The electronic component mounting device according to claim 1, comprising: a sensing component, provided between the rotating component and the substrate, for confirming the adsorption state of the component picked up by the picking component; as well as The control unit controls the driving actions of the rotating component and the picking component.

3. The electronic component mounting device according to claim 2, further comprising: An auxiliary sensing component is provided between the component supply device and the rotating component to confirm the adsorption state of the component picked up by the picking component.

4. The electronic component mounting device according to claim 1, further comprising: The control unit controls the rotational motion of the rotational member by controlling the driving motion of the pickup member.

5. The electronic component mounting device according to claim 2, wherein: The rotating member further includes a sensor member that senses the position of the pickup member, senses the placement of the component, and senses the rotation of the component.

6. The electronic component mounting device according to claim 1, wherein: The rotating component also includes: The driving unit provides power for driving the rotator to rotate.

7. The electronic component mounting device according to claim 1, wherein: When the rotator rotates around the first axis, One of the two side surfaces of the placement surface of the rotator is folded with the bottom surface of the base plate, and the other of the two side surfaces of the placement surface of the rotator is exposed upward. The second surface of the element is folded with one surface of the supporting member and the first surface of the element is exposed upward.

8. The electronic component mounting device according to claim 6, wherein: The driving portion is formed to include a hydraulic cylinder.

9. A method for mounting electronic components, comprising the following steps: Providing a component supply device with the components stored with a first surface or a second surface perpendicular to the first surface facing upward; Adsorbing the first surface or the second surface of the component by a nozzle of a pickup component; releasing the component adsorbed to the pickup member to the rotating member when the second surface of the component is stored in an upward direction; Rotating the rotating member to position the element so that the first surface of the element faces upward; Adsorbing the first surface of the component by a suction nozzle of the pickup component; Mounting the first surface adsorbed component on a substrate, Among them, the rotating component includes: a base; a rotator, which is equipped to be able to rotate around a first axis on the base and has a placement surface with a placement groove introduced inward to place and support the element; a supporting component, adjacent to the rotator, which supports the element while contacting the placement surface according to the rotation of the rotator.

10. The electronic component mounting method according to claim 9, wherein: When the rotating member rotates 90 degrees, the second surface of the element moves in a side direction and the terminal portion of the element faces downward.

11. The electronic component mounting method according to claim 9, wherein: After the step of the picking component adsorbing the first surface of the component, the following steps are also included: The state in which the pickup member adsorbs the first surface of the component is confirmed by a sensing member formed between the rotating member and the substrate.

12. The electronic component mounting method according to claim 9, further comprising the following steps: Through the auxiliary sensing component between the component supply device and the rotating component, the state of the pickup component adsorbing the component is confirmed before the component is placed on the rotating component.

13. The electronic component mounting method according to claim 9, wherein: In order to pick up the component, rotate the component and place the component, the rotating component and the picking component are linked via a communication component.

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