Wet cleaning process

A wet cleaning and process technology, applied in chemical instruments and methods, cleaning methods and appliances, electrical components, etc., can solve problems such as abnormal substrate yield and inability to clean the substrate surface, and achieve the effect of low cleaning cost

CN113690130AInactive Publication Date: 2021-11-23GUANGZHOU CANSEMI TECH INC
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
Publication Date
2021-11-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a wet cleaning process which comprises the following steps of providing a substrate with a first surface and a second surface oppositely arranged, executing an SPM cleaning process for removing organic matters and part of metal ions on the first surface and the second surface of the substrate, executing an SC1 cleaning process to remove particles and part of metal ions on the first surface and the second surface of the substrate, executing an SC2 cleaning process for removing residual metal ions on the first surface and the second surface of the substrate, performing at least one ozone oxidation process for removing residual particles on the first surface and the second surface of the substrate, and executing an HF cleaning process for removing the oxide layers on the first surface and the second surface of the substrate. Ozone is introduced into the pure water tank before the HF cleaning process, other impurities or chemical liquid is not introduced into the wet cleaning process, the cleaning cost is low, and large-scale popularization can be carried out.
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Description

technical field

[0001] The invention relates to the technical field of semiconductors, in particular to a wet cleaning process. Background technique

[0002] The substrate cleaning technology is one of the most important factors affecting the substrate yield, device quality and reliability.

[0003] The main purpose of cleaning is to remove contamination on the surface of the substrate, such as particles, organic matter and metal ions and other impurities. Before the substrate enters the relevant process, the cleanliness of the substrate must be guaranteed, so chemical cleaning is required before the relevant process. Cleaning with ultra-pure water makes the surface of the substrate meet the required cleanliness, so that the manufactured semiconductor device can have the design electrical characteristics. However, in the manufacture of high-level integrated circuits, it is the most difficult to clean silicon surface particles due to the size, environment, and process condi...

Examples

Embodiment Construction

[0031] A wet cleaning process proposed by the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0032] Specifically, please refer to figure 1 , figure 1 It is the flow chart of the wet cleaning process of the embodiment of the present invention. Such as figure 1 As shown, this embodiment provides a wet cleaning process for integrated circuit manufacturing, including:

[0033] Step S10, providing a substrate, the substrate has a first surface and a second surface opposite to each other;

[0034] Step S20, performing an SPM cleaning process for removing organic matter an...