Hybrid multilayer optically flexible printed circuit assembly and method of manufacturing the same

Abstract

A hybrid multilayer optically flexible printed circuit assembly includes an optically flexible substrate including a first window and a second window, and having opposing first and second surfaces; an intrinsic film formed on the first surface of the optically flexible substrate, the intrinsic film including a first die attach region and a second die attach region, and the first die attach region aligned with the first window and the second die attach region aligned with the second window; an optical waveguide film formed on the second surface of the optically flexible substrate and filling the first and second windows of the optically flexible substrate; and a first optoelectronic assembly and a second optoelectronic assembly respectively fixedly disposed in the first die attach region and the second die attach region of the intrinsic film.

Description

TECHNICAL FIELD

[0001] The present invention relates to optical communications, and more particularly, to a hybrid multi-layer optically flexible printed circuit assembly and method of manufacturing the same. BACKGROUND

[0002] Smartphones and other mobile devices have become increasingly computationally rich. They can be equipped with megapixel cameras and high-resolution displays, support high-speed Internet and high-definition video and 3D graphics and gaming access, as well as a wide range of RF functionality, such as Wi-Fi, Bluetooth, WLAN, GPS, GSM, etc. Sometimes, multiple applications running in multiple windows can be opened, which requires high-speed computing power, thus pushing up the clock rate of the mobile device processor.

[0003] At the same time, parallel bus interfaces in mobile devices are replaced by high-speed serial links. Serial data links reduce the number of pins, reduce the number of transmission lines, suppress interference, and reduce power consumption. For example, the data rate supported on MIPI Camera Serial Interface 2 (CSI-2) and D-PHY is 800 Mb / s to 1 Gbps per channel, and can be extended to 4 Gbit / s through four channels.

[0004] However, the gigabit data link for display and camera modules can include spectral components that overlap with cellular frequencies, which will make the data link susceptible to electromagnetic coupling with positioning antennas and mobile antennas located in close proximity. In addition, connector emissions can degrade signal quality and impedance control. In addition, with continued miniaturization, increased component density, and an increasing number of high-speed chip packages, the challenge of thermal management in the design of mobile devices is also increasing.

[0005] Flexible printed circuits are commonly used in electrical devices to connect functional modules in locations where flexible or bendable interconnects can be employed. For example, a flexible printed circuit can be employed through a connecting hinge to connect between an upper portion (e.g., having a display portion) and a lower portion (e.g., having a host processor) of a foldable mobile phone. In the foregoing example, about 30 to 60 or more signals can be transmitted through the hinge in parallel traces. However, at high frequencies, the copper traces used can be affected by radiation and electromagnetic interference (EMI), thus degrading signal integrity and increasing crosstalk. Although optical flexible printed circuits can be used to enhance bandwidth and improve signal quality, their manufacture is a challenge when faced with various power requirements or low-speed electrical signal requirements such as multiple metal layers (given the multi-layer alignment limitations and material properties) and material property differences. SUMMARY

[0006] A hybrid multilayer optically flexible printed circuit assembly includes an optically flexible substrate having a first and a second window, and a first and a second surface opposite to each other; an intrinsic film formed on the first surface of the optically flexible substrate, the intrinsic film including a first die-bonding area aligned with the first window and a second die-bonding area aligned with the second window; an optical waveguide film formed on the second surface of the optically flexible substrate and filled in the first and second windows of the optically flexible substrate, the optical waveguide film including a first groove having a first slope and aligned with the first die-bonding area, and a second groove having a second slope and aligned with the second die-bonding area; a first flexible printed circuit board formed on the optical waveguide film, the first flexible printed circuit board including first metal lines, a first opening aligned with the first window, and a second opening aligned with the second window, and / or a second flexible printed circuit board formed on the intrinsic film, the second flexible printed circuit board including second metal lines, a third opening aligned with the first window, and a fourth opening aligned with the second window; and a first optoelectronic component and a second optoelectronic component fixedly disposed on the first die-bonding area and the second die-bonding area of the intrinsic film, respectively, wherein the first optoelectronic component is configured to convert an electrical signal into an optical intensity signal and to emit the optical intensity signal into the optical waveguide film, and the second optoelectronic component is configured to convert an optical intensity signal received from the optical waveguide film into an electrical signal.

[0007] The hybrid multilayer optically flexible printed circuit assembly of the preceding paragraph, wherein the intrinsic film includes an insulating layer, a metal pattern layer formed on the insulating layer, and a cover layer formed on the metal pattern layer and partially covering the metal pattern layer, and the intrinsic film is formed on the first surface of the optically flexible substrate by the insulating layer, and the metal pattern layer in the first and second die-bonding areas is exposed.

[0008] The hybrid multilayer optically flexible printed circuit assembly of the preceding paragraph, further including a first connection window penetrating through the intrinsic film, the optically flexible substrate, and the optical waveguide film to expose part of the first metal lines on the first flexible printed circuit board, and / or a second connection window penetrating through the second flexible printed circuit board to expose part of the metal pattern layer on the intrinsic film.

[0009] The hybrid multilayer optically flexible printed circuit assembly of the preceding paragraph, wherein the optical waveguide film comprises an upper cladding layer, a lower cladding layer, and a core layer sandwiched between the upper cladding layer and the lower cladding layer, and the first and second grooves are respectively formed through the lower cladding layer, the core layer, and a portion of the upper cladding layer, and the optical waveguide film is formed on the second surface of the optically flexible substrate by the upper cladding layer and filled within the first and second windows of the optically flexible substrate.

[0010] The hybrid multilayer optically flexible printed circuit assembly of the preceding paragraph, wherein the optically flexible substrate is made of a material selected from a group consisting of polyimide, metal, and liquid crystal polymer.

[0011] The hybrid multilayer optically flexible printed circuit assembly of the preceding paragraph, further comprising a third optoelectronic component and a fourth optoelectronic component fixedly disposed on the first die-bonding region and the second die-bonding region of the intrinsic film, respectively, wherein the fourth optoelectronic component is configured to convert an electrical signal into an optical intensity signal and inject the optical intensity signal into the optical waveguide film, and the third optoelectronic component is configured to convert an optical intensity signal received from the optical waveguide film into an electrical signal.

[0012] The hybrid multilayer optically flexible printed circuit assembly of the preceding paragraph, wherein the first and fourth optoelectronic components are each an optical signal emitting component, and the second and third optoelectronic components are each an optical signal receiving component.

[0013] The hybrid multilayer optically flexible printed circuit assembly of the preceding paragraph, wherein the first flexible printed circuit board and / or the second flexible printed circuit board is a single-layer, double-layer, or multi-layer printed circuit board.

[0014] The hybrid multilayer optically flexible printed circuit assembly of the preceding paragraph, wherein the first inclined surface comprises an acute angle θ1 between 25 degrees and 75 degrees, and the second inclined surface comprises an acute angle θ2 between 25 degrees and 75 degrees.

[0015] The hybrid multilayer optically flexible printed circuit assembly of the preceding paragraph, wherein the first flexible printed circuit board is formed on the optical waveguide film by a first adhesive layer, and / or a first anisotropic conductive film, and / or first solder balls, and / or a first metal pattern, and / or the second flexible printed circuit board is formed on the intrinsic film by a second adhesive layer, and / or a second anisotropic conductive film, and / or second solder balls, and / or a second metal pattern.

[0016] A method for manufacturing a hybrid multilayer optically flexible printed circuit assembly includes the steps of: providing an optically flexible substrate having opposite first and second surfaces; forming an intrinsic film on the first surface of the optically flexible substrate, the intrinsic film including a first die attach area and a second die attach area; forming a first and a second window on the optically flexible substrate aligned with the first and second die attach areas, respectively; forming an optical waveguide film on the second surface of the optically flexible substrate and filling the first and second windows of the optically flexible substrate; forming a first flexible printed circuit board on the optical waveguide film, the first flexible printed circuit board including first metal traces, a first opening aligned with the first window, and a second opening aligned with the second window, and / or forming a second flexible printed circuit board on the intrinsic film, the second flexible printed circuit board including second metal traces, a third opening aligned with the first window, and a fourth opening aligned with the second window; forming a first recess having a first slope and aligned with the first die attach area and a second recess having a second slope and aligned with the second die attach area on the optical waveguide film; and mounting a first optoelectronic component and a second optoelectronic component in the first die attach area and the second die attach area of the intrinsic film, respectively, wherein the first optoelectronic component is configured to convert an electrical signal into an optical intensity signal and to emit the optical intensity signal into the optical waveguide film, and the second optoelectronic component is configured to convert an optical intensity signal received from the optical waveguide film into an electrical signal.

[0017] The method for manufacturing a hybrid multilayer optically flexible printed circuit assembly, wherein the intrinsic film includes an insulating layer, a metal pattern layer formed on the insulating layer, and a cover layer formed on the metal pattern layer and partially covering the metal pattern layer, and the intrinsic film is formed on the first surface of the optically flexible substrate by the insulating layer, and the metal pattern layer in the first and second die attach areas is exposed.

[0018] The method for manufacturing a hybrid multilayer optically flexible printed circuit assembly, further including a first connection window extending through the intrinsic film, the optically flexible substrate, and the optical waveguide film to expose a portion of the first metal traces on the first flexible printed circuit board, and / or a second connection window extending through the second flexible printed circuit board to expose a portion of the metal pattern layer on the intrinsic film.

[0019] The method of claim 1, wherein the optical waveguide film comprises an upper cladding layer, a lower cladding layer, and a core layer sandwiched between the upper cladding layer and the lower cladding layer, and the first and second grooves are formed through the lower cladding layer, the core layer, and a portion of the upper cladding layer, respectively, and the optical waveguide film is formed on the second surface of the optically flexible substrate by the upper cladding layer and filled within the first and second windows of the optically flexible substrate.

[0020] The method of claim 1, wherein the optically flexible substrate is made of a material selected from the group consisting of polyimide, metal, and liquid crystal polymer.

[0021] The method of claim 1, further comprising a step of respectively fixing a third optoelectronic component and a fourth optoelectronic component on the first die-bonding region and the second die-bonding region of the intrinsic film, wherein the fourth optoelectronic component is used to convert an electrical signal into an optical intensity signal and inject the optical intensity signal into the optical waveguide film, and the third optoelectronic component is used to convert an optical intensity signal received from the optical waveguide film into an electrical signal.

[0022] The method of claim 1, wherein the first flexible printed circuit board and / or the second flexible printed circuit board is a single-layer, double-layer, or multi-layer printed circuit board.

[0023] The method of claim 1, wherein the first and second grooves are formed by laser cutting or mechanical cutting through the first and second openings, respectively.

[0024] The method of claim 1, wherein the first bevel comprises an acute angle θ1 between 25 degrees and 75 degrees, and the second bevel comprises an acute angle θ2 between 25 degrees and 75 degrees.

[0025] The method of claim 1, wherein the first flexible printed circuit board is formed on the optical waveguide film by a first adhesive layer, and / or a first anisotropic conductive film, and / or first solder balls, and / or a first metal pattern, and / or the second flexible printed circuit board is formed on the intrinsic film by a second adhesive layer, and / or a second anisotropic conductive film, and / or second solder balls, and / or a second metal pattern. BRIEF DESCRIPTION OF DRAWINGS

[0026] Unless otherwise stated, the accompanying drawings illustrate innovative patent objectives according to the following embodiments of the invention. Referring to the drawings, in which similar reference numerals indicate similar portions in related views, several examples of optical communication incorporating aspects of the principles of the present disclosure are shown in an exemplary, rather than restrictive, manner.

[0027] Figure 1A This is a top view of a hybrid multilayer optical flexible printed circuit assembly 100 according to Embodiment 1 of the present invention.

[0028] Figure 1B Is along as Figure 1A The section line IB-IB' in the figure shows a cross-sectional view of a hybrid multilayer optical flexible printed circuit assembly 100 according to Embodiment 1 of the present invention.

[0029] Figure 1A' This is a top view of a hybrid multilayer optical flexible printed circuit assembly 100' according to Embodiment 2 of the present invention.

[0030] Figure 1B' Is along as Figure 1A' The section line IB-IB' in the figure shows a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 100' according to Embodiment 2 of the present invention.

[0031] Figure 1C' Is along as Figure 1A' The section line IC-IC' shown in the figure is a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 100' according to Embodiment 2 of the present invention.

[0032] Figure 2 The flowchart illustrates the process steps for manufacturing a hybrid multilayer optical flexible printed circuit assembly according to various embodiments of the present invention.

[0033] Figures 3A-3C It is based on Figure 2 The flowchart steps 610-630 illustrate the cross-sectional process for manufacturing the hybrid multilayer optical flexible printed circuit assembly 100 according to Embodiment 1 of the present invention.

[0034] Figures 4A-4D It is based on Figure 2 The flowchart steps 640-670 illustrate the cross-sectional process for manufacturing the hybrid multilayer optical flexible printed circuit assembly 100 according to Embodiment 1 of the present invention.

[0035] Figures 5A-5C It is based on Figure 2 Steps 680-700 of the flowchart illustrate the cross-sectional process for manufacturing the hybrid multilayer optical flexible printed circuit assembly 100 according to Embodiment 1 of the present invention.

[0036] Figure 6 It is based on Figure 2 Step 710 of the flowchart illustrates a cross-sectional process for manufacturing the hybrid multilayer optical flexible printed circuit assembly 100 according to Embodiment 1 of the present invention.

[0037] Figure 7A This is a top view of a hybrid multilayer optical flexible printed circuit assembly 101 illustrated in Embodiment 3 of the present invention.

[0038] Figure 7B Is along as Figure 7A The section lines VIIB-VIIB' in the figure show a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 101 according to Embodiment 3 of the present invention.

[0039] Figure 7A' This is a top view of a hybrid multilayer optical flexible printed circuit assembly 101' according to Embodiment 4 of the present invention.

[0040] Figure 7B' Is along as Figure 7A' The section lines VIIB-VIIB' shown in the figure represent a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 101' according to Embodiment 4 of the present invention.

[0041] Figure 7C' Is along as Figure 7A' The section lines VIIC-VIIC' shown in the figure represent a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 101' according to Embodiment 4 of the present invention.

[0042] Figure 8A This is a top view of a hybrid multilayer optical flexible printed circuit assembly 102 according to Embodiment 5 of the present invention.

[0043] Figure 8B Is along as Figure 8A The section lines VIIIB-VIIIB' in the figure represent a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 102 according to Embodiment 5 of the present invention.

[0044] Figure 8A' This is a top view of a hybrid multilayer optical flexible printed circuit assembly 102' according to Embodiment Six of the present invention.

[0045] Figure 8B' Is along as Figure 8A' The section lines VIIIB-VIIIB' shown in the figure represent a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 102' according to Embodiment 6 of the present invention.

[0046] Figure 8C'is along the section line VIIIC-VIIIC' as shown in FIG. 7C. Figure 8A' FIG. 7C is a cross-sectional view of a hybrid multilayer optically flexible printed circuit assembly 102' according to an embodiment of the present application.

[0047] Wherein, the simple explanation of the symbols in the drawings is as follows:

[0048] 100, 100', 101, 101', 102, 102' hybrid multilayer optically flexible printed circuit assembly

[0049] 200 intrinsic film

[0050] 202 insulating layer

[0051] 203 metal pattern layer

[0052] 204 cover layer

[0053] 206A first optoelectronic component

[0054] 206B second optoelectronic component

[0055] 206C third optoelectronic component

[0056] 206D fourth optoelectronic component

[0057] 207 bonding pad

[0058] 210 first die attach region

[0059] 220 second die attach region

[0060] 250 optically flexible substrate

[0061] 250A first surface

[0062] 250B second surface

[0063] 300 optical waveguide film

[0064] 301 upper cladding layer

[0065] 302 core layer

[0066] 303 lower cladding layer

[0067] 307 first window

[0068] 308 second window

[0069] 310 first recess

[0070] 315 first bevel

[0071] 320 second recess

[0072] 325 second bevel

[0073] 400 first flexible printed circuit board

[0074] 401 first metal line

[0075] 405 first adhesive layer

[0076] 410 first opening

[0077] 420 second opening

[0078] 500 first connection window

[0079] 510 second connection window

[0080] 600 second flexible printed circuit board

[0081] 601 second metal line

[0082] 605 second adhesive layer

[0083] 610 third opening

[0084] 640 fourth opening

[0085] θ1, θ2 angle is an acute angle between 25 degrees and 75 degrees DETAILED DESCRIPTION

[0086] To make the disclosure of the present application more complete and complete, the following describes the embodiments and specific examples of the present application; but this is not the only form of implementation or use of the specific embodiments of the present application. The embodiments disclosed below can be combined or replaced with each other in a beneficial case, and other embodiments can be added in an embodiment, without further description or description.

[0087] The various principles related to optical communications are described below by referring to specific implementations of optical communications and hybrid multilayer optical flexible printed circuit assemblies, including arrangements and embodiments of hybrid multilayer optical flexible printed circuit assemblies, and manufacturing methods embodying innovative concepts. More specifically, but not exclusively, selected examples of optical communications describe related innovative principles, and for the purpose of brevity and clarity, hybrid multilayer optical flexible printed circuit assemblies and well-known functions or configurations are not described in detail. However, one or more disclosed principles can be incorporated into various other embodiments of optical communications, as well as hybrid multilayer optical flexible printed circuit assemblies, to achieve any of a variety of desired results, characteristics and / or performance standards.

[0088] Thus, optical communication and hybrid multi-layered optically flexible printed circuit assemblies having properties different than those specifically exemplified in this specification can employ one or more of the innovative aspects described herein, and can be used in applications other than those described herein. It is believed that the scope of the application should be determined, not by the embodiment, but by the patent claims. It is specifically intended that all such changes and modifications that come within the spirit of the application are covered by the claims. It is also contemplated to be covered by the claims any delivery of content over a network using an optical communication and hybrid multi-layered optically flexible printed circuit assembly not specifically described herein.

[0089] Unless otherwise defined, all terms (including technical and scientific terms) used in the present disclosure, including the terms of patent applications, are intended to have the same meaning as commonly understood by one of ordinary skill in the art in the field of the disclosure, and are intended to not be interpreted in an overly idealized or formal manner, such as those defined in generally used dictionaries, unless clearly defined in the present disclosure.

[0090] The disclosed inventive concepts are not limited to the embodiments illustrated in this specification, but are consistent with their full scope, consistent with the principles on which the concepts disclosed in this specification are based. The directions and symbols used in each component (for example, "up", "down", "upper", "lower", "horizontal", "vertical", "left", "right", and the like) do not indicate absolute relationships, positions, and / or directions. The nouns used in each component (for example, "first" and "second") are not literal, but are distinguishing nouns. As used in this specification, the noun "comprise" encompasses the concepts of "include" and "have", and designates the existence of components, operations, and / or groups or combinations thereof, and does not mean the exclusion of the existence or addition of one or more other components, operations, and / or groups or combinations thereof. The order of operations is not absolute unless specifically stated. Unless specifically stated, reference to a component in the singular, such as by use of the article "a" or "an", is not intended to mean "one and only one", but rather "one or more". As used herein, "and / or" means "and" or "or", as well as "and" and "or". The meaning of the range and sub-range (for example, "at least", "more than", "less than", "not more than", and the like) is a sub-range and / or an upper or lower limit. One of ordinary skill in the relevant art or later known to be known will be encompassed by the features described and claimed in this specification. In addition, nothing disclosed in this specification is intended to be dedicated to the public, whether or not the disclosed content is ultimately recited in the claims.

[0091] Embodiments

[0092] Embodiment One

[0093] This embodiment one discloses a hybrid multi-layered optically flexible printed circuit assembly as Figures 1A-1BThe mixed multilayer optical flexible printed circuit assembly 100 is shown, and the aforementioned mixed multilayer optical flexible printed circuit assembly 100 is manufactured by Figure 2 The steps shown in the flowchart and Figures 3A-3C , 4A~4D, 5A~5C and 6 are shown in the cross-sectional process.

[0094] Please refer to Figures 1A-1B . Figure 1A is a top view of the mixed multilayer optical flexible printed circuit assembly 100 according to embodiment one of the present application. Figure 1B is a cross-sectional view of the mixed multilayer optical flexible printed circuit assembly 100 according to embodiment one of the present application, shown along the cross-sectional line IB-IB' in Figure 1A As shown in Figures 1A-1B , the mixed multilayer optical flexible printed circuit assembly 100 disclosed according to embodiment one comprises: an optical flexible substrate 250 comprising a first window 307 and a second window 308, and the aforementioned optical flexible substrate 250 has opposite first and second surfaces 250A, 250B; an intrinsic film 200 formed on the first surface 250A of the optical flexible substrate 250, the intrinsic film 200 comprising a first die-bonding area 210 and a second die-bonding area 220, and the first die-bonding area 210 is aligned with the first window 307, and the second die-bonding area 220 is aligned with the second window 308; an optical waveguide film 300 formed on the second surface 250B of the optical flexible substrate 250 and filling the first and second windows 307, 308 of the optical flexible substrate 250, the optical waveguide film 300 comprising a first groove 310 having a first inclined surface 315 and aligned with the first die-bonding area 210, and a second groove 320 having a second inclined surface 325 and aligned with the second die-bonding area 220; a first flexible printed circuit board 400 formed on the optical waveguide film 300, and the first flexible printed circuit board 400 comprising first metal lines 401, a first opening 410 aligned with the first window 307, and a second opening 420 aligned with the second window 308; and a first optoelectronic component 206A and a second optoelectronic component 206B respectively fixedly arranged in the first die-bonding area 210 and the second die-bonding area 220 of the intrinsic film 200; wherein the first optoelectronic component 206A is used to convert an electrical signal into an optical intensity signal, and the optical intensity signal is emitted into the optical waveguide film 300, and the second optoelectronic component 206B is used to convert the optical intensity signal received from the optical waveguide film 300 into an electrical signal.

[0095] As shown in Figures 1A-1BAs shown, the aforementioned intrinsic film 200 includes an insulating layer 202, a metal patterned layer 203 formed on the insulating layer 202, and a cover layer 204 formed on and partially covering the metal patterned layer 203. The intrinsic film 200 is formed on the first surface 250A of the optically flexible substrate 250 via the insulating layer 202, and the metal patterned layer 203 located within the first and second die-bonding regions 210 and 220 is exposed. The insulating layer 202 can be prepared from a dielectric material, such as, but not limited to, polyimide (PI), and its thickness is, for example, but not limited to, 3~70 μm. The metal patterned layer 203 can be prepared from a highly conductive metal, such as, but not limited to, copper, nickel, gold, or aluminum, and its thickness is, for example, but not limited to, 0.5~30 μm. The capping layer 204 may be formed from, for example but not limited to, polyimide (PI), polyethylene terephthalate (PET), photoimageable polymers, in the absence of an adhesive, or in the presence of an adhesive such as, but not limited to, pressure-sensitive adhesive (PSA), epoxy resin adhesive, or acrylic adhesive, and its thickness may be, for example but not limited to, 5 to 50 μm.

[0096] like Figures 1A-1B As shown, the aforementioned hybrid multilayer optical flexible printed circuit assembly 100 further includes a first connection window 500 that penetrates the aforementioned intrinsic film 200, the aforementioned optical flexible substrate 250, and the aforementioned waveguide film 300 to expose a portion of the aforementioned first metal line 401 located on the aforementioned first flexible printed circuit board 400, so that power supply, high-speed electrical signals, and low-speed electrical signals can be coupled between the first printed circuit board 400 and the input / output port (not shown).

[0097] like Figures 1A-1BAs shown, the aforementioned optical waveguide film 300 includes: an upper fiber shell layer 301, a lower fiber shell layer 303, and a core layer 302 sandwiched between the upper fiber shell layer 301 and the lower fiber shell layer 303. The first and second grooves 310 and 320 respectively penetrate the lower fiber shell layer 303, the core layer 302, and a portion of the upper fiber shell layer 301. The optical waveguide film 300 is formed on the second surface 250B of the optically flexible substrate 250 by means of the upper fiber shell layer 301 and fills the first and second windows 307 and 308 of the optically flexible substrate 250. The upper fiber shell layer 301, the core layer 302, and the lower fiber shell layer 303 can be prepared from materials such as, but not limited to, photosensitive polyimide resin or epoxy resin with a refractive index between 1.45 and 1.6, and their thickness is, for example, but not limited to, 20 to 60 μm. The optical waveguide film 300 serves as a transmission path for optical intensity signals, and especially as a transmission path for high-speed optical intensity signals.

[0098] like Figures 1A-1B As shown, the aforementioned optically flexible substrate 250 can be prepared from a material selected from the group consisting of polyimide, metal and liquid crystal polymer (LCP).

[0099] like Figures 1A-1BAs shown, the first optoelectronic component 206A is an optical signal emitting component for converting an electrical signal into an optical intensity signal, and then emitting the optical intensity signal into the optical waveguide film 300, and the second optoelectronic component 206B is an optical signal receiving component for converting an optical intensity signal received from the optical waveguide film 300 into an electrical signal. The first inclined surface 315 in the first recess 310 acts as an optical reflector, so that the optical intensity signal emitted by the first optoelectronic component 206A into the core layer 302 can be further vertically inclined and then received by the second optoelectronic component 206B, and the second inclined surface 325 in the second recess 320 acts as another optical reflector, so that the optical intensity signal in the core layer 302 can be further vertically inclined and then received by the second optoelectronic component 206B. The first optoelectronic component 206A can be, for example but not limited to, a vertical-cavity surface-emitting laser (VCSEL) or a photo diode (PD), and the second optoelectronic component 206B can be, for example but not limited to, a vertical-cavity surface-emitting laser (VCSEL) receiver or a photo diode (PD) receiver. The first inclined surface 315 in the first recess 310 acts as an optical reflector, so that the optical intensity signal emitted by the first optoelectronic component 206A can be vertically inclined and then emitted into the core layer 302 of the optical waveguide film 300, and the second inclined surface 325 in the second recess 320 acts as another optical reflector, so that the optical intensity signal in the core layer 302 can be further vertically inclined and then received by the second optoelectronic component 206B. The first optoelectronic component 206A and the second optoelectronic component 206B can be respectively fixed on the metal pattern layer 203 in the first die-bonding area 210 and the second die-bonding area 220 through their respective bonding pads 207 in a flip-chip manner, and preferably on a surface finishing layer (not shown) on the surface of the metal pattern layer 203 in the first die-bonding area 210 and the second die-bonding area 220. The surface finishing layer (not shown) can be formed on the surface of the metal pattern layer 203 in the first die-bonding area 210 and the second die-bonding area 220 by electroplating or electroless plating, for example but not limited to chemical plating, to improve the bonding strength between the third optoelectronic component 206C, the fourth optoelectronic component 206D and the surface of the metal pattern layer 203 in the first die-bonding area 210 and the second die-bonding area 220.

[0100] Figures 1A-1BThe first flexible printed circuit board 400 shown comprising the first metal line 401 provides a flexible layout platform which can be configured for, for example, but not limited to, high-speed electrical signals (data signals), low-speed electrical signals (control signals), or auxiliary connections of power supply (DC or AC power supply), which can be, for example, a single-layer flexible printed circuit board, a double-layer flexible printed circuit board, or a multi-layer flexible printed circuit board.

[0101] As shown in Figures 1A-1B , the first slope 315 of the first groove 310 comprises an acute angle θ1 between 25 degrees and 75 degrees, and preferably an acute angle θ1 of 45 degrees, and the second slope 325 of the second groove 320 comprises an acute angle θ2 between 25 degrees and 75 degrees, and preferably an acute angle θ2 of 45 degrees. The first slope 315 in the first groove 310 acts as a light reflector so that the light intensity signal in the core layer 302 emitted by the first optoelectronic component 206A can be further vertically tilted and then received by the second optoelectronic component 206B, and the second slope 325 in the second groove 320 acts as another light reflector so that the light intensity signal in the core layer 302 can be vertically tilted and then received by the second optoelectronic component 206B.

[0102] As shown in Figure 2 , the first flexible printed circuit board 400 is formed on the optical waveguide film 300 by a first adhesive layer 405. According to other embodiments of the present application, the first flexible printed circuit board 400 can also be formed on the optical waveguide film 300 by a first anisotropic conductive film (ACF) (not shown), and / or first solder balls (not shown), and / or first metal bumps (not shown), or even used in combination with the first adhesive layer 405.

[0103] The manufacturing method of the hybrid multi-layer optical flexible printed circuit assembly 100 according to the embodiment one of the present application shown in Figures 3A-3C will be described below in cooperation with Figures 4A-4D , Figures 5A-5C , Figure 6 and Figures 1A-1B cross-sectional views. Figure 2

[0104] Please refer to Figures 3A-3C and Figure 3A . First, please refer to Figure 2 , as shown in Figure 3B ​As described in step 610 of the manufacturing method in the flowchart, an optically flexible substrate 250 having opposing first and second surfaces 250A and 250B is provided. Then, after subsequent patterning using conventional deposition, printing, photolithography, etching, and other conventional techniques, an insulating layer 202 is formed on the first surface 250A of the aforementioned optically flexible substrate 250. As mentioned earlier, the aforementioned optically flexible substrate 250 can be prepared from a material selected from the group consisting of polyimide, metal, and liquid crystal polymer (LCP). Next, please refer to... Figure 2 ,like Figure 3C As described in step 620 of the flowchart manufacturing method, a metal pattern layer 203 made of materials such as, but not limited to, copper, nickel, gold, or aluminum is formed on the aforementioned insulating layer 202 using methods such as electroplating or sputtering. A specific pattern defined by photolithography or printing technology can be transferred onto the aforementioned metal pattern layer 203 by etching technology, thereby completing the preparation of the aforementioned metal pattern layer 203. The aforementioned metal pattern layer 203 can serve as, for example, but not limited to, a bonding pad, a grounding pad (GND pad), a power line, a control signal line, or a transmission line. Next, please refer to... Figure 2 ,like Figure 4A As described in step 630 of the flowchart manufacturing method, after defining the process using conventional deposition or printing techniques and photolithography and etching techniques, a capping layer 204 is formed on the aforementioned metal pattern layer 203, and partially covers the aforementioned metal pattern layer 203. An intrinsic layer 200 having first and second die-bonding regions 210 and 220 is then formed on the first surface 250A of the aforementioned optically flexible substrate 250. As previously mentioned, the insulating layer 202 can be prepared from a dielectric material, such as, but not limited to, polyimide (PI), and its thickness is, for example, but not limited to, 3 to 70 μm. The metal pattern layer 203 can be prepared from a highly conductive metal, such as, but not limited to, copper, nickel, gold, or aluminum, and its thickness is, for example, but not limited to, 0.5 to 30 μm. The capping layer 204 may be formed from, for example but not limited to, polyimide (PI), polyethylene terephthalate (PET), photoimageable polymers, in the absence of an adhesive, or in the presence of an adhesive such as, but not limited to, pressure-sensitive adhesive (PSA), epoxy resin adhesive, or acrylic adhesive, and its thickness may be, for example but not limited to, 5 to 50 μm.

[0105] Next, please refer to Figure 2 ,like Figure 4B As described in step 640 of the manufacturing method in the flowchart, a first window 307 aligned with the aforementioned first die-bonding region 210 and a second window 308 aligned with the aforementioned second die-bonding region 220 are formed on the optically flexible substrate 250 using dry etching or wet etching techniques. Then, please refer to...Figure 2 ,like Figure 4C As described in step 650 of the manufacturing method in the flowchart, a fiber shell layer 301 is formed on the second surface 250B of the aforementioned optically flexible substrate 250 using conventional techniques such as photolithography and printing, and fills the first and second windows 307 and 308 of the aforementioned optically flexible substrate 250. Then, please refer to... Figure 2 ,like Figure 4D As described in step 660 of the manufacturing method in the flowchart, a core layer 302 is formed on a side surface of the upper fiber shell layer 301 that is different from the optically flexible substrate 250 using conventional techniques such as photolithography and printing. The core layer 302 can be patterned using conventional techniques such as photolithography and etching. Then, please refer to... Figure 2 ,like Figure 5A As described in step 670 of the manufacturing method in the flowchart, a lower fiber shell layer 303 is formed on a side surface of the aforementioned core layer 302 that is different from the aforementioned upper fiber shell layer 301 using conventional techniques such as photolithography and printing to complete an optical waveguide film 300. This waveguide film is formed on the aforementioned second surface 250B of the aforementioned optically flexible substrate 250 and fills the first and second windows 307 and 308 of the aforementioned optically flexible substrate 250. As mentioned above, the aforementioned upper fiber shell layer 301, the aforementioned core layer 302, and the aforementioned lower fiber shell layer 303 can be prepared from materials such as, but not limited to, photosensitive polyimide resin or epoxy resin with a refractive index between 1.45 and 1.6, and their thickness is, for example, but not limited to, 20 to 60 μm. The optical waveguide film 300 serves as a transmission path for light intensity signals, and particularly as a transmission path for high-speed light intensity signals.

[0106] Next, please refer to Figure 2 ,like Figure 5B As described in step 680 of the manufacturing method in the flowchart, a first flexible printed circuit board 400 is provided, formed on the aforementioned lower fiber shell layer 303 of the aforementioned optical waveguide film 300, and the aforementioned first flexible printed circuit board 400 includes a first metal line 401, a first opening 410 aligned with the aforementioned first window 307, and a second opening 420 aligned with the aforementioned second window 308. Then, please refer to... Figure 2 ,like Figure 5C As described in step 690 of the manufacturing method in the flowchart, a first flexible printed circuit board 400 is formed on the aforementioned lower fiber shell layer 303 of the aforementioned optical waveguide film 303 via a first adhesive layer 405. According to other embodiments of the present invention, the aforementioned first flexible printed circuit board 400 may also be formed on the aforementioned lower fiber shell layer 303 of the aforementioned optical waveguide film 300 via a first anisotropic conductive film (ACF) (not shown), and / or a first solder ball (not shown), and / or a first metal bump (not shown), or even in combination with the aforementioned first adhesive layer 405. Then, please refer to... Figure 2As Figures 1A-1B As described in step 700 of the flowchart of the manufacturing method, a first bevel 315 and a second bevel 325 are formed in the optical waveguide film 300 through the first and second openings 410, 420 of the first flexible printed circuit board 400 by using a known technique such as, but not limited to, laser cutting or mechanical cutting. The first bevel 315 is aligned with the first die-bonding area 210, and the second bevel 325 is aligned with the second die-bonding area 220. The first and second bevels 310, 320 are formed by penetrating the lower cladding layer 303, the core layer 302, and part of the upper cladding layer 301, respectively. As described above, the first bevel 315 of the first bevel 310 includes an acute angle θ1 of 25 to 75 degrees, and preferably an acute angle θ1 of 45 degrees. The second bevel 325 of the second bevel 320 includes an acute angle θ2 of 25 to 75 degrees, and preferably an acute angle θ2 of 45 degrees.

[0107] As described above, Figure 6 The first flexible printed circuit board 400 can be a single-layer flexible printed circuit board, a double-layer flexible printed circuit board, or a multi-layer flexible printed circuit board.

[0108] Finally, please refer to Figure 2 As Figures 1A-1B As described in step 710 of the flowchart of the manufacturing method, a first optoelectronic component 206A and a second optoelectronic component 206B are respectively fixed on the exposed metal pattern layer 203 in the first die-bonding area 210 and the second die-bonding area 220 of the intrinsic film to complete the optical subassembly 200 as shown in FIG. 2B. Figures 1A'-1C'The fabrication of the hybrid multilayer optical flexible printed circuit assembly 100 is shown. As previously described, the first optoelectronic component 206A is an optical signal transmitting component for converting an electrical signal into an optical intensity signal, and then transmitting the optical intensity signal into the optical waveguide film 300, while the second optoelectronic component 206B is an optical signal receiving component for converting an optical intensity signal received from the optical waveguide film 300 into an electrical signal. The first inclined surface 315 in the first recess 310 acts as an optical reflector, such that the optical intensity signal transmitted from the first optoelectronic component 206A into the core layer 302 can be further vertically inclined and then received by the second optoelectronic component 206B, while the second inclined surface 325 in the second recess 320 acts as another optical reflector, such that the optical intensity signal in the core layer 302 can be further vertically inclined and then received by the second optoelectronic component 206B. The first optoelectronic component 206A can be, for example but not limited to, a vertical-cavity surface-emitting laser (VCSEL) or a photo diode (PD), while the second optoelectronic component 206B can be, for example but not limited to, a vertical-cavity surface-emitting laser (VCSEL) receiver or a photo diode (PD) receiver. The first inclined surface 315 in the first recess 310 acts as an optical reflector, such that the optical intensity signal transmitted from the first optoelectronic component 206A can be vertically inclined and then transmitted into the core layer 302 of the optical waveguide film 300, while the second inclined surface 325 in the second recess 320 acts as another optical reflector, such that the optical intensity signal in the core layer 302 can be further vertically inclined and then received by the second optoelectronic component 206B. The first optoelectronic component 206A and the second optoelectronic component 206B can be flip-chip mounted on the metal pattern layer 203 in the first flip-chip region 210 and the second flip-chip region 220, respectively, through their respective bonding pads 207, and preferably on a surface finishing layer (not shown) on the surface of the metal pattern layer 203 in the first flip-chip region 210 and the second flip-chip region 220. The surface finishing layer (not shown) can be formed on the surface of the metal pattern layer 203 in the first flip-chip region 210 and the second flip-chip region 220 by electroplating or electroless plating, such as but not limited to chemical plating, to improve the bonding strength between the third optoelectronic component 206C, the fourth optoelectronic component 206D, and the surface of the metal pattern layer 203 in the first flip-chip region 210 and the second flip-chip region 220.

[0109] Example Two

[0110] This second embodiment is disclosed as follows: Figure 2 The hybrid multilayer optical flexible printed circuit assembly 100' shown is, and the aforementioned hybrid multilayer optical flexible printed circuit assembly 100' is... Figures 1A'-1C' The process shown in the flowchart is used to manufacture the product.

[0111] Please see Figure 2 as well as Figure 1A' . Figure 1B' This is a top view of a hybrid multilayer optical flexible printed circuit assembly 100' according to Embodiment 2 of the present invention. Figure 1A' Is along as Figure 1C' The section line IB-IB' in the figure shows a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 100' according to Embodiment 2 of the present invention. Figure 1A' Is along as Figures 1A'-1C' The section line IC-IC' shown is a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 100' according to Embodiment 2 of the present invention. Figures 1A-1B As shown, the hybrid multilayer optical flexible printed circuit assembly 100' disclosed in this embodiment 2 has a structure similar to that in this embodiment 1. Figures 1A'-1C' The disclosed hybrid multilayer optical flexible printed circuit assembly 100 is similar, except that the hybrid multilayer optical flexible printed circuit assembly 100' further includes a third photoelectric component 260C and a fourth photoelectric component 206D which are respectively fixedly disposed in the metal pattern layer 203 exposed in the first die-bonding region 210 and the second die-bonding region 220 of the aforementioned intrinsic film 200, and the light intensity signal emitted by the aforementioned fourth photoelectric component 206D can be received by the aforementioned third photoelectric component 206C through the aforementioned fiber core layer 302 in the aforementioned optical waveguide film 300.

[0112] like Figure 2 as well as Figure 2 As shown, the first optoelectronic component 206A and the third optoelectronic component 206C are in the following... Figure 2 In step 710 of the flowchart shown, the components are respectively fixed on the exposed metal pattern layer 203 within the first die-bonding region 210, while the second optoelectronic component 206B and the fourth optoelectronic component 206D are, as shown in the flowchart... Figures 1A'-1C'The fourth optoelectronic component 206D is an optical signal emitting component for converting an electrical signal into an optical intensity signal and then emitting the optical intensity signal into the optical waveguide film 300, and the third optoelectronic component 206C is an optical signal receiving component for converting an optical intensity signal received from the optical waveguide film 300 into an electrical signal. The fourth optoelectronic component 206D can be, for example but not limited to, a vertical-cavity surface-emitting laser (VCSEL) or a photo diode (PD), and the third optoelectronic component 206C can be, for example but not limited to, a vertical-cavity surface-emitting laser (VCSEL) receiver or a photo diode (PD) receiver. The second inclined surface 325 in the second recess 320 is another optical reflector for vertically tilting the optical intensity signal emitted by the fourth optoelectronic component 206D and then emitting the optical intensity signal into the core layer 302 of the optical waveguide film 300, and the first inclined surface 315 in the first recess 310 is an optical reflector for further vertically tilting the optical intensity signal in the core layer 302 and then receiving the optical intensity signal by the third optoelectronic component 206C.

[0113] Similarly, the third optoelectronic component 206C and the fourth optoelectronic component 206D are respectively fixed on the metal pattern layer 203 in the first die bonding area 210 and the second die bonding area 220 by flip-chip bonding through the bonding pads 207 thereof, and preferably fixed on a surface finishing layer (not shown) on the surface of the metal pattern layer 203 in the first die bonding area 210 and the second die bonding area 220. The surface finishing layer (not shown) can be formed on the surface of the metal pattern layer 203 in the first die bonding area 210 and the second die bonding area 220 by electroplating or electroless plating, for example but not limited to chemical plating, to improve the bonding strength between the third optoelectronic component 206C, the fourth optoelectronic component 206D and the surface of the metal pattern layer 203 in the first die bonding area 210 and the second die bonding area 220.

[0114] Similarly, Figures 7A-7BThe first flexible printed circuit board 400 shown comprising the first metal lines 401 provides a flexible layout platform which can be configured for, for example, but not limited to, high speed electrical signals (data signals), low speed electrical signals (control signals) or auxiliary connections for power (DC or AC power). The first flexible printed circuit board 400 can be, for example, a single layer flexible printed circuit board, a double layer flexible printed circuit board or a multi-layer flexible printed circuit board.

[0115] Embodiment Three

[0116] The present embodiment three discloses a hybrid multi-layered optical flexible printed circuit assembly 101 as shown in Figure 2 and the hybrid multi-layered optical flexible printed circuit assembly 101 is obtained by manufacturing the steps shown in the flowchart. Figures 7A-7B

[0117] Please refer to Figure 2 and Figure 7A . Figure 7B is a top view of the hybrid multi-layered optical flexible printed circuit assembly 101 according to the present embodiment three. Figure 7A is a cross-sectional view of the hybrid multi-layered optical flexible printed circuit assembly 101 according to the present embodiment three along the cross-sectional line VIIB-VIIB’ in Figures 7A-7B As shown in Figures 1A-1B , the hybrid multi-layered optical flexible printed circuit assembly 101 disclosed according to the present embodiment three is similar to the hybrid multi-layered optical flexible printed circuit assembly 100 disclosed according to the present embodiment one, with the difference that a second flexible printed circuit board 600 formed on the intrinsic film is used to replace the first flexible printed circuit board 400 formed on the optical waveguide film 300. The second flexible printed circuit board 600 comprises second metal lines 601, a third opening 610 aligned with the first window 307 and a fourth opening 620 aligned with the second window 308. The second flexible printed circuit board 600 comprising the second metal lines 601 provides a flexible layout platform which can be configured for, for example, but not limited to, high speed electrical signals (data signals), low speed electrical signals (control signals) or auxiliary connections for power (DC or AC power). Figures 7A-7B

[0118] Figures 7A-7B The second flexible printed circuit board 600 shown can be, for example, a single layer flexible printed circuit board, a double layer flexible printed circuit board or a multi-layer flexible printed circuit board.

[0119] As shown in Figures 7A-7B ​​As shown, the aforementioned second flexible printed circuit board 600 is formed on the aforementioned intrinsic film 200 by a second adhesive layer 605. According to other embodiments of the present application, the aforementioned second flexible printed circuit board 600 can also be formed on the aforementioned intrinsic film 200 by a second anisotropic conductive film (ACF), and / or second solder balls, and / or second metal bumps, or even in combination with the aforementioned second adhesive layer 605.

[0120] As shown, the aforementioned hybrid multi-layered optical flexible printed circuit assembly 101 further comprises a second connection window 501 through the aforementioned second flexible printed circuit board 600 to expose part of the metal pattern 203 on the surface of the intrinsic film 200, so that not only high-speed electrical signals can be linked between the first and second optoelectronic components 206A, 206B and external components (not shown), but also low-speed electrical signals or power lines can be linked between the terminals of the hybrid multi-layered optical flexible printed circuit assembly 101. Figures 7A'-7C' Similarly, the aforementioned first optoelectronic component 206A is an optical signal transmitting component for converting electrical signals into optical intensity signals, and then emitting the aforementioned optical intensity signals into the aforementioned optical waveguide film 300, while the aforementioned second optoelectronic component 206B is an optical signal receiving component for converting optical intensity signals received from the aforementioned optical waveguide film 300 into electrical signals. The aforementioned first inclined surface 315 in the first groove 310 acts as an optical reflector, so that the optical intensity signals emitted by the first optoelectronic component 206A into the core layer 302 can be further vertically inclined and then received by the second optoelectronic component 206B, while the aforementioned second inclined surface 325 in the second groove 320 acts as another optical reflector, so that the optical intensity signals in the core layer 302 can be vertically inclined and then received by the second optoelectronic component 206B.

[0121] Embodiment Four

[0122] The present embodiment four discloses a hybrid multi-layered optical flexible printed circuit assembly 101' as shown, and the aforementioned hybrid multi-layered optical flexible printed circuit assembly 101' is obtained by manufacturing steps shown in the flowchart.

[0123] Figure 2 As shown, the aforementioned hybrid multi-layered optical flexible printed circuit assembly 101 further comprises a second connection window 501 through the aforementioned second flexible printed circuit board 600 to expose part of the metal pattern 203 on the surface of the intrinsic film 200, so that not only high-speed electrical signals can be linked between the first and second optoelectronic components 206A, 206B and external components (not shown), but also low-speed electrical signals or power lines can be linked between the terminals of the hybrid multi-layered optical flexible printed circuit assembly 101. Figures 7A'-7C' As shown, the aforementioned hybrid multi-layered optical flexible printed circuit assembly 101 further comprises a second connection window 501 through the aforementioned second flexible printed circuit board 600 to expose part of the metal pattern 203 on the surface of the intrinsic film 200, so that not only high-speed electrical signals can be linked between the first and second optoelectronic components 206A, 206B and external components (not shown), but also low-speed electrical signals or power lines can be linked between the terminals of the hybrid multi-layered optical flexible printed circuit assembly 101.

[0124] Figure 2 As shown, the aforementioned hybrid multi-layered optical flexible printed circuit assembly 101 further comprises a second connection window 501 through the aforementioned second flexible printed circuit board 600 to expose part of the metal pattern 203 on the surface of the intrinsic film 200, so that not only high-speed electrical signals can be linked between the first and second optoelectronic components 206A, 206B and external components (not shown), but also low-speed electrical signals or power lines can be linked between the terminals of the hybrid multi-layered optical flexible printed circuit assembly 101. Figure 7A' Figure 7B' is a top view of the hybrid multi-layered optical flexible printed circuit assembly 101' shown in accordance with embodiment four of the present application. Figure 7A' is a cross-sectional view taken along as shown in Figure 7C' ​​​The section lines VIIB-VIIB' shown in the figure represent a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 101' according to Embodiment 4 of the present invention. Figure 7A' Is along as Figures 7A'-7C' The section lines VIIC-VIIC' shown are a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 101' according to Embodiment 4 of the present invention. Figures 7A-7B As shown, the hybrid multilayer optical flexible printed circuit assembly 101' disclosed in this embodiment has a structure similar to that in this embodiment. Figures 7A'-7C' The disclosed hybrid multilayer optical flexible printed circuit assembly 101 is similar, except that the hybrid multilayer optical flexible printed circuit assembly 101' further includes a third photoelectric component 260C and a fourth photoelectric component 206D, which are respectively fixedly disposed in the metal pattern layer 203 exposed in the first die-bonding region 210 and the second die-bonding region 220 of the aforementioned intrinsic film 200, and the light intensity signal emitted by the aforementioned fourth photoelectric component 206D can be received by the aforementioned third photoelectric component 206C through the aforementioned fiber core layer 302 in the aforementioned optical waveguide film 300.

[0125] like Figure 2 as well as Figure 2 As shown, the first optoelectronic component 206A and the third optoelectronic component 206C are in the following... Figure 2 In step 710 of the flowchart shown, the components are respectively fixed on the exposed metal pattern layer 203 within the first die-bonding region 210, while the second optoelectronic component 206B and the fourth optoelectronic component 206D are, as shown in the flowchart... Figures 7A'-7C'In step 710 of the flowchart shown, the components are fixedly disposed on the exposed metal pattern layer 203 within the second die-bonding region 220. The aforementioned fourth optoelectronic component 206D is a light signal emitting component used to convert an electrical signal into a light intensity signal, and then project the light intensity signal into the aforementioned optical waveguide film 300. The aforementioned third optoelectronic component 206C is a light signal receiving component used to convert the light intensity signal received from the aforementioned optical waveguide film 300 into an electrical signal. The fourth optoelectronic component 206D can be, for example, but not limited to, a vertical-cavity surface-emitting laser (VCSEL) or a photodiode (PD), while the aforementioned third optoelectronic component 206C can be, for example, but not limited to, a VCSEL receiver or a photodiode (PD) receiver. The aforementioned second inclined surface 325 in the second groove 320 serves as another light reflector, allowing the light intensity signal emitted by the fourth optoelectronic component 206D to be vertically tilted and then incident into the fiber core layer 302 of the optical waveguide layer 300. The aforementioned first inclined surface 315 in the first groove 310 also serves as a light reflector, allowing the light intensity signal in the fiber core layer 302 to be further vertically tilted and then received by the third optoelectronic component 206C.

[0126] like Figures 7A'-7C' As shown, the aforementioned hybrid multilayer optical flexible printed circuit assembly 101' further includes a second connection window 501 penetrating the aforementioned second flexible printed circuit board 600 to expose a portion of the metal pattern 203 on the surface of the intrinsic film 200, so that not only high-speed electrical signals can be linked between the first, second, third, and fourth optoelectronic components 206A, 206B, 206C, and 206D and external components (not shown), but also low-speed electrical signals or power lines can be linked between the endpoints of the hybrid multilayer optical flexible printed circuit assembly 101'.

[0127] Similarly, the third optoelectronic component 206C and the fourth optoelectronic component 206D can be fixedly disposed on the metal pattern layer 203 located in the first die-bonding region 210 and the second die-bonding region 220 respectively by flip-chip bonding through their own bonding pads 207, and preferably fixedly disposed on the surface finishing layer (not shown) located on the surface of the metal pattern layer 203 located in the first die-bonding region 210 and the second die-bonding region 220. The aforementioned surface finishing layer (not shown) can be formed on the surface of the metal pattern layer 203 located in the first die-bonding region 210 and the second die-bonding region 220 by electroplating or electroless electroplating, such as but not limited to chemical plating, to improve the bonding strength between the third optoelectronic component 206C, the fourth optoelectronic component 206D and the surface of the metal pattern layer 203 located in the first die-bonding region 210 and the second die-bonding region 220.

[0128] Similarly, Figures 8A-8B The second flexible printed circuit board 600 shown may be, for example, a single-layer flexible printed circuit board, a double-layer flexible printed circuit board, or a multi-layer flexible printed circuit board.

[0129] Example 5

[0130] This fifth embodiment discloses as follows: Figure 2 The hybrid multilayer optical flexible printed circuit assembly 102 shown is, and the aforementioned hybrid multilayer optical flexible printed circuit assembly 102 is... Figures 8A-8B The process shown in the flowchart is used to manufacture the product.

[0131] Please see Figure 2 as well as Figure 8A . Figure 8B This is a top view of a hybrid multilayer optical flexible printed circuit assembly 102 according to Embodiment 5 of the present invention. Figure 8A Is along as Figures 8A-8B The section lines VIIIB-VIIIB' depicted in the figure represent a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 102 according to Embodiment 5 of the present invention. Figures 1A-1B As shown, the hybrid multilayer optical flexible printed circuit assembly 102 disclosed in this embodiment has a structure similar to that in this embodiment. Figure 2 The disclosed hybrid multilayer optical flexible printed circuit assembly 100 is similar, the only difference being in Figures 8A-8BSteps 680-690 of the flowchart further include forming a second flexible printed circuit board 600 on the aforementioned intrinsic film. The second flexible printed circuit board 600 includes a second metal line 601, a third opening 610 aligned with the aforementioned first window 307, and a fourth opening 620 aligned with the aforementioned second window 308. The second flexible printed circuit board 600 including the second metal line 601 can provide a flexible layout platform, which can be configured for auxiliary connections for, for example, but not limited to, high-speed electrical signals (data signals), low-speed electrical signals (control signals), or power supplies (DC or AC power).

[0132] Similarly, Figures 8A-8B The first flexible printed circuit board 400 shown may be, for example, a single-layer flexible printed circuit board, a double-layer flexible printed circuit board, or a multi-layer flexible printed circuit board.

[0133] like Figures 8A-8B As shown, the aforementioned second flexible printed circuit board 600 is formed on the aforementioned intrinsic film 200 by means of a second adhesive layer 605. According to other embodiments of the present invention, the aforementioned second flexible printed circuit board 600 may also be formed on the aforementioned intrinsic film 200 by means of a second anisotropic conductive film (ACF), and / or a second solder ball, and / or a second metal bump, or even in combination with the aforementioned second adhesive layer 605.

[0134] like Figures 8A'-8C' As shown, the aforementioned hybrid multilayer optical flexible printed circuit assembly 101 further includes a first connection window 500 penetrating the aforementioned intrinsic film 200, the aforementioned optical flexible substrate 250, and the aforementioned waveguide film 300 to expose a portion of the first metal line 401 on the surface of the first flexible printed circuit board 400, so that power, high-speed electrical signals, and low-speed electrical signals can be coupled between the first printed circuit board and the input / output port (not shown), respectively. It also includes a second connection window 501 penetrating the aforementioned second flexible printed circuit board 600 to expose a portion of the metal pattern 203 on the surface of the intrinsic film 200, so that not only high-speed electrical signals can be linked between the first and second optoelectronic components 206A, 206B and external components (not shown), but low-speed electrical signals or power lines can also be linked between the endpoints of the hybrid multilayer optical flexible printed circuit assembly 102.

[0135] Similarly, the aforementioned first optoelectronic component 206A is a light signal emitting component used to convert electrical signals into light intensity signals, and then project the light intensity signals into the aforementioned optical waveguide film 300. The aforementioned second optoelectronic component 206B is a light signal receiving component used to convert the light intensity signals received from the aforementioned optical waveguide film 300 into electrical signals. The aforementioned first inclined surface 315 in the first groove 310 acts as a light reflector, allowing the light intensity signals projected by the first optoelectronic component 206A into the fiber core layer 302 to be further vertically tilted and then received by the second optoelectronic component 206B. The aforementioned second inclined surface 325 in the second groove 320 acts as another light reflector, allowing the light intensity signals in the fiber core layer 302 to be vertically tilted and then received by the second optoelectronic component 206B.

[0136] Example 6

[0137] This sixth embodiment discloses as follows: Figure 2 The hybrid multilayer optical flexible printed circuit assembly 102' shown is, and the aforementioned hybrid multilayer optical flexible printed circuit assembly 102' is... Figures 8A'-8C' The process shown in the flowchart is used to manufacture the product.

[0138] Please see Figure 2 as well as Figure 8A' . Figure 8B' This is a top view of a hybrid multilayer optical flexible printed circuit assembly 102' according to Embodiment Six of the present invention. Figure 8A' Is along as Figure 8C' The section lines VIIIB-VIIIB' shown in the figure represent a cross-sectional view of the hybrid multilayer optical flexible printed circuit assembly 102' according to Embodiment 6 of the present invention. Figure 8A' Is along as Figures 8A'-8C' The section lines VIIIC-VIIIC' depicted in the figure are cross-sectional views of the hybrid multilayer optical flexible printed circuit assembly 102' according to Embodiment Six of the present invention. Figures 8A-8B As shown, the hybrid multilayer optical flexible printed circuit assembly 102' disclosed in Embodiment Six has a structure similar to that in Embodiment Five. Figures 8A'-8C' The disclosed hybrid multilayer optical flexible printed circuit assembly 102 is similar, except that the hybrid multilayer optical flexible printed circuit assembly 102' further includes a third photoelectric component 260C and a fourth photoelectric component 206D, which are respectively fixedly disposed in the metal pattern layer 203 exposed in the first die-bonding region 210 and the second die-bonding region 220 of the aforementioned intrinsic film 200, and the light intensity signal emitted by the aforementioned fourth photoelectric component 206D can be received by the aforementioned third photoelectric component 206C through the aforementioned fiber core layer 302 in the aforementioned optical waveguide film 300.

[0139] likeFigure 2 and Figure 2 As shown in FIG. 6, the first optoelectronic component 206A and the third optoelectronic component 206C are fixedly disposed on the exposed metal pattern layer 203 in the first die-bonding region 210 in step 710 of the flowchart shown in FIG. 7, while the second optoelectronic component 206B and the fourth optoelectronic component 206D are fixedly disposed on the exposed metal pattern layer 203 in the second die-bonding region 220 in step 710 of the flowchart shown in FIG. 7. Figure 2 As shown in FIG. 6, the first optoelectronic component 206A and the third optoelectronic component 206C are fixedly disposed on the exposed metal pattern layer 203 in the first die-bonding region 210 in step 710 of the flowchart shown in FIG. 7, while the second optoelectronic component 206B and the fourth optoelectronic component 206D are fixedly disposed on the exposed metal pattern layer 203 in the second die-bonding region 220 in step 710 of the flowchart shown in FIG. 7. Figures 8A'-8C' As shown in FIG. 6, the first optoelectronic component 206A and the third optoelectronic component 206C are fixedly disposed on the exposed metal pattern layer 203 in the first die-bonding region 210 in step 710 of the flowchart shown in FIG. 7, while the second optoelectronic component 206B and the fourth optoelectronic component 206D are fixedly disposed on the exposed metal pattern layer 203 in the second die-bonding region 220 in step 710 of the flowchart shown in FIG. 7. The fourth optoelectronic component 206D is a light signal emitting component for converting an electrical signal into a light intensity signal, and then emitting the light intensity signal into the optical waveguide film 300, while the third optoelectronic component 206C is a light signal receiving component for converting a light intensity signal received from the optical waveguide film 300 into an electrical signal. The fourth optoelectronic component 206D can be, for example but not limited to, a vertical-cavity surface-emitting laser (VCSEL) or a photo diode (PD), while the third optoelectronic component 206C can be, for example but not limited to, a vertical-cavity surface-emitting laser (VCSEL) receiver or a photo diode (PD) receiver. The second inclined surface 325 in the second groove 320 serves as another light reflector, so that the light intensity signal emitted by the fourth optoelectronic component 206D can be vertically inclined and then emitted into the core layer 302 of the optical waveguide film 300, while the first inclined surface 315 in the first groove 310 also serves as a light reflector, so that the light intensity signal in the core layer 302 can be further vertically inclined and then received by the third optoelectronic component 206C.

[0140] As shown in FIG. 6, the first optoelectronic component 206A and the third optoelectronic component 206C are fixedly disposed on the exposed metal pattern layer 203 in the first die-bonding region 210 in step 710 of the flowchart shown in FIG. 7, while the second optoelectronic component 206B and the fourth optoelectronic component 206D are fixedly disposed on the exposed metal pattern layer 203 in the second die-bonding region 220 in step 710 of the flowchart shown in FIG. 7. Figures 8A'-8C' As shown in FIG. 6, the first optoelectronic component 206A and the third optoelectronic component 206C are fixedly disposed on the exposed metal pattern layer 203 in the first die-bonding region 210 in step 710 of the flowchart shown in FIG. 7, while the second optoelectronic component 206B and the fourth optoelectronic component 206D are fixedly disposed on the exposed metal pattern layer 203 in the second die-bonding region 220 in step 710 of the flowchart shown in FIG. 7.

[0141] Similarly, the third optoelectronic component 206C and the fourth optoelectronic component 206D can be flip-chip mounted on the metal pattern layer 203 in the first die-bonding region 210 and the second die-bonding region 220, respectively, through the bonding pads 207 thereof, and preferably on a surface finishing layer (not shown) on the surface of the metal pattern layer 203 in the first die-bonding region 210 and the second die-bonding region 220. The aforementioned surface finishing layer (not shown) can be formed on the surface of the metal pattern layer 203 in the first die-bonding region 210 and the second die-bonding region 220 by electroplating or electroless plating, such as but not limited to chemical plating, to improve the bonding strength between the third optoelectronic component 206C, the fourth optoelectronic component 206D and the surface of the metal pattern layer 203 in the first die-bonding region 210 and the second die-bonding region 220.

[0142] Similarly, ​ The first and second flexible printed circuit boards 400, 600 shown can be, for example, a single-layer flexible printed circuit board, a double-layer flexible printed circuit board or a multi-layer flexible printed circuit board.

[0143] As mentioned above, the high alignment accuracy between the aforementioned intrinsic film 200 and the aforementioned optical waveguide layer 300 can be achieved by photolithography and printing techniques. In addition, the aforementioned first flexible printed circuit board 400 can be formed on the aforementioned optical waveguide layer 300 by the aforementioned first adhesive layer 405, and / or a first anisotropic conductive film (not shown), and / or first solder balls (not shown), and / or first metal bumps (not shown), and / or the aforementioned second flexible printed circuit board 600 can be formed on the aforementioned intrinsic film 200 by the aforementioned second adhesive layer 605, and / or a first anisotropic conductive film (not shown), and / or second solder balls (not shown), and / or second metal bumps (not shown), so that the technology of highly accurately aligning the first flexible printed circuit board 400 with the intrinsic film 200 and / or the technology of highly accurately aligning the aforementioned second flexible printed circuit board 600 with the intrinsic film 200 is not required. Therefore, the aforementioned hybrid multi-layer optical flexible printed circuit assembly 100, 100', 101, 101', 102 and 102' can be suitable for supporting high-speed Internet and high-definition video and 3D image and game access and a wider range of radio frequency (RF) functional applications, such as Wi-Fi, Bluetooth, WLAN, GPS, GSM and other mobile devices, such as but not limited to smart phones, notebook computers or tablet computers.

[0144] Although the present application has been disclosed in the form of preferred embodiments as above, it will be understood that any modifications thereof, and any further applications thereof within the spirit and scope of the present application are intended to be within the scope of the following claims.

Claims

1. A hybrid multilayer optically flexible printed circuit assembly, characterized in that, include: An optically flexible substrate includes a first window and a second window, and the aforementioned optically flexible substrate has opposing first and second surfaces; An intrinsic film is formed on the first surface of the aforementioned optically flexible substrate. The intrinsic film includes a first die-bonding region and a second die-bonding region, with the first die-bonding region aligned with the first window and the second die-bonding region aligned with the second window. An optical waveguide film is formed on the aforementioned second surface of the aforementioned optical flexible substrate and fills the aforementioned first and second windows of the aforementioned optical flexible substrate. The aforementioned optical waveguide film includes a first groove having a first slope and aligned with the aforementioned first die-bonding region, and a second groove having a second slope and aligned with the aforementioned second die-bonding region. A first flexible printed circuit board is formed on the aforementioned optical waveguide film, and the aforementioned first flexible printed circuit board includes a first metal line, a first opening aligned with the aforementioned first window and a second opening aligned with the aforementioned second window, and / or a second flexible printed circuit board is formed on the aforementioned intrinsic film, and the aforementioned second flexible printed circuit board includes a second metal line, a third opening aligned with the aforementioned first window and a fourth opening aligned with the aforementioned second window. as well as A first optoelectronic component and a second optoelectronic component are respectively fixedly disposed in the first crystal bonding region and the second crystal bonding region of the aforementioned intrinsic film; The first optoelectronic component is used to convert an electrical signal into a light intensity signal and to project the light intensity signal into the optical waveguide film, while the second optoelectronic component is used to convert the light intensity signal received from the optical waveguide film into an electrical signal.

2. The hybrid multilayer optically flexible printed circuit assembly as described in claim 1, characterized in that, The aforementioned intrinsic film includes an insulating layer, a metal pattern layer formed on the aforementioned insulating layer, and a cover layer formed on the aforementioned metal pattern layer and partially covering the aforementioned metal pattern layer. The aforementioned intrinsic film is formed on the aforementioned first surface of the aforementioned optically flexible substrate by means of the aforementioned insulating layer, and the aforementioned metal pattern layer located in the aforementioned first and second die-bonding regions is exposed.

3. The hybrid multilayer optical flexible printed circuit assembly as described in claim 2, characterized in that, It further includes a first connection window that penetrates the aforementioned intrinsic film, the aforementioned optical flexible substrate, and the aforementioned optical waveguide film to expose a portion of the aforementioned first metal line located on the aforementioned first flexible printed circuit board, and / or a second connection window that penetrates the aforementioned second flexible printed circuit board to expose a portion of the metal pattern layer located on the aforementioned intrinsic film.

4. The hybrid multilayer optically flexible printed circuit assembly as described in claim 1, characterized in that, The aforementioned optical waveguide film includes: an upper fiber shell layer, a lower fiber shell layer, and a core layer sandwiched between the upper fiber shell layer and the lower fiber shell layer. The first and second grooves respectively penetrate the lower fiber shell layer, the core layer, and a portion of the upper fiber shell layer. The optical waveguide film is formed on the second surface of the optically flexible substrate through the upper fiber shell layer and fills the first and second windows of the optically flexible substrate.

5. The hybrid multilayer optically flexible printed circuit assembly as described in claim 2, characterized in that, The aforementioned optically flexible substrate can be prepared from a material selected from the group consisting of polyimide, metal and liquid crystal polymer.

6. The hybrid multilayer optically flexible printed circuit assembly as described in claim 2, characterized in that, It further includes a third optoelectronic component and a fourth optoelectronic component, which are respectively fixedly disposed in the first die-bonding region and the second die-bonding region of the aforementioned intrinsic film. The fourth optoelectronic component is used to convert electrical signals into light intensity signals and to project the light intensity signals into the aforementioned optical waveguide film. The third optoelectronic component is used to convert the light intensity signals received from the aforementioned optical waveguide film into electrical signals.

7. The hybrid multilayer optically flexible printed circuit assembly as described in claim 6, characterized in that, The first and fourth optoelectronic components mentioned above are independent optical signal transmitting components, while the second and third optoelectronic components mentioned above are independent optical signal receiving components.

8. The hybrid multilayer optically flexible printed circuit assembly as claimed in claim 1, characterized in that, The aforementioned first flexible printed circuit board and / or the aforementioned second flexible printed circuit board are single-layer, double-layer or multi-layer printed circuit boards.

9. The hybrid multilayer optically flexible printed circuit assembly as claimed in claim 1, characterized in that, The aforementioned first inclined plane includes an acute angle θ1 with an angle between 25 degrees and 75 degrees, and the aforementioned second inclined plane includes an acute angle θ2 with an angle between 25 degrees and 75 degrees.

10. The hybrid multilayer optically flexible printed circuit assembly as claimed in claim 1, characterized in that, The aforementioned first flexible printed circuit board is formed on the aforementioned optical waveguide film by means of a first adhesive layer, and / or a first anisotropic conductive film, and / or a first solder ball, and / or a first metal pattern, and / or the aforementioned second flexible printed circuit board is formed on the aforementioned intrinsic film by means of a second adhesive layer, and / or a second anisotropic conductive film, and / or a second solder ball, and / or a second metal pattern.

11. A method for manufacturing a hybrid multilayer optically flexible printed circuit assembly, characterized in that, Includes the following steps: An optically flexible substrate is provided, having opposing first and second surfaces; An intrinsic film is formed on the first surface of the aforementioned optically flexible substrate, the aforementioned intrinsic film comprising a first die-bonding region and a second die-bonding region. A first and a second window are formed on the aforementioned optically flexible substrate, respectively aligned with the aforementioned first and second die-bonding regions; An optical waveguide film is formed on the aforementioned second surface of the aforementioned optical flexible substrate and fills the aforementioned first and second windows of the aforementioned optical flexible substrate; A first flexible printed circuit board is formed on the aforementioned optical waveguide film, and the aforementioned first flexible printed circuit board includes a first metal line, a first opening aligned with the aforementioned first window and a second opening aligned with the aforementioned second window, and / or a second flexible printed circuit board is formed on the aforementioned intrinsic film, and the aforementioned second flexible printed circuit board includes a second metal line, a third opening aligned with the aforementioned first window and a fourth opening aligned with the aforementioned second window. A first groove having a first bevel and aligned with the first die-bonding region and a second groove having a second bevel and aligned with the second die-bonding region are formed on the aforementioned optical waveguide film; and A first photoelectric component and a second photoelectric component are respectively fixedly disposed in the first die-bonding region and the second die-bonding region of the aforementioned intrinsic film; The first optoelectronic component is used to convert an electrical signal into a light intensity signal and to project the light intensity signal into the optical waveguide film, while the second optoelectronic component is used to convert the light intensity signal received from the optical waveguide film into an electrical signal.

12. The method for manufacturing a hybrid multilayer optically flexible printed circuit assembly as described in claim 11, characterized in that, The aforementioned intrinsic film includes an insulating layer, a metal pattern layer formed on the aforementioned insulating layer, and a cover layer formed on the aforementioned metal pattern layer and partially covering the aforementioned metal pattern layer. The aforementioned intrinsic film is formed on the aforementioned first surface of the aforementioned optically flexible substrate by means of the aforementioned insulating layer, and the aforementioned metal pattern layer located in the aforementioned first and second die-bonding regions is exposed.

13. The method of manufacturing a hybrid multilayer optically flexible printed circuit assembly as described in claim 12, characterized in that, It further includes a first connection window that penetrates the aforementioned intrinsic film, the aforementioned optical flexible substrate, and the aforementioned optical waveguide film to expose a portion of the aforementioned first metal line located on the aforementioned first flexible printed circuit board, and / or a second connection window that penetrates the aforementioned second flexible printed circuit board to expose a portion of the metal pattern layer located on the aforementioned intrinsic film.

14. The method for manufacturing a hybrid multilayer optically flexible printed circuit assembly as described in claim 11, characterized in that, The aforementioned optical waveguide film includes: an upper fiber shell layer, a lower fiber shell layer, and a core layer sandwiched between the upper fiber shell layer and the lower fiber shell layer. The first and second grooves respectively penetrate the lower fiber shell layer, the core layer, and a portion of the upper fiber shell layer. The optical waveguide film is formed on the second surface of the optically flexible substrate through the upper fiber shell layer and fills the first and second windows of the optically flexible substrate.

15. The method of manufacturing a hybrid multilayer optically flexible printed circuit assembly as claimed in claim 11, characterized in that, The aforementioned optically flexible substrate can be prepared from a material selected from the group consisting of polyimide, metal and liquid crystal polymer.

16. The method of manufacturing a hybrid multilayer optically flexible printed circuit assembly as claimed in claim 11, characterized in that, It further includes a step of fixing a third optoelectronic component and a fourth optoelectronic component to the first die-bonding region and the second die-bonding region of the intrinsic film, respectively. The fourth optoelectronic component is used to convert an electrical signal into a light intensity signal and to project the light intensity signal into the optical waveguide film. The third optoelectronic component is used to convert the light intensity signal received from the optical waveguide film into an electrical signal.

17. The method of manufacturing a hybrid multilayer optically flexible printed circuit assembly as claimed in claim 11, characterized in that, The aforementioned first flexible printed circuit board and / or the aforementioned second flexible printed circuit board are single-layer, double-layer or multi-layer printed circuit boards.

18. The method of manufacturing a hybrid multilayer optically flexible printed circuit assembly as claimed in claim 11, characterized in that, The aforementioned first and second grooves are prepared by laser cutting or mechanical cutting through the aforementioned first and second openings, respectively.

19. The method of manufacturing a hybrid multilayer optically flexible printed circuit assembly as claimed in claim 11, characterized in that, The aforementioned first inclined plane includes an acute angle θ1 with an angle between 25 degrees and 75 degrees, and the aforementioned second inclined plane includes an acute angle θ2 with an angle between 25 degrees and 75 degrees.

20. The method of manufacturing a hybrid multilayer optically flexible printed circuit assembly as claimed in claim 11, characterized in that, The aforementioned first flexible printed circuit board is formed on the aforementioned optical waveguide film by means of a first adhesive layer, and / or a first anisotropic conductive film, and / or a first solder ball, and / or a first metal pattern, and / or the aforementioned second flexible printed circuit board is formed on the aforementioned intrinsic film by means of a second adhesive layer, and / or a second anisotropic conductive film, and / or a second solder ball, and / or a second metal pattern.

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