Packaging tool, industrial glue injection machine and packaging method

Abstract

The invention relates to a packaging tool, an industrial glue injection machine and a packaging method. The packaging tool comprises a packaging plate, a clamping unit, and a surface of the packaging plate is provided with a plurality of packaging hole groups distributed at intervals. Each packaging hole group comprises a plurality of packaging holes with the same inner diameter and depth, and the packaging holes in different packaging hole groups have different inner diameters and depths. The clamping unit is detachable and can be selectively installed at different positions of the packaging plate. A plurality of workpieces can be clamped at intervals by the clamping unit, and a plurality of workpieces can be simultaneously inserted into a group of packaging holes for packaging. After the first packaging layer of the workpiece is packaged, the clamping unit is moved to a position so that the plurality of workpieces are simultaneously inserted into the next group of packaging holes with the same inner diameter and depth for glue coating packaging, thereby completing the packaging of different packaging layers, ensuring the uniformity of the size and shape of each packaging layer of the workpiece, reducing the uncertain factors introduced by artificial packaging, and ensuring the consistency of packaging.

Description

Technical Field

[0001] The invention belongs to the field of optical fiber sensing, and in particular relates to a packaging tool, an industrial glue injection machine and a packaging method. Background Art

[0002] Fiber optic fluorescence temperature measurement technology is one of the important technologies in the field of point-type fiber optic temperature measurement. It utilizes the advantages of the fiber itself, such as passivity, corrosion resistance, and anti-interference, combined with the passive and temperature-sensitive characteristics of fluorescent materials, to achieve high-precision temperature monitoring under harsh working conditions. A large number of engineering applications have been carried out in the power, petrochemical and other industries. Among them, the fiber optic fluorescence probe is a temperature-sensitive unit with a temperature-sensitive fluorescent material inside. However, due to the thin core diameter of the optical fiber (generally ≤300μm), the attachment and protection of the fluorescent material on the end face of the optical fiber is one of the key technologies in the field of fiber optic fluorescence temperature measurement. The preparation of the fiber optic fluorescence probe must not only meet the effective attachment of the fluorescent material on the end face of the optical fiber, but also ensure that the fluorescent material is not affected by the external environment and its performance changes under long-term working conditions, thereby improving the life and reliability of the fiber optic fluorescence temperature measurement system.

[0003] At present, the fiber optic fluorescence probe is mainly bonded, and the method of manual glue coating is basically adopted. Due to the thin core diameter of the optical fiber, the manual glue coating method has the following problems: (1) the shape and size of the manually glued probe vary greatly; (2) the thickness of each glue layer is uneven; (3) due to the insufficient viscosity of the glue, after the glue coating is completed, when the probe to be cured is transferred to the grill or oven for high-temperature curing, it is easy to cause glue flow, which affects the packaging quality, brings more uncertainty to the use and effect of the fiber optic fluorescence probe, seriously affects the consistency of different fiber optic fluorescence probes, and may cause the accuracy of the fiber optic fluorescence sensing system to decrease or even fail. Summary of the invention

[0004] Based on this, it is necessary to provide a packaging tool, an industrial glue injection machine including the packaging tool, and a packaging method using the packaging tool to address the problems of poor consistency of the existing manual glue coating method of fiber optic fluorescent probes, which leads to large differences in the shape and size of the probes, uneven thickness of the glue layer, and easy glue flow during high-temperature curing.

[0005] According to one aspect of the present application, a packaging tool is provided, comprising: a packaging plate having at least two packaging hole groups spaced apart and distributed along a first direction, each of the packaging hole groups comprising at least one packaging hole, the packaging hole being used to accommodate a packaging material; and

[0006] A clamping unit is detachably mounted on the packaging plate, the clamping unit has a clamping gap, and the clamping gap extends along a second direction intersecting the first direction;

[0007] The clamping unit can be selectively installed at different positions of the packaging plate, so that the clamping gap is selectively arranged corresponding to a group of the packaging hole groups.

[0008] In one of the embodiments, each group of the packaging hole groups includes a plurality of the packaging holes, and the plurality of the packaging holes in each group of the packaging hole groups are arranged at intervals along a third direction; the third direction intersects the first direction and the second direction at the same time; the diameters and inner diameters of all the packaging holes in the same group of the packaging hole groups are the same, and the inner diameters and / or depths of the packaging holes in at least two groups of the packaging hole groups are different.

[0009] In one embodiment, the clamping unit includes a substrate and at least one clamp assembly. The substrate is detachably mounted on the surface of the packaging plate where the packaging hole is opened. Each clamp assembly is mounted on the substrate and defines together with the substrate to form the clamping gap.

[0010] In one embodiment, the clamp assembly comprises:

[0011] A bracket, penetrating the substrate along the first direction;

[0012] A fixing plate, mounted on one end of the bracket, wherein the fixing plate and the base plate define the clamping gap;

[0013] a positioning element, mounted on an end of the bracket away from the fixing plate; and

[0014] The elastic element is sleeved on the bracket and supported between the positioning element and the substrate. The elastic element can be deformed in a restorable manner along the third direction under the action of an external force.

[0015] In one embodiment, the substrate has a first buffer layer on a side facing the fixing plate, and the fixing plate has a second buffer layer on a side facing the substrate, and the clamping gap is formed between the first buffer layer and the second buffer layer.

[0016] In one of the embodiments, the packaging board is further provided with a temperature sensor component installation groove and a temperature sensor component wiring groove, the temperature sensor component installation groove is located on the surface of the packaging board where the packaging hole is provided, one end of the temperature sensor component wiring groove is connected to the edge of the packaging board, and the other end of the temperature sensor component wiring groove is connected to the temperature sensor component installation groove.

[0017] According to another aspect of the present application, a packaging method using the above packaging tool is provided, comprising the following steps:

[0018] Injecting packaging material into the packaging holes of the packaging board;

[0019] A workpiece is clamped and one end of the workpiece is immersed in the packaging material to form a packaging material layer.

[0020] In one embodiment, the packaging plate includes three groups of packaging hole groups, and the three groups of packaging hole groups are respectively injected with a first packaging material, a second packaging material, and a third packaging material; the step of clamping the workpiece and immersing one end of the workpiece into the packaging material to form a packaging material layer specifically includes the following steps:

[0021] Clamping the workpiece and immersing one end of the workpiece into the first packaging material to form a first packaging layer;

[0022] Clamping the workpiece and immersing one end of the workpiece into the second packaging material to form a second packaging layer wrapping the first packaging layer;

[0023] The workpiece is clamped and one end of the workpiece is immersed in the third packaging material to form a third packaging layer that wraps the second packaging layer.

[0024] In one embodiment, the step of clamping the workpiece and immersing one end of the workpiece into the packaging material to form the packaging material layer further comprises the following steps:

[0025] The encapsulation material is cured to form the encapsulation material layer.

[0026] According to another aspect of the present application, an industrial glue injection machine including the above-mentioned packaging tooling is provided.

[0027] The above-mentioned packaging tooling arranges packaging hole groups of different sizes on the packaging plate, and installs clamp assemblies at intervals on the clamping unit to clamp the optical fiber, so that the optical fiber can be inserted into one group of packaging hole groups for packaging, and then inserted into the next group of packaging hole groups for packaging at the same time, thereby ensuring that the size and shape of each adhesive layer of the optical fiber are uniform. In addition, in the high-temperature curing process, there is no need to take the optical fiber out of the packaging hole, but the tooling as a whole is placed in a high-temperature environment, thereby reducing the occurrence of glue flow. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of the present invention. For ordinary technicians in this field, drawings of other embodiments can be obtained based on these drawings without paying creative work.

[0029] Figure 1 and Figure 2 A three-dimensional schematic diagram of a packaging tool provided by an embodiment of the present invention at two angles;

[0030] Figure 3 A three-dimensional schematic diagram of a packaging board provided by an embodiment of the present invention;

[0031] Figure 4 A schematic diagram of the packaging structure of an optical fiber fluorescence probe provided by an embodiment of the present invention;

[0032] Figure 5 A three-dimensional schematic diagram of a clamping unit provided in an embodiment of the present invention;

[0033] Figure 6 A three-dimensional schematic diagram of a substrate in a clamping unit provided by an embodiment of the present invention;

[0034] Figure 7 A three-dimensional schematic diagram of a clamp assembly in a clamping unit provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0036] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “liquid level”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0037] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature has a higher liquid level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower liquid level than the second feature.

[0040] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "liquid horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0041] Combination Figures 1 to 7 As shown, an embodiment of the present invention provides an industrial glue injection machine (not shown in the figure), including a packaging tool, which is used to apply glue to package the workpiece.

[0042] The following uses the packaging tooling of the optical fiber fluorescent probe as an example to illustrate the structure of the packaging tooling in the present application. This embodiment is only used as an example and does not limit the technical scope of the present application. It can be understood that in other embodiments, the packaging tooling can also be used for packaging tools of other workpieces, which is not limited here.

[0043] like Figure 1 and Figure 2As shown, the packaging tool 10 includes a packaging plate 100 and a clamping unit 300. A side surface of the packaging plate 100 has a plurality of packaging hole groups for accommodating packaging materials, and each packaging hole group includes at least one packaging hole. The clamping unit 300 is detachably mounted on the packaging plate 100. The clamping unit 300 has a clamping gap for clamping the optical fiber 210. The clamping unit 300 can be selectively mounted at different positions of the packaging plate 100 so that the clamping gap is selectively arranged opposite to a group of packaging holes.

[0044] In this way, one end of the optical fiber 210 is clamped and fixed by the clamping unit 300 , and the other end of the optical fiber 210 is inserted into a packaging hole of any group of packaging holes to be immersed in the packaging material, thereby forming a packaging layer covering the optical fiber 210 .

[0045] Specifically, in some embodiments, Figure 3 As shown, the package board 100 is in a cubic shape with a certain thickness, the width direction of the package board 100 is the first direction, the thickness direction of the package board 100 is the second direction, the length direction of the package board 100 is the third direction, and the first direction, the second direction and the third direction intersect each other. As a preferred embodiment, the first direction, the second direction and the third direction are perpendicular to each other. Figure 1 and Figure 2 As shown, the coordinate axis X direction shown in the figure is the first direction, the Y direction is the second direction, and the Z direction is the third direction. The first direction, the second direction and the third direction are perpendicular to each other.

[0046] A surface of one side of the packaging board 100 along the second direction has a plurality of packaging hole groups arranged at intervals along the first direction, each packaging hole group includes a plurality of packaging holes, and the shape of the packaging holes is preferably cylindrical. The plurality of packaging holes in each packaging hole group are arranged at intervals along the third direction, and the diameters and inner diameters of all packaging holes in the same packaging hole group are the same, and the inner diameters and / or depths of the packaging holes of at least two groups of packaging hole groups are different, so that while ensuring that the size of the packaging material layer formed by the same group of packaging hole groups is consistent, packaging material layers of different sizes can be formed by different packaging hole groups on the same packaging tooling.

[0047] Specifically, in some embodiments, the packaging board 100 has three groups of packaging hole groups, namely a first packaging hole group 110, a second packaging hole group 120 and a third packaging hole group 130. The three groups of packaging hole groups are arranged in sequence according to the inner diameter and depth. The inner diameter and depth of multiple packaging holes in each packaging hole group are the same, and the number of packaging holes in each packaging hole group is preferably four.

[0048] like Figure 4As shown, the first packaging hole group 110, the second packaging hole group 120, and the third packaging hole group 130 are respectively used to form the first packaging layer 220, the second packaging layer 230, and the third packaging layer 240 of the optical fiber fluorescence probe 20, wherein the first packaging layer 220 serves to attach the fluorescent material to the end face of the optical fiber 210, the second packaging layer 230 serves to reflect the fluorescent signal, and the third packaging layer 240 serves to protect the internal packaging layer of the optical fiber 210.

[0049] Specifically, since the diameter of the optical fiber 210 used for fluorescence temperature measurement is usually ≤300μm, the inner diameter of each packaging hole in the first packaging hole group 110 is at least 0.8mm to ensure that the end face of the optical fiber 210 can be completely wrapped, and has a certain depth to achieve the effect of full coverage of the end face. The design concept of the second packaging hole group 120 and the third packaging hole group 130 is similar to that of the first packaging hole group 110. The inner diameter and depth of the packaging holes in the first packaging hole group 120, the second packaging hole group 130 and the third packaging hole group 130 increase successively, so as to ensure that the outer packaging material fully covers the inner packaging material.

[0050] Preferably, the inner diameter of the packaging holes in the first packaging hole group 110 is 0.8 mm to 1.0 mm, the inner diameter of the packaging holes in the second packaging hole group 120 is 1.2 mm to 1.5 mm, and the inner diameter of the packaging holes in the third packaging hole group 130 is 1.8 mm to 2.5 mm; the depth of the packaging holes in the first packaging hole group 110 is 3 mm to 5 mm, the depth of the packaging holes in the second packaging hole group 120 is 6 mm to 8 mm, and the depth of the packaging holes in the third packaging hole group 130 is 9 mm to 13 mm. The design size of the above packaging holes is conducive to improving the packaging consistency of the fluorescent probe.

[0051] Please continue reading Figure 3 The thickness of the packaging plate 100 is slightly greater than the depth of the third packaging hole group 130 to prevent the packaging material in the third packaging hole group 130 from leaking out. In addition, the thickness should not be too large to ensure the effective transfer of the external temperature during curing. Preferably, in some embodiments, the thickness of the packaging plate 100 is 15 to 17 mm.

[0052] In some embodiments, the packaging board 100 is provided with a plurality of packaging board mounting holes 140 for fixing the clamping unit 300 on the surface having the packaging holes, each packaging board mounting hole 140 is preferably a cylindrical through hole, each packaging board mounting hole 140 penetrates the packaging board 100 along the second direction, and all packaging board mounting holes 140 have the same diameter.

[0053] Specifically, in some embodiments, the packaging board 100 includes three groups of packaging board mounting hole groups, and the three groups of packaging board mounting hole groups are spaced apart along the third direction, each group of packaging board mounting hole groups includes four packaging board mounting holes 140, each group of packaging board mounting hole groups is located on one side of a group of packaging hole groups in the first direction, and a line connecting the center points of each packaging board mounting hole 140 in each group of packaging board mounting hole groups is parallel to a line connecting the center points of each packaging hole in each group of packaging hole groups.

[0054] In some embodiments, the packaging plate 100 has connection holes 150 at four corners on the surface with the packaging holes for connecting an external heating device. It is understood that the number and position of the connection holes 150 are not limited and can be set as needed to meet different connection requirements.

[0055] In some embodiments, the packaging tooling 10 also includes a temperature sensor component, and the surface of the packaging board 100 having the packaging hole also has a temperature sensor component installation groove 160 and a temperature sensor component wiring groove 170. The temperature sensor component installation groove 160 and the temperature sensor component wiring groove 170 are interconnected and are used to install the temperature sensor component and lead out the temperature sensor component connecting wire.

[0056] Specifically, there are preferably two temperature sensor assembly mounting grooves 160, one of which is located between the first packaging hole group 110 and the second packaging hole group 120, and the other is located between the second packaging hole group 120 and the third packaging hole group 130. The cross section of each temperature sensor assembly mounting groove 160 is rectangular. It can be understood that the shape of the temperature sensor assembly mounting groove 160 is not limited, as long as it matches the shape of the temperature sensor assembly.

[0057] Correspondingly, there are preferably two temperature sensor component wiring grooves 170, one end of each temperature sensor component wiring groove 170 is connected to a corresponding temperature sensor component mounting groove 160, and the other end of the temperature sensor component wiring groove 170 extends along the third direction to the edge of the packaging board 100, and is connected to an end face of the packaging board 100 along the third direction to form a notch on the end face.

[0058] In this way, two temperature sensor components are installed in the temperature sensor component installation groove 160, one end of the temperature sensor component connecting wire is connected to the temperature sensor component, and the other end of the temperature sensor component connecting wire is placed in the temperature sensor component wiring groove 170, and is led out from the packaging board 100 along the temperature sensor component wiring groove 170 for connecting an external temperature measuring device.

[0059] Preferably, the temperature sensing component can be a thermocouple or a thermal resistor type temperature sensitive device. Considering the thermal conductivity of the material, the actual temperature of the packaging board 100 may be different from the set temperature of the grill or oven. By providing a temperature sensing component installation groove 160 and a temperature sensing component wiring groove 170 on the packaging board 100 to install the temperature sensing component, the curing temperature can be monitored in real time, which helps to accurately set the curing temperature.

[0060] In some embodiments, preferably, the packaging plate 100 is made of polytetrafluoroethylene, mainly by utilizing two characteristics of polytetrafluoroethylene. First, polytetrafluoroethylene is an excellent anti-sticking material, which makes it extremely difficult to adhere to the surface of other objects. Therefore, it is conducive to demolding after the packaging material is cured, and reduces the operation of filling the packaging hole with a release agent. Especially for the fluorescent probe packaging application, the packaging hole size is small, the process of adding a release agent is difficult, and the operation precision requirement is high. Second, the working temperature range of polytetrafluoroethylene is wide, and it can be used for a long time at a high temperature of 260°C, which can meet the high temperature curing requirements of most packaging materials, and the packaging plate 100 made of this material can be used repeatedly.

[0061] In some embodiments, Figure 5 to Figure 6 As shown, the clamping unit 300 includes a substrate 310 and at least one clamp assembly 330. The substrate 310 is a cubic structure, and the substrate 310 is detachably mounted on the packaging board 100 through the packaging board mounting hole 140. The clamp assembly 330 is mounted on the substrate 310, and the clamp assembly 330 and the substrate 310 together form a clamping gap along the second direction, and the central axis of the clamping gap extending along the second direction is coaxially arranged with the central axis of one packaging hole, so that one end of the optical fiber 220 clamped in the clamping gap can be inserted into the packaging hole along the second direction to be immersed in the packaging material.

[0062] Specifically, in one embodiment, there are preferably four clamp components 330, and the four clamp components 330 are installed at intervals along the third direction on a surface of the substrate 310 along the first direction, so that the four clamp components 330 and the substrate 310 are jointly defined to form four clamping gaps spaced and distributed along the third direction, and the four clamping gaps are coaxial with each packaging hole of one group of packaging holes and are arranged opposite to each other. In this way, the four optical fibers 210 are respectively clamped in the clamping gaps between one clamp component 330 and the substrate 310, and are simultaneously inserted into the four packaging holes in one group of packaging holes.

[0063] Specifically in one embodiment, Figure 6As shown, the thickness of the substrate 310 is less than the length and width of the substrate 310, and its thickness direction is consistent with the first direction. The surface of the substrate 310 along the first direction is provided with a plurality of substrate through-hole groups, and each substrate through-hole group is spaced apart along the third direction. At the same time, on a surface of the substrate 310 along the first direction, in the middle of each substrate through-hole group, there is also a long strip-shaped substrate boss 312, and the length direction of the substrate boss 312 is consistent with the second direction. In addition, an end face of the substrate 310 along the second direction is also provided with a plurality of spaced apart substrate mounting holes 314, which correspond to the packaging board mounting holes 140 in each packaging board mounting hole group on the packaging board 100, so as to connect the clamping unit 300 with the packaging board 100.

[0064] In one embodiment, if Figure 7 As shown, the clamp assembly 330 includes a fixing plate 331, a bracket 332, an elastic element 333 and a positioning element 334. The fixing plate 331 is a cubic plate structure with a certain thickness. The thickness of the fixing plate 331 is much smaller than the length and width of the fixing plate 331. The thickness direction of the fixing plate 331 is consistent with the thickness direction of the substrate 310. A side surface of the fixing plate 331 has a long strip-shaped fixing plate boss 3311 extending along the second direction, corresponding to a substrate boss 312 on the substrate 310. There are multiple brackets 332, and one end of each bracket 332 is fixedly arranged on a side of the fixing plate 331 where the fixing plate boss 3311 is arranged.

[0065] Specifically in one embodiment, the bracket 332 is cylindrical, the number of the brackets 332 is four, and the four brackets 332 are distributed in an array on the surface of the fixing plate 331, and two brackets 332 form a group and are respectively located on opposite sides of the fixing plate boss 3311 in the third direction. The positioning element 334 is preferably a screw with a gasket, which is threadedly connected to one end of the bracket 332 away from the fixing plate 331. The elastic element 333 is preferably a spring, which is sleeved outside the bracket 332 along the first direction and is located between the positioning element 334 and the fixing plate 331.

[0066] In this way, the bracket 332 can pass through a group of substrate through-hole groups to connect the clamp assembly 330 to the substrate 310, one end of the elastic element 333 contacts the positioning element 334, and the other end abuts against a surface of the substrate 310 away from the fixed plate 331. The elastic element 333 can undergo a recoverable deformation along the first direction under the action of an external force to apply a force on the positioning element 334 away from the substrate 310.

[0067] When installing the optical fiber 220 to the packaging tool 10, the user can use the elastic force of the elastic element 333 to pull the fixing plate 331 along the first direction to insert the optical fiber 210 into the gap between the substrate boss 312 and the fixing plate boss 3311, and then loosen the fixing plate 331 so that the fixing plate boss 3311 and the substrate boss 312 clamp the optical fiber 210. Since multiple clamp assemblies 330 can be installed on the substrate 310, the clamping unit 300 can clamp multiple optical fibers 210 at the same time. Preferably, in one embodiment, the substrate 310 has four groups of substrate through-hole groups, and correspondingly, the substrate 310 can be fixedly installed with four clamp assemblies 330, so that four optical fibers 210 can be clamped at the same time for packaging.

[0068] Since the core diameter of the optical fiber 210 is relatively thin (generally ≤300 μm), the optical fiber 210 is very fragile and easily damaged. In some embodiments, a first buffer layer 313 is provided on the side of the substrate boss 312 close to the fixing plate 331, and a second buffer layer 3312 is provided on the side of the fixing plate boss 3311 close to the substrate 310. The above-mentioned clamping gap is formed between the first buffer layer 313 and the second buffer layer 3312. The optical fiber 210 is fixed between the first buffer layer 313 and the second buffer layer 3312, which can protect the coating layer and cladding of the optical fiber 210 and prevent the optical fiber 210 from being damaged by the mechanical clamping effect of the optical fiber fixing bracket 332 or the optical fiber clamp assembly 330. Preferably, in one embodiment, the buffer layer material is foam or silicone flat pad.

[0069] It should be noted that, since the substrate 310 and the fixture assembly 330 are not in direct contact with the packaging material, there is no problem of demoulding, so the material of the substrate 310 and the fixture assembly 330 can be selected from polytetrafluoroethylene or aluminum alloy.

[0070] Through the above structure and installation method, the packaging board 100 is provided with multiple groups of packaging board mounting hole groups and multiple groups of packaging hole groups, and the base plate 310 of the clamping unit 300 is provided with base plate mounting holes 314 corresponding to the packaging board mounting holes 140. By screwing into the packaging board mounting holes 140 and the base plate mounting holes 314 with screws, the entire clamping unit 300 can be detachably installed at different positions of the packaging board 100, so that multiple optical fibers 210 can be simultaneously inserted into packaging holes of different sizes, thereby completing the packaging of different layers of packaging materials. In some embodiments, the packaging material is preferably glue. In the high-temperature curing process, it is not necessary to remove the optical fiber fluorescence probe 20 from the packaging hole, but to place the tooling as a whole in a high-temperature environment, which can effectively reduce the occurrence of glue flow.

[0071] Specifically, when assembling the packaging tool 10, the clamp assembly 330 is first fixedly installed on the substrate 310. The specific steps are: insert the bracket 332 of the clamp assembly 330 through the substrate through hole 311 of the substrate 310, tighten the gasket screw 334 of the clamp assembly 330, complete the installation of the clamp assembly 330 on the substrate 310, and then complete the installation of other clamp assemblies 330 on the substrate 310, so as to complete the installation of the clamp unit 300. Then, the substrate mounting hole 314 of the substrate 310 in the clamp unit 300 is coaxially aligned with the packaging board mounting hole 140 in the corresponding group of packaging board mounting holes of the packaging board 100, and the screw is screwed in to complete the installation of the clamp unit 300 and the packaging board 100. In this way, the packaging tool 10 is installed.

[0072] When the optical fiber fluorescence probe 20 is packaged using the above-mentioned packaging tool 10, the specific steps are as follows:

[0073] Step 1: Prepare each layer of packaging material and inject it into the corresponding holes.

[0074] Specifically, the first packaging material, the second packaging material, and the third packaging material are respectively configured, and each type of packaging material is correspondingly injected into the first packaging hole group 110, the second packaging hole group 120, and the third packaging hole group 130 through a syringe or a dispensing machine. In the process of injecting the packaging material, it is necessary to first place the needle of the syringe or the dispensing machine at the bottom of the corresponding packaging hole, slowly inject the packaging material, and slowly lift the needle of the syringe or the dispensing machine according to the injection speed until the packaging material fills each packaging hole, and the packaging material at the upper surface of each packaging hole is hemispherical due to surface tension.

[0075] Step 2: Prepare the fiber end face. Use a fiber cleaver or fiber scriber to process the end face of the optical fiber 210 into a flat end face. Before cutting, use dust-free paper dipped in alcohol or acetone to gently wipe the end of the optical fiber 210 to be cut, and the cut optical fiber 210 needs to be installed on the packaging tooling 10 in time to avoid contamination of the optical fiber end face.

[0076] Step 3: Install the two temperature sensor components in the temperature sensor component installation groove 160 respectively, connect the temperature sensor components to the wires, and lead the temperature sensor component connecting wires out of the temperature sensor component wiring groove 170 to connect to the external temperature measuring device.

[0077] Step 4: Pull the fixed plate 331 in the clamp assembly 330, and use the elastic force of the spring 333 to increase the width of the clamping gap between the clamp assembly 330 and the substrate 310, insert the optical fiber 210 from the gap between the fixed plate boss 3311 and the substrate boss 312, then release the fixed plate 331, insert the front end of an optical fiber 210 into a packaging hole in the first packaging hole group 110, and then use the elastic force of the spring 333 to bring the fixed plate boss 3311 and the substrate boss 312 closer to clamp the optical fiber 210, and use the same method to insert the remaining optical fibers 210 into the corresponding packaging holes in the first packaging hole group 110, and clamp them in other clamp assemblies 330 of the clamping unit 300.

[0078] Step 5: Place the packaging tool 10 as a whole on a grill or in an oven to perform high-temperature curing on the packaging material. During the curing process, monitor the measurement value of the temperature sensor component located in the temperature sensor component installation groove 160 in real time. According to the measurement value, reasonably adjust the temperature of the grill or oven so that the packaging plate 100 reaches the required curing temperature of the packaging material, and the first packaging material in the packaging hole forms a first packaging layer 220 that wraps the optical fiber 210.

[0079] Step 6: Remove the packaging tool 10 from the grill or oven, and after cooling to room temperature, pull the fixing plate 331 in the clamp assembly 330 to pull out the optical fiber 210. At this time, the packaging of the first packaging layer 220 of the optical fiber 210 is completed.

[0080] Step seven: Remove the clamping unit 300 from one set of packaging board mounting hole groups of the packaging board 100, and then install the clamping unit 300 at another set of packaging board mounting hole groups next to the second packaging hole group 120, and insert multiple optical fibers 210 into the second packaging hole group 120 of the packaging board 100 at the same time.

[0081] Repeat steps 5 and 6, and the second packaging material in the packaging hole forms a second packaging layer 230 that wraps the first packaging layer 220; after the optical fiber 210 is taken out of the clamping unit 300, repeat steps 4 to 6, and the third packaging material in the packaging hole forms a third packaging layer 240 that wraps the second packaging layer 230.

[0082] Step eight: remove the packaging tool 10 from the grill or oven, cool it to room temperature, pull open the fixing plate 331 in the clamp assembly 330, and pull out the optical fiber 210, thereby completing the packaging of the optical fiber fluorescent probe 20.

[0083] In some embodiments, preferably, the first packaging material, the second packaging material, and the third packaging material are: fluorescent glue, titanium dioxide glue, and sealant. The fluorescent glue adopts a high-temperature resistant silicon-based high-refractive index packaging material or a high-refractive index epoxy resin packaging material, and is mixed with phosphor powder; the titanium dioxide glue adopts a high-temperature resistant silicon-based high-refractive index packaging material or a high-refractive index epoxy resin packaging material, and is mixed with titanium dioxide powder; the sealant adopts a high-temperature resistant and opaque epoxy resin structural glue. When configuring each layer of packaging material, it is necessary to perform degassing treatment in advance, that is, each packaging material solution is placed in a vacuum degassing machine for about half an hour; the first packaging material is mixed with the phosphor by mass, the mass ratio is about 1:1, and after mixing, it is stirred evenly and left to stand for about half an hour; the second packaging material is mixed with the titanium dioxide powder by mass, the mass ratio is about 1:1, and after mixing, it is stirred evenly and left to stand for about half an hour; after the third packaging material is degassed, it is taken out of the vacuum degassing machine and left to stand for about half an hour.

[0084] The packaging tool 10 provided by the present invention can be structurally expanded according to production needs, and can be used in conjunction with industrial glue injection machines, large ovens and other equipment to facilitate mass production of optical fiber fluorescent probes. The process method is simple, and the tool can be used repeatedly. At the same time, compared with the manual packaging method, the packaging method provided by the present invention has fewer uncertain factors introduced by human operation, ensuring the consistency of the fluorescent probe packaging.

[0085] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The above-mentioned embodiment only expresses one implementation mode of the present invention, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the attached claims.

Claims

1. A packaging tool, characterized in that: include: A packaging plate, comprising at least two packaging hole groups spaced apart and distributed along a first direction, each of the packaging hole groups comprising at least one packaging hole, and the packaging hole is used to accommodate packaging materials; as well as A clamping unit, comprising a substrate and at least one clamping assembly, wherein the substrate is detachably mounted on the surface of the packaging plate where the packaging hole is opened; the clamping assembly comprises a bracket, a fixing plate, a positioning element and an elastic element; the bracket is arranged on the substrate along the first direction; the fixing plate is mounted on one end of the bracket and defines a clamping gap with the substrate, the clamping gap extends along a second direction intersecting the first direction, and the central axis of the clamping gap extending along the second direction is coaxially arranged with the central axis of one of the packaging holes; the positioning element is mounted on one end of the bracket away from the fixing plate; the elastic element is sleeved on the bracket and abuts between the positioning element and the substrate, and the elastic element can undergo a recoverable deformation under the action of an external force; The clamping unit can be selectively installed at different positions of the packaging plate, so that the clamping gap is selectively arranged corresponding to a group of the packaging hole groups.

2. The packaging tool according to claim 1, characterized in that: Each group of the packaging hole groups includes a plurality of the packaging holes, and the plurality of the packaging holes in each group of the packaging hole groups are arranged at intervals along a third direction; the third direction intersects the first direction and the second direction at the same time; the diameters and inner diameters of all the packaging holes in the same group of the packaging hole groups are the same, and the inner diameters and / or depths of the packaging holes in at least two groups of the packaging hole groups are different.

3. The packaging tool according to claim 1, characterized in that: The substrate has a first buffer layer on a side facing the fixing plate, and the fixing plate has a second buffer layer on a side facing the substrate. The clamping gap is formed between the first buffer layer and the second buffer layer.

4. The packaging tool according to claim 1, characterized in that: The packaging board is also provided with a temperature sensor component installation groove and a temperature sensor component wiring groove. The temperature sensor component installation groove is located on the surface of the packaging board where the packaging hole is provided. One end of the temperature sensor component wiring groove is connected to the edge of the packaging board, and the other end of the temperature sensor component wiring groove is connected to the temperature sensor component installation groove.

5. A packaging method using the packaging tool as claimed in any one of claims 1 to 4, characterized in that: The following steps are involved: Injecting packaging material into the packaging holes of the packaging board; A workpiece is clamped and one end of the workpiece is immersed in the packaging material to form a packaging material layer.

6. The packaging method according to claim 5, characterized in that: The packaging plate comprises three groups of packaging hole groups, and the three groups of packaging hole groups are respectively injected with a first packaging material, a second packaging material and a third packaging material; The step of clamping the workpiece and immersing one end of the workpiece into the packaging material to form a packaging material layer specifically includes the following steps: Clamping the workpiece and immersing one end of the workpiece into the first packaging material to form a first packaging layer; Clamping the workpiece and immersing one end of the workpiece into the second packaging material to form a second packaging layer wrapping the first packaging layer; The workpiece is clamped and one end of the workpiece is immersed in the third packaging material to form a third packaging layer that wraps the second packaging layer.

7. The packaging method according to claim 6, characterized in that: The step of clamping the workpiece and immersing one end of the workpiece into the packaging material to form a packaging material layer also includes the following steps: The encapsulation material is cured to form the encapsulation material layer.

8. An industrial glue injection machine, characterized in that: The packaging tool comprises the packaging tool as claimed in any one of claims 1 to 4.

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