Substrate support for adsorbing a mask used in a deposition process

Abstract

Embodiments of the present disclosure include methods and apparatus for electrostatically coupling a mask to a substrate support in a deposition chamber. In one embodiment, a substrate support is disclosed, the substrate support comprising: a substrate receiving surface; a recessed portion disposed around a periphery of the substrate receiving surface; an electrostatic chuck disposed below the substrate receiving surface; and a plurality of compressible buttons disposed within corresponding openings formed in the recessed portion that form an electrical circuit with the electrostatic chuck.

Description

[0001] background

[0002] field

[0003] Embodiments of the present disclosure relate to methods and apparatus for securing masks utilized in deposition processes, such as plasma enhanced chemical vapor deposition (PECVD) processes or atomic layer deposition (ALD) processes used in the manufacture of electronic devices. In particular, embodiments of the present disclosure relate to securing metal shadow masks utilized in encapsulation processes in the manufacture of organic light emitting diode (OLED) display devices using PECVD and / or ALD processes.

[0004] Description of related technologies

[0005] Organic light emitting diodes (OLEDs) are used to manufacture television screens, computer monitors, mobile phones, other handheld devices, etc. for displaying information. A typical OLED may include layers of organic materials disposed between two electrodes, all deposited on a substrate in a manner to form a matrix display panel with pixels that can be individually powered. The OLED is generally placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED in the glass panels.

[0006] Many challenges are encountered in the manufacture of such display devices. In some manufacturing steps, OLED materials are encapsulated in one or more layers to prevent moisture from damaging the OLED materials. During these processes, one or more masks are used to shield the portion of the substrate that does not include the OLED material. In order to control deposition, the mask is carefully positioned relative to the substrate. The masks used in these processes are typically metals or metal alloys with relatively low thermal expansion coefficients. However, during processing, the mask is typically misaligned and / or misplaced relative to the substrate. Misalignment or misalignment generally means that the mask is not close to the substrate. When the mask is so misaligned and / or misplaced, a shadow effect occurs on the substrate and / or an erroneous coating is formed under the mask. One or both of the aforementioned problems can cause problems, one of which is the "mura effect" or "clouding" of part of the final display product.

[0007] Therefore, there is a need for methods and apparatus for improving the positioning of masks during the formation of OLED display devices.

[0008] Overview

[0009] Embodiments of the present disclosure include methods and apparatus for electrostatically coupling a mask to a substrate support in a deposition chamber. In one embodiment, a substrate support is disclosed, the substrate support comprising: a substrate receiving surface; a recessed portion disposed around a periphery of the substrate receiving surface; an electrostatic chuck disposed below the substrate receiving surface; and a plurality of compressible buttons disposed within corresponding openings formed in the recessed portion that form an electrical circuit with the electrostatic chuck.

[0010] In another embodiment, a substrate support is disclosed, comprising: a body comprising a conductive material; a substrate receiving surface comprising a dielectric layer adhered to the body, wherein the body comprises a recessed portion disposed around a periphery of the substrate receiving surface; an electrostatic chuck disposed below the substrate receiving surface; and a plurality of compressible buttons disposed within corresponding openings formed in the recessed portion that form an electrical circuit with the electrostatic chuck.

[0011] In another embodiment, a substrate support is disclosed, comprising: a body comprising a conductive material; a substrate receiving surface comprising a dielectric layer adhered to the body, wherein the body comprises a recessed portion disposed around a periphery of the substrate receiving surface, and the substrate receiving surface comprises a groove pattern; an electrostatic chuck disposed in the dielectric layer below the substrate receiving surface; and a plurality of compressible buttons disposed within corresponding openings formed in the recessed portion that form an electrical circuit with the electrostatic chuck.

[0012] BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order that the manner in which the above-described features may be understood in detail, a more particular description of the embodiments of the present disclosure briefly summarized above may be obtained by reference to the embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only typical embodiments and are therefore not to be considered limiting of the scope of the present disclosure, as the present disclosure may admit to other equally effective embodiments.

[0014] Figure 1 is a schematic cross-sectional view of a plasma enhanced chemical vapor deposition (PECVD) chamber according to one embodiment.

[0015] Figure 2 is Figure 1 An exploded isometric view of the internal chamber components used in the chamber body of a PECVD chamber.

[0016] Figure 3 is a cross-sectional side view of one embodiment of a portion of a substrate support as disclosed herein.

[0017] Figure 4A-4C are schematic cross-sectional views of portions of a substrate support and an electrostatic chuck having different electrical configurations.

[0018] Figure 5A is a cross-sectional side view of a portion of a substrate support according to another embodiment.

[0019] Figure 5B yes Figure 5A An enlarged view of the substrate support.

[0020] Figure 6 is a cross-sectional view of a portion of a body of a substrate support and a mask frame showing one embodiment of a compressible button.

[0021] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation.

[0022] Specific instructions

[0023] Embodiments of the present disclosure include methods and apparatus for electrically grounding a shadow mask used in a deposition chamber. The mask can be used in a plasma enhanced chemical vapor deposition (PECVD) process chamber, which is operable to align the mask relative to a substrate, position the mask on the substrate, and deposit an encapsulation layer on an OLED material formed on the substrate. The embodiments described herein can be used with other types of process chambers and are not limited to use with PECVD process chambers. The embodiments described herein can be used with other types of deposition processes and are not limited to use for encapsulating OLEDs formed on substrates. The embodiments described herein can be used with masks and substrates of various types, shapes, and sizes. In addition, suitable chambers that can benefit from the masks disclosed herein can be obtained from AKT America, Inc., Santa Clara, CA, a subsidiary of Applied Materials, Inc., Santa Clara, CA, in Santa Clara, California.

[0024] Figure 11 is a schematic cross-sectional view of a PECVD chamber 100 according to one embodiment. The PECVD chamber 100 includes a chamber body 102 having an opening 104 through one or more walls to allow one or more substrates 106 and a mask 108 to be inserted into the chamber body 102. The substrate 106 is disposed on a substrate support 110 opposite a diffuser 113 during processing. The substrate support 110 includes a substrate receiving surface 112 having a plurality of grooves 115 formed therein. The plurality of grooves 115 are used to provide a backside gas to the substrate 106 positioned on the plurality of grooves 115. The backside gas from the plurality of grooves 115 achieves temperature uniformity of the substrate 106 positioned on the substrate support 110. The backside gas is provided by a gas source 129. The gas is provided to the grooves 115 through a conduit disposed in a rod 130 supporting the substrate support 110.

[0025] The diffuser 113 has one or more openings 114 formed therethrough to allow a process gas or process material to enter a process space 116 between the diffuser 113 and the substrate 106. The process material may be a silicon-containing gas, an aluminum-containing gas, a polymer material, and a carrier gas and / or a reactive gas that forms an encapsulation layer on the OLED device formed on the substrate 106.

[0026] Substrate 106 can be used to form an OLED display, wherein the OLED is formed on the surface of substrate 106 by a sequential deposition process in PECVD chamber 100. Substrate 106 can be a glass substrate, a polymer substrate, or other suitable materials for forming electronic devices. Substrate 106 can be rigid or flexible. Substrate 106 can be used to form a single display or multiple displays. Each display includes multiple OLEDs, which are coupled to an electrical contact layer formed around the periphery of each display. During manufacturing, the OLED portion of each display is encapsulated in one or more layers to protect the OLED from environmental influences. The layer may contain one or a combination of silicon nitride, aluminum oxide and / or polymer materials. The encapsulation material can be deposited in PECVD chamber 100 by a PECVD process. Mask 108 is used to shield the electrical contact layer of the OLED during the deposition of the encapsulation material. Mask 108 includes a mask frame 118 and a plurality of open areas or grooves 121. The size of each groove 121 can be set according to the size of the OLED portion of each display. The encapsulation material is deposited on the OLED portion of each display through the groove 121. Outside and between each trench 121 is a strip 120 which shields the electrical contact layers during the packaging process.

[0027] The substrate support 110 further includes a heater 117 that heats the substrate 106 positioned on the substrate support 110. The substrate support 110 further includes an electrode 119. The electrode 119 is used to attract the substrate 106 and / or the mask 108 to the substrate support 110. The electrode 119 is configured as an electrostatic chuck that is used to fix the mask 108 relative to the substrate 106. The electrode 119 is coupled to a power supply 127.

[0028] One or more compressible couplers 125 may be used to align the mask 108 relative to the substrate support 110. The mask 108, including the mask frame 118 and the strips 120, is made of a conductive material, such as a metal alloy material. In one embodiment, the mask 108 comprises a material having a low coefficient of thermal expansion. Examples of metal alloys include Alloy (Ni-Co) and Alloy (Ni-Fe). The substrate support 110 may be made of a conductive material such as aluminum. In one implementation, the compressible coupler 125 may be made of a conductive material that functions to electrically couple the mask 108 to the substrate support 110. Thus, electrons accumulated on the substrate 106 and / or the mask 108 during the PECVD process may be transferred to a ground potential through or on the mask 108, the compressible coupler 125, and the substrate support 110.

[0029] For processing, the mask 108 is initially inserted into the PECVD chamber 100 through the opening 104 and disposed on a plurality of kinematic alignment elements 122. The substrate support 110 is disposed on rods 130 coupled to an actuator 123. The lifting of the substrate support 110 in the PECVD chamber 100 may be controlled by the actuator 123. When the substrate support 110 is lowered to a level adjacent to the opening 104, the substrate 106 may be inserted through the opening 104 and disposed on a plurality of lifting pins 124 extending through the substrate support 110. The substrate support 110 is then raised to meet the substrate 106 so that the substrate 106 is supported on the substrate support 110. The substrate 106 may be aligned while on the substrate support 110.

[0030] Once the substrate 106 is aligned on the substrate support 110, the one or more visualization systems 126 determine whether the mask 108 is properly aligned over the substrate 106. If the mask 108 is not properly aligned, the one or more actuators 128 move the one or more kinematic alignment elements 122 to adjust the position of the mask 108 relative to the substrate support 110. The one or more visualization systems 126 may then recheck the alignment of the mask 108 to verify the alignment.

[0031] Once the mask 108 is properly aligned over the substrate 106, the mask 108 is lowered onto the substrate 106 and the substrate support 110 is raised until the shadow frame 132 contacts the mask 108. Prior to resting on the mask 108, the shadow frame 132 is disposed in the chamber body 102 on ledges 134 extending from one or more interior walls of the chamber body 102. The substrate support 110 continues to be raised until the substrate 106, mask 108, and shadow frame 132 are disposed in a processing position relative to the diffuser 113.

[0032] Once the mask 108 is properly aligned, the electrode 119 is energized to effectively fix the mask 108 relative to the substrate 106. Then, a process material is delivered from one or more gas sources 136 through an opening formed in the backing plate 138, while an electrical bias is provided to the diffuser 113 to form a plasma in the processing space 116 between the diffuser 113 and the substrate 106. Alternatively, a remote plasma source 140 may excite the process gas, which is then delivered from the one or more gas sources 136 to provide plasma to the processing space 116. The temperature during processing may be from about 80 degrees Celsius (° C.) to about 100° C. or higher.

[0033] It is desirable to have good contact between the mask 108 and the substrate 106 in order to control the deposition of the encapsulation layer and / or prevent "shadow" effects at the edges of the slots 121. For example, the strips 120 should fall directly onto the substrate 106 to contain the encapsulation material during deposition. The substrate support 110 using the electrodes 119 as disclosed herein promotes contact between the mask 108 and the substrate 106 to prevent insufficient contact between the mask 108 and the substrate 106.

[0034] When there is insufficient contact between the mask 108 and the substrate 106, the encapsulation material may cover the portion of the substrate 106 that should be shielded by the mask 108. However, the electrode 119 minimizes or eliminates any insufficient contact between the mask 108 and the substrate 106. The enhanced contact between the mask 108 and the substrate 106 minimizes shadow and / or mura effects, which increases yield. The enhanced contact between the mask 108 and the substrate 106 also enables a narrow bezel or zero bezel around the OLED display on the substrate 106.

[0035] Figure 2 is Figure 1 An exploded isometric view of the internal chamber components used in the chamber body 102 of the PECVD chamber 100 of FIG. Figure 2The substrate 106 is decomposed from the substrate support 110, but the substrate 106 rests on the substrate receiving surface 112 of the substrate support 110 during processing. The substrate support 110 is typically made of aluminum material. The substrate receiving surface 112 includes an electrostatic chuck 200 (having an electrode 119 ( Figure 1 )). The electrostatic chuck 200 includes a plurality of grooves 115 for backside gas application.

[0036] The recessed surface 202 is disposed below the plane of the substrate receiving surface 112 of the substrate support 110. The recessed surface 202 includes a plurality of compressible couplers 125. In one embodiment, each of the compressible couplers 125 can be a compressible button 205. The substrate 106 is at least partially covered by the mask 108, and the shadow frame 132 at least partially covers the mask 108. The shadow frame 132 is typically made of an aluminum material. The mask 108 and the shadow frame 132 may include dimensions greater than about 0.5 meters (m) in length by 0.5 m in width. An opening 210 is shown in the substrate support 110 for allowing one or more kinematic alignment elements 122 ( Figure 1 ) is inserted into the substrate 106 to extend through the opening 210 and contact the mask 108 and / or move the mask 108 relative to the substrate 106 to ensure proper alignment between the substrate 106 and the mask 108.

[0037] The mask frame 118 also includes a first side 215 on the lower surface of the mask frame 118 and a second side 220 opposite the first side 215. The second side 220 may include a plurality of recesses 225 that cooperate with protrusions (not shown) on the lower surface of the shadow frame 132. The recesses 225 and the protrusions (not shown) facilitate the transition position and alignment of the shadow frame 132 with the mask 108. The first side 215 is connected to the second side wall 220 by the first outer side wall 230. The shadow frame 118 also includes a raised area 235 protruding from the plane of the second side 220. The strip 120 is coupled to the upper surface of the raised area 235. The strip 120 may be a substantially planar rectangular member fastened to the mask frame 118. Together, the strips 120 form a mask sheet 240 having a slot 121 formed therethrough. The strip 120 projects inwardly from the raised area 235 in a plane that is substantially parallel to the plane of one or both of the first side 215 and the second side 220 .

[0038] Figure 3 is a cross-sectional side view of one embodiment of a portion of a substrate support 110 as disclosed herein. A mask sheet 240 is shown coupled to the mask frame 118 and positioned over the substrate 106. The shadow frame 132 is Figure 31. Shown in FIG. 1 is a shadow frame 132 positioned over the recessed surface 202 of the substrate support 110, with a portion of the mask frame 118 positioned over an edge of the substrate 106. The positions of the substrate 106, mask 108, and shadow frame 132 depict processing positions for a packaging process.

[0039] The substrate support 110 includes a body 300 made of a conductive material such as titanium or aluminum. An electrostatic chuck 305 is disposed on an upper surface of the body 300. The electrostatic chuck 305 is essentially composed of one (or more) dielectric layers and an electrode 119 embedded in the electrostatic chuck 305. A plurality of grooves 115 are embossed or otherwise formed in the upper surface of the dielectric material of the electrostatic chuck 305.

[0040] The substrate support 110 also includes one of the compressible buttons 205 positioned in a pocket 310 formed in the recessed surface 202. The pocket 310 is sized to receive the mask frame 118 of the mask 108. In one implementation, if the compressible button 205 has dielectric properties, the compressible button 205 comprises a ceramic material. In other implementations, if conductive properties are desired, the compressible button 205 is a ceramic with a metallic coating or a conductive coating. The compressible button 205 is biased by a spring (not shown) to provide a gap 320 between the recessed surface 202 and the surface of the mask frame 118. The gap 320 prevents electrical continuity between the mask frame 118 and the approaching surface of the substrate support 110.

[0041] Additionally, Figure 3 The assembly shown in FIG. 1 includes a plurality of compressible rest buttons 315. One of the compressible rest buttons 315 is positioned on the recessed surface 202 of the substrate support 110 outside the compressible button 205 and / or the recess 310. Another of the compressible rest buttons 315 is positioned between the mask 108 and the shadow frame 132. All of the compressible rest buttons 315 include a dielectric material, such as a ceramic material. Although in FIG. Figure 3 Only two compressible shelf buttons 315 are shown in the view of FIG. 3 , but a plurality of compressible shelf buttons 315 are included.

[0042] Figure 4A-4C is a schematic cross-sectional view of a portion of a substrate support 110 as described herein. In addition to different circuits for holding the mask 108 using the electrostatic chuck 305, Figure 4A-4C The substrate support 110 shown in FIG. 1 is similar to the substrate support 110 .

[0043] exist Figure 4A , the compressible button 205 is conductive so that a negative voltage can be applied to the mask 108 and a positive voltage is applied to the electrode 119.

[0044] exist Figure 4B , the compressible button 205 is conductive so that a positive voltage is applied to the electrode 119 and the mask 108 is grounded.

[0045] exist Figure 4C In FIG. 1 , the compressible button 205 is dielectric, causing the mask 108 to electrically float when a positive voltage is applied to the electrode 119 .

[0046] For example Figure 4A-4C The testing of the substrate support 110 shown in FIG. produced different results. Although in all Figure 4A-4C In , electrodes 119 are all positively charged, but the potential of mask 108 is different, which results in the removal of any non-uniform effects. However, other criteria are considered, as detailed below.

[0047] When the mask 108 is Figure 4A When negatively charged as shown in , the adsorption force is stronger than other configurations (in the presence or absence of plasma), but the desorption is slower than other configurations.

[0048] When the mask 108 is Figure 4B When grounded as shown in , the adsorption force is milder than in other configurations (in the presence or absence of plasma), but the desorption is the fastest compared to other configurations.

[0049] When the mask 108 is Figure 4C When electrically floating as shown in , the minimum adsorption force is observed in the absence of plasma. Figure 4C In the configuration, the adsorption force is stronger in the presence of plasma than in Figure 4B In addition, in the Figure 4C In the test of the configuration, the desorption ratio Figure 4A The configuration shown in is faster, but slower than Figure 4B The configuration shown in is slow.

[0050] Figure 5A is a cross-sectional side view of a portion of a substrate support 110 according to another embodiment. Figure 5B yes Figure 5A FIG. 1 is an enlarged view of the substrate support 110 .

[0051] exist Figure 5A, an edge 500 of a substrate receiving surface 112 of a substrate support 110 is shown. Portions of a plurality of grooves 115 are shown on the substrate receiving surface 112 of the substrate support 110. The edge 500 is similar around the entire perimeter of the substrate receiving surface 112 of the substrate support 110. Similarly, a grooved surface 505 formed by the plurality of grooves 115 is substantially constant across the substrate receiving surface 112 of the substrate support 110 inboard of the edge 500.

[0052] The edge 500 includes a rounded corner 510. The rounded corner 510 abuts between the recessed surface 202 and the substrate receiving surface 112 of the substrate support 110. A dielectric layer 515 is disposed above the upper surface 520 of the body 300 of the substrate support 110. The dielectric layer 515 includes the electrostatic chuck 305 adjacent to the substrate receiving surface 112 of the substrate support 110. The dielectric layer 515 also extends near the edge 500 and covers the edge 500. The dielectric layer 515 also covers the sidewalls 525 of the substrate support 110. The plane of the sidewalls 525 is approximately orthogonal to the plane of the upper surface 520. The dielectric layer 515 generally aligns the body 300 with the mask 108 ( Figure 5A ) is electrically insulated.

[0053] exist Figure 5B , the electrostatic chuck 305 is shown on the upper surface 520 of the body 300 of the substrate support 110. An interface layer 530 is shown between the upper surface 520 of the body 300 and the dielectric layer 515 of the electrostatic chuck 305. The interface layer 530 may include one or more layers of dielectric and / or thermally insulating films. The interface layer 530 may also be an anodized layer having a roughened surface to promote adhesion between the upper surface 520 of the body 300 of the substrate support 110 and the dielectric layer 515.

[0054] The dielectric layer 515 includes a ceramic material such as aluminum oxide (Al2O3). The dielectric layer 515 consists of a first portion 535A and a second portion 535B. The first portion 535A is positioned above the electrode 119, and the second portion 535B is positioned below the electrode 119. The second portion 535B is also sandwiched between the interface layer 530 and the electrode 119.

[0055] The first portion 535A and the second portion 535B have a first thickness 540 and a second thickness 545. In some embodiments, the first thickness 540 is substantially equal to the second thickness 545. In some embodiments, the first thickness 540 is about 0.2 millimeters (mm) to about 0.4 mm, such as about 0.3 mm. The thickness of the electrode 119 is about 0.04 mm to about 0.06 mm, such as about 0.05 mm. The thickness 555 of the interface layer 530 is about 0.08 mm to about 0.013 mm, such as about 0.1 mm. The thickness 560 of the electrostatic chuck 305 and the interface layer 530 may be about 0.7 mm to about 0.8 mm.

[0056] The grooved surface 505 includes a plurality of grooves 115 and a plurality of protrusions 575 formed adjacent to the grooves 115. The depth 565 of the outermost grooves 570 of the plurality of grooves 115 is about 0.04 mm to about 0.06 mm. The height 580 of the protrusions 575 is about 0.02 mm to about 0.04 mm.

[0057] Figure 6 1 is a cross-sectional view of a portion of the body 300 of the substrate support 110 and the mask frame 118, illustrating one embodiment of the compressible button 205. The compressible button 205 includes a contact pin 600 that is movably disposed in a blind hole 605 formed in the recessed surface 202 of the substrate support 110. An elastic member 610, such as a compression spring, is at least partially disposed in the blind hole 605. The elastic member 610 is used to bias the contact pin 600 toward the mask frame 118. The elastic member 610 allows the contact pin 600 to move toward the bottom surface 615 of the blind hole 605 based on the movement of the mask frame 118 while maintaining contact with the mask frame 118. The material of the contact pin 600 and / or the elastic member 610 can be made based on the need for electrical continuity or electrical insulation between the contact pin 600 and the mask 108.

[0058] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be envisaged without departing from the basic scope thereof, and the scope of the disclosure is to be determined by the claims which follow.

Claims

1. A substrate support, comprising: a substrate receiving surface; a recessed portion disposed around a periphery of the substrate receiving surface; an electrostatic chuck disposed below the substrate receiving surface; and a plurality of compressible buttons disposed within corresponding recesses formed in the recessed portion forming an electrical circuit with the electrostatic chuck, The recess is sized to receive a mask frame of a mask, each compressible button includes a contact pin movably disposed in a blind hole formed in the recessed portion, and an elastic member is at least partially disposed in the blind hole, the elastic member being used to bias the contact pin toward and in contact with the mask frame, and wherein the electrostatic chuck is used to adsorb the mask.

2. The substrate support of claim 1, wherein the electrostatic chuck comprises a dielectric layer adhered to an upper surface of a body of the substrate support. The substrate support of claim 2 , wherein the dielectric layer comprises a ceramic material. The substrate support of claim 2 , wherein electrodes are embedded in the dielectric layer.

5. The substrate support of claim 2, wherein the dielectric layer is embossed to form a groove pattern on the substrate receiving surface.

6. The substrate support of claim 1, wherein the substrate receiving surface comprises a groove pattern.

7. The substrate support of claim 1, wherein the substrate receiving surface comprises a dielectric layer.

8. The substrate support of claim 7, wherein the dielectric layer extends beyond the substrate receiving surface.

9. The substrate support of claim 7, wherein the body of the substrate support comprises a sidewall, and the dielectric layer covers a portion of the sidewall.

10. A substrate support, comprising: a body comprising a conductive material; a substrate receiving surface comprising a dielectric layer adhered to the body, wherein the body comprises a recessed portion disposed around a perimeter of the substrate receiving surface; an electrostatic chuck disposed below the substrate receiving surface; and a plurality of compressible buttons disposed within corresponding recesses formed in the recessed portion forming an electrical circuit with the electrostatic chuck, The recess is sized to receive a mask frame of a mask, each compressible button includes a contact pin movably disposed in a blind hole formed in the recessed portion, and an elastic member is at least partially disposed in the blind hole, the elastic member being used to bias the contact pin toward and in contact with the mask frame, and wherein the electrostatic chuck is used to adsorb the mask.

11. The substrate support of claim 10, wherein each of the compressible buttons is made of an electrically conductive material.

12. The substrate support of claim 10, wherein each of the compressible buttons is made of a dielectric material.

13. The substrate support of claim 10, wherein the dielectric layer comprises a ceramic material.

14. The substrate support of claim 13, wherein electrodes are embedded in the dielectric layer.

15. The substrate support of claim 13, wherein the dielectric layer is embossed to form a groove pattern on the substrate receiving surface.

16. A substrate support, comprising: a body comprising a conductive material; a substrate receiving surface comprising a dielectric layer adhered to the body, wherein the body comprises a recessed portion disposed around a perimeter of the substrate receiving surface, and the substrate receiving surface comprises a groove pattern; an electrostatic chuck disposed in the dielectric layer below the substrate receiving surface; and a plurality of compressible buttons disposed within corresponding recesses formed in the recessed portion forming an electrical circuit with the electrostatic chuck, The recess is sized to receive a mask frame of a mask, each compressible button includes a contact pin movably disposed in a blind hole formed in the recessed portion, and an elastic member is at least partially disposed in the blind hole, the elastic member being used to bias the contact pin toward and in contact with the mask frame, and wherein the electrostatic chuck is used to adsorb the mask.

17. The substrate support of claim 16, wherein each of the compressible buttons is made of an electrically conductive material.

18. The substrate support of claim 16, wherein each of the compressible buttons is made of a dielectric material.

19. The substrate support of claim 16, wherein the dielectric layer comprises a ceramic material.

20. The substrate support of claim 19, wherein electrodes are embedded in the dielectric layer.

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