Vacuum etching control system and vacuum etching machine

Abstract

The invention relates to a vacuum etching control system and a vacuum etching machine. The vacuum etching machine comprises a vacuum cavity, an ion source and a rotary workpiece table, wherein the ion source and the rotary workpiece table are arranged in the vacuum cavity; wherein the rotary workpiece table and the ion source are respectively connected to an industrial personal computer arranged outside the vacuum cavity; the rotary workpiece table rotates and swings the workpiece disc in the etching process, the ion source outputs ion beams to etch workpieces to be etched on the workpiece disc, and the industrial personal computer controls the ion source to output the ion beams with set parameters according to the current etching process. The maximum safety angle of swinging of the workpiece disc is calculated according to the target position of the rotary workpiece table in the vacuum cavity, the coverage range of swinging of the workpiece disc and the position parameters of all parts in the vacuum cavity, and the workpiece disc is controlled to swing within the maximum safety angle; according to the technical scheme, the internal space of the vacuum cavity is utilized to the maximum extent, the limitation on the etching process is reduced, the etching process effect is improved, and most vacuum etching process requirements are met.

Description

Technical Field

[0001] The present application relates to the field of vacuum etching technology, and in particular to a vacuum etching control system and a vacuum etcher. Background Art

[0002] When the etching process is performed in a vacuum etcher, the workpiece is placed on a workpiece disk of a rotating workpiece table in a vacuum chamber, and then an ion source is used to bombard the workpiece surface for etching in a vacuum environment.

[0003] During the etching process, the rotating worktable will rotate and swing to achieve a uniform process effect. However, due to the limited internal space of the vacuum chamber, the rotating worktable will easily hit other components and cause damage when swinging in the chamber. Therefore, the vacuum etcher will strictly limit the swing angle of the rotating worktable to avoid hitting the components in the vacuum chamber.

[0004] However, since the angles at which the workpiece needs to be bombarded are different in different etching processes, in most cases, due to the limitation of the swing angle, the bombardment angle is often difficult to reach an optimal value, which limits the etching process and seriously affects the etching process effect. In particular, some etching processes with high requirements cannot be carried out normally, affecting the scope of application of the vacuum etcher. Summary of the invention

[0005] Based on this, it is necessary to provide a vacuum etching control system and a vacuum etcher to address one of the above technical defects so as to improve the etching process effect.

[0006] A vacuum etching control system is applied to a vacuum etcher, the vacuum etcher comprising: a vacuum chamber, an ion source and a rotating workpiece table arranged in the vacuum chamber; wherein the rotating workpiece table and the ion source are respectively connected to an industrial computer arranged outside the vacuum chamber; The rotating workpiece table is provided with a workpiece disk for placing the workpiece to be etched, and the rotating workpiece table rotates and swings the workpiece disk during the etching process; The ion source is used to output an ion beam to etch the workpiece to be etched on the workpiece disk; The industrial computer is used to control the ion source to output an ion beam with set parameters according to the current etching process, The maximum safe angle of the workpiece disc swing is calculated according to the target position of the rotating workpiece table in the vacuum chamber, the coverage of the workpiece disc swing and the position parameters of each component in the vacuum chamber. And the workpiece disk is controlled to swing within the maximum safety angle.

[0007] In one embodiment, the vacuum etcher further comprises: a motion platform disposed in the vacuum chamber and connected to the industrial computer, for moving the rotating workpiece table to a target position; The industrial computer is also used to determine the target position of the rotating workpiece table in the vacuum chamber according to the current etching process, and to control the motion platform to move the swing center point of the rotating workpiece table to the target position.

[0008] In one embodiment, the vacuum etcher further comprises: a steering platform on which the ion source is mounted, the steering platform being connected to the industrial computer and used to rotate the ion source to change the direction of its output ion beam; The industrial computer is also used to determine the angle at which the ion beam bombards the workpiece according to the current etching process, and to control the steering platform to adjust the direction of the ion beam output by the ion source according to the angle.

[0009] In one embodiment, the motion platform includes an XY motion platform disposed on an XY plane and a linear module disposed in the Z-axis direction; The rotating workpiece table comprises: a rotating mechanism and a workpiece disk; wherein the rotating mechanism is mounted on the slider of the linear module, and the workpiece disk is mounted on the rotating mechanism; The XY motion platform drives the rotating workpiece table to move on the XY plane, and the linear module drives the rotating workpiece table to move up and down along the Z axis; The workpiece disk is driven by the rotating mechanism to rotate and swing.

[0010] In one embodiment, the XY motion platform is provided with an X-axis motor and a Y-axis motor connected to the industrial computer, and the linear module is provided with a Z-axis motor connected to the industrial computer; wherein the industrial computer is also used to output a first control parameter to the X-axis motor, output a second control parameter to the Y-axis motor, and output a third control parameter to the Z-axis motor to control it to perform three-dimensional movement to the target position; The rotating mechanism is provided with a self-rotating motor and a swinging motor respectively connected to the industrial computer; wherein, the industrial computer is also used to output a fourth control parameter to the swinging motor to control the workpiece disk to swing, and output a fifth control parameter to the self-rotating motor to control the workpiece disk to rotate; The steering platform is provided with a pitch motor and a rotary motor; wherein the industrial computer is also used to output six control parameters to the pitch motor and output seven control parameters to the rotary motor to control the direction of the ion beam output by the ion source.

[0011] In one embodiment, the industrial computer is also used to control the XY motion platform to drive the rotating workpiece table to move to the target position, and control the linear module to drive the rotating workpiece table to perform reciprocating motion in the Z-axis direction; The rotating workpiece table is swung at a minimum value of the calculated maximum safe angle of the workpiece disk.

[0012] In one embodiment, the industrial computer is also used to calculate the optimal direction angle of the ion beam output by the ion source according to the target position of the rotating workpiece table and its maximum safe angle; and to control the steering platform so that the ion source outputs the ion beam at the optimal direction angle.

[0013] In one embodiment, the industrial computer is also used to determine the target position of the rotating workpiece table according to the etching process; calculate the coverage range of the workpiece disk swinging according to the target position and the radius of the workpiece disk of the rotating workpiece table; calculate the maximum movement range of the rotating workpiece table in the vacuum chamber according to the position parameters of each component in the vacuum chamber; calculate the maximum safe angle of the swing of the workpiece disk of the rotating workpiece table according to the coverage range and the maximum movement range.

[0014] In one embodiment, the industrial computer is also used to obtain various position points that the rotating workpiece table can reach in the vacuum chamber according to the etching process, calculate the coverage range of the workpiece disk swing at each position point, and select the position point with the largest coverage range as the target position.

[0015] In one embodiment, the industrial computer is also used to obtain the endpoint coordinates of the edge of the rotating workpiece table when the maximum motion range and the coverage range intersect; calculate the cutoff deflection angle of the workpiece disk swing according to the swing center point and endpoint coordinates of the workpiece disk; and determine the maximum safe angle of the rotating workpiece table swing according to the cutoff deflection angle.

[0016] A vacuum etching machine comprises the vacuum etching control system.

[0017] The above-mentioned vacuum etching control system and vacuum etcher, the rotating workpiece table rotates and swings the workpiece disk during the etching process, the ion source outputs an ion beam to etch the workpiece to be etched on the workpiece disk, the industrial control computer controls the ion source to output an ion beam with set parameters according to the current etching process, calculates the maximum safe angle of the workpiece disk swing according to the target position of the rotating workpiece table in the vacuum chamber, the coverage range of the workpiece disk swing and the position parameters of each component in the vacuum chamber, and controls the workpiece disk to swing within the maximum safe angle; this technical solution, when performing the etching process, can calculate the maximum safe angle of the swing of the rotating workpiece table according to the requirements of different etching processes, so that the rotating workpiece table can be swung at the maximum safe angle in the vacuum chamber on the basis of ensuring its safety, thereby maximizing the use of the internal space of the vacuum chamber, reducing the restrictions on the etching process, improving the etching process effect, and meeting most vacuum etching process requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a structural block diagram of a vacuum etcher according to an embodiment; Figure 2 is a structural block diagram of a vacuum etcher according to another embodiment; Figure 3 is an electrical diagram of an example vacuum etcher; Figure 4 This is a schematic diagram of the maximum safe angle of the swing of the rotating workpiece table; Figure 5 This is a diagram showing the maximum safe angle for reciprocating motion. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0020] The term "comprising" and any other variations of the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device comprising a series of steps is not limited to the listed steps or modules, but may optionally include steps or modules not listed, or may optionally include other steps or modules inherent to the process, method, product, or device.

[0021] The technical solution of the present application provides a vacuum etching control system and a vacuum etcher, referring to Figure 1 As shown, Figure 1 : is a block diagram of the structure of a vacuum etcher of an embodiment. The vacuum etching control system can be applied to an industrial computer 04 connected to the vacuum etcher. The vacuum etcher mainly comprises: a vacuum chamber 01, an ion source 02 and a rotating workpiece table 03 arranged in the vacuum chamber 01; wherein the rotating workpiece table 03 and the ion source 02 are respectively connected to the industrial computer 04 arranged outside the vacuum chamber 01; Figure 1 In the figure, inside the vacuum chamber 01, various components are included, such as the ion source 02 and its related pipes, cables, etc., and other components required for the etching process, which are classified as other components in the figure; the existence of these components will limit the swing range of the rotating workpiece table 03 in the vacuum chamber 01.

[0022] A workpiece disk 31 is provided on the rotating workpiece table 03 for placing the workpiece to be etched. The rotating workpiece table 03 rotates and swings the workpiece disk 31 during the etching process; specifically, before etching, the workpiece to be etched is first placed on the workpiece disk 31. During the etching process, the rotating workpiece table 03 will rotate the workpiece disk 31 so that the etching can be carried out evenly, and at the same time swing the workpiece disk 31 so that different parts of the workpiece face the ion source 02 and are etched from different angles. It should be noted that the swinging here refers to the reciprocating swinging of the workpiece disk 31 at a certain angle, rather than the revolution or flipping of the entire rotating workpiece table 03.

[0023] The ion source 02 is used to output an ion beam to etch the workpiece to be etched on the workpiece disk 31, and a radio frequency ion source can usually be selected; Figure 1 In the figure, the ion source 02 is installed at a set position in the vacuum chamber 01. Under the control of the industrial computer 04, it will output corresponding ion beams according to different etching processes to bombard the surface of the workpiece for etching process.

[0024] The industrial computer 04 is used to control the ion source 02 to output an ion beam with set parameters according to the current etching process, calculate the maximum safe angle of the workpiece disk 31 according to the target position of the rotating workpiece table 03 in the vacuum chamber 01, the coverage of the workpiece disk 31 swinging, and the position parameters of each component in the vacuum chamber 01, and control the workpiece disk 31 to swing within the maximum safe angle; illustratively, in order to make full use of the space, the workpiece disk 31 can be swung at the maximum safe angle, or it can be swung at a smaller angle than the maximum safe angle. For example, for the selection and control of etching process parameters, the etching rate, uniformity, etching deviation, etching angle and other parameters can be mainly selected, and the industrial computer 04 is used to control the corresponding parameters of the vacuum etcher.

[0025] As in the scheme of the above-mentioned embodiment, the vacuum etcher can calculate the maximum safe swing angle of the rotating workpiece table 03 according to the requirements of different etching processes, so that on the basis of ensuring the safety of the rotating workpiece table 03, the rotating workpiece table 03 can be swung within the maximum safe angle in the vacuum chamber 01, thereby maximizing the use of the internal space of the vacuum chamber 01, reducing the restrictions on the etching process, and improving the etching process effect, so that the vacuum etcher can adapt to most vacuum etching process requirements.

[0026] In one embodiment, reference Figure 2 As shown, Figure 2 is a structural block diagram of a vacuum etcher according to another embodiment. Figure 2In the figure, an O-XYZ three-dimensional coordinate system is established with the internal control of the vacuum chamber 01. The figure shows a cross-sectional view of the XZ axis, and the Y axis is perpendicular to the paper direction (not shown in the figure). The vacuum etcher of the present application may also include a motion platform 05 disposed in the vacuum chamber 01 and connected to the industrial computer 04, for moving the rotating workpiece table 03 to a target position; the industrial computer 04 is also used to determine the target position of the rotating workpiece table 03 in the vacuum chamber 01 according to the current etching process, and to control the motion platform 05 to move the swing center point of the rotating workpiece table 03 to the target position.

[0027] The motion platform 05 may be a one-dimensional, two-dimensional or three-dimensional platform. Preferably, the motion platform 05 of this embodiment is a three-dimensional motion platform, which includes an XY motion platform 51 arranged on the XY plane and a linear module 52 arranged in the Z-axis direction; the XY motion platform 51 drives the rotating workpiece table 03 to move on the XY plane, and the linear module 52 drives the rotating workpiece table 03 to move up and down in the Z-axis direction.

[0028] As an embodiment, the rotating workpiece table 03 may include a rotating mechanism 32 and a workpiece disk 31; wherein the rotating mechanism 32 is installed on the slider 52a of the linear module 52, and the workpiece disk 31 is installed on the rotating mechanism 32, and the workpiece disk 31 is driven by the rotating mechanism 32 to rotate and swing.

[0029] As in the above-mentioned embodiment, the rotating workpiece table 03 and the workpiece placed thereon can be moved to a suitable target position through the motion platform 05, and by controlling the rotation and swing of the workpiece disk 31, a more precise etching process can be performed to improve the etching process effect.

[0030] Exemplary, reference Figure 3 As shown, Figure 3 This is an electrical structure diagram of an example vacuum etcher, wherein an X-axis motor and a Y-axis motor connected to an industrial computer 04 are provided on an XY motion platform 51, and a Z-axis motor connected to the industrial computer 04 is provided on a linear module 52; wherein the industrial computer 04 is also used to output a first control parameter to the X-axis motor, output a second control parameter to the Y-axis motor, and output a third control parameter to the Z-axis motor to control it to perform three-dimensional movement to a target position.

[0031] Exemplarily, the rotating mechanism 32 is provided with a self-rotating motor and a swinging motor respectively connected to the industrial computer 04; wherein, the industrial computer 04 is also used to output a fourth control parameter to the swinging motor to control the workpiece disk 31 to swing, and output a fifth control parameter to the self-rotating motor to control the workpiece disk 31 to rotate.

[0032] In one embodiment, during the etching process, the vacuum etcher performs Figure 2As shown, the industrial computer 04 can drive the rotating workpiece table 03 to move to the target position through the XY motion platform 51, control the workpiece disk 31 to rotate and swing, and then control the linear module 52 to drive the rotating workpiece table 03 to move back and forth in the Z-axis direction.

[0033] As in the above-mentioned embodiment, during the etching process, through up and down reciprocating motion, all angles of the workpiece on the workpiece disk 31 can fully face the ion beam, so that all surfaces of the workpiece can be more fully etched, thereby improving the etching effect.

[0034] In one embodiment, Figure 2 As shown, the vacuum etcher of the present application further includes: a steering platform 21 on which the ion source 02 is installed, the steering platform 21 is connected to the industrial computer 04, and is used to rotate the ion source 02 to change the direction of its output ion beam; the industrial computer 04 is also used to determine the angle at which the ion beam bombards the workpiece according to the current etching process, and to adjust the direction of the ion beam output by the ion source 02 according to the angle by controlling the steering platform 21.

[0035] For example, Figure 3 As shown, the steering platform 21 is provided with a pitch motor and a rotary motor; wherein, the industrial computer 04 is also used to output six control parameters to the pitch motor and output seven control parameters to the rotary motor to control the direction of the ion beam output by the ion source 02 .

[0036] As in the scheme of the above-mentioned embodiment, the direction of the ion beam output by the ion source 02 is adjusted by controlling the steering platform 21, so that the up and down movement and swing of the rotating workpiece table 03 can be coordinated with the direction adjustment of the ion source 02, and the internal space of the vacuum chamber 01 can be fully utilized to complete the etching process, so that the workpiece can be fully and evenly etched, thereby greatly improving the etching process effect.

[0037] In order to better illustrate the technical solution of the present application, a more detailed embodiment description of the functions implemented by the industrial computer 04 is given below.

[0038] In one embodiment, the industrial computer 04 calculates the maximum safe angle of the workpiece plate 31 according to the target position of the rotating workpiece table 03 in the vacuum chamber 01, the coverage of the workpiece plate 31 swinging, and the position parameters of each component in the vacuum chamber 01; usually, the maximum safe angle The maximum swing angle of the rotating workpiece table 03. If you need to limit the swing angle to the threshold The maximum safety angle is At the swing angle threshold The maximum swing angle of the inner swing can maximize the utilization of the internal space of the vacuum chamber 01.

[0039] The coordinate space inside the vacuum chamber 01 can be obtained based on the O-XYZ three-dimensional coordinate system and the internal dimensions of the vacuum chamber. The process of calculating the maximum safe angle of the swing of the workpiece disk 31 based on the coordinate space may include the following: like Figure 2 As shown, the industrial computer 04 may include the following when calculating the maximum safety angle: (1) Determine the target position of the rotating workpiece stage 03 according to the etching process.

[0040] For example, the target position to which the rotating workpiece stage 03 needs to move in the vacuum chamber 01 is determined according to the etching process currently to be performed. Usually, the target position is represented by the deflection center coordinates of the rotating workpiece stage 03. The swing center point of the rotating workpiece stage 03 is used as a reference point. When the reference point is at the target position, its position in the range of 0-1 is obtained. XYZ The target coordinate P0 in the three-dimensional coordinate system ( x 0 ,y 0 ,z 0 ).

[0041] like Figure 2 In the etching process, the rotating workpiece stage 03 needs to be placed within a certain distance from the ion source 02. During the etching process, the rotating workpiece stage 03 can also perform a reciprocating motion within a certain range in the vertical direction according to the etching requirements. In addition, since the workpiece side of the rotating workpiece stage 03 needs to face the ion source 02, its swing angle usually needs to be limited to a swing angle threshold. within the range.

[0042] (2) The coverage range of the swing of the workpiece disk 31 is calculated based on the target position and the radius of the workpiece disk 31 of the rotating workpiece table 03 .

[0043] For example, according to the radius R of the rotating workpiece table 03, the swing angle threshold value of the rotating workpiece table 03 is Within the range, according to the target coordinates P0 ( x 0 ,y 0 ,z 0 ) and the radius R of the rotating workpiece table 03 can calculate the coverage Q during swinging, such as Figure 2 The shaded area is the coverage Q.

[0044] (3) Calculate the maximum motion range of the rotating workpiece stage 03 in the vacuum chamber 01 based on the position parameters of each component in the vacuum chamber 01 .

[0045] like Figure 2In the embodiment, before executing the current etching process, the first spatial coordinate range corresponding to the interior of the entire vacuum chamber 01 is first obtained; then the corresponding second spatial coordinate range can be obtained according to the position parameters of various components inside the vacuum chamber 01; finally, the corresponding third spatial coordinate range is obtained according to the area that can be covered when the rotating workpiece stage 03 swings on the right side of the motion platform 05; the maximum motion range of the rotating workpiece stage 03 in the vacuum chamber 01 is obtained by calculating the intersection of the first coordinate spatial range, the second coordinate spatial range and the third coordinate spatial range; Figure 2 The medium gray background portion is the maximum range of motion within which the rotating workpiece stage 03 can move and swing in the vacuum chamber 01 .

[0046] (4) Calculate the maximum safe angle of the workpiece disc 31 of the rotating workpiece table 03 according to the coverage range and the maximum motion range.

[0047] For example, since the rotating workpiece table 03 needs to be restricted to a maximum motion range S for swinging, the maximum safe angle of the swinging of the workpiece disk 31 of the rotating workpiece table 03 can be calculated through the intersection of the coordinate range of the maximum motion range S and the coverage range Q.

[0048] In one embodiment, the industrial computer 04 may include the following when calculating the maximum safe angle of the swing of the workpiece disk 31 of the rotating workpiece table 03: Obtain the endpoint coordinates of the edge of the rotating workpiece table 03 when the maximum motion range and the coverage range intersect; calculate the cutoff deflection angle of the workpiece disk 31 according to the swing center point and endpoint coordinates of the workpiece disk 31; determine the maximum safe angle of the workpiece disk 31 according to the cutoff deflection angle.

[0049] For example, Figure 4 As shown, Figure 4 This is an example of the maximum safe angle diagram of the swing of the rotating workpiece table. The maximum motion range S and the coverage range Q intersect at p ( x,y,z ), the rotating workpiece table 03 is at the dotted line position, and the end point coordinates P1 of the edge of the rotating workpiece table 03 can be obtained at this time ( x 1 ,y 1 ,z 1 ); According to the intersection point p ( x,y,z ) and radius R can calculate the endpoint coordinates P1 ( x 1 ,y 1 ,z 1 ).

[0050] In addition, since the rotating workpiece table 03 has a certain thickness d Therefore, if there is a certain deviation when calculating using the center line, if you want to perform accurate calculations, you can further consider the influence of thickness during calculations and obtain its thickness in advance. d , and then according to the intersection point p ( x,y,z ),thickness d and the center line of radius R to calculate the endpoint coordinates P1 ( x 1 ,y 1 ,z 1 ).

[0051] It should be noted that there may be multiple intersection points when obtaining the intersection point. The figure shows the first intersection point. This intersection point is actually the first intersection point in the swing range that needs to be obtained. p The endpoint coordinate P1 of the edge of the rotating workpiece table 03 corresponding to the time; using the target coordinate P0 ( x 0 ,y 0 ,z 0 ) and the endpoint coordinates P1 ( x 1 ,y 1 ,z 1 ) can calculate the cut-off deflection angle of the workpiece disk 31 swing , the calculation formula can be as follows: in, represents the cut-off deflection angle, is the projection distance of the endpoint coordinates on the plane where the swing center point of the rotating workpiece table 03 is located, and R is the radius of the rotating workpiece table 03.

[0052] like Figure 4 As shown, when calculating the projection distance L of the endpoint coordinate P1 on the target coordinate P0 plane, the target coordinate P0 ( x 0 ,y 0 ,z 0 ) and the projection point P2 ( x 2 ,y 2 ,z 2 ) Calculate the projection distance L. According to the radius R and the projection distance L, the cut-off deflection angle can be calculated It should be noted that if there are multiple intersection points, multiple cutoff deflection angles can be calculated. , ……. Then combined with the swing angle threshold of the workpiece disk 31 of the rotating workpiece table 03 and the cut-off deflection angle The maximum safe angle of the workpiece plate 31 can be obtained. ; If there are multiple cutoff deflection angles , ..., then multiple angle ranges can be calculated separately , ... and then choose the smallest one as the maximum safety angle .

[0053] As in the technical solution of the above embodiment, the maximum safe angle of the workpiece disk 31 of the rotating workpiece table 03 when it swings in the vacuum chamber 01 can be calculated according to the etching process requirements, the optimal swing angle range under the etching process can be obtained, and the internal space of the vacuum chamber 01 can be fully utilized to swing the rotating workpiece table 03.

[0054] In one embodiment, the vacuum etching of the present application, based on the functions implemented by the industrial computer 04, can also find an optimal target position for etching in the current vacuum chamber 01 according to the etching process, thereby obtaining a better etching effect.

[0055] Accordingly, when the industrial computer 04 determines the target position of the rotating workpiece table 03 according to the etching process, it can also obtain the various position points that the rotating workpiece table 03 can reach in the vacuum chamber 01 according to the etching process, calculate the coverage range of the swinging of the workpiece disk 31 of the rotating workpiece table 03 at each position point, and select the position point with the largest coverage range as the target position.

[0056] Specifically, the reachable position range of the rotating workpiece table 03 in the vacuum chamber 01 is determined according to the current etching process. When performing the etching process, the rotating workpiece table 03 needs to be limited to a certain position range, for example, a set distance from the ion source 02, and the angle between the rotating workpiece table 03 and the ion source 02 is within a set angle range. Within the reachable position range, discretization processing can be performed to select multiple position points within the position range; then for each position point, the maximum swing angle corresponding to the workpiece disk 31 of the rotating workpiece table 03 when it swings at the position point can be calculated according to the maximum motion range, and the position point with the largest maximum swing angle is set as the target position, so that the optimal target position can be selected by calculation.

[0057] In one embodiment, in order to achieve a better etching effect, the industrial computer 04 is also used to calculate the optimal direction angle of the ion beam output by the ion source 02 according to the target position of the rotating workpiece table 03 and its maximum safe angle; and control the steering platform 21 so that the ion source 02 outputs the ion beam at the optimal direction angle.

[0058] Specifically, after selecting the optimal target position, the optimal azimuth angle of the ion beam bombarding the workpiece in the etching process can be calculated based on the target position of the rotating workpiece table 03 and the maximum safe angle. Therefore, during the etching process, the ion source 02 can be adjusted to output the ion beam at the optimal direction angle to etch the workpiece.

[0059] As in the solution of the above embodiment, a position point with a maximum swing angle can be found as a target position for different etching processes, so as to match the best swing angle, which can not only improve the internal space utilization rate of the vacuum chamber 01, but also maximize the process effect, thereby greatly improving the process effect.

[0060] In one embodiment, during the etching process, when the rotating workpiece table 03 performs up and down reciprocating motion in the Z-axis direction, the industrial computer 04 may include the following when calculating the maximum safe angle of the swing of the workpiece disk 31 of the rotating workpiece table 03: (a) Taking the swing center point of the rotating workpiece stage 03 as the reference point, the position point range of the reciprocating motion of the rotating workpiece stage 03 in the vacuum chamber 01 is obtained; specifically, since the rotating workpiece stage 03 is first moved to a target position when performing the reciprocating motion, and then controlled to perform the reciprocating motion along a certain trajectory, the position point range of the reference point when performing the reciprocating motion can be determined.

[0061] (b) Selecting a plurality of position points in the position point range of the reciprocating motion of the rotating workpiece stage 03 to form a position point set; specifically, in the vacuum chamber 01, when the rotating workpiece stage 03 performs reciprocating motion in the vertical direction, a plurality of position points can be selected at certain intervals on the reciprocating motion path to form a position point set, and the number of the selected position points can be determined according to demand.

[0062] (c) Within the space limited by the maximum motion range, the maximum swing angle of the rotating workpiece table 03 corresponding to each position point is calculated, and the maximum swing angle of each position point is calculated.

[0063] (d) Select the minimum value from the maximum swing angles of each position point as the maximum safe angle for the entire reciprocating motion .

[0064] like Figure 5 As shown, Figure 5This is an example of the maximum safety angle under reciprocating motion. As shown in the figure, when the rotating workpiece table moves back and forth in the range of H in the Z-axis direction, the maximum safety angle can be calculated. and maximum safety angle 2, where , you can choose As the maximum safe angle for reciprocating motion .

[0065] As in the above-mentioned embodiment, it can be ensured that the rotating workpiece table 03 will not hit other components during the entire round trip, and the internal space of the vacuum chamber 01 can be fully utilized to provide the workpiece disk 31 of the rotating workpiece table 03 for swinging, thereby improving the utilization rate of the internal space of the vacuum chamber 01 and enhancing the etching process effect.

[0066] In one embodiment, for the above (d), the maximum safety angle is selected When the rotating workpiece table 03 passes through the target point position, several position points can be selected from the position point set as target points, and the maximum swing angle corresponding to the target point can be recorded accordingly. When the rotating workpiece table 03 is controlled to move back and forth in the vacuum chamber 01, when the rotating workpiece table 03 passes through the target point position, the rotating workpiece table 03 is controlled to swing at the maximum swing angle corresponding to the target point.

[0067] Exemplarily, several target points within the local range where the maximum swing angle changes can be selected, and combined with the maximum swing angles corresponding to these target points, when controlling the reciprocating motion of the rotating workpiece table 03 in the vacuum chamber 01, based on the real-time position of the rotating workpiece table 03, when passing through the positions of these target points, the rotating workpiece table 03 is controlled to swing at the maximum swing angle corresponding to the target point.

[0068] As in the above-mentioned embodiment, more refined swing angle control can be achieved, thereby further improving the utilization rate of the internal space of the vacuum chamber 01 and enhancing the etching process effect.

[0069] In one embodiment, the industrial computer 04 determines the movement displacement and maximum safety angle Later, during the etching process, according to the movement displacement Control the rotating workpiece table 03 to move to the target position P0, and then control the rotating workpiece table 03 to move to the target position P0 at the maximum safety angle. Swing inside.

[0070] Exemplarily, when controlling the motion platform 05 to move the rotating workpiece stage 03 , the motion displacement of the rotating workpiece stage 03 from the starting position to the target position during the etching process can be calculated based on the target position of the rotating workpiece stage 03 and the second position parameter of the starting position of the rotating workpiece stage 03 .

[0071] For example, the motion displacement is calculated using the starting position coordinates of the deflection center of the rotating workpiece stage 03 and the target position coordinates P0. , the movement displacement It is a value with direction; then add the movement displacement based on the starting position coordinates The target position coordinates P1 can be obtained. When the rotating workpiece table 03 is to move to the next position, the motion displacement can be calculated based on the current starting position coordinates and the next target position coordinates. , and then perform corresponding control.

[0072] Based on the vacuum etching control system and vacuum etcher of the above-mentioned embodiments, when performing an etching process, the maximum safe swing angle of the workpiece disk 31 of the rotating workpiece table 03 can be calculated according to different etching process requirements. Therefore, on the basis of ensuring the safety of the rotating workpiece table 03, the workpiece disk 31 can be swung at the maximum safe angle in the vacuum chamber 01, thereby maximizing the use of the internal space of the vacuum chamber 01, reducing restrictions on the etching process, improving the etching process effect, and meeting most vacuum etching process requirements.

[0073] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A vacuum etching control system, applied to a vacuum etcher, characterized in that: The vacuum etcher comprises: a vacuum chamber, an ion source and a rotating workpiece table arranged in the vacuum chamber; wherein the rotating workpiece table and the ion source are respectively connected to an industrial computer arranged outside the vacuum chamber; The rotating workpiece table is provided with a workpiece disk for placing the workpiece to be etched, and the rotating workpiece table rotates and swings the workpiece disk during the etching process; The ion source is used to output an ion beam to etch the workpiece to be etched on the workpiece disk; The industrial computer is used to control the ion source to output an ion beam with set parameters according to the current etching process, calculate the maximum safe angle of the workpiece disk swing according to the target position of the rotating workpiece table in the vacuum chamber, the coverage range of the workpiece disk swing and the position parameters of each component in the vacuum chamber, and control the workpiece disk to swing within the maximum safe angle.

2. The vacuum etching control system according to claim 1, characterized in that: The vacuum etcher further comprises: a motion platform disposed in the vacuum chamber and connected to the industrial computer, and used for moving the rotating workpiece table to a target position; The industrial computer is also used to determine the target position of the rotating workpiece table in the vacuum chamber according to the current etching process, and to control the motion platform to move the swing center point of the rotating workpiece table to the target position.

3. The vacuum etching control system according to claim 2, characterized in that: The vacuum etcher further comprises: a steering platform on which the ion source is mounted, the steering platform being connected to the industrial computer and used for rotating the ion source to change the direction of its output ion beam; The industrial computer is also used to determine the angle at which the ion beam bombards the workpiece according to the current etching process, and to control the steering platform to adjust the direction of the ion beam output by the ion source according to the angle.

4. The vacuum etching control system according to claim 3, characterized in that: The motion platform includes an XY motion platform arranged on the XY plane and a linear module arranged in the Z-axis direction; The rotating workpiece table comprises: a rotating mechanism and a workpiece disk; wherein the rotating mechanism is mounted on the slider of the linear module, and the workpiece disk is mounted on the rotating mechanism; The XY motion platform drives the rotating workpiece table to move on the XY plane, and the linear module drives the rotating workpiece table to move up and down along the Z axis; The workpiece disk is driven by the rotating mechanism to rotate and swing.

5. The vacuum etching control system according to claim 4, characterized in that: The XY motion platform is provided with an X-axis motor and a Y-axis motor connected to the industrial computer, and the linear module is provided with a Z-axis motor connected to the industrial computer; wherein the industrial computer is also used to output a first control parameter to the X-axis motor, output a second control parameter to the Y-axis motor, and output a third control parameter to the Z-axis motor to control it to perform three-dimensional movement to the target position; The rotating mechanism is provided with a self-rotating motor and a swinging motor respectively connected to the industrial computer; wherein, the industrial computer is also used to output a fourth control parameter to the swinging motor to control the workpiece disk to swing, and output a fifth control parameter to the self-rotating motor to control the workpiece disk to rotate; The steering platform is provided with a pitch motor and a rotary motor; wherein the industrial computer is also used to output six control parameters to the pitch motor and output seven control parameters to the rotary motor to control the direction of the ion beam output by the ion source.

6. The vacuum etching control system according to claim 4, characterized in that: The industrial computer is also used to control the XY motion platform to drive the rotating workpiece table to move to the target position, and control the linear module to drive the rotating workpiece table to perform reciprocating motion in the Z-axis direction; The rotating workpiece table is swung at a minimum value of the calculated maximum safe angle of the workpiece disk.

7. The vacuum etching control system according to claim 4, characterized in that: The industrial computer is also used to calculate the optimal direction angle of the ion beam output by the ion source according to the target position of the rotating workpiece table and its maximum safe angle; and to control the steering platform so that the ion source outputs the ion beam at the optimal direction angle.

8. The vacuum etching control system according to any one of claims 1 to 7, characterized in that: The industrial computer is also used to determine the target position of the rotating workpiece table according to the etching process; calculate the coverage range of the workpiece disk swing according to the target position and the radius of the workpiece disk of the rotating workpiece table; calculate the maximum movement range of the rotating workpiece table in the vacuum chamber according to the position parameters of each component in the vacuum chamber; calculate the maximum safe angle of the swing of the workpiece disk of the rotating workpiece table according to the coverage range and the maximum movement range.

9. The vacuum etching control system according to claim 8, characterized in that: The industrial computer is also used to obtain various position points that the rotating workpiece table can reach in the vacuum chamber according to the etching process, calculate the coverage range of the workpiece disk swing at each position point, and select the position point with the largest coverage range as the target position.

10. A vacuum etcher, characterized in that: The invention comprises the vacuum etching control system as described in any one of claims 1-9.

Images