Mask assembly and manufacturing apparatus for display device
By employing magnetic support components and a stepped design in the mask assembly, the problems of mask assembly deformation and sagging were solved, enabling the deposition of precision patterns and the high-quality manufacturing of display devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SAMSUNG DISPLAY CO LTD
- Filing Date
- 2021-05-13
- Publication Date
- 2026-06-05
Smart Images

Figure CN113725082B_ABST
Abstract
Description
Technical Field
[0001] Embodiments of the present invention relate to apparatus and methods thereof, and more specifically, to an apparatus for manufacturing mask assemblies and display devices. Background Technology
[0002] Mobile electronic devices are becoming increasingly popular. In addition to small electronic devices such as mobile phones, tablet computers are now widely used as mobile electronic devices.
[0003] To support multiple functions, mobile electronic devices like these include display devices for providing users with visual information such as images or videos. Recently, as other components used to drive the display device have been miniaturized, there is a growing trend of display devices taking up an increasingly larger proportion of electronic devices, and structures that can be bent at a predetermined angle in a flat state are also being developed.
[0004] In the mask assembly used to manufacture the display device as described above, the resolution of the display device and the shape of the image presented by the display device may vary depending on the degree of deformation resistance during the deposition process. Summary of the Invention
[0005] Because conventional mask assemblies exhibit uneven magnetic force formation based on the shape of the opening, they may not be able to prevent deformation or sagging of the mask assembly. Embodiments of the present invention provide a mask assembly that prevents deformation and sagging of the mask assembly, as well as a manufacturing apparatus for a display device capable of depositing precise patterns.
[0006] An embodiment of the present invention discloses a mask assembly, comprising: a mask frame including a first mounting surface, a second mounting surface, and a first opening, wherein the second mounting surface is arranged with a stepped difference from the first mounting surface; a support member, a portion of which is mounted on the first mounting surface and divides the first opening into a plurality of second openings; a first mask disposed on the support member and including a third opening arranged corresponding to the second openings; and a second mask, a portion of which is mounted on the second mounting surface and includes a plurality of fourth openings arranged in a manner corresponding to the third openings.
[0007] In this embodiment, the shapes of the second opening and the third opening may be different from each other.
[0008] In this embodiment, the support component may include a magnetic material.
[0009] In this embodiment, the support member can be in the form of a grid to divide the first opening into the plurality of second openings.
[0010] In this embodiment, at least one of the first mounting surface and the second mounting surface may include a slot.
[0011] In this embodiment, the mask frame may include a protrusion having a first mounting surface and a second mounting surface.
[0012] In this embodiment, when viewed in a plane, the second opening can be arranged inside the third opening.
[0013] Another embodiment of the present invention discloses a method for manufacturing a mask assembly, comprising the following steps: in a mask frame including a first mounting surface, a second mounting surface, and a first opening, a support member that divides the first opening into a plurality of second openings is arranged to be mounted on the first mounting surface, the second mounting surface being arranged to have a step difference from the first mounting surface; a first mask including a third opening corresponding to the second opening is arranged to be mounted on the support member; the support member and the first mask are fixed to the first mounting surface; and a second mask is arranged on the second mounting surface and fixed.
[0014] In this embodiment, the following step may also be included: removing a portion of at least one of the support component, the first mask, and the second mask.
[0015] In this embodiment, at least one of the support member, the first mask, and the second mask can be cut based on a slot arranged on at least one of the first mounting surface and the second mounting surface.
[0016] In this embodiment, the following steps may also be included: stretching at least one of the support member, the first mask, and the second mask.
[0017] In this embodiment, the support component may include a magnetic material.
[0018] In this embodiment, when viewed in a plane, the second opening can be arranged inside the third opening.
[0019] In this embodiment, a plurality of second masks arranged adjacent to each other in a second direction may be provided, each of the plurality of second masks shielding all the third openings arranged in a row along a first direction.
[0020] In this embodiment, when viewed on a plane, the fourth opening may be arranged only in the area of the second mask that overlaps with the third opening.
[0021] Another embodiment of the present invention discloses a manufacturing apparatus for a display device, comprising: a mask assembly as described above; a cavity into which the mask assembly and a substrate are inserted; and a deposition source disposed inside the cavity in a manner opposite to the mask assembly, and supplying a deposition material to the substrate.
[0022] In this embodiment, the support member can be in the form of a grid to divide the first opening into the plurality of second openings.
[0023] In this embodiment, at least one of the first mounting surface and the second mounting surface may include a slot.
[0024] In this embodiment, the mask frame may include a protrusion having a first mounting surface and a second mounting surface.
[0025] In this embodiment, when viewed in a plane, the second opening is arranged inside the third opening.
[0026] Other aspects, features, and advantages, besides those described above, will become apparent from the following drawings, the scope of the claims, and the detailed description of the invention.
[0027] This general and specific aspect can be implemented using systems, methods, computer programs, or any combination of systems, methods, and computer programs.
[0028] The mask assembly according to embodiments of the present invention can deposit a material in a precise pattern on a substrate. The manufacturing method of the mask assembly according to embodiments of the present invention can manufacture a mask assembly having a pre-designed pattern.
[0029] The manufacturing apparatus for the display device according to embodiments of the present invention is capable of manufacturing display devices having precise patterns. Attached Figure Description
[0030] Figure 1 This is a cross-sectional view showing a manufacturing apparatus for a display device according to an embodiment of the present invention.
[0031] Figure 2 This is a perspective view showing a mask assembly according to an embodiment of the present invention.
[0032] Figure 3 It is shown Figure 2 A plan view of a portion of the mask frame shown.
[0033] Figure 4 It is along Figure 3 A cross-sectional view taken from line IV-IV′.
[0034] Figure 5 It is shown Figure 2A plan view of a portion of the support component shown.
[0035] Figure 6 It is shown Figure 2 A plan view of a portion of the first mask shown.
[0036] Figure 7 and Figure 8 It is shown Figure 2 A partial perspective view of the manufacturing process of the mask assembly shown.
[0037] Figure 9 and Figure 10 It is shown Figure 2 A plan view of the manufacturing process of the mask assembly shown.
[0038] Figure 11 This is a plan view illustrating a display device according to an embodiment of the present invention.
[0039] Figure 12 It is along Figure 11 A cross-sectional view taken from the A-A' line.
[0040] Explanation of reference numerals in the attached figures
[0041] 20: Display device; 212: Protrusion.
[0042] 100: Manufacturing apparatus for display device; 213: First mounting surface
[0043] 110: Chamber 221: Main body of support component
[0044] 120: Magnetic force generation unit; 222: Grid component
[0045] 131: First support part; 223: First connecting part
[0046] 132: Second support part; 224: Welded part of support component
[0047] 140: Camera section; 225: Supporting component dummy section
[0048] 160: Sediment source; 230: First mask
[0049] 170: Pressure regulating section; 231: First mask body section
[0050] 200: Mask assembly; 233: Second connecting component
[0051] 210: Mask frame; 234: First mask welding section
[0052] 211: Main frame section; 235: First mask virtual section
[0053] 214: Second mounting surface; 240: Second mask
[0054] 220: Support component Detailed Implementation
[0055] This invention can be modified in various ways and has multiple embodiments, specific embodiments of which are shown in the accompanying drawings and described in detail in the description. The effects and features of this invention, as well as the methods for achieving them, will be explained by referring to the accompanying drawings. Figure 1 As will become clear from the detailed embodiments described below. However, the invention is not limited to the embodiments disclosed below, but can be implemented in many different forms.
[0056] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding constituent elements will be given the same reference numerals and repeated descriptions thereof will be omitted.
[0057] In the following embodiments, terms such as "first" and "second" are not used in a limiting sense, but are used for the purpose of distinguishing one constituent element from other constituent elements.
[0058] In the following embodiments, the singular expression includes the plural expression unless otherwise explicitly indicated in the context.
[0059] In the following embodiments, terms such as "comprising" or "having" indicate the presence of features or constituent elements described in the specification, without pre-excluding the possibility of adding more than one other feature or constituent element.
[0060] In the following embodiments, when referring to a portion of a membrane, region, constituent element, etc., located on or above another portion, it includes not only the case where it is immediately above the other portion, but also the case where other membranes, regions, constituent elements, etc. exist in between.
[0061] For ease of explanation, the sizes of the constituent elements in the accompanying drawings may be exaggerated or reduced. For example, for ease of explanation, the sizes and thicknesses of the various components shown in the drawings are arbitrarily depicted, and therefore the invention is not necessarily limited to the content shown in the drawings.
[0062] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system, but can be interpreted to include their broader meaning. For example, the x-axis, y-axis, and z-axis may intersect each other perpendicularly, but may also refer to different directions that do not intersect each other perpendicularly.
[0063] Where an embodiment can be implemented in different ways, a particular process sequence may be performed in a different order than that described. For example, two processes described consecutively may be performed substantially simultaneously, or they may be performed in the reverse order of the description.
[0064] Figure 1 This is a cross-sectional view showing a manufacturing apparatus for a display device according to an embodiment of the present invention.
[0065] refer to Figure 2 The manufacturing apparatus 100 for the display device may include a chamber 110, a magnetic force generating unit 120, a first support unit 131, a second support unit 132, an imaging unit 140, a mask assembly 200, a deposition source 160, and a pressure regulating unit 170.
[0066] The chamber 110 may have an internal space and may be part of the chamber 110 having an opening. The opening of the chamber 110 is provided with a gate valve 110A, thereby selectively opening and closing the opening of the chamber 110.
[0067] The magnetic force generating section 120 can be formed to be fixed to the cavity 110. In this case, the magnetic force generating section 120 can include at least one of an electromagnet and a permanent magnet to selectively generate a magnetic field. The magnetic force generating section 120 can cause the mask assembly 200 to be tightly attached to the display substrate D side.
[0068] The first support portion 131 can support the display substrate D. In this case, the first support portion 131 can support the display substrate D in various ways. For example, the first support portion 131 may include an electrostatic chuck or an adhesive chuck. In this case, the first support portion 131 and the magnetic force generating portion 120 can be formed as one unit. As another embodiment, the first support portion 131 may include a frame that holds a portion of the display substrate D and supports the display substrate D, or a clamp that holds and fixes a portion of the display substrate D. The first support portion 131 is not limited to the above, and may include all devices capable of supporting the display substrate D. However, for ease of explanation, the following detailed description will focus on the case where the first support portion 131 includes a clamp that holds the display substrate D.
[0069] The mask assembly 200 can be placed and supported in the second support portion 132. At this time, the mask assembly 200 can be finely adjusted in at least two different directions in the second support portion 132.
[0070] The imaging unit 140 can capture the positions of the display substrate D and the mask assembly 200. At this time, at least one of the display substrate D and the mask assembly 200 can be moved based on the image captured by the imaging unit 140 to align the display substrate D and the mask assembly 200.
[0071] The mask assembly 200 may include a mask frame 210, a support component 220, a first mask 230, and a second mask 240.
[0072] The sedimentation source 160 can cause the sediment to evaporate after it is inserted into it. At this time, the sedimentation source 160 can be equipped with a heater 160A, and the sediment can be evaporated by the heat applied by the heater 160A.
[0073] The sedimentation source 160 can be formed in various forms. For example, the sedimentation source 160 can be a point sedimentation source with a circular inlet for discharging sediment. Furthermore, the sedimentation source 160 can be a linear sedimentation source with an elongated shape and multiple inlets or an elongated pore shape. For ease of explanation, the following detailed description will focus on the case where the sedimentation source 160 is arranged opposite a point on the mask assembly 200 and is a point sedimentation source.
[0074] The pressure regulating unit 170 can be connected to the chamber 110 to regulate the pressure inside the chamber 110 to be approximately atmospheric pressure or a vacuum. In this case, the pressure regulating unit 170 may include a connecting pipe 171 connected to the chamber 110 and a pressure regulating pump 172 arranged in the connecting pipe 171.
[0075] Furthermore, observing the method of manufacturing a display device (not shown) using the display device manufacturing apparatus 100 as described above, a display substrate D can be prepared for manufacturing.
[0076] The pressure regulating unit 170 can maintain atmospheric pressure inside the chamber 110, and after the gate valve 110A is opened, the display substrate D and the deformation-compensated mask assembly 200 can be inserted into the chamber 110. At this time, a separate robotic arm, conveyor, etc. can be provided inside or outside the chamber 110 to transport the display substrate D and the mask assembly 200.
[0077] The pressure regulating unit 170 can maintain a near-vacuum inside the chamber 110. Furthermore, at least one of the first support unit 131 and the second support unit 132 can operate to adjust the distance between the display substrate D and the mask assembly 200 to a preset distance. The imaging unit 140 can capture images of the display substrate D and the mask assembly 200 while micro-driving the first support unit 131 and the second support unit 132, thereby aligning the display substrate D and the mask assembly 200 by fine-tuning at least one of them.
[0078] Heater 160A can operate to supply deposited material from deposition source 160 to mask assembly 200. The deposited material through mask assembly 200 can be deposited onto display substrate D in a predetermined pattern.
[0079] During the process described above, at least one of the deposition source 160 and the display substrate D can undergo linear movement. Alternatively, deposition can be performed when both the deposition source 160 and the display substrate D are stationary. For ease of explanation, the following detailed description will focus on the scenario where deposition is performed when both the deposition source 160 and the display substrate D are stationary.
[0080] As described above, the deposit material supplied from the deposition source 160 can be deposited onto the display substrate D through the mask assembly 200, thereby forming at least one of the intermediate layers described later.
[0081] As described above, when forming at least one of the intermediate layers, the deposition source 160 can supply a high-temperature deposition material. In this case, the first mask 230 may experience problems such as sagging due to thermal deformation or load. In this situation, the magnetic force of the magnetic force generating section 120 can not only prevent the support member 220 from sagging, but also cause the support member 220 to exert a force on the first mask 230 toward the magnetic force generating section 120.
[0082] In the situation described above, the support member 220 can reduce at least one of the positions and shapes of the first mask 230 from the initial state by preventing the first mask 230 from drooping toward the deposition source 160 side.
[0083] Subsequently, a counter electrode can be formed on the intermediate layer using other display device manufacturing equipment. After forming the intermediate layer and counter electrode as described above, encapsulation components can be arranged on the counter electrode to manufacture the display device 20.
[0084] Therefore, the manufacturing apparatus 100 for the display device is capable of forming at least one of the intermediate layers with accurate patterns or forming a counter electrode in an accurate area.
[0085] The display device manufacturing apparatus 100 can deposit a deposition material onto the display substrate D in an accurate pattern by accurately maintaining the shapes of the second opening 222-1 and the third opening 231-1.
[0086] Figure 3 This is a perspective view showing a mask assembly according to an embodiment of the present invention. Figure 2 It is shown Figure 4 A plan view of a portion of the mask frame shown. Figure 3 It is along Figure 5 A cross-sectional view taken from line IV-IV′.
[0087] Figure 2 It is shown Figure 6 A plan view of a portion of the support component shown. Figure 2 It is shown Figure 2 to Figure 6A plan view of a portion of the first mask shown.
[0088] refer to Figure 2 The mask assembly 200 may include a mask frame 210, a support component 220, a first mask 230, and a second mask 240.
[0089] The mask frame 210 may include multiple frames connected to each other. These multiple frames can form a quadrilateral shape. In this case, the mask frame 210 may include a first opening 211-1 in its central portion. The first opening 211-1 can then be quadrilateral. For example, the first opening 211-1 can be rectangular or square. The mask frame 210 may then have a long side and a short side. For example, the long side of the mask frame 210 may be along... Figure 2 Arranged in the X direction, the short side of the mask frame 210 can be along... Figure 2 Arranged in the Y direction.
[0090] The mask frame 210 described above may include: a quadrilateral frame body 211; a protrusion 212 disposed on the outside of the frame body 211; and a first mounting surface 213 and a second mounting surface 214 formed with a stepped difference on the protrusion 212. In this case, the protrusion 212 can protrude from the outside of the frame body 211. The first mounting surface 213 and the second mounting surface 214 may be arranged flatly, with a support member 220 disposed on the first mounting surface 213 and a first mask 230 disposed on the second mounting surface 214. A first slot 213-1 and a second slot 214-1 may be respectively disposed on the first mounting surface 213 and the second mounting surface 214. At this time, the first slot 213-1 may be disposed on the innermost side of the first mounting surface 213, and the second slot 214-1 may be disposed on the innermost side of the second mounting surface 214.
[0091] The support member 220 can be arranged in the first opening 211-1 to divide the first opening 211-1 into a plurality of second openings 222-1.
[0092] For example, the support member 220 may be equipped with a grid arranged internally along a first direction and a second direction that are different from each other. The support member 220 may include: a support member body portion 221 forming an outline; and a grid member 222, which, in an opening region inside the support member body portion 221, is arranged along the first direction (e.g., Figure 2 The Y-axis direction) and the second direction (e.g., Figure 7The grid members 222 are arranged in the X-axis direction. This grid member 222 can divide the first opening 211-1 into a plurality of second openings 222-1. In this case, the size of the second openings 222-1 can be smaller than the size of the first openings 211-1. The support member 220 described above may include a support member dummy portion 225 connected to the support member body portion 221. The support member dummy portion 225 can be removed after the support member 220 is attached to the mask frame 210. Furthermore, the support member 220 may include a support member weld portion 224 connected to the support member body portion 221. The support member weld portion 224 is disposed on the first mounting surface 213 and can be fixed to the support member body portion 221 by welding. In this case, the support member weld portion 224 can be formed with a stepped difference. For example, the support member weld portion 224 can be bent such that it is respectively disposed on the first mounting surface 213 and the second mounting surface 214. In this case, the support member welding portion 224 can be placed not only on the first mounting surface 213, but also on the second mounting surface 214. At this time, the support member main body portion 221 and the first dummy opening portion 223-1 can be arranged on different planes. A first dummy opening portion 223-1 can be formed between the support member welding portion 224 and the support member dummy portion 225 as described above to avoid interference with the protrusion 212 of the mask frame 210. Multiple such first dummy opening portions 223-1 can be provided, and a first connecting member 223 connecting the support member welding portion 224 and the support member dummy portion 225 can be arranged between the multiple first dummy opening portions 223-1. In this case, a mounting groove 215 for placing the first connecting member 223 can be arranged in the protrusion 212 to prevent interference between the first connecting member 223 and the protrusion 212. As described above, a portion of the support component dummy part 225 and the support component welded part 224 can be removed after the support component welded part 224 is fixed to the mask frame 210.
[0093] The magnetic susceptibility of the support member 220, as described above, can be higher than that of the first mask 230. In this case, the support member 220 may include a magnetic material, while the first mask 230 may not include a magnetic material. In particular, the support member 220 may be formed from a sheet of Invar material, and the first mask 230 may be formed from a sheet of austenitic stainless steel (SUS).
[0094] The first mask 230 can be arranged on the support member 220. One or more first masks 230 can be provided. As one embodiment, when only one first mask 230 is provided, it can cover the entire first opening 211-1. When multiple first masks 230 are provided, they can be arranged adjacent to each other. However, for ease of explanation, the following detailed description will focus on the case where one first mask 230 completely covers the first opening 211-1.
[0095] The first mask 230 can be arranged on the support member 220. As described above, the first mask 230 may include: a first mask body portion 231 with a third opening portion 231-1; a first mask welding portion 234 connected to the first mask body portion 231; and a first mask dummy portion 235 connected to the first mask welding portion 234. At least one third opening portion 231-1 may be provided. In this case, the third opening portion 231-1 may be arranged to correspond to the second opening portion 222-1. For example, when viewed in a plane, the third opening portion 231-1 may be arranged inside the second opening portion 222-1. In this case, the area of the third opening portion 231-1 may be smaller than the area of the second opening portion 222-1. The shape of the third opening portion 231-1 can be varied. For example, the shape of the third opening portion 231-1 may be a polygon, a circle, or an ellipse. However, for ease of explanation, the following detailed description focuses on the case where the shape of the third opening portion 231-1 is circular.
[0096] Similar to the support component welding portion 224, the first mask welding portion 234 can be formed with a stepped difference. As another embodiment, the first mask welding portion 234 can also be formed in a flat plate shape.
[0097] The first mask dummy portion 235 may include a second dummy opening 233-1. In this case, multiple second dummy openings 233-1 may be provided, and the multiple second dummy openings 233-1 may be arranged spaced apart from each other, and a second connecting member 233 may be arranged between adjacent second dummy openings 233-1. This second connecting member 233 can connect the first mask welding portion 234 and the first mask dummy portion 235 to each other. Furthermore, when the first mask 230 is arranged on the mask frame 210, the protrusion 212 is inserted into the second dummy opening 233-1, thereby minimizing the interference between the first mask 230 and the protrusion 212. In particular, in the case described above, the first mask 230 may be arranged on the support member 220, and after the first mask 230 is fixed to the support member 220 and the mask frame 210 by welding, a portion of the first mask welding portion 234 and the first mask dummy portion 235 may be removed.
[0098] The second mask 240 can be arranged on the second mounting surface 214 of the mask frame 210. At least one second mask 240 can be provided. In this case, if multiple second masks 240 are provided, they can be arranged adjacent to each other. For example, multiple second masks 240 can be arranged adjacent to each other along a second direction. In this case, the length direction of each second mask 240 can be the same as or parallel to the first direction. For ease of explanation, the following detailed description focuses on the case where multiple second masks 240 are provided.
[0099] Each of the second masks 240 as described above can be arranged to cover at least a portion of the first mask 230. In this case, each of the second masks 240 can be arranged to cover all the third openings 231-1 arranged in a row along the first direction. A plurality of fourth openings 241 can be arranged on the surface of each of the second masks 240. In this case, the plurality of fourth openings 241 can be arranged spaced apart from each other on most of the surface of each of the second masks 240. As another embodiment, a portion of the plurality of fourth openings 241 can also be arranged to correspond to the third openings 231-1. That is, the fourth openings 241 can be arranged only in the area of the second mask 240 that overlaps with the third openings 231-1 when viewed in a plane.
[0100] The second mask 240 can be fixed to the mask frame 210 under tension. In this case, the second mask 240 can be formed in a stick shape. The second mask 240 can be fixed to the mask frame 210 in a stretched state. For example, both ends of the second mask 240 can be respectively placed on the second mounting surface 214 and fixed by welding.
[0101] Therefore, the mask assembly 200 can reduce the situation where the position of each opening is variable in the manufacturing process.
[0102] Figure 8 and Figure 2 It is shown Figure 9 A partial perspective view of the manufacturing process of the mask assembly shown. Figure 10 and Figure 2 It is shown Figure 7 to Figure 10 A plan view of the manufacturing process of the mask assembly shown.
[0103] refer to Figure 5 The mask frame 210, support component 220, first mask 230, and second mask 240 can be prepared for fabrication. At this time, they can be used in conjunction with the aforementioned... Figure 6 and Figure 7 The support component 220 and the first mask 230 are manufactured in the same form as shown.
[0104] refer toFigure 8 A support member 220 can be arranged in the mask frame 210. In this case, the support member 220 can be arranged in a stretched state in the mask frame 210. For example, the support member 220 can be stretched along the direction of the protrusion 212. The protrusion 212 can be inserted into the support member 220. In this case, the support member welding portion 224 of the support member 220 can be placed on the first mounting surface 213, and the support member dummy portion 225 can protrude outwards from the outline of the protrusion 212. Furthermore, the protrusion 212 can be inserted into the first dummy opening 223-1.
[0105] refer to Figure 9 The first mask 230 can be placed on the support member 220 while the support member 220 is stretched, after the support member 220 is placed on the mask frame 210 as described above. In the case described above, a third opening 231-1 can be arranged on the second opening 222-1. When the first mask 230 is arranged, a protrusion 212 can be inserted into the second dummy opening 233-1. Furthermore, the first mask dummy part 235 can be arranged on the support member dummy part 225, and the second connecting member 233 can be arranged on the first connecting member 223.
[0106] The support member 220 and the first mask 230, as described above, can be fixed to the first mounting surface 213. The order in which the support member 220 and the first mask 230 are fixed to the first mounting surface 213 can vary. For example, in one embodiment, the first mask 230 can be fixed to the support member 220 after the support member 220 is fixed to the first mounting surface 213. In this case, the support member 220 can be stretched and fixed to the mask frame 210, and then the first mask 230 can be stretched again and placed on the support member 220, and the first mask 230 can be fixed to the support member 220. In another embodiment, the support member 220 can be placed on the mask frame 210, the first mask 230 can be placed on the support member 220, and then both the support member 220 and the first mask 230 can be fixed to the first mounting surface 213 simultaneously. For ease of explanation, the following detailed description focuses on the case where the support member 220 and the first mask 230 are simultaneously fixed to the first mounting surface 213.
[0107] After the support member 220 and the first mask 230 are fixed to the mask frame 210 as described above, a portion of the support member 220 and a portion of the first mask 230 can be removed. Specifically, a portion of the support member weld portion 224, the support member dummy portion 225 of the support member 220, a portion of the first mask weld portion 234 of the first mask 230, and the first mask dummy portion 235 of the first mask 230 can be removed. In this case, a laser or a blade can be used to remove a portion of the support member 220 and a portion of the first mask 230. At this time, a laser can be used to irradiate the first mask 230 and the support member 220 along the first cutting line CL1 corresponding to the first slot 213-1, or the first mask 230 and the support member 220 can be removed by using a blade.
[0108] refer to Figure 11 After the first mask 230 and the support member 220 are fixed, the second mask 240 can be stretched and arranged on the mask frame 210. At this time, both ends of the second mask 240 can be arranged on the protrusion 212.
[0109] If the second mask 240 is arranged as described above, the portion of the second mask 240 disposed above the second mounting surface 214 can be fixed to the second mounting surface 214. In this case, the second mask 240 can be disposed on the second mounting surface 214 by welding.
[0110] If the second mask 240 is fixed to the second mounting surface 214 as described above, a portion of both ends of the second mask 240 can be removed. For example, the two ends of the second mask 240 can be removed by cutting along the second cutting line CL2 corresponding to the second slot 214-1. In this case, the method for removing the two ends of the second mask 240 can be as described above, using a laser or a blade, etc.
[0111] In the situation described above, the support member 220 can prevent the first mask 230 and the second mask 240 from sagging when the magnetic force generating part (not shown) described above is working. Moreover, the support member 220 can also minimize the deformation of the mask frame 210.
[0112] Therefore, the method for manufacturing mask components can produce mask components 200 capable of depositing precise patterns.
[0113] Figure 12 This is a plan view illustrating a display device according to an embodiment of the present invention. Figure 11 It is along Figure 11 A cross-sectional view taken from the A-A' line.
[0114] Reference Figure 12 and The display device can define a display area DA on the substrate 21, and a non-display area NDA can be defined on the outer contour of the display area DA. A light-emitting portion is arranged in the display area DA, and power wiring (not shown) can be arranged in the non-display area NDA. Furthermore, a pad portion C can be arranged in the non-display area NDA. In this case, the display area DA can be formed in various shapes. For example, the display area DA can be a polygon, a circle, or an ellipse. For ease of explanation, the following detailed description will focus on the case where the display area DA is circular.
[0115] The display device 20 may include a display substrate D and an encapsulation component (not shown). In this case, the display substrate D may include a substrate 21, a thin-film transistor (TFT), a passivation film 27, and a pixel electrode 28A. As another embodiment, the display substrate D may also include at least one layer selected from the substrate 21, the TFT, the passivation film 27, the pixel electrode 28A, and an intermediate layer 28B. As one embodiment, the encapsulation component may include: an encapsulation substrate (not shown) arranged facing the substrate 21; and a sealing component (not shown) disposed between the substrate 21 and the encapsulation substrate. In this case, the organic light-emitting diode (OLED) disposed on the substrate 21 can be sealed by the sealing component and the encapsulation substrate. As another embodiment, the encapsulation component may include a thin-film encapsulation layer E. For ease of explanation, the following detailed description focuses on the case where the display substrate D includes the substrate 21, the TFT, the passivation film 27, and the pixel electrode 28A. Furthermore, for ease of explanation, the detailed description focuses on the case where the encapsulation component includes the thin-film encapsulation layer E.
[0116] The substrate 21 may comprise glass or a polymer resin. The polymer resin may include polymers such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 21 comprising the polymer resin may have flexible, rollable, or foldable properties. The substrate 21 may be a multilayer structure comprising a layer containing the aforementioned polymer resin and an inorganic layer (not shown).
[0117] A thin-film transistor (TFT) is formed on a substrate 21, a passivation film 27 is formed to cover the TFT, and an organic light-emitting element (OLED) 28 can be formed on the passivation film 27.
[0118] A buffer layer 22, composed of organic and / or inorganic compounds, is also formed on the substrate 21, which can utilize SiO2. x (x≥1), SiN x (x≥1) is formed.
[0119] After an active layer 23 with a predetermined pattern is formed on the buffer layer 22, the active layer 23 is buried through the gate insulating layer 24. The active layer 23 has a source region 23A and a drain region 23C, and also includes a channel region 23B between them.
[0120] This active layer 23 can be formed from a variety of materials. For example, the active layer 23 may include an inorganic semiconductor material such as amorphous silicon or crystalline silicon. As another example, the active layer 23 may include an oxide semiconductor. As yet another example, the active layer 23 may include an organic semiconductor material. However, for ease of explanation, the following detailed description will focus on the case where the active layer 23 is formed using amorphous silicon.
[0121] This active layer 23 can be formed by crystallizing an amorphous silicon film on the buffer layer 22 to form a polycrystalline silicon film, and then patterning the polycrystalline silicon film. Depending on the type of TFT, such as a driving TFT (not shown) or a switching TFT (not shown), the source region 23A and the drain region 23C of the active layer 23 are doped with impurities.
[0122] A gate electrode 25 corresponding to the active layer 23 and an interlayer insulating layer 26 burying it are formed on the gate insulating layer 24.
[0123] Furthermore, after forming contact hole H1 in interlayer insulating layer 26 and gate insulating layer 24, source electrode 27A and drain electrode 27B, respectively in contact with source region 23A and drain region 23C, are formed on interlayer insulating layer 26.
[0124] A passivation film 27 is formed on the upper part of the thin-film transistor thus formed, and a pixel electrode 28A of an organic light-emitting element (OLED) 28 is formed on the upper part of the passivation film 27. The pixel electrode 28A is in contact with the drain electrode 27B of the TFT through a via hole H2 formed in the passivation film 27. The passivation film 27 can be formed of inorganic and / or organic materials, a single layer or two or more layers, and can be formed as a planarization film to make the upper surface flat, independent of the curvature of the lower film. Conversely, it can also be formed to be curved along the curvature of the lower film. Furthermore, the passivation film 27 is preferably formed using a transparent insulator to achieve a resonance effect.
[0125] After the pixel electrode 28A is formed on the passivation film 27, a pixel defining film 29 can be formed by organic and / or inorganic materials to cover the pixel electrode 28A and the passivation film 27, and the pixel defining film 29 is opened to expose the pixel electrode 28A.
[0126] Furthermore, at least an intermediate layer 28B and a counter electrode 28C are formed on the pixel electrode 28A. Alternatively, the counter electrode 28C may be formed on the entire surface of the display substrate D. In this case, the counter electrode 28C may be formed on the intermediate layer 28B and the pixel defining film 29. For ease of explanation, the following detailed description will focus on the case where the counter electrode 28C is formed on the intermediate layer 28B and the pixel defining film 29.
[0127] Pixel electrode 28A acts as a positive electrode, and counter electrode 28C acts as a negative electrode. Of course, it doesn't matter if the polarities of pixel electrode 28A and counter electrode 28C are opposite.
[0128] The pixel electrode 28A and the counter electrode 28C are insulated from each other through the intermediate layer 28B, and light emission in the organic light-emitting layer is achieved by applying voltages of different polarities to the intermediate layer 28B.
[0129] The intermediate layer 28B may be equipped with an organic emission layer. As an alternative example, the intermediate layer 28B may be equipped with an organic emission layer, and may also be equipped with at least one of a hole injection layer (HIL), a hole transport layer, an electron transport layer, and an electron injection layer. This embodiment is not limited to this; the intermediate layer 28B may be equipped with an organic emission layer, and may also be equipped with various other functional layers (not shown).
[0130] As described above, multiple intermediate layers 28B can be provided, and multiple intermediate layers 28B can form a display area DA. At this time, the multiple intermediate layers 28B can be arranged to be spaced apart from each other within the display area DA.
[0131] Furthermore, a unit pixel is composed of multiple sub-pixels, which can emit light of various colors. For example, the multiple sub-pixels can be equipped with sub-pixels that emit red, green, and blue light, and can also be equipped with sub-pixels that emit red, green, blue, and white light (not shown). These sub-pixels can be respectively included in the pixel electrode 28A, intermediate layer 28B, and counter electrode 28C described above.
[0132] The display device manufacturing apparatus described above can form at least one of at least one of the layers included in the intermediate layer 28B on the display substrate D. Specifically, the display device manufacturing apparatus 100 can form at least one of the following in the intermediate layer 28B: an organic light-emitting layer, a hole injection layer, a hole transport layer, an electron injection layer, an electron transport layer, and a functional layer.
[0133] In addition, the thin film encapsulation layer E may include multiple inorganic layers or include both inorganic and organic layers.
[0134] The organic layer of the thin-film encapsulation layer E may include polymer-based materials. Polymer-based materials may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resins (e.g., polymethyl methacrylate, polyacrylic acid, etc.), or any combination thereof.
[0135] The inorganic layer of the thin-film encapsulation layer E may include one or more inorganic insulating materials such as aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride.
[0136] The outermost layer of the thin-film encapsulation layer E that is exposed to the outside can be formed using an inorganic layer to prevent moisture from penetrating into the organic light-emitting element.
[0137] The thin-film encapsulation layer E may include at least one sandwich structure in which at least one organic layer is inserted between at least two inorganic layers. As another example, the thin-film encapsulation layer E may also include a sandwich structure in which at least one organic layer is inserted between at least two organic layers, and a sandwich structure in which at least one inorganic layer is inserted between at least two organic layers.
[0138] The thin-film encapsulation layer E can be sequentially composed of a first inorganic layer, a first organic layer, and a second inorganic layer from the top of the organic light-emitting element (OLED) 28.
[0139] As another example, the thin-film encapsulation layer E may sequentially include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer from the top of the organic light-emitting element (OLED) 28.
[0140] As another example, the thin-film encapsulation layer E may sequentially include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, a third inorganic layer, a third organic layer, and a fourth inorganic layer from the top of the organic light-emitting element (OLED) 28.
[0141] An additional metal halide layer comprising LiF may be included between the organic light-emitting element (OLED) 28 and the first inorganic layer. The metal halide layer can prevent damage to the organic light-emitting element (OLED) 28 during the sputtering formation of the first inorganic layer.
[0142] The area of the first organic layer can be narrower than that of the second inorganic layer, and the area of the second organic layer can also be narrower than that of the third inorganic layer.
[0143] In the case where multiple inorganic layers are provided as described above, the inorganic layers can be deposited in a manner that allows them to directly contact each other in the corner areas of the display device 20, and the organic layers can be kept from being exposed to the outside.
[0144] Therefore, the display device 20 can present a precise image.
[0145] While the present invention has been described with reference to one embodiment shown in the accompanying drawings, it is merely exemplary, and those skilled in the art will understand that various modifications and variations of the embodiments can be made accordingly. Therefore, the true scope of protection of the present invention should be determined based on the technical concept of the claims.
Claims
1. A mask assembly, comprising: A mask frame includes a first mounting surface, a second mounting surface, and a first opening, wherein the second mounting surface is arranged with a step difference from the first mounting surface; A supporting component is partially placed on the first mounting surface and divides the first opening into a plurality of second openings; A first mask, disposed on the support member, and including a third opening disposed corresponding to the second opening; and The second mask, a portion of which is disposed on the second placement surface, includes a plurality of fourth openings arranged in a manner corresponding to the third opening. The magnetic susceptibility of the support component is higher than that of the first mask. At least one of the first mounting surface and the second mounting surface includes a slot. The slot is located on the innermost side of the first mounting surface and / or the innermost side of the second mounting surface. The support member and the first mask can be cut with reference to the slot arranged on the first mounting surface, and the second mask can be cut with reference to the slot arranged on the second mounting surface.
2. The mask assembly as claimed in claim 1, wherein, The second opening and the third opening have different shapes.
3. The mask assembly as claimed in claim 1, wherein, The support component includes a magnetic material.
4. The mask assembly as claimed in claim 1, wherein, The support component is in the form of a grid to divide the first opening into the plurality of second openings.
5. The mask assembly as claimed in claim 1, wherein, The mask frame includes: The protrusion is provided with the first mounting surface and the second mounting surface.
6. The mask assembly as claimed in claim 1, wherein, When viewed in a plane, the third opening is arranged inside the second opening.
7. The mask assembly as claimed in claim 1, wherein, Equipped with a plurality of second masks arranged adjacent to each other in a second direction, each of the plurality of second masks shielding all the third openings arranged in a row along a first direction.
8. The mask assembly as claimed in claim 1, wherein, When viewed in a plane, the fourth opening is only located in the area of the second mask that overlaps with the third opening.
9. An apparatus for manufacturing a display device, comprising: The mask assembly as described in any one of claims 1 to 8; The chamber contains the mask assembly and the substrate; as well as A deposition source is arranged inside the cavity in a manner opposite to the mask assembly and supplies deposition material to the substrate.