Housing assembly and electronic device

Abstract

The present application relates to a shell assembly and an electronic device. The shell assembly includes a metal cover and a plastic covering body. The metal cover includes an inner side surface and an outer side surface, and the inner side surface and the outer side surface are opposite to each other. The metal cover further includes a groove, and the groove is recessed on the inner side surface so that the inner side surface is divided into a plurality of heat insulation areas. The plastic covering body is disposed on the metal cover body and completely covers the outer side surface of the metal cover body. The electronic device includes a shell assembly and a plurality of heat sources. The plurality of heat sources respectively correspond to the plurality of heat insulation areas on the inner side surface of the metal cover body. Thereby, the shell assembly and the electronic device can avoid the heat energy generated by the components from affecting each other.

Description

Technical Field

[0001] The present invention relates to a housing assembly with a heat dissipation structure and an electronic device, in particular to a housing assembly with a plurality of heat insulation areas and an electronic device including the housing assembly. Background Art

[0002] like Figure 1A and Figure 1B As shown, many electronic devices use a metal housing 2 in consideration of structural strength, rigidity, or to attract consumers' attention. Although the metal housing 2 can quickly conduct the heat energy generated by the heat source 4 (such as a chip) in the electronic device to the outside, it is also easy for the heat source to form a high-temperature hot spot P on the surface of the housing 2. When the user holds the housing 2 and touches the high-temperature hot spot P, he or she may feel uncomfortable or wonder if there is something wrong with the electronic device.

[0003] like Figure 2A and Figure 2B As shown, in addition, there are usually multiple heat sources 4 in the electronic device, and the heat energy generated by one heat source (chip) 4 is also easily conducted along the metal shell 2 to another heat source (chip) 4 or other electronic components, which may cause the chip to overheat and deteriorate its performance.

[0004] As the performance of electronic devices improves day by day, they tend to generate a lot of heat, and heat management becomes more important. Summary of the invention

[0005] An object of the present invention is to provide a housing assembly with a heat dissipation structure and an electronic device. The housing assembly has a plurality of heat insulation areas to avoid or reduce the influence caused by a heat source in the electronic device.

[0006] To achieve the above-mentioned purpose, the housing assembly provided by the present invention includes a metal cover and a plastic covering body. The metal cover includes an inner side and an outer side, and the inner side and the outer side are opposite to each other. The metal cover further includes a groove, and the groove is concavely arranged on the inner side so that the inner side is divided into a plurality of heat insulation areas. The plastic covering body is arranged on the metal cover body, and the plastic covering body completely covers the outer side of the metal cover body.

[0007] The electronic device provided by the present invention may include a housing assembly and a plurality of heat sources. The housing assembly includes a metal cover and a plastic covering body. The metal cover includes an inner side surface and an outer side surface, and the inner side surface and the outer side surface are opposite to each other. The metal cover further includes a groove, and the groove is recessed on the inner side surface so that the inner side surface is divided into a plurality of heat insulation areas. The plastic covering body is disposed on the metal cover body and completely covers the outer side surface of the metal cover body. The plurality of heat sources correspond to the plurality of heat insulation areas on the inner side surface of the metal cover body.

[0008] In one embodiment, the groove of the metal cover of the housing assembly of the present invention further penetrates to the outer side surface.

[0009] In one embodiment, the plastic covering body of the housing assembly of the present invention includes a heat-blocking portion, and the heat-blocking portion is disposed in the groove.

[0010] In one embodiment, the housing assembly of the present invention further includes a fan, wherein the heat blocking portion includes a groove, and the fan is disposed in the groove.

[0011] In one embodiment, the heat blocking portion of the housing assembly of the present invention protrudes from the inner side surface of the metal cover.

[0012] In one embodiment, the housing assembly of the present invention further comprises a heat barrier, wherein the heat barrier is disposed in the heat barrier portion of the plastic covering body.

[0013] In one embodiment, the housing assembly of the present invention further comprises a heat barrier, wherein the heat barrier is disposed in the groove of the metal cover.

[0014] In one embodiment, the housing assembly of the present invention further includes a fan, wherein the fan is disposed in the groove of the metal cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein:

[0016] Figure 1A and Figure 1B They are respectively schematic diagrams of heat flow on the outer side surface and along the AA line section of a known housing assembly in a heating state;

[0017] Figure 2A and Figure 2B They are respectively schematic diagrams of heat flow on the outer side surface and along the AA line section of another known housing assembly when the heat source is in a heating state;

[0018] Figure 3A and Figure 3B They are schematic diagrams of heat flow on the outer side surface of the housing assembly and along the AA line section according to the first preferred embodiment of the present invention;

[0019] Figure 4A and Figure 4B They are schematic diagrams of heat flow on the outer side surface of the housing assembly and along the AA line section according to the first preferred embodiment of the present invention;

[0020] Figure 5 Schematic diagram of heat flow in cross section of a housing assembly according to a second preferred embodiment of the present invention (the heat blocking portion and the plastic covering body are integrated);

[0021] Figure 6 Schematic diagram of heat flow in cross section of a housing assembly according to a third preferred embodiment of the present invention (the heat blocking portion has a groove);

[0022] 7A to 7C They are cross-sectional heat flow schematic diagrams of a housing assembly according to a fourth preferred embodiment of the present invention (with a heat barrier);

[0023] Fig. 8A and Figure 8B Schematic diagrams of the configuration of the housing assembly and the heat source according to the preferred embodiment of the present invention; and

[0024] Fig. 9 FIG. 4 is a cross-sectional schematic diagram of an electronic device according to a preferred embodiment of the present invention.

[0025] Explanation of symbols

[0026] 10, 10': Shell assembly

[0027] 20: Electronic devices

[0028] 30': Heat source

[0029] 100:Metal cover

[0030] 110: Inner side

[0031] 120: Outer side

[0032] 130: Groove

[0033] 140: Insulation area

[0034] 200: Plastic covering

[0035] 201: Display unit

[0036] 202: Back

[0037] 210: Heat barrier

[0038] 211: Groove

[0039] 220: Outer surface

[0040] 230: Inner surface

[0041] 300:Substrate

[0042] 400: Chip

[0043] 400A, 400B: Chip (heat source)

[0044] 500: Thermal barrier

[0045] 600: Fan

[0046] F: Heat DETAILED DESCRIPTION

[0047] The specific embodiments according to the present invention will be described in detail below; however, without departing from the spirit of the present invention, the present invention can also be practiced in a variety of different forms of embodiments, and the protection scope of the present invention should not be interpreted as being limited to what is stated in the specification.

[0048] Unless the context clearly indicates otherwise, the singular form "a" or "an" used herein also includes the plural forms. The directions (such as front, back, top, bottom, both sides, inside, outside, etc.) described herein are relative directions and can be defined according to the use state of the electronic device or housing assembly. They do not indicate or imply that the electronic device or housing assembly needs to be constructed or operated in a specific direction, nor can they be understood as limitations on the present invention.

[0049] The electronic device mentioned in the present invention may be a wireless communication product (mobile phone, tablet, computer, etc.), a wearable controller of a virtual reality (VR) game product, etc., which includes a housing assembly and multiple heat sources (or heat or temperature rise components). The housing assembly is an outer cover or a shell of the electronic device, that is, it constitutes an appearance of the electronic device, covers multiple internal components of the electronic device (including these heat sources), and also has a heat dissipation structure. The heat source here refers to a component inside the electronic device that will make the surrounding temperature higher than the ambient temperature after the operation of the electronic device. Such components may be, for example, chips, electronic components, hard disks, batteries, etc. in the electronic device that are prone to generate higher operating temperatures during operation, so that the user's skin can clearly feel the hot spots when it touches the surface of the product. The following will take the cover-shaped housing assembly as an example to explain the technical content of each component and how the heat dissipation structure conducts the heat energy generated by the heat source out of the electronic device, but it is not limited to this.

[0050] See also FIG. 3A to FIG. 3B As shown, when the heat generated by the heat source is conducted to the housing assembly 10 via the heat dissipation structure, they are respectively schematic diagrams of the heat flow of the housing assembly 10 in the heating state on the outer side and the AA line section according to the first preferred embodiment of the present invention. The housing assembly 10 can be used as a back cover of an electronic device to have a protective effect. The housing assembly 10 includes a metal cover 100 and a plastic covering 200, which can cover at least one substrate 300 and at least one chip 400 (i.e., the heat source, for clear presentation, each component is shown in an exaggerated proportion, and the relative size and position of the components are not limited by this) inside the electronic device.

[0051] The metal cover 100 has an inner side surface 110 and an outer side surface 120, the inner side surface 110 is opposite to the outer side surface 120, and the inner side surface 110 faces the chip 400, and can be close to the chip 400, have a distance from the chip 400, or partially abut the chip 400. The metal cover 100 can be formed into a cover-shaped body by die casting, or a metal plate can be formed into a cover-shaped body by stamping. The inner side surface 110 has multiple locking points, ribs, depressions and other features, and is not a completely smooth plane (not shown). The plastic covering body 200 is formed on the metal cover 100 by, for example, overmolding or insert molding to form a plastic (the raw material of the plastic covering body 200) to completely cover an outer side surface 120 of the metal cover 100. Therefore, in one direction of the outer side surface 120 (e.g., the direction of the normal), the user can only observe and touch the plastic covering body 200, but cannot observe and touch the outer side surface 120. Since the main purpose of the plastic covering body 200 is not to increase the structural rigidity or strength of the housing assembly 10, the plastic covering body 200 as a whole does not need to be too thick. Preferably, the plastic covering body 200 can be thinner than the metal cover 100 to avoid the generation of high-temperature hot spots. The plastic covering body 200 can also partially cover the inner side surface 110 of the metal cover 100.

[0052] When the chip 400 generates high temperature, the heat energy F is conducted to the metal cover 100 and then diffuses outward. Since the thermal conductivity coefficient of the plastic covering body 200 is much lower than that of the metal covering body 100, the heat energy F cannot be directly and quickly conducted to the outside by the plastic covering body 200. Therefore, the heat energy F will first be horizontally conducted and diffused in the metal covering body 100, and then gradually conducted to the plastic covering body 200. In this way, through the above-mentioned heat dissipation design, the heat energy F will not be concentrated at a certain point and quickly conduct heat to form a high-temperature hot spot on the outer surface of the housing assembly 10, so as not to cause discomfort to the user.

[0053] like FIG. 4A to FIG. 4B As shown, the metal cover 100 further includes a groove 130, which is disposed on the inner side 110 and is recessed from the inner side 110 to the outer side 120 to a depth, and the depth may be less than a thickness of the metal cover 100 or equal to the thickness, that is, it does not penetrate or penetrates to the outer side 120, so that the inner side 110 is divided into a plurality of heat insulation areas 140. The arrangement of the groove 130 allows the heat insulation area 140 to correspond to the positions of these chips (heat sources) 400A and 400B. In this way, when the heat energy F generated by the chip 400A is conducted through the metal cover 100, it will be blocked or blocked by the groove 130, and it is difficult to be transmitted to another chip 400B, so as not to affect the operation of other chips 400B or other components.

[0054] like Figure 5As shown, in another preferred embodiment, the plastic encapsulation body 200 may further include a heat blocking portion 210. The heat blocking portion 210 may be a part of the plastic encapsulation body 200, formed integrally with the plastic encapsulation body 200, extending in the groove 130, and further extending between the plurality of chips 400 to prevent heat from affecting each other through air convection. The heat blocking portion 210 may only fill a part of the groove 130 (the thickness of the heat blocking portion 210 in the groove 130 is less than the depth of the groove 130), or completely fill the groove 130 (the thickness is the same as the depth), or further protrude from the groove 130 (the thickness is greater than the depth, protruding from the inner side 110 of the metal cover 100). A width of the heat blocking portion 210 may also be set to abut or not abut the two sections of the metal cover 100 (the left and right sides of the groove 130).

[0055] like Figure 6 As shown, in another preferred embodiment, the heat blocking portion 210 may further include a groove 211. The groove 211 may extend from an inner surface 230 of the plastic package 200 to an outer surface 220, but does not penetrate the outer surface 220. There may be air in the groove 211, so that the heat conductivity of the heat blocking portion 210 as a whole is lower.

[0056] like 7A to 7C As shown, the housing assembly 10 may further include a thermal isolator 500. The thermal isolator 500 may be an independent component relative to the plastic covering body 200 (the two are not integrally formed) and is a poor conductor of heat, such as foam, rubber, etc. The thermal isolator 500 may be independent of the plastic covering body 200 and located in the groove 130 (such as Fig. 7A ), or, the thermal barrier 500 may be hermetically enclosed by the thermal barrier portion 210 and located in the groove 130 (eg, Figure 7B In addition, the heat barrier 500 may also be disposed in the groove 211, or further protrude from the groove 211 (eg Figure 7B Preferably, the thermal conductivity of the heat barrier 500 may be lower than the thermal conductivity of the plastic enclosure 200 .

[0057] like Fig. 8A and Figure 8B, which is a schematic diagram of the inner side of the housing assembly 10 according to a preferred embodiment of the present invention. In each of the above preferred embodiments, the groove 130 may have a specific shape, such as a rectangle or a U-shape, to cope with the position of the heat source 400, to avoid the heat energy of each heat source 400 from affecting each other, or to isolate components that are susceptible to temperature. The thermal barrier 500 may also have a length equal to the groove 130 and be continuously arranged in the groove 130, or be less than the length of the groove 130 and be discontinuously and segmentedly arranged in the groove 130, as required. The housing assembly 10 may further include a fan 600, which is arranged in the groove 130, and can blow or extract air in the groove 130, disperse the heat energy to reduce the local high temperature, and direct the heat energy to a predetermined direction for discharge.

[0058] See also Fig. 9 , is a three-dimensional schematic diagram of an electronic device 20 according to another preferred embodiment of the present invention, which includes a housing assembly 10' and at least one heat source 30'. The electronic device 20 may include a display portion 201 and a back portion 202. The display portion 201 may include a display screen of a mobile phone or a tablet and its frame, and the back portion 202 may include a housing assembly 10' and a frame relative to the display portion 201 (the technical content of which may refer to the housing assembly 10 of the above embodiment). In this embodiment, the heat source 30' may be a component that is prone to generate heat during operation, such as a chip, a microprocessor, a battery, etc., which is disposed in the accommodation space formed by the display portion 201 and the back portion 202, and may be electrically connected to other components in the accommodation space, such as a circuit board, an antenna, a sound-emitting element, etc.

[0059] In summary, the housing assembly and electronic device of the present invention can have the structural rigidity and strength of a metal cover, and have grooves to separate multiple heat insulation areas to prevent the heat energy of multiple heat sources from affecting each other. In addition, it can also have heat dissipation structures such as heat barriers and / or heat insulation parts formed by a plastic coating to provide further heat insulation to have good heat dissipation management. The housing assembly can be used in electronic devices as a component of the electronic device.

[0060] The above embodiments are only used to illustrate the implementation of the present invention and to explain the technical features of the present invention, and are not used to limit the protection scope of the present invention. Any changes or equivalent arrangements that can be easily completed by a person skilled in the art belong to the scope claimed by the present invention, and the scope of protection of the present invention shall be subject to the claims.

Claims

1. A housing assembly, comprising: A metal cover, comprising an inner side surface and an outer side surface, the inner side surface and the outer side surface are opposite to each other, and the metal cover further comprises a groove, the groove is recessed on the inner side surface, so that the inner side surface is divided into a plurality of heat insulation areas; and A plastic covering body is disposed on the metal cover body, and the plastic covering body completely covers the outer side surface of the metal cover body; in, The groove of the metal cover further penetrates to the outer side surface, and the plastic covering body comprises a heat-blocking part which is extendedly arranged in the groove.

2. The housing assembly according to claim 1, characterized in that: It further comprises a fan, wherein the heat blocking portion comprises a groove, and the fan is disposed in the groove.

3. The housing assembly according to claim 1, characterized in that: The heat blocking portion protrudes from the inner side surface of the metal cover.

4. The housing assembly as claimed in claim 1 further comprises a thermal barrier, wherein: The heat barrier is arranged in the heat barrier portion of the plastic covering body.

5. The housing assembly according to claim 4, characterized in that: The heat blocking portion includes a groove, and the heat blocking element is arranged in the groove.

6. The housing assembly as claimed in claim 1 further comprises a thermal barrier, wherein: The heat barrier is arranged in the groove of the metal cover.

7. The housing assembly as claimed in claim 1 further comprises a fan, wherein: The fan is arranged in the groove of the metal cover.

8. An electronic device comprising: A shell assembly includes a metal cover and a plastic covering body, wherein the metal cover includes an inner side and an outer side, wherein the inner side and the outer side are opposite to each other, and the metal cover further includes a groove, wherein the groove is recessed on the inner side so that the inner side is divided into a plurality of heat insulation areas, and the plastic covering body is disposed on the metal cover and completely covers the outer side of the metal cover, wherein: The groove of the metal cover further penetrates to the outer side surface, and the plastic covering body includes a heat-blocking portion, which is extendedly disposed in the groove; as well as A plurality of heat sources respectively correspond to the plurality of heat insulation areas on the inner side surface of the metal cover.

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