Thermal bridge for electrical components

Abstract

A thermal bridge (200) includes an upper bridge assembly (202) including upper plates (230) arranged into an upper plate stack (232) and a lower bridge assembly (204) including lower plates arranged into a lower plate stack (250). The thermal bridge includes upper spring elements (212) extending from the upper plates having upper mating interfaces that engage the lower plates to bias the upper plates in a first biasing direction generally away from the lower bridge assembly. The thermal bridge includes lower spring elements (214) extending from the lower plates having lower mating interfaces that engage the upper plates to bias the lower plates in a second biasing direction generally away from the upper bridge assembly. A bridge frame (208) having connecting elements (220) extends through the upper plates and the lower plates to retain the upper plates in the upper plate stack and to retain the lower plates in the lower plate stack.

Description

Technical Field

[0001] The main topic of this article is heat dissipation of electrical components. Background Technology

[0002] It may be necessary to transfer heat energy (or heat) from designated components of a system or device. Some systems use electrical components, such as electrical connectors, to transmit data and / or power to and from different systems and devices. Some systems use electrical components, such as pluggable modules, to transmit data signals in the form of optical and / or electrical signals via communication cables. Some systems use electrical components (such as integrated circuits) to control the system. Electrical components define heat sources within the system.

[0003] A common challenge for electrical system developers is thermal management. The heat generated by electrical components within a system can degrade performance and even damage components. To dissipate heat, systems include thermal components, such as heat sinks, which engage with heat sources, absorb heat from them, and transfer it away. Heat sinks are typically thermally coupled to another thermal component at a separate thermal interface. Components lose efficiency at each thermal interface. Furthermore, achieving efficient thermal coupling at interfaces is difficult due to the limited area and variations in surface temperature, such as the surface flatness of the interface surfaces.

[0004] Therefore, there is a need for a heat transfer component that can efficiently transfer heat away from electrical components. Summary of the Invention

[0005] According to the present invention, a thermal bridge is provided. The thermal bridge includes an upper bridge assembly comprising a plurality of upper plates arranged in an upper plate stack. Each upper plate has a front end and a rear end. Each upper plate has a side surface between the front end and the rear end. Each upper plate has an inner end and an outer end. The thermal bridge includes a lower bridge assembly comprising a plurality of lower plates arranged in a lower plate stack. Each lower plate has a front end and a rear end. Each lower plate has a side surface between the front end and the rear end. Each lower plate has an inner end and an outer end. The outer end of the lower plate is configured to face and thermally couple to an electrical component. The side surface of the lower plate faces the side surface of the upper plate to thermally abut the lower plate to the upper plate. The thermal bridge includes an upper spring element extending from the inner end of a corresponding upper plate. Each upper spring element includes an upper mating interface that engages the lower bridge assembly to bias the upper plate in a first bias direction substantially away from the lower bridge assembly. The thermal bridge includes a lower spring element extending from the inner end of a corresponding lower plate. Each lower spring element includes a lower mating interface that engages with the upper bridge assembly to bias the lower plate in a second bias direction substantially away from the upper bridge assembly. Attached Figure Description

[0006] Figure 1 This is a front perspective view of a communication system and a thermal bridge according to an exemplary embodiment.

[0007] Figure 2 This is an exploded view of a thermal bridge according to an exemplary embodiment.

[0008] Figure 3 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment.

[0009] Figure 4 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment, showing a thermal bridge in an expanded state.

[0010] Figure 5 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment, showing a thermal bridge in a compressed state.

[0011] Figure 6 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment, showing a thermal bridge in an expanded state.

[0012] Figure 7 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment, showing a thermal bridge in a compressed state.

[0013] Figure 8 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment.

[0014] Figure 9 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment.

[0015] Figure 10 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment.

[0016] Figure 11 This is a cross-sectional view of a thermal bridge according to an exemplary embodiment. Detailed Implementation

[0017] Figure 1 This is a front perspective view of a communication system 100 and a thermal bridge 200 according to an exemplary embodiment. The thermal bridge 200 is used to dissipate heat from at least one electrical component 102 of the communication system 100. The thermal bridge 200 is configured to be thermally coupled to the electrical component 102 at a lower thermal interface 104 at its bottom. In an exemplary embodiment, a heat transfer device 106 is provided to dissipate heat from the thermal bridge 200. For example, the thermal bridge 200 is configured to be thermally coupled to the heat transfer device 106 at an upper thermal interface 108. The thermal bridge 200 forms a thermal interface between the electrical component 102 and the heat transfer device 106. The heat transfer device 106 may be a heat sink, such as a finned heat sink, configured to be cooled by air by transferring heat to a passing airflow. In various other embodiments, the heat transfer device 106 may be a radiator, a cooling plate with liquid cooling, etc. In alternative embodiments, the communication system 100 may not have a separate heat transfer device, but instead rely on the thermal bridge 200 to dissipate heat directly to the external environment.

[0018] In an exemplary embodiment, the thermal bridge 200 is compressible between the electrical component 102 and the heat transfer device 106. In an exemplary embodiment, the lower thermal interface 104 conforms to the shape of the electrical component 102, and the upper thermal interface 108 conforms to the shape of the heat transfer device 106 to enable efficient heat transfer between them.

[0019] In an exemplary embodiment, electrical component 102 is mounted to circuit board 110. In various embodiments, electrical component 102 may be a communication connector, such as a receptacle connector, plug connector, pin connector, or other type of communication connector. In other various embodiments, electrical component 102 may be an electronic package, such as an integrated circuit or ASIC. In other various embodiments, electrical component 102 may be a pluggable module, such as an I / O transceiver module. In alternative embodiments, other types of electrical components may be provided.

[0020] In an exemplary embodiment, the thermal bridge 200 includes an upper bridge assembly 202 and a lower bridge assembly 204, which are joined together to form the thermal bridge 200. The lower bridge assembly 204 is configured to thermally bond the electrical component 102. The upper bridge assembly 202 is configured to dissipate heat to the external environment and / or to a heat transfer device 106. The upper bridge assembly 202 is in thermal communication with the lower bridge assembly 204 and dissipates heat from the lower bridge assembly 204 to cool the electrical component 102. In an exemplary embodiment, the thermal bridge 200 includes a spring assembly 206 (e.g., ...) between the upper bridge assembly 202 and the lower bridge assembly 204. Figure 2 (As shown) to press the upper bridge assembly 202 and the lower bridge assembly 204 apart, for example, to thermally engage with the electrical component 102 and the heat transfer device 106. In an exemplary embodiment, the thermal bridge 200 includes a bridge frame 208 for holding the upper bridge assembly 202 and the lower bridge assembly 204 together. The bridge frame 208 provides internal support for the upper bridge assembly 202 and the lower bridge assembly 204. The internal support eliminates the need for an external frame, which provides a larger surface area for heat dissipation and / or for thermal interface with the heat transfer device 106.

[0021] The upper bridge assembly 202 and the lower bridge assembly 204 are compressible relative to each other. For example, the upper bridge assembly 202 and the lower bridge assembly 204 are compressible between the electrical component 102 and the heat transfer device 106. A spring assembly 206 is used to bias the upper bridge assembly 202 and the lower bridge assembly 204 apart. In an exemplary embodiment, the spring assembly 206 presses the upper bridge assembly 202 against the bridge frame 208 in a first bias direction (e.g., upward), and the spring assembly 206 presses the lower bridge assembly 204 against the bridge frame 208 in a second bias direction (e.g., downward). The upper bridge assembly 202 and the lower bridge assembly 204 can be held by the bridge frame 208, thereby allowing a limited amount of floating movement of the upper bridge assembly 202 and the lower bridge assembly 204 relative to the bridge frame 208.

[0022] Figure 2 This is an exploded view of a thermal bridge 200 according to an exemplary embodiment, showing portions of the upper bridge assembly 202 and the lower bridge assembly 204. Figure 3 This is a cross-sectional view of a thermal bridge 200 according to an exemplary embodiment. The thermal bridge 200 includes an upper bridge assembly 202 and a lower bridge assembly 204. A spring assembly 206 is located between the upper bridge assembly 202 and the lower bridge assembly 204. A bridge frame 208 is configured to hold the upper bridge assembly 202 and the lower bridge assembly 204.

[0023] In an exemplary embodiment, thermal bridge 200 is a parallelepiped (e.g., generally box-shaped). For example, thermal bridge 200 includes a top 270, a bottom 272, a front portion 274, a rear portion 276, a first side 280, and a second side 282. Top 270 may be generally planar. Bottom 272 may be generally planar. Front 274 may be generally planar. Rear 276 may be generally planar. First side 280 may be generally planar. Second side 282 may be generally planar. In alternative embodiments, thermal bridge 200 may have other shapes than the parallelepiped shape shown in the illustrated embodiment. In various embodiments, top 270 and / or bottom 272 may conform to the shape of heat transfer device 106 or electrical component 102, respectively. For example, upper bridge assembly 202 may float relative to lower bridge assembly 204, and spring assembly 206 may allow floating movement of upper bridge assembly 202 and lower bridge assembly 204. In an exemplary embodiment, the frame structure for holding the thermal bridge 200 together is defined by a bridge frame 208 extending through the upper bridge assembly 202 and the lower bridge assembly 204. The bridge frame 208 provides a large usable external surface area for the thermal bridge 200. In alternative embodiments, other types of frame assemblies, except for external or peripheral frame structures, may be used. In an exemplary embodiment, the bridge frame 208 includes a first side plate 222 and a second side plate 224, arranged on a first side 280 and a second side 282 to include the upper bridge assembly 202 and the lower bridge assembly 204 and sandwich them between them. The bridge frame 208 includes a connecting element 220 extending through the upper bridge assembly 202 and the lower bridge assembly 204 between the side plates 222, 224. The connecting element 220 holds the first side plate 222 and the second side plate 224, with the upper bridge assembly 202 and the lower bridge assembly 204 between them.

[0024] In an exemplary embodiment, bridge assemblies 202 and 204 each include a plurality of plates arranged together to form a stack. The plates are interlaced to provide thermal communication between the upper bridge assembly 202 and the lower bridge assembly 204. Individual plates are movable relative to each other, such that the plates can be individually hinged to conform to electrical component 102 and / or heat transfer device 106. For example, an individual plate may conform to electrical component 102 at the lower thermal interface 104 to improve contact and / or proximity between thermal bridge 200 and electrical component 102, and / or an individual plate may conform to heat transfer device 106 at the upper thermal interface 108 to improve contact and / or proximity between thermal bridge 200 and heat transfer device 106. Gaps or spaces may be provided between the plates of bridge assemblies 202 and 204 to allow compressive movement between bridge assemblies 202 and 204. A spring assembly 206 spans the gap between bridge assemblies 202 and 204.

[0025] In an exemplary embodiment, the upper bridge assembly 202 includes a plurality of upper plates 230 arranged in an upper plate stack 232 (only two upper plates 230 are in the stack). Figure 2 As shown in the diagram; however, any number of upper plates 230 can be used depending on the width of the upper bridge assembly 202. Each upper plate 230 has a side 234 extending between an inner end 236 and an outer end 238 of the upper plate 230. The inner end 236 faces the lower bridge assembly 204. The outer end 238 faces outward, for example toward the heat transfer device 106. Optionally, the individual upper plates 230 may have different shapes, such as different heights and / or different features between the inner end 236 and the outer end 238.

[0026] In an exemplary embodiment, the upper plate 230 includes an upper bridge plate 240 and an upper spacer plate 242. The upper spacer plate 242 is located between the upper bridge plates 240. Each upper bridge plate 240 includes overlapping regions 312, 314 at its inner end 236, configured to overlap with the adjacent lower plate of the lower bridge assembly 204. In the illustrated embodiment, the upper bridge plate 240 is generally rectangular in shape; however, in alternative embodiments, the upper bridge plate 240 may have other shapes. In an exemplary embodiment, the upper bridge plate 240 includes a slot 310 for receiving the bridge frame 208. In an exemplary embodiment, the slot 310 is elongated, for example, in the vertical direction, to allow vertical movement of the upper bridge plate 240 relative to the bridge frame 208.

[0027] Each upper spacer 242 extends between an inner end 236 and an outer end 238. In the illustrated embodiment, the upper spacer 242 is generally rectangular in shape; however, in alternative embodiments, the upper spacer 242 may have other shapes. In various embodiments, the lower spacer is shorter than the lower bridge plate 260. In an exemplary embodiment, the upper spacer 242 is configured to align with the corresponding lower plate of the lower bridge assembly 204. During assembly, the bottom edge of the upper spacer 242 may engage the spring assembly 206. In an exemplary embodiment, the upper spacer 242 includes a slot 360 for receiving the bridge frame 208. In an exemplary embodiment, the slot 360 is elongated, for example, in the vertical direction, to allow vertical movement of the upper spacer 242 relative to the bridge frame 208.

[0028] In an exemplary embodiment, the lower bridge assembly 204 includes a plurality of lower plates 250 arranged in a lower plate stack 252 (only two lower plates 250 are in the stack). Figure 2 As shown in the diagram; however, any number of lower plates 250 can be used depending on the width of the lower bridge assembly 204. Each lower plate 250 has a side 254 extending between an inner end 256 and an outer end 258 of the lower plate 250. The inner end 256 faces the upper bridge assembly 202. The outer end 258 faces outward, for example toward the electrical component 102 (e.g., Figure 1(As shown). Optionally, each lower plate 250 may have a different shape and / or height between the inner end 256 and the outer end 258.

[0029] In an exemplary embodiment, the lower plate 250 includes a lower bridge plate 260 and a lower spacer plate 262. The lower spacer plate 262 is located between the lower bridge plates 260. In the illustrated embodiment, the lower bridge plates 260 are rectangular; however, in alternative embodiments, the lower bridge plates 260 may have other shapes. Each lower bridge plate 260 includes overlapping regions 412, 414 at its inner end 256, configured to overlap with the adjacent upper plate 230 of the upper bridge assembly 202. For example, the overlapping regions 412, 414 overlap with the overlapping regions 312, 314 of the upper bridge plate 240. The overlapping regions 412, 414 provide a large surface area configured for thermal coupling to the upper bridge plate 240. The overlapping regions 412, 414 are configured to overlap by a certain overlap distance sufficient to allow efficient heat transfer between the lower plate 250 and the upper plate 230. The sides of the plates are slidable relative to each other to allow movement between the upper plate 230 and the lower plate 250 and to change the overlap distance. In an exemplary embodiment, the lower bridge plate 260 includes a slot 410 for receiving the bridge frame 208. In an exemplary embodiment, the slot 410 is elongated, for example, in the vertical direction, to allow vertical movement of the lower bridge plate 260 relative to the bridge frame 208.

[0030] Each lower partition 262 extends between an inner end 256 and an outer end 258. In the illustrated embodiment, the lower partition 262 is rectangular; however, in alternative embodiments, the lower partition 262 may have other shapes. In various embodiments, the lower partition is shorter than the lower bridge plate 260. In an exemplary embodiment, the lower partition 262 is configured to align with a corresponding upper bridge plate 240. During assembly, the top edge of the lower partition 262 may engage the spring assembly 206. In an exemplary embodiment, the lower partition 262 includes a slot 460 for receiving the upper bridge plate 240. In an exemplary embodiment, the slot 460 is elongated, for example, in the vertical direction, to allow vertical movement of the lower partition 262 relative to the bridge frame 208.

[0031] In an exemplary embodiment, the spring assembly 206 is located between the upper bridge assembly 202 and the lower bridge assembly 204. For example, the spring assembly 206 includes an upper spring element 212 and a lower spring element 214. In the illustrated embodiment, the upper spring element 212 includes a spring arm 216, and the lower spring element 214 includes a spring arm 218. In an exemplary embodiment, the upper spring element 212 is coplanar with the corresponding upper plate 230, and the lower spring element 214 is coplanar with the corresponding lower plate 250. For example, the upper spring element 212 has an upper spring width between its sides, which is included within the width of the upper plate 230 between its sides 234, and the lower spring element 214 has a lower spring width between its sides, which is included within the width of the lower plate 250 between its sides 254.

[0032] In an exemplary embodiment, the spring assembly 206 is integral with the upper plate 230 and the lower plate 250. For example, an upper spring element 212 extends from the upper bridge plate 240 and / or the upper spacer plate 242, and a lower spring element 214 extends from the lower bridge plate 260 and / or the lower spacer plate 262. The upper spring element 212 may be stamped with the corresponding upper plate 230, and the lower spring element 214 may be stamped with the corresponding lower plate 250. In an alternative embodiment, the spring elements 212 and 214 may be separate and independent from the upper plate 230 and the lower plate 250, respectively. The spring elements 212 and 214 may be coupled to the upper plate 230 and the lower plate 250. In various embodiments, the spring elements 212 and 214 may be made of a different material than the upper plate 230 and the lower plate 250. Spring elements 212 and 214 are flexible and can be compressed during deflection to form an internal spring bias force, which presses against the opposite plates 250 and 230 respectively.

[0033] A connecting element 220 of the bridge frame 208 extends internally through the upper bridge assembly 202 and the lower bridge assembly 204. The connecting element 220 is configured to connect to the upper plate 230 and the lower plate 250, securing the upper plate 230 to the upper plate stack 232 and the lower plate 250 to the lower plate stack 252. In an exemplary embodiment, the connecting element 220 includes one or more upper connecting elements and one or more lower connecting elements. The upper connecting elements 220 are received in upper slots 310 and 360 of the upper bridge plate 240 and the upper spacer 242, respectively. The lower connecting elements 220 are received in lower slots 410 and 460 of the lower bridge plate 260 and the lower spacer 262. The connecting element 220 extends between the first side plate 222 and the second side plate 224. For example, the connecting element 220 may pass through openings 226 and 228 in the side plates 222 and 225, respectively. In various embodiments, the connecting element 220 may be integrally formed with the first side plate 222 and / or the second side plate 224. For example, the side plates 222, 224 and the connecting element 220 may be stamped from a sheet of metal. In alternative embodiments, the connecting element 220 may be separate from and fixed to the side plates 222, 224, for example, by welding, crimping, latching, riveting, clipping, using fasteners, or other methods of fixing the connecting element 220 to the side plates 222, 224. In other alternative embodiments, the connecting element 220 may be fixed to the thermal bridge 200 without using the side plates 222, 224. For example, the connecting element 220 may be directly fixed to the plates of the upper bridge assembly 202 and / or the lower bridge assembly 204.

[0034] In an exemplary embodiment, the connecting element 220 is a pin or post. For example, the connecting element 220 may include a head and a cylindrical shaft extending from the head to an end. In alternative embodiments, the connecting element 220 may have other shapes. For example, the connecting element 220 may be a flat, level rod configured to pass through the upper plate 230 and the lower plate 250. For example, the connecting element 220 may be stamped from a sheet of metal.

[0035] Figure 4 This is a cross-sectional view of the thermal bridge 200 taken through one of the upper bridge plates 240 and one of the lower partition plates 262 according to an exemplary embodiment, showing the thermal bridge 200 in an expanded state. Figure 5 This is a cross-sectional view of the thermal bridge 200 taken through one of the upper bridge plate 240 and the lower partition plate 262 according to an exemplary embodiment, showing the thermal bridge 200 in a compressed state.

[0036] During assembly, the lower spacer 262 is aligned with the upper bridge plate 240. A spring assembly 206 is located between the upper bridge plate 240 and the lower spacer 262. In the illustrated embodiment, the spring assembly 206 includes an upper spring element 212 between the upper plate 230 and the lower plate 250. The upper spring element 212 presses the upper plate 230 in an upward biasing direction and / or presses the lower plate 250 in a downward biasing direction. The upper spring element 212 tends to separate the upper plate 230 from the lower plate 250 to press the upper bridge plate 240 into thermal engagement with the heat transfer device 106 and press the lower spacer 262 into thermal engagement with the electrical component 102. The upper bridge plate 240 and the lower spacer 262 are independently movable relative to each other and relative to adjacent upper plates 230 and lower plates 250.

[0037] The upper spring element 212 includes a spring arm 216. In an exemplary embodiment, the spring arm 216 is integral with the upper plate 230. For example, the spring arm 216 may be stamped with the upper plate 230. The spring arm 216 may be compressed between the upper plate 230 and the lower plate 250. In an exemplary embodiment, the spring arm 216 extends between a proximal end 290 and a distal end 292. The spring arm 216 extends at a lateral angle relative to an offset direction. The spring arm 216 is laterally angled relative to its inner end 236. The spring arm 216 includes an upper mating interface 294 at or near the distal end 292. The upper mating interface 294 is configured to engage the lower plate 250 to offset the upper plate 230 in a first offset direction substantially away from the lower plate 250. In an alternative embodiment, the upper mating interface 294 may be located away from the distal end 292, for example, approximately centered between the distal end 290 and the proximal end 292. In such an embodiment, the distal end 292 can engage the inner end 236 of the upper plate 230, such that the spring arm 216 is supported at both ends by the upper plate 230.

[0038] Bridge frame 208 passes through upper bridge plate 240 and lower partition plate 262. For example, connecting element 220 passes through slots 310 and 460. In the expanded state, connecting element 220 is located at or near the inner edge of slots 310 and 460. In the compressed state, connecting element 220 is located at or near the outer edge of slots 310 and 460.

[0039] Figure 6 This is a cross-sectional view of a thermal bridge 200 taken through one of the upper partition plates 242 and one of the lower bridge plates 260 according to an exemplary embodiment, showing the thermal bridge 200 in an expanded state. Figure 7 This is a cross-sectional view of the thermal bridge 200 taken through one of the upper partition plate 242 and the lower bridge plate 260 according to an exemplary embodiment, showing the thermal bridge 200 in a compressed state.

[0040] During assembly, the upper spacer 242 is aligned with the lower bridge plate 260. A spring assembly 206 is located between the upper plate 230 and the lower plate 250. In the illustrated embodiment, the spring assembly 206 includes a lower spring element 214 between the upper plate 230 and the lower plate 250. The lower spring element 214 presses the upper plate 230 in an upward biasing direction and the lower plate 250 in a downward biasing direction. The lower spring element 214 tends to separate the upper plate 230 from the lower plate 250 to press the upper spacer bridge 242 into thermal engagement with the heat transfer device 106 and the lower bridge plate 260 into thermal engagement with the electrical component 102. The upper spacer 242 and the lower bridge plate 260 are independently movable relative to each other and relative to adjacent upper plates 230 and lower plates 250.

[0041] The lower spring element 214 includes a spring arm 218. In an exemplary embodiment, the spring arm 218 is integral with the lower plate 250. For example, the spring arm 218 may be stamped with the lower plate 250. The spring arm 218 may be compressed between the upper plate 230 and the lower plate 250. In an exemplary embodiment, the spring arm 218 extends between a proximal end 291 and a distal end 293. The spring arm 218 extends at a lateral angle relative to an offset direction. The spring arm 218 is laterally angled relative to an inner end 256. The spring arm 218 includes a lower mating interface 295 at the distal end 293. The lower mating interface 295 is configured to engage the upper plate 230 to offset the lower plate 250 in a second offset direction substantially away from the upper plate 230. In an alternative embodiment, the lower mating interface 295 may be located away from the distal end 293, for example, approximately centered between the distal end 291 and the proximal end 293. In such an embodiment, the distal end 293 can engage the inner end 256 of the lower plate 250, such that the spring arm 218 is supported at both ends by the lower plate 250.

[0042] Bridge frame 208 passes through upper partition plate 242 and lower bridge plate 260. For example, connecting element 220 passes through slots 360 and 410. In the expanded state, connecting element 220 is located at or near the inner edge of slots 360 and 410. In the compressed state, connecting element 220 is located at or near the outer edge of slots 360 and 410.

[0043] Figure 8 This is a cross-sectional view of the thermal bridge 200 taken through one of the upper bridge plates 240 and one of the lower partition plates 262 according to an exemplary embodiment. Figure 9 This is a cross-sectional view of the thermal bridge 200 taken through one of the upper partition plates 242 and one of the lower bridge plates 260 according to an exemplary embodiment.

[0044] Spring assembly 206 is located between upper plate 230 and lower plate 250. In the illustrated embodiment, spring assembly 206 includes a pair of upper spring elements 212 and a pair of lower spring elements 214. The upper spring elements 212 are integral with the upper plate 230, for example, by stamping. The proximal end 290 of the upper spring element 212 is approximately centered along the inner end 236, and the distal end 292 of the upper spring element 212 is located near the front 274 and rear 276 of the thermal bridge 200. In alternative embodiments, other orientations are possible. The lower spring elements 214 are integral with the lower plate 250, for example, by stamping. The proximal end 291 of the lower spring element 214 is approximately centered along the inner end 256, and the distal end 293 of the lower spring element 214 is located near the front 274 and rear 276 of the thermal bridge 200. In alternative embodiments, other orientations are possible.

[0045] Figure 10 This is a cross-sectional view of the thermal bridge 200 taken through one of the upper bridge plates 240 and one of the lower partition plates 262 according to an exemplary embodiment. Figure 11 This is a cross-sectional view of the thermal bridge 200 taken through one of the upper partition plates 242 and one of the lower bridge plates 260 according to an exemplary embodiment.

[0046] Spring assembly 206 is located between upper plate 230 and lower plate 250. In the illustrated embodiment, upper spring element 212 includes a base 215 and a pair of spring arms 216, and lower spring element 214 includes a base 217 and a pair of spring arms 218. In the illustrated embodiment, upper spring element 212 is separate and independent from upper plate 230, and lower spring element 214 is separate and independent from lower plate 250, rather than being integral with upper plate 230 and lower plate 250 (e.g., Figure 8 and Figure 9 ).

[0047] The spring arm 216 is integral with the base 215. The base 215 is separate from and configured to attach to the upper plate 230, for example, by attaching to a groove 237 at its inner end 236. For example, the base 215 may be welded to the upper plate 230 or attached by adhesive. The base 215 may be secured to the upper plate 230 by a dovetail or other fixing feature of the base 215. In the illustrated embodiment, the base 215 is approximately centered along the inner end 236, such that the spring arm 216 extends forward and backward from the base 215. In alternative embodiments, other locations are possible. In alternative embodiments, the upper spring element 212 may include a single spring arm 216. In an exemplary embodiment, the upper plate 230 may be made of a first material, and the upper spring element 212 may be made of a second material different from the first material. For example, the upper plate 230 may be made of a material with high thermal conductivity, such as a metal plate, aluminum, copper, steel, etc. The upper spring element 212 can be made of a material with good spring properties, such as metal or plastic.

[0048] The spring arm 218 is integral with the base 217. The base 217 is separate from the lower plate 230 and configured to attach to the lower plate 250, for example, by attaching to a groove 257 at the inner end 256. For example, the base 217 may be welded to the lower plate 250 or attached by adhesive. The base 217 may be secured to the lower plate 250 by a dovetail or other fixing feature of the base 217. In the illustrated embodiment, the base 217 is approximately centered along the inner end 256, such that the spring arm 218 extends forward and backward from the base 217. In alternative embodiments, other locations are possible. In alternative embodiments, the lower spring element 214 may include a single spring arm 218. In an exemplary embodiment, the lower plate 250 may be made of a first material, and the lower spring element 214 may be made of a second material different from the first material. For example, the lower plate 250 may be made of a material with high thermal conductivity, such as a metal plate, aluminum, copper, steel, etc. The lower spring element 214 can be made of a material with good spring properties, such as metal or plastic.

Claims

1. A thermal bridge (200), comprising: The upper bridge assembly (202) includes a plurality of upper plates (230) arranged in an upper plate stack (232), each upper plate having a front end and a rear end, each upper plate having a side (254) between the front end and the rear end, and each upper plate having an inner end (236) and an outer end (238). The lower bridge assembly (204) includes a plurality of lower plates (250) arranged in a lower plate stack, each lower plate having a front end and a rear end, each lower plate having a side between the front end and the rear end, each lower plate having an inner end (256) and an outer end (258), the outer end of the lower plate being configured to face and thermally couple to an electrical component (102), the side of the lower plate facing the side of the upper plate to thermally connect the lower plate to the upper plate; Upper spring elements (212) extending from the inner end of the corresponding upper plate, each upper spring element including an upper mating interface (294) that engages the lower bridge assembly to bias the upper plate in a first biasing direction away from the lower bridge assembly; Lower spring elements (214) extending from the inner end of the corresponding lower plate, each lower spring element (214) includes a lower mating interface that engages the upper bridge assembly to bias the lower plate in a second bias direction away from the upper bridge assembly; as well as The bridge frame (208) has a connecting element (220) extending through the upper plate and the lower plate to hold the upper plate in the upper plate stack and the lower plate in the lower plate stack.

2. The thermal bridge (200) as claimed in claim 1, wherein the upper spring element (212) is coplanar with the corresponding upper plate (230), and the lower spring element (214) is coplanar with the corresponding lower plate (250).

3. The thermal bridge (200) as claimed in claim 1, wherein each upper plate (230) has an upper plate width between the sides and each upper spring element has an upper spring width between the sides of the upper spring element, and wherein each lower plate has a lower plate width between the sides and each lower spring element (214) has a lower spring width between the sides of the lower spring element.

4. The thermal bridge (200) as claimed in claim 1, wherein the upper spring element (212) is angled laterally to the first bias direction, and wherein the lower spring element (214) is angled laterally to the second bias direction.

5. The thermal bridge (200) as claimed in claim 1, wherein each upper plate (230) includes a single upper spring element (212) and each lower plate (250) includes a single lower spring element (214).

6. The thermal bridge (200) as claimed in claim 1, wherein each upper plate (230) includes a plurality of upper spring elements (212) and each lower plate (250) includes a plurality of lower spring elements (214).

7. The thermal bridge (200) as claimed in claim 1, wherein the upper spring element (212) is integral with the upper plate (230) and is stamped with the upper plate, and wherein the lower spring element (214) is integral with the lower plate (250) and is stamped with the lower plate.

8. The thermal bridge (200) of claim 1, wherein the upper spring element (212) is separate and independent from the upper plate (230) and is connected to the inner end of the upper plate, the upper plate being made of a first material and the upper spring element being made of a second material different from the first material, and wherein the lower spring element (214) is separate and independent from the lower plate (250) and is connected to the inner end of the lower plate, the lower plate being made of the first material and the lower spring element being made of a second material different from the first material.

9. The thermal bridge (200) of claim 1, wherein the upper plate (230) includes an upper slot (237) for receiving a corresponding connecting element and the lower plate (250) includes a lower slot (257) for receiving a corresponding connecting element (220), the upper slot being oversized to allow the upper plate to move relative to the connecting element and the lower slot being oversized to allow the lower plate to move relative to the connecting element.

10. The thermal bridge (200) of claim 1, wherein the connecting element (220) includes a pin that extends fully through the upper bridge assembly (202) and the lower bridge assembly (204).

11. The thermal bridge (200) of claim 1, wherein the upper plate (230) includes an upper bridge plate (240) having upper overlapping regions (312, 314) and the lower plate (250) includes a lower bridge plate (260) having lower overlapping regions (412, 414), the upper overlapping regions overlapping the lower overlapping regions to thermally couple the upper plate and the lower plate.

12. The thermal bridge (200) of claim 11, wherein the upper bridge assembly further includes an upper spacer (242) between the upper bridge plates (240), and the lower bridge assembly further includes a lower spacer (262) between the lower bridge plates (260), the upper spacer being aligned with a corresponding lower bridge plate, and a lower spring element of the lower bridge plate engaging a corresponding upper spacer, the lower spacer being aligned with a corresponding upper bridge plate, and an upper spring element of the upper bridge plate engaging a corresponding lower spacer.

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