Non-detonating electronic detonator system

Abstract

This invention relates to a non-detonating electronic detonator system, belonging to the technical field of non-detonating electronic detonator systems. The technical problem to be solved is to provide an improvement in the hardware structure of a non-detonating electronic detonator system. The technical solution adopted to solve this problem includes a non-detonating detonator and a three-way connector. The non-detonating detonator is sealed to the energy storage drive circuit via a retainer. External threads are provided at both ends of the three-way connector, which is connected to a bus socket nut with corresponding internal threads. A high-voltage charging detonation control circuit board or a high-voltage charging regulated digital communication circuit board is installed inside the three-way connector. The bus socket nut is connected to the detonator bus via a male pin. A delay drive circuit is also encapsulated inside the energy storage drive circuit's plastic casing. The output of the delay drive circuit is connected to the detonator pins and the input of the high-voltage charging detonation control circuit board or the high-voltage charging regulated communication circuit board. This invention is applied to electronic detonators.

Description

Technical Field

[0001] This invention relates to a non-detonating electronic detonator system, belonging to the technical field of non-detonating electronic detonator systems. Background Technology

[0002] like Figure 1 As shown, the currently used digital electronic detonator employs a low-voltage capacitor energy storage-driven detonating charge structure. The control circuit board inside the electronic detonator is soldered with a small-diameter (diameter ≤ 6mm) low-voltage (≤ 25V) energy storage capacitor, digital circuit, and ignition element. The integrated electronic module is installed inside a metal detonator shell of the same diameter (inner diameter = 6mm). A plastic lead wire extends from the electronic module, with a two-core insulated copper wire wrapped inside. The other end of the lead wire is connected to a two-wire connector between the upper and lower housings. The two-core lead wire is electrically connected to the two-wire fieldbus by a movable part between the upper and lower housings of the two-wire connector. The two-wire fieldbus is then connected to the detonator.

[0003] like Figure 2 As shown, the existing digital electronic detonator system consists of a metal detonator shell 10, a primary high explosive 20, a secondary high explosive 30, an initiating charge 40, a reinforcing cap 50, a ignition cavity 60, a resistance wire ignition head 70, a control circuit board 80, a plastic end cap 90, lead wires 100, a two-wire connector 110, and a two-wire fieldbus 120. It should be noted that the control circuit board 80 integrates all digital circuits and a low-voltage energy storage capacitor, and is fabricated as a small-diameter integrated circuit module that can be installed inside the detonator shell. The power supply voltage of this integrated circuit module is ≤25V. The working mechanism of this type of digital electronic detonator adopts the "combustion-to-detonation" mechanism, mainly relying on low-voltage capacitor energy storage in the resistance wire ignition head 70. The discharge heating ignites the gunpowder → the flame passes through the ignition cavity 60 → ignites the detonating charge 40 through the small hole in the center of the reinforcing cap 50 → the detonating charge 40 burns and detonates → the initial detonation wave triggers the detonation of the secondary high explosive 30 → the detonation wave then outputs a strong detonation wave through the primary high explosive 20. There is a section of ignition cavity 60 without charge between the resistance wire igniter 70 and the reinforcing cap 50. The reinforcing cap 50 is filled with a highly mechanically sensitive detonating charge 40 (such as nickel hydrazine nitrate or dinitrodiazophenol). This type of electronic detonator with a detonating charge structure is a high-risk product. Such electronic detonators with detonating charge structures are extremely prone to explosion accidents during daily production, transportation, storage, and blasting engineering use, posing a safety hazard. Summary of the Invention

[0004] In order to overcome the safety hazards of digital electronic detonators with detonating charges, and the shortcomings of existing digital detonators where the control circuit board integrates all digital circuits and low-voltage energy storage capacitors and cannot provide high-voltage power supply, the present invention aims to provide an improved hardware structure for a non-detonating electronic detonator system.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a non-detonating electronic detonator system, including a non-detonating detonator and a three-way connector. The non-detonating detonator is sealed and connected to the energy storage drive circuit through a clamp. The three-way connector is a hollow part with openings at both ends and in the middle. The two ends are used to connect to the detonator bus, and the middle part is used to connect to the detonator lead wire.

[0006] The three-way connector has external threads at both ends. The three-way connector is connected to a bus socket nut with corresponding internal threads. An initiation control circuit board or a voltage stabilizing communication circuit board is installed inside the three-way connector. The bus socket nut is connected to the detonator bus via a male pin.

[0007] A lead wire connector is provided at the middle opening of the three-way connector. The energy storage drive circuit is also encapsulated inside the plastic body. The output terminal of the delay drive circuit is connected to the detonator lead wire. The detonator lead wire is connected to the input terminal of the detonation control circuit board or the voltage stabilizing communication circuit board through the lead wire connector of the three-way connector.

[0008] The internal charge structure of the non-detonating detonator is as follows:

[0009] The detonator without detonator is arranged from the inside out with a first-stage high explosive, a second-stage high explosive, a reinforcing cap, and a third-stage high explosive. The energy storage drive circuit encapsulation contains a plasma igniter, a control circuit board, and an energy storage capacitor.

[0010] The control circuit board is a strip-shaped control circuit board. Two sides of the outward extension end of the control circuit board are provided with copper foil surfaces. The copper foil surfaces are perpendicularly welded to the copper foil surface electrodes of the outer side A of the plasma igniter. The inner side B of the plasma igniter is tightly installed with the surface of the third-stage high explosive.

[0011] The plasma igniter is specifically a printed circuit board covered with copper foil on both sides;

[0012] A pair of copper-clad foil surfaces, e1 and e2, are symmetrically etched on the outer surface A of the printed circuit board, and metal pad holes are etched on the e1 and e2 surfaces of the copper-clad foil.

[0013] A pair of copper-clad foil surfaces e3 and e4 are symmetrically etched on the inner side B of the printed circuit board, and the copper-clad foil surfaces e3 and e4 are connected by copper bridge foil lines.

[0014] The e1 and e2 sides of the copper-clad foil are electrically connected to the e3 and e4 sides of the copper-clad foil through corresponding metal pad holes.

[0015] Specifically soldered on the control circuit board is an analog delay drive circuit, the output of which is connected to the input of the detonation control circuit board via detonator pins.

[0016] The analog delay drive circuit includes a drive chip IC1, a high-voltage field-effect transistor U1, a diode D1, a current-limiting resistor R1, a resistor R2, a delay resistor Rt, a delay capacitor Ct, and a high-voltage capacitor Cg.

[0017] The output terminals of the analog delay drive circuit are VH, VFB, and GND. Each output terminal is electrically connected via a three-core insulated wire and serves as a detonator pin. The detonator pins with the three-core insulated wire are connected to the input terminals b1, b3, and b2 on the detonation control circuit board. The detonation control circuit board is provided with pin terminals a1, a3, and a2. Pin terminals a1, a3, and a2 are respectively connected to the bus socket nut of the detonation control circuit board, and the bus socket nut is connected to the detonator bus.

[0018] The delay time T is formed by multiplying the resistance value of the delay resistor Rt and the resistance value of the delay capacitor Ct. Different delay time T values ​​are selected as different delay time T values ​​for the electronic detonator in the analog circuit.

[0019] The settings for the delay time of the analog circuit are set from instantaneous 0 seconds, delay 1ms±1%, 5ms±1%, 10ms±1%, 15ms±1%, 20ms±1%, 25ms±1%, ..., seconds±1%, minutes±1%, and the fixed settings are used to produce analog circuit delay electronic detonators of different segments T.

[0020] The high-voltage charging voltage range is VH = 40V to 150V.

[0021] The digital delay drive circuit is specifically soldered on the control circuit board. The output of the digital delay drive circuit is connected to the input of the voltage regulator communication circuit board through the detonator pin.

[0022] The digital delay drive circuit includes a drive chip IC2, a high-voltage field-effect transistor U2, a diode D2, a current-limiting resistor R3, a resistor R4, and a high-voltage capacitor Cg.

[0023] The output terminals of the digital delay drive circuit are VH, Vcc, and GND. Each output terminal is electrically connected by wrapping a three-core insulated wire and then used as a detonator lead. The detonator leads wrapped with three-core insulated wire are connected to the input terminals d1, d3, and d2 in the voltage-stabilized communication circuit board. The voltage-stabilized communication circuit board is provided with pin terminals c1 and c2. The pin terminals c1 and c2 are respectively connected to the bus socket nut of the voltage-stabilized communication circuit board, and the bus socket nut is connected to the detonator bus.

[0024] The delay time of the digital circuit in the digital delay drive circuit is T, which can be arbitrarily set in the second range of 1ms, 2ms, 3ms... by the program setting.

[0025] The high-voltage charging voltage range is VH = 40V to 150V.

[0026] The first-stage high explosive, the second-stage high explosive, and the third-stage high explosive are specifically RDX (Rexin) or PETN (Texasin PETN).

[0027] The advantages of this invention compared to the prior art are as follows: This invention provides an electronic detonator system without initiating explosives. To avoid loading initiating explosives into the electronic detonator, it uses the electrical energy stored in a high-voltage capacitor to discharge in a plasma igniter, instantaneously generating a high-energy plasma shock wave. This plasma shock wave directly excites the powerful explosive to form a detonation. This is an electronic detonator with a "plasma shock wave to detonation" mechanism and no initiating explosive charge structure. As an electronic detonator without initiating explosives, it is safer in production, transportation, storage, and blasting processes compared to traditional initiating explosive detonators. It is also easier to install and use, and the detonation control is more accurate. Attached Figure Description

[0028] The present invention will be further described below with reference to the accompanying drawings:

[0029] Figure 1 This is a schematic diagram of an existing electronic detonator system for initiating explosives;

[0030] Figure 2 This is a schematic diagram of the internal structure of an existing electronic detonator for initiating explosives;

[0031] Figure 3 This is a schematic diagram of the structure of the non-detonating electronic detonator system of the present invention;

[0032] Figure 4 This is a schematic diagram of the internal structure of the non-detonating electronic detonator of the present invention;

[0033] Figure 5 for Figure 4 A schematic diagram of the structure of side A of a medium-ion igniter;

[0034] Figure 6 for Figure 4 A schematic diagram of the structure of side B of a medium-ion igniter;

[0035] Figure 7 This is a schematic diagram of the welding structure of the control circuit board of the present invention;

[0036] Figure 8 for Figure 7 C-section view;

[0037] Figure 9for Figure 7 A schematic diagram of the structure of surface E of a medium-ion igniter;

[0038] Figure 10 for Figure 7 Top view;

[0039] Figure 11 This is a schematic diagram of the internal analog circuit of the electronic detonator of the present invention;

[0040] Figure 12 This is a schematic diagram of the internal digital circuit of the electronic detonator of the present invention;

[0041] exist Figure 1 and Figure 2 middle:

[0042] 10 is the metal detonator shell, 90 is the plastic end cap, 100 is the lead wire, 110 is the two-wire connection clamp, 120 is the two-wire fieldbus, 20 is the first-stage high explosive, 30 is the second-stage high explosive, 40 is the detonator, 50 is the reinforcing cap, 60 is the ignition cavity, 70 is the resistance wire ignition head, and 80 is the control circuit board.

[0043] exist Figures 3 to 12 middle:

[0044] In the diagram: 200 is a detonator without explosive charge, 300 is the encapsulated body of the energy storage drive circuit, 400 is the detonator lead wire, 500 is a waterproof three-way electronic connector, 510 is the detonation control circuit board, 520 is the voltage stabilizing communication circuit board, 501 is the bus socket nut, and 502 is the bus for connecting the detonator.

[0045] 201 is the first-stage high explosive, 202 is the second-stage high explosive, 203 is the reinforcing cap, 204 is the third-stage high explosive, and 205 is the waist clip;

[0046] 300 is the plastic package of the energy storage drive circuit, 301 is the plasma igniter, 302 is the control circuit board, 303 is the energy storage capacitor, 310 is the copper foil e1 and e2 sides, 311 is the metal pad hole, 312 is the copper bridge foil line, 313 is the copper foil e3 and e4 sides, and 400 is the detonator lead wire.

[0047] 304 is an analog delay drive circuit, and 305 is a digital delay drive circuit. Detailed Implementation

[0048] like Figures 3 to 12 As shown, the non-explosive electronic detonator provided by the present invention integrates a high-voltage (150V≥VH≥40V) energy storage capacitor, a plasma igniter, and a control circuit board into a single injection molding process, and assembles it with a non-explosive basic detonator to form a non-explosive electronic detonator; the control circuit board is soldered with an analog delay drive circuit or a digital delay drive circuit.

[0049] like Figure 4 The diagram shown is a structural diagram of the non-detonating electronic detonator provided by the present invention, comprising: a non-detonating base detonator 200, a first-stage high explosive 201, a second-stage high explosive 202, a reinforcing cap 203, a third-stage high explosive 204, a retainer 205, a capacitor energy storage electronic drive circuit encapsulation, a plasma igniter 301, a control circuit board 302, an energy storage capacitor 303, and detonator lead wires 400; the first to third-stage high explosives are RDX or PETN; the electronic... The encapsulated body of the energy storage electronic drive circuit encapsulates a plasma igniter 301, a control circuit board 302, and an energy storage capacitor 303. An analog delay drive circuit or a digital delay drive circuit is soldered onto the control circuit board 302. The plasma ignition end face (B) of the plasma igniter 301 and the surface of the third-stage high explosive 204 are installed in close contact with each other without gaps. The aforementioned non-detonating basic detonator and the encapsulated body of the energy storage drive circuit are sealed and connected by a retainer 205 to form an integrated non-detonating electronic detonator.

[0050] like Figure 5 and Figure 6 The diagram shown is a structural diagram of the plasma ignition device provided by the present invention. The plasma ignition device is made of a double-sided copper-clad printed circuit board. The A side of the printed circuit board has symmetrical copper-clad foil e1 and e2 sides 310 and metal pad holes. The B side of the printed circuit board has symmetrical copper-clad foil e3 and e4 sides 313 and copper bridge foil lines with line widths on the order of micrometers. The metal pad holes on the copper-clad foil e1 and e2 sides of the printed circuit board A are electrically connected to the copper-clad foil e3 and e4 sides of the printed circuit board B.

[0051] like Figure 7 The diagram shows the welding connection between the plasma igniter and the control circuit board in the electronic detonator of the present invention. The two copper foil surfaces of the narrower end of the control circuit board 302 are welded perpendicularly to the copper foil electrodes on surface e1 and e2 of the plasma igniter 301. Figure 10 This is a top view of the control circuit board 302. The mark F in the figure represents the solder accumulation area on the copper foil 310 on the A side e1 and e2 of the plasma igniter 301 and the double-sided copper foil side of the control circuit board 302. Figure 8 The mark D in the diagram is the DD cross-sectional view of the control circuit board 302; Figure 9 The mark E in the diagram is the B-side view of the plasma igniter 301;

[0052] This invention provides two embodiments of non-detonating electronic detonators: an electronic detonator with analog circuit delay control and an electronic detonator with digital circuit delay control. The basic structure of both electronic detonators is as follows... Figure 4As shown, each component contains a circuit consisting of a plasma igniter 301, a control circuit board 302, and a high-voltage capacitor 303, all encapsulated in plastic. The control circuit board 302 is used to solder an analog delay drive circuit and a digital delay drive circuit.

[0053] Example 1, as Figure 11 The diagram shown is a block diagram of a non-detonating explosive simulation circuit delay electronic detonator system. This system consists of two parts. One part is the control circuit board 302 inside the plastic casing, which houses the simulation delay drive circuit 304. This circuit includes: an RLR763-1 simulation circuit delay drive chip IC1, a high-voltage field-effect transistor U1, a diode D1, a current-limiting resistor R1, a resistor R2, a delay resistor Rt, a delay capacitor Ct, a high-voltage capacitor Cg, and a plasma igniter DHJ, forming the non-detonating explosive simulation circuit delay electronic detonator section. The other part is a three-way electronic connector. The internal high-voltage charging detonation control circuit board 500; the VH, VFB, and GND terminals of the control circuit board 302 in the plastic enclosure are connected to the b1, b3, and b2 terminals of the internal high-voltage charging detonation control circuit board 510 of the three-way electronic connector through the lead wire wrapped with three-core insulated wire. The control circuit board 510 has a1, a3, and a2 pin terminals. The a1, a3, and a2 pins are connected to the three-wire bus socket nut. A bus wrapped with three-core insulated wire is connected to the three-wire detonator to form a non-detonating explosive simulation circuit delay electronic detonator system.

[0054] Specifically, the circuit structure of the analog delay drive circuit 304 is as follows:

[0055] The Vrc terminal of the delay driver chip IC1 is connected to one end of the delay resistor Rt. The Vref terminal of the delay driver chip IC1 is connected in parallel to the other end of the delay resistor Rt and then to one end of the delay capacitor Ct. The Vk terminal of the delay driver chip IC1 is connected in parallel to one end of the resistor R2 and then to the gate of the high-voltage field-effect transistor U1. The drain of the high-voltage field-effect transistor U1 is connected in parallel to the positive terminal of the diode D1, one end of the current-limiting resistor R1, and then to one electrode of the plasma igniter DHJ. The source of the high-voltage field-effect transistor U1 is connected in parallel to the other end of the resistor R2, the other end of the delay capacitor Ct, the GND terminal of the delay driver chip IC1, and then to the negative terminal of the high-voltage capacitor Cg. The positive terminal of the high-voltage capacitor Cg is connected to the other electrode of the plasma igniter DHJ. The other end of the current-limiting resistor R1, the VFB terminal of the delay driver chip IC1, and the GND terminal of the delay driver chip IC1 are connected to the detonator pin 400.

[0056] The product of the delay resistor Rt and the delay capacitor Ct constitutes the delay time T. Different Rt and Ct values ​​are selected as different delay time categories T for the simulated circuit delay electronic detonator. The simulated circuit delay time category can be set from instantaneous 0 seconds, delays of 1ms±1%, 5ms±1%, 10ms±1%, 15ms±1%, 20ms±1%, 25ms±1%, ..., seconds±1%, minutes±1%, producing non-detonating simulated circuit delay electronic detonators with different T categories. The high-voltage charging voltage range is 40V≤VH≤150V. The RLR... The VFB terminal of the 763-1 analog circuit delay driver chip IC1 is the trigger signal input terminal. When there is a high level trigger signal at the VFB terminal, the Vrc output high level and charges the capacitor Ct through the resistor Rt. When the voltage value of the capacitor Ct rises to Vref, the Vk output high level to trigger the gate G of the field-effect transistor, making the drain D and source S of the field-effect transistor instantaneously conduct. The electrical energy stored in the high-voltage capacitor Cg is instantaneously discharged in the plasma igniter to generate a plasma shock wave that excites the detonation of the third-stage high explosive 204, and causes the second-stage high explosive 202 and the first-stage high explosive 201 to produce a strong detonation output.

[0057] Example 2, as Figure 12 The diagram shown is a block diagram of a digital circuit delay electronic detonator system without detonator. This system consists of two parts. One part is the control circuit board 302 inside the plastic casing, which houses the digital delay drive circuit 305. This circuit includes: an RLR763-2 digital circuit delay drive chip IC2, a high-voltage field-effect transistor U2, a diode D2, a current-limiting resistor R3, a resistor R4, a high-voltage capacitor Cg, and a plasma igniter DHJ, forming the circuit for the digital circuit delay electronic detonator without detonator. The other part is the three-way electronic connector 500, which contains a high-voltage charging and low-voltage stabilizer. The digital communication control circuit board 520 is pressurized; the VH, Vcc, and GND terminals of the digital delay drive circuit 305 in the plastic encapsulation are connected to the d1, d3, and d2 terminals of the high-voltage charging and low-voltage stabilizing digital communication control circuit board 520 inside the three-way electronic connector 500 through the lead wire wrapped with three-core insulated wire. The control circuit board 520 has c1 and c2 pin terminals, and the c1 and c2 pins are connected to the two-wire bus socket nut. A bus wrapped with two-core insulated wire is connected to a two-wire detonator to form a digital circuit delay electronic detonator system without detonating explosive.

[0058] Specifically, the circuit structure of the digital delay drive circuit 305 is as follows:

[0059] The VD terminal of the delay driver chip IC2 is connected to the negative terminal of diode D2. The positive terminal of diode D2 is connected in parallel to the drain of high-voltage field-effect transistor U2. One end of current-limiting resistor R3 is connected to one electrode of plasma igniter DHJ. The Vk terminal of the delay driver chip IC2 is connected in parallel to one end of resistor R4 and then to the gate of high-voltage field-effect transistor U2. The source of high-voltage field-effect transistor U2 is connected in parallel to the other end of resistor R4. The GND terminal of the delay driver chip IC2 is connected to the negative terminal of high-voltage capacitor Cg. The positive terminal of high-voltage capacitor Cg is connected to the other electrode of plasma igniter DHJ. The other end of current-limiting resistor R3, the Vcc terminal of delay driver chip IC2, and the GND terminal of delay driver chip IC2 are connected to detonator pin 400.

[0060] The delay time T of the digital circuit can be arbitrarily set in the range of 1ms to seconds through program settings; the high-voltage charging voltage range is 40V≤VH≤150V; the delay time of the RLR763-2 digital circuit delay driver chip IC2 is stored in a register through program settings; the Vcc and GND terminals of IC2 are input to the IC2 chip via a two-wire detonator that issues a detonation voltage modulation signal; the IC2 chip receives the detonation command and counts according to the set delay time, the counting time being the delay time; the Vk output is high level to trigger the gate G of the field-effect transistor, causing the drain D and source S of the field-effect transistor to conduct instantaneously; the electrical energy stored in the high-voltage capacitor Cg is instantaneously discharged in the plasma igniter to generate a plasma shock wave that excites the detonation of the third-stage high explosive 204, and causes the second-stage high explosive 202 and the first-stage high explosive 201 to produce a strong detonation output.

[0061] Regarding the specific structure of this invention, it should be noted that the connection relationships between the various component modules used in this invention are definite and achievable. Except as specifically described in the embodiments, their specific connection relationships can bring about corresponding technical effects and solve the technical problems proposed by this invention without relying on the execution of corresponding software programs. The models of the components, modules, and specific components appearing in this invention, the connection methods between them, and the conventional usage methods and expected technical effects brought about by the above technical features, unless specifically described, are all publicly disclosed content in patents, journal articles, technical manuals, technical dictionaries, and textbooks that can be obtained by those skilled in the art before the application date, or belong to conventional technology, common knowledge, and other existing technologies in this field. There is no need to elaborate, which makes the technical solution provided in this case clear, complete, and achievable, and can reproduce or obtain corresponding physical products based on this technical means.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A non-detonating electronic detonator system, comprising a non-detonating detonator (200) and a three-way connector (500), characterized in that: The detonator (200) without detonator charge is sealed to the energy storage drive circuit encapsulation (300) by a waist clip (205). The three-way connector (500) is a hollow part with openings at both ends and in the middle. The two ends are used to connect to the detonator bus (502), and the middle part is used to connect to the detonator lead wire (400). External threads are provided at both ends of the three-way connector (500). The three-way connector (500) is connected to the bus socket nut (501) with corresponding internal threads. An initiation control circuit board (510) or a voltage stabilizing communication circuit board (520) is installed inside the three-way connector (500). The bus socket nut (501) is connected to the detonator bus (502) through a male pin. A lead wire connector is provided at the middle opening of the three-way connector (500). The energy storage drive circuit encapsulation (300) also encapsulates a delay drive circuit. The output end of the delay drive circuit is externally connected to the detonator lead wire (400). The detonator lead wire (400) is connected to the input end of the detonation control circuit board (510) or the voltage regulator communication circuit board (520) through the lead wire connector of the three-way connector (500). The internal charge structure of the non-detonating detonator (200) is as follows: The detonator (200) without detonator is provided with a first-stage high explosive (201), a second-stage high explosive (202), a reinforcing cap (203), and a third-stage high explosive (204) in sequence from the inside to the outside. The energy storage drive circuit encapsulation (300) is provided with a plasma igniter (301), a control circuit board (302), and an energy storage capacitor (303). The first-stage high explosive (201), the second-stage high explosive (202), and the third-stage high explosive (204) are specifically RDX or PETN; The control circuit board (302) is a strip-shaped control circuit board. The two sides of the outward extension end of the control circuit board (302) are provided with copper foil surfaces. The copper foil surfaces are perpendicularly welded to the copper foil surface electrodes on the outer side A of the plasma igniter (301). The inner side B of the plasma igniter (301) is tightly attached to the explosive surface of the third-level high explosive (204). The plasma igniter (301) is specifically a printed circuit board with copper foil covering both sides; A pair of copper-clad foil e1 and e2 surfaces (310) are symmetrically etched on the outer side A of the printed circuit board, and metal pad holes (311) are etched on the copper-clad foil e1 and e2 surfaces (310). A pair of copper-clad foil surfaces e3 and e4 (313) are symmetrically etched on the inner side B of the printed circuit board, and the copper-clad foil surfaces e3 and e4 (313) are connected by copper bridge foil lines (312). The e1 and e2 sides (310) of the copper-clad foil are electrically connected to the e3 and e4 sides (313) of the copper-clad foil through the metal pad holes (311); Specifically soldered on the control circuit board (302) is an analog delay drive circuit (304), the output of which is connected to the input of the detonation control circuit board (510) via the detonator lead wire (400). The analog delay drive circuit (304) includes a drive chip IC1, a high-voltage field-effect transistor U1, a diode D1, a current-limiting resistor R1, a resistor R2, a delay resistor Rt, a delay capacitor Ct, and a high-voltage capacitor Cg. The circuit structure of the analog delay drive circuit (304) is as follows: The Vrc terminal of the delay driver chip IC1 is connected to one end of the delay resistor Rt. The Vref terminal of the delay driver chip IC1 is connected in parallel to the other end of the delay resistor Rt and then to one end of the delay capacitor Ct. The Vk terminal of the delay driver chip IC1 is connected in parallel to one end of the resistor R2 and then to the gate of the high-voltage field-effect transistor U1. The drain of the high-voltage field-effect transistor U1 is connected in parallel to the positive terminal of the diode D1, one end of the current-limiting resistor R1, and then to one electrode of the plasma igniter DHJ. The source of the high-voltage field-effect transistor U1 is connected in parallel to the other end of the resistor R2, the other end of the delay capacitor Ct, the GND terminal of the delay driver chip IC1, and then to the negative terminal of the high-voltage capacitor Cg. The positive terminal of the high-voltage capacitor Cg is connected to the other electrode of the plasma igniter DHJ. The other end of the current-limiting resistor R1, the VFB terminal of the delay driver chip IC1, and the GND terminal of the delay driver chip IC1 are connected to the detonator pin (400). The output terminals of the analog delay drive circuit (304) are VH, VFB, and GND. Each output terminal is electrically connected by a three-core insulated wire and used as a detonator lead wire (400). The detonator lead wire (400) with the three-core insulated wire is connected to the input terminals b1, b3, and b2 in the detonation control circuit board (510). The detonation control circuit board (510) is provided with pin terminals a1, a3, and a2. The pin terminals a1, a3, and a2 are respectively connected to the bus socket nut (501) of the detonation control circuit board (510), and the bus socket nut (501) is connected to the detonator bus (502). The delay time T is formed by multiplying the resistance value of the delay resistor Rt and the resistance value of the delay capacitor Ct. Different delay time T values ​​are selected as different delay time T values ​​for the electronic detonator in the simulation delay drive circuit. The simulation delay drive circuit (304) is configured with delay time settings from instantaneous 0 seconds, delay 1ms±1%, 5ms±1%, 10ms±1%, 15ms±1%, 20ms±1%, 25ms±1%, ..., seconds±1%, minutes±1%, and the settings are fixed to produce simulation circuit delay electronic detonators of different segments T. The high-voltage charging voltage range is VH = 40V to 150V.

2. A non-detonating electronic detonator system, comprising a non-detonating detonator (200) and a three-way connector (500), characterized in that: The detonator (200) without detonator charge is sealed to the energy storage drive circuit encapsulation (300) by a waist clip (205). The three-way connector (500) is a hollow part with openings at both ends and in the middle. The two ends are used to connect to the detonator bus (502), and the middle part is used to connect to the detonator lead wire (400). External threads are provided at both ends of the three-way connector (500). The three-way connector (500) is connected to the bus socket nut (501) with corresponding internal threads. An initiation control circuit board (510) or a voltage stabilizing communication circuit board (520) is installed inside the three-way connector (500). The bus socket nut (501) is connected to the detonator bus (502) through a male pin. A lead wire connector is provided at the middle opening of the three-way connector (500). The energy storage drive circuit encapsulation (300) also encapsulates a delay drive circuit. The output end of the delay drive circuit is externally connected to the detonator lead wire (400). The detonator lead wire (400) is connected to the input end of the detonation control circuit board (510) or the voltage regulator communication circuit board (520) through the lead wire connector of the three-way connector (500). The internal charge structure of the non-detonating detonator (200) is as follows: The detonator (200) without detonator is provided with a first-stage high explosive (201), a second-stage high explosive (202), a reinforcing cap (203), and a third-stage high explosive (204) in sequence from the inside to the outside. The energy storage drive circuit encapsulation (300) is provided with a plasma igniter (301), a control circuit board (302), and an energy storage capacitor (303). The first-stage high explosive (201), the second-stage high explosive (202), and the third-stage high explosive (204) are specifically RDX or PETN; The control circuit board (302) is a strip-shaped control circuit board. The two sides of the outward extension end of the control circuit board (302) are provided with copper foil surfaces. The copper foil surfaces are perpendicularly welded to the copper foil surface electrodes on the outer side A of the plasma igniter (301). The inner side B of the plasma igniter (301) is tightly attached to the explosive surface of the third-level high explosive (204). The plasma igniter (301) is specifically a printed circuit board with copper foil covering both sides; A pair of copper-clad foil e1 and e2 surfaces (310) are symmetrically etched on the outer side A of the printed circuit board, and metal pad holes (311) are etched on the copper-clad foil e1 and e2 surfaces (310). A pair of copper-clad foil surfaces e3 and e4 (313) are symmetrically etched on the inner side B of the printed circuit board, and the copper-clad foil surfaces e3 and e4 (313) are connected by copper bridge foil lines (312). The e1 and e2 sides (310) of the copper-clad foil are electrically connected to the e3 and e4 sides (313) of the copper-clad foil through the metal pad holes (311); Specifically soldered on the control circuit board (302) is a digital delay drive circuit (305), the output of which is connected to the input of the voltage regulator communication circuit board (520) via detonator leads (400); The digital delay drive circuit (305) includes a drive chip IC2, a high-voltage field-effect transistor U2, a diode D2, a current-limiting resistor R3, a resistor R4, and a high-voltage capacitor Cg. The circuit structure of the digital delay drive circuit (305) is as follows: The VD terminal of the delay driver chip IC2 is connected to the negative terminal of diode D2. The positive terminal of diode D2 is connected in parallel to the drain of high-voltage field-effect transistor U2. One end of current-limiting resistor R3 is connected to one electrode of plasma igniter DHJ. The Vk terminal of the delay driver chip IC2 is connected in parallel to one end of resistor R4 and then to the gate of high-voltage field-effect transistor U2. The source of high-voltage field-effect transistor U2 is connected in parallel to the other end of resistor R4. The GND terminal of the delay driver chip IC2 is connected to the negative terminal of high-voltage capacitor Cg. The positive terminal of high-voltage capacitor Cg is connected to the other electrode of plasma igniter DHJ. The other end of current-limiting resistor R3, the Vcc terminal of delay driver chip IC2, and the GND terminal of delay driver chip IC2 are connected to the detonator pin (400). The output terminals of the digital delay drive circuit (305) are VH, Vcc, and GND. Each output terminal is electrically connected by a three-core insulated wire and used as a detonator lead wire (400). The detonator lead wire (400) with the three-core insulated wire is connected to the input terminals d1, d3, and d2 in the voltage regulator communication circuit board (520). The voltage regulator communication circuit board (520) is provided with pin terminals c1 and c2. The pin terminals c1 and c2 are respectively connected to the bus socket nut (501) of the voltage regulator communication circuit board (520), and the bus socket nut (501) is connected to the detonator bus (502). The delay time of the digital circuit in the digital delay driving circuit (305) is T, which can be arbitrarily set to the second level, such as 1ms, 2ms, 3ms... by the program. The high-voltage charging voltage range is VH = 40V to 150V.

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