Holding device, photolithography device, and article manufacturing method

Abstract

The present invention provides a holding device, a photolithography device, and an article manufacturing method. The holding device holds an object, characterized in that the holding device comprises: a suction portion for vacuum suctioning the object; a plurality of generating portions, each provided corresponding to a plurality of first pipes connected to the suction portion, generating vacuum air to be supplied to the suction portion via the plurality of first pipes; a pump, supplying compressed air to the plurality of generating portions via a plurality of second pipes respectively connected to the plurality of generating portions; a third pipe, comprising a plurality of connecting pipes respectively connected to the plurality of second pipes and a collection pipe for collecting the plurality of connecting pipes; a control valve provided in the collection pipe, controlling the release of air from the plurality of second pipes via the plurality of connecting pipes by opening and closing the collection pipe; and a plurality of check valves, each provided in the plurality of connecting pipes, preventing compressed air in one of the plurality of second pipes from flowing into the other pipes of the plurality of second pipes via the third pipe.

Description

Technical Field

[0001] The present invention relates to a holding device, a photolithography device and an article manufacturing method. Background Art

[0002] Conventional exposure systems use an illumination optical system to illuminate a master plate (mask or mask), then project the master plate pattern onto a substrate (wafer) via a projection optical system. In the substrate holding devices (stages) used in exposure systems, the number of systems required for substrate suction has increased with the recent increase in substrate size. As a countermeasure against substrate warpage (shape), a segmented suction method has been adopted, which suctions the substrate to each area.

[0003] Generally speaking, substrate holding devices, such as those disclosed in Japanese Utility Model Application Laid-Open No. 5-39798 and Japanese Patent Application Laid-Open No. 11-340305, often utilize vacuum air or vacuum air generated by a vacuum generating device for substrate suction. In this case, vacuum air or compressed air supplied to the vacuum generating device is supplied from a suction control unit to the substrate suction unit or vacuum generating device. A supply valve within the suction control unit controls the supply or stop of vacuum air or compressed air, thereby controlling the vacuum suction or release of a substrate placed on the substrate suction unit. Summary of the Invention

[0004] Problems to be solved by the invention

[0005] However, in conventional technology, when releasing vacuum suction relative to a substrate, even if the suction control unit stops the supply of vacuum air or compressed air, the vacuum air or compressed air remaining in the pipe between the workbench and the suction control unit continues to be supplied to the substrate suction unit. Consequently, releasing the vacuum in the substrate suction unit takes time, a major factor in reducing productivity. Alternatively, installing an atmospheric release valve in each segmented suction system to shorten the time required for vacuum release is also being considered. However, the addition of an atmospheric release valve would increase the size and cost of the workbench and piping unit, which would be a major issue.

[0006] The present invention provides a technology that is advantageous in shortening the time required for vacuum release in a suction portion that vacuum-suctions an object and improving productivity.

[0007] Solutions to Problems

[0008] As one aspect of the present invention, a holding device holds an object and is characterized in that the holding device comprises: an adsorption portion for vacuum adsorption of the object; a plurality of generating portions, which are respectively arranged corresponding to the plurality of first pipes connected to the adsorption portion, and generate vacuum air supplied to the adsorption portion via the plurality of first pipes; a pump, which supplies compressed air to the plurality of generating portions via the plurality of second pipes respectively connected to the plurality of generating portions; a third pipe, which includes a plurality of connecting pipes respectively connected to the plurality of second pipes and a collecting pipe for collecting the plurality of connecting pipes; a control valve, which is arranged in the collecting pipe, and controls the atmospheric release of the plurality of second pipes via the plurality of connecting pipes by opening and closing the collecting pipe; and a plurality of check valves, which are respectively arranged in the plurality of connecting pipes, and inhibit the compressed air existing in one pipe among the plurality of second pipes from flowing into other pipes among the plurality of second pipes via the third pipe.

[0009] As another aspect of the present invention, the holding device holds an object and is characterized in that the holding device comprises: an adsorption portion for vacuum adsorption of the object; a plurality of generating portions, which are respectively arranged corresponding to the plurality of first pipes connected to the adsorption portion, and generate vacuum air supplied to the adsorption portion via the plurality of first pipes; a pump, which supplies compressed air to the plurality of generating portions via the plurality of second pipes respectively connected to the plurality of generating portions; a third pipe, which includes a plurality of connecting pipes respectively connected to the plurality of first pipes and a collecting pipe for collecting the plurality of connecting pipes; a control valve, which is arranged in the collecting pipe, and controls the atmospheric release of the plurality of first pipes via the plurality of connecting pipes by opening and closing the collecting pipe; and a plurality of check valves, which are respectively arranged in the plurality of connecting pipes, and inhibit the vacuum air existing in one pipe among the plurality of first pipes from flowing into other pipes among the plurality of first pipes via the third pipe.

[0010] As another aspect of the present invention, a holding device holds an object and is characterized in that the holding device comprises: an adsorption portion for vacuum adsorption of the object; a pump for exhausting a plurality of first pipes connected to the adsorption portion and generating vacuum air to be supplied to the adsorption portion; a plurality of solenoid valves, which are provided between the adsorption portion and the pump, and which control the exhaust of the plurality of first pipes by the pump and the stopping of the exhaust of the plurality of first pipes by the pump by opening and closing the plurality of first pipes respectively; a second pipe, which includes a plurality of connecting pipelines respectively connected to the plurality of first pipelines and a collecting pipeline for collecting the plurality of connecting pipelines; a control valve, which is provided in the collecting pipeline and controls the atmospheric release of the plurality of first pipelines via the plurality of connecting pipelines by opening and closing the collecting pipeline; and a plurality of check valves, which are respectively provided in the plurality of connecting pipelines and inhibit the vacuum air existing in one pipeline among the plurality of first pipelines from flowing into the other pipelines among the plurality of first pipelines via the second pipeline, wherein the plurality of solenoid valves are respectively solenoid valves including more than three orifices.

[0011] A photolithography apparatus according to another aspect of the present invention forms a pattern on a substrate, and is characterized in that the photolithography apparatus includes the holding device described above, and the holding device holds the substrate as an object.

[0012] As another aspect of the present invention, the method for manufacturing an article is characterized in that the above-mentioned method for manufacturing an article includes: a process of forming a pattern on a substrate using the above-mentioned photolithography device; a process of processing the above-mentioned substrate on which the above-mentioned pattern is formed in the above-mentioned process; and a process of manufacturing an article from the processed above-mentioned substrate.

[0013] Other objects and other aspects of the present invention will become apparent from the following embodiments described with reference to the accompanying drawings.

[0014] Effects of the Invention

[0015] According to the present invention, for example, a technique can be provided that is advantageous in shortening the time required for releasing the vacuum in a suction portion that vacuum-suctions an object and improving productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram showing the configuration of an exposure apparatus as one aspect of the present invention.

[0017] Figure 2 It is a diagram showing an example of a specific configuration of the adsorption unit.

[0018] Figure 3 It is a diagram showing the structure of the holding device in the first embodiment.

[0019] Figure 4 It is a diagram showing the structure of the holding device in the first embodiment.

[0020] Figure 5 It is a diagram showing the structure of the holding device in the first embodiment.

[0021] Figure 6 It is a diagram showing the structure of a holding device in the second embodiment.

[0022] Figure 7 It is a diagram showing the structure of a holding device in the second embodiment.

[0023] Figure 8 It is a diagram showing the structure of a holding device in the second embodiment.

[0024] Figure 9 It is a diagram showing the structure of a holding device in a third embodiment.

[0025] Figure 10 It is a diagram showing the structure of a holding device in a third embodiment.

[0026] Figure 11 It is a diagram showing the structure of a holding device in a third embodiment. DETAILED DESCRIPTION

[0027] The following embodiments are described in detail with reference to the accompanying drawings. The following embodiments do not limit the inventions described in the claims. While the embodiments describe multiple features, not all of these features are essential components of the invention, and multiple features may be combined in any desired manner. Furthermore, in the accompanying drawings, identical or similar components are denoted by the same reference numerals, and duplicate descriptions are omitted.

[0028] Figure 1 This is a schematic diagram of the structure of an exposure device 100 as one aspect of the present invention. The exposure device 100 is a photolithography device that forms a pattern on a substrate using an original plate, which is used in a photolithography process as a manufacturing process of a semiconductor device or a liquid crystal display element. The exposure device 100 performs an exposure process that exposes a substrate W through a photomask R as an original plate, and transfers the pattern of the photomask R to the substrate W. A step-scan method, a step-and-repeat method, and other exposure methods can be used in the exposure device 100. In addition, in this specification and the drawings, directions are expressed in an XYZ coordinate system in which a direction parallel to the surface of the substrate W is an XY plane. Directions parallel to the X axis, Y axis, and Z axis in the XYZ coordinate system are respectively defined as the X direction, the Y direction, and the Z direction.

[0029] The exposure apparatus 100 includes an illumination optical system 120 that illuminates the mask R with light from the light source 110 , a projection optical system 130 that projects a pattern formed on the mask R onto a substrate W, a holding device 200 that holds the substrate W as an object, and a control unit 150 .

[0030] The light source 110 includes a mercury lamp with a wavelength of approximately 365 nm, or an excimer laser such as a KrF excimer laser with a wavelength of approximately 248 nm or an ArF excimer laser with a wavelength of approximately 193 nm, and emits (outputs) light of multiple wavelength bands as exposure light.

[0031] The illumination optical system 120 includes a shading plate 121, a half-reflecting mirror 122, a photoelectric sensor 123, a reflector 124, a shaping optical system (not shown) and an optical integrator (not shown). The light emitted from the light source 110 is shaped into a predetermined shape by the shaping optical system and is incident on the optical integrator. The optical integrator forms a plurality of secondary light sources for illuminating the photomask R with a uniform light intensity distribution. The photomask R has a pattern to be transferred to the substrate W (for example, a circuit pattern of a device) formed on its surface. The shading plate 121 is arranged on the optical path of the illumination optical system 120 to define (form) an arbitrary illumination area on the photomask. The half-reflecting mirror 122 is arranged on the optical path of the illumination optical system 120 to reflect (extract) a portion of the exposure light illuminating the photomask R. The photoelectric sensor 123 is arranged on the optical path of the light reflected by the half-reflecting mirror 122 and outputs a signal corresponding to the intensity of the exposure light (exposure energy) to the control unit 150. The control unit 150 controls the light shielding plate 121 and the like based on the signal output from the photosensor 123 .

[0032] The projection optical system 130 is a refractive optical system or a catadioptric optical system, etc., which reduces the pattern of the mask R by a magnification β (for example, β = 1 / 2) and projects (images) it onto (the exposure area of) a substrate W coated with a resist (photosensitive agent). The projection optical system 130 includes, for example, an optical element 131 and an aperture stop 132. Under the control of the control unit 150, the first drive unit 101 drives (moves) the optical element 131 in the direction along the optical axis of the projection optical system 130 (the Z-axis direction). By driving the optical element 131, the increase of various aberrations of the projection optical system 130 can be suppressed, while the projection magnification can be well maintained, and distortion errors can be reduced. The aperture stop 132 is arranged on the pupil plane of the projection optical system 130 (the Fourier transform plane relative to the mask R). The aperture stop 132 has a circular opening. Under the control of the control unit 150, the second drive unit 102 adjusts (controls) the diameter of the opening of the aperture stop 132.

[0033] The holding device 200 includes a stage 140 , a suction unit 160 , and a suction control unit 170 , and is specifically embodied as a holding mechanism for holding the substrate W in this embodiment.

[0034] The worktable 140 is a worktable capable of supporting and moving the suction unit 160. The worktable 140 is controlled in six degrees of freedom by the third drive unit 103 to position the substrate W. The six degrees of freedom include translational freedom along each axis of the XYZ coordinate system and rotational freedom around each axis.

[0035] The position of the stage 140 in the XY plane is obtained by measuring the distance from the mirror 141 fixed to the stage 140 using a laser interferometer 142. The positional relationship between the stage 140 and the substrate W is measured by the alignment measurement system 104.

[0036] If the substrate W is focused, the focus measurement system FM including the projection optical system 105 and the detection optical system 106 performs measurement. The projection optical system 105 projects light that does not photosensitize the resist coated on the substrate W. The detection optical system 106 detects the light reflected by the substrate W. In the detection optical system 106, a plurality of light receiving elements are arranged corresponding to the light reflected by the substrate W. The light receiving surfaces of the plurality of light receiving elements are configured to be approximately conjugate with the respective reflection points of the light reflected by the substrate W via the imaging optical system. Therefore, if the substrate W is focused, the position deviation of the light incident on the light receiving element (light receiving surface) is measured in the detection optical system 106.

[0037] The suction unit 160 is supported on the stage 140. Under the control of the suction control unit 170, the suction unit 160 vacuum-suctions (holds) the substrate W. In this embodiment, the suction control unit 170 is provided separately from the control unit 150, but this is not limiting. For example, the control unit 150 may also function as the suction control unit 170.

[0038] The control unit 150 is composed of an information processing device (computer) including a CPU and memory, and controls the entire exposure apparatus 100 according to a program stored in the storage unit 152. The control unit 150 controls each component of the exposure apparatus 100 to perform an exposure process for exposing a substrate and transferring the pattern of the mask R to each exposure area on the substrate, as well as various processes related to the exposure process.

[0039] Reference Figure 2 The specific structure of the adsorption unit 160 is described below. Figure 2As shown, the suction section 160 includes suction areas 11, 12, and 13, which are divided (divided) by boundaries 21, 22, and 23. Furthermore, suction holes 31, 32, and 33, and pin lift holes 41, 42, and 43, are provided throughout the suction section 160 (i.e., as through-holes) to vacuum-hold the substrate W by exhausting air from the suction areas 11, 12, and 13. The pin lift holes 41-43 are openings for raising and lowering lift pins (not shown) when transferring (handing over) the substrate W between the suction section 160 and a substrate transport robot (not shown). The substrate transport robot places the substrate W on the lift pins that have risen from the pin lift holes 41-43. After the substrate transport robot retreats, the lift pins are lowered, placing the substrate W on the suction section 160.

[0040] Hereinafter, the specific structure and function of the holding device 200 will be described in each embodiment.

[0041] <First embodiment>

[0042] Figure 3 as well as Figure 4 1. The diagram shows a configuration of the holding device 200A in the first embodiment, particularly an example of piping of the holding device 200A. The holding device 200A is assembled in the exposure apparatus 100 as the holding device 200 and is a holding mechanism for holding a substrate W.

[0043] Figure 3 The holding device 200A is shown holding the substrate W, that is, the suction unit 160 is vacuum-sucking the substrate W. The suction regions 11 to 13 of the suction unit 160 are each provided with a plurality of small protrusions for supporting the substrate W during vacuum suction.

[0044] The multiple adsorption holes 31, 32, and 33 provided in the adsorption unit 160 are connected to the multiple vacuum generating units E1, E2, and E3 via multiple first pipelines L1 connected to the respective adsorption holes 31, 32, and 33 (adsorption unit 160). In this embodiment, the vacuum generating units E1-E3 are provided corresponding to the first pipelines L1 and are vacuum generating devices that generate vacuum air that is supplied to the adsorption unit 160 (adsorption holes 31-33) via the first pipelines L1. In this embodiment, the vacuum generating units E1-E3 are each composed of an ejector.

[0045] Multiple second pipelines L2 are connected to the vacuum generating units E1, E2, and E3. Through these second pipelines L2, the vacuum generating units E1-E3 are connected to a compressed air pump 173 that supplies compressed air to the vacuum generating units E1-E3. Furthermore, multiple air-operated valves AV1, AV2, and AV3, each consisting of a solenoid valve, are provided in the second pipelines L2 between the vacuum generating units E1, E2, and E3 and the compressed air pump 173. The air-operated valves AV1-AV3 are valves used to control the supply of compressed gas from the compressed air pump 173 to the vacuum generating units E1-E3 and the stopping of the supply of compressed gas by opening and closing the second pipelines L2 with the solenoid valves. In this embodiment, the air-operated valves AV1-AV3 are connected to the compressed air pump 173 via a branching manifold 171.

[0046] In the plurality of second pipelines L2, a third pipeline L3 is connected as a branch line branching from the plurality of second pipelines L2 between each vacuum generating unit E1-E3 and each air-operated valve AV1-AV3. The third pipeline L3 includes a plurality of connecting pipelines CL connected to each of the plurality of second pipelines L2 and a collection pipeline ML that collects the plurality of connecting pipelines CL. Furthermore, a solenoid valve 701 is provided in the collection pipeline ML as a control valve that controls the release of atmospheric air from the plurality of second pipelines L2 via the plurality of connecting pipelines CL by opening and closing the collection pipeline ML. Furthermore, a plurality of check valves CV1, CV2, and CV3 are provided in each of the plurality of connecting pipelines CL to suppress (prevent) compressed air in one of the plurality of second pipelines L2 from flowing into the other pipelines via the third pipeline L3.

[0047] When the substrate W is vacuum-adsorbed by the adsorption unit 160, the adsorption control unit 170 controls the air-operated valves AV1-AV3 (solenoid valves) to the OPEN state, thereby opening the multiple lines L2. Compressed air supplied from the compressed air pump 173 to the vacuum generating units E1-E3 is discharged from the vacuum generating units E1-E3 into the interior of the workbench 140, thereby generating vacuum air in the vacuum generating units E1-E3. The vacuum air generated by the vacuum generating units E1-E3 is then supplied to the adsorption holes 31-33 via the first line L1, respectively, and the substrate W is vacuum-adsorbed by the adsorption unit 160.

[0048] As described above, a third line L3 (branch line) connected to a solenoid valve 701, which functions as an exhaust port in this embodiment, is provided between the vacuum generating units E1-E3 and the air-operated valves AV1-AV3. When the adsorption unit 160 vacuum-adsorbs a substrate W, the adsorption control unit 170 controls the solenoid valve 701 to the CLOSE position, closing the collection line ML (third line L3). This blocks compressed air flowing into the third line L3 from the plurality of second lines L2. Furthermore, check valves CV1-CV3 provided in the connecting line CL prevent compressed air flowing into the third line L3 from returning to the second line L2 via the solenoid valve 701 (i.e., from flowing back into the system connected to the other exhaust ports).

[0049] Figure 4 The figure shows the state of the holding device 200A when it is not holding a substrate W, that is, when the vacuum suction of the substrate W by the suction unit 160 is released, for example, when the substrate W is being transported. When the vacuum suction of the substrate W by the suction unit 160 is released, the suction control unit 170 controls the air-operated valves AV1 to AV3 (solenoid valves) to the CLOSE position, closing the plurality of second lines L2. This stops the supply of compressed air from the compressed air pump 173 to the vacuum generating units E1 to E3. Simultaneously, the suction control unit 170 controls the solenoid valve 701, which serves as an exhaust port, to the OPEN position, opening the collection line ML. This allows the compressed air remaining in the second lines L2 between the vacuum generating units E1 to E3 and the air-operated valves AV1 to AV3 to flow into the solenoid valve 701 through the third line L3 connected to the solenoid valve 701 and be discharged from the solenoid valve 701. Therefore, the supply of compressed air from the compressed air pump 173 to the vacuum generating units E1 to E3 is immediately stopped, which can shorten the time required to release the vacuum in the suction unit 160. Therefore, according to the exposure apparatus 100 including the holding device 200A of this embodiment, the time required to transfer the substrate W is shortened, which contributes to improved productivity (throughput).

[0050] In addition, in this embodiment, the adsorption control unit 170 controls the opening and closing of the plurality of second pipelines L2 in a unified manner, that is, controls the plurality of air-operated valves AV1 to AV3 so that all the states thereof become the same, but the present invention is not limited thereto. Figure 5 As shown, the states of the plurality of air-operated valves AV1 to AV3 are individually controlled so that the opening and closing of each of the plurality of second pipes L2 are independently controlled. Figure 5 The state shown is that only the air operation valve AV1 is controlled to the OPEN state, only compressed air is supplied to the vacuum generating portion E1 , and the substrate W is vacuum-adsorbed only by the adsorption holes 31 provided in the adsorption portion 160 .

[0051] <Second embodiment>

[0052] Figure 6 as well as Figure 7 1 and 2. This is a diagram showing a configuration of a holding device 200B in the second embodiment, particularly an example of piping of the holding device 200B. The holding device 200B is assembled in the exposure device 100 as the holding device 200 and is a holding mechanism for holding a substrate W.

[0053] Figure 6 The figure shows the state in which the holding device 200B holds a substrate W, that is, the suction unit 160 vacuum-adsorbs the substrate W. A third line L3 is connected to the plurality of first lines L1 between the suction holes 31-33 provided in the suction unit 160 and the vacuum generating units E1-E3, as a branch line branching from the plurality of first lines L1. The third line L3 includes a plurality of connecting lines CL connected to the plurality of first lines L1, and a collection line ML that collects the plurality of connecting lines CL. Furthermore, a solenoid valve 801 is provided in the collection line ML as a control valve that controls the release of atmospheric air from the plurality of first lines L1 through the plurality of connecting lines CL by opening and closing the collection line ML. Furthermore, a plurality of check valves CV1, CV2, and CV3 are provided in each of the plurality of connecting lines CL to suppress (prevent) vacuum air in one of the plurality of first lines L1 from flowing into the other lines via the third line L3.

[0054] When the substrate W is vacuum-adsorbed by the adsorption unit 160, the adsorption control unit 170 controls the air-operated valves AV1-AV3 (solenoid valves) to the OPEN state, thereby opening the plurality of second lines L2. Compressed air supplied from the compressed air pump 173 to the vacuum generating units E1-E3 is discharged from the vacuum generating units E1-E3 into the interior of the workbench 140, thereby generating vacuum air in the vacuum generating units E1-E3. The vacuum air generated by the vacuum generating units E1-E3 is then supplied to the adsorption holes 31-33 via the first line L1, respectively, and the substrate W is vacuum-adsorbed by the adsorption unit 160.

[0055] As described above, a third line L3 (branch line) connected to a solenoid valve 801, which functions as an atmospheric release port in this embodiment, is provided between the adsorption holes 31-33 provided in the adsorption unit 160 and the vacuum generating units E1-E3. When the adsorption unit 160 vacuum-adsorbs a substrate W, the adsorption control unit 170 controls the solenoid valve 801 to the CLOSE position, closing the collection line ML (third line L3). This blocks the flow of vacuum air from the multiple first lines L1 into the third line L3. Furthermore, check valves CV1-CV3 provided in the connecting line CL prevent the vacuum air flowing into the third line L3 from returning to the first line L1 via the solenoid valve 801 (i.e., from flowing back into the system connected to the other exhaust ports).

[0056] Figure 7 The figure shows a state in which the holding device 200B is not holding a substrate W, that is, when the vacuum suction of the substrate W by the suction unit 160 is released, for example, when the substrate W is being transported. When the vacuum suction of the substrate W by the suction unit 160 is released, the suction control unit 170 controls the air-operated valves AV1 to AV3 (solenoid valves) to the CLOSE position, closing the plurality of second lines L2. This stops the supply of compressed air from the compressed air pump 173 to the vacuum generating units E1 to E3. Simultaneously, the suction control unit 170 controls the solenoid valve 801, which serves as an atmospheric release port, to the OPEN position, opening the collection line ML. This allows atmospheric air from the solenoid valve 801 to enter the plurality of first lines L1 between the suction holes 31 to 33 and the vacuum generating units E1 to E3 via the third line L3. Meanwhile, the compressed air remaining in the plurality of second lines L2 between the vacuum generating units E1 to E3 and the air-operated valves AV1 to AV3 is discharged from the vacuum generating units E1 to E3 into the interior of the workbench 140. Therefore, vacuum air is temporarily supplied from the vacuum generating units E1 to E3 to the multiple first lines L1 between the suction holes 31 to 33 and the vacuum generating units E1 to E3 (i.e., before the compressed air remaining in the second line L2 is exhausted). However, atmospheric air also enters the multiple first lines L1 between the suction holes 31 to 33 and the vacuum generating units E1 to E3 from the third line L3, allowing the vacuum state in the multiple first lines L1 to be released to atmospheric air. Consequently, the time required to release the vacuum in the suction unit 160 can be shortened. Therefore, according to the exposure apparatus 100 including the holding device 200B of this embodiment, the time required to transfer substrates W is shortened, contributing to improved productivity (throughput).

[0057] In addition, in this embodiment, the adsorption control unit 170 controls the opening and closing of the plurality of second pipelines L2 in a unified manner, that is, controls the plurality of air-operated valves AV1 to AV3 so that all the states thereof become the same, but the present invention is not limited thereto. Figure 8 As shown, the states of the plurality of air-operated valves AV1 to AV3 are individually controlled so that the opening and closing of each of the plurality of second pipes L2 are independently controlled. Figure 8 The state shown is that only the air operation valve AV1 is controlled to the OPEN state, only compressed air is supplied to the vacuum generating portion E1 , and the substrate W is vacuum-adsorbed only by the adsorption holes 31 provided in the adsorption portion 160 .

[0058] <Third embodiment>

[0059] Figure 9 as well as Figure 101 and 2. The diagram shows a configuration of a holding device 200C in the third embodiment, particularly an example of piping of the holding device 200C. The holding device 200C is assembled in the exposure apparatus 100 as the holding device 200 and is a holding mechanism for holding a substrate W.

[0060] Figure 9 The figure shows the state in which the holding device 200C holds the substrate W, that is, the suction unit 160 is vacuum-absorbing the substrate W. The plurality of suction holes 31, 32, and 33 provided in the suction unit 160 are connected to the vacuum pump 273 via a plurality of first pipes L1 connected to the suction holes 31, 32, and 33 (the suction unit 160). The vacuum pump 273 exhausts the plurality of first pipes L1 to generate vacuum air, which is supplied to the plurality of suction holes 31 to 33 (the suction unit 160). In the plurality of first pipes L1, a plurality of solenoid valves SV1, SV2, and SV3 are provided between the suction unit 160 and the vacuum pump 273, respectively. The solenoid valves SV1 to SV3 are valves for controlling the evacuation of the plurality of first pipes L1 by the vacuum pump 273 and stopping the evacuation of the plurality of first pipes L1 by the vacuum pump 273 by opening and closing the plurality of first pipes L1. In the present embodiment, the solenoid valves SV1 to SV3 include three or more ports and are connected to the vacuum pump 273 via the branching manifold 171 .

[0061] In the plurality of first pipelines L1, second pipelines L22 are connected as branch lines branching from the plurality of first pipelines L1 between the respective adsorption holes 31-33 provided in the adsorption unit 160 and the respective solenoid valves SV1-SV3. The second pipeline L22 includes a plurality of connecting pipelines CL1 connected to the plurality of first pipelines L1 and a collection pipeline ML1 that collects the plurality of connecting pipelines CL1. Furthermore, a solenoid valve 801 is provided in the collection pipeline ML1 as a control valve that controls the release of atmospheric air from the plurality of first pipelines L1 through the plurality of connecting pipelines CL1 by opening and closing the collection pipeline ML1. Furthermore, a plurality of check valves CV1, CV2, and CV3 are provided in each of the plurality of connecting pipelines CL1 to suppress (prevent) vacuum air in one of the plurality of first pipelines L1 from flowing into the other pipelines via the second pipeline L22.

[0062] When the suction unit 160 vacuum-adsorbs the substrate W, the suction control unit 170 controls the solenoid valves SV1-SV3 to the OPEN state, opening the plurality of first lines L1. As described above, a third line L3 (branch line) connected to the solenoid valve 801, which functions as an atmospheric release port in this embodiment, is provided between the suction holes 31-33 provided in the suction unit 160 and the solenoid valves SV1-SV3. When the suction unit 160 vacuum-adsorbs the substrate W, the suction control unit 170 controls the solenoid valve 801 to the CLOSE state, closing the collection line ML1 (second line L22). This blocks the flow of vacuum air from the plurality of first lines L1 into the second line L22. Furthermore, check valves CV1-CV3 provided in the connecting line CL1 prevent the vacuum air flowing into the second line L22 from returning to the first line L1 via the solenoid valve 801 (i.e., from flowing back into the system connected to the other exhaust ports). Therefore, vacuum air is supplied to the suction holes 31 to 33 through the first pipe L1 , and the substrate W is vacuum-sucked by the suction unit 160 .

[0063] Figure 10 The figure shows the state of the holding device 200C when it is not holding a substrate W, that is, when the vacuum suction of the substrate W by the suction unit 160 is released, for example, when the substrate W is being transported. When the vacuum suction of the substrate W by the suction unit 160 is released, the suction control unit 170 controls the solenoid valves SV1-SV3 to the CLOSE state, closing the plurality of first lines L1. This stops the supply of vacuum air from the vacuum pump 273 to the suction holes 31-33. Furthermore, atmospheric air enters through other openings of the solenoid valves SV1-SV3, releasing the plurality of first lines L1 between the suction holes 31-33 and the solenoid valves SV1-SV3 from the vacuum state to atmospheric air. Simultaneously, the suction control unit 170 controls the solenoid valve 801, which serves as the atmospheric release opening, to the OPEN state, opening the collecting line ML1. This allows atmospheric air to enter the plurality of first lines L1 between the suction holes 31-33 and the solenoid valves SV1-SV3 via the second line L22. In addition to the atmospheric air entering through the solenoid valves SV1 to SV3, atmospheric air also enters through the second line L22, thereby shortening the time required to release the vacuum in the suction unit 160. Therefore, according to the exposure apparatus 100 including the holding device 200C of this embodiment, the time required to transfer the substrate W is shortened, which contributes to improved productivity (throughput).

[0064] In addition, in this embodiment, the adsorption control unit 170 centrally controls the opening and closing of the plurality of first pipelines L1, that is, controls the states of the plurality of solenoid valves SV1 to SV3 to all become the same state, but is not limited to this. For example, the adsorption control unit 170 may also be as follows Figure 11As shown, the states of the plurality of electromagnetic valves SV1 to SV3 are individually controlled so that the opening and closing of each of the plurality of first pipes L1 are independently controlled. Figure 11 The state in which only the solenoid valve SV1 is controlled to the OPEN state and the substrate W is vacuum-adsorbed only by the adsorption holes 31 provided in the adsorption unit 160 is shown.

[0065] In the above embodiment, the suction unit 160 is composed of a single suction component, specifically a suction component (so-called a clamp) that places the substrate W and vacuum-suctions the substrate W. This suction component is provided with a plurality of suction holes 31-33 connected to the plurality of pipelines L1. However, the suction unit 160 may also be composed of a plurality of suction components. In this case, each suction component may be provided with either a plurality of suction holes 31-33 connected to the plurality of pipelines L1 or a suction hole connected to at least one of the plurality of pipelines L1.

[0066] The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.). The manufacturing method includes: a process of forming a pattern on a substrate using an exposure device 100; a process of processing the substrate on which the pattern is formed; and a process of manufacturing an article from the processed substrate. In addition, the manufacturing method may include other well-known processes (oxidation, film formation, vapor deposition, doping, flattening, etching, resist stripping, cutting, bonding, packaging, etc.). The article manufacturing method according to this embodiment is advantageous compared to the past in at least one of the following aspects: the performance, quality, productivity, and production cost of the article.

[0067] The present invention is not limited to photolithography apparatuses for exposure, and can also be applied to, for example, imprint apparatuses. Imprint apparatuses bring an imprint material supplied (placed) on a substrate into contact with a stamper (master plate), applying energy to the imprint material for curing, thereby forming a pattern of a cured product in which the pattern of the stamper is transferred.

[0068] The present invention is not limited to the above-described embodiment, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the appended claims are intended to disclose the scope of the invention.

Claims

1. A holding device for holding an object, characterized in that: The above-mentioned holding device has: An adsorption portion, the adsorption portion being used for vacuum adsorption of the object; a plurality of generating units, each of which is provided corresponding to the plurality of first pipes connected to the adsorption unit, and generates a reduced-pressure gas to be supplied to the adsorption unit via the plurality of first pipes; a pump that supplies compressed air to the plurality of generating parts via a plurality of second pipes respectively connected to the plurality of generating parts; a third pipeline, the third pipeline comprising a plurality of connecting pipelines respectively connected to the plurality of second pipelines and a collecting pipeline for collecting the plurality of connecting pipelines; a control valve, which is provided in the collecting pipe and controls the opening and closing of the collecting pipe; and A plurality of check valves are provided in the plurality of connecting pipes, respectively, to prevent the compressed air in one of the plurality of second pipes from flowing into the other pipes of the plurality of second pipes via the third pipe.

2. The holding device according to claim 1, characterized in that The above-mentioned retaining device also has multiple valves, which are arranged between each of the above-mentioned multiple generating parts and the above-mentioned pump, and control the supply of the above-mentioned compressed air from the above-mentioned pump to the above-mentioned multiple generating parts and the stopping of the supply of the above-mentioned compressed air from the above-mentioned pump to the above-mentioned multiple generating parts by opening and closing the above-mentioned multiple second pipelines respectively.

3. The holding device according to claim 2, characterized in that The holding device further comprises a control unit for controlling the control valve and the plurality of valves. When the object is vacuum-adsorbed by the adsorption unit, the control unit controls the control valve and the plurality of valves to close the collection pipe and open the plurality of second pipes. When the vacuum suction of the object by the suction unit is released, the control unit controls the control valve and the plurality of valves to open the collecting pipe and close the plurality of second pipes.

4. The holding device according to claim 3, characterized in that The control unit individually controls the plurality of valves so as to independently control the opening and closing of each of the plurality of second pipes.

5. The holding device according to claim 1, wherein: Each of the plurality of generating units includes an ejector configured to generate the decompressed gas by discharging the compressed air supplied from the pump.

6. The holding device according to claim 1, wherein: The adsorption unit includes an adsorption component that carries the object and vacuum-adsorbs the object. The adsorption member is provided with a plurality of adsorption holes connected to the plurality of first pipes, respectively.

7. The holding device according to claim 1, wherein: The adsorption unit includes a plurality of adsorption components for respectively placing the objects and vacuum adsorbing the objects. Each of the plurality of adsorption members is provided with an adsorption hole connected to at least one of the plurality of first pipes.

8. A holding device for holding an object, characterized in that: The above-mentioned holding device has: An adsorption portion, the adsorption portion being used for vacuum adsorption of the object; a plurality of generating units, each of which is provided corresponding to the plurality of first pipes connected to the adsorption unit, and generates a reduced-pressure gas to be supplied to the adsorption unit via the plurality of first pipes; a pump that supplies compressed air to the plurality of generating parts via a plurality of second pipes respectively connected to the plurality of generating parts; a third pipeline, the third pipeline comprising a plurality of connecting pipelines respectively connected to the plurality of first pipelines and a collecting pipeline for collecting the plurality of connecting pipelines; a control valve, which is provided in the collecting pipe and controls the opening and closing of the collecting pipe; and A plurality of check valves are provided in the plurality of connecting pipes, respectively, to prevent the decompressed gas in one of the plurality of first pipes from flowing into the other pipes of the plurality of first pipes via the third pipe.

9. The holding device according to claim 8, characterized in that The above-mentioned retaining device also has multiple valves, which are arranged between each of the above-mentioned multiple generating parts and the above-mentioned pump, and control the supply of the above-mentioned compressed air from the above-mentioned pump to the above-mentioned multiple generating parts and the stopping of the supply of the above-mentioned compressed air from the above-mentioned pump to the above-mentioned multiple generating parts by opening and closing the above-mentioned multiple second pipelines respectively.

10. The holding device according to claim 9, characterized in that The holding device further comprises a control unit for controlling the control valve and the plurality of valves. When the object is vacuum-adsorbed by the adsorption unit, the control unit controls the control valve and the plurality of valves to close the collection pipe and open the plurality of second pipes. When the vacuum suction of the object by the suction unit is released, the control unit controls the control valve and the plurality of valves to open the collecting pipe and close the plurality of second pipes.

11. The holding device according to claim 10, characterized in that The control unit individually controls the plurality of valves so as to independently control the opening and closing of each of the plurality of second pipes.

12. The holding device according to claim 8, wherein Each of the plurality of generating units includes an ejector configured to generate the decompressed air by discharging the compressed air supplied from the pump.

13. The holding device according to claim 8, characterized in that The adsorption unit includes an adsorption component that carries the object and vacuum-adsorbs the object. The adsorption member is provided with a plurality of adsorption holes connected to the plurality of first pipes, respectively.

14. The holding device according to claim 8, characterized in that The adsorption unit includes a plurality of adsorption components for respectively placing the objects and vacuum adsorbing the objects. Each of the plurality of adsorption members is provided with an adsorption hole connected to at least one of the plurality of first pipes.

15. A holding device for holding an object, characterized in that: The above-mentioned holding device has: An adsorption portion, the adsorption portion being used for vacuum adsorption of the object; a pump for exhausting the plurality of first pipes connected to the adsorption unit; a plurality of solenoid valves provided between the adsorption portion and the pump, the plurality of solenoid valves controlling exhaust of the plurality of first pipes by the pump and stopping exhaust of the plurality of first pipes by the pump by opening and closing the plurality of first pipes respectively; a second pipeline, the second pipeline comprising a plurality of connecting pipelines respectively connected to the plurality of first pipelines and a collecting pipeline for collecting the plurality of connecting pipelines; a control valve, which is provided in the collecting pipe and controls the opening and closing of the collecting pipe; and a plurality of check valves, each of which is provided in the plurality of connecting pipelines, to prevent the decompressed gas in one of the plurality of first pipelines from flowing into the other pipelines of the plurality of first pipelines via the second pipeline; The plurality of solenoid valves are solenoid valves each including three or more orifices.

16. The holding device according to claim 15, characterized in that When the object is vacuum-adsorbed by the adsorption unit, the plurality of solenoid valves and the control valve are controlled to open the plurality of first pipes and close the collection pipe. When the vacuum suction of the object by the suction portion is released, the plurality of solenoid valves and the control valve are controlled to close the plurality of first pipes and open the collecting pipe.

17. The holding device according to claim 15, characterized in that The adsorption unit includes an adsorption component that carries the object and vacuum-adsorbs the object. The adsorption member is provided with a plurality of adsorption holes connected to the plurality of first pipes, respectively.

18. The holding device according to claim 15, characterized in that The adsorption unit includes a plurality of adsorption components for respectively placing the objects and vacuum adsorbing the objects. Each of the plurality of adsorption members is provided with an adsorption hole connected to at least one of the plurality of first pipes.

19. A photolithography apparatus for forming a pattern on a substrate, characterized in that: The photolithography apparatus includes the holding device according to claim 1, and the holding device holds the substrate as an object.

20. The lithographic apparatus according to claim 19, wherein: The photolithography apparatus includes a projection optical system that projects the pattern of the original plate onto the substrate held by the holding device.

21. A photolithography apparatus for forming a pattern on a substrate, characterized in that: The photolithography apparatus includes the holding device according to claim 8, which holds the substrate as an object.

22. A photolithography apparatus for forming a pattern on a substrate, characterized in that: The photolithography apparatus includes the holding device according to claim 15, which holds the substrate as an object.

23. A method for manufacturing an article, characterized in that: The above-mentioned method for manufacturing an article has the following characteristics: A process of forming a pattern on a substrate using the photolithography apparatus according to claim 19; a step of processing the substrate on which the pattern is formed in the step; and The process of manufacturing an article from the processed substrate.

24. A method for manufacturing an article, characterized in that: The above-mentioned method for manufacturing an article has the following characteristics: A process of forming a pattern on a substrate using the photolithography apparatus according to claim 21; a step of processing the substrate on which the pattern is formed in the step; and The process of manufacturing an article from the processed substrate.

25. A method for manufacturing an article, characterized in that: The above-mentioned method for manufacturing an article has the following characteristics: A process of forming a pattern on a substrate using the photolithography apparatus according to claim 22; a step of processing the substrate on which the pattern is formed in the step; and The process of manufacturing an article from the processed substrate.

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